Plane finishing system suitable for large-size workpiece

Abstract

The invention discloses a plane finishing system suitable for a large-size workpiece, and belongs to the technical field of ultra-precision plane machining equipment. The problems that in the prior art, deformation and secondary deformation exist in the machining process and the detection process of surface shape finishing machining equipment for large-size and large-weight workpieces, so that the machining efficiency is low, and the machining precision is difficult to guarantee are solved. Comprising a control center, and a first-stage platform, a second-stage platform, a first-stage leveling assembly, a second-stage leveling assembly, a processing device, a clamping assembly, a laser interferometer and two groups of laser reflection assemblies which are in signal connection with the control center, each laser reflection assembly comprises a laser, a laser reflector and a photosensitive position sensor. The method is used for plane finishing of large-size workpieces.

Description

Technical Field

[0001] The invention relates to a plane finishing processing system suitable for large-size workpieces, and belongs to the technical field of ultra-precision plane processing equipment. Background Art

[0002] Traditional surface finishing of large-sized and heavy workpieces such as lapping plates usually involves precision grinding and polishing followed by surface finishing. This process has three significant technical bottlenecks: First, large-mass and large-size workpieces are prone to asymmetric deformation under free gravity, causing the surface shape to deviate from the design tolerance; Second, off-site contact detection introduces secondary deformation errors and lacks real-time closed-loop monitoring, making it impossible to immediately correct reference plane offsets caused by dynamic interference such as temperature deformation and stress release. Third, traditional processing technology relies more on manual experience to adjust processing parameters. This method is time-consuming and the surface accuracy is difficult to guarantee.

[0003] Therefore, there is an urgent need for a new plane finishing system to better achieve the finishing of the surface of large-sized and heavy workpieces. Summary of the Invention

[0004] The present invention is to solve the above technical problems and further provide a plane finishing processing system suitable for large-sized workpieces.

[0005] The technical solution adopted by the present invention to solve the above technical problems is: A plane finishing system suitable for large-size workpieces includes a control center and a primary platform, a secondary platform, a primary leveling component, a secondary leveling component, a processing device, a clamping component, a laser interferometer, and two sets of laser reflection components, each of which is connected to the control center by signal. The first-level platform is horizontally arranged on the first-level leveling assembly, and the second-level platform is horizontally arranged on the first-level platform through the second-level leveling assembly. The first-level leveling assembly and the second-level leveling assembly are arranged orthogonally along the horizontal direction. The first inclinometer is set on the first-level platform, and the second inclinometer is set on the second-level platform. The clamping components are evenly distributed around the outside of the workpiece to be processed, and the workpiece to be processed is fixed on the secondary platform through the clamping components. The laser interferometer is installed on the secondary platform through the support assembly, and the laser interferometer is located above the workpiece to be processed. The processing device is installed on the secondary platform through a three-axis linkage assembly, and the processing device is located above the workpiece to be processed. Each inclinometer, support assembly and three-axis linkage assembly are connected to the control center signal. Two groups of laser reflection components are arranged orthogonally in the horizontal direction. Each group of laser reflection components includes a laser, a laser reflection mirror and a photosensitive position sensor. The two lasers are respectively installed on the secondary platforms on the adjacent sides of the workpiece to be processed. The two photosensitive position sensors are correspondingly installed above the two lasers. The two laser reflection mirrors are both vertically installed on the top of the processing device, and the two laser reflection mirrors are arranged orthogonally in the horizontal direction.

[0006] Furthermore, the processing device includes a tool and an angle adjustment component, wherein the angle adjustment component is installed between the tool and the end of the three-axis linkage component.

[0007] Furthermore, the angle adjustment assembly includes a first fixing plate, a second fixing plate, and a plurality of first piezoelectric ceramics fixed between the two fixing plates and arranged in a ring array, and the tool is fixed at the bottom end of the second fixing plate.

[0008] Furthermore, the first-level leveling assembly includes a plurality of first-level leveling mechanisms uniformly distributed circumferentially, and each first-level leveling mechanism includes a second piezoelectric ceramic.

[0009] Furthermore, a vibration isolator is provided at the bottom end of each first-level leveling mechanism.

[0010] Furthermore, a support leg is fixedly installed between the top end of each first-level leveling mechanism and the bottom end of the first-level platform.

