Load isolation type power supply module aging device and design method thereof

Abstract

The invention discloses a load isolation type power supply module aging device and a design method thereof, and belongs to the field of aging tests. The clamp plate and the load plate are separately designed, and the clamp plate is in butt joint with the applicable load plate through the golden fingers, so that the flexibility of the matching plate is ensured, the design time and the purchase cost are reduced, and the test efficiency is improved. According to the invention, the influence of load resistor heating on the power module circuit is effectively reduced, and the accuracy and safety of module circuit test are guaranteed; aiming at the performance of a module circuit, compatibility design is carried out on different output paths of the same package, so that the burn-in test can be carried out by using the same board during single-path output or double-path output, and the reuse rate of the clamp board is improved. The load board simultaneously comprises a state monitoring module, has the functions of monitoring output voltage, alarming abnormity and storing, and ensures high reliability of the test.

Description

Technical Field

[0001] This invention relates to the field of aging test technology, and in particular to a load-isolated power module aging device and its design method. Background Technology

[0002] A power module aging device refers to a support structure used in the aging test of power module circuits with a power of 20W or more to provide electrical connections between the module circuits and components.

[0003] Generally, power module curing equipment requires custom board design based on the packaging and power requirements of the curing test plan. This includes module fixtures, load circuits, filter capacitors, temperature monitoring, and output monitoring terminals suitable for the circuit. Unlike integrated circuit curing boards, power module circuits have larger packages, higher power ratings, and require larger load resistors. Therefore, for the same area, power module curing boards can accommodate fewer workstations and are more expensive. Furthermore, when conducting curing tests on the same package but different power ratings, a new curing board must be designed for load resistor matching, consuming a significant portion of time and manpower, and multiplying hardware costs. Simultaneously, the heat from the power module and the load resistor interacts, increasing the difficulty of temperature control and potentially causing circuit damage.

[0004] Traditional power module circuit aging device design methods often employ a one-to-one design between the module circuit test requirements and the test board. When the same circuit needs to be tested for different power levels, even if only the load resistance is different, the test board needs to be redesigned and manufactured. There is a high proportion of repetitive labor and material consumption in the fixture, component, and monitoring terminal parts, resulting in high efficiency and low cost. Furthermore, since the module circuit and the load resistor are on the same board and close to each other, both the module circuit and the load resistor generate a lot of heat during power testing, which can easily cause mutual temperature interference, making it difficult to control the test temperature of the module circuit and damaging the circuit. When performing single-channel and dual-channel tests, separate boards still need to be made, which is not conducive to cost control and storage management. Summary of the Invention

[0005] The purpose of this invention is to provide a load-isolated power module aging device and its design method to solve the problems in the background art.

[0006] To address the aforementioned technical problems, this invention provides a load-isolated power module aging device and its design method, comprising:

[0007] Step S1: Design a power module aging test board, including the power module under test, fixture board, load board, status monitoring module, and adapter module;

[0008] Step S2: The fixture board includes a fixture part of the power module, an external capacitor part, and a gold finger adapter part. After receiving the test board request, the package of the power module under test is analyzed to confirm whether there is a fixture board with a corresponding package.

[0009] Step S3: If a fixture board is available, proceed directly to step S4; if no fixture board is available, the fixture needs to be customized for the package. The fixture part, the peripheral capacitor part, and the gold finger adapter module are designed according to the fixture package design; the gold finger adapter module includes all output ports, temperature monitoring ports, and power ports.

[0010] Step S4: If the required resistance value of the load board is available, proceed directly to step S5; if the required resistance value of the load board is not available, design the load board. The load board includes a load resistor section, a status monitoring module, and a gold finger adapter module. The load resistor section is a load resistor section that matches the power of the power module. The status monitoring module includes a voltage output monitoring port and a power module monitoring port. The gold finger adapter module should include all output ports, a temperature monitoring port, and a power port.

[0011] Step S5: Connect the fixture board and the load board using the gold finger adapter module to achieve one-to-one matching of the output port, temperature monitoring port, and power port.

[0012] Step S6: The output voltage and circuit temperature of the power module are monitored in real time during the test using the status monitoring module. An alarm is triggered when there is an abnormality, and data is stored.

[0013] In one embodiment, the load board and the fixture board are connected by gold fingers to provide corresponding power to the power supply module under test on the fixture board. After receiving the power, the power supply module under test outputs a corresponding level to the output monitoring terminal on the load board.

