Cooling fan and electronic equipment

Abstract

The invention provides a cooling fan and electronic equipment, and relates to the technical field of cooling structures. The cooling fan comprises fan blades, a shell and a supporting piece. The shell is provided with a mounting cavity, the fan blades are arranged in the mounting cavity, a plurality of first micro-penetrating holes are formed in the shell, and the first micro-penetrating holes communicate with the mounting cavity. The supporting piece is arranged on the shell. According to the cooling fan, the shell is provided with the multiple first micro-penetrating holes, the supporting piece, the shell and the electronic equipment define the first noise reduction cavity, in this way, a Helmholtz resonance noise reduction structure is formed, noise energy can be dissipated, and the working noise of the fan blades is reduced. Moreover, the first noise reduction cavity is formed by the gap between the shell of the cooling fan and the electronic equipment, so that the noise reduction effect can be ensured while the internal space of the electronic equipment is fully utilized, and the lightness and thinness of the electronic equipment are improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation structures, and in particular to a heat dissipation fan and an electronic device. Background Art

[0002] Fans are a core component of the cooling system for electronic devices (such as laptops and mainframe computers). They reduce the temperature of electronic devices through forced convection, preventing excessive temperatures from affecting performance. As fan speed increases, so does the noise generated, necessitating noise reduction.

[0003] However, due to the compact structure inside the electronic device, there is only a few millimeters of clearance between the fan and other components inside the electronic device. Many existing noise reduction structures are limited by the installation space of the electronic device, resulting in an inability to achieve a good noise reduction effect on the fan. Summary of the Invention

[0004] Embodiments of the present application provide a heat dissipation fan and an electronic device to solve the problem that the existing noise reduction structure is limited by its own size structure, resulting in poor noise reduction effect on the fan.

[0005] In a first aspect, the heat dissipation fan provided by the embodiments of the present application includes:

[0006] fan blades;

[0007] The shell has a mounting cavity, the fan blades are rotatably arranged in the mounting cavity, and a plurality of first micro-perforations are provided on the shell, the first micro-perforations are connected to the mounting cavity;

[0008] The support member is arranged on the side of the shell having the first micro-perforation, and the support member is used to connect with the electronic device so that the support member, the shell and the electronic device form at least one first silencer cavity, and the first micro-perforation is correspondingly connected to the first silencer cavity.

[0009] In a possible implementation, in the heat dissipation fan provided in an embodiment of the present application, the plurality of first micro-perforations are evenly spaced and distributed.

[0010] In a possible implementation, in the heat dissipation fan provided in an embodiment of the present application, the plurality of first micro-perforations form at least two micro-perforation groups, and each micro-perforation group is distributed in different areas of the housing.

[0011] In one possible implementation, in the heat dissipation fan provided in an embodiment of the present application, the support member is a first sealing member, and the first sealing member is used to fill a gap between the housing and the electronic device to form a first silencing cavity;

[0012] Alternatively, a second sealing member is provided on the supporting member, and the second sealing member is used to fill the gap between the supporting member and the electronic device.

[0013] In one possible implementation, the heat dissipation fan provided in an embodiment of the present application has an enclosure portion provided in the installation cavity, the enclosure portion dividing the installation cavity into a sub-installation cavity and at least one second silencer cavity, and the fan blades are provided in the sub-installation cavity;

[0014] The sub-mounting cavity and the second silencing cavity are respectively communicated with the first silencing cavity through the first micro-perforations.

[0015] In one possible implementation, the heat dissipation fan provided in the embodiment of the present application further includes at least one silencer plate, wherein the silencer plate is provided with a plurality of second micro-perforations;

[0016] The silencer plate is arranged in the first silencer cavity, and divides the first silencer cavity into a plurality of sub-silencer cavities distributed along the axial direction of the fan blade, and two adjacent sub-silencer cavities are connected through the second micro-perforations.

[0017] In a possible implementation, the heat dissipation fan provided in an embodiment of the present application further includes a connector, which connects the silencer plate and the housing, and the side wall of the silencer plate abuts against the inner side wall of the support member.

