Double-sided peelable adhesive tape and curing process control system and method thereof

Abstract

The invention discloses a double-sided peelable adhesive tape and a curing process control system and method thereof, and belongs to the technical field of adhesive tape curing equipment control, and the double-sided peelable adhesive tape comprises a UV irradiation adjustment module, a curing process continuous execution judgment module, a reaction sufficiency evaluation module and a curing strategy determination module. According to the method, the curing uniformity inside and outside the adhesive layer can be analyzed through the UV penetration consistency factor, the energy distribution inside and outside the adhesive layer is optimized in combination with the long-wavelength UV light internal supplementary curing and multi-band irradiation process, and meanwhile closed-loop control of physical energy regulation and chemical reaction verification is formed by evaluating the reaction sufficiency of the bonding interface, so that the curing uniformity of the adhesive layer is improved. And the problems of peeling surface tearing, residual adhesive accumulation, peeling force fluctuation and the like caused by non-uniform curing are avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of adhesive tape curing equipment control, in particular to a double-sided peelable adhesive tape and a curing process control system and method thereof. Background Art

[0002] In the rapidly developing electronic information industry, chips, as core components, require critical precision and efficiency in their manufacturing processes. The securing and peeling of wafers and chips are crucial steps in chip manufacturing, placing extremely high demands on related materials and processes. Double-sided removable tape plays a crucial role in this process, particularly during chip polishing and packaging, providing reliable support for the secure and precise handling of wafers and chips.

[0003] During the chip polishing process, the wafer needs to be stably fixed on the grinding table for polishing and thinning operations. At this time, the heat-expandable peelable pressure-sensitive adhesive sheet plays an important role as an application form of double-sided peelable tape. Specifically, the wafer is first pasted on the heat-expandable peelable pressure-sensitive adhesive sheet and then fixed on the grinding table. Through the polishing and thinning process, the wafer reaches the specific thickness and specifications required for chip production. After polishing is completed, the heat-expandable peelable pressure-sensitive adhesive sheet is heated, the pressure-sensitive adhesive expands due to the heat, and the wafer can be smoothly detached from the pressure-sensitive adhesive sheet to become the wafer specifically required for chip production. This method ensures that the wafer is stably fixed during the polishing process, while allowing it to be easily peeled off after completion to avoid damage to the wafer.

[0004] In the chip packaging process, the manufactured chip needs to be pasted on a heat-expandable peelable pressure-sensitive adhesive sheet, which is used to fix the chip on the carrier so that it can be made into chips of various packaging forms according to needs. This ensures that the chip can be accurately fixed during the packaging process, facilitates the packaging operation, and achieves damage-free peeling after the packaging is completed, meeting the high-precision requirements of chip packaging.

[0005] For example, the invention patent with announcement number CN115799126B discloses a method and device for controlling the cooling of UV lamps in a photoresist curing process. The method includes: determining an original temperature curve of each UV lamp when no cooling is performed based on the photoresist curing process flow, and determining a first-class UV lamp whose temperature exceeds a first threshold value based on the original temperature curve; turning on air cooling and updating the temperature curve based on the moment when the temperature of each first-class UV lamp reaches a second threshold value; determining whether water cooling needs to be turned on based on the updated temperature curve; if necessary, turning on water cooling based on the updated temperature curve, turning off air cooling, and updating the temperature curve; and turning off water cooling based on the updated temperature curve and updating the temperature curve; if not necessary, turning off air cooling based on the updated temperature curve and updating the temperature curve; determining whether a first-class UV lamp exists in a subsequent process based on the current temperature curve of each UV lamp, and continuing to perform corresponding cooling operations based on the judgment result.

[0006] For example, the electrode tape manufacturing machine disclosed in patent publication number CN103560099B includes a conductive structure reel and a forming mold. The conductive structure reel provides the conductive structure. The forming mold includes an upper mold, a lower mold, an adhesive material injection port, and a curing device. The upper and lower molds are each capable of moving up and down and joining together to form a space for receiving the conductive structure. The adhesive material injection port is used to inject the adhesive material into the space. The curing device is used to cure the adhesive material within the space.

[0007] However, in the process of implementing the technical solutions of the invention in the embodiments of the present application, the present application found that the above technology has at least the following technical problems:

[0008] Current tape curing methods only focus on regulating external curing conditions. During UV curing or thermal curing, due to the limitations of heat transfer efficiency and light energy penetration depth, the outer layer of adhesive completes the cross-linking reaction first due to rapid energy absorption, while the inner layer of adhesive lags behind in heat and light energy conduction, causing the curing reaction to lag significantly. As a result, when the adhesive layer is not fully cured, the peeling surface cannot occur accurately at the preset interface layer, but instead presents a tear-like damage, resulting in an unclear curing interface and an abnormally increased peeling force. This unstable peeling performance may cause problems such as wafer scratches and chip packaging position offset in processes with extremely high precision requirements such as chip polishing and packaging, affecting product qualification rate and reliability. Summary of the Invention

[0009] The first aspect of the present invention provides a double-sided peelable adhesive tape curing process control system, comprising:

[0010] The UV irradiation adjustment module is used to record the double-sided removable tape that is undergoing the tape curing process as the target tape, analyze the UV penetration consistency factor of the target tape, thereby determining the curing uniformity information inside and outside the adhesive layer, and perform internal supplementary curing of the target tape.

