Thin forced air cooling piezoelectric pump for chip heat dissipation

Abstract

According to the thin forced air cooling piezoelectric pump for chip heat dissipation, the air inlet channel and the air outlet channel are separated from each other, the heat dissipation effect is good, meanwhile, noise is smaller, the size is small, and the thin forced air cooling piezoelectric pump can be flexibly integrated into various chip heat dissipation scenes with limited space. The piezoelectric pump structurally comprises a shell assembly and a piezoelectric ceramic assembly, a piezoelectric pump working cavity is formed in the shell assembly, the pressure in the piezoelectric pump working cavity can be changed through deformation of the piezoelectric ceramic assembly, and the piezoelectric pump working cavity communicates with an air inlet and an air outlet through an air inlet flow channel and an air outlet flow channel correspondingly; the air inlet and the air outlet are not located in the same end of the shell assembly, an air inlet piece assembly is installed at the joint of the air inlet flow channel and the piezoelectric pump working cavity, and an air outlet piece assembly is installed at the joint of the air outlet flow channel and the piezoelectric pump working cavity.

Description

Technical Field

[0001] The present invention relates to the technical field of air-cooling heat dissipation devices, and in particular to a thin forced air-cooling piezoelectric pump for chip heat dissipation. Background Art

[0002] With the development of chip manufacturing technology, the integration density and power consumption of chips have continued to increase, and the heat generated during operation has also increased significantly. Efficient heat dissipation solutions have become the key to ensuring stable operation and extending the service life of equipment.

[0003] Traditional electronic equipment cooling methods include natural convection, forced air cooling, and liquid cooling. While these methods can meet cooling requirements to a certain extent, they each have limitations. For example, while forced air cooling increases air flow through fans and other devices, it is bulky, noisy, and inefficient, making it difficult to flexibly apply to high-density electronic equipment.

[0004] To overcome the shortcomings of traditional electronic device heat dissipation methods, air-cooled piezoelectric pumps are now used for electronic device heat dissipation. For example, the piezoelectric ceramic air pump and piezoelectric ceramic heat dissipation device disclosed in publication number CN219472306U energizes the piezoelectric ceramic to cause the vibrating plate connected to the piezoelectric ceramic to bend up and down, thereby increasing or decreasing the volume of the piezoelectric pump's working chamber, thereby driving gas into or out of the working chamber. However, the inlet and outlet flow paths of existing piezoelectric pumps are mixed, causing some of the outlet air to flow back into the inlet flow path, resulting in insufficient outlet air volume and ineffective heat dissipation. Summary of the Invention

[0005] In view of the above problems, the present invention provides a thin forced air-cooled piezoelectric pump for chip heat dissipation, wherein the inlet and outlet air flow channels are separated from each other, and the heat dissipation effect is good.

[0006] The technical solution is as follows: a thin forced air-cooled piezoelectric pump for chip heat dissipation, which includes a shell assembly and a piezoelectric ceramic assembly, a piezoelectric pump working chamber being provided in the shell assembly, the deformation of the piezoelectric ceramic assembly being able to change the pressure in the piezoelectric pump working chamber, the piezoelectric pump working chamber being connected to the air inlet and the air outlet through an inlet flow channel and an outlet flow channel respectively, the air inlet and the air outlet being not located at the same end of the shell assembly, and being characterized in that an air inlet plate assembly is installed at the connection between the inlet flow channel and the piezoelectric pump working chamber, the air inlet plate assembly being used to allow air to enter the piezoelectric pump working chamber from the inlet flow channel and to prevent air from entering the piezoelectric pump working chamber from the piezoelectric pump working chamber, and an air outlet plate assembly being installed at the connection between the outlet flow channel and the piezoelectric pump working chamber, the air outlet plate assembly being used to allow air to enter the outlet flow channel from the piezoelectric pump working chamber and to prevent air from entering the piezoelectric pump working chamber from the outlet flow channel.

[0007] Furthermore, the piezoelectric ceramic assembly includes a piezoelectric ceramic, a flexible electrode plate, an insulating pad, and a metal substrate. One electrode surface of the piezoelectric ceramic is connected to the flexible electrode plate, and the other electrode surface is connected to the metal substrate. The insulating pad is arranged between the flexible electrode plate and the metal substrate.