[0018] In one possible implementation, the cooling fan provided in an embodiment of the present application has a support member having at least two third support parts connected to each other, and the third support parts are used to connect to the electronic device so that the third support parts, the shell and the electronic device are surrounded to form a plurality of first silencer chambers, and each first silencer chamber is connected to at least one first micro-perforation.

[0019] In a possible implementation, a sound absorbing member is provided in the first silencing cavity of the heat dissipation fan provided in an embodiment of the present application.

[0020] In a second aspect, an electronic device provided in an embodiment of the present application includes a device body and any of the above-described cooling fans, wherein the cooling fan is disposed on the device body.

[0021] The present invention provides a cooling fan and an electronic device. The cooling fan includes fan blades, a housing, and a support member. The cooling fan is provided with a plurality of first micro-perforations in the housing. The support member, the housing, and the electronic device form a first silencing chamber, thereby forming a Helmholtz resonance noise reduction structure, thereby dissipating noise energy and reducing the operating noise of the fan blades. Furthermore, the first silencing chamber is formed by the gap between the cooling fan housing and the electronic device. This ensures noise reduction while fully utilizing the internal space of the electronic device, thereby enhancing the lightness and thinness of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0023] Figure 1A schematic diagram of a portion of the structure of an electronic device provided in an embodiment of the present application;

[0024] Figure 2 for Figure 1 Disassembly of electronic equipment in Figure 1 ;

[0025] Figure 3 for Figure 2 Disassembly of the cooling fan Figure 1 ;

[0026] Figure 4 for Figure 1 Cross-section of the middle AA;

[0027] Figure 5 for Figure 3 The first micro-perforation in the first embodiment is shown in an enlarged schematic diagram. Figure 1 ;

[0028] Figure 6 for Figure 5 An enlarged diagram of the first microperforation in Figure 2 ;

[0029] Figure 7 for Figure 5 An enlarged diagram of the first microperforation in Figure 3 ;

[0030] Figure 8 for Figure 5 An enlarged diagram of the first microperforation in Figure 4 ;

[0031] Figure 9 for Figure 5 An enlarged diagram of the first microperforation in Figure 5 ;

[0032] Figure 10 for Figure 3 The first micro-perforations in the second embodiment are arranged schematically. Figure 1 ;

[0033] Figure 11 for Figure 3 The first micro-perforations in the second embodiment are arranged schematically. Figure 2 ;

[0034] Figure 12 for Figure 3 An exploded view of the first shell portion and the muffler plate;

[0035] Figure 13 for Figure 2 Disassembly of the cooling fan Figure 2 ;

[0036] Figure 14 for Figure 1 Disassembly of electronic equipment in Figure 2 .

[0037] Description of reference numerals:

[0038] 10. Cooling fan;

[0039] 100, fan blades;

[0040] 200, housing; 201, mounting cavity; 202, first micro-perforation; 203, micro-perforation group; 204, enclosure; 205, second muffler cavity; 210, first housing portion; 211, first air inlet; 212, air outlet; 213, sidewall; 220, second housing portion; 221, second air inlet;

[0041] 300, support member; 301, first muffler chamber; 310, first support portion; 320, second support portion; 330, third support portion;

[0042] 400, muffler plate; 401, second micro-perforation;

[0043] 500, connector;

[0044] 20. Equipment body;

[0045] 21. Keyboard stand; 22. Heat pipe; 23. Heat sink fin.

[0046] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0047] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0048] The terms "first," "second," "third," and "fourth," etc. (if any) in the description and claims of the present invention and in the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the present invention described herein can be implemented in orders other than those illustrated or described herein. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0049] As mentioned in the background, fans are a core component of the cooling system for electronic devices (such as laptops and mainframe computers). They reduce the temperature of electronic devices through forced convection, preventing excessive temperatures from affecting performance. As fan speed increases, the noise generated also increases, necessitating noise reduction.

[0050] However, due to the compact structure inside the electronic device, there is only a few millimeters of clearance between the fan and other components inside the electronic device. Many existing noise reduction structures are limited by the installation space of the electronic device, resulting in an inability to achieve a good noise reduction effect on the fan.