[0011] The curing process continues to execute the determination module, which is used to evaluate the adjustment effect after the internal part of the target tape is additionally cured, and thereby determine whether the curing process continues to execute the label.

[0012] The reaction sufficiency assessment module is used to analyze the bonding interface reaction completeness score and evaluate the sufficiency of the chemical reaction at the bonding interface.

[0013] The curing strategy determination module is used to determine the curing strategy of the target tape based on the curing uniformity information inside and outside the adhesive layer after receiving the traceability judgment signal, thereby completing the curing process of the target tape.

[0014] A second aspect of the present invention provides a method for controlling a curing process of a double-sided peelable adhesive tape, comprising the following steps:

[0015] S1, record the double-sided removable tape that performs the tape curing process as the target tape, analyze the UV penetration consistency factor of the target tape, thereby determining the internal and external curing uniformity information of the adhesive layer, and perform internal supplementary curing of the target tape.

[0016] S2, after the target tape is cured internally, the adjustment effect is evaluated, and the curing process is determined to continue with the labeling.

[0017] S3: Analyze the bonding interface reaction completeness score and evaluate the adequacy of the bonding interface chemical reaction.

[0018] S4, after receiving the traceability determination signal, the curing strategy of the target tape is determined in combination with the curing uniformity information of the inner and outer layers of the adhesive layer, thereby completing the curing process of the target tape.

[0019] The third aspect of the present invention provides a double-sided removable adhesive tape, comprising: coating a pressure-sensitive adhesive on a plastic film substrate, and drying and curing the resultant.

[0020] Pressure-sensitive adhesives include resins, monomers, initiators, expanding microspheres, and solvents.

[0021] One or more technical solutions provided in the present invention have at least the following technical effects or advantages:

[0022] 1. The double-sided removable adhesive tape and its curing process control system provided by the present invention can analyze the curing uniformity inside and outside the adhesive layer through the UV penetration consistency factor, and combine the internal supplementary curing of long-wavelength UV light with the multi-band irradiation process to optimize the energy distribution inside and outside the adhesive layer. At the same time, by evaluating the sufficiency of the bonding interface reaction, a closed-loop control of physical energy regulation and chemical reaction verification is formed to avoid problems such as tearing of the peeling surface, residual adhesive accumulation, and peeling force fluctuations caused by uneven curing.

[0023] 2. The present invention performs internal supplementary curing on the target adhesive tape and specifically uses long-wavelength UV light to enhance the UV energy input deep into the adhesive layer, thereby avoiding excessive curing of the surface due to energy concentration. At the same time, it effectively improves the matching of internal transmittance and UV energy density, reduces the difference in heat conduction inside and outside the adhesive layer, and makes the curing reaction intensity and rate inside and outside the adhesive layer tend to be consistent, thereby achieving uniform curing of the adhesive layer.

[0024] 3. The present invention can quantify the completeness of the chemical reaction between the adhesive layer and the peeling layer by evaluating the sufficiency of the chemical reaction at the bonding interface, identify the potential risk of insufficient interface reaction during the curing process, avoid problems such as tearing of the peeling surface and accumulation of residual adhesive in the boundary layer due to incomplete reaction, ensure a clear peeling interface and stable peeling force, and significantly improve the interface bonding reliability of the double-sided peelable tape. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic structural diagram of the double-sided peelable tape curing process control system provided in an embodiment of the present application.

[0026] Figure 2 Flowchart of the double-sided peelable tape curing process control method provided in an embodiment of the present application.

[0027] Figure 3 This is a flowchart of the target tape curing strategy execution involved in the embodiments of the present application.

[0028] Figure 4 This is the homepage of the material production system involved in the embodiment of this application.

[0029] Figure 5 This is the UV irradiation monitoring interface of the material production system involved in the embodiment of this application.

[0030] Figure 6 A solidified execution monitoring interface for the material production system involved in the embodiment of this application.

[0031] Figure 7 This is a visualization interface of the material production system involved in the embodiment of this application. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0033] Reference Figure 4As shown, this is the homepage of the material production system involved in the embodiment of the present application, from which the current system production objects and historical production records can be obtained.

[0034] Reference Figure 1 As shown, the first aspect of the present invention provides a double-sided peelable tape curing process control system, comprising:

[0035] See Figure 5 As shown, it is the UV irradiation monitoring interface of the material production system involved in the embodiment of the present application, through which the current UV power and exposure time can be monitored, and at the same time, the required UV wavelength can be set.

[0036] The UV irradiation adjustment module is used to record the double-sided removable tape that is undergoing the tape curing process as the target tape, analyze the UV penetration consistency factor of the target tape, thereby determining the curing uniformity information inside and outside the adhesive layer, and perform internal supplementary curing of the target tape.

[0037] In this embodiment, the specific analysis method for determining the curing uniformity information inside and outside the adhesive layer is as follows:

[0038] Collect photothermal curing data, including surface reflectivity, internal transmittance, UV (Ultra-Violet) energy density, and temperature gradient.

