Copper sulfate recovery device and recovery method of circuit board copper reduction etching machine

Abstract

The invention belongs to the field of circuit board copper reduction etching machine processing, and discloses a copper sulfate recovery device and method for a circuit board copper reduction etching machine, the recovery device comprises a precipitation tank, a cooling assembly, a liquid supply assembly and a scraping assembly, the precipitation tank is used for injecting micro-etching waste liquid; the cooling assembly comprises cooling plates and a refrigerator, and the cooling plates are arranged on the two opposite sides of the precipitation tank; the scraping assembly comprises a plurality of scraping plates, a transmission chain and a driver, and the transmission chain drives the scraping plates to move along the precipitation tank, so that the scraping plates scrape out the copper sulfate crystals from the discharge port; the detection assembly comprises a volumetric flowmeter and a temperature sensor, the volumetric flowmeter is arranged on the infusion tube, and the temperature sensor is arranged in the precipitation tank; the water pump is provided with a first controller; the first controller is in communication connection with the volume flow meter; the refrigerator is provided with a second controller, and the second controller is in communication connection with the temperature sensor and the first controller. According to the invention, the crystallization time can be shortened, the refrigeration energy consumption is reduced, and the maintenance cost is obviously reduced.

Description

Technical Field

[0001] This invention relates to the technical field of printed circuit board manufacturing, and in particular to a copper sulfate recovery device and method for a copper reduction etching machine for printed circuit boards. Background Technology

[0002] In the production of printed circuit boards, copper reduction is an important manufacturing process. Copper reduction etching machines are used to reduce the copper foil layer on the surface of the circuit board. Specifically, the copper reduction etching machine is equipped with a spraying device. The spraying device sprays etching liquid to simultaneously reduce the copper foil layer on the two opposite surfaces of the circuit board. During the copper reduction process, the etching liquid reacts with copper to produce copper sulfate solution, and the generated micro-etching waste liquid flows into the etching tank.

[0003] Because etching solutions generate high-concentration copper sulfate wastewater after repeated use, the industry commonly employs a cooling crystallization method to recover copper sulfate in order to achieve resource recycling. Existing recovery devices typically include a closed recovery tank and a built-in cooling coil system. During operation, the micro-etching wastewater is injected into the recovery tank, and a low-temperature refrigerant is introduced through the cooling pipes to lower the temperature of the wastewater to below 10-15°C, causing the copper sulfate solution in the wastewater to become supersaturated and crystallize out. However, some shortcomings exist: 1. Cooling pipes are prone to crystallization: During the cooling process, the micro-etching waste liquid and the refrigerant of the cooling pipe exchange heat. The crystals formed by the cooling of copper sulfate solution are easy to adhere to the outer surface of the cooling pipe, which affects the heat exchange between the cooling pipe and the micro-etching waste liquid. The cooling pipe cannot cool down the micro-etching waste liquid quickly, the efficiency of copper sulfate solution is low, and the energy consumption of the recovery device is high. 2. High maintenance costs: In order to remove the crystals on the outer surface of the cooling pipe, it is usually necessary to clean or replace the cooling pipe regularly. This not only consumes a lot of manpower and resources, but may also cause the production line to stop and affect the progress of copper sulfate recovery. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a copper sulfate recovery device for a circuit board copper reduction etching machine, which can significantly increase the heat exchange area, improve heat exchange efficiency, shorten crystallization time, reduce cooling energy consumption, and, moreover, the scraping component continuously scrapes off the crystals and automatically discharges them without the need to stop the machine to clean the cooling pipes, thus significantly reducing maintenance costs.

[0005] The present invention also proposes a method for recovering copper sulfate using a copper reduction etching machine for circuit boards as described above.