[0051] In response to the above-mentioned problems existing in the prior art, the present invention provides a heat dissipation fan and an electronic device. The heat dissipation fan includes fan blades, a shell and a support member. The shell has an installation cavity, the fan blades are arranged in the installation cavity, and a plurality of first micro-perforations are provided on the shell, and the first micro-perforations are connected to the installation cavity. The support member is provided on the shell, and the support member is used to connect with the electronic device so that the support member, the shell and the electronic device are surrounded to form at least one first silencer cavity, and the first micro-perforations are correspondingly connected to the first silencer cavity. By providing a plurality of first micro-perforations on the shell, the support member, the shell and the electronic device are surrounded to form a first silencer cavity, so as to form a Helmholtz resonance noise reduction structure, thereby being able to dissipate noise energy to reduce the working noise of the fan blades. In addition, the first silencer cavity is formed by the gap between the shell of the heat dissipation fan and the electronic device, so that while making full use of the internal space of the electronic device, the noise reduction effect can also be ensured to improve the lightness and thinness of the electronic device.

[0052] The following describes exemplary application scenarios of the present invention.

[0053] The cooling fan provided by the present invention can be applied to electronic devices such as laptop computers, computer hosts, etc. Specifically, the cooling fan provided by the present invention can fully utilize the internal space of the electronic device while ensuring noise reduction effect, thereby improving the lightness and thinness of the electronic device.

[0054] The following specific embodiments describe in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0055] Reference Figures 1 to 14 As shown, the heat dissipation fan 10 provided in the embodiment of the present application includes fan blades 100 , a housing 200 and a support member 300 .

[0056] The housing 200 has a mounting cavity 201, within which the fan blades 100 are rotatably mounted. The housing 200 is provided with a plurality of first microperforations 202, which communicate with the mounting cavity 201. A support member 300 is provided on a side of the housing 200 having the first microperforations 202. The support member 300 is configured to connect to an electronic device, such that the support member 300, the housing 200, and the electronic device enclose at least one first silencing cavity 301, with the first microperforations 202 correspondingly communicating with the first silencing cavity 301.

[0057] It is understood that the cooling fan 10 provided in the embodiment of the present application can be used in electronic devices, such as laptop computers. The cooling fan 10 generates airflow through the rotation of the fan blades 100, thereby effectively removing heat from the electronic device and ensuring the normal operation of the electronic device. The fan blades 100 can be connected to a driving member (such as a driving motor), and the driving member drives the fan blades 100 to rotate to generate airflow.

[0058] Reference Figures 2 to 4 As shown, the housing 200 is provided with a plurality of first micro-perforations 202. The support member 300 on the housing 200 is used to connect to the electronic device. The support member 300, the housing 200 and the electronic device are arranged to form a first silencing chamber 301, thereby forming a Helmholtz resonance noise reduction structure. The noise sound waves generated by the operation of the fan blades 100 can be divided into multiple parts, and each part enters the first micro-perforations 202. When the noise sound waves pass through the tiny first micro-perforations 202, the air particles in and near the hole openings are forced to vibrate at high speed, resulting in intense friction between the air particles and between the air particles and the hole walls of the first micro-perforations 202. The friction converts the sound energy (mechanical energy) into heat energy (i.e., the thermoviscous effect), thereby absorbing part of the noise.

[0059] After the noise waves pass through the first micro-perforations 202 and enter the first silencing chamber 301, the back-and-forth reflections and destructive interference gradually consume the energy of the noise waves, ultimately dissipating the energy of the noise waves. This effectively absorbs the noise generated by the fan blades 100. This ensures that the fan blades 100 rotate at high speeds and generate high airflow while also effectively reducing noise through the first silencing chamber 301, thereby improving the user experience.

[0060] Among them, the first silencing chamber 301 is formed by the support member 300, the shell 200 and the electronic device. In this way, the first silencing chamber 301 is formed by utilizing the structural gap between the shell 200 and the electronic device, which does not occupy the internal space of the electronic device, thereby improving the utilization rate of the internal space of the electronic device and ensuring the lightness and thinness of the electronic device.