[0039] It should be noted that surface reflectivity refers to the ratio of the reflected light energy to the incident light energy when UV light strikes the target tape surface, and can be measured using a UV reflectometer. Internal transmittance refers to the ratio of the transmitted light energy to the incident light energy after UV light penetrates the tape's adhesive layer. It reflects the UV light's ability to penetrate the adhesive layer. This can be measured using a UV transilluminator. UV energy density refers to the amount of UV light received per unit area and can be measured using a UV energy meter. Temperature gradient refers to the rate of temperature change at different depths within the adhesive layer, reflecting the uniformity of heat conduction during the curing process. This can be measured using a thermocouple array.

[0040] A greater ratio of internal transmittance to surface reflectance indicates a greater ability of UV light to penetrate the adhesive layer (more light enters the interior rather than being reflected by the surface). This, combined with a higher UV energy density (sufficient cumulative energy per unit area), allows the curing energy received by the interior and surface of the adhesive layer to be closer. Furthermore, a smaller temperature gradient means more uniform heat conduction inside and outside the adhesive layer, avoiding reaction rate differences caused by surface overheating or insufficient internal temperature. When these three factors work together, the intensity and rate of the curing reaction inside and outside the adhesive layer tend to be consistent, resulting in high curing uniformity inside and outside the adhesive layer.

[0041] The reference UV energy density and reference temperature gradient stored in the database are extracted.

[0042] Extract the UV transmittance distribution coefficient, UV energy density distribution coefficient and temperature gradient distribution coefficient preset in the database.

[0043] It should be noted that the UV transmittance distribution coefficient, UV energy density distribution coefficient and temperature gradient distribution coefficient all have a value range of 0-1, and the sum of the UV transmittance distribution coefficient, UV energy density distribution coefficient and temperature gradient distribution coefficient is 1. When used, the pre-set value can be directly extracted from the database. The specific extraction method is, for example, to construct a one-to-one mapping set with the ratio of internal transmittance to surface reflectance, UV energy density and temperature gradient and the corresponding UV transmittance distribution coefficient, UV energy density distribution coefficient and temperature gradient distribution coefficient respectively. When used, the obtained ratio of internal transmittance to surface reflectance, UV energy density and temperature gradient are respectively input into the corresponding mapping set, so as to extract the UV transmittance distribution coefficient, UV energy density distribution coefficient and temperature gradient distribution coefficient.

[0044] Analyze UV ​​penetration consistency factors based on photothermal curing data.

[0045] The UV penetration consistency factor is a quantitative indicator of the impact of surface reflectivity, internal transmittance, UV energy density and temperature gradient on the uniformity of curing inside and outside the target tape adhesive layer. The specific analysis process is as follows: internal transmittance and surface reflectivity are compared, UV energy density is compared with the corresponding reference value, and the reference value of temperature gradient is compared with the temperature gradient. The results of each comparison are coupled with the corresponding distribution coefficient to obtain the UV penetration consistency factor.

[0046] It should be noted that surface reflectivity, internal transmittance, UV energy density and temperature gradient are interrelated and dynamically influence each other: surface reflectivity directly determines the loss ratio of incident UV light energy. The higher the reflectivity, the lower the internal transmittance, resulting in significantly lower UV energy density inside the adhesive layer than on the surface. The difference in UV energy density will trigger a change in the temperature gradient - the surface temperature rises rapidly due to energy concentration, while the internal temperature rises slowly due to insufficient energy, forming a temperature difference between the inside and the outside. The temperature gradient will in turn affect the distribution and absorption of UV energy. For example, the molecular movement of the adhesive layer in the high-temperature area is intensified, which may change the light absorption characteristics and further affect the matching of surface reflectivity and internal transmittance.

[0047] In a specific embodiment, the UV penetration consistency factor is specifically expressed as follows:

[0048]

[0049] Among them, A is the UV penetration consistency factor, R s is the surface reflectivity, T s is the internal transmittance, E is the UV energy density, is the temperature gradient, E vef is the reference UV energy density, is the reference temperature gradient, α1 is the UV transmittance distribution coefficient, α2 is the UV energy density distribution coefficient, and α3 is the temperature gradient distribution coefficient.

[0050] Extract the preset UV penetration consistency threshold in the database.

[0051] If the UV penetration consistency factor is greater than or equal to the UV penetration consistency threshold, the curing uniformity information inside and outside the adhesive layer is recorded as uniform curing.

[0052] If the UV penetration consistency factor is greater than or equal to the UV penetration consistency threshold, it means that during the UV curing process, the curing reaction intensity and rate inside and on the surface of the target tape adhesive layer tend to be consistent, and it can be determined that the adhesive layer is uniformly cured inside and outside.

[0053] If the UV penetration consistency factor is less than the UV penetration consistency threshold, the curing uniformity information inside and outside the adhesive layer is recorded as non-uniform curing.

[0054] If the UV penetration consistency factor is less than the UV penetration consistency threshold, it means that during the curing process, the curing energy received by the surface and the interior of the adhesive layer is significantly different, the surface is over-cured and the interior is insufficiently cured, which ultimately leads to the curing uniformity inside and outside the adhesive layer not meeting the standard, and is judged to be a non-uniform curing state.

[0055] In this embodiment, internal supplementary curing of the target tape is performed, and the specific analysis process is as follows:

[0056] If the curing uniformity information of the inside and outside of the adhesive layer is non-uniform curing, the UV penetration consistency threshold and the UV penetration consistency factor are subjected to difference processing to obtain the UV penetration consistency deviation factor.

