Data center chip backboard cooling system with backflow working medium separation function

Abstract

The invention provides a data center chip backboard cooling system with a backflow working medium separation function, and the system comprises a condensation unit which is configured to carry out condensation processing on a refrigeration working medium; the refrigeration working medium comprises liquid carbon dioxide and / or liquid hypofluoro acid; the liquid cooling unit is configured to perform refrigeration by gasifying the cooling liquid; and the cooling liquid distribution unit is configured to adjust the refrigerating capacity of the liquid cooling unit according to the cooling requirement, perform separation treatment on a backflow working medium of the liquid cooling unit, and convey the separated working medium to the condensation unit for recooling treatment. By means of the system, the problem that an existing data center cooling system lacks a working medium separation function, so that the recooling efficiency of refrigerants becomes low is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioning systems, and in particular to a data center chip backplane cooling system with a reflux working medium separation function. Background Art

[0002] With the rapid development of cloud computing, artificial intelligence, and the Internet of Things (IoT), data center scale and computing power requirements are growing exponentially. Chip power density continues to climb, and data center energy consumption has become a key bottleneck restricting the industry's sustainable development. As a primary source of energy consumption in data centers, traditional cooling solutions face multiple challenges in terms of efficiency, environmental compatibility, and operating costs. Traditional air cooling technology, limited by low air heat transfer efficiency, often relies on high-volume forced convection to dissipate heat from high-power-density chips. This significantly increases fan energy consumption and makes it difficult to effectively mitigate localized heat accumulation.

[0003] Traditional data center cooling systems rely on a hierarchical heat dissipation architecture, which results in significant system performance degradation. The lengthy heat conduction path leads to over-cooling and energy waste, making it difficult for the cooling capacity to meet the heat flux density requirements of high-density chips, and unable to quickly respond to rapid changes in data center server loads.

[0004] In addition, the refrigerant reflux of traditional data center cooling systems cannot separate the liquid and gaseous working fluids, which reduces the re-cooling efficiency of the refrigerant. Summary of the Invention

[0005] The present application provides a data center chip backplane cooling system with a reflux working fluid separation function to solve the problem that existing data center cooling systems lack a working fluid separation function, resulting in low refrigerant re-cooling efficiency.

[0006] The system comprises:

[0007] A condensing unit configured to condense a refrigerant; the refrigerant includes liquid carbon dioxide and / or liquid hypofluoric acid;

[0008] a liquid cooling unit configured to perform cooling by vaporizing the cooling liquid;

[0009] a cooling liquid distribution unit, the cooling liquid distribution unit being configured to adjust the cooling capacity of the liquid cooling unit according to cooling requirements, separate the reflux working fluid of the liquid cooling unit, and deliver the separated working fluid to the condensing unit for re-cooling;

[0010] The coolant distribution unit comprises:

[0011] a high-pressure liquid reservoir, the high-pressure liquid reservoir being connected to the condensing unit and the liquid cooling unit, respectively, and configured to store the coolant;

[0012] A gas-liquid separator is connected to the liquid cooling unit and the condensing unit respectively. The gas-liquid separator is configured to perform gas-liquid separation on the reflux working fluid of the liquid cooling unit and to deliver the separated working fluid to the condensing unit respectively.

[0013] Preferably, the liquid cooling unit comprises:

[0014] A chip cold plate assembly, the chip cold plate assembly being arranged on a chip in a data center, the input end of the chip cold plate assembly being connected to the coolant distribution unit, and the chip cold plate assembly being configured to perform heat exchange and gasification processing on the input coolant;

[0015] A backplate heat exchanger is provided on the chip backplate of the data center, the backplate heat exchanger is connected in parallel with the chip cold plate group, the input end of the backplate heat exchanger is connected to the coolant distribution unit, and the backplate heat exchanger is configured to perform heat exchange and vaporization processing on the input coolant.

[0016] Preferably, the cooling liquid distribution unit further comprises an output pipe assembly, one end of the output pipe assembly is connected to the high-pressure liquid reservoir, and the other end of the output pipe assembly is respectively connected to the chip cold plate group and the back plate heat exchanger in the liquid cooling unit;

[0017] The high-pressure liquid reservoir is further configured to deliver the cooling liquid to the chip cold plate assembly and the back plate heat exchanger through the output pipe assembly.