[0011] Furthermore, the secondary leveling assembly includes a plurality of secondary leveling mechanisms uniformly distributed circumferentially, and each secondary leveling mechanism includes a third piezoelectric ceramic.

[0012] Furthermore, a two-dimensional moving platform is provided at the bottom of each laser.

[0013] Furthermore, the two-dimensional mobile platform includes a first support plate, a second support plate and a plurality of lifting mechanisms fixed between the first support plate and the second support plate, the laser is fixed on the first support plate, and the second support plate is fixed on the secondary platform.

[0014] Furthermore, the support assembly includes a base, a support frame and a mounting seat, wherein the base is fixedly mounted parallel to the secondary platform on one side of the workpiece to be processed, the bottom end of the support frame is slidably connected to the base in the horizontal direction and the support frame is telescopically adjustable in the vertical direction, the mounting seat is circumferentially mounted on the top of the support frame, and the rotation axis of the mounting seat is horizontally arranged, and the laser interferometer is fixedly mounted on the mounting seat.

[0015] Compared with the prior art, the present invention has the following effects: By evenly distributing the clamping assemblies around the outside of the workpiece to be machined, the present invention avoids asymmetric deformation of large workpieces under free gravity, thereby effectively preventing deviations from the design tolerance. The clamping assemblies can be any structure in the prior art that can achieve clamping of the workpiece to be machined, and their specific structure will not be detailed here.

[0016] The plane finishing system of the present invention can detect the surface shape while processing, and can adjust the processing process in real time according to the surface shape. Compared with the existing off-site contact detection method, it effectively avoids the introduction of secondary deformation errors, realizes real-time closed-loop monitoring, and can immediately correct the reference plane offset caused by dynamic interference such as temperature deformation and stress release.

[0017] The plane finishing processing system of the present invention no longer relies on manual experience to adjust processing parameters, effectively improves processing efficiency, and greatly improves surface accuracy.

[0018] The control center receives data monitored by two inclinometers in real time, and then controls the two leveling components in real time to adjust the horizontal accuracy and tilt angle of the two-stage platform in real time; by setting up a laser interferometer, during the flat finishing process of large-size workpieces, the surface error is monitored in real time, and the monitored surface error data is transmitted to the control center in real time, and then the control center adjusts the inclination angle of the processing device in real time; the position of the laser interferometer can also be controlled by the support component. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a first three-dimensional structural schematic diagram of a plane finishing processing system suitable for large-sized workpieces according to the present invention; Figure 2 This is a second three-dimensional structural schematic diagram of a plane finishing processing system suitable for large-sized workpieces according to the present invention; Figure 3 A third three-dimensional structural schematic diagram of a plane finishing processing system suitable for large-sized workpieces according to the present invention; Figure 4 It is a schematic front view of a plane finishing processing system suitable for large-sized workpieces of the present invention; Figure 5 It is a schematic diagram of the three-axis linkage assembly; Figure 6 It is a schematic diagram of the three-dimensional structure of the processing device; Figure 7 Schematic diagram of the connection structure between the laser and the two-dimensional mobile platform; Figure 8 for Figure 7 Schematic side view (not to scale); Figure 9 Schematic diagram of the working principle of the laser reflection component (top view); Figure 10 Schematic diagram of the working principle of the laser reflection component (side view, where the dotted line represents the change in position of the laser beam reflected to the photosensitive position sensor when the laser reflector is deflected).

[0020] In the picture: 1. First-level platform; 2. Second-level platform; 3. First-level leveling mechanism; 4. Second-level leveling mechanism; 5. Processing device; 51. Tool; 52. First fixed plate; 53. Second fixed plate; 54. First piezoelectric ceramic; 6. Clamping assembly; 7. Laser interferometer; 8. Laser; 9. Laser reflector; 10. Photosensitive position sensor; 11. First inclinometer; 12. Second inclinometer; 13. Support assembly; 131. Base; 132. Support frame; 133. Mounting seat; 14. Three-axis linkage assembly; 141. First support seat; 142. Second support seat; 143. First telescopic rod; 144. Second telescopic rod; 15. Vibration isolator; 16. Support leg; 17. Two-dimensional moving platform; 171. First support plate; 172. Second support plate; 173. Lifting mechanism; 18. Wedge block; 100. Workpiece to be processed. DETAILED DESCRIPTION