[0057] It should be noted that the difference processing refers to subtracting the UV penetration consistency factor from the UV penetration consistency threshold.

[0058] The UV irradiation parameter adjustment set is extracted based on the UV penetration consistency deviation factor.

[0059] It should be noted that the database stores a mapping set of UV irradiation parameter adjustment sets and UV penetration consistency deviation factors. When used, the UV penetration consistency deviation factor obtained in real time is input into the mapping set to extract the UV irradiation parameter adjustment set.

[0060] The UV irradiation parameter adjustment set includes a UV power supplement value and an exposure time supplement value.

[0061] Internal supplementary curing of the target tape is performed based on the UV irradiation parameter adjustment set, specifically: the current UV power is extracted from the system program log, the sum of the current UV power and the UV power supplement value is used as the execution UV power, and the internal supplementary curing of the target tape is completed based on the execution UV power and the exposure time supplement value.

[0062] In specific embodiments, long-wavelength UV light is used for supplemental internal curing. Long-wavelength UV light, due to its lower photon energy and reduced scattering losses, can penetrate deep into the adhesive layer. Short-wavelength UV light, on the other hand, is easily absorbed by surface materials, limiting its penetration depth. When the adhesive layer appears "cured on the outside but uncured on the inside," supplemental long-wavelength UV light can effectively deliver UV energy to the uncured areas without significantly increasing surface energy input, improving the match between internal transmittance and UV energy density. Furthermore, the curing reaction initiated by long-wavelength light generates heat more evenly, reducing temperature gradients in the adhesive layer.

[0063] The curing process continues to execute the determination module, which is used to evaluate the adjustment effect after the internal part of the target tape is additionally cured, and thereby determine whether the curing process continues to execute the label.

[0064] In this embodiment, it is determined that the curing process continues to execute the tag. The specific process is as follows:

[0065] Retrieve the UV penetration consistency factor.

[0066] If the re-acquired UV penetration consistency factor is less than or equal to the UV penetration consistency threshold, the curing process is continued and the curing process is marked as stopped, and a prompt message is generated simultaneously to indicate that the internal supplementary curing is invalid.

[0067] If the re-acquired UV transmittance consistency factor is greater than the UV transmittance consistency threshold, the internal transmittance of the target tape is continuously monitored within a preset time window to obtain a decrease value of the internal transmittance of the target tape.

[0068] If the internal transmittance decrease value of the target tape is greater than or equal to the preset internal transmittance decrease threshold, the curing process is continued and the curing process is marked as stopped, and a prompt message is generated simultaneously to prompt that the internal supplementary curing is invalid.

[0069] If the internal transmittance reduction value of the target tape is less than the preset internal transmittance reduction threshold, the curing process continuation tag is recorded as continuing the curing process.

[0070] See Figure 6 As shown, this is the curing execution monitoring interface of the material production system involved in the embodiment of the present application, through which the current curing process of the system can be monitored and the operation log of the system curing execution process can be obtained simultaneously.

[0071] The reaction sufficiency assessment module is used to analyze the bonding interface reaction completeness score and evaluate the sufficiency of the chemical reaction at the bonding interface.

[0072] In this embodiment, the bonding interface reaction completeness score is analyzed, and the specific analysis process is as follows:

[0073] When the curing process continuation tag is set to continue executing the curing process, the curing process of the target tape is continued, each sample tape is extracted according to the number of samples preset in the database, and the interface reaction integrity data of each sample tape is collected.

[0074] The interface reaction integrity data include surface tension, residual functional group absorption peak, interface layer residual glue thickness and average reaction temperature.

[0075] It should be noted that surface tension refers to the mutual attraction between surface molecules, reflecting the molecular activity and reaction sufficiency at the interface between the adhesive layer and the peeling layer, and can be measured using a surface tension meter. The residual functional group absorption peak refers to the characteristic absorption peak intensity corresponding to the incompletely reacted functional groups in the adhesive layer after curing in the infrared spectrum. It is used to characterize the completeness of the interfacial chemical reaction and can be detected using a Fourier transform infrared spectrometer. The residual adhesive thickness of the boundary layer refers to the thickness of the adhesive layer remaining on the surface of the peeling layer after the adhesive layer of the tape is separated from the peeling layer. It reflects the uniformity of adhesive layer adhesion during interface separation and can be measured using a white light interferometer. The average reaction temperature can be measured using a thermocouple array.

[0076] It should be added that the functional groups include but are not limited to double bonds, hydroxyl groups, etc.

[0077] It should also be noted that the smaller the surface tension, the weaker the intermolecular attraction at the interface between the adhesive layer and the peeling layer, the low degree of cross-linking of the adhesive layer molecules, and the incomplete participation of the reactive groups in the curing reaction. The larger the residual functional group absorption peak, the higher the intensity of the characteristic peak of the unreacted functional group in the infrared spectrum, which directly reflects the incompleteness of the curing reaction. The thicker the residual adhesive in the boundary layer, the weaker the adhesive layer is attached to the interface during peeling, and the weak cohesion of the adhesive layer remains due to insufficient curing. The more the average reaction temperature deviates from the ideal temperature, the more the curing reaction rate will deviate from the optimal range (if the temperature is too low, the reaction will be slow, and if it is too high, side reactions or energy loss will be triggered), resulting in the inability to fully proceed with the chemical reaction.

