PCB flying probe testing device

Abstract

The invention discloses a PCB flying probe testing device which comprises a left elastic sheet baffle and a right elastic sheet baffle, a left metal auxiliary seat is arranged on the outer side of the lower portion of the left elastic sheet baffle, and a right metal auxiliary seat is arranged on the side, close to the left metal auxiliary seat, of the right elastic sheet baffle in the same direction. And a left mounting mechanism is arranged between the left metal auxiliary seat and the top end of the left elastic sheet baffle plate and comprises a third metal elastic sheet, a fourth metal elastic sheet and a left probe. Compared with plastic, the metal is more stable, not prone to deformation caused by temperature influence and beneficial to long-time storage and long-distance transportation, the high elasticity of the metal is utilized, the elasticity more excellent than that of the plastic can be shown without high-grade metal, the upgrading space is larger, high-end engineering plastics such as PEEK and PAI are used for the plastic at present, and the application range is wide. And the metal elastic sheet only needs to use common elastic metal such as spring steel or beryllium copper, so that the manufacturing cost can be saved.

Description

Technical Field

[0001] The present invention relates to the field of PCB flying probe testing, in particular to a PCB flying probe testing device. Background Art

[0002] Existing PCB flying probe testers are primarily made of plastic, fashioned through NC or injection molding into a plastic frame with two elastic positioning arms. Metal probes are mounted perpendicular to the two arms, and connecting wires are connected to the tester. The bending of the plastic elastic positioning arms, in conjunction with an optical coupler, allows the metal probes to contact the PCB, enabling continuous testing.

[0003] Plastics are often easily deformed by stress and temperature during the molding process, making them unsuitable for long-term storage. This is especially true during long-distance transportation in hot weather, where slight deformations can easily occur. Plastics have limited elasticity, and expensive engineering plastics are often required to meet the elasticity requirements of flying probe testing. Plastic elastic frames also have limited bending resistance, and they fatigue quickly during high-speed testing. Summary of the Invention

[0004] The object of the present invention is to provide a PCB flying probe test device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a PCB flying probe test device, comprising a left spring baffle and a right spring baffle, wherein a left metal sub-base is provided on the lower outer side of the left spring baffle, and a right metal sub-base is provided on the same side of the right spring baffle close to the left metal sub-base; a left mounting mechanism is provided between the left metal sub-base and the top of the left spring baffle, and the left mounting mechanism includes a third metal spring, a fourth metal spring and a left probe; a right mounting mechanism is provided between the right metal sub-base and the top of the right spring baffle, and the right mounting mechanism includes a first metal spring, a second metal spring and a right probe.

[0006] Furthermore, the top of the left spring baffle is fixedly connected to the third metal spring, the top of the left metal sub-base is fixedly connected to the fourth metal spring, and a left probe is arranged between the tops of the third and fourth metal springs.

[0007] Furthermore, the top of the right spring baffle is fixedly connected to the first metal spring, the top of the right metal sub-base is fixedly connected to the second metal spring, and a right probe is arranged between the tops of the first metal spring and the second metal spring.

[0008] Furthermore, a left plastic insulating sub-seat is provided on the side and bottom of the left elastic baffle away from the left metal sub-seat, and a right plastic insulating sub-seat is provided on the side and bottom of the right elastic baffle away from the right metal sub-seat.

[0009] Furthermore, a left metal base is provided on a side of the left plastic insulating sub-base away from the left metal sub-base, and a right metal base is provided on a side of the right plastic insulating sub-base away from the right metal sub-base.

[0010] Furthermore, a grounding metal gasket is provided on one side of the left metal base and the right metal base away from the left plastic insulating sub-base and the right plastic insulating sub-base, and a plastic bracket is provided on the other side of the grounding metal gasket.

[0011] Furthermore, a left gasket is provided on a side of the left metal sub-base away from the left elastic baffle, and a right gasket is provided on a side of the right metal sub-base away from the right elastic baffle.