[0061] For example, the first micro-perforations 202 may have a diameter of 0.1 mm to 1 mm, for example, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, etc. The spacing between two adjacent first micro-perforations 202 is not specifically limited and can be arranged according to the perforation ratio of the housing 200.

[0062] In summary, the cooling fan 10 provided in the embodiment of the present application has a plurality of first micro-perforations 202 provided on the housing 200. The support member 300, the housing 200, and the electronic device enclose a first silencing chamber 301, thereby forming a Helmholtz resonance noise reduction structure, thereby dissipating noise energy and reducing the operating noise of the fan blades 100. Furthermore, the first silencing chamber 301 is formed by the gap between the housing 200 of the cooling fan 10 and the electronic device. This fully utilizes the internal space of the electronic device while also ensuring a noise reduction effect, thereby enhancing the lightness and thinness of the electronic device.

[0063] Reference Figures 2 to 4 As shown, in some embodiments, the housing 200 includes a first housing portion 210 and a second housing portion 220, which are connected to form a mounting cavity 201. The first micro-perforations 202 and the support member 300 are both provided on the first housing portion 210, with the support member 300 located on a side of the first housing portion 210 facing away from the second housing portion 220. Thus, a first silencing cavity 301 is formed by the first housing portion 210, the support member 300, and the electronic device.

[0064] Furthermore, a first air inlet 211 is provided on the first housing portion 210, a second air inlet 221 is provided on the second housing portion 220, and an air outlet 212 is formed between the first housing portion 210 and the second housing portion 220. When the fan blade 100 is in operation, air flows into the mounting cavity 201 through the first air inlet 211 and the second air inlet 221, respectively, thereby increasing the air flow channel and expanding the heat dissipation area. The air then flows out through the air outlet 212.

[0065] It is understood that the support member 300 surrounds the plurality of first micro-perforations 202 and separates the first micro-perforations 202 from the first air inlet 211. A portion of the first housing portion 210, the support member 300, and the electronic device form a first silencing chamber 301. The first micro-perforations 202 are connected to the first silencing chamber 301, and the first air inlet 211 is staggered from the first silencing chamber 301 (i.e., the first air inlet 211 is not connected to the first silencing chamber 301). This ensures that the first silencing chamber 301 reduces noise while allowing airflow from the external environment to enter the mounting chamber 201 through the first air inlet 211, thereby preventing mutual interference.

[0066] Reference Figure 3 As shown, the air inlet area of the second air inlet 221 is larger than the air inlet area of the first air inlet 211, and the air flow mainly enters the installation cavity 201 through the second air inlet 221. The ratio of the air inlet area of the second air inlet 221 to the air inlet area of the first air inlet 211 can be 9:1, 8:2, etc.

[0067] For example, refer to Figure 1 、 Figure 2 and Figure 14 As shown, when the electronic device is a laptop computer, the laptop computer has a keyboard bracket 21 and a D-shell (not shown in the figure), and the cooling fan 10 is installed between the keyboard bracket 21 and the D-shell. In one embodiment, the first shell portion 210 is arranged toward the keyboard bracket 21, so that the first shell portion 210, the support member 300 and the keyboard bracket 21 can form a first silencing chamber 301. In another embodiment, the first shell portion 210 is arranged toward the D-shell, so that the first shell portion 210, the support member 300 and the D-shell can form a first silencing chamber 301. The embodiments of the present application do not impose too many restrictions on this.

[0068] Reference Figures 5 to 9 As shown, in some embodiments, the plurality of first micro-perforations 202 are evenly spaced apart.

[0069] In the above embodiment, multiple first micro-perforations 202 are evenly spaced and distributed on the side of the shell 200 facing the support member 300, so as to ensure that the micro-perforations fully cover one side of the shell 200, which can ensure more comprehensive absorption of the noise generated by the fan blades 100 to enhance the noise reduction effect.

[0070] Specifically, refer to Figure 5 As shown, a plurality of first micro-perforations 202 are evenly spaced and distributed on the first shell portion 210 of the shell 200 , the first air inlet 211 is disposed in the middle area of the first shell portion 210 , and the plurality of first micro-perforations 202 are located around the first air inlet 211 .