[0078] The reference surface tension, reference residual functional group absorption peak, reference interface layer residual adhesive thickness and ideal reaction temperature stored in the database are extracted.

[0079] The surface tension distribution coefficient, residual functional group absorption peak distribution coefficient, boundary layer residual glue thickness distribution coefficient and average reaction temperature distribution coefficient preset in the database are extracted.

[0080] It should be noted that the surface tension distribution coefficient, the residual functional group absorption peak distribution coefficient, the boundary layer residual glue thickness distribution coefficient and the average reaction temperature distribution coefficient all have a value range of 0-1, and the sum of the surface tension distribution coefficient, the residual functional group absorption peak distribution coefficient, the boundary layer residual glue thickness distribution coefficient and the average reaction temperature distribution coefficient is 1. When used, the pre-set value can be directly extracted from the database. The specific extraction method is, for example, to construct a one-to-one mapping set with the surface tension, the residual functional group absorption peak, the boundary layer residual glue thickness and the average reaction temperature respectively and the corresponding surface tension distribution coefficient, the residual functional group absorption peak distribution coefficient, the boundary layer residual glue thickness distribution coefficient and the average reaction temperature distribution coefficient. When used, the obtained surface tension, residual functional group absorption peak, boundary layer residual glue thickness and average reaction temperature are respectively input into the corresponding mapping set, so as to extract the surface tension distribution coefficient, the residual functional group absorption peak distribution coefficient, the boundary layer residual glue thickness distribution coefficient and the average reaction temperature distribution coefficient.

[0081] The bonding interface reaction completeness score was analyzed based on the interface reaction integrity data.

[0082] The bonding interface reaction completeness score is a quantitative indicator of the degree to which surface tension, residual functional group absorption peak, residual adhesive thickness in the interface layer, and average reaction temperature jointly influence the completeness of the interfacial chemical reaction between the adhesive layer and the peeling layer of the target tape. The specific analysis process is as follows: comparing the surface tension with the corresponding reference value, comparing the reference values ​​of the residual functional group absorption peak and the residual adhesive thickness in the interface layer with the residual functional group absorption peak and the residual adhesive thickness in the interface layer, respectively, performing deviation processing on the average reaction temperature and the ideal reaction temperature, and coupling the comparison and deviation processing results with the corresponding distribution coefficient to obtain the bonding interface reaction completeness score.

[0083] It should be noted that surface tension, residual functional group absorption peak, residual adhesive thickness in the boundary layer and average reaction temperature are interrelated and influence each other during the curing process of double-sided removable tape. The average reaction temperature directly affects the curing reaction rate and completeness. If the temperature deviates from the ideal range, it will lead to insufficient curing reaction or trigger side reactions, which will increase the intensity of the residual functional group absorption peak (increase in unreacted functional groups). At the same time, the degree of cross-linking of the adhesive layer molecules will decrease, and the surface tension will decrease accordingly (weakened intermolecular attraction). A large number of residual functional groups will weaken the cohesion of the adhesive layer, resulting in an increase in the thickness of the residual adhesive in the boundary layer and uneven distribution during peeling. In addition, abnormal temperature gradients will aggravate the curing differences inside and outside the adhesive layer, making the internal residual functional group distribution more uneven, further affecting the consistency of surface tension and the uniformity of residual adhesive thickness.

[0084] In a specific embodiment, the bonding interface reaction completeness score is specifically expressed as follows:

[0085]

[0086] Among them, B is the bonding interface reaction completeness score, γ is the surface tension, AFG is the residual functional group absorption peak, D is the thickness of the residual glue in the boundary layer, T is the average reaction temperature, γ vef is the reference surface tension, AFG vef is the reference residual functional group absorption peak, D vef is the reference boundary layer residual adhesive thickness, T0 is the ideal reaction temperature, β1 is the surface tension distribution coefficient, β2 is the residual functional group absorption peak distribution coefficient, β3 is the boundary layer residual adhesive thickness distribution coefficient, and β4 is the average reaction temperature distribution coefficient.

[0087] In this embodiment, the sufficiency of the chemical reaction at the bonding interface is evaluated, and the specific analysis process is as follows:

[0088] Each sample tape was traversed in turn, the bonding interface reaction completeness score of each sample tape was counted and extracted, and the mean value was obtained by averaging.

[0089] Extract the preset bonding interface reaction completeness scoring threshold in the database.

[0090] If the bonding interface reaction completeness score mean is greater than the bonding interface reaction completeness score threshold, the bonding interface chemical reaction sufficiency assessment result is recorded as a bonding interface complete reaction, and the subsequent process continues.

[0091] If the mean bonding interface reaction completeness score is greater than the bonding interface reaction completeness score threshold, it means that the interfacial chemical reaction between the adhesive layer and the peeling layer of the target tape has reached an ideal state, the interfacial chemical reaction is fully complete, and the subsequent process can continue.

[0092] If the bonding interface reaction completeness score mean is less than or equal to the bonding interface reaction completeness score threshold, the bonding interface chemical reaction sufficiency assessment result is recorded as an incomplete bonding interface reaction, and a retrospective judgment signal is generated simultaneously.

