Camera module

Abstract

The invention discloses a camera module. The camera module comprises an optical lens; the photosensitive assembly comprises a photosensitive chip and a circuit board, and the photosensitive chip is arranged and electrically connected to the circuit board; the base is fixed above the circuit board; the adhesive is arranged between the circuit board and the base; the focusing driving assembly is configured to drive the optical lens to move in the direction parallel to the optical axis, and the anti-shake driving assembly drives the optical lens to move in the direction perpendicular to the optical axis; one end of the focusing substrate is fixed and electrically connected to the focusing driving assembly, and the other end of the focusing substrate is fixed to the base on the first side and welded to the circuit board. One end of the anti-shake substrate is fixed and electrically connected to the anti-shake driving assembly, and the other end of the anti-shake substrate is fixed to the base on the second side and welded to the circuit board, so that the base and the circuit board are subjected to symmetrical pulling force on the first side and the second side respectively. The camera module provided by the invention has good stability and reliability.

Description

Technical Field

[0001] The present application relates to the field of camera modules, and in particular to a camera module. Background Art

[0002] Currently, consumers in the market are demanding increasingly sophisticated and diverse features from camera modules in mobile electronic devices (e.g., smartphones). For example, to achieve common optical focus and optical image stabilization functions, a motor is typically included in the camera module to drive the movement of the optical lens, thereby adjusting optical performance.

[0003] Motor circuit conductivity not only affects signal transmission and motor performance, but also the reliability and stability of the camera module. Therefore, it is urgent to optimize the motor circuit conductivity structure to develop a camera module with better stability and reliability. Summary of the Invention

[0004] One purpose of the present application is to provide a camera module, which is conducive to improving the reliability and stability of the camera module and reducing the risk of cracking of the adhesive.

[0005] Another object of the present application is to provide a camera module that is conducive to improving the focusing speed and focusing accuracy of the camera module and further enhancing the imaging quality.

[0006] To achieve the above objectives, the technical solution adopted in the present application is as follows: a camera module, comprising: an optical lens, defining an optical axis; a photosensitive component, comprising a photosensitive chip and a circuit board, wherein the photosensitive chip is arranged and electrically connected to the circuit board, and the photosensitive chip is located on the optical path of the optical lens; a base, wherein the circuit board is fixed below the base; an adhesive, which is arranged between the circuit board and the base; a focus drive component and an anti-shake drive component, wherein the focus drive component is configured to drive the optical lens to move in a direction parallel to the optical axis, and the anti-shake drive component is configured to drive the optical lens to move in a direction perpendicular to the optical axis. direction of movement; a focusing substrate and an anti-shake substrate, one end of the focusing substrate is fixed and electrically connected to the focusing drive assembly, and the other end of the focusing substrate is fixed to the base on a first side and welded to the circuit board; one end of the anti-shake substrate is fixed and electrically connected to the anti-shake drive assembly, and the other end of the anti-shake substrate is fixed to the base on a second side and welded to the circuit board, so that the base and the circuit board are respectively subjected to symmetrical pulling forces on the first side and the second side; the camera module includes a first side, a second side, a third side and a fourth side located on the peripheral side, and the first side and the second side are opposite sides.

[0007] In some embodiments, the focusing substrate includes a second focusing conductive portion fixed to the base and welded to the circuit board, and the anti-shake substrate includes a third anti-shake conductive portion fixed to the base and welded to the circuit board, and the plane where the second focusing conductive portion is located is parallel to the plane where the third anti-shake conductive portion is located, and both are parallel to the direction of the optical axis; wherein, the width of the second focusing conductive portion along the direction perpendicular to the optical axis is smaller than the width of the third anti-shake conductive portion along the direction perpendicular to the optical axis.

[0008] In some embodiments, the anti-shake substrate also includes a first anti-shake conductive portion and a second anti-shake conductive portion electrically connected to the anti-shake driving component, and an anti-shake bending portion having one end connected to the first anti-shake conductive portion or the second anti-shake conductive portion and the other end connected to the third anti-shake conductive portion, and the plane where the first anti-shake conductive portion and the second anti-shake conductive portion are located is perpendicular to the plane where the third anti-shake conductive portion is located; wherein the width of the anti-shake bending portion along the direction perpendicular to the optical axis is h1, and the width of the third anti-shake conductive portion along the direction perpendicular to the optical axis is h2, and h1<h2.

[0009] In some embodiments, the third anti-shake conductive portion has an anti-shake conductive pad, and the second focus conductive portion has a focus conductive pad, and the plane where the anti-shake conductive pad is located is parallel to the plane where the focus conductive pad is located; the top surface of the circuit board has a first pad group located on the first side and a second pad group located on the second side, and the plane where the anti-shake conductive pad and the focus conductive pad are located is perpendicular to the plane where the first pad group and the second pad group are located; wherein the number of the anti-shake conductive pads, the focus conductive pads, the first pad group and the second pad group is the same.

[0010] In some embodiments, the base includes a first base side wall located on the first side and a second base side wall located on the second side, the first base side wall has a first groove recessed toward the optical axis, the second base side wall has a second groove recessed toward the optical axis, and the circuit board closes the openings at the bottom of the first groove and the second groove; the focus conductive pad and the first pad group are exposed in the first groove, the anti-shake conductive pad and the second pad group are exposed in the second groove, and solder is arranged in the first groove and the second groove to fix and electrically connect the focus conductive pad and the first pad group, and to fix and electrically connect the anti-shake conductive pad and the second pad group.

[0011] In some embodiments, the circuit board includes a circuit board body, a connecting strip and a connector, the connecting strip connects the connector and the circuit board body, and the connecting strip and the connector are located on the third side; the first solder pad group and the second solder pad group are arranged on the circuit board body, and the first solder pad group, the second solder pad group, the connecting strip and the connector are respectively located on different sides of the circuit board body.

[0012] In some embodiments, the camera module includes an anti-shake module, which includes an anti-shake carrier, the anti-shake drive assembly and the anti-shake substrate, the focus substrate is parallel to the optical axis, and the focus substrate includes a first focus conductive portion located at one end, a second focus conductive portion located at the other end and a focus extension portion located between the first focus conductive portion and the second focus conductive portion; wherein, the first focus conductive portion and the second focus conductive portion are respectively located on different sides of the peripheral side, the first focus conductive portion is fixed to the anti-shake carrier, the second focus conductive portion is fixed to the base and extends toward the circuit board to be fixed and electrically connected to the circuit board, the focus extension portion is located on the periphery of the anti-shake carrier and has a gap with the anti-shake carrier, and the focus extension portion is bent at least twice on the periphery of the anti-shake carrier.

[0013] In some embodiments, the anti-shake substrate includes a first anti-shake conductive portion, a second anti-shake conductive portion and the third anti-shake conductive portion, wherein the first anti-shake conductive portion and the second anti-shake conductive portion are fixed to the base on different sides of the peripheral side, the first anti-shake conductive portion and the second anti-shake conductive portion are connected to each other, and the third anti-shake conductive portion extends from the first anti-shake conductive portion or the second anti-shake conductive portion toward the circuit board, is fixed and electrically connected to the circuit board; wherein the third anti-shake conductive portion and the first focus conductive portion are located on adjacent sides of the peripheral side, and the third anti-shake conductive portion and the second focus conductive portion are located on opposite sides of the peripheral side.