[0006] According to a first aspect of the present invention, a copper sulfate recovery device for a circuit board copper reduction etching machine includes: a precipitation tank for injecting micro-etching waste liquid, wherein a discharge port is provided on one side of the precipitation tank in the length direction; and a cooling assembly including a cooling plate and a cooler for supplying refrigerant to the cooling plate, wherein the cooling plate is disposed on opposite sides of the precipitation tank to form a sidewall in the width direction of the precipitation tank. A liquid supply assembly includes a liquid inlet pipe and a water pump. The liquid inlet pipe is used to deliver micro-etching waste liquid to the precipitation tank. The water pump and the liquid inlet pipe cooperate to transport the micro-etching waste liquid from the etching tank to the precipitation tank. A scraping assembly includes multiple scraper blades, a drive chain connected to the scraper blades, and a driver for driving the drive chain. The multiple scraper blades are distributed circumferentially along the drive chain and match the width of the precipitation tank. The drive chain is arranged along the length of the precipitation tank and drives the scraper blades to move along the length of the precipitation tank, so that the scraper blades scrape copper sulfate crystals from the discharge port. Inspection The detection component includes a volumetric flow meter and a temperature sensor. The volumetric flow meter is disposed in the infusion pipe, and the temperature sensor is disposed in the precipitation tank. The temperature sensor is used to detect the temperature of the micro-etching waste liquid in the precipitation tank, and the volumetric flow meter is used to detect the volume of micro-etching waste liquid flowing into the precipitation tank. The water pump is equipped with a first controller, which is communicatively connected to the volumetric flow meter and is used to control the amount of micro-etching waste liquid pumped by the water pump. The cooler is equipped with a second controller, which is communicatively connected to the temperature sensor and the first controller and is used to control the output power of the cooler.

[0007] A copper sulfate recovery device for a circuit board copper reduction etching machine according to an embodiment of the present invention has at least the following beneficial effects: 1. This invention, by setting up a cooling plate and a refrigerator, provides refrigerant to the cooling plate, enabling the cooling pump plate to cool the micro-etched waste liquid in the precipitation tank. Furthermore, the cooling plate forms a sidewall in the width direction of the precipitation tank, that is, the cooling plate extends along the length direction of the precipitation tank, increasing the contact area between the micro-etched waste liquid and the cooling plate, significantly increasing the heat exchange area, and improving the heat exchange efficiency. The micro-etched waste liquid can be quickly cooled to the crystallization temperature, shortening the crystallization time and reducing the cooling energy consumption.

[0008] 2. This invention, by setting up multiple scraper blades, a transmission chain, and a driver, uses the driver to drive the transmission chain, which in turn moves the multiple scraper blades. This allows the scraper blades to scrape off copper sulfate crystals from the sidewalls of the cooling plate, significantly reducing the amount of copper sulfate crystals adhering to the surface of the cooling plate. This avoids the problem of low cooling efficiency of the cooling plate and solves the problem of increased energy consumption of the refrigerator caused by crystal adhesion due to local overcooling on the outer surface of the existing cooling pipe. It fundamentally eliminates the impact of scale on heat exchange efficiency. Furthermore, the scraper assembly continuously scrapes off crystals and automatically discharges them, eliminating the need to stop the machine to clean the cooling pipe, significantly reducing maintenance costs and improving the efficiency of copper sulfate crystal discharge. It also prevents copper sulfate crystals from accumulating in the precipitation tank, lowers the liquid level in the precipitation tank, increases the amount of liquid that the precipitation tank can receive, and improves the recovery capacity of the precipitation tank. In addition, the scraper blades can agitate the micro-etching waste liquid in the precipitation tank, accelerating the flow rate of the micro-etching waste liquid, making the micro-etching waste liquid cool evenly, which is conducive to the rapid precipitation of copper sulfate crystals and improves the precipitation efficiency of copper sulfate crystals.