[0093] If the mean bonding interface reaction completeness score is less than or equal to the bonding interface reaction completeness score threshold, it means that the interfacial chemical reaction is obviously insufficient and needs to be adjusted in a targeted manner.

[0094] The curing strategy determination module is used to determine the curing strategy of the target tape based on the curing uniformity information inside and outside the adhesive layer after receiving the traceability judgment signal, thereby completing the curing process of the target tape.

[0095] In this embodiment, the target tape curing strategy is determined by combining the curing uniformity information of the inner and outer surfaces of the adhesive layer. The specific analysis process is as follows:

[0096] After receiving the traceability judgment signal, if the curing uniformity information of the inner and outer layers of the adhesive layer is uniform curing, the target tape curing strategy is recorded as stopping the current curing process, and a warning prompt information is generated simultaneously.

[0097] It should be noted that if the curing uniformity information inside and outside the adhesive layer is uniform curing, it means that the UV light has good ability to penetrate the adhesive layer, the UV energy density is evenly distributed inside and outside the adhesive layer, and the temperature gradient is within the normal range, that is, the physical conditions required for curing (energy transfer, heat conduction) have been fully met. However, at this time, the interfacial reaction still appears incomplete, indicating that the root cause of the problem is not abnormal UV light penetration or energy distribution, but defects in the ratio or state of the chemical reactants themselves: it may be that the amount of crosslinker in the pressure-sensitive adhesive formula is insufficient, or the ratio of the main agent to the curing agent is deviated, resulting in the inability of the active groups to fully react; it may also be that the spray surface is contaminated with dust, grease, and other pollutants during the coating process, or the material has aged due to improper storage, and the volatile components are lost, affecting the adequacy of the interfacial chemical reaction. Since such problems cannot be improved by adjusting the UV irradiation parameters or the temperature field, continuing the curing process will only increase energy consumption. Therefore, the current curing process needs to be stopped immediately and an early warning generated.

[0098] If the curing uniformity information inside and outside the adhesive layer is non-uniform curing, the target tape curing strategy is recorded as a segmented control interface reaction adjustment process.

[0099] If the curing uniformity information inside and outside the adhesive layer is non-uniform curing, although the UV power and temperature have been adjusted, the purpose of the adjustment is to restore the energy distribution. It is a physical adjustment and may not immediately cause the chemical reaction to complete. After the bonding interface has not completely reacted, it needs to be adjusted again.

[0100] In this embodiment, the interface reaction adjustment process is controlled in sections. The specific analysis process is as follows:

[0101] The correction factor for the completeness of the bonding interface reaction was extracted based on the UV penetration consistency factor.

[0102] It should be noted that the database stores a mapping set of UV penetration consistency factors and bonding interface reaction completeness correction factors. When used, the UV penetration consistency factor obtained in real time is input into the mapping set to extract the bonding interface reaction completeness correction factor.

[0103] The bond interface reaction completeness correction score was analyzed based on the mean bond interface reaction completeness score and the bond interface reaction completeness correction factor.

[0104] The bond interface reaction completeness correction score is a quantitative indicator of the degree of influence of the bond interface reaction completeness score mean and the bond interface reaction completeness correction factor on the bond interface reaction completeness after correction. The specific analysis process is: the bond interface reaction completeness score mean is corrected based on the bond interface reaction completeness correction factor to obtain the bond interface reaction completeness correction score. Specifically expressed as: the product of the bond interface reaction completeness score mean and the bond interface reaction completeness correction factor is used as the numerical result of the bond interface reaction completeness correction score.

[0105] The interface reaction adjustment set was extracted based on the bond interface reaction completeness correction score.

[0106] It should be added that the database stores a mapping set of interface reaction adjustment sets and bonding interface reaction completeness correction scores. When used, the bonding interface reaction completeness correction score obtained in real time is input into the mapping set to extract the interface reaction adjustment set.

[0107] The interface reaction adjustment set includes a surface heating temperature supplement value and a UV irradiation time supplement value.

[0108] See Figure 3 As shown, this is a flow chart for executing the target tape curing strategy involved in an embodiment of the present application. Short-wave and long-wave irradiation are set, and the irradiation time and temperature rise values ​​of the two types of wavelengths are calculated in parallel. First, deep curing adjustment is performed through the long-wave irradiation time and temperature rise value, and then the short-wave parameters are used to complete the rapid curing of the surface, and finally the segmented control process is ended.

[0109] A multi-band UV irradiation process is set based on the interface reaction adjustment set, thereby completing the segmented control of the interface reaction adjustment process.

[0110] In a specific embodiment, a multi-band UV irradiation process is set based on the interface reaction adjustment set, and the specific steps are as follows:

[0111] A1, set multi-band UV irradiation, including short-wave irradiation and long-wave irradiation.

[0112] A2. Extract the irradiation time allocation factors corresponding to the preset wavelengths in the database, including the short-wave irradiation time allocation factor and the long-wave irradiation time allocation factor. Multiply the short-wave irradiation time allocation factor by the UV irradiation time supplement value to obtain the short-wave irradiation time. Multiply the long-wave irradiation time allocation factor by the UV irradiation time supplement value to obtain the long-wave irradiation time.