[0021] Specific implementation method 1: Combination Figures 1 to 10 This embodiment is explained, and the technical solutions in the embodiment of the present invention are clearly and completely described. Obviously, the described embodiment is only a part of the embodiment of the present invention, rather than all the embodiments. Based on the embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0022] It should be noted that the descriptions of the present invention regarding directions such as "front", "back", "left", "right", "inside", "outside", "left side", "right side", "upper", "lower", "top", and "bottom" are all defined based on the relationship between the orientations or positions shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the structure must be constructed and operated in a specific orientation. Therefore, they should not be understood as limiting the present invention. In the description of the present invention, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0023] In the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediary, or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0024] A plane finishing system suitable for large-size workpieces includes a control center and a primary platform 1, a secondary platform 2, a primary leveling component, a secondary leveling component, a processing device 5, a clamping component 6, a laser interferometer 7, and two sets of laser reflection components, respectively connected to the control center signal. The first-level platform 1 is horizontally arranged on the first-level leveling assembly, and the second-level platform 2 is horizontally arranged on the first-level platform 1 through the second-level leveling assembly. The first-level leveling assembly and the second-level leveling assembly are arranged orthogonally along the horizontal direction. A first inclinometer 11 is provided on the first-level platform 1, and a second inclinometer 12 is provided on the second-level platform 2. The clamping components 6 are evenly distributed around the outside of the workpiece 100 to be processed. The workpiece 100 to be processed is fixed on the secondary platform 2 through the clamping components 6. The laser interferometer 7 is mounted on the secondary platform 2 via the support assembly 13, and the laser interferometer 7 is located above the workpiece 100 to be processed. The processing device 5 is installed on the secondary platform 2 through the three-axis linkage assembly 14, and the processing device 5 is located above the workpiece 100 to be processed. Each inclinometer, support assembly 13 and three-axis linkage assembly 14 are connected to the control center signal. Two groups of laser reflection components are arranged orthogonally in the horizontal direction. Each group of laser reflection components includes a laser 8, a laser reflection mirror 9 and a photosensitive position sensor 10. The two lasers 8 are respectively installed on the secondary platform 2 on the adjacent sides of the workpiece 100 to be processed. The two photosensitive position sensors 10 are correspondingly installed above the two lasers 8. The two laser reflection mirrors 9 are both vertically installed on the top of the processing device 5, and the two laser reflection mirrors 9 are arranged orthogonally in the horizontal direction.

[0025] The surface finishing system of this invention is suitable for nanoscale surface processing of large, high-density workpieces such as cast iron lapping plates and semiconductor wafers. This technology can be expanded to other fields such as optical component coating and precision measurement tools.

[0026] The plane finishing processing system of the present invention has a two-stage leveling system, which monitors the level conditions of the first-level platform 1 and the second-level platform 2 in real time through the first inclinometer 11 and the second inclinometer 12 respectively, and transmits the monitoring data to the control center in real time. The level of the first-level platform 1 is controlled by the first-level leveling component, and the level of the second-level platform 2 is controlled by adding a second-level leveling component as a supplementary leveling mechanism, and the second-level leveling component is arranged orthogonally to the first-level leveling component in the horizontal direction, which can effectively improve the overall leveling accuracy of the processing system.

[0027] The photosensitive position sensor, or PSD, is a mature detector and its specific structure and working principle will not be described in detail here.

[0028] The two lasers 8 form two orthogonal laser beams, which are transmitted to two photosensitive position sensors 10 through two orthogonal reflectors. If the reflector angles shift, the position where the laser beams strike the photosensitive position sensors 10 will change. The laser reflector assembly can then monitor the reflector angles in real time, and thus the deflection angle of the processing device 5, facilitating real-time adjustment of the processing device 5 during processing. The orthogonal arrangement of the two laser reflector assemblies enables more accurate monitoring.