[0014] In some embodiments, the focusing extension portion further includes a first bending portion, a first extension portion, a second bending portion, a second extension portion and a third bending portion, the first bending portion integrally connects the first focusing conductive portion and the first extension portion, the second bending portion integrally connects the first extension portion and the second extension portion, and the third bending portion integrally connects the second extension portion and the second focusing conductive portion, so that the first focusing conductive portion and the second focusing conductive portion are arranged on the first side and the fourth side of the anti-shake carrier, and the first extension portion and the second extension portion are arranged on the second side and the third side of the anti-shake carrier, wherein the first side and the second side are arranged relative to each other along the second direction or the third direction, the third side and the fourth side are arranged relative to each other along the third direction or the second direction, and the first direction is parallel to the optical axis, and the second direction and the third direction are orthogonal to the first direction.

[0015] In some embodiments, the camera module also includes a focusing module, which includes the focusing drive assembly, the focusing substrate and the focusing carrier, the focusing drive assembly includes a focusing drive magnet and a focusing drive coil arranged relative to each other along a first direction perpendicular to the first direction, the focusing drive magnet is arranged on one side of the focusing carrier, and the focusing drive coil is arranged on one side of the anti-shake carrier, wherein the focusing drive coil is arranged between the focusing drive magnet and the first focusing conductive portion along the second direction; the anti-shake drive assembly includes at least one anti-shake drive magnet and at least one anti-shake drive coil arranged relative to each other along the first direction, the anti-shake drive magnet and the focusing drive coil are arranged on opposite sides of the anti-shake carrier, the anti-shake drive coil is arranged on the base, and the anti-shake substrate is electrically connected to the circuit board, so as to drive the anti-shake carrier to move along the second direction and / or the third direction.

[0016] In some embodiments, the focusing substrate further includes a reinforcement, at least a portion of the reinforcement is attached to the periphery of the bent portion of the focusing extension portion, and another portion of the reinforcement extends along the second direction and / or the third direction, so that the reinforcement is attached to the connection between the bent portion of the focusing extension portion and the extension portion of the focusing extension portion; a conductive circuit is provided in the focusing substrate, and the number of the conductive circuits is not greater than 4, wherein the width of the reinforcement along the first direction is not greater than the width of the bent portion of the focusing extension portion along the first direction.

[0017] In some embodiments, the projection of the focusing substrate along the first direction and the projection of the anti-shake substrate along the first direction do not overlap on the first side and the fourth side; the projection of the focusing substrate along the first direction and the projection of the anti-shake substrate along the first direction overlap on the second side and the third side.

[0018] In some embodiments, the base includes a base body and a base protrusion, the base protrusion extends from one side of the base body toward the second focus conductive portion, the base protrusion supports the second focus conductive portion along a first direction, the base body is further provided with a body top surface, a body bottom surface and a body side surface, the body top surface supports the anti-shake carrier, the second focus conductive portion and the third anti-shake conductive portion are arranged on opposite sides of the body side surface, and the body bottom surface is bonded to the circuit board by an adhesive.

[0019] In some embodiments, the focus module further includes a focus support portion, the anti-shake carrier includes a main body, and a first beam, a second beam, a third beam and a fourth beam sequentially arranged along the circumferential direction, wherein the first beam and the third beam are arranged opposite to each other along the second direction, and the second beam and the fourth beam are arranged opposite to each other along the third direction, wherein the focus substrate is annularly installed on the outer circumference of the main body, and the focus drive coil is installed on the first beam; the anti-shake drive magnet is installed on the second beam and / or the third beam to drive the anti-shake carrier to move along the second direction and / or the third direction; The main body is provided with a first support groove, which is located on both sides of the first beam, and the first support groove is adapted for the installation of the focus support part; and the focus carrier includes an installation cavity, a first side wall, a second side wall, a third side wall and a fourth side wall arranged in sequence along the circumferential direction, wherein the first side wall and the third side wall are arranged opposite to each other along the second direction, and the second side wall and the fourth side wall are arranged opposite to each other along the third direction, and the focus drive magnet is arranged on the first side wall, so that the focus drive magnet, the focus drive coil and the first focus conductive part are arranged in sequence on the first side of the focus carrier along the second direction.

[0020] In some embodiments, the base is further provided with a glue storage tank, which is arranged along the second direction at the joint between the base, the focusing substrate, and the anti-shake substrate, for accommodating glue.

[0021] Compared with the prior art, the present invention has the following advantages: (1) The present application provides an anti-shake circuit board on opposite sides and a focus circuit board that is bent at least three times, so that the two conductive pads are connected to opposite sides of the base, which is conducive to balancing the tension generated by welding, reducing the risk of cracking of the adhesive, further enhancing the stability and reliability of the camera module, and extending its service life.

[0022] (2) This application places the focus module partly inside the anti-shake module, which helps to reduce the weight of the focus module and the weight of the drive. While further reducing the energy consumption of the drive, it increases the speed of focus and zoom, thereby improving the performance, imaging quality and market competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Cross-sectional views of some exemplary camera modules in this application.

[0024] Figure 2 Exploded views of some exemplary camera modules in this application.

[0025] Figure 3 These are stereoscopic images of some exemplary camera modules in this application.

[0026] Figure 4 Exploded views of some exemplary camera modules in this application.

[0027] Figure 5 These are three-dimensional images of some focusing substrates in this application.

[0028] Figure 6 Exploded views of some further exemplary camera modules in this application.

[0029] Figure 7 Exploded views of some other exemplary camera modules in this application.

[0030] Figure 8 These are stereoscopic images of some exemplary camera modules in this application.

[0031] Figure 9 For this application Figure 8 Enlarged view of part A.

[0032] Figure 10 Exploded diagrams of some exemplary camera modules in this application.

[0033] Figure 11 Side views of some anti-shake substrates in this application.

[0034] In the figure: 101, first side; 102, second side; 103, third side; 104, fourth side; 10, housing; 20, base; 21, base body; 211, top surface of the body; 212, bottom surface of the body; 213, side surface of the body; 2131, first base side wall; 2132, second base side wall; 2133, first groove; 2134, second groove; 22, base protrusion; 30, optical lens; 40, focus module; 41, focus carrier; 411, first side wall; 4111, magnet mounting portion; 4 112, guide groove; 412, second side wall; 413, third side wall; 414, fourth side wall; 415, mounting cavity; 42, focus drive assembly; 421, focus drive magnet; 422, focus drive coil; 43, focus substrate; 430, conductive circuit; 431, first focus conductive portion; 432, focus extension portion; 4321, first bend portion; 4322, first extension portion; 4323, second bend portion; 4324, second extension portion; 4325, third bend portion; 433, second focus conductive portion; 434, focus conductive pad; 435, reinforcement; 44, focus support portion; 441, support guide rod; 45, focus position sensing element; 50, anti-shake module; 51, anti-shake carrier; 511, main body; 512, first beam; 513, second beam; 514, third beam; 515, fourth beam; 52, anti-shake drive assembly; 521, anti-shake drive magnet; 522, anti-shake drive coil; 53, anti-shake substrate; 531, first anti-shake conductive portion; 532, second anti-shake conductive portion; 533, connecting portion ;534, anti-shake bending part; 535, third anti-shake conductive part; 5351, anti-shake conductive pad; 54, anti-shake support part; 541, support ball; 55, anti-shake position sensing element; 60, photosensitive component; 61, photosensitive chip; 62, circuit board; 620, circuit board body; 621, first conductive part; 6211, first pad group; 622, second conductive part; 6221, second pad group; 623, connecting belt; 624, connector; 63, filter element; 64, filter element bracket; 70, adhesive. DETAILED DESCRIPTION

[0035] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0036] In the description of this application, it should be noted that for directional words, such as the terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and so on, indicating the orientation and position relationship are based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of this application.