[0014] In one embodiment, the silkscreen markings on the fixture plate include the packaging information of the power module, ensuring that the project information is accurate and clear; the silkscreen markings on the load plate include the load resistor value information, ensuring that the corresponding load plate can be effectively matched when needed.

[0015] A load-isolated power module aging device includes a fixture plate, a load plate, and a power module aging test chamber.

[0016] The fixture plate includes a fixture part for the power module, an external capacitor part, and a gold finger adapter part; the fixture part ensures the stability and reliability of the contact of the power module under test during the test, and the gold finger adapter part includes all output ports, temperature monitoring ports, and power ports;

[0017] The load board includes a load resistor section, a status monitoring module, and a gold finger adapter module. The load resistor section is used to provide load resistance during power module testing, ensuring that the power required for power module testing matches the load resistance value, and ensuring that the test conditions meet the power supply requirements of the power module.

[0018] The power module aging test chamber is used for the effective connection between the load plate and the fixture plate during the aging test. It also supports the fixture plate and the load plate to be stable and firm, and simulates the test environment conditions of the product, providing the required electrical and thermal stress to the fixture plate and the required electrical stress to the load plate.

[0019] In one embodiment, the gold finger adapter is used to connect to the output end of the fixture pin, the temperature controller connection end, and the power supply end, ensuring that the position and sequence of each gold finger port are absolutely consistent, so that the electrical connection of the aging test scheme is accurate.

[0020] In one embodiment, the power supply terminal is used to transmit the electrical stress provided by the power module aging test chamber to the fixture plate and load plate. The status monitoring module is used to monitor, display and store the output voltage and circuit temperature of the power module in real time during the test process, and also has an alarm function in case of abnormality, making the aging test more controllable and reliable.

[0021] In one embodiment, the fixture plate is designed with connection layouts for single and dual power modules under different test states, to be compatible with two different electrical connection methods during the test process and to cover the power requirements of the aging test; the status monitoring module in the load board displays the output voltage value and module circuit temperature value in real time, and performs data storage and abnormal alarms, so that the test process is controllable.

[0022] In one embodiment, the power module under test is connected to a fixture plate via a custom fixture.

[0023] In one embodiment, the fixture plate is connected to the load plate via a gold finger adapter to form the electrical circuit of the aging test scheme.

[0024] This invention provides a load-isolated power module aging device and its design method. It achieves separate design of the fixture board and load board for the same circuit with different power ratings. The fixture board connects to the appropriate load board via gold fingers, ensuring the flexibility of the matching board, reducing design time and procurement costs, and improving testing efficiency. This invention effectively reduces the impact of load resistor heating on the power module circuit, ensuring the accuracy and safety of module circuit testing. For module circuit performance, it designs for compatibility of different output channels within the same package, ensuring that the same board can be used for aging tests with single or dual outputs, improving the fixture board reuse rate. The load board of this invention also includes a status monitoring module with output voltage monitoring, abnormal alarm, and storage functions, ensuring high testing reliability. Attached Figure Description

[0025] Figure 1 A flowchart illustrating the design method of the load-isolated power module aging device provided by the present invention.

[0026] Figure 2 The structural diagram of the load-isolated power module aging device provided by the present invention is shown. Detailed Implementation

[0027] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, provides a further detailed explanation of the load-isolated power module aging device and its design method proposed in this invention. The advantages and features of this invention will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this invention.

[0028] One embodiment of the present invention provides a design method for a load-isolated power module aging device, the process of which is as follows: Figure 1 As shown, it includes the following steps:

[0029] Step S1: Design a power module aging test board, including the power module under test, a fixture board, a load board, a status monitoring module, and an adapter module. Connect the load board and the fixture board with gold fingers. Provide the corresponding power to the power module under test on the fixture board. After receiving the power, the power module under test outputs the corresponding level to the output monitoring terminal on the load board.

[0030] Step S2: The fixture board includes the fixture part of the power module, the external capacitor part, and the gold finger adapter part. After receiving the test board request, the package of the power module under test is analyzed to confirm whether there is a fixture board with a corresponding package. If there is no fixture board, the fixture needs to be customized for the package, and all external components (external capacitor part) and gold finger adapters (excluding the load resistor) need to be designed. If a fixture board with an existing package exists, the subsequent step S3 will be skipped, thus avoiding the repeated purchase of fixtures and the design and manufacture of test boards, avoiding unnecessary waste.