[0009] 3. This invention, by setting up a volumetric flow meter and a first controller, uses the volumetric flow meter to detect the amount of liquid delivered to the precipitation tank through the infusion pipe, and can calculate the volume of micro-etching waste liquid input into the precipitation tank each time. Furthermore, the first controller controls the start and stop of the water pump to precisely control the amount of waste liquid injected each time, avoiding excessive injection that would delay the cooling of the micro-etching waste liquid, thus enabling the micro-etching waste liquid to cool down rapidly, improving the precipitation efficiency of copper sulfate crystals, and facilitating the continuous discharge of copper sulfate crystals by the scraping component. This allows the micro-etching waste in the etching tank to be discharged into the precipitation tank in a timely manner, avoiding the problem of excessive micro-etching waste liquid in the etching tank causing overflow.

[0010] 4. This invention uses a temperature sensor and a second controller. The temperature sensor detects the temperature of the micro-etching waste liquid in the precipitation tank, and the second controller dynamically adjusts the power of the cooler to maintain the optimal crystallization temperature, thus avoiding insufficient temperature drop of the micro-etching waste liquid that would lead to a decrease in crystallization efficiency.

[0011] According to a first aspect of the present invention, a copper sulfate recovery device for a circuit board copper reduction etching machine, wherein the scraper has a connecting part and a first scraper, the connecting part is mounted on the transmission chain and connected to the first scraper, and the first scraper is used to slide against the bottom wall of the precipitation tank to push copper sulfate crystals in the precipitation tank.

[0012] According to a first aspect of the present invention, a copper sulfate recovery device for a circuit board copper reduction etching machine, the scraper further has two second scraping parts, which are respectively connected to opposite sides of the first scraping part and slide against the side wall of the cooling plate to scrape off copper sulfate crystals on the surface of the cooling plate. A liquid passage hole is formed between the connecting part, the first scraping part and the second scraping part, and the liquid passage hole allows micro-etching waste liquid to pass through.

[0013] According to a first aspect of the present invention, a copper sulfate recovery device for a circuit board copper reduction etching machine further includes a filtration assembly. The filtration assembly includes a drain pipe disposed on the bottom wall of the precipitation tank and a filter plate disposed on the drain pipe. The drain pipe is used to discharge micro-etching waste liquid in the precipitation tank. The filter plate is made of titanium alloy nano-sintered plate and is embedded in the bottom wall of the precipitation tank and flush with the inner bottom wall of the precipitation tank to filter copper sulfate crystals.

[0014] According to a first aspect of the present invention, a copper sulfate recovery device for a circuit board copper reduction etching machine further includes a vacuum system for generating negative pressure. The vacuum system is equipped with a third controller. The drain pipe has a first connector and a first solenoid valve disposed at the first connector. The first connector is connected to the vacuum system. The first solenoid valve is used to open or close the first connector. The vacuum system draws micro-etching waste liquid from the precipitation tank through the drain pipe. The third controller is communicatively connected to the first solenoid valve and the volumetric flow meter, respectively, and is used to control the on / off operation between the drain pipe and the vacuum system.

[0015] According to a first aspect of the present invention, a copper sulfate recovery device for a circuit board copper reduction etching machine further includes an air compression system for generating compressed air. The air compression system is equipped with a fourth controller. The drain pipe has a second connector and a second solenoid valve disposed at the first connector. The second connector is connected to the air compression system. The second solenoid valve is used to open or close the second connector. The fourth controller is communicatively connected to the first solenoid valve, the second solenoid valve, and the volumetric flow meter, and is used to control the on / off action between the drain pipe and the air compression system. When the first solenoid valve is closed, the air compression system provides compressed air through the drain pipe to clean the blockage of the filter plate.

[0016] According to a first aspect of the present invention, a copper sulfate recovery device for a circuit board copper reduction etching machine, wherein the precipitation tank has an inclined surface located on the side wall where the discharge port is located, the inclined surface is used to guide the discharge of copper sulfate crystals, and the transmission chain has an inclined section parallel to and opposite to the inclined surface, the inclined section driving the scraper to move along the inclined surface.