[0018] Preferably, the output ends of the chip cold plate group and the back plate heat exchanger are both connected to the input end of the gas-liquid separator; the output end of the gas-liquid separator is connected to the condensing unit, and the gas-liquid separator is further configured as follows:

[0019] Separating the liquid refrigerant and the gaseous refrigerant refluxed from the chip cold plate group and the back plate heat exchanger, and delivering the liquid refrigerant and the gaseous refrigerant to the condensing unit through different pipelines;

[0020] The condensing unit is further configured to perform re-cooling treatments of different powers on the liquid refrigerant and the gaseous refrigerant transported by the gas-liquid separator to obtain the cooling liquid.

[0021] Preferably, the coolant distribution unit further comprises a return pipe assembly, and the return pipe assembly comprises a return input pipe and a return output pipe;

[0022] One end of the reflux input pipe is connected to the chip cold plate group and the back plate heat exchanger respectively, and the other end of the reflux input pipe is connected to the gas-liquid separator;

[0023] One end of the reflux output pipe is connected to the high-pressure liquid reservoir, and the other end of the reflux output pipe is connected to the condensing unit.

[0024] Preferably, the cooling liquid distribution unit further comprises an input pipe assembly, one end of the input pipe assembly is connected to the gas-liquid separator, and the other end of the input pipe assembly is connected to the condensing unit.

[0025] Preferably, the output pipe assembly includes a spare pipe, and the spare pipe is configured to be connected to the added liquid cooling unit.

[0026] Preferably, the spare pipeline and the remaining pipelines of the output pipeline assembly are all provided with a working fluid pump, a pressure sensor and a first one-way valve;

[0027] The standby pipeline is also provided with a pressure valve.

[0028] Preferably, a compressor and a second one-way valve are further provided on the reflux output pipeline;

[0029] The return output pipeline further includes a third one-way valve, which is connected in parallel to both ends of the compressor and the second one-way valve.

[0030] As can be seen from the above content, the present application provides a data center chip backplane cooling system with a reflux working fluid separation function, the system including a condensing unit, the condensing unit being configured to condense the refrigerant; the refrigerant including liquid carbon dioxide and / or liquid hypofluoric acid; a liquid cooling unit, the liquid cooling unit being configured to cool by gasifying the coolant; a cooling liquid distribution unit, the cooling liquid distribution unit being connected to the liquid cooling unit and the condensing unit respectively, the cooling liquid distribution unit being configured to adjust the cooling capacity of the liquid cooling unit according to the cooling demand, separating the reflux working fluid of the liquid cooling unit, and delivering the separated working fluid to the condensing unit for re-cooling. The present application solves the problem of the lack of working fluid separation function in existing data center cooling systems, which results in low refrigerant re-cooling efficiency, through the above system. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0032] Figure 1 This is a schematic diagram of a data center chip backplane cooling system with reflux fluid separation function in this application. DETAILED DESCRIPTION

[0033] The following will provide a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0034] It should be noted that the brief descriptions of terms in this application are only for the purpose of facilitating the understanding of the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise specified, these terms should be understood according to their ordinary and usual meanings.

[0035] It should be noted that, in this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described in this application as "exemplary" or "for example" should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0036] Driven by the digital revolution, the deep integration of cloud computing, artificial intelligence, and the Internet of Things (IoT) has spurred the massive growth of data centers worldwide. The surge in demand for massive computing power has driven the continuous increase in server cluster deployment density. The stacking of high-power chips has pushed the heat load of a single rack beyond the boundaries of traditional cooling designs. The resulting energy consumption contradictions have become a core obstacle to the industry's green transformation. Statistics show that energy consumption in data center cooling systems accounts for over 40% of total operating costs, making technological innovation far more urgent than in conventional industrial refrigeration.

[0037] Although traditional air-cooling heat dissipation systems have cost advantages when dealing with low heat flux density scenarios, their core flaw lies in the low specific heat capacity characteristics of the air medium. When the chip power density exceeds the threshold, forced convection heat dissipation needs to rely on multi-stage fan drive, which not only leads to a significant deterioration in the power conversion efficiency, but also forms a local high-temperature dead zone due to the physical limitations of the air turbulence boundary layer. The frequency reduction protection mechanism caused by the heat dissipation delay of some high-computing power nodes directly weakens the overall computing performance of the data center. To alleviate the above contradictions, the industry has tried to introduce indirect liquid cooling solutions to improve the heat exchange efficiency through cold plate contact heat conduction. However, the complex distributor structure design and the problem of controlling the pressure drop of the circulation pipeline have caused the system operation and maintenance costs and failure rate to rise simultaneously.

