Fault early warning detection system for notebook mainboard

Abstract

The invention discloses a fault early warning detection system for a notebook mainboard, and relates to the technical field of electronic detection. The signal acquisition module is used for acquiring temperature and vibration acceleration signals of a main board BGA welding spot; the damage characteristic calculation module is used for calculating the heat effect index and the vibration intensity of the welding spot; the crack prediction module is used for constructing a crack dynamic function based on the thermal effect index and the vibration intensity and calculating the crack growth degree; the risk assessment module is used for calculating a comprehensive risk prediction value according to the crack growth degree in combination with the temperature and the vibration sudden change rate; the root cause analysis module is used for identifying dominant failure factors through a gradient analysis method and outputting failure mode classification; and the dynamic suppression module is used for dynamically adjusting heat, vibration or creep coping measures of the welding spots based on failure mode classification. Through thermal-mechanical coupling damage extraction, crack dynamic modeling and multi-parameter risk grade assessment capabilities, welding spot early damage identification and operation risk early warning can be realized.

Description

Technical Field

[0001] This invention relates to the field of electronic testing technology, specifically a fault early warning and detection system for notebook motherboards. Background Technology

[0002] As laptops become thinner, lighter, and more high-performance, BGA solder joints on motherboards face a more complex thermo-coupling stress environment, making them prone to reliability issues such as crack propagation, solder joint fatigue, and creep failure. Current technologies often rely on periodic manual inspection or simple temperature monitoring, which makes it difficult to achieve early identification of minute solder joint damage and differentiation of failure modes.

[0003] Furthermore, traditional fault early warning methods typically rely on a single physical quantity and lack a multi-source fusion damage modeling mechanism. This makes them ill-equipped to handle complex dynamic disturbances under real-world operating conditions, resulting in untimely warnings, high false alarm and false negative rates, and an inability to meet the demands of high-reliability applications. Therefore, there is an urgent need for an intelligent early warning system that combines multi-physical quantity sensing information with a crack dynamics model to achieve real-time assessment, root cause identification, and proactive suppression control of weld joint damage. Summary of the Invention

[0004] Based on the shortcomings of the prior art described above, the purpose of this invention is to provide a fault early warning and detection system for notebook motherboards to solve the aforementioned technical problems.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a fault early warning and detection system for notebook motherboards, comprising: Signal acquisition module: Used to acquire temperature and vibration acceleration signals of the motherboard BGA solder joints in real time through sensors; Damage characteristic calculation module: used to calculate the thermal effect index and vibration intensity of the weld joint based on the collected temperature signal and vibration acceleration signal, respectively; Crack prediction module: used to construct crack dynamics functions based on thermal effect index and vibration intensity, and calculate crack growth rate; Risk assessment module: used to calculate the comprehensive risk prediction value based on crack growth rate, combined with temperature abrupt change rate and vibration transient rate; Root Cause Analysis Module: Used to calculate the contribution weights of thermal effect index, vibration intensity and creep damage rate to the comprehensive risk prediction value through gradient analysis method, identify the dominant failure factors, and output failure mode classification. Dynamic suppression module: Used to dynamically adjust the thermal load, vibration compensation strategy or creep control measures of the solder joint based on the failure mode classification results.

[0006] The present invention is further configured such that the damage feature calculation module includes: The temperature fluctuation and temperature rise rate are calculated based on the collected temperature signal, and the thermal effect index of the solder joint is calculated based on the temperature fluctuation and temperature rise rate. The vibration spectrum is obtained by Fourier transforming the collected vibration acceleration signal, and the vibration intensity is calculated based on the vibration spectrum.

[0007] The present invention is further configured such that the crack prediction module includes: The thermal effect index and vibration intensity are used as coupling driving factors for crack propagation to construct a crack dynamics function; The creep damage rate is calculated based on the equivalent stress and creep characteristic time, and used as the input to the crack growth rate calculation model; By introducing a time-increase factor into the crack growth rate calculation model, the change in crack propagation rate caused by time evolution is dynamically simulated. The crack growth rate is calculated by integrating the product of the crack kinetic function, creep damage rate, and time increment factor in the time domain.

[0008] The present invention is further configured to generate a residual metric based on the measured value of crack growth degree and the absolute deviation of crack growth degree; Calculate the partial derivative of the residual measure with respect to the time-incrementing factor coefficient to generate sensitivity weights; The coefficients of the time-incrementing factor are updated iteratively and weighted according to the sensitivity weight and the preset learning rate. Perform a physical rationality check on the updated time increment factor coefficients.

[0009] The present invention is further configured such that the risk assessment module includes: The vibration intensity is subjected to a first-order time-domain differential operation to generate the vibration transient rate. Based on the power-law relationship between crack propagation degree and crack propagation threshold, and combined with the crack propagation index weighting coefficient, a crack propagation risk component is generated. Based on the vibration transient rate, an exponential amplification function is constructed through the vibration transient sensitivity coefficient to generate the vibration transient risk component; Based on the temperature mutation rate, an exponential amplification function is constructed using the temperature mutation sensitivity coefficient to generate a temperature mutation risk component; The comprehensive risk prediction value is calculated by using the crack propagation risk component, vibration transient risk component, and temperature sudden change risk component.