[0017] A recycling method according to a second aspect of the present invention includes a copper sulfate recycling device for a circuit board copper reduction etching machine as described in any one of the above claims. The recycling method includes: a liquid injection step, wherein a first controller controls the water pump to start, the water pump extracts micro-etching waste liquid from the etching tank, and injects the micro-etching waste liquid into the precipitation tank through the liquid delivery pipe, wherein the volume of micro-etching waste liquid injected into the precipitation tank each time is [missing information]. The volumetric flow meter detected the volume of the micro-etched waste liquid in the precipitation tank as follows: The first controller controls the water pump to stop working; in the cooling step, the second controller controls the cooler to generate refrigerant, which is introduced into the cooling plate to lower the temperature of the micro-etching waste liquid in the precipitation tank. Simultaneously, the driver drives the transmission chain to move the scraper along the precipitation tank, using the scraper to agitate the micro-etching waste liquid and cool it evenly. Let the threshold temperature for copper sulfate crystal precipitation be... The temperature sensor detected that the temperature of the micro-etching waste liquid was less than The second controller controls the cooler's output power to be increased to the maximum, and the temperature sensor detects that the temperature of the micro-etching waste liquid is greater than [a certain value]. The second controller controls the cooler to maintain maximum output power, and the first controller controls the water pump to extract the micro-etching waste liquid again. In the precipitation step, the micro-etching waste liquid reaches a temperature within a certain range, and copper sulfate crystals precipitate in the precipitation tank. The driver drives the transmission chain to move the scraper along the precipitation tank, using the scraper to move the copper sulfate crystals in the tank, allowing them to be discharged through the discharge port. This process is repeated multiple times, setting a threshold for the precipitation tank to hold the micro-etching waste liquid. , After n injections of micro-etching waste liquid, the volumetric flow meter detected the volume of the etching waste liquid in the precipitation tank as follows: No more micro-etching waste liquid will be injected into the precipitation tank.

[0018] According to a second aspect of the present invention, a recycling method includes a draining step, wherein when copper sulfate crystals are completely drained, and the volumetric flow meter detects a volumetric waste liquid in the precipitation tank as having a volumetric flow rate of [missing value]. The third controller controls the first solenoid valve to open, and under the negative pressure of the vacuum system, the micro-etching waste liquid in the precipitation tank is discharged to the outside through the drain pipe.

[0019] According to a second aspect of the present invention, a recycling method includes a blockage clearing step: after the micro-etching waste liquid is discharged from the precipitation tank, the third controller controls the first solenoid valve to close, the fourth controller controls the second solenoid valve to open, and the air compression system injects compressed air into the filter plate to clean the blockage holes of the filter plate.

[0020] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the copper sulfate recovery device of a circuit board copper reduction etching machine according to an embodiment of the present invention; Figure 2 for Figure 1 The diagram shows a top view of a copper sulfate recovery device for a circuit board copper reduction etching machine; Figure 3 for Figure 1 The image shown is a side cross-sectional view of a copper sulfate recovery device for a circuit board copper reduction etching machine; Figure 4 for Figure 1 A schematic diagram of the scraper structure of a copper sulfate recovery device in a circuit board copper reduction etching machine is shown. Figure 5 for Figure 1 A partial view of a copper sulfate recovery device for a circuit board copper reduction etching machine is shown. Figure 6 for Figure 1 A schematic diagram of a copper sulfate recovery device for a circuit board copper reduction etching machine is shown.

[0023] Reference numerals: 100-precipitation tank, 110-discharge port, 120-cooling plate, 130-refrigerator, 140-infusion pipe, 150-water pump, 160-scraper, 170-drive chain, 180-driver, 190-volume flow meter, 200-temperature sensor, 210-first controller, 220-second controller, 230-connection part, 240-first scraper, 250-second scraper, 260-through hole, 270-drain pipe, 280-vacuum system, 290-third controller, 300-first solenoid valve, 310-air compression system, 320-fourth controller, 330-second solenoid valve, 340-sloping surface, 350-inclined section, 360-filter plate. Detailed Implementation

[0024] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0025] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0026] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" and "second" are mentioned, this is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0027] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation, connection, and linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] The following description, in conjunction with the accompanying drawings, describes a copper sulfate recovery device and method for a circuit board copper reduction etching machine according to an embodiment of the present invention.