[0038] Current mainstream data center cooling systems generally utilize a hierarchical thermal management architecture, which exhibits significant energy efficiency degradation along the heat transfer path. Heat energy transfer from the chip package surface to the room-level chiller requires multiple intermediate heat exchange stages. The cumulative thermal resistance of each stage amplifies refrigerant superheat deviations, forcing the system to compensate with excessive cooling to maintain end-user heat dissipation requirements. This "trading space for efficiency" design concept not only results in significant ineffective cooling loss, but also, due to delayed thermal response, struggles to adapt to the rapidly fluctuating dynamic loads of servers. In sudden computing power scheduling scenarios, the system often finds itself in a conflicting state of coexisting local overcooling and global thermal runaway.

[0039] It is worth noting that the refrigerant reflux mechanism of the traditional cooling system lacks an efficient phase separation device, resulting in continuous mixing of the gas-liquid two-phase working fluid during the circulation process. When the unseparated mixed working fluid enters the compression link, the liquid component cannot fully participate in the phase change heat absorption process, resulting in a significant reduction in the utilization rate of the refrigerant latent heat. At the same time, the liquid droplets entrained in the gaseous medium will interfere with the stable operation of the compressor, resulting in a decrease in the system's volumetric efficiency and an increase in additional energy consumption. Although the existing technical system attempts to alleviate the impact of mixed working fluids by optimizing the pipeline layout, it is limited by the lack of a separation mechanism. The system still faces problems such as uncontrolled dryness at the evaporation end and fluctuations in subcooling at the condensation end during variable operating conditions, which seriously affects the re-cooling efficiency of the refrigerant.

[0040] Based on the above problems, the present application provides the following implementation methods.

[0041] Figure 1 This is a schematic diagram of a data center chip backplane cooling system with reflux fluid separation function in this application.

[0042] See also Figure 1 It can be seen that this embodiment provides a data center chip backplane cooling system with a reflux working medium separation function, the system comprising:

[0043] The condensing unit 100 is configured to condense a refrigerant; the refrigerant includes liquid carbon dioxide and / or liquid hypofluoric acid.

[0044] Specifically, in this embodiment, the condensing unit 100 is used to provide the coolant. It can be understood that the condensing unit 100 is a device for liquefying carbon dioxide gas and / or hypofluoric acid gas. The condensing unit 100 converts gaseous carbon dioxide into liquid carbon dioxide, converts gaseous hypofluoric acid into liquid hypofluoric acid, or cools the liquid carbon dioxide and / or liquid hypofluoric acid, thereby realizing the subsequent provision of the coolant.

[0045] The system further comprises:

[0046] The liquid cooling unit 200 is configured to perform cooling by gasifying the cooling liquid.

[0047] Specifically, in this embodiment, the liquid cooling unit 200 is set on the equipment that needs to be cooled in the data center. The liquid cooling unit 200 exchanges heat with the liquid coolant in the pipeline and the external environment, thereby absorbing heat from the external environment, thereby practically regulating the temperature of the external environment.

[0048] The system further comprises:

[0049] The cooling liquid distribution unit 300 is configured to adjust the cooling capacity of the liquid cooling unit 200 according to the cooling demand, separate the reflux working fluid of the liquid cooling unit 200, and deliver the separated working fluid to the condensing unit 100 for re-cooling.

[0050] Specifically, in this embodiment, the coolant distribution unit 300 is used to distribute the coolant and transport it to the liquid cooling unit 200. Taking into account the situation that the reflux working fluid of the liquid cooling unit 200 contains both liquid and gas, it is necessary to separate the two different forms of working fluids before the reflux working fluid can be transported back to the condensing unit 100 for re-cooling treatment. Therefore, the function of working fluid separation is added to the coolant distribution unit 300 to improve the re-cooling efficiency of the reflux working fluid.

[0051] Furthermore, in some embodiments, the coolant distribution unit 300 includes:

[0052] The high-pressure liquid reservoir 310 is connected to the condensing unit 100 and the liquid cooling unit 200 respectively, and is configured to store the cooling liquid.

[0053] Specifically, in this embodiment, the high-pressure liquid reservoir 310 is a component for storing and distributing the coolant. The coolant is delivered to the liquid cooling unit 200 according to different needs through the high-pressure liquid reservoir 310, and when the coolant in the liquid cooling unit 200 is sufficient, a portion of the coolant is stored.