[0010] The present invention is further configured to classify and determine the comprehensive risk prediction value based on a preset safety threshold, and implement a three-level early warning mechanism, wherein the three-level early warning mechanism includes: When the comprehensive risk prediction value is less than the first preset safety threshold, the system determines that the solder joint is in a safe state, maintains the basic sampling rate of the sensor, and continues to record the operating data. When the comprehensive risk prediction value is greater than or equal to the first preset safety threshold and less than the second preset safety threshold, the system determines that the solder joint is in an early warning state, generates a first early warning signal, increases the sensor sampling frequency, and triggers the output of visual early warning information and the log marking mechanism. When the comprehensive risk prediction value is greater than or equal to the second preset safety threshold, the system determines that the solder joint is in a dangerous state, generates a second warning signal, displays a full-screen red flashing warning interface, and automatically generates a service request file containing the device ID and error code.

[0011] The present invention is further configured such that the root cause analysis module includes: Based on the comprehensive risk prediction value, the partial derivative response values ​​corresponding to the thermal effect index, vibration intensity and creep damage rate are calculated, and a triaxial risk gradient contribution vector is constructed. Extract the maximum value component from the risk gradient contribution vector as the dominant component reference value, and determine whether there is a component contribution value that exceeds the preset proportion threshold of the dominant component reference value. If it exists, the factor corresponding to the component that meets the condition is determined to be the dominant failure factor; otherwise, the factor corresponding to the maximum value component is determined to be the dominant failure factor. The corresponding failure mode classification is output based on the dominant failure factor. When the thermal effect index is the dominant failure factor, it is marked as a thermal fatigue failure mode. When vibration intensity is the dominant failure factor, it is marked as a mechanical vibration failure mode; When the creep damage rate is the dominant failure factor, it is marked as the material creep failure mode.

[0012] The present invention is further configured such that the dynamic suppression module includes: For thermal fatigue failure modes, the heat load redistribution at the solder joint is adjusted based on the correction index; For mechanical vibration failure modes, vibration damping compensation is generated based on a correction exponent. For material creep failure modes, processor workload parameters are adjusted based on a correction exponent.

[0013] The present invention is further configured such that the step of generating the correction index includes: The first control term is calculated based on the power-law relationship between crack growth rate and crack propagation threshold; The second control term is calculated based on the exponential decay function of vibration intensity; The first and second regulatory terms are merged to generate a correction index.

[0014] The present invention is further configured such that the system includes a visualization module for real-time display of temperature changes, vibration intensity, comprehensive risk prediction value and early warning status of the solder joint, and supports graphical interface interaction and historical data query.

[0015] This invention provides a fault early warning and detection system for laptop motherboards. The system comprises: a signal acquisition module for real-time acquisition of temperature and vibration acceleration signals from BGA solder joints via sensors; a damage characteristic calculation module for calculating the thermal effect index and vibration intensity of the solder joints based on the acquired temperature and vibration acceleration signals; a crack prediction module for constructing a crack dynamics function based on the thermal effect index and vibration intensity to calculate crack growth rate; a risk assessment module for calculating a comprehensive risk prediction value based on crack growth rate, combined with temperature abrupt change rate and vibration transient rate; a root cause analysis module for calculating the contribution weights of the thermal effect index, vibration intensity, and creep damage rate to the comprehensive risk prediction value using a gradient analysis method, identifying dominant failure factors, and outputting a failure mode classification; and a dynamic suppression module for dynamically adjusting the thermal load, vibration compensation strategy, or creep control measures of the solder joints based on the failure mode classification results. The beneficial effects include: 1. High-precision extraction capability of thermo-coupling damage indicators: The damage feature calculation module constructs two indicators, thermal effect index and vibration intensity, based on physical quantities such as temperature change rate, temperature difference fluctuation amplitude and power spectral density of vibration acceleration signal, thereby capturing the complex damage evolution behavior of weld joints from multiple angles and enhancing the ability to identify responses to different loads. 2. Dynamic evolution capability of crack propagation modeling: The crack prediction module introduces crack dynamics function under thermo-mechanical synergy, accurately calculates the crack growth rate of weld joint based on two damage indicators: thermal effect index and vibration intensity, captures the initiation, propagation and critical stages of microcracks, and improves the ability to identify early hidden dangers. 3. Risk level assessment capability oriented towards system status: The risk assessment module introduces temperature mutation rate and vibration transient rate as dynamic disturbance factors, and constructs a multi-parameter fusion risk prediction function based on crack growth rate to realize quantitative assessment of weld joint failure risk and risk level classification, effectively supporting the optimization of system operation strategy.

[0016] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, specific embodiments of this application are given below. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings: Figure 1 This is a structural diagram of a fault early warning and detection system for a notebook motherboard, as shown in an exemplary embodiment of the present invention. Detailed Implementation

[0018] The embodiments of the present invention will be described below with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be understood that the preferred embodiments are only for illustrating the present invention and not for limiting the scope of protection of the present invention.

[0019] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0020] In the following description, numerous details are explored to provide a more thorough explanation of embodiments of the invention. However, it will be apparent to those skilled in the art that embodiments of the invention may be practiced without these specific details. In other embodiments, well-known structures and devices are shown in block diagram form rather than in detail to avoid obscuring embodiments of the invention.