[0029] Reference Figure 1 The present invention aims to provide an embodiment of a copper sulfate recovery device and recovery method for a circuit board copper reduction etching machine.

[0030] A copper sulfate recovery device for a circuit board copper reduction etching machine according to an embodiment of the present invention includes a precipitation tank 100, a cooling assembly, and a liquid supply assembly. The precipitation tank 100 is used to inject micro-etching waste liquid, and a discharge port 110 is provided on one side of the precipitation tank 100 along its length. The cooling assembly includes a cooling plate 120 and a cooler 130 that supplies refrigerant to the cooling plate 120. The cooling plate 120 is disposed on opposite sides of the precipitation tank 100 to form a sidewall in the width direction of the precipitation tank 100. The liquid supply assembly includes a liquid delivery pipe 140 and a water pump 150. The liquid delivery pipe 140 is used to transport the micro-etching waste liquid to the precipitation tank 100, and the water pump 150 and the liquid delivery pipe 140 cooperate to transport the micro-etching waste liquid from the etching tank to the precipitation tank 100.

[0031] It should be noted that the cooling plate 120 has multiple pipes inside, which are distributed along the height of the cooling plate 120, and refrigerant can be passed through the pipes.

[0032] It is understood that by setting up a cooling plate 120 and a refrigerator 130, the present invention provides a refrigerant to the cooling plate 120, enabling the cooling pump plate to cool the micro-etched waste liquid in the precipitation tank 100. Furthermore, the cooling plate 120 forms a sidewall in the width direction of the precipitation tank 100, that is, the cooling plate 120 extends along the length direction of the precipitation tank 100, which increases the contact area between the micro-etched waste liquid and the cooling plate 120, significantly increases the heat exchange area, and improves the heat exchange efficiency. The micro-etched waste liquid can be quickly cooled to the crystallization temperature, shortening the crystallization time and reducing the cooling energy consumption.

[0033] The copper sulfate recovery device of a circuit board copper reduction etching machine according to an embodiment of the present invention further includes a scraping assembly. The scraping assembly includes multiple scraper plates 160, a transmission chain 170 connected to the scraper plates 160, and a driver 180 for driving the transmission chain 170. The multiple scraper plates 160 are distributed circumferentially along the transmission chain 170 and match the width of the precipitation tank 100. The transmission chain 170 is arranged along the length direction of the precipitation tank 100 and drives the scraper plates 160 to move along the length direction of the precipitation tank 100 so that the scraper plates 160 scrape out the copper sulfate crystals from the discharge port 110.

[0034] It is understood that this invention, by setting up multiple scraper blades 160, a transmission chain 170, and a driver 180, uses the driver 180 to drive the transmission chain 170, which in turn drives the multiple scraper blades 160 to move. This allows the scraper blades 160 to scrape off the copper sulfate crystals on the sidewall of the cooling plate 120, greatly reducing the amount of copper sulfate crystals adhering to the surface of the cooling plate 120. This avoids the problem of low cooling efficiency of the cooling plate 120 and solves the problem of increased energy consumption of the refrigerator 130 due to crystal adhesion caused by localized overcooling on the outer surface of existing cooling pipes. It fundamentally eliminates the impact of scale buildup on heat exchange. The scraping assembly continuously scrapes away and automatically discharges the crystals, which reduces the liquid level in the precipitation tank 100, increases the amount of liquid that the precipitation tank 100 can receive, and improves the recovery capacity of the precipitation tank 100. It eliminates the need to stop the machine to clean the cooling pipes, significantly reducing maintenance costs and improving the discharge efficiency of copper sulfate crystals. It also prevents copper sulfate crystals from accumulating in the precipitation tank 100. In addition, the scraper plate 160 can move the micro-etching waste liquid in the precipitation tank 100, accelerate the flow speed of the micro-etching waste liquid, and make the micro-etching waste liquid cool evenly, which is conducive to the rapid precipitation of copper sulfate crystals and improves the precipitation efficiency of copper sulfate crystals.