[0037] It should be noted that the terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0038] The terms "comprises" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, product or apparatus.

[0039] like Figures 1 to 11 As shown, one embodiment of the present application provides a camera module, including: an optical lens 30, a photosensitive component 60, a base 20, an adhesive 70, a focus drive component 42, an anti-shake drive component 52, a focus substrate 43 and an anti-shake substrate 53. The optical lens 30 defines an optical axis. The photosensitive component 60 includes a photosensitive chip 61 and a circuit board 62. The photosensitive chip 61 is arranged and electrically connected to the circuit board 62. The photosensitive chip 61 is located on the optical path of the optical lens 30 and is used to receive light signals. The base 20 is arranged above the circuit board 62, and the adhesive 70 is arranged between the circuit board 62 and the base 20 to fix the base 20 and the circuit board 62. The focus drive component 42 is configured to drive the optical lens 30 to move in a direction parallel to the optical axis so that light converges on the photosensitive chip 61 to achieve imaging. One end of the focusing substrate 43 is fixed and electrically connected to the focusing drive assembly 42, and the other end of the focusing substrate 43 is fixed to the base 20 on the first side 101 and welded to the circuit board 62, thereby receiving the current signal to achieve fast and accurate focusing or zooming operation.

[0040] The anti-shake drive component 52 is configured to drive the anti-shake module 50 and drive the focus module 40 to move in a direction perpendicular to the optical axis, thereby reducing the risk of reduced image quality caused by camera module shaking; one end of the anti-shake substrate 53 is fixed to and electrically connected to the anti-shake drive component 52, and the other end of the anti-shake substrate 53 is fixed to the base 20 on the second side 102 opposite to the first side 101 and welded to the circuit board 62, so that the base 20 and the circuit board 62 are respectively subjected to symmetrical tensile forces on the first side 101 and the second side 102. On the other hand, a command signal can be transmitted to the anti-shake drive component 52, so that the anti-shake module 50 can be driven in a short time, further enhancing the image anti-shake function.

[0041] It is understood that the camera module includes a light incident side, a light exit side, and a peripheral side, wherein the peripheral side includes a first side 101, a second side 102, a third side 103, and a fourth side 104. The first side 101 and the second side 102 are opposite sides of the peripheral side. Since tensile force is generated at the soldering locations due to the solidification and shrinkage of the solder, if the soldering locations between the focus substrate 43 and the circuit board 62 and the soldering locations between the anti-shake substrate 53 and the circuit board 62 are located on adjacent sides, such as the first side 101 and the third side 103, the tensile force generated by the solidification and shrinkage of the solder will be concentrated on the adjacent sides of the base 20 and the circuit board 62, or on the connection area between the adjacent sides. This may result in uneven horizontal force on the base 20 and the circuit board 62. At this time, on the two unsoldered sides, such as the second side 102 and the fourth side 104, the circuit board 62, the base 20, and the adhesive 70 may easily separate, causing debonding or cracking. It is worth mentioning that in this application, since the focus substrate 43 is fixed to the circuit board 62 on the first side 101 and the anti-shake substrate 53 is fixed to the circuit board 62 on the second side 102, this means that the welding positions of the focus substrate 43 and the circuit board 62, and the welding positions of the anti-shake substrate 53 and the circuit board 62 are respectively located on opposite sides of the circuit board 62. This is conducive to balancing the stress generated when welding the focus substrate 43, the anti-shake substrate 53 and the circuit board 62 and the tensile force generated by the solidification shrinkage of the solder. That is, the tensile force exerted on the opposite sides of the circuit board 62 and the base 20 is symmetrical, thereby reducing the risk of cracking of the adhesive 70, further enhancing the stability and reliability of the camera module, and extending its service life. In other words, the structure in which the welding positions of the anti-shake substrate 53 and the circuit board 62 are respectively located on opposite sides of the circuit board 62 can significantly improve the reliability and stability of the camera module while maintaining the integrity of the electrical connection.

[0042] It is worth mentioning that Figures 1 to 3As shown, the camera module includes a focus module 40 and an anti-shake module 50. The focus module 40 includes a focus drive assembly 42, a focus substrate 43 and a focus carrier 41. The anti-shake module 50 includes an anti-shake drive assembly 52, an anti-shake substrate 53 and an anti-shake carrier 51. In this application, part of the focus module 40 is arranged inside the anti-shake module 50 to reduce the length of the camera module in the first direction, thereby reducing the occupied volume of the camera module, which is conducive to expanding its application scenarios in miniaturized and high-performance electronic devices. At the same time, the focus module 40 arranged inside only needs to drive the optical lens 30 when performing the focusing step, which is conducive to reducing the weight of the focus module 40 and the weight required to be driven, reducing the drive assembly, further reducing the energy consumption of the drive, and increasing the speed of focusing and zooming, thereby increasing the performance, image quality and market competitiveness of capturing dynamic scenes. Furthermore, since the weight required to drive the focus module 40 is relatively small, the optical lens 30 can perform a larger focus movement stroke, thereby increasing the movement stroke of the optical lens 30. On the other hand, due to the reduced weight required for the drive, the focus module 40 can precisely control the drive travel of the optical lens 30, which helps improve the focusing accuracy of the focus module 40 and thus enhance the image quality. Furthermore, since the anti-shake module 50 is located outside the focus module 40, the design of the anti-shake module 50 can be more flexible. Moreover, the anti-shake travel is smaller than the focus travel, making it easier for the anti-shake module 50 to control the movement of the optical lens 30. This helps improve the accuracy of the anti-shake module 50 and reduce over-compensation or under-compensation. On this basis, as users' requirements for shooting quality continue to increase, the requirements for the optical performance of electronic products are also gradually increasing. Therefore, a variable aperture is commonly used in camera modules to improve the user's shooting experience in different lighting conditions. In this application, the focus module 40 is located inside the anti-shake module 50. The focus module 40 can support the relatively heavy variable aperture, achieving the requirements of fast and accurate optical zoom and / or optical focus, thereby enhancing market competitiveness.

[0043] Among them, Figure 2 As shown, the optical lens 30 defines an optical axis, which is perpendicular to the second direction and the third direction. The first direction is parallel to the optical axis. Specifically, the first direction is defined as the height direction of the camera module arranged along the Z axis, the second direction is defined as the length direction of the camera module arranged along the X axis, and the third direction is defined as the width direction of the camera module arranged along the Y axis. It is understood that the setting of the coordinate system can be flexibly set according to actual needs and is not limited here.