[0021] A fault early warning and detection system for laptop motherboards, such as Figure 1 As shown, it includes: Signal acquisition module: Used to acquire temperature and vibration acceleration signals of the motherboard BGA solder joints in real time through sensors; Damage characteristic calculation module: used to calculate the thermal effect index and vibration intensity of the weld joint based on the collected temperature signal and vibration acceleration signal, respectively; Crack prediction module: used to construct crack dynamics functions based on thermal effect index and vibration intensity, and calculate crack growth rate; Risk assessment module: used to calculate the comprehensive risk prediction value based on crack growth rate, combined with temperature abrupt change rate and vibration transient rate; Root Cause Analysis Module: Used to calculate the contribution weights of thermal effect index, vibration intensity and creep damage rate to the comprehensive risk prediction value through gradient analysis method, identify the dominant failure factors, and output failure mode classification. Dynamic suppression module: Used to dynamically adjust the thermal load, vibration compensation strategy or creep control measures of the solder joint based on the failure mode classification results.

[0022] The present invention is further configured such that the damage feature calculation module includes: The temperature fluctuation and temperature rise rate are calculated based on the collected temperature signal, and the thermal effect index of the solder joint is calculated based on the temperature fluctuation and temperature rise rate. The vibration spectrum is obtained through Fourier transform based on the collected vibration acceleration signal, and the vibration intensity is calculated based on the vibration spectrum. Specifically, by acquiring real-time response data of BGA solder joints under temperature fluctuations and vibration, the impact of temperature and vibration on solder joint degradation is quantified, providing a more accurate prediction of solder joint health status. The thermal effect index is used to measure the cumulative impact of temperature fluctuations and temperature rise rate on BGA solder joints. This index comprehensively considers temperature fluctuations and temperature rise rate to quantify the impact of thermal cycling on solder joint degradation. The temperature signal of the solder joint, i.e., temperature change data, is acquired in real time by a temperature sensor. The temperature signal is first filtered to remove noise, and the temperature fluctuation and temperature rise rate are obtained. The calculation logic for temperature fluctuation is as follows: , For a moment Temperature fluctuations The maximum temperature value at time t The minimum temperature value at time t, and the temperature fluctuation. This refers to the temperature change amplitude of the solder joint at time t, reflecting the thermal stress response of the solder joint during thermal cycling. This temperature change amplitude is closely related to the thermal fatigue damage of the solder joint; the calculation logic for the temperature rise rate is as follows: , For a moment The rate of temperature rise, For a moment Temperature fluctuations and For time step, temperature rise rate It reflects the rate of temperature change at the solder joint; the calculation logic for the thermal effect index is as follows: , For the thermal effect index, and Thermal cycling influence coefficient; Used to reflect the degree of influence of temperature fluctuations on solder joint degradation, with a value range of [0.01, 0.2]. The value range is [0.1, 0.5], used to control the impact of temperature rise rate on solder joint degradation. Vibration intensity measures the impact of vibration on the solder joint, considering vibration amplitude, frequency, and duration. Vibration intensity is calculated by extracting the energy change rate of high-frequency vibration through time-frequency domain analysis to assess the potential damage to the solder joint. Vibration acceleration signals around the solder joint are collected using an accelerometer. The vibration acceleration signals are then processed by Fast Fourier Transform to extract the vibration spectrum. The vibration intensity is calculated based on the vibration spectrum. The calculation logic for vibration intensity is as follows: , For vibration intensity, For a moment vibration spectrum, For the rate of change of vibration spectrum, and As a regulating factor; Reflects on time The vibration amplitude and frequency components of the solder joint at any given moment; This is used to measure the rate at which vibration frequency changes over time. Excessive frequency changes can exacerbate fatigue damage at the weld joint. The calculation logic is as follows: ; Used to adjust the effect of vibration amplitude on the weld joint, with a value range of [0.2, 0.5]. Used to adjust the effect of frequency changes on solder joints, with a value range of [0.05, 0.15]. By collecting and processing temperature and vibration acceleration signals, the degradation process of solder joints is quantified, providing a comprehensive assessment tool to monitor the health status of solder joints. The thermal effect index and vibration intensity can reflect the thermal and mechanical stresses on the solder joints in real time, thus providing effective data support for solder joint failure prediction and maintenance.