[0035] In some embodiments of the present invention, reference is made to... Figure 3 and Figure 4 The scraper 160 has a connecting part 230 and a first scraper part 240. The connecting part 230 is mounted on the transmission chain 170 and connected to the first scraper part 240. The first scraper part 240 is used to slide against the bottom wall of the precipitation tank 100 to push the copper sulfate crystals in the precipitation tank 100.

[0036] Understandably, the first scraper 240 of the scraper plate 160 slides close to the bottom wall of the precipitation tank 100 to thoroughly scrape off the copper sulfate crystals deposited at the bottom and prevent residual crystals from accumulating and affecting subsequent operations.

[0037] In a further embodiment of the present invention, reference is made to Figure 2 and Figure 4 The scraper 160 also has two second scraper sections 250, which are respectively connected to the opposite sides of the first scraper section 240 and slide against the side wall of the cooling plate 120 to scrape out copper sulfate crystals on the surface of the cooling plate 120. A liquid passage hole 260 is formed between the connecting part 230, the first scraper section 240 and the second scraper section 250, which allows micro-etching waste liquid to pass through.

[0038] Understandably, the second scraper 250 moves closely against the side wall of the cooling plate 120 to scrape off the crystalline layer on the surface of the cooling plate 120 in real time, maintaining efficient heat exchange capacity and avoiding the problem of high energy consumption caused by the slow cooling of the micro-etched waste liquid by the cooling plate 120.

[0039] In addition, the liquid passage 260 allows the waste liquid to pass freely through the scraper 160, ensuring uniform circulation of the micro-etching waste liquid and not affecting the consistency of cooling, which is conducive to accelerating the cooling of the micro-etching waste liquid and the precipitation of copper sulfate crystals.

[0040] In a further embodiment of the present invention, reference is made to Figure 1 and Figure 5 The precipitation tank 100 has an inclined surface 340, which is located on the side wall where the discharge port 110 is located. The inclined surface 340 is used to guide the copper sulfate crystals to be discharged. The transmission chain 170 has an inclined section 350 that is parallel to and opposite to the inclined surface 340. The inclined section 350 drives the scraper 160 to move along the inclined surface 340.

[0041] Specifically, the transmission chain 170 is provided with a driving sprocket, a first driven sprocket, a second driven sprocket and a third driven sprocket, the driver 180 has a motor and a reducer connected to the motor, the reducer is connected to the driving sprocket, and the transmission chain 170 is connected to the driving sprocket, the first driven sprocket, the second driven sprocket and the third driven sprocket.

[0042] Understandably, the guide scraper 160 pushes the crystals along the inclined plane 340, and copper sulfate crystals can accumulate between the scraper 160 and the inclined plane 340. Under the guidance of the inclined plane 340, the copper sulfate crystals move from low to high, so that the copper sulfate crystals are discharged from the discharge port 110. This facilitates the discharge of copper sulfate crystals from the liquid and prevents copper sulfate crystals from flowing away from the scraper 160.