[0044] In some embodiments, as Figure 4 、 5As shown, the width direction of the focusing substrate 43 is parallel to the first direction, the thickness direction of the focusing substrate 43 is parallel to the second direction, or the third direction, the length of the focusing substrate 43 is the length extending around the circumference of the camera module, and the width of the focusing substrate 43 is greater than the thickness, so that a sufficient number of wires can be set on the focusing substrate 43. The focusing substrate 43 includes a first focusing conductive portion 431 located at one end, a second focusing conductive portion 433 located at the other end, and a focusing extension portion 432 located between the first focusing conductive portion 431 and the second focusing conductive portion 433, and the planes where the first focusing conductive portion 431, the second focusing conductive portion 433 and the focusing extension portion 432 are located are all parallel to the first direction; wherein, the first focusing conductive portion 431 and the second focusing conductive portion 433 are respectively located on different sides of the circumference, the first focusing conductive portion 431 is connected to the focus drive assembly 42, the second focusing conductive portion 433 is connected to the base 20 and extends toward the circuit board 62, so that the second focusing conductive portion 433 is fixed and electrically connected to the circuit board 62, the focusing extension portion 432 is gap-arranged on the outer periphery of the anti-shake carrier 51, and the focusing extension portion 432 is bent at least twice on the outer periphery of the anti-shake carrier 51.

[0045] It can be understood that since the focus drive assembly 42 is arranged on the inner side of the anti-shake drive assembly 52 in this application, the focus substrate 43 arranged on the periphery of the anti-shake module 50 needs to be connected to the circuit board 62 and the focus drive assembly 42 at the same time, and the first focus conductive part 431 and the second focus conductive part 433 need to be located on different sides of the periphery respectively. At the same time, the drive signal of the focus module 40 needs to be conducted to the outside, so the focus substrate 43 needs to be bent at least twice, which is not only beneficial to reduce the generated reaction force, but also can optimize the arrangement of the internal components of the camera module and enhance flexibility. Furthermore, since a focusing substrate 43 and an anti-shake substrate 53 are respectively provided in the present application, that is, the focusing substrate 43 and the anti-shake substrate 53 are split structures, wherein the focusing substrate 43 is electrically connected to the focusing drive component 42 and the circuit board 62, and the anti-shake substrate 53 is electrically connected to the anti-shake drive component 52 and the circuit board 62, compared with the technical solution of only providing a single integrated substrate that is electrically connected to the focusing drive component 42, the anti-shake drive component 52 and the circuit board 62 at the same time, the number of conductive lines that must be provided in the split focusing substrate 43 and the anti-shake substrate 53 can be reduced, which is beneficial to reducing the width of the substrate. This reduces the reaction force generated when the substrate is driven in the anti-shake step and the focusing step, further reduces the risk of deformation, vibration or stress concentration of the substrate, and improves the imaging accuracy and reliability of the camera module.

[0046] It is worth mentioning that since the camera module is connected end to end in a clockwise direction and the first side 101, the third side 103, the second side 102 and the fourth side 104 are arranged in sequence, when the focusing substrate 43 is bent twice in the plane where the second direction and the third direction are located, the first focusing conductive portion 431 and the second focusing conductive portion 433 are respectively arranged on the second side 102 and the first side 101, or the third side 103 and the fourth side 104, or the first side 101 and the second side 102, or the fourth side 104 and the third side 103. At this time, the third anti-shake conductive portion 535 of the anti-shake substrate 53 is arranged on the second side 102, or the third side 103, or the first side 101, or the fourth side 104, so that the third anti-shake conductive portion 535 and the second focusing conductive portion 433 are arranged on opposite sides. When the focus substrate 43 is bent fewer than twice, because the focus substrate 43 is positioned outside the anti-shake carrier 51, driving the anti-shake carrier 51 in the second and / or third directions will cause the focus substrate 43 to move with it, easily causing deformation. This, in turn, generates a corresponding force in the focus substrate 43 to overcome the deformation, i.e., a reaction force. In other words, this reaction force can affect the driving effect of the anti-shake drive assembly 52, so it is necessary to reduce the reaction force.

[0047] When the focus substrate 43 is bent three times in the plane corresponding to the second and third directions, the first focus conductive portion 431 and the second focus conductive portion 433 are respectively disposed adjacent to the fourth side 104 and the first side 101, or the second side 102 and the fourth side 104, or the third side 103 and the second side 102, or the first side 101 and the third side 103. At this time, the third anti-shake conductive portion 535 of the anti-shake substrate 53 is disposed on the second side 102, the third side 103, the first side 101, or the fourth side 104, so that the third anti-shake conductive portion 535 and the second focus conductive portion 433 are disposed on opposite sides. It can be understood that increasing the number of bends of the focus substrate 43 increases the length of the focus substrate 43, which helps reduce the reaction force generated by the focus substrate 43.

[0048] In some embodiments, the projection of the focus substrate 43 along the first direction and the projection of the anti-shake substrate 53 along the first direction do not overlap on the first side 101 and the fourth side 104; however, the projection of the focus substrate 43 along the first direction and the projection of the anti-shake substrate 53 along the first direction overlap on the second side 102 and the third side 103. In other words, by bending the focus substrate 43 a number of times and in what direction, the arrangement of the focus substrate 43 and the anti-shake substrate 53 within the camera module can be adjusted, simplifying the structure of the focus substrate 43 and the anti-shake substrate 53 within the camera module and improving the space utilization of the camera module.

[0049] In some embodiments, reference Figure 4 and Figure 5As can be seen, the anti-shake module 50 includes an anti-shake carrier 51, and the focus extension portion 432 further includes a first bent portion 4321, a first extension portion 4322, a second bent portion 4323, a second extension portion 4324, and a third bent portion 4325. The first bent portion 4321 integrally connects the first focus conductive portion 431 and the first extension portion 4322, the second bent portion 4323 integrally connects the first extension portion 4322 and the second extension portion 4324, and the third bent portion 4325 integrally connects the second extension portion 4324 and the second focus conductive portion 433, so that the first focus conductive portion 431 and the second focus conductive portion 433 are arranged on the first side 101 and the fourth side 104 of the anti-shake support 51, and the first extension portion 4322 and the second extension portion 4324 are arranged on the second side 102 and the third side 103 of the anti-shake support 51, wherein the first side 101 and the second side 102 are arranged relative to each other along the second direction or the third direction, and the third side 103 and the fourth side 104 are arranged relative to each other along the third direction or the second direction.

[0050] By arranging the bent focus substrate 43 on the outside of the anti-shake bearing 51, the focus drive assembly 42 and the circuit board 62 are electrically connected, while reducing the reaction force generated by the focus substrate 43, further enhancing the stability of the camera module.

[0051] In some embodiments, as Figure 6 As shown, the anti-shake substrate 53 includes a first anti-shake conductive portion 531, a second anti-shake conductive portion 532, and a third anti-shake conductive portion 535. The first anti-shake conductive portion 531 and the second anti-shake conductive portion 532 are fixed to the base 20 on different sides of the peripheral side. The planes of the first anti-shake conductive portion 531 and the second anti-shake conductive portion 532 are perpendicular to the first direction, while the plane of the third anti-shake conductive portion 535 is parallel to the first direction. The first anti-shake conductive portion 531 and the second anti-shake conductive portion 532 are interconnected. The third anti-shake conductive portion 535 extends from the first anti-shake conductive portion 531 or the second anti-shake conductive portion 532 toward the circuit board 62 to be fixed and electrically connected to the circuit board 62. The third anti-shake conductive portion 535 is located adjacent to the first focus conductive portion 431 on the peripheral side, and is located on the opposite side of the peripheral side from the second focus conductive portion 433. By arranging the third anti-shake conductive portion 535 on the opposite side of the first focusing conductive portion 431, the connection position between the anti-shake substrate 53 and the circuit board 62 is arranged on the opposite side of the connection position between the focusing substrate 43 and the circuit board 62. That is to say, the plane where the second focusing conductive portion 433 is located is parallel to the plane where the third anti-shake conductive portion 535 is located, and both are parallel to the first direction. This is beneficial to balancing the tension generated during welding, reducing the unilateral force phenomenon generated in the camera module, and enhancing the reliability and performance of the camera module.