[0071] Reference Figures 3 to 5 As shown, in one embodiment, the support member 300 includes a first support portion 310 and a second support portion 320. Both the first support portion 310 and the second support portion 320 are annular structures, with the first support portion 310 located inside the second support portion 320. The first air inlet 211 is located inside the first support portion 310, and the plurality of first micro-perforations 202 are located between the first support portion 310 and the second support portion 320. Thus, the first muffler cavity 301 is formed by the first support portion 310 and the second support portion 320. The plurality of first micro-perforations 202 are located within the first muffler cavity 301, and the first muffler cavity 301 surrounds the first air inlet 211.

[0072] For example, refer to Figures 5 to 9 As shown, the shape of the first micro-perforations 202 can be circular, rectangular, square, diamond, hexagonal, petal-shaped, etc., and the embodiment of the present application does not impose too many restrictions on this.

[0073] Reference Figure 10 and Figure 11 As shown, in some embodiments, the plurality of first micro-perforations 202 form at least two micro-perforation groups 203 , and each micro-perforation group 203 is distributed in a different area of the housing 200 .

[0074] In the above embodiment, micro-perforation groups 203 can be provided in certain areas of one side of the housing 200 based on the frequency characteristics of the noise source and the required noise reduction. This can improve the noise reduction effect in a targeted manner. Furthermore, by distributing the micro-perforation groups 203 only in specific areas with high noise levels, rather than throughout the entire housing 200, the overall structural strength of the housing 200 can be ensured.

[0075] Reference Figure 10 and Figure 11 As shown, at least two microperforation groups 203 are provided. It is understood that the number of microperforation groups 203 can be two, or more, such as three, four, or five, and this embodiment of the present application does not impose any further limitations on this. The contours of the microperforation groups 203 can be rectangular, circular, elliptical, triangular, or the like. Each microperforation group 203 can have 10, 12, 16, 20, or other first microperforations 202.

[0076] Specifically, refer to Figure 10 and Figure 11As shown, the micro-perforation group 203 is disposed on the first housing portion 210 of the housing 200 , the first air inlet 211 is disposed in the middle area of the first housing portion 210 , and the micro-perforation group 203 is distributed around the first air inlet 211 .

[0077] In one embodiment, referring to Figure 10 As shown, the first housing portion 210 is provided with a micro-perforation group 203, which is formed by a plurality of first micro-perforations 202 (e.g., 16) arranged in a matrix. The shapes of the first micro-perforations 202 within the micro-perforation group 203 can be uniform, or can vary in each column or row, and this embodiment of the present application does not impose any further restrictions on this.

[0078] In one embodiment, referring to Figure 11 As shown, a plurality of micro-perforation groups 203 are spaced apart on the first housing portion 210. Each micro-perforation group 203 is formed by a plurality of first micro-perforations 202 (e.g., 8, 12, 16, etc.) arranged in a matrix. The first micro-perforations 202 in each micro-perforation group 203 can be identical or different, and this embodiment of the present application does not impose any further limitations on this.

[0079] Reference Figure 2 and Figure 14 As shown, in some embodiments, the support member 300 is a first sealing member, which is used to fill the gap between the housing 200 and the electronic device to form a first silencing cavity 301 .

[0080] In the above embodiment, the first sealing member can play a supporting role, and together with the housing 200 and the electronic device, form the first silencing chamber 301. In addition, the first sealing member can also rely on its own elastic sealing properties to fill the gap, thereby ensuring the noise reduction effect of the first silencing chamber 301.

[0081] For example, the material of the first sealing member can be elastic materials such as foam, silicone, rubber, etc., and the embodiment of the present application does not impose too many restrictions on this.

[0082] The first sealing member may be bonded to the housing 200 and the electronic device by means of structural sealant to ensure the stability of the connection.

[0083] In some embodiments, a second sealing member is provided on the support member 300 , and the second sealing member is used to fill the gap between the support member 300 and the electronic device.

[0084] In the above embodiment, the gap between the support member 300 and the electronic device is filled by the second sealing member to ensure the noise reduction effect of the first silencing cavity 301 .