[0031] Step S3: After step S2 is initiated, customize the fixture for the package, and design the fixture part, peripheral capacitor part, and gold finger adapter module according to the fixture package design. At the same time, the silkscreen markings must include the package information of the power module to ensure that the project information is accurate and clear. The gold finger adapter module should include all output ports (one or two positive outputs, negative outputs, and a common terminal), temperature monitoring port, and power port to ensure the compatibility of the fixture board.

[0032] Step S4: After step S3 is completed, the load board needs to be designed. If a load board with the required resistance value already exists, step S4 can be skipped. The load board should include a load resistor section, a status monitoring module, and a gold finger adapter module. The silkscreen markings must include the load resistor value information to ensure effective matching with the appropriate load board when needed. The load resistor section should be matched to the power of the power module. The status monitoring module includes a voltage output monitoring port and a power module monitoring port. The gold finger adapter module should include all output ports (one or two positive outputs, negative outputs, and a common terminal), a temperature monitoring port, and a power port to ensure effective connection and strict matching between the load board and the fixture board.

[0033] Step S5: Connect the fixture board and the load board using the gold finger adapter module to achieve one-to-one matching of the output port, temperature monitoring port, and power port, ensuring effective port connection and level transmission.

[0034] Step S6: The output voltage and circuit temperature of the power module are monitored in real time during the power module test using the status monitoring module. An alarm is triggered when an abnormality is detected, and the data is stored. Step S6 effectively avoids the risk that abnormalities in the power module test process cannot be detected in time by humans, ensuring the reliability and traceability of the power module test process.

[0035] As another embodiment of the present invention, such as Figure 2As shown, a load-isolated power module curing device is provided. The power module curing device includes a fixture plate, a load plate, and a power module curing test chamber. The fixture plate includes a clamping part for the power module, an external capacitor part, and a gold finger adapter part. The clamping part can ensure the stability and reliability of the contact of the power module under test during the test. The gold finger adapter part includes all output ports (one or two positive outputs, negative outputs, and a common terminal), a temperature monitoring port, and a power port.

[0036] The load board includes a load resistor section, a status monitoring module, and a gold finger adapter module. The load resistor section is used to provide load resistance during power module testing, ensuring that the power required for the power module test matches the load resistance value, and guaranteeing that the test conditions meet the power supply requirements of the power module.

[0037] The power module aging test chamber is used for the effective connection between the load plate and the fixture plate during aging tests. It also supports the fixture plate and the load plate to be stable and firm, and simulates the test environment conditions of the product, providing the required electrical and thermal stress to the fixture plate and the required electrical stress to the load plate.

[0038] Furthermore, the power module under test is connected to the fixture board via a custom-made fixture. The fixture board is connected to the load board via a gold finger adapter, forming the electrical circuit of the aging test scheme.

[0039] The gold finger adapter is used to connect to the output terminals of the fixture pins (one or two positive outputs, negative outputs, and a common terminal), the temperature controller connection terminal, and the power supply terminal. It should be ensured that the position and sequence of each gold finger port are absolutely consistent to ensure that the electrical connection of the aging test scheme is accurate.

[0040] The power supply terminal transmits the electrical stress provided by the power module aging test chamber to the fixture plate and load plate. The status monitoring module monitors, displays, and stores the output voltage and circuit temperature in real time during the power module test, and also has an alarm function in case of abnormality, making the aging test more controllable and reliable.

[0041] In this embodiment, the core component of the fixture board is the connection layout for both single and dual-channel power modules under different test conditions. This design accommodates two different electrical connection methods during the test and covers the power requirements of the aging test. The core component of the load board design is the design and display of the status monitoring module. This module needs to display the output voltage and module circuit temperature values ​​in real time, as well as store data and provide alarms for any abnormalities, ensuring controllability of the test process.

[0042] The load board resistor value should have a sufficiently high power rating. For the same resistance value, the power rating should be increased to 20W so that the board can be used for aging tests of any load ≤20W, thereby improving the compatibility of the load resistor. The resistance value information should be silkscreened and recorded in a table to form a searchable file.

[0043] When designing the load resistor, it should be kept at a certain distance from the monitoring module so that the monitoring module is not affected by the heat generated by the load resistor and can perform its monitoring function normally.