[0113] A3, synchronously extract the temperature rise distribution factors corresponding to the preset wavelengths in the database, including the shortwave temperature rise distribution factor and the longwave temperature rise distribution factor, multiply the shortwave temperature rise distribution factor by the surface heating temperature supplement value to obtain the shortwave temperature rise value, and multiply the longwave temperature rise distribution factor by the surface heating temperature supplement value to obtain the longwave temperature rise value.

[0114] A4, adjust the long-wave band based on the long-wave irradiation time and the long-wave temperature rise value, and then adjust the short-wave band based on the short-wave irradiation time and the short-wave temperature rise value.

[0115] It should be noted that short-wave UV light is mainly used for rapid surface curing reaction due to its high photon energy and strong surface absorption efficiency. Long-wave UV light can penetrate deep into the adhesive layer and activate deep curing reaction due to its large penetration depth and low scattering loss.

[0116] See Figure 2 As shown, the second aspect of the present invention provides a method for controlling a curing process of a double-sided peelable adhesive tape, comprising the following steps:

[0117] S1, record the double-sided removable tape that performs the tape curing process as the target tape, analyze the UV penetration consistency factor of the target tape, thereby determining the internal and external curing uniformity information of the adhesive layer, and perform internal supplementary curing of the target tape.

[0118] S2, after the target tape is cured internally, the adjustment effect is evaluated, and the curing process is determined to continue with the labeling.

[0119] S3: Analyze the bonding interface reaction completeness score and evaluate the adequacy of the bonding interface chemical reaction.

[0120] S4, after receiving the traceability determination signal, the curing strategy of the target tape is determined in combination with the curing uniformity information of the inner and outer layers of the adhesive layer, thereby completing the curing process of the target tape.

[0121] See Figure 7 As shown, it is a visualization interface of the material production system involved in the embodiment of the present application, through which the temperature and energy distribution of the solidified object of the current system can be monitored.

[0122] The third aspect of the present invention provides a double-sided removable adhesive tape, comprising: coating a pressure-sensitive adhesive on a plastic film substrate, and drying and curing the resultant.

[0123] Pressure-sensitive adhesives include resins, monomers, initiators, expanding microspheres, and solvents.

[0124] It will be understood by those skilled in the art that embodiments of the present invention may be provided as methods, systems, or computer program products. Thus, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0125] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowcharts and / or block diagrams, as well as combinations of processes and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowcharts and / or block diagrams. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0126] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0127] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0128] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0129] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. Double-sided peelable tape curing process control system, characterized in that: The following steps are involved: A UV irradiation adjustment module is used to record the double-sided removable tape undergoing the tape curing process as the target tape, analyze the UV penetration consistency factor of the target tape, thereby determining the curing uniformity information inside and outside the adhesive layer, and perform internal supplementary curing of the target tape; a curing process continuation determination module, configured to evaluate the adjustment effect after the internal portion of the target tape has been additionally cured, thereby determining whether the curing process should continue to be executed; Reaction sufficiency assessment module, used to analyze the bonding interface reaction completeness score and conduct bonding interface chemical reaction sufficiency assessment; The curing strategy determination module is used to determine the curing strategy of the target tape based on the curing uniformity information inside and outside the adhesive layer after receiving the traceability judgment signal, thereby completing the curing process of the target tape.

2. The double-sided peelable tape curing process control system according to claim 1, characterized in that: The specific analysis method for determining the curing uniformity information inside and outside the adhesive layer is as follows: Collect photothermal curing data, including surface reflectivity, internal transmittance, UV energy density, and temperature gradient; Analyze UV ​​penetration consistency factors based on photothermal curing data; The UV penetration consistency factor is a quantitative indicator of the influence of surface reflectivity, internal transmittance, UV energy density, and temperature gradient on the uniformity of curing inside and outside the target tape adhesive layer. The specific analysis process is as follows: internal transmittance and surface reflectivity are compared, UV energy density is compared with the corresponding reference value, and the reference value of temperature gradient is compared with the temperature gradient. The results of each comparison are coupled with the corresponding distribution coefficient to obtain the UV penetration consistency factor. Extract the UV penetration consistency threshold preset in the database; If the UV penetration consistency factor is greater than or equal to the UV penetration consistency threshold, the curing uniformity information inside and outside the adhesive layer is recorded as uniform curing; If the UV penetration consistency factor is less than the UV penetration consistency threshold, the curing uniformity information inside and outside the adhesive layer is recorded as non-uniform curing.

3. The double-sided peelable tape curing process control system according to claim 2, characterized in that: The specific analysis process of the internal supplementary curing of the target tape is as follows: If the curing uniformity information inside and outside the adhesive layer is non-uniform curing, the UV penetration consistency threshold and the UV penetration consistency factor are subtracted to obtain the UV penetration consistency deviation factor; Extracting UV irradiation parameter adjustment set based on UV penetration consistency deviation factor; The UV irradiation parameter adjustment set includes a UV power supplement value and an exposure time supplement value; The internal supplementary curing of the target tape is performed based on the UV irradiation parameter adjustment set.