[0085] Exemplarily, the support member 300 and the shell 200 can both be made of hard plastic or metal, and the second sealing member can be made of elastic materials such as foam, silicone, rubber, etc., and the second sealing member is sleeved on the support member 300.

[0086] The support member 300 can be integrally formed with the housing 200 to enhance the stability of the structure. The support member 300 can also be designed independently and detachably mounted on the housing 200 by bolts, buckles, etc.

[0087] Reference Figure 13 As shown, in some embodiments, a blocking portion 204 is provided in the installation cavity 201, and the blocking portion 204 divides the installation cavity 201 into a sub-installation cavity and at least one second silencer cavity 205, and the fan blade 100 is provided in the sub-installation cavity.

[0088] The sub-mounting cavity and the second silencing cavity 205 are respectively communicated with the first silencing cavity 301 through the first micro-perforations 202 .

[0089] In the above embodiment, the enclosure 204 and the housing 200 enclose a second silencing chamber 205, which forms a dual-cavity structure with the first silencing chamber 301. Some noise waves within the first silencing chamber 301, when reflected back and forth, enter the second silencing chamber 205 through the first micro-perforations 202. The second silencing chamber 205 effectively adds an acoustic load, changing the acoustic impedance characteristics of the system and thus improving the noise reduction effect.

[0090] Among them, reference Figure 13 As shown, the first housing portion 210 has a side wall 213 , and the enclosure portion 204 , a portion of the first housing portion 210 , the side wall 213 and the first housing portion 210 together form the second muffler chamber 205 .

[0091] At least one second muffler cavity 205. It is understood that the number of second muffler cavity 205 can be one, and the second muffler cavity 205 is provided with one first micro-perforation 202, or multiple first micro-perforations 202. The number of second muffler cavity 205 can be multiple, and each second muffler cavity 205 is provided with one first micro-perforation 202, or multiple first micro-perforations 202. This embodiment of the present application does not impose any additional restrictions on this.

[0092] Reference Figure 12 As shown, in some embodiments, the heat dissipation fan 10 provided in the embodiment of the present application further includes at least one silencer plate 400 , and a plurality of second micro-perforations 401 are provided on the silencer plate 400 .

[0093] The silencer plate 400 is disposed in the first silencer cavity 301 , and the silencer plate 400 divides the first silencer cavity 301 into a plurality of sub-silencer cavities distributed along the axial direction of the fan blade 100 , and two adjacent sub-silencer cavities are connected through the second micro-perforations 401 .

[0094] In the above embodiment, the first muffler chamber 301 is divided into multiple sub-muffler chambers distributed along the axial direction of the fan blade 100 by the muffler plate 400. These sub-muffler chambers are connected in series. This way, each time a noise wave enters a sub-muffler chamber, it consumes a certain amount of energy. After passing through multiple sub-muffler chambers, the noise wave's energy gradually decays, achieving a stronger noise reduction effect and improving broadband sound absorption characteristics.

[0095] At least one muffler plate 400, it can be understood that, with reference to Figure 12 As shown, the number of the muffler plate 400 can be one to divide the first muffler cavity 301 into two sub-muffler cavities. The number of the muffler plates 400 can be two or more, such as three, four, five, etc., to divide the first muffler cavity 301 into two or more sub-muffler cavities.

[0096] In one embodiment, the depths of the multiple sub-muffler cavities may be increased or decreased in sequence, so that the energy of the noise sound waves is attenuated more evenly, thereby improving the noise reduction effect.

[0097] In one embodiment, the silencer plate 400 and the first shell portion 210 provided with the first micro-perforation 202 can be made of piezoelectric material. By utilizing the inverse piezoelectric characteristics of the piezoelectric material and actively controlling it through a voltage excitation signal, the silencer plate 400 and the first shell portion 210 generate micro-vibrations to improve the sound absorption effect.

[0098] Exemplary piezoelectric materials include, but are not limited to, polyvinylidene fluoride (PVDF), polyvinyl fluoride (PVF), polyvinyl chloride (PVC), lithium gallate, lithium germanate, titanium germanate, lithium niobate, lithium tantalate, lithium niobate, lead zinc niobate, lead titanate, lead zirconate, lead titanate, etc.