[0029] The processing device 5 is mounted on the secondary platform 2 via a three-axis linkage assembly 14, capable of precise displacement control in the X, Y, and Z directions. The three-axis linkage assembly 14 comprises a first support seat 141, a second support seat 142, a horizontally arranged first telescopic rod 143, and a plurality of vertically arranged second telescopic rods 144. The processing device 5 is mounted at the end of the first telescopic rod 143, and the plurality of second telescopic rods 144 are vertically fixed between the first support seat 141 and the second support seat 142. The second support seat 142 is fixedly connected to the secondary platform 2. The plurality of second telescopic rods 144 are used to adjust the Z-direction displacement of the first support seat 141, thereby adjusting the Z-direction displacement of the processing device 5. The head end of the first telescopic rod 143 is slidably connected to the first support seat 141 along the X direction, thereby adjusting the X-direction displacement of the processing device 5. The Y-direction displacement of the processing device 5 is adjusted by telescoping the first telescopic rod 143.

[0030] In the present invention, by evenly distributing the clamping assemblies 6 circumferentially around the outside of the workpiece 100 to be processed, asymmetric deformation of large workpieces under free gravity is avoided, thereby effectively preventing deviations from the design tolerance of the surface shape. The clamping assemblies 6 can be any structure in the prior art that can achieve clamping of the workpiece 100 to be processed, and their specific structure will not be detailed here.

[0031] The plane finishing system of the present invention can detect the surface shape while processing, and can adjust the processing process in real time according to the surface shape. Compared with the existing off-site contact detection method, it effectively avoids the introduction of secondary deformation errors, realizes real-time closed-loop monitoring, and can immediately correct the reference plane offset caused by dynamic interference such as temperature deformation and stress release.

[0032] The plane finishing processing system of the present invention no longer relies on manual experience to adjust processing parameters, effectively improves processing efficiency, and greatly improves surface accuracy.

[0033] The control center receives data monitored by the two inclinometers in real time, and then controls the two leveling components in real time to adjust the horizontal accuracy and tilt angle of the two-stage platform in real time; by setting up the laser interferometer 7, during the surface finishing processing of large-size workpieces, the surface error is monitored in real time, and the monitored surface error data is transmitted to the control center in real time, and then the control center adjusts the tilt angle of the processing device 5 in real time; the position of the laser interferometer 7 can also be controlled by the support component 13.

[0034] The processing device 5 includes a tool 51 and an angle adjustment assembly, wherein the angle adjustment assembly is installed between the tool 51 and the end of the three-axis linkage assembly 14. With this design, the angle of the tool 51 can be adjusted by the angle adjustment assembly. The angle adjustment assembly is connected to the control center signal, enabling real-time adjustment of the angle of the tool 51. The tool 51 is a small, high-hardness flat blade used to refine the deformed surface to be processed. This is prior art and will not be described in detail here. A reflector is installed on the top of the angle adjustment assembly.

[0035] The angle adjustment assembly includes a first fixed plate 52, a second fixed plate 53, and a plurality of first piezoelectric ceramics 54 fixed between the two fixed plates and arranged in an annular array. The tool 51 is fixed to the bottom end of the second fixed plate 53. With this design, the angle adjustment assembly integrates an annular piezoelectric ceramic array, achieving nanometer-level displacement compensation through the inverse piezoelectric effect, significantly improving the angle adjustment accuracy and stability of the tool 51. Each first piezoelectric ceramic 54 is provided with a first displacement sensor, which monitors the displacement changes of the first piezoelectric ceramic 54 in real time. A first pressure sensor is also provided between the second fixed plate 53 and the tool 51, which monitors the pressure applied to the tool 51 during the machining process in real time. The number of first piezoelectric ceramics is preferably 8.

[0036] The primary leveling assembly includes multiple primary leveling mechanisms 3 evenly distributed around the circumference, each of which includes a second piezoelectric ceramic. With this design, the primary leveling mechanisms 3 also include a second displacement sensor and a second piezoelectric ceramic. The second displacement sensor is disposed on the second piezoelectric ceramic, and a second pressure sensor is disposed between the second piezoelectric ceramic and the primary platform 1. The second displacement sensor monitors the displacement of the second piezoelectric ceramic in real time, while the second pressure sensor monitors the pressure applied to the second piezoelectric ceramic during processing.

[0037] Each leveling mechanism 3 is provided with a vibration isolator 15 at the bottom end. Such a design effectively reduces the influence of table vibration on machining accuracy by providing the vibration isolator 15.

[0038] A support leg 16 is fixedly mounted between the top of each leveling mechanism 3 and the bottom of the first-level platform 1. In this way, the support of the first-level platform 1 is achieved by setting the support leg 16.