4. The double-sided peelable tape curing process control system according to claim 1, characterized in that: The determination and curing process continues to execute the tag, and the specific process is as follows: Re-obtain UV penetration consistency factor; If the re-acquired UV penetration consistency factor is less than or equal to the UV penetration consistency threshold, the curing process is marked as continuing to execute as stopping the curing process, and a prompt message is generated simultaneously; If the re-obtained UV transmittance consistency factor is greater than the UV transmittance consistency threshold, the internal transmittance of the target tape is continuously monitored within a preset time window to obtain a decrease value of the internal transmittance of the target tape; If the internal transmittance drop value of the target tape is greater than or equal to the preset internal transmittance drop threshold, the curing process is marked as stopped and a prompt message is generated simultaneously; If the internal transmittance reduction value of the target tape is less than the preset internal transmittance reduction threshold, the curing process continuation tag is recorded as continuing the curing process.

5. The double-sided peelable tape curing process control system according to claim 1, characterized in that: The analysis of the bonding interface reaction completeness score is as follows: When the curing process continues to be executed with the label "Continue to execute the curing process", the curing process of the target tape is continued, each sample tape is extracted according to the preset number of samples, and the interface reaction integrity data of each sample tape is collected; The interface reaction integrity data include surface tension, residual functional group absorption peak, boundary layer residual glue thickness and average reaction temperature; Analyze the bonding interface reaction completeness score based on the interface reaction integrity data; The bonding interface reaction completeness score is a quantitative indicator of the degree to which surface tension, residual functional group absorption peak, boundary layer residual glue thickness and average reaction temperature jointly influence the completeness of the interfacial chemical reaction between the adhesive layer and the peeling layer of the target tape. The specific analysis process is as follows: comparing the surface tension with the corresponding reference value, comparing the reference values ​​of the residual functional group absorption peak and the boundary layer residual glue thickness with the residual functional group absorption peak and the boundary layer residual glue thickness, respectively, performing deviation processing on the average reaction temperature and the ideal reaction temperature, and coupling processing the comparison and deviation processing results with the corresponding distribution coefficient to obtain the bonding interface reaction completeness score.

6. The double-sided peelable tape curing process control system according to claim 5, characterized in that: The specific analysis process for evaluating the adequacy of the chemical reaction at the bonding interface is as follows: Traverse each sample tape in turn, count and extract the bonding interface reaction completeness score of each sample tape, and perform average processing to obtain the average bonding interface reaction completeness score; Extracting the bonding interface reaction completeness score threshold preset in the database; If the bonding interface reaction completeness score mean is greater than the bonding interface reaction completeness score threshold, the bonding interface chemical reaction sufficiency assessment result is recorded as bonding interface complete reaction, and the subsequent process continues; If the bonding interface reaction completeness score mean is less than or equal to the bonding interface reaction completeness score threshold, the bonding interface chemical reaction sufficiency assessment result is recorded as an incomplete bonding interface reaction, and a retrospective judgment signal is generated simultaneously.

7. The double-sided peelable tape curing process control system according to claim 1, characterized in that: The target tape curing strategy is determined by combining the curing uniformity information inside and outside the adhesive layer. The specific analysis process is as follows: After receiving the traceability judgment signal, if the curing uniformity information of the internal and external surfaces of the adhesive layer indicates uniform curing, the target tape curing strategy is recorded as stopping the current curing process, and a warning prompt message is generated simultaneously; If the curing uniformity information inside and outside the adhesive layer is non-uniform curing, the target tape curing strategy is recorded as a segmented control interface reaction adjustment process.

8. The double-sided peelable tape curing process control system according to claim 7, characterized in that: The specific analysis process of the segmented control interface reaction adjustment process is as follows: Extract the correction factor of bonding interface reaction completeness based on UV penetration consistency factor; The bond interface reaction completeness correction score was analyzed based on the bond interface reaction completeness score mean and the bond interface reaction completeness correction factor; The bonding interface reaction completeness correction score is a quantitative indicator of the degree of influence of the bonding interface reaction completeness score mean and the bonding interface reaction completeness correction factor on the corrected bonding interface reaction completeness. The specific analysis process is: based on the bonding interface reaction completeness correction factor, the bonding interface reaction completeness score mean is corrected to obtain the bonding interface reaction completeness correction score; Extracting the interface reaction adjustment set based on the bond interface reaction completeness correction score; The interface reaction adjustment set includes a surface heating temperature supplement value and a UV irradiation time supplement value; A multi-band UV irradiation process is set based on the interface reaction adjustment set, thereby completing the segmented control of the interface reaction adjustment process.

9. A method for controlling a curing process of a double-sided peelable adhesive tape according to any one of claims 1 to 8, characterized in that: include: S1, recording the double-sided removable tape undergoing the tape curing process as the target tape, analyzing the UV penetration consistency factor of the target tape, thereby determining the curing uniformity information of the inner and outer layers of the adhesive layer, and performing internal supplementary curing of the target tape; S2, after the target tape is cured internally, the adjustment effect is evaluated, and the curing process is determined to continue with the labeling; S3, analyze the bonding interface reaction completeness score and evaluate the adequacy of the chemical reaction at the bonding interface; S4, after receiving the traceability determination signal, the curing strategy of the target tape is determined in combination with the curing uniformity information of the inner and outer layers of the adhesive layer, thereby completing the curing process of the target tape.

10. The double-sided removable adhesive tape according to any one of claims 1 to 8, characterized in that: include: It is made by coating pressure-sensitive adhesive on the plastic film substrate and drying and curing it; The pressure-sensitive adhesive comprises resin, monomer, initiator, expanded microspheres and solvent.

Images