[0052] In some embodiments, as Figures 5 and 6As shown, the third anti-shake conductive portion 535 has an anti-shake conductive pad 5351, and the second focus conductive portion 433 has a focus conductive pad 434. The plane where the anti-shake conductive pad 5351 is located is parallel to the plane where the focus conductive pad 434 is located. The top surface of the circuit board 62 has a first pad group 6211 located on the first side 101 and a second pad group 6221 located on the second side 102. The plane where the anti-shake conductive pad 5351 and the focus conductive pad 434 are located is perpendicular to the plane where the first pad group 6211 and the second pad group 6221 are located. The number of the anti-shake conductive pad 5351, the focus conductive pad 434, the first pad group 6211 and the second pad group 6221 is the same. It is understood that welding the anti-shake substrate 53, the focus substrate 43, and the circuit board 62 together to form perpendicular pad-to-pad connection paths helps to increase the connection stability of the components within the camera module and provides ample space for solder filling, avoiding the risk of cold joints or short circuits, thereby enhancing the stability and performance of the camera module. However, when the welding position between the third anti-shake conductive portion 535 and the circuit board 62 is located on the same side or adjacent to the welding position between the second focus conductive portion 433 and the circuit board 62, the tensile force generated by the welding on one side is greater, further increasing the risk of cracking of the adhesive 70 inside the camera module, thereby reducing the reliability of the camera module.

[0053] Therefore, the present application arranges the welding position between the third anti-shake conductive part 535 and the circuit board 62 on the opposite side of the welding position between the second focus conductive part 433 and the circuit board 62, thereby balancing and symmetrically balancing the tension generated by the solidification shrinkage of the solder, while reducing the risk of unilateral force on the camera module. In particular, when the module undergoes reliability tests such as temperature cycling, falling or mechanical shock, the risk of cracking of the circuit board 62, the base 20 and the adhesive 70 is further reduced, and the cracking phenomenon caused by the glue between each driving component and the photosensitive component 60 can also be reduced.

[0054] In some embodiments, as Figure 6 and Figure 11 As shown, the anti-shake substrate 53 further includes a connecting portion 533 and an anti-shake bent portion 534. The connecting portion 533 integrally connects the first anti-shake conductive portion 531 and the second anti-shake conductive portion 532. The anti-shake bent portion 534 extends from the outer side of the second anti-shake conductive portion 532 in a curved manner along the first direction, integrally connecting the second anti-shake conductive portion 532 and the third anti-shake conductive portion 535. The width of the anti-shake bent portion 534 along the second direction is h1, and the width of the third anti-shake conductive portion 535 along the second direction is h2, where h1 < 2h2 / 3 and h2 > h1. In other words, the anti-shake bent portion 534 enhances the operational stability of the joints between the various components of the anti-shake substrate 53 and helps reduce the reaction force generated in the anti-shake substrate 53.

[0055] It can be understood that since the first anti-shake conductive part 531 and the second anti-shake conductive part 532 are arranged on the top surface of the base 20, but the third anti-shake conductive part 535 needs to be arranged on the side of the base 20 and fixed to each other with glue on the side of the base 20, the third anti-shake conductive part 535 needs to be bent downward along the first direction from the plane where the first anti-shake conductive part 531 and the second anti-shake conductive part 532 are located, but the bent part, that is, the anti-shake bending part 534 has a large reaction force, which can easily cause the third anti-shake conductive part 535 to separate from the base 20, thereby affecting the subsequent welding of the third anti-shake conductive part 535 and the circuit board 62.

[0056] It's worth noting that to reduce the reaction force generated by the anti-shake bend 534, the length h1 of the anti-shake bend 534 along the second direction can be reduced. On the other hand, to ensure sufficient bonding area between the third anti-shake conductive portion 535 and the base 20 for fixation, and sufficient soldering area between the third anti-shake conductive portion 535 and the circuit board 62, the length h2 of the third anti-shake conductive portion 535 along the second direction can be increased. Furthermore, since h2 is greater than h1 in this application, reducing the width of the anti-shake bend 534 along the second direction can help reduce the reaction force generated by the anti-shake bend 534. However, the value of h1 should not be too small to meet the required width of the conductive trace 430 in the anti-shake substrate 53. In other words, by reducing the width of the anti-shake bend 534 along the second direction, the stiffness coefficient of the anti-shake bend 534 decreases, thereby reducing the reaction force. On the one hand, increasing the length of the third anti-shake conductive portion 535 along the second direction provides a larger bonding area for the anti-shake substrate 53, further improving bonding stability and performance, thereby preventing debonding between the third anti-shake conductive portion 535 and the base 20. On the other hand, this prevents any impact on the soldering between the third anti-shake conductive portion 535 and the circuit board 62, thereby facilitating subsequent soldering operations and further enhancing the reliability and stability of the camera module.

[0057] In some embodiments, the base 20 is further provided with a glue storage tank, which is arranged along the second direction relative to the base 20 and the focusing substrate 43 and the anti-shake substrate 53 at the joint, for accommodating glue, further increasing the bonding area, and improving the stability and reliability of the camera module.

[0058] In some embodiments, the width of the second focus conductive portion 433 along the direction perpendicular to the optical axis is smaller than the width of the third anti-shake conductive portion 535 along the direction perpendicular to the optical axis. It is understood that since the second focus conductive portion 433 extends along the first direction toward the base 20, the width of the second focus conductive portion 433 along the direction perpendicular to the optical axis only needs to be sufficient for fixing to the base 20 and soldering to the circuit board 62. As previously mentioned, the third anti-shake conductive portion 535 needs to bend downward along the first direction from the plane of the first and second anti-shake conductive portions 531 and 532. The width of the bent anti-shake portion 534 along the direction perpendicular to the optical axis needs to be smaller to reduce reaction force. Therefore, the width of the third anti-shake conductive portion 535 along the direction perpendicular to the optical axis needs to be increased to ensure sufficient area for bonding and fixing to the base 20 and soldering to the circuit board 62, thereby improving the reliability and stability of the camera module. That is to say, in the present application, by making the width of the second focusing conductive portion 433 in the direction perpendicular to the optical axis smaller than the width of the third anti-shake conductive portion 535 in the direction perpendicular to the optical axis, it can not only ensure that the second focusing conductive portion 433, the third anti-shake conductive portion 535 have sufficient connection strength with the base 20 and the circuit board 62, but also reduce the reaction force of the bending of the anti-shake substrate 53.