[0039] The secondary leveling assembly includes multiple secondary leveling mechanisms 4 evenly distributed around the circumference, each of which includes a third piezoelectric ceramic. With this design, the secondary leveling mechanisms 4 also include a third displacement sensor and a third pressure sensor, wherein the third displacement sensor is disposed on the third piezoelectric ceramic, and the third pressure sensor is disposed between the third piezoelectric ceramic and the secondary platform 2.

[0040] A two-dimensional movable platform 17 is installed at the bottom of each laser 8. This design allows the position of the laser 8 to be adjusted, thereby adjusting the laser emission angle. The two-dimensional movable platform 17 is connected to the control center signal, thereby enabling real-time displacement adjustment of the laser 8. A wedge 18 is installed at the bottom of the laser 8, allowing the laser 8 to be installed at an angle on the secondary platform 2, so that the laser beam can be reflected by the reflector and hit the photosensitive position sensor 10.

[0041] The two-dimensional mobile platform 17 includes a first support plate 171, a second support plate 172, and multiple lifting mechanisms 173 fixedly mounted between the first and second support plates 171, 172. The laser 8 is fixedly mounted on the first support plate 171, and the second support plate 172 is fixedly mounted on the secondary platform 2. With this design, the height position of the laser 8 and the photosensitive position sensor 10 mounted above it can be adjusted by adjusting the lifting and lowering of the multiple lifting mechanisms 173. The lifting mechanisms 173 can be any conventional mechanism capable of achieving lifting and lowering adjustment, such as a piezoelectric ceramic column, a telescopic cylinder, etc.

[0042] The support assembly 13 comprises a base 131, a support frame 132, and a mounting seat 133. The base 131 is fixedly mounted parallel to the secondary platform 2 on one side of the workpiece 100 to be processed. The bottom end of the support frame 132 is horizontally slidably connected to the base 131 and is vertically adjustable. The mounting seat 133 is rotatably mounted on the top of the support frame 132, with the rotation axis of the mounting seat 133 arranged horizontally. The laser interferometer 7 is fixedly mounted on the mounting seat 133. This design allows the laser interferometer 7 to be adjusted over a wide range of deflection angles within the space above the workpiece 100 to be processed via the mounting seat 133. The height position of the laser interferometer 7 is adjusted via the support frame 132, and the lateral position of the laser interferometer 7 above the workpiece 100 to be processed is adjusted via the sliding connection between the support frame 132 and the base 131. The sliding connection between the support frame 132 and the base 131 can be achieved by providing a self-locking slide rail on the base 131, which allows the support frame 132 to be locked at any position on the base 131.

[0043] Working principle: The workpiece 100 to be processed is clamped onto the secondary platform 2 through the clamping assembly 6, and the level of the primary platform 1 and the secondary platform 2 is monitored in real time by the first inclinometer 11 and the second inclinometer 12, and the primary platform 1 and the secondary platform 2 are adjusted in real time to keep them level through the primary leveling assembly and the secondary leveling assembly.

[0044] The laser interferometer 7 monitors the surface shape of the workpiece 100 in real time and feeds this data back to the control center. The control center determines a machining plan (i.e., the angle and feed rate of the tool 51) based on the surface shape of the workpiece 100 and sends this plan to the three-axis linkage assembly 14. Once the machining plan is determined, the angle of the tool 51 is controlled by the angle adjustment assembly. The laser 8 directs a laser beam onto a reflector, which then reflects it onto a photosensitive position sensor 10. This detects the reflector's deflection angle (determined by the law of reflection and trigonometric functions). This allows for real-time monitoring of the tool 51's position and feeds this data back to the control center. The control center adjusts the tool 51's position in real time based on the surface shape monitored by the laser interferometer 7. The workpiece is then machined via the three-axis linkage assembly 14. The angle adjustment assembly can also be used to move the tool 51 within a small range, monitoring its position (i.e., its trajectory) in real time and making corrections to the surface shape.