[0043] A copper sulfate recovery device for a circuit board copper reduction etching machine according to an embodiment of the present invention further includes a detection component, as shown in the following figure. Figure 6 The detection components include a volumetric flow meter 190 and a temperature sensor 200. The volumetric flow meter 190 is installed in the infusion pipe 140, and the temperature sensor 200 is installed in the precipitation tank 100. The temperature sensor 200 is used to detect the temperature of the micro-etching waste liquid in the precipitation tank 100, and the volumetric flow meter 190 is used to detect the volume of the micro-etching waste liquid flowing into the precipitation tank 100. The water pump 150 is equipped with a first controller 210, which is communicatively connected to the volumetric flow meter 190 and is used to control the amount of micro-etching waste liquid pumped by the water pump 150. The cooler 130 is equipped with a second controller 220, which is communicatively connected to the temperature sensor 200 and the first controller 210 and is used to control the output power of the cooler 130.

[0044] It is understood that the present invention, by setting a volumetric flow meter 190 and a first controller 210, uses the volumetric flow meter 190 to detect the amount of liquid delivered from the infusion pipe 140 to the precipitation tank 100, and can calculate the volume of micro-etching waste liquid input into the precipitation tank 100 each time. Furthermore, the first controller 210 controls the start and stop of the water pump 150 to precisely control the amount of waste liquid injected each time, avoiding excessive injection that would delay the cooling of the micro-etching waste liquid, thus enabling the micro-etching waste liquid to cool down rapidly, improving the precipitation efficiency of copper sulfate crystals, and facilitating the continuous discharge of copper sulfate crystals by the scraping component. This allows the micro-etching waste in the etching tank to be discharged into the precipitation tank 100 in a timely manner, avoiding the problem of excessive micro-etching waste liquid in the etching tank causing overflow.

[0045] Furthermore, by setting a temperature sensor 200 and a second controller 220, the present invention uses the temperature sensor 200 to detect the temperature of the micro-etching waste liquid in the precipitation tank 100, and the second controller 220 to dynamically adjust the power of the cooler 130 to maintain the optimal crystallization temperature, thereby avoiding insufficient temperature drop of the micro-etching waste liquid that would lead to a decrease in crystallization efficiency.

[0046] In some embodiments of the present invention, a filtration assembly is also included. The filtration assembly includes a drain pipe 270 disposed on the bottom wall of the precipitation tank 100 and a filter plate 360 ​​disposed on the drain pipe 270. The drain pipe 270 is used to discharge the micro-etching waste liquid in the precipitation tank 100. The filter plate 360 ​​is made of titanium alloy nano-sintered plate and is embedded in the bottom wall of the precipitation tank 100 and flush with the inner bottom wall of the precipitation tank 100 to filter copper sulfate crystals.

[0047] It should be noted that there can be multiple filter components, which are arranged along the length of the precipitation tank 100.

[0048] Understandably, the titanium alloy nano-sintered filter plate 360 ​​is corrosion resistant and has high filtration accuracy. It can intercept microcrystals, greatly reducing the amount of copper sulfate crystals entering the drain pipe 270. This is beneficial for the separation of copper sulfate crystals and micro-corrosion waste, allowing the copper sulfate crystals to remain in the precipitation tank 100, making it easier for the scraper plate 160 to discharge the copper sulfate crystals.

[0049] The filter plate 360 ​​is designed to be flush with the bottom of the tank to avoid interference between the scraper plate 160 and the filter plate 360 ​​when the scraper plate 160 moves, reduce friction between the scraper plate 160 and the filter plate 360, and ensure smooth movement of the scraper plate 160.

[0050] In some embodiments of the present invention, a vacuum system 280 is also included. The vacuum system 280 is used to generate negative pressure. The vacuum system 280 is provided with a third controller 290. The drain pipe 270 has a first connector and a first solenoid valve 300 disposed on the first connector. The first connector is connected to the vacuum system 280. The first solenoid valve 300 is used to open or close the first connector. The vacuum system 280 draws micro-etching waste liquid from the precipitation tank 100 through the drain pipe 270. The third controller 290 is communicatively connected to the first solenoid valve 300 and the volumetric flow meter 190, respectively, and is used to control the on / off operation between the drain pipe 270 and the vacuum system 280.

[0051] It should be noted that the first connector is positioned opposite to the filter plate 360, allowing compressed air to be directly delivered to the filter plate 360.