[0059] In some embodiments, as Figure 7 and Figure 10 As shown, the circuit board 62 includes a circuit board body 620, a connecting strip 623 and a connector 624. The connecting strip 623 and the connector 624 are located on the third side 103 of the circuit board 62, and integrally connect the circuit board body 620 and the connector 624 along the second direction; the circuit board body 620 is provided with a first conductive portion 621 on the first side 101, and the first conductive portion 621 is provided with a first solder pad group 6211 and is fixed and conductive with the focus conductive pad 434 by welding, so that the focus substrate 43 is electrically connected to the circuit board 62; the circuit board body 620 is provided with a second conductive portion 622 on the second side 102, and the second conductive portion 622 is fixed and conductive with the anti-shake conductive pad 5351 by welding, so that the anti-shake substrate 53 is electrically connected to the circuit board 62. It is understood that since the connecting strip 623, the connector 624, the first pad group 6211, and the second pad group 6221 are respectively connected to different sides of the circuit board body 620, it is beneficial to optimize the wiring within the camera module, reduce crosstalk and interference in the signal transmission path, and further improve the overall signal transmission quality of the camera module. On the other hand, it can also optimize the internal structure of the camera module to avoid spatial conflicts between the connecting strip 623, the anti-shake module 50, and the focus module 40, further improving the overall layout of the camera module and promoting the portability and performance of the camera module.

[0060] In some embodiments, reference Figure 6 It can be seen that the focusing module 40 includes a focusing carrier 41, and the focusing drive assembly 42 includes a focusing drive magnet 421 and a focusing drive coil 422 arranged relative to each other along a first direction perpendicular to the first direction. The focusing drive magnet 421 is arranged on one side of the focusing carrier 41, and the focusing drive coil 422 is arranged on one side of the anti-shake carrier 51, wherein the focusing drive coil 422 is arranged between the focusing drive magnet 421 and the first focusing conductive portion 431 along the second direction; the anti-shake drive assembly 52 includes at least one anti-shake drive magnet 521 and at least one anti-shake drive coil 522 arranged relative to each other along the first direction, the anti-shake drive magnet 521 and the focusing drive coil 422 are arranged on opposite sides of the anti-shake carrier 51, and the anti-shake drive coil 522 is arranged on the base 20, and the anti-shake substrate 53 is electrically connected to the circuit board 62, so as to drive the anti-shake carrier 51 to move along the second direction and / or the third direction. The focus drive assembly 42 and the anti-shake drive assembly 52 can respectively drive the focus support 41 and the anti-shake support 51, which further reduces the drive weight and energy consumption during focus driving, thereby achieving fast focusing and / or fast zooming. Moreover, this fast response is very important for capturing dynamic scenes, ensuring that the image remains clear during the zoom process.

[0061] In some embodiments, as Figure 4 As shown, the focus module 40 further includes a focus support portion 44, which is arranged on the fourth side 104 of the focus carrier 41 and is spaced apart at the corners of the focus carrier 41 along the third direction, so as to support the focus carrier 41 inside the anti-shake carrier 51, which is beneficial to improving the installation stability of various components inside the camera module.

[0062] In some embodiments, the focus support portion 44 is a support guide rod 441 to support the focus carrier 41 inside the anti-shake carrier 51. The focus carrier 41 includes guide grooves 4112 arranged on both sides of the first side wall 411. The guide grooves 4112 are used to accommodate the support guide rod 441, which is conducive to providing stable supporting force in the first direction.

[0063] In some embodiments, the focusing module 40 further includes a focusing position sensing element 45 for detecting the real-time position of the optical lens 30 during the focusing process to enhance the imaging quality of the camera module.

[0064] In some embodiments, reference Figures 3 to 6It can be seen that the anti-shake bearing component 51 includes a main body 511, and a first beam 512, a second beam 513, a third beam 514 and a fourth beam 515 arranged in sequence along the circumferential direction, wherein the first beam 512 and the third beam 514 are arranged opposite to each other along the second direction, and the second beam 513 and the fourth beam 515 are arranged opposite to each other along the third direction, wherein the focus substrate 43 is installed on the outer peripheral side of the main body 511, and the focus drive coil 422 is installed on the first beam 512; the anti-shake drive magnet 521 is installed on the second beam 513 and / or the third beam 514 to drive the anti-shake bearing component 51 to move along the second direction and / or the third direction; the main body 511 is provided with a first support groove, and the first support groove is located at On both sides of the first crossbeam 512, first support grooves are adapted for mounting the focus support portion 44. The focus carrier 41 includes a mounting cavity 415, a first sidewall 411, a second sidewall 412, a third sidewall 413, and a fourth sidewall 414, sequentially arranged along the circumferential direction. The first sidewall 411 and the third sidewall 413 are arranged opposite each other along the second direction, and the second sidewall 412 and the fourth sidewall 414 are arranged opposite each other along the third direction. The focus drive magnet 421 is mounted on a magnet mounting portion 4111 recessed in the first sidewall 411. The focus drive magnet 421, the focus drive coil 422, and the first focus conductive portion 431 are sequentially arranged along the second direction on the first side 101 of the focus carrier 41. By arranging the focus drive assembly 42 and the anti-shake drive assembly 52 below or on the sides of the crossbeams of the anti-shake carrier 51, the space occupied by the internal components of the camera module is reduced, increasing the compactness of the structure.

[0065] In some embodiments, as Figure 5 As shown, the bending angle of the bent portion in the focusing substrate 43 is 90°±5°, which is beneficial to reducing the degree of protrusion at the bent portion, reducing the risk of contact interference with the camera module housing 10, and can also improve the bending strength, facilitate control of the bending angle, and further enhance the imaging quality and performance of the camera module.

[0066] In some embodiments, as Figure 5In the dotted part shown, a conductive circuit 430 is provided in the focus substrate 43, and the number of the conductive circuits 430 is not greater than 4. Specifically, the number of the conductive circuits 430 is 1, or 2, or 3, or 4. It is worth mentioning that since the focus substrate 43 and the anti-shake substrate 53 are separately provided in the present application, the number of conductive circuits 430 provided in a single focus substrate 43 can be reduced to further reduce the width of the bent portion, thereby reducing the reaction force generated in the focus substrate 43 and improving the driving performance of the camera module. On the other hand, when the number of conductive circuits 430 is asymmetric with the number of pads, the risk of inter-layer crosstalk, signal delay differences and welding misalignment will increase. Therefore, by reducing the number of conductive circuits 430, the number of anti-shake conductive pads 5351 and focus conductive pads 434 can be reduced at the same time, thereby improving the overall signal integrity and assembly yield of the circuit board 62, while simplifying the wiring design of the conductive circuit 430, further reducing the space occupied by the camera module, and reducing production costs.

[0067] In some embodiments, the focus substrate 43 further includes a reinforcement member 435. At least a portion of the reinforcement member 435 is attached to the outside of the bent portion of the focus extension 432. Another portion of the reinforcement member 435 extends along the second direction and / or the third direction, such that the reinforcement member 435 is attached to the junction of the bent portion of the focus extension 432 and the straight portion of the focus extension 432. It will be appreciated that providing the reinforcement member 435 on the periphery of the bent portion helps increase the mechanical strength of the focus substrate 43 at the bent portion, control the bending angle, and reduce the risk of damage or fracture. The reinforcement member 435 can be a metal sheet to further increase bending strength.