[0045] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A plane finishing system suitable for large-size workpieces, characterized by: It includes a control center and a primary platform (1), a secondary platform (2), a primary leveling component, a secondary leveling component, a processing device (5), a clamping component (6), a laser interferometer (7) and two sets of laser reflection components, which are respectively connected to the control center signal. The first-level platform (1) is horizontally arranged on the first-level leveling assembly, and the second-level platform (2) is horizontally arranged on the first-level platform (1) through the second-level leveling assembly. The first-level leveling assembly and the second-level leveling assembly are arranged orthogonally along the horizontal direction. A first inclinometer (11) is provided on the first-level platform (1), and a second inclinometer (12) is provided on the second-level platform (2). The clamping components (6) are evenly distributed around the outside of the workpiece (100) to be processed. The workpiece (100) to be processed is fixed on the secondary platform (2) through the clamping components (6). The laser interferometer (7) is mounted on the secondary platform (2) via a support assembly (13), and the laser interferometer (7) is located above the workpiece (100) to be processed. The processing device (5) is installed on the secondary platform (2) through a three-axis linkage assembly (14), and the processing device (5) is located above the workpiece (100) to be processed. Each inclinometer, support assembly (13) and three-axis linkage assembly (14) are connected to the control center signal. Two groups of laser reflection components are arranged orthogonally in the horizontal direction, and each group of the laser reflection components includes a laser (8), a laser reflection mirror (9) and a photosensitive position sensor (10). The two lasers (8) are respectively installed on the secondary platform (2) on the adjacent two sides of the workpiece (100) to be processed, and the two photosensitive position sensors (10) are correspondingly installed above the two lasers (8). The two laser reflection mirrors (9) are both vertically installed on the top of the processing device (5), and the two laser reflection mirrors (9) are arranged orthogonally in the horizontal direction.

2. A plane finishing system suitable for large-size workpieces according to claim 1, characterized in that: The processing device (5) comprises a tool (51) and an angle adjustment component, wherein the angle adjustment component is installed between the tool (51) and the end of the three-axis linkage component (14).

3. A plane finishing system suitable for large-size workpieces according to claim 2, characterized in that: The angle adjustment assembly comprises a first fixed plate (52), a second fixed plate (53), and a plurality of first piezoelectric ceramics (54) fixed between the two fixed plates and arranged in a ring array, and the tool (51) is fixed at the bottom end of the second fixed plate (53).

4. A plane finishing system suitable for large-size workpieces according to claim 1, characterized in that: The primary leveling assembly comprises a plurality of primary leveling mechanisms (3) uniformly distributed in the circumferential direction, and each primary leveling mechanism (3) comprises a second piezoelectric ceramic.

5. A plane finishing system suitable for large-size workpieces according to claim 4, characterized in that: A vibration isolator (15) is provided at the bottom end of each first-level leveling mechanism (3).

6. A plane finishing system suitable for large-size workpieces according to claim 4 or 5, characterized in that: A supporting leg (16) is correspondingly fixed between the top end of each first-level leveling mechanism (3) and the bottom end of the first-level platform (1).

7. A plane finishing system suitable for large-size workpieces according to claim 1, characterized in that: The secondary leveling component comprises a plurality of secondary leveling mechanisms (4) uniformly distributed in the circumferential direction, and each secondary leveling mechanism (4) comprises a third piezoelectric ceramic.

8. The surface finishing system for large-size workpieces according to claim 1, characterized in that: A two-dimensional moving platform (17) is provided at the bottom of each laser (8).

9. A plane finishing system suitable for large-size workpieces according to claim 8, characterized in that: The two-dimensional mobile platform (17) comprises a first support plate (171), a second support plate (172), and a plurality of lifting mechanisms (173) fixed between the first support plate (171) and the second support plate (172); the laser (8) is fixed on the first support plate (171), and the second support plate (172) is fixed on the secondary platform (2).

10. The surface finishing system for large-size workpieces according to claim 1, characterized in that: The support assembly (13) includes a base (131), a support frame (132) and a mounting seat (133), wherein the base (131) is fixedly mounted parallel to the secondary platform (2) on one side of the workpiece (100) to be processed, the bottom end of the support frame (132) is connected to the base (131) in a sliding manner in the horizontal direction, and the support frame (132) is telescopically adjustable in the vertical direction, the mounting seat (133) is circumferentially mounted on the top of the support frame (132), and the rotation axis of the mounting seat (133) is arranged horizontally, and the laser interferometer (7) is fixedly mounted on the mounting seat (133).

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