[0054] The coolant distribution unit 300 further includes:

[0055] The gas-liquid separator 320 is connected to the liquid cooling unit 200 and the condensing unit 100 respectively. The gas-liquid separator 320 is configured to perform gas-liquid separation on the reflux working fluid of the liquid cooling unit 200 and to deliver the separated working fluid to the condensing unit 100 respectively.

[0056] Specifically, in this embodiment, the gas-liquid separator 320 is a component for separating the reflux working fluid. The reflux working fluid output by the liquid cooling unit 200 is subjected to gas-liquid separation through the gas-liquid separator 320, so that working fluids in different forms can be transported back to the condensing unit 100 through different pipelines for re-cooling treatment.

[0057] Furthermore, in some embodiments, the liquid cooling unit 200 includes:

[0058] The chip cold plate group 210 is set on the chip of the data center. The input end of the chip cold plate group 210 is connected to the cooling liquid distribution unit 300. The chip cold plate group 210 is configured to perform heat exchange gasification processing on the input cooling liquid.

[0059] The backplane heat exchanger 220 is arranged on the chip backplane of the data center. The backplane heat exchanger 220 is connected in parallel with the chip cold plate group 210. The input end of the backplane heat exchanger 220 is connected to the coolant distribution unit 300. The backplane heat exchanger 220 is configured to perform heat exchange and gasification processing on the input coolant.

[0060] Specifically, in this embodiment, in the temperature regulation of the data center, the chip equipment in the data center is mainly cooled, and the main cooling parts of the chip equipment include the chip body and the backplane of the chip. Therefore, the chip cold plate group 210 is set to cool the chip body. The cooling method is to exchange heat with the external environment and vaporize the liquid coolant, thereby absorbing a large amount of external heat, thereby achieving cooling of the chip body.

[0061] The backplane heat exchanger 220 is provided to cool the chip backplane. The cooling method is also to exchange heat with the external environment and vaporize the liquid coolant to absorb a large amount of external heat, thereby achieving cooling of the chip backplane.

[0062] Furthermore, in some embodiments, the cooling liquid distribution unit 300 further includes an output pipe assembly 330, one end of which is connected to the high-pressure liquid reservoir 310, and the other end of which is respectively connected to the chip cold plate assembly 210 and the back plate heat exchanger 220 in the liquid cooling unit 200;

[0063] The high-pressure liquid reservoir 310 is further configured to deliver the cooling liquid to the chip cold plate assembly 210 and the back plate heat exchanger 220 through the output pipe assembly 330 .

[0064] Specifically, in this embodiment, since the coolant distribution unit 300 needs to adjust the temperature of the liquid cooling unit 200 according to different requirements, it is necessary to set the output pipe assembly 330 for delivering the coolant to the liquid cooling unit 200. When the high-pressure liquid reservoir 310 needs to deliver the coolant to the liquid cooling unit 200, it is only necessary to adjust the opening of the corresponding pipe in the output pipe assembly 330, the size of the valve opening and the rate of delivering the coolant to achieve the distribution of the coolant to the liquid cooling unit 200 according to different needs. Among them, the heat exchange capacity of the chip cold plate group 210 and the backplate heat exchanger 220 in the same liquid cooling unit 200 can also be adjusted by setting corresponding valves on their respective pipes. That is, the heat exchange capacity of different liquid cooling units 200 can be adjusted, and the heat exchange capacity of the chip cold plate group 210 and the backplate heat exchanger 220 in the same liquid cooling unit 200 can also be adjusted.

[0065] Furthermore, in some embodiments, the output ends of the chip cold plate assembly 210 and the back plate heat exchanger 220 are both connected to the input end of the gas-liquid separator 320; the output end of the gas-liquid separator 320 is connected to the condensing unit 100, and the gas-liquid separator 320 is further configured as follows:

[0066] Separating the liquid refrigerant and the gaseous refrigerant refluxed from the chip cold plate assembly 210 and the back plate heat exchanger 220, and delivering the liquid refrigerant and the gaseous refrigerant to the condensing unit 100 through different pipelines;

[0067] The condensing unit 100 is further configured to perform re-cooling treatments of different powers on the liquid refrigerant and the gaseous refrigerant transported by the gas-liquid separator 320 to obtain the cooling liquid.

[0068] Specifically, in this embodiment, after the coolant in the chip cold plate group 210 and the backplate heat exchanger 220 completes a cycle of cooling, it flows back to the gas-liquid separator 320. The gas-liquid separator 320 transports the liquid refrigerant and the gaseous refrigerant to the condensing unit 100 for condensation processing, thereby realizing the secondary utilization of the coolant.