[0068] In some embodiments, the width of the reinforcement member 435 along the first direction is no greater than the width of the bent portion of the focus extension 432 along the first direction. The width of the extension and the bent portion along the first direction is no less than 0.8 mm and no greater than 1 mm. It is worth noting that since the conductive trace 430 in the focus substrate 43 needs to be grounded, its width should not be too small to maintain good signal transmission quality and enhance the performance of the camera module.

[0069] In some embodiments, as Figure 6 、 Figure 8 and Figure 9As can be seen, the base 20 includes a base body 21 and a base protrusion 22. The base protrusion 22 extends from one side of the base body 21 toward the light incident side. The second focus conductive portion 433 is fixed to the base protrusion 22. The base body 21 further includes a main body top surface 211, a main body bottom surface 212, and a main body side surface 213. The main body top surface 211 supports the anti-shake carrier 51. The second focus conductive portion 433 and the third anti-shake conductive portion 535 are disposed on opposite sides of the main body side surface 213. The main body bottom surface 212 is bonded to the circuit board 62 via adhesive 70. The provision of the base protrusion 22 helps increase the contact area between the second focus conductive portion 433 and the base 20, providing stable support for the connection between the second focus conductive portion 433 and the circuit board 62, and further improving welding accuracy.

[0070] In some embodiments, the base 20 includes a first base sidewall 2131 located on the first side 101 and a second base sidewall 2132 located on the second side 102. The first base sidewall 2131 has a first groove 2133 that is recessed toward the optical axis, and the second base sidewall 2132 has a second groove 2134 that is recessed toward the optical axis. The circuit board 62 closes the openings at the bottom of the first groove 2133 and the second groove 2134. The focus conductive pad 434 and the first pad group 6211 are exposed in the first groove 2133, the anti-shake conductive pad 5351 and the second pad group 6221 are exposed in the second groove 2134, and the first groove 2133 and the second groove 2134 are closed. Solder is disposed in the first groove 2133 to secure and electrically connect the focus conductive pad 434 and the first pad group 6211, with the first pad group 6211 positioned in the first groove 2133. Furthermore, the anti-shake conductive pad 5351 and the second pad group 6221 are secured and electrically connected, with the second pad group 6221 positioned in the second groove 2134. Adhesive 70 is disposed between the top surface of the circuit board 62 and the bottom surface of the base 20. Solder is disposed in the first groove 2133 to electrically connect the first pad group 6211 to the focus conductive pad 434, and solder is disposed in the second groove 2134 to electrically connect the second pad group 6221 to the anti-shake conductive pad 5351. Providing the first groove 2133 and the second groove 2134 in the base 20 allows for the focus conductive pad 434 and the anti-shake conductive pad 5351 to be positioned, facilitating the soldering process.

[0071] In some embodiments, as Figure 6As shown, the anti-shake module 50 further includes an anti-shake support portion 54. The anti-shake support portion 54 is located at at least three corners of the anti-shake module 50 and is spaced between the top surface 211 of the main body and the bottom surface of the anti-shake support member 51. It can movably support the anti-shake module 50 above the base 20, further enhancing the anti-shake performance, reliability, and accuracy of the camera module. In at least one embodiment, the anti-shake support portion 54 is located at the corner formed by the first side 101 and the third side 103 of the anti-shake module 50, the corner formed by the second side 102 and the third side 103, and the corner formed by the second side 102 and the fourth side 104.

[0072] In some embodiments, the main body 511 of the anti-shake supporting component 51 is provided with a support groove on the side close to the base 20 for accommodating the anti-shake support part 54, wherein the anti-shake support part 54 is a support ball 541 structure. It can be understood that since the friction of the support ball 541 structure is small, less energy is consumed when driving the anti-shake supporting component 51, thereby reducing the power consumption of the entire camera module and extending the usage time.

[0073] In some embodiments, the anti-shake module 50 further includes an anti-shake position sensing element 55 for detecting positional deviation of the optical lens 30 caused by device vibration, etc., to enhance the imaging quality of the camera module.

[0074] In some embodiments, as Figure 1 As shown, the camera module further includes a filter element 63, a filter element holder 64, and electronic components. The filter element holder 64 is disposed on the circuit board 62 to support the filter element 63, so that the filter element 63 is arranged opposite to the photosensitive chip 61 along a first direction. The electronic components are electrically connected to the chip circuit board 62. It is worth noting that supporting the filter element 63 by the filter element holder 64 can prevent displacement or shaking during use, which helps maintain the stability of the optical path and further enhance the imaging quality and performance of the camera module.

[0075] The above describes the basic principles, main features, and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above-described embodiments. The above-described embodiments and the specification merely illustrate the principles of the present application. Various changes and improvements may be made to the present application without departing from the spirit and scope of the present application. These changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the appended claims and their equivalents.

Claims

1. A camera module, characterized in that: include: An optical lens defines an optical axis; A photosensitive component, comprising a photosensitive chip and a circuit board, wherein the photosensitive chip is arranged and electrically connected to the circuit board, and the photosensitive chip is located on the optical path of the optical lens; A base, the circuit board is fixed below the base; An adhesive is provided between the circuit board and the base; a focus drive assembly and an anti-shake drive assembly, wherein the focus drive assembly is configured to drive the optical lens to move in a direction parallel to the optical axis, and the anti-shake drive assembly is configured to drive the optical lens to move in a direction perpendicular to the optical axis; a focus substrate and an anti-shake substrate, wherein one end of the focus substrate is fixed to and electrically connected to the focus drive assembly, and the other end of the focus substrate is fixed to the base on a first side and welded to the circuit board; One end of the anti-shake substrate is fixed and electrically connected to the anti-shake drive assembly, and the other end of the anti-shake substrate is fixed to the base on the second side and welded to the circuit board, so that the base and the circuit board are subjected to symmetrical tensile forces on the first side and the second side respectively; the camera module includes a first side, a second side, a third side and a fourth side located on the peripheral side, and the first side and the second side are opposite sides.

2. The camera module according to claim 1, wherein: The focusing substrate includes a second focusing conductive portion fixed to the base and welded to the circuit board, and the anti-shake substrate includes a third anti-shake conductive portion fixed to the base and welded to the circuit board. The plane where the second focusing conductive portion is located is parallel to the plane where the third anti-shake conductive portion is located, and both are parallel to the direction of the optical axis; wherein the width of the second focusing conductive portion along the direction perpendicular to the optical axis is smaller than the width of the third anti-shake conductive portion along the direction perpendicular to the optical axis.

3. The camera module according to claim 2, wherein: The anti-shake substrate also includes a first anti-shake conductive portion and a second anti-shake conductive portion electrically connected to the anti-shake driving component, and an anti-shake bent portion having one end connected to the first anti-shake conductive portion or the second anti-shake conductive portion and the other end connected to the third anti-shake conductive portion, and the plane where the first anti-shake conductive portion and the second anti-shake conductive portion are located is perpendicular to the plane where the third anti-shake conductive portion is located; wherein the width of the anti-shake bent portion along the direction perpendicular to the optical axis is h1, and the width of the third anti-shake conductive portion along the direction perpendicular to the optical axis is h2, and h1<h2.