[0023] The present invention is further configured such that the crack prediction module includes: The thermal effect index and vibration intensity are used as coupling driving factors for crack propagation to construct a crack dynamics function; The creep damage rate is calculated based on the equivalent stress and creep characteristic time, and used as the input to the crack growth rate calculation model; By introducing a time-increase factor into the crack growth rate calculation model, the change in crack propagation rate caused by time evolution is dynamically simulated. The crack growth rate is calculated by integrating the product of the crack dynamics function, creep damage rate, and time-increase factor in the time domain. Specifically, crack propagation is affected by the coupling of thermal stress and vibration. A crack dynamics function is constructed to simulate the external excitation of crack propagation trend. The construction logic of the crack dynamics function is as follows: , For crack dynamics function, , and These are nonlinear coefficients; The synergistic amplification effect used to control the thermal effect index and vibration intensity has a value range of [1.2, 1.8]. The value range is [0.01, 0.05], which is used to control the attenuation effect of the thermal effect index during crack propagation. The steepness of the thermal effect exponential saturation curve is adjusted, with a value range of [1.5, 2]. The crack dynamics function combines the interaction of thermal and vibration effects to simulate the crack propagation behavior of weld joints under different loads and environmental conditions. By adjusting the nonlinear coefficient, it can better reflect the crack propagation characteristics of the weld joint. By considering the influence of equivalent thermal stress on the weld joint, the creep damage rate is dynamically calculated to quantify the degradation of the weld joint material under long-term load. The calculation logic of the creep damage rate is as follows: , For creep damage rate, For creep characteristic time, and For creep index, For equivalent thermal stress, Reference stress; creep characteristic time Determined based on the stress response or historical creep data of the weld joint material; The nonlinear rate used to control the development of creep damage over time has a value range of [0.3, 0.7]. Used to characterize the amplification effect of equivalent thermal stress on creep rate, with a value range of [3,5]; Equivalent thermal stress is used to standardize thermal stress, representing the yield stress of the solder joint material at a certain reference temperature or the equivalent creep initiation stress under long-term service. It can be obtained through literature lookup or experimental calibration. Equivalent thermal stress reflects the impact of thermal stress generated by temperature fluctuations and local hot spot effects on solder joint performance. The calculation logic is as follows: , For the elastic modulus of solder, For the difference in thermal expansion coefficients, This is a local hotspot effect; It is used to reflect the elastic response of the solder joint material to thermal stress. It is a known material property parameter, and the specific value is set according to the experimental material parameter library of the selected solder. This represents the difference in thermal expansion coefficients between the solder and the substrate, determining the degree of thermal strain accumulation. Its value ranges from [0.000001, 0.00001], and the unit is... In this embodiment, the local hotspot effect It can be calculated based on the coupling relationship between instantaneous current density, resistivity, and thermal conductivity, and the obtained... Normalization is performed; creep damage rate characterizes the microstructural degradation process of materials under high-temperature loads. Over time, weld joints undergo creep, leading to a decrease in material properties. By calculating the creep damage rate, the degradation process of weld joints can be dynamically monitored; the time increment factor is used to simulate the accelerating effect of time on crack propagation. Considering the change in crack propagation rate under long-term load, the calculation logic of the time increment factor is as follows: , For time-increasing factors, For time linearity coefficients, The time coefficient is a quadratic coefficient; and Collectively referred to as the time-increase factor coefficient, and It is used to reflect the accelerating trend of time effect during crack propagation. Its value is obtained by power function regression fitting of crack growth rate collected under constant load conditions and after different loading times. The value range is [0.01, 0.05]. The value range is [0.00001, 0.001]. By combining the crack kinetic function, creep damage rate, and time increment factor, the overall growth process of weld joint cracks is simulated. The crack growth degree represents the overall extent of crack propagation at the weld joint. The calculation logic for the crack growth degree is as follows: , For crack growth rate, For a moment Crack dynamics function For a moment Time increment factor For a moment The creep damage rate; the crack growth rate is obtained through comprehensive calculation, which can fully describe the crack propagation process of the weld joint and reflect the degradation status of the weld joint under long-term load.

[0024] The present invention is further configured to generate a residual metric based on the measured value of crack growth degree and the absolute deviation of crack growth degree; Calculate the partial derivative of the residual measure with respect to the time-incrementing factor coefficient to generate sensitivity weights; The coefficients of the time-incrementing factor are updated iteratively and weighted according to the sensitivity weight and the preset learning rate. The updated time increment factor coefficient is physically validated. Specifically, in this embodiment, the measured value of the weld crack growth rate is collected by X-ray tomography or acoustic emission sensor and compared with the predicted crack growth rate to calculate the residual metric. The calculation logic of the residual metric is as follows: , For residual measurement, This represents the measured crack growth rate; based on residual measurement. The partial derivatives of the residual metric with respect to the time-incrementing factor coefficients are calculated using the central difference method to generate sensitivity weights. Based on these sensitivity weights and a preset learning rate, the time-incrementing factor coefficients are then iteratively updated using the following update formula: , Let k be the k-th coefficient in the time-increasing factor, and k be the index. ,when hour, For time linearity coefficients, when hour, The time coefficient is a quadratic coefficient; The learning rate is used to adjust the magnitude of parameter updates and prevent oscillations. In this embodiment, the learning rate is preset to 0.01; initial value The time linear and time quadratic coefficients in the time increment factor calculation logic are assigned values; the updated time increment factor coefficients are then evaluated. Perform a physical plausibility check, if the time linearity coefficient or time quadratic coefficient When the value is lower than the lower limit or higher than the upper limit, it is clamped to the boundary value; if the coefficient does not exceed the boundary, the updated value is retained; when the following convergence condition is met in continuous iterations: Furthermore, if this condition is consistently met for a preset number of iterations, then the determination coefficient... It has converged, among which, A preset convergence threshold is used; the time increment factor coefficient is adaptively optimized by guiding the residual sensitivity, and combined with physical constraint verification, which improves the accuracy of fault prediction.