[0008] Furthermore, the air intake plate assembly includes an air intake plate and an air intake channel main body plate, a cavity is provided in the middle of the air intake channel main body plate for forming the air intake channel, an air intake hole is provided on the side of the air intake channel main body plate facing the piezoelectric pump working chamber, and the air intake hole is used to connect the piezoelectric pump working chamber and the air intake channel, the air intake plate is located on the side of the air intake channel main body plate provided with the air intake hole, and a blocking spring piece 1 is provided corresponding to the position of each air intake hole, when the pressure in the working chamber of the piezoelectric pump is greater than the pressure of the air intake channel, the blocking spring piece 1 approaches the air intake channel main body plate and blocks the air intake hole, when the pressure in the working chamber of the piezoelectric pump is less than the pressure of the air intake channel, the blocking spring piece 1 moves away from the air intake channel main body plate, and the intake air enters the working chamber of the piezoelectric pump through the gap on the air intake plate.

[0009] Furthermore, the air outlet plate assembly includes an air outlet duct plate, an air outlet plate and a heat absorption plate, the heat absorption plate is evenly provided with heat conduction grooves for forming the air outlet duct, the air outlet duct plate is provided with air outlet holes, the air outlet holes are used to connect the piezoelectric pump working chamber and the air outlet duct, the air outlet plate is provided on one side of the air outlet duct plate, and a blocking spring two is provided corresponding to the position of each air outlet hole, when the pressure in the working chamber of the piezoelectric pump is lower than the pressure of the air outlet duct, the blocking spring two approaches the air outlet duct plate and blocks the air outlet hole, when the pressure in the working chamber of the piezoelectric pump is higher than the pressure of the air outlet duct, the blocking spring two moves away from the air outlet duct plate, and the outlet air enters the air outlet duct through the gap on the air outlet plate.

[0010] Furthermore, the heat absorbing plate is used to be connected to a position requiring heat dissipation, the heat absorbing plate is made of a heat conductive material, and the outlet air channel extends to the end face of the air-cooled piezoelectric pump to form the air outlet.

[0011] Furthermore, the sum of the cross-sectional areas of the air inlets is greater than the sum of the cross-sectional areas of the air outlets.

[0012] Furthermore, the air inlet plate assembly and the air outlet plate assembly are both located below the piezoelectric ceramic assembly, the air outlet plate assembly is located below the air inlet plate assembly, and the air inlet plate assembly is provided with a connecting channel, which is used to connect the air outlet plate assembly and the piezoelectric pump working chamber.

[0013] Furthermore, the shell assembly includes an air intake shell and an air guide plate. The air intake shell is provided with an air intake port at the top. There is a certain gap between the air intake shell and the air guide plate to form an air guide cavity. The air intake port is connected to the air guide cavity. An air guide groove is provided on the side of the air intake shell. One end of the air guide groove is connected to the air guide cavity, and the other end passes over the piezoelectric ceramic assembly and is connected to the intake flow channel.

[0014] Furthermore, the piezoelectric pump working chamber is located below the piezoelectric ceramic component, and a back pressure cavity is provided above the piezoelectric ceramic component. The back pressure cavity is connected to the air inlet groove through a pressure relief port.

[0015] Furthermore, sealing members are provided between the housing assembly and the piezoelectric ceramic assembly, between the piezoelectric ceramic assembly and the air inlet plate assembly, and between the air inlet plate assembly and the air outlet plate assembly.

[0016] Beneficial effects: By setting up an air inlet plate assembly and an air outlet plate assembly, the air flow can flow from the inlet flow channel into the working chamber of the piezoelectric pump and then into the outlet flow channel, and reverse flow of the air flow is avoided, air flow turbulence is avoided, and sufficient air output is ensured; at the same time, other beneficial effects of this solution also include: there are multiple outlet flow channels and they are evenly distributed on the heat absorbing plate, and the air flow is used to take away the heat of the heat absorbing plate to cool it down, thereby achieving an efficient heat dissipation effect; the air-cooled piezoelectric pump has multiple air inlets and air outlets, and the sum of the cross-sectional areas of all the air inlets is greater than the sum of the cross-sectional areas of all the air outlets, forming a one-way gas flow channel with a gradually decreasing cross-sectional area, and can increase the gas pressure, thereby achieving a better heat dissipation effect. At the same time, the piezoelectric pump has lower noise and is compact in size, and can be flexibly integrated into various space-constrained chip heat dissipation scenarios, such as ultra-thin laptops, IPADs, wearable devices, aerospace equipment, etc., providing these devices with efficient and reliable heat dissipation solutions. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the present invention;