[0012] Furthermore, a first rod groove is provided in the middle of the first metal spring and the top of the second metal spring, and the right probe is sleeved in the two first rod grooves. The first rod groove at the top of the second metal spring is located in the middle of the right probe, and the first rod groove at the top of the first metal spring is welded to the tail end of the right probe.

[0013] Furthermore, a second rod groove is provided in the middle of the third metal spring and the top of the fourth metal spring, and the left probe is sleeved in the two second rod grooves. The second rod groove at the top of the fourth metal spring is located in the middle of the left probe, and the second rod groove at the top of the third metal spring is welded to the tail end of the left probe.

[0014] Furthermore, the first metal dome, the second metal dome, the third metal dome and the fourth metal dome are made of spring steel or beryllium copper.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The metal in the present invention is more stable than plastic and is not easily deformed by temperature, which is conducive to long-term storage and long-distance transportation. By utilizing the high elasticity of metal, it is not necessary to use high-grade metal to show better elasticity than plastic, and there is greater room for upgrading. Plastics currently use high-end engineering plastics such as PEEK and PAI, while metal shrapnel only needs to use ordinary elastic metals such as spring steel or beryllium copper, which can save production costs.

[0017] 2. In the present invention, the first rod groove at the top of the first metal spring is welded to the tail end of the right probe, and the second rod groove at the top of the third metal spring is welded to the tail end of the left probe to form conduction, so that the part of the spring that does not participate in the deformation work is connected to the test equipment, and the tips of the left probe and the right probe are in contact with the PCB for testing, thereby achieving the purpose of easy installation and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1This is a schematic diagram of the overall structure of a PCB flying probe test device according to the present invention;

[0019] Figure 2 This is a schematic diagram of a fourth metal dome of a PCB flying probe test device according to the present invention;

[0020] Figure 3 This is a schematic diagram of the right mounting mechanism of a PCB flying probe test device according to the present invention;

[0021] Figure 4 This is a schematic diagram of the left mounting mechanism of a PCB flying probe test device according to the present invention;

[0022] Figure 5 A PCB flying probe test device of the present invention Figure 2 A magnified schematic diagram of point A in FIG.

[0023] In the figure: 1. Left spring clip baffle; 2. Right spring clip baffle; 3. Left metal sub-base; 4. Right metal sub-base; 5. Left mounting mechanism; 501. Third metal spring; 502. Fourth metal spring; 503. Left probe; 6. Right mounting mechanism; 601. First metal spring; 602. Second metal spring; 603. Right probe; 7. Left plastic insulating sub-base; 8. Right plastic insulating sub-base; 9. Left metal base; 10. Right metal base; 11. Grounding metal gasket; 12. Plastic bracket; 13. Left gasket; 14. Right gasket; 15. First rod slot; 16. Second rod slot. DETAILED DESCRIPTION