[0044] By using a design method involving a fixture board, a load board, and an adapter module, the fixture board and load board are inserted into the corresponding interface of the power module aging test chamber via the adapter module. The chip is then placed in the fixture, and the chip can be subjected to the corresponding aging test and process monitoring.

[0045] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A design method for a load-isolated power module aging device, characterized in that, include: Step S1: Design a power module aging test board, including the power module under test, fixture board, load board, status monitoring module, and adapter module; Step S2: The fixture board includes a fixture part of the power module, an external capacitor part, and a gold finger adapter part. After receiving the test board request, the package of the power module under test is analyzed to confirm whether there is a fixture board with a corresponding package. Step S3: If there is a fixture board, proceed directly to step S4; if there is no fixture board, the fixture needs to be customized for the package, and the fixture part, peripheral capacitor part and gold finger adapter module are designed according to the fixture package design. The gold finger adapter module includes all output ports, temperature monitoring ports, and power ports; Step S4: If the required resistance value of the load board is available, proceed directly to step S5; if the required resistance value of the load board is not available, design the load board. The load board includes a load resistor section, a status monitoring module, and a gold finger adapter module. The load resistor section is a load resistor section that matches the power of the power module. The status monitoring module includes a voltage output monitoring port and a power module monitoring port. The gold finger adapter module should include all output ports, a temperature monitoring port, and a power port. Step S5: Connect the fixture board and the load board using the gold finger adapter module to achieve one-to-one matching of the output port, temperature monitoring port, and power port. Step S6: The output voltage and circuit temperature of the power module are monitored in real time during the test using the status monitoring module. An alarm is triggered when there is an abnormality, and data is stored.

2. The design method of the load-isolated power module aging device as described in claim 1, characterized in that, The load board and the fixture board are connected by gold fingers to provide corresponding power to the power supply module under test on the fixture board. After receiving the power, the power supply module under test outputs the corresponding level to the output monitoring terminal on the load board.

3. The design method of the load-isolated power module aging device as described in claim 1, characterized in that, The silkscreen markings on the fixture plate contain the packaging information of the power module, ensuring that the project information is accurate and clear; the silkscreen markings on the load plate contain the load resistor value information, ensuring that the corresponding load plate can be effectively matched when needed.

4. A load-isolated power module aging device, characterized in that, Includes fixture board, load board, and power module aging test chamber; The fixture plate includes a fixture part for the power module, an external capacitor part, and a gold finger adapter part; the fixture part ensures the stability and reliability of the contact of the power module under test during the test, and the gold finger adapter part includes all output ports, temperature monitoring ports, and power ports; The load board includes a load resistor section, a status monitoring module, and a gold finger adapter module. The load resistor section is used to provide load resistance during power module testing, ensuring that the power required for power module testing matches the load resistance value, and ensuring that the test conditions meet the power supply requirements of the power module. The power module aging test chamber is used for the effective connection between the load plate and the fixture plate during the aging test. It also supports the fixture plate and the load plate to be stable and firm, and simulates the test environment conditions of the product, providing the required electrical and thermal stress to the fixture plate and the required electrical stress to the load plate.

5. The load-isolated power module aging device as described in claim 4, characterized in that, The gold finger adapter is used to connect to the output end of the pins of the fixture part, the temperature controller connection port, and the power port, ensuring that the position and sequence of each gold finger port are absolutely consistent, so that the electrical connection of the aging test scheme is accurate.

6. The load-isolated power module aging device as described in claim 5, characterized in that, The power supply terminal is used to transmit the electrical stress provided by the power module aging test chamber to the fixture plate and load plate. The status monitoring module is used to monitor, display and store the output voltage and circuit temperature of the power module in real time during the test process. It also has an alarm function when there is an abnormality, making the aging test more controllable and reliable.

7. The load-isolated power module aging device as described in claim 4, characterized in that, The fixture plate is designed with connection layouts for single and dual power modules under different test states, to be compatible with two different electrical connection methods during the test process, and to cover the power supply requirements of aging tests; the status monitoring module in the load board displays the output voltage value and module circuit temperature value in real time, and performs data storage and abnormal alarms, making the test process controllable.

8. The load-isolated power module aging device as described in claim 4, characterized in that, The power module under test is connected to the fixture plate via a custom fixture.

9. The load-isolated power module aging device as described in claim 4, characterized in that, The fixture plate is connected to the load plate via a gold finger adapter to form the electrical circuit of the aging test scheme.

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