[0018] Figure 2 for Figure 1 Explosion diagram of

[0019] Figure 3 It is a schematic diagram of the back structure of the air intake housing;

[0020] Figure 4 Schematic diagram of the structure of a piezoelectric ceramic component;

[0021] Figure 5 Schematic diagram of the air intake plate assembly structure;

[0022] Figure 6 Schematic diagram of the back structure of the intake air duct plate;

[0023] Figure 7 It is an enlarged structural diagram of the blocking shrapnel 1;

[0024] Figure 8 Schematic diagram of the structure of the air outlet plate assembly;

[0025] Figure 9 It is a schematic diagram of the enlarged structure of the second blocking shrapnel.

[0026] In the figure, 1-air inlet shell; 100-air inlet; 101-air guide groove; 2-air guide plate; 3-first sealing gasket; 301-pressure relief port; 4-flexible electrode plate; 5-piezoelectric ceramic; 6-insulating pad; 7-metal substrate; 8-second sealing gasket; 9-air inlet plate; 901-sealing spring piece 1; 902-connecting channel; 10-inlet flow channel plate; 1000-inlet flow channel; 1001-air inlet hole; 11-inlet flow channel cover; 12-third sealing gasket; 13-outlet flow channel plate; 1300-outlet hole; 14-outlet plate; 1400-sealing spring piece 2; 15-heat absorbing plate; 1500-outlet; 1501-heat conduction groove; 16-dust plug. DETAILED DESCRIPTION

[0027] like Figure 1 、 Figure 2 A thin forced air cooling piezoelectric pump for chip heat dissipation is shown, which includes a housing component, Figure 4 The piezoelectric ceramic assembly shown in the figure forms a piezoelectric pump working chamber in the shell assembly through the piezoelectric ceramic assembly. The deformation of the piezoelectric ceramic assembly can change the pressure in the piezoelectric pump working chamber. The piezoelectric pump working chamber is connected to the air inlet 100 and the air outlet 1500 through the inlet flow channel and the outlet flow channel respectively. The air inlet 100 and the air outlet 1500 are not located at the same end of the shell assembly. Preferably, they are located at the upper and lower parts of the air inlet shell 1 respectively, so as to ensure a large temperature difference between the inlet and outlet temperatures. The connection between the inlet flow channel 1000 and the piezoelectric pump working chamber is installed as shown in the figure. Figure 5 The air intake plate assembly shown is used to allow air flow to enter the piezoelectric pump working chamber from the air intake channel 1000 and prevent air flow from entering the piezoelectric pump working chamber from the piezoelectric pump working chamber. Figure 8 The air outlet plate assembly shown is used to allow the air flow to enter the outlet flow channel from the working chamber of the piezoelectric pump, and to prevent the air flow from entering the working chamber of the piezoelectric pump from the outlet flow channel. This can avoid reverse flow of the air flow, avoid air flow turbulence, and ensure sufficient air outlet volume.

[0028] Specifically, such as Figure 4As shown, the piezoelectric ceramic assembly includes a piezoelectric ceramic 5, a flexible electrode plate 4, an insulating pad 6, and a metal substrate 7. One electrode surface of the multiple piezoelectric ceramics 5 is welded or bonded to the flexible electrode plate 4, and the other electrode surface is attached to the metal substrate 7 with a conductive adhesive. The flexible electrode plate 4 and the metal substrate 7 extend through the housing assembly to the outside and are connected to the power supply. A dust plug 16 is provided on the housing assembly to prevent dust from entering the piezoelectric pump from the electrode extension area. The insulating pad 6 is provided between the flexible electrode plate 4 and the metal substrate 7 and attached along the edge of the flexible electrode plate 4. By applying an alternating electric signal to the upper and lower electrode surfaces of the piezoelectric ceramic 5, the piezoelectric ceramic 5 will vibrate, thereby driving the metal substrate 7 to vibrate, so that the volume of the working chamber of the piezoelectric pump changes back and forth: when the volume of the chamber increases and generates a sufficiently large negative pressure, air will enter the chamber from the air inlet 100 through the inlet flow channel 1000, which is a pumping state; when the volume of the chamber decreases and generates a sufficiently large positive pressure, air will flow out from the outlet flow channel, which is a pumping state.