[0025] The present invention is further configured such that the risk assessment module includes: The vibration intensity is subjected to a first-order time-domain differential operation to generate the vibration transient rate. Based on the power-law relationship between crack propagation degree and crack propagation threshold, and combined with the crack propagation index weighting coefficient, a crack propagation risk component is generated. Based on the vibration transient rate, an exponential amplification function is constructed using the vibration transient sensitivity coefficient to generate the vibration transient risk component; Based on the temperature mutation rate, an exponential amplification function is constructed using the temperature mutation sensitivity coefficient to generate a temperature mutation risk component; The comprehensive risk prediction value is calculated by considering the crack propagation risk component, vibration transient risk component, and temperature abrupt change risk component. Specifically, in this embodiment, a comprehensive risk prediction function is constructed to assess the risk level of weld joints. This function integrates information from multiple factors, such as crack propagation degree, vibration transient trend, and temperature abrupt change rate. The function introduces multiple sets of sensitivity weight coefficients to achieve nonlinear weighted integration of various degradation factors. The calculation logic of the comprehensive risk prediction function is as follows: , For comprehensive risk forecast value, For crack propagation threshold, , , , and Sensitivity modulator; This is the crack propagation risk component, used to measure the extent to which the current crack growth exceeds the crack propagation threshold. If the crack growth exceeds the material's allowable threshold, the risk increases. This is the transient risk component of vibration, used to reflect the impact of the rate of change of the current vibration intensity on the risk of the weld joint. If the vibration increases sharply in a short period of time, this component will increase rapidly, and the vibration-induced risk will increase sharply. The temperature change risk component reflects the contribution of the temperature change rate to the risk. When the temperature changes drastically, such as rapid heating or cooling, the thermal shock to the solder joint is aggravated, and the risk increases. The nonlinear growth intensity used to control the crack propagation risk component has a value range of [1.2, 1.8]. Used to adjust the base value of vibration transient risk, that is, to adjust the vibration transient risk component, with a value range of 0.15, 0.35; Used to control the amplification effect of vibration transient rate on risk, with a value range of [0.08, 0.15]; Used to adjust the base value for temperature mutation risk, i.e., to adjust the temperature mutation risk component, with a value range of [0.1, 0.25]. The value range is [0.05, 0.12], which is used to control the amplification effect of the temperature rise rate on risk. It integrates the risk contributions of three fault causes through a three-term accumulation method, which can dynamically respond to various external disturbances and has good adaptability. The nonlinear structure and partial derivative input of each term make the comprehensive risk prediction function model more sensitive to sudden changes and help to provide early warning.

[0026] The present invention is further configured to classify and determine the comprehensive risk prediction value based on a preset safety threshold, and implement a three-level early warning mechanism, wherein the three-level early warning mechanism includes: When the comprehensive risk prediction value is less than the first preset safety threshold, the system determines that the solder joint is in a safe state, maintains the basic sampling rate of the sensor, and continues to record the operating data. When the comprehensive risk prediction value is greater than or equal to the first preset safety threshold and less than the second preset safety threshold, the system determines that the solder joint is in an early warning state, generates a first early warning signal, increases the sensor sampling frequency, and triggers the output of visual early warning information and the log marking mechanism. When the comprehensive risk prediction value is greater than or equal to the second preset safety threshold, the system determines that the solder joint is in a dangerous state, generates a second warning signal, displays a full-screen red flashing warning interface, and automatically generates a service request file containing the device ID and error code. Specifically, in this embodiment, based on the preset safety threshold, the comprehensive risk prediction value is used to classify and determine the health status of the solder joint, specifically divided into three risk levels, and corresponding warning measures are taken. Specifically, when the comprehensive risk prediction value is less than the first preset safety threshold, it indicates that the solder joint is in a safe state. The system maintains the basic sampling rate to record data and continues to monitor the operation to ensure continuous tracking. If the comprehensive risk prediction value is greater than or equal to the first preset safety threshold and less than the second preset safety threshold, it indicates that the solder joint is in a warning state. At this time, the system generates a first warning signal, increases the sampling frequency of the sensor to obtain more accurate data, and triggers the output of visual warning information and log marking to ensure that maintenance personnel can be aware of the potential risks of the solder joint in a timely manner. If the comprehensive risk prediction value is less than the first preset safety threshold, it indicates that the solder joint is in a dangerous state. The system generates a second warning signal, increases the sampling frequency of the sensor to obtain more accurate data, and triggers the output of visual warning information and log marking to ensure that maintenance personnel can be aware of the potential risks of the solder joint in a timely manner. When the measured value is greater than or equal to the second preset safety threshold, it indicates that the solder joint is in a dangerous state. The system will automatically identify this state and trigger an early warning mechanism, generating a second early warning signal. This signal is triggered through the graphical interface, displaying a full-screen flashing red warning interface on the screen to ensure that users can quickly identify the risk. At the same time, the system automatically generates a service request file containing the device ID, error code, and relevant fault information, and saves it or transmits it to a remote service platform or maintenance management system via the network. This file will provide important data support for subsequent fault diagnosis and equipment maintenance. During the process, the interface update is triggered by the system background based on real-time calculation results. Hardware such as graphics cards and display drivers support the full-screen flashing effect, while the service request file is generated using a standard format and transmitted remotely via network protocols to ensure that fault information is delivered to maintenance personnel in a timely manner. By combining the comprehensive risk prediction value and multiple preset safety thresholds, the system can accurately classify the health status of the solder joint, which helps to identify potential risks in a timely manner, provide early warnings, and prevent faults from occurring.