4. The camera module according to claim 2, wherein: The third anti-shake conductive portion has an anti-shake conductive pad, and the second focus conductive portion has a focus conductive pad. The plane where the anti-shake conductive pad is located is parallel to the plane where the focus conductive pad is located; the top surface of the circuit board has a first pad group located on the first side and a second pad group located on the second side, and the plane where the anti-shake conductive pad and the focus conductive pad are located is perpendicular to the plane where the first pad group and the second pad group are located; wherein the number of the anti-shake conductive pads, the focus conductive pads, the first pad group and the second pad group is the same.

5. The camera module according to claim 4, wherein: The base includes a first base sidewall located on the first side and a second base sidewall located on the second side, the first base sidewall having a first groove recessed toward the optical axis, the second base sidewall having a second groove recessed toward the optical axis, and the circuit board enclosing openings at the bottoms of the first groove and the second groove; The focus conductive pad and the first pad group are exposed in the first groove, the anti-shake conductive pad and the second pad group are exposed in the second groove, and solder is set in the first groove and the second groove to fix and electrically connect the focus conductive pad and the first pad group, and to fix and electrically connect the anti-shake conductive pad and the second pad group.

6. The camera module according to claim 4, wherein: The circuit board includes a circuit board body, a connecting strip and a connector, the connecting strip connects the connector and the circuit board body, and the connecting strip and the connector are located on the third side; the first solder pad group and the second solder pad group are arranged on the circuit board body, and the first solder pad group, the second solder pad group, the connecting strip and the connector are respectively located on different sides of the circuit board body.

7. The camera module according to claim 5, wherein: The camera module includes an anti-shake module, which includes an anti-shake carrier, an anti-shake drive assembly and an anti-shake substrate. The focus substrate is parallel to the optical axis. The focus substrate includes a first focus conductive portion located at one end, a second focus conductive portion located at the other end and a focus extension portion located between the first focus conductive portion and the second focus conductive portion; wherein, the first focus conductive portion and the second focus conductive portion are respectively located on different sides of the peripheral side, the first focus conductive portion is fixed to the anti-shake carrier, the second focus conductive portion is fixed to the base and extends toward the circuit board to be fixed and electrically connected to the circuit board, the focus extension portion is located on the outer periphery of the anti-shake carrier and has a gap between the anti-shake carrier, and the focus extension portion is bent at least twice on the outer periphery of the anti-shake carrier.

8. The camera module according to claim 7, wherein: The anti-shake substrate includes a first anti-shake conductive portion, a second anti-shake conductive portion and the third anti-shake conductive portion, wherein the first anti-shake conductive portion and the second anti-shake conductive portion are fixed to the base on different sides of the peripheral side, the first anti-shake conductive portion and the second anti-shake conductive portion are connected to each other, and the third anti-shake conductive portion extends from the first anti-shake conductive portion or the second anti-shake conductive portion toward the circuit board to be fixed and electrically connected to the circuit board; wherein the third anti-shake conductive portion and the first focus conductive portion are located on adjacent sides of the peripheral side, and the third anti-shake conductive portion and the second focus conductive portion are located on opposite sides of the peripheral side.

9. The camera module according to claim 7, wherein: The focus extension portion further includes a first bending portion, a first extension portion, a second bending portion, a second extension portion and a third bending portion, the first bending portion integrally connects the first focus conductive portion and the first extension portion, the second bending portion integrally connects the first extension portion and the second extension portion, and the third bending portion integrally connects the second extension portion and the second focus conductive portion, so that the first focus conductive portion and the second focus conductive portion are arranged on the first side and the fourth side of the anti-shake support component, the first extension portion and the second extension portion are arranged on the second side and the third side of the anti-shake support component, wherein the first side and the second side are arranged relative to each other along the second direction or the third direction, the third side and the fourth side are arranged relative to each other along the third direction or the second direction, and the first direction is parallel to the optical axis, and the second direction and the third direction are orthogonal to the first direction.

10. The camera module according to claim 7, wherein: The camera module also includes a focusing module, which includes the focusing drive assembly, the focusing substrate and the focusing carrier, the focusing drive assembly includes a focusing drive magnet and a focusing drive coil arranged relative to each other along a first direction perpendicular to the first direction, the focusing drive magnet is arranged on one side of the focusing carrier, and the focusing drive coil is arranged on one side of the anti-shake carrier, wherein the focusing drive coil is arranged between the focusing drive magnet and the first focusing conductive portion along the second direction; the anti-shake drive assembly includes at least one anti-shake drive magnet and at least one anti-shake drive coil arranged relative to each other along the first direction, the anti-shake drive magnet and the focusing drive coil are arranged on opposite sides of the anti-shake carrier, the anti-shake drive coil is arranged on the base, and the anti-shake substrate is electrically connected to the circuit board to drive the anti-shake carrier to move along the second direction and / or the third direction.

11. The camera module according to claim 7, wherein: The focusing substrate further includes a reinforcement member, at least a portion of the reinforcement member is attached to the outer periphery of the bent portion of the focusing extension portion, and another portion of the reinforcement member extends along the second direction and / or the third direction, such that the reinforcement member is attached to the connection between the bent portion of the focusing extension portion and the extending portion of the focusing extension portion; Conductive circuits are provided in the focusing substrate, and the number of the conductive circuits is no more than 4. The width of the reinforcing member along the first direction is no more than the width of the bent portion of the focusing extension portion along the first direction.

12. The camera module according to claim 1, wherein: The projection of the focusing substrate along the first direction does not overlap with the projection of the anti-shake substrate along the first direction on the first side and the fourth side; the projection of the focusing substrate along the first direction overlaps with the projection of the anti-shake substrate along the first direction on the second side and the third side.

13. The camera module according to claim 7, wherein: The base includes a base body and a base protrusion, the base protrusion extends from one side of the base body toward the second focus conductive portion, the base protrusion supports the second focus conductive portion along a first direction, the base body is further provided with a main body top surface, a main body bottom surface and a main body side surface, the main body top surface supports the anti-shake carrier, the second focus conductive portion and the third anti-shake conductive portion are arranged on opposite sides of the main body side surface, and the main body bottom surface is bonded to the circuit board by an adhesive.

14. The camera module according to claim 10, wherein: The focus module further includes a focus support portion, the anti-shake bearing component includes a main body, and a first beam, a second beam, a third beam, and a fourth beam sequentially arranged along a circumferential direction, wherein the first beam and the third beam are arranged opposite to each other along a second direction, and the second beam and the fourth beam are arranged opposite to each other along a third direction, wherein the focus substrate is annularly mounted on the outer circumference of the main body, the focus drive coil is mounted on the first beam; the anti-shake drive magnet is mounted on the second beam and / or the third beam; the main body is provided with a first support groove, the first support groove is located on both sides of the first beam, and the first support groove is adapted to the installation of the focus support portion; and The focusing carrier includes a mounting cavity, a first side wall, a second side wall, a third side wall and a fourth side wall arranged in sequence along the circumferential direction, wherein the first side wall and the third side wall are arranged opposite to each other along the second direction, and the second side wall and the fourth side wall are arranged opposite to each other along the third direction, and the focusing drive magnet is arranged on the first side wall, so that the focusing drive magnet, the focusing drive coil and the first focusing conductive part are arranged in sequence on the first side of the focusing carrier along the second direction.

15. The camera module according to claim 13, wherein: The base is further provided with a glue storage tank, which is arranged along the second direction at the joints between the base, the focusing substrate and the anti-shake substrate, and is used to accommodate glue.

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