[0029] like Figure 5 、 Figure 6 、 Figure 7 As shown, the air intake plate assembly includes an air intake plate 9 and an air intake channel main body plate. The air intake channel main body plate is formed by interconnecting the air intake channel plate 10 and the air intake channel cover plate 11. A cavity is provided in the middle of the air intake channel main body plate for forming an air intake channel 1000. An air intake hole 1001 is provided on the side of the air intake channel main body plate facing the working chamber of the piezoelectric pump. The air intake hole 1001 is used to connect the working chamber of the piezoelectric pump and the air intake channel 1000. The air intake plate 9 is located on the side of the air intake channel main body plate provided with the air intake hole 1001, and corresponds to each air intake. The position of the hole 1001 is respectively provided with a blocking spring 901, which has elastic force and can be pressed away from the air intake plate 9. When the pressure in the working chamber of the piezoelectric pump is greater than the pressure of the intake air duct 1000, the blocking spring 901 is pressed close to the main plate of the intake air duct and blocks the air intake hole 1001. When the pressure in the working chamber of the piezoelectric pump is less than the pressure of the intake air duct 1000, the blocking spring 901 is pressed away from the main plate of the intake air duct, and the intake air enters the working chamber of the piezoelectric pump through the gap on the intake air duct 9.

[0030] like Figure 8 、 Figure 9As shown, the air outlet plate assembly includes an air outlet duct plate 13, an air outlet plate 14 and a heat absorbing plate 15. Since the piezoelectric pump is small in size and is suitable for the heat dissipation of the chip, the heat absorbing plate 15 is used to connect to the position where the chip needs to dissipate heat. Of course, it can also be used for positions where other components or equipment need to dissipate heat. The heat absorbing plate 15 is made of a heat-conducting material such as copper. The air outlet duct extends to the end face of the air-cooled piezoelectric pump and forms an air outlet 1500. The heat absorbing plate 15 is evenly provided with heat-conducting grooves 1501 for forming the air outlet duct. The air outlet duct plate 13 is provided with an air outlet hole 1300. The air outlet hole 1300 is used to connect the working chamber of the piezoelectric pump and the outlet The air flow duct, the air outlet piece 14 is arranged on one side of the air outlet duct plate 13, and a blocking spring piece 1400 is provided corresponding to the position of each air outlet hole 1300. The blocking spring piece 1400 has elastic force and can be pressed away from the air outlet piece 14. When the pressure in the working chamber of the piezoelectric pump is lower than the pressure of the air outlet duct, the blocking spring piece 1400 is pressed close to the air outlet duct plate 13 and blocks the air outlet hole 1300. When the pressure in the working chamber of the piezoelectric pump is higher than the pressure of the air outlet duct, the blocking spring piece 1400 is away from the air outlet duct plate 13, and the outlet air enters the heat conduction groove 1501 through the gap on the air outlet piece 14.

[0031] Since the air inlet 100 and the air outlet 1500 are not located at the same end of the housing assembly in this solution, they are preferably located at the upper and lower parts of the air inlet housing 1 respectively. In order to adapt to this structure and make the components of the device compact and save space, the air inlet plate assembly and the air outlet plate assembly are both located below the piezoelectric ceramic assembly, and the air outlet plate assembly is located below the air inlet plate assembly. The air inlet plate assembly is provided with a connecting channel 902 (combined with Figure 5 、 Figure 6 ), the connecting channel 902 is used to connect the air outlet plate assembly and the piezoelectric pump working chamber.