[0099] Reference Figure 12 As shown, in some embodiments, the heat dissipation fan 10 provided in the embodiment of the present application further includes a connector 500 , which connects the silencer plate 400 and the housing 200 , and the side wall of the silencer plate 400 abuts against the inner wall of the support member 300 .

[0100] In the above embodiment, the muffler plate 400 can be disposed on the housing 200 through the connecting member 500 and abut against the inner side wall 213 of the supporting member 300 , thereby dividing the first muffler chamber 301 into a plurality of sub-muffler chambers.

[0101] The connecting member 500 may be a structure such as a bolt or a buckle to fix the connecting member 500 on the second housing portion 220 .

[0102] In one embodiment, there are multiple sound-absorbing panels 400 , and two adjacent sound-absorbing panels 400 may be connected via a connector 500 , so as to form multiple sub-sound-absorbing chambers.

[0103] Reference Figure 14 As shown, in some embodiments, the support member 300 has at least two third support portions 330 connected to each other, and the third support portion 330 is used to connect to the electronic device so that the third support portion 330, the shell 200 and the electronic device are surrounded to form a plurality of first silencer cavities 301, and each first silencer cavity 301 is correspondingly connected to at least one first micro-perforation 202.

[0104] In the above embodiment, multiple independent first silencing cavities 301 are formed by at least two third support portions 330, the housing 200, and the electronic device. Each first silencing cavity 301 communicates with the mounting cavity 201 via the first micro-perforations 202. This creates a parallel multi-cavity design, where each first silencing cavity 301 effectively absorbs a portion of the noise sound waves, thus dispersing the sound absorption area and improving the sound absorption characteristics. Each first silencing cavity 301 independently dissipates the energy of the noise sound waves, thereby enhancing the noise reduction effect.

[0105] Specifically, a sound-absorbing plate 400 may be provided in each first sound-absorbing cavity 301 to separate each first sound-absorbing cavity 301 into a plurality of sub-sound-absorbing cavities, thereby further improving the noise reduction efficiency.

[0106] Among them, there are at least two third support parts 330. The number of third support parts 330 can be two, or two or more, such as 3, 4, 5, etc., and the embodiment of the present application does not impose too many restrictions on this.

[0107] Reference Figure 14 As shown, in one embodiment, the number of the third supporting parts 330 is multiple, forming a honeycomb-shaped support member 300, and the multiple first silencer cavities 301 formed by the support member 300, the shell 200 and the electronic device are arranged in a honeycomb shape.

[0108] In other embodiments, the support member 300 formed by the plurality of third support portions 330 may also be in a grid shape, a tree branch shape, or the like.

[0109] In one embodiment, the sizes and shapes of the multiple first silencer cavities 301 can be different, so that the resonance frequency of each first silencer cavity 301 is different, so that noise of different frequencies can be absorbed to cover a wider frequency range and provide a more comprehensive noise attenuation effect.

[0110] In one embodiment, a sound absorbing member is provided in the first silencing cavity 301 .

[0111] In the above embodiment, a sound absorbing member is provided in the first silencing chamber 301. The sound absorbing member has good sound wave energy absorption characteristics and can provide more noise sound wave reflection and attenuation paths in the first silencing chamber 301, thereby improving the noise absorption capacity of the first silencing chamber 301.

[0112] For example, the sound absorbing member includes but is not limited to sound absorbing cotton, foam metal and other sound absorbing materials.

[0113] Reference Figure 1 、 Figure 2 and Figure 14 As shown, the electronic device provided in the embodiment of the present application includes a device body 20 and any of the above-described heat dissipation fans 10 , and the heat dissipation fan 10 is disposed on the device body 20 .

[0114] In the above structural arrangement, since the electronic device adopts the heat dissipation fan 10 in the above embodiment, it also correspondingly has the advantages and benefits brought by the above heat dissipation fan 10, which will not be further elaborated here.

[0115] In some embodiments, reference Figure 1 、 Figure 2 and Figure 14 As shown, a heat pipe 22 and a plurality of heat dissipation fins 23 are provided on the device body 20 . The heat dissipation fins 23 are provided corresponding to the air outlets 212 on the housing 200 of the heat dissipation fan 10 , and the heat pipe 22 is connected to the heat dissipation fins 23 .