[0027] The present invention is further configured such that the root cause analysis module includes: Based on the comprehensive risk prediction value, the partial derivative response values ​​corresponding to the thermal effect index, vibration intensity and creep damage rate are calculated, and a triaxial risk gradient contribution vector is constructed. Extract the maximum value component from the risk gradient contribution vector as the dominant component reference value, and determine whether there is a component contribution value that exceeds the preset proportion threshold of the dominant component reference value. If it exists, the factor corresponding to the component that meets the condition is determined to be the dominant failure factor; otherwise, the factor corresponding to the maximum value component is determined to be the dominant failure factor. The corresponding failure mode classification is output based on the dominant failure factor. When the thermal effect index is the dominant failure factor, it is marked as a thermal fatigue failure mode. When vibration intensity is the dominant failure factor, it is marked as a mechanical vibration failure mode; When creep damage rate is the dominant failure factor, it is marked as a material creep failure mode. Specifically, in this embodiment, to achieve root cause tracing of weld joint failure, a risk gradient contribution vector is constructed to quantify the relative contribution of multiple influencing factors to the comprehensive risk prediction value, thereby enabling the determination of the root cause of failure. Based on the comprehensive risk prediction value... Partial derivatives are calculated with respect to the thermal effect index, vibration intensity, and creep damage rate to obtain partial derivative response values. A risk gradient contribution vector is then constructed, which is expressed as follows: , This represents the risk gradient contribution vector. Each component in the vector reflects the degree of local response of a single variable disturbance to the overall comprehensive risk forecast at the current time t. Furthermore, to improve the comparability between different indicators, all input parameters have been pre-normalized using standard deviation. The maximum component in the risk gradient contribution vector is extracted. ,in, , and These are the thermal effect exponential component, vibration intensity component, and creep damage rate component in the risk gradient contribution vector, respectively; and a preset proportional threshold is set. ,in, The value range of is [0,1]. In this embodiment, The default value is 0.5; if a certain component exists... If a factor is considered to play a dominant role in the current failure trend, then the factor that meets the conditions is determined to be the dominant failure factor. Furthermore, based on the dimension of the dominant failure factor, the failure mode is divided into three categories: if the dominant failure factor is the thermal effect index... If the failure mode is thermal fatigue, it corresponds to fatigue cracking of the weld material induced by cyclic temperature changes; if the dominant failure factor is vibration intensity... If the failure mode is identified as mechanical vibration, it corresponds to the loosening of the weld joint structure under high-frequency or high-amplitude vibration; if the dominant failure factor is creep damage rate... If the failure mode is identified as material creep failure, it corresponds to the failure caused by slow plastic deformation of the solder under high-temperature stress coupling. By constructing a triaxial risk gradient contribution vector and introducing a dominant component reference value and a relative threshold judgment mechanism, quantitative sensitivity analysis of multiple failure factors can be achieved, effectively identifying the dominant failure factor that contributes the most to the overall risk under the current operating state. Compared with the traditional judgment method that relies on only a single index, this method takes into account the coupling effect of multiple factors and the dynamic evolution trend of abrupt risk, improving the accuracy and practicality of failure mode classification. At the same time, the calculation of the partial derivative response value is based on normalized data, which can ensure the dimensional consistency between different physical quantities and the physical interpretability of the calculation results, thereby enhancing the stability and engineering adaptability of the risk identification model.

[0028] The present invention is further configured such that the dynamic suppression module includes: For thermal fatigue failure modes, the heat load redistribution at the solder joint is adjusted based on the correction index; For mechanical vibration failure modes, vibration damping compensation is generated based on a correction exponent. For material creep failure modes, the processor workload parameters are adjusted based on a correction index. Specifically, in the embodiments, for different failure modes, including thermal fatigue failure mode, mechanical vibration failure mode, and material creep failure mode, the processor workload parameters are adjusted based on the correction index. Adjust the thermal load on the solder joints, enable damping compensation, and regulate the processor's workload; when the thermal effect index is determined to be the dominant failure factor, adjust the index accordingly. Adjusting the temperature of the solder joints and redistributing the heat load, the calculation logic for adjusting the solder joint temperature is as follows: , For the target temperature of the solder joint, To reduce thermal stress at the solder joint and mitigate thermal fatigue failure caused by high temperatures, the target temperature of the solder joint increases as the correction index increases. The impact will decrease accordingly; when vibration intensity is determined to be the dominant failure factor, damping compensation is activated to reduce the impact of vibration on the weld joint. The calculation logic for vibration damping compensation is as follows: , For vibration damping compensation, when the vibration intensity is too high, vibration damping compensation reduces the vibration impact on the solder joints. The compensation force increases with the intensity of vibration, preventing mechanical damage to the solder joints. When creep damage is determined to be the dominant failure factor, the processor's workload is adjusted to reduce temperature and pressure, delaying material creep failure. The calculation logic for the processor load is as follows: , For the actual processor load, For processor rated load, For coefficients; The index is used to represent the sensitivity of the correction index to load reduction, and its value ranges from [0,1]. To reduce the risk of failure due to creep, when creep damage becomes the dominant failure factor, the processor's workload is reduced to decrease heat generation and stress accumulation, thereby slowing down the creep damage process. When multiple dominant failure factors exist, it is a coupled failure mode, for example, when... ,in, ,but and If the condition "the contribution value of a component exceeds the preset proportional threshold of the reference value of the dominant component" is met, the output is a thermal-vibration coupling failure mode, which simultaneously triggers thermal load redistribution and vibration damping compensation to suppress thermal-vibration synergistic damage. Through the above adjustment strategy, different failure modes can be dynamically compensated according to the real-time correction index, ensuring the stability and durability of solder joints and system components under adverse environments such as high temperature, vibration and creep damage. According to different failure modes, the thermal load, vibration intensity and processor load of the solder joints can be flexibly adjusted, thereby effectively extending the service life of the equipment and reducing the probability of failure.