[0032] At the same time, based on the above, combined with Figure 2 、 Figure 3 The shell assembly specifically includes an air intake shell 1 and an air guide plate 2. The air intake shell is provided with an air intake port 100 at the top. The air intake shell 1 and the air guide plate 2 are separated so as to have a certain gap and form a horizontally arranged air guide cavity. The air intake port 100 is connected with the air guide cavity. A vertical air guide groove 101 is provided on the side of the air intake shell 1. One end of the air guide groove 101 is connected with the air guide cavity, and the other end passes over the piezoelectric ceramic assembly and is connected with the intake flow channel 1000.

[0033] Since the air inlet groove 101 is provided, the gas on the back of the piezoelectric ceramic component can be discharged. Specifically, the piezoelectric pump working chamber is located below the piezoelectric ceramic component, and a back pressure cavity is provided above the piezoelectric ceramic component. The back pressure cavity is connected to the air inlet groove 101 through the pressure relief port 301. Figure 4) to reduce the pressure of the back pressure cavity, so that the metal substrate 7 can vibrate with a larger amplitude, thereby improving the gas flow capacity and enhancing the working capacity of the piezoelectric pump.

[0034] In addition, in order to ensure that the components do not directly contact each other and to ensure their sealing, seals are provided between the shell component and the piezoelectric ceramic component, between the piezoelectric ceramic component and the air inlet component, and between the air inlet component and the air outlet component. Figure 4 In the embodiment, the first sealing gasket 3 between the air guide plate 2 and the flexible electrode plate 4, Figure 5 In the embodiment, the second sealing gasket 8 between the metal substrate 7 and the air intake sheet 9 is Figure 8 In the embodiment, the third sealing gasket 12 is provided between the inlet flow channel cover plate 11 and the outlet flow channel plate 13, and the piezoelectric pump plates can be connected to each other by bonding or other methods.

[0035] By adopting the above structure, in the chip heat dissipation system, the air-cooled piezoelectric pump pressurizes the cold air and blows it toward the heat absorption plate 15 from multiple air outlets 1300, thereby removing the heat generated by the chip and achieving an efficient cooling effect. Compared with the traditional fan cooling system, the air-cooled piezoelectric pump has multiple air inlets 100 and air outlets 1500. The sum of the cross-sectional areas of all the air inlets 100 is greater than the sum of the cross-sectional areas of all the air outlets 1500, forming a one-way gas flow channel with a gradually decreasing cross-sectional area, and can increase the gas pressure, thereby achieving a better heat dissipation effect. At the same time, the piezoelectric pump is quieter and compact, and can be flexibly integrated into various space-constrained chip heat dissipation scenarios, such as ultra-thin laptops, IPADs, wearable devices, aerospace equipment, etc., providing these devices with efficient and reliable heat dissipation solutions. Compared with traditional cooling fans, the heat dissipation efficiency is greatly improved. Compared with traditional liquid cooling methods, the micro piezoelectric pump has a simpler structure, a smaller size, and lower maintenance costs.

[0036] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by anyone familiar with the art within the technical scope disclosed by the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A thin, forced-air-cooled piezoelectric pump for chip heat dissipation, comprising a housing assembly and a piezoelectric ceramic assembly. A piezoelectric pump working chamber is defined within the housing assembly. Deformation of the piezoelectric ceramic assembly can cause pressure changes within the piezoelectric pump working chamber. The piezoelectric pump working chamber is connected to an air inlet and an air outlet via an inlet flow channel and an outlet flow channel, respectively. The air inlet and the air outlet are located at different ends of the housing assembly. The invention is characterized in that: An air inlet plate assembly is installed at the connection between the inlet air duct and the piezoelectric pump working chamber. The air inlet plate assembly is used to allow the air flow from the inlet air duct to enter the piezoelectric pump working chamber and prevent the air flow from the piezoelectric pump working chamber to enter the inlet air duct. An air outlet plate assembly is installed at the connection between the outlet air duct and the piezoelectric pump working chamber. The air outlet plate assembly is used to allow the air flow from the piezoelectric pump working chamber to enter the outlet air duct and prevent the air flow from the outlet air duct to enter the piezoelectric pump working chamber.

2. A thin forced air-cooled piezoelectric pump for chip heat dissipation according to claim 1, characterized in that: The piezoelectric ceramic assembly includes a piezoelectric ceramic, a flexible electrode plate, an insulating pad, and a metal substrate. One electrode surface of the piezoelectric ceramic is connected to the flexible electrode plate, and the other electrode surface is connected to the metal substrate. The insulating pad is arranged between the flexible electrode plate and the metal substrate.