[0069] Furthermore, in some embodiments, the coolant distribution unit 300 further includes a return pipe assembly 340 , and the return pipe assembly 340 includes a return input pipe 341 and a return output pipe 342 ;

[0070] One end of the reflux input pipe 341 is connected to the chip cold plate assembly 210 and the back plate heat exchanger 220 respectively, and the other end of the reflux input pipe 341 is connected to the gas-liquid separator 320;

[0071] One end of the reflux output pipe 342 is connected to the gas-liquid separator 320 , and the other end of the reflux output pipe 342 is connected to the condensing unit 100 .

[0072] Specifically, in this embodiment, since the chip cold plate group 210 and the backplate heat exchanger 220 need to transport the working medium that has completed heat exchange back to the condensing unit 100 through the gas-liquid separator 320, corresponding pipelines are required to complete the transportation of the working medium. Therefore, the return pipe assembly 340 is set, and the chip cold plate group 210 and the backplate heat exchanger 220 are respectively connected to the gas-liquid separator 320 through the return input pipe 341 in the return pipe assembly 340, and the gas-liquid separator 320 is connected to the condensing unit 100 through the return output pipe 342; when the return working medium is transported to the low-pressure circulation assembly 310, the return working medium is pressure-configured and separated by the gas-liquid separator 320, and thus refluxed to the condensing unit 100 through the return output pipe 342 for re-cooling treatment.

[0073] Furthermore, in some embodiments, the cooling liquid distribution unit 300 further includes an input pipe assembly 350 , one end of which is connected to the high-pressure liquid reservoir 310 , and the other end of which is connected to the condensing unit 100 .

[0074] Specifically, in this embodiment, since the condensing unit 100 also needs to use a pipeline to transport the coolant waiting for heat exchange to the high-pressure liquid reservoir 310, the input pipe assembly 350 is set to connect the condensing unit 100 and the high-pressure liquid reservoir 310, thereby constructing a pipeline path for transporting the coolant from the condensing unit 100 to the high-pressure liquid reservoir 310.

[0075] Furthermore, in some embodiments, the output pipe assembly 330 includes a spare pipe 331 , and the spare pipe 331 is configured to be connected to the added liquid cooling unit 200 .

[0076] Specifically, in this embodiment, considering that chip equipment may be added to the data center, it is also necessary to add pipes for connecting more liquid cooling units 200 in this system, so the backup pipe 331 is provided for emergency use.

[0077] Furthermore, in some embodiments, the spare pipeline 331 and the remaining pipelines of the output pipeline assembly 330 are provided with a working fluid pump 332, a pressure sensor 333 and a first one-way valve 334; the spare pipeline 331 is also provided with a pressurizing valve 335;

[0078] The reflux output pipe 342 is further provided with a compressor 343 and a second one-way valve 344;

[0079] The reflux output pipeline 342 further includes a third one-way valve 345 . The third one-way valve 345 is connected in parallel to both ends of the compressor 343 and the second one-way valve 344 .

[0080] Specifically, in this embodiment, since the coolant needs to be pressure-adjusted during transportation in the pipeline so that it can be transported smoothly, the above-mentioned valve is required to adjust the delivery pressure of each pipeline, and the pressure inside the pipeline is detected by the pressure sensor 333, so as to realize real-time monitoring of the condition of each pipeline.

[0081] This embodiment has the following advantages:

[0082] By separating the reflux working fluid and subjecting the working fluid in different forms to different degrees of re-cooling, the re-cooling efficiency is greatly improved, the use of coolant is reduced, and the cooling effect on the data center is improved.

[0083] For ease of explanation, the above description has been made in conjunction with specific embodiments. However, the above discussion of some embodiments is not intended to be exhaustive or to limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations can be obtained. The above embodiments are selected and described to better explain the content of this disclosure, thereby enabling those skilled in the art to better use the embodiments.

Claims

1. A data center chip backplane cooling system with reflux medium separation function, characterized in that: The system comprises: A condensing unit (100), the condensing unit (100) being configured to condense a refrigerant; the refrigerant comprising liquid carbon dioxide and / or liquid hypofluoric acid; a liquid cooling unit (200), the liquid cooling unit (200) being configured to perform cooling by gasifying the cooling liquid; A cooling liquid distribution unit (300), the cooling liquid distribution unit (300) being configured to adjust the refrigeration capacity of the liquid cooling unit (200) according to cooling requirements, separate the reflux working fluid of the liquid cooling unit (200), and deliver the separated working fluid to the condensing unit (100) for re-cooling; The cooling liquid distribution unit (300) comprises: a high-pressure liquid reservoir (310), the high-pressure liquid reservoir (310) being connected to the condensing unit (100) and the liquid cooling unit (200), respectively, and the high-pressure liquid reservoir (310) being configured to store the cooling liquid; A gas-liquid separator (320) is connected to the liquid cooling unit (200) and the condensing unit (100) respectively. The gas-liquid separator (320) is configured to perform gas-liquid separation on the reflux working medium of the liquid cooling unit (200) and to deliver the separated working medium to the condensing unit (100).