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] like Figure 1-5As shown, the present invention provides a technical solution: a PCB flying probe test device, comprising a left spring baffle 1 and a right spring baffle 2, a left metal sub-base 3 is provided on the lower outer side of the left spring baffle 1, and a right metal sub-base 4 is provided on the same side of the right spring baffle 2 close to the left metal sub-base 3; a left plastic insulating sub-base 7 is provided on the side and bottom end of the left spring baffle 1 away from the left metal sub-base 3, and a right plastic insulating sub-base 8 is provided on the side and bottom end of the right spring baffle 2 away from the right metal sub-base 4; the left plastic insulating sub-base 7 is away from the left metal sub-base 3 A left metal base 9 is provided on one side of the left metal sub-base 3, and a right metal base 10 is provided on the side of the right plastic insulating sub-base 8 away from the right metal sub-base 4; a grounding metal gasket 11 is provided on the side of the left metal base 9 and the right metal base 10 away from the left plastic insulating sub-base 7 and the right plastic insulating sub-base 8, and a plastic bracket 12 is provided on the other side of the grounding metal gasket 11; a left gasket 13 is provided on the side of the left metal sub-base 3 away from the left elastic baffle 1, and a right gasket 14 is provided on the side of the right metal sub-base 4 away from the right elastic baffle 2 ; The first metal spring 601, the second metal spring 602, the third metal spring 501 and the fourth metal spring 502 are made of spring steel or beryllium copper; a left mounting mechanism 5 is provided between the left metal sub-base 3 and the top of the left spring baffle 1, and the left mounting mechanism 5 includes the third metal spring 501, the fourth metal spring 502 and the left probe 503; a right mounting mechanism 6 is provided between the right metal sub-base 4 and the top of the right spring baffle 2, and the right mounting mechanism 6 includes the first metal spring 601, the second metal spring 602 and the right probe 603; the top of the left spring baffle 1 is fixedly connected to the third metal spring 501, the top of the left metal sub-base 3 is fixedly connected to the fourth metal spring 502, and the left probe 503 is arranged between the tops of the third metal spring 501 and the fourth metal spring 502; the top of the right spring baffle 2 is fixedly connected to the first metal spring 601, the top of the right metal sub-base 4 is fixedly connected to the second metal spring 602, and the right probe 603 is arranged between the tops of the first metal spring 601 and the second metal spring 602;

[0026] In this embodiment, since metal is more stable than plastic and is not easily deformed by temperature, it is conducive to long-term storage and long-distance transportation. By utilizing the high elasticity of metal, it is not necessary to use very high-grade metal to exhibit better elasticity than plastic, and there is more room for upgrade. Plastics currently use high-end engineering plastics such as PEEK and PAI, while metal shrapnel only needs to use ordinary elastic metals such as spring steel or beryllium copper, which can save production costs.

[0027] like Figure 3 、 Figure 4 and Figure 5As shown, a first rod groove 15 is provided in the middle of the first metal dome 601 and the top of the second metal dome 602, and the right probe 603 is sleeved in the two first rod grooves 15. The first rod groove 15 at the top of the second metal dome 602 is located in the middle of the right probe 603, and the first rod groove 15 at the top of the first metal dome 601 is welded to the tail end of the right probe 603; a second rod groove 16 is provided in the middle of the third metal dome 501 and the top of the fourth metal dome 502, and the left probe 503 is sleeved in the two second rod grooves 16. The second rod groove 16 at the top of the fourth metal dome 502 is located in the middle of the left probe 503, and the second rod groove 16 at the top of the third metal dome 501 is welded to the tail end of the left probe 503;

[0028] In this embodiment, the first rod groove 15 at the top of the first metal spring 601 is welded to the tail end of the right probe 603, and the second rod groove 16 at the top of the third metal spring 501 is welded to the tail end of the left probe 503 to form a conduction, so that the part of the spring that does not participate in the deformation work is connected to the test equipment, and the tips of the left probe 503 and the right probe 603 are in contact with the PCB for testing, thereby achieving the purpose of easy installation and use.

[0029] Working principle: The first metal dome 601, the second metal dome 602, the third metal dome 501 and the fourth metal dome 502 are fixed in parallel in pairs on the left dome baffle 1, the right dome baffle 2, the left metal sub-base 3 and the right metal sub-base 4 using independent domes. The left probe 503 and the right probe 603 are vertically installed on the front ends of the first metal dome 601 and the second metal dome 602 as well as the third metal dome 501 and the fourth metal dome 502 respectively. Among them, the first rod groove 15 at the top of the first metal dome 601 is welded to the tail end of the right probe 603, and the second rod groove at the top of the third metal dome 501 is welded to the tail end of the right probe 603. 16 is welded to the tail end of the left probe 503 to form conduction, so that the part of the shrapnel that does not participate in the deformation work is connected to the test equipment, and the tips of the left probe 503 and the right probe 603 are in contact with the PCB for testing. Since metal is more stable than plastic and is not easily deformed by temperature, it is conducive to long-term storage and long-distance transportation. By utilizing the high elasticity of metal, it does not require high-grade metal to show better elasticity than plastic, and there is more room for upgrading. Plastics currently use high-end engineering plastics such as PEEK and PAI, while metal shrapnel only needs to use ordinary elastic metals such as spring steel or beryllium copper, which can save production costs.