[0029] The present invention is further configured such that the step of generating the correction index includes: The first control term is calculated based on the power-law relationship between crack growth rate and crack propagation threshold; The second control term is calculated based on the exponential decay function of vibration intensity; The first and second control terms are fused to generate a correction index. Specifically, in this embodiment, the calculation process of the correction index fusion is mainly used to dynamically adjust the load of the solder joint based on the dominance of the failure inducing factors, ensuring that the system can make corresponding load compensation under different failure modes. The correction index adjusts the solder joint load by fusing the influence of different failure factors. This process consists of two parts: a first control term and a second control term. The first control term calculates the impact of crack development on the solder joint load by comparing the current crack growth rate and crack propagation threshold of the solder joint. The second control term quantifies the impact of vibration intensity on the solder joint load by performing exponential decay processing on vibration intensity. The calculation logic of the correction index is as follows: , To correct the index, For crack growth rate, For crack propagation threshold, For vibration intensity, and For weighting coefficients, For exponential coefficients, Vibration attenuation coefficient; and These are used to control the contribution of crack growth rate and vibration intensity to the correction index, respectively, with values ​​ranging from [0,1]. and The sum of the two is 1. It is used to control the nonlinear relationship between crack growth degree and correction index. By adjusting the degree of influence of crack growth degree on correction index, it reflects the sensitivity of crack growth to weld load. The value range is [1,2]. The correction index is used to control the attenuation effect of vibration intensity on the correction index, with a value range of [0, 0.5]. By dynamically adjusting the correction index, the load on the solder joint can be adjusted according to the actual working state of the solder joint, environmental changes, and the dominance of the failure mode, so as to avoid overload.

[0030] The invention is further configured such that the system includes a visualization module for real-time display of solder joint temperature changes, vibration intensity, comprehensive risk prediction value, and warning status, supporting graphical interface interaction and historical data query. Specifically, the main function of the visualization module is to display the solder joint temperature changes, vibration intensity, comprehensive risk prediction value, and current warning status in real time. Through the graphical interface, users can intuitively observe the dynamic changes of the solder joint and the risk assessment process, thereby making timely decisions or taking appropriate measures. The visualization module includes multiple interface components for displaying real-time data and historical query results. The interface mainly consists of a temperature change chart, a vibration intensity chart, a comprehensive risk prediction value panel, and warning status indicator lights / icons. The temperature change chart displays the change in solder joint temperature over time. The system includes temperature fluctuations, temperature rise rate, and temperature mutation rate; the vibration intensity chart displays the vibration frequency and amplitude of the solder joint in real time, helping users understand changes in vibration intensity; the comprehensive risk prediction value panel provides a real-time risk level display for the solder joint based on the calculated comprehensive risk prediction value, intuitively indicating whether the solder joint is in a safe, warning, or dangerous state through different colors or graphics; the warning status indicator / icon uses different colored indicator lights or icons to represent the risk level of the solder joint, such as green, yellow, and red, making it easy for users to quickly identify and respond; users can select a specific time period to query the historical changes of temperature, vibration, risk prediction value, and warning status, which are displayed in tabular or chart form, supporting data sorting, filtering, and export to help analyze trends and identify early signs of failure.

[0031] The above embodiments can be implemented, in whole or in part, by software, hardware, firmware, or any other combination thereof. When implemented using software, the above embodiments can be implemented, in whole or in part, as a computer program product. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer programs are loaded or executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that includes one or more sets of available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium. A semiconductor medium can be a solid-state drive.

[0032] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. A and B can be singular or plural. Additionally, the character " / " in this article generally indicates an "or" relationship between the preceding and following related objects, but it can also represent an "and / or" relationship. Please refer to the context for a more accurate understanding.

[0033] In this application, "at least one" means one or more, and "more than one" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or multiple items. For example, at least one of a, b, or c can mean: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0034] It should be understood that in the various embodiments of this application, the order of the above-mentioned processes does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0035] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0036] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0037] In the several embodiments provided in this application, it should be understood that the disclosed system can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0038] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0039] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0040] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0041] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A fault early warning and detection system for laptop motherboards, characterized in that, include: Signal acquisition module: Used to acquire temperature and vibration acceleration signals of the motherboard BGA solder joints in real time through sensors; Damage characteristic calculation module: used to calculate the thermal effect index and vibration intensity of the weld joint based on the collected temperature signal and vibration acceleration signal, respectively; Crack prediction module: used to construct crack dynamics functions based on thermal effect index and vibration intensity, and calculate crack growth rate; Risk assessment module: used to calculate the comprehensive risk prediction value based on crack growth rate, combined with temperature abrupt change rate and vibration transient rate; Root Cause Analysis Module: Used to calculate the contribution weights of thermal effect index, vibration intensity and creep damage rate to the comprehensive risk prediction value through gradient analysis method, identify the dominant failure factors, and output failure mode classification. Dynamic suppression module: Used to dynamically adjust the thermal load, vibration compensation strategy or creep control measures of the solder joint based on the failure mode classification results.