3. A thin forced air-cooled piezoelectric pump for chip heat dissipation according to claim 1 or 2, characterized in that: The air intake plate assembly includes an air intake plate and an air intake channel main body plate. A cavity is provided in the middle of the air intake channel main body plate for forming the air intake channel. An air intake hole is provided on the side of the air intake channel main body plate facing the piezoelectric pump working chamber, and the air intake hole is used to connect the piezoelectric pump working chamber and the air intake channel. The air intake plate is located on the side of the air intake channel main body plate provided with the air intake hole, and a blocking spring piece 1 is provided corresponding to the position of each air intake hole. When the pressure in the working chamber of the piezoelectric pump is greater than the pressure of the air intake channel, the blocking spring piece 1 approaches the air intake channel main body plate and blocks the air intake hole. When the pressure in the working chamber of the piezoelectric pump is less than the pressure of the air intake channel, the blocking spring piece 1 moves away from the air intake channel main body plate, and the intake air enters the working chamber of the piezoelectric pump through the gap on the air intake plate.

4. A thin forced air-cooled piezoelectric pump for chip heat dissipation according to claim 3, characterized in that: The air outlet plate assembly includes an air outlet duct plate, an air outlet plate and a heat absorption plate, the heat absorption plate is evenly provided with heat conduction grooves for forming the air outlet duct, the air outlet duct plate is provided with air outlet holes, the air outlet holes are used to connect the piezoelectric pump working chamber and the air outlet duct, the air outlet plate is provided on one side of the air outlet duct plate, and a second blocking spring is provided at the position corresponding to each air outlet hole. When the pressure in the working chamber of the piezoelectric pump is lower than the pressure in the air outlet duct, the second blocking spring approaches the air outlet duct plate and blocks the air outlet hole. When the pressure in the working chamber of the piezoelectric pump is higher than the pressure in the air outlet duct, the second blocking spring moves away from the air outlet duct plate, and the outlet air enters the air outlet duct through the gap on the air outlet plate.

5. A thin forced air-cooled piezoelectric pump for chip heat dissipation according to claim 4, characterized in that: The heat absorbing plate is used to be connected to a position where heat dissipation is required. The heat absorbing plate is made of a heat-conducting material. The outlet air channel extends to the end face of the air-cooled piezoelectric pump and forms the air outlet.

6. A thin forced air-cooled piezoelectric pump for chip heat dissipation according to claim 1 or 5, characterized in that: The sum of the cross-sectional areas of the air inlets is greater than the sum of the cross-sectional areas of the air outlets.

7. A thin forced air-cooled piezoelectric pump for chip heat dissipation according to claim 4, characterized in that: The air inlet plate assembly and the air outlet plate assembly are both located below the piezoelectric ceramic assembly. The air outlet plate assembly is located below the air inlet plate assembly. The air inlet plate assembly is provided with a connecting channel, which is used to connect the air outlet plate assembly and the piezoelectric pump working chamber.

8. A thin forced air-cooled piezoelectric pump for chip heat dissipation according to claim 7, characterized in that: The shell assembly includes an air intake shell and an air guide plate. The air intake shell is provided with an air intake port at the top. There is a certain gap between the air intake shell and the air guide plate to form an air guide cavity. The air intake port is connected to the air guide cavity. An air guide groove is provided on the side of the air intake shell. One end of the air guide groove is connected to the air guide cavity, and the other end passes over the piezoelectric ceramic assembly and is connected to the intake flow channel.

9. A thin forced air-cooled piezoelectric pump for chip heat dissipation according to claim 8, characterized in that: The piezoelectric pump working chamber is located below the piezoelectric ceramic assembly. A back pressure cavity is provided above the piezoelectric ceramic assembly. The back pressure cavity is communicated with the air induction groove through a pressure relief port.

10. A thin forced air-cooled piezoelectric pump for chip heat dissipation according to any one of claims 1, 2, and 4, characterized in that: Sealing elements are provided between the housing component and the piezoelectric ceramic component, between the piezoelectric ceramic component and the air inlet plate component, and between the air inlet plate component and the air outlet plate component.

Images