[0030] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0031] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A PCB flying probe test device, characterized by: include A left spring baffle (1) and a right spring baffle (2), wherein a left metal sub-seat (3) is provided on the lower outer side of the left spring baffle (1), and a right metal sub-seat (4) is provided on the same side of the right spring baffle (2) close to the left metal sub-seat (3); A left mounting mechanism (5) is provided between the left metal sub-base (3) and the top end of the left spring plate baffle (1), and the left mounting mechanism (5) comprises a third metal spring plate (501), a fourth metal spring plate (502) and a left probe (503); A right mounting mechanism (6) is provided between the right metal sub-base (4) and the top end of the right spring plate baffle (2), and the right mounting mechanism (6) comprises a first metal spring plate (601), a second metal spring plate (602) and a right probe (603).

2. A PCB flying probe test device according to claim 1, characterized in that: The top end of the left spring plate baffle (1) is fixedly connected to the third metal spring plate (501), the top end of the left metal sub-base (3) is fixedly connected to the fourth metal spring plate (502), and a left probe (503) is provided between the top ends of the third metal spring plate (501) and the fourth metal spring plate (502).

3. A PCB flying probe test device according to claim 1, characterized in that: The top of the right spring plate baffle (2) is fixedly connected to the first metal spring (601), the top of the right metal sub-base (4) is fixedly connected to the second metal spring (602), and a right probe (603) is arranged between the tops of the first metal spring (601) and the second metal spring (602).

4. A PCB flying probe test device according to claim 1, characterized in that: A left plastic insulating sub-seat (7) is provided on the side and bottom end of the left spring-flake baffle (1) away from the left metal sub-seat (3), and a right plastic insulating sub-seat (8) is provided on the side and bottom end of the right spring-flake baffle (2) away from the right metal sub-seat (4).

5. A PCB flying probe test device according to claim 4, characterized in that: A left metal base (9) is provided on the side of the left plastic insulating sub-base (7) away from the left metal sub-base (3), and a right metal base (10) is provided on the side of the right plastic insulating sub-base (8) away from the right metal sub-base (4).

6. A PCB flying probe test device according to claim 5, characterized in that: A grounding metal gasket (11) is provided on one side of the left metal base (9) and the right metal base (10) away from the left plastic insulating sub-base (7) and the right plastic insulating sub-base (8), and a plastic bracket (12) is provided on the other side of the grounding metal gasket (11).

7. A PCB flying probe test device according to claim 1, characterized in that: A left gasket (13) is provided on the side of the left metal sub-base (3) away from the left elastic baffle (1), and a right gasket (14) is provided on the side of the right metal sub-base (4) away from the right elastic baffle (2).

8. The PCB flying probe test device according to claim 1, characterized in that: A first rod groove (15) is provided at the middle of the first metal spring (601) and the top of the second metal spring (602); the right probe (603) is sleeved in the two first rod grooves (15); the first rod groove (15) at the top of the second metal spring (602) is located in the middle of the right probe (603); and the first rod groove (15) at the top of the first metal spring (601) is welded to the tail end of the right probe (603).

9. A PCB flying probe test device according to claim 8, characterized in that: The middle of the third metal spring (501) and the top of the fourth metal spring (502) are both provided with second rod grooves (16), and the left probe (503) is sleeved in the two second rod grooves (16). The second rod groove (16) at the top of the fourth metal spring (502) is located in the middle of the left probe (503), and the second rod groove (16) at the top of the third metal spring (501) is welded to the tail end of the left probe (503).

10. The PCB flying probe test device according to claim 9, characterized in that: The first metal spring (601), the second metal spring (602), the third metal spring (501) and the fourth metal spring (502) are made of spring steel or beryllium copper.

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