2. The fault early warning and detection system for a notebook motherboard according to claim 1, characterized in that, The damage feature calculation module includes: The temperature fluctuation and temperature rise rate are calculated based on the collected temperature signal, and the thermal effect index of the solder joint is calculated based on the temperature fluctuation and temperature rise rate. The vibration spectrum is obtained by Fourier transforming the collected vibration acceleration signal, and the vibration intensity is calculated based on the vibration spectrum.

3. The fault early warning and detection system for a notebook motherboard according to claim 1, characterized in that, The crack prediction module includes The thermal effect index and vibration intensity are used as coupling driving factors for crack propagation to construct a crack dynamics function; The creep damage rate is calculated based on the equivalent stress and creep characteristic time, and used as the input to the crack growth rate calculation model; By introducing a time-increase factor into the crack growth rate calculation model, the change in crack propagation rate caused by time evolution is dynamically simulated. The crack growth rate is calculated by integrating the product of the crack kinetic function, creep damage rate, and time increment factor in the time domain.

4. The fault early warning and detection system for a notebook motherboard according to claim 3, characterized in that, A residual metric is generated based on the measured crack growth rate and the absolute deviation of the crack growth rate. Calculate the partial derivative of the residual measure with respect to the time-incrementing factor coefficient to generate sensitivity weights; The coefficients of the time-incrementing factor are updated iteratively and weighted according to the sensitivity weight and the preset learning rate. Perform a physical rationality check on the updated time increment factor coefficients.

5. A fault early warning and detection system for a notebook motherboard according to claim 1, characterized in that, The risk assessment module includes The vibration intensity is subjected to a first-order time-domain differential operation to generate the vibration transient rate. Based on the power-law relationship between crack propagation degree and crack propagation threshold, and combined with the crack propagation index weighting coefficient, a crack propagation risk component is generated. Based on the vibration transient rate, an exponential amplification function is constructed using the vibration transient sensitivity coefficient to generate the vibration transient risk component; Based on the temperature mutation rate, an exponential amplification function is constructed using the temperature mutation sensitivity coefficient to generate a temperature mutation risk component; The comprehensive risk prediction value is calculated by using the crack propagation risk component, vibration transient risk component, and temperature sudden change risk component.

6. A fault early warning and detection system for a notebook motherboard according to claim 5, characterized in that, Based on a preset safety threshold, the comprehensive risk prediction value is graded and a three-level early warning mechanism is implemented, which includes: When the comprehensive risk prediction value is less than the first preset safety threshold, the system determines that the solder joint is in a safe state, maintains the basic sampling rate of the sensor, and continues to record the operating data; When the comprehensive risk prediction value is greater than or equal to the first preset safety threshold and less than the second preset safety threshold, the system determines that the solder joint is in an early warning state, generates a first early warning signal, increases the sensor sampling frequency, and triggers the output of visual early warning information and the log marking mechanism. When the comprehensive risk prediction value is greater than or equal to the second preset safety threshold, the system determines that the solder joint is in a dangerous state, generates a second warning signal, displays a full-screen red flashing warning interface, and automatically generates a service request file containing the device ID and error code.

7. A fault early warning and detection system for a notebook motherboard according to claim 1, characterized in that, The root cause analysis module includes: Based on the comprehensive risk prediction value, the partial derivative response values ​​corresponding to the thermal effect index, vibration intensity and creep damage rate are calculated, and a triaxial risk gradient contribution vector is constructed. Extract the maximum value component from the risk gradient contribution vector as the dominant component reference value, and determine whether there is a component contribution value that exceeds the preset proportion threshold of the dominant component reference value. If it exists, the factor corresponding to the component that meets the condition is determined to be the dominant failure factor; otherwise, the factor corresponding to the maximum value component is determined to be the dominant failure factor. The corresponding failure mode classification is output based on the dominant failure factor. When the thermal effect index is the dominant failure factor, it is marked as a thermal fatigue failure mode. When vibration intensity is the dominant failure factor, it is marked as a mechanical vibration failure mode; When the creep damage rate is the dominant failure factor, it is marked as the material creep failure mode.

8. A fault early warning and detection system for a notebook motherboard according to claim 7, characterized in that, The dynamic suppression module includes: For thermal fatigue failure modes, the heat load redistribution at the solder joint is adjusted based on the correction index; For mechanical vibration failure modes, vibration damping compensation is generated based on a correction exponent. For material creep failure modes, processor workload parameters are adjusted based on a correction exponent.

9. A fault early warning and detection system for a notebook motherboard according to claim 8, characterized in that, The steps for generating the correction index include: The first control term is calculated based on the power-law relationship between crack growth rate and crack propagation threshold; The second control term is calculated based on the exponential decay function of vibration intensity; The first and second regulatory terms are merged to generate a correction index.

10. A fault early warning and detection system for a notebook motherboard according to claim 1, characterized in that, The system includes a visualization module for real-time display of temperature changes, vibration intensity, comprehensive risk prediction values, and early warning status of the solder joints, and supports graphical interface interaction and historical data query.

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