2. A data center chip backplane cooling system with reflux medium separation function according to claim 1, characterized in that: The liquid cooling unit (200) comprises: A chip cold plate group (210), the chip cold plate group (210) is arranged on a chip in a data center, an input end of the chip cold plate group (210) is connected to the cooling liquid distribution unit (300), and the chip cold plate group (210) is configured to perform heat exchange gasification processing on the input cooling liquid; A backplane heat exchanger (220) is provided on a chip backplane of a data center, the backplane heat exchanger (220) is connected in parallel with the chip cold plate group (210), an input end of the backplane heat exchanger (220) is connected to the cooling liquid distribution unit (300), and the backplane heat exchanger (220) is configured to perform heat exchange and gasification processing on the input cooling liquid.

3. A data center chip backplane cooling system with reflux medium separation function according to claim 2, characterized in that: The cooling liquid distribution unit (300) further comprises an output pipe assembly (330), one end of the output pipe assembly (330) being connected to the high-pressure liquid reservoir (310), and the other end of the output pipe assembly (330) being respectively connected to the chip cold plate group (210) and the back plate heat exchanger (220) in the liquid cooling unit (200); The high-pressure liquid reservoir (310) is further configured to deliver the cooling liquid to the chip cold plate assembly (210) and the back plate heat exchanger (220) through the output pipe assembly (330).

4. A data center chip backplane cooling system with reflux medium separation function according to claim 3, characterized in that: The output ends of the chip cold plate group (210) and the back plate heat exchanger (220) are both connected to the input end of the gas-liquid separator (320); the output end of the gas-liquid separator (320) is connected to the condensing unit (100), and the gas-liquid separator (320) is further configured as follows: Separating the liquid refrigerant and the gaseous refrigerant refluxed from the chip cold plate group (210) and the back plate heat exchanger (220), and delivering the liquid refrigerant and the gaseous refrigerant to the condensing unit (100) through different pipelines; The condensing unit (100) is further configured to perform re-cooling treatments of different powers on the liquid refrigerant and the gaseous refrigerant transported by the gas-liquid separator (320) to obtain the cooling liquid.

5. The data center chip backplane cooling system with reflux medium separation function according to claim 4, characterized in that: The cooling liquid distribution unit (300) further comprises a return pipe assembly (340), wherein the return pipe assembly (340) comprises a return input pipe (341) and a return output pipe (342); One end of the reflux input pipe (341) is connected to the chip cold plate group (210) and the back plate heat exchanger (220), respectively, and the other end of the reflux input pipe (341) is connected to the gas-liquid separator (320); One end of the reflux output pipe (342) is connected to the gas-liquid separator (320), and the other end of the reflux output pipe (342) is connected to the condensing unit (100).

6. A data center chip backplane cooling system with reflux medium separation function according to claim 5, characterized in that: The cooling liquid distribution unit (300) further comprises an input pipe assembly (350), one end of the input pipe assembly (350) being connected to the high-pressure liquid reservoir (310), and the other end of the input pipe assembly (350) being connected to the condensing unit (100).

7. A data center chip backplane cooling system with reflux medium separation function according to claim 6, characterized in that: The output pipe assembly (330) includes a spare pipe (331), and the spare pipe (331) is configured to be connected to the added liquid cooling unit (200).

8. The data center chip backplane cooling system with reflux medium separation function according to claim 7, characterized in that: The spare pipeline (331) and the remaining pipelines of the output pipeline assembly (330) are all provided with a working fluid pump (332), a pressure sensor (333) and a first one-way valve (334); The standby pipeline (331) is also provided with a pressurizing valve (335).

9. The data center chip backplane cooling system with reflux medium separation function according to claim 7, characterized in that: The reflux output pipe (342) is further provided with a compressor (343) and a second one-way valve (344); The return output pipeline (342) further includes a third one-way valve (345), and the third one-way valve (345) is connected in parallel to both ends of the compressor (343) and the second one-way valve (344).

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