[0116] The heat pipe 22 is a heat transfer element with extremely high thermal conductivity. The heat pipe 22 has an evaporation end and a condensation end. The heat pipe 22 contains a working fluid, and heat is transferred by evaporating and condensing the working fluid in the heat pipe 22.

[0117] Heat pipes 22, connected to fins 23, transfer heat generated by the electronic device to fins 23. Due to the high thermal conductivity of heat pipes 22, they quickly transfer heat to fins 23, allowing fins 23 to more effectively disperse the heat into the air. The air outlets 212 of cooling fan 10 are positioned corresponding to fins 23. Cooling fan 10 accelerates air flow, helping to remove heat from fins 23 and achieving even greater heat dissipation.

[0118] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the contents disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0119] It should be understood that the present application is not limited to the exact structure described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A cooling fan, characterized in that: include: Fan blades (100); A housing (200), the housing (200) having an installation cavity (201), the fan blade (100) being rotatably disposed in the installation cavity (201), the housing (200) being provided with a plurality of first micro-perforations (202), the first micro-perforations (202) being in communication with the installation cavity (201); A support member (300) is provided on a side of the housing (200) having the first micro-perforation (202), and the support member (300) is used to connect with an electronic device so that the support member (300), the housing (200) and the electronic device enclose at least one first silencing cavity (301), and the first micro-perforation (202) is correspondingly connected to the first silencing cavity (301).

2. The heat dissipation fan according to claim 1, characterized in that: The plurality of first micro-perforations (202) are evenly spaced and distributed.

3. The heat dissipation fan according to claim 1, characterized in that: The plurality of first micro-perforations (202) form at least two micro-perforation groups (203), and each of the micro-perforation groups (203) is distributed in a different area of the shell (200).

4. The heat dissipation fan according to claim 1, characterized in that: The support member (300) is a first sealing member, and the first sealing member is used to fill the gap between the housing (200) and the electronic device to form the first silencing cavity (301); Alternatively, a second sealing member is provided on the support member (300), and the second sealing member is used to fill the gap between the support member (300) and the electronic device.

5. The cooling fan according to any one of claims 1 to 4, characterized in that: A blocking portion (204) is provided in the installation cavity (201), the blocking portion (204) dividing the installation cavity (201) into a sub-installation cavity and at least one second silencer cavity (205), and the fan blade (100) is provided in the sub-installation cavity; The sub-mounting cavity and the second silencing cavity (205) are respectively connected to the first silencing cavity (301) through the first micro-perforations (202).

6. The cooling fan according to any one of claims 1 to 4, characterized in that: It also includes at least one sound-absorbing plate (400), wherein the sound-absorbing plate (400) is provided with a plurality of second micro-perforations (401); The silencer plate (400) is arranged in the first silencer cavity (301), and the silencer plate (400) divides the first silencer cavity (301) into a plurality of sub-silencer cavities distributed along the axial direction of the fan blade (100), and two adjacent sub-silencer cavities are connected through the second micro-perforations (401).

7. The heat dissipation fan according to claim 6, characterized in that: It also includes a connecting piece (500), wherein the connecting piece (500) connects the muffler plate (400) and the shell (200), and the side wall of the muffler plate (400) abuts against the inner side wall of the support piece (300).

8. The cooling fan according to any one of claims 1 to 4, characterized in that: The support member (300) has at least two connected third support portions (330), and the third support portion (330) is used to connect to the electronic device, so that the third support portion (330), the housing (200) and the electronic device are surrounded to form a plurality of first silencing cavities (301), and each of the first silencing cavities (301) is correspondingly connected to at least one of the first micro-perforations (202).

9. The cooling fan according to any one of claims 1 to 4, characterized in that: A sound absorbing component is provided in the first silencing cavity (301).

10. An electronic device, characterized in that: The device comprises a device body (20) and a heat dissipation fan (10) according to any one of claims 1 to 9, wherein the heat dissipation fan (10) is arranged on the device body (20).

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