[0052] Understandably, after the precipitation tank 100 completes the precipitation of copper sulfate crystals, the vacuum system 280 generates negative pressure. The third controller 290 uses the first solenoid valve 300 to open the drain pipe 270. The negative pressure of the vacuum system 280 can extract the micro-etching waste liquid and quickly separate the micro-etching waste liquid from the copper sulfate crystals. After the draining is completed, the first solenoid valve 300 closes the drain pipe 270, realizing automatic control of the opening of the drain pipe 270 and improving the automation level of the equipment.

[0053] In a further embodiment of the present invention, an air compression system 310 is also included. The air compression system 310 is used to generate compressed air. The air compression system 310 is provided with a fourth controller 320. The drain pipe 270 has a second connector and a second solenoid valve 330 disposed at the first connector. The second connector is connected to the air compression system 310. The second solenoid valve 330 is used to open or close the second connector. The fourth controller 320 is communicatively connected to the first solenoid valve 300, the second solenoid valve 330 and the volumetric flow meter 190, and is used to control the on / off action between the drain pipe 270 and the air compression system 310. When the first solenoid valve 300 is closed, the air compression system 310 provides compressed air through the drain pipe 270 to clean the blockage of the filter plate 360.

[0054] Understandably, after the drain pipe 270 drains the liquid, the air compression system 310 generates compressed air. The fourth controller 320 opens the second solenoid valve 330, and the compressed air is sprayed through the drain pipe 270 onto the filter plate 360. This periodically and automatically cleans the pores of the filter plate 360, preventing long-term crystal accumulation that could clog the filter plate 360 ​​and reducing the frequency of manual cleaning. After the clogging is cleared, the fourth controller 320 closes the second solenoid valve 330 to ensure that the precipitation tank 100 works normally for the next time.

[0055] Meanwhile, the present invention also proposes a method for recovering copper sulfate using the aforementioned copper reduction etching machine for circuit boards, the method comprising: In the liquid injection step, the first controller 210 controls the water pump 150 to start. The water pump 150 extracts the micro-etching waste liquid from the etching tank and injects it into the precipitation tank 100 through the liquid delivery pipe 140. The volume of micro-etching waste liquid injected into the precipitation tank 100 each time is [missing information]. The volumetric flow meter 190 detected the volume of the micro-etched waste liquid in the precipitation tank 100 as follows: The first controller 210 controls the water pump 150 to stop working.

[0056] In the cooling step, the second controller 220 controls the cooler to generate refrigerant, which is introduced into the cooling plate 120 to lower the temperature of the micro-etching waste liquid in the precipitation tank 100. Simultaneously, the driver 180 drives the transmission chain 170 to move the scraper 160 along the precipitation tank 100, agitating the micro-etching waste liquid and ensuring uniform cooling. Let the threshold temperature for copper sulfate crystal precipitation be... Temperature sensor 200 detected a temperature value of less than [value missing] in the micro-etching waste liquid. The second controller 220 controls the output power of the cooler to be increased to the maximum, and the temperature sensor 200 detects that the temperature of the micro-etching waste liquid is greater than [value missing]. The second controller 220 controls the cooler to maintain maximum output power, and controls the water pump 150 to extract the micro-etching waste liquid again through the first controller 210.

[0057] In the precipitation step, the micro-etching waste liquid reaches a certain temperature range, and copper sulfate crystals precipitate in the precipitation tank 100. The driver 180 drives the transmission chain 170 to move the scraper 160 along the precipitation tank 100. The scraper 160 moves the copper sulfate crystals in the precipitation tank 100, and the copper sulfate crystals are discharged to the outside through the discharge port 110.

[0058] Repeat the above steps multiple times, setting the threshold for the precipitation tank 100 to hold the micro-etched waste liquid as follows: , After n injections of micro-etching waste liquid, the volumetric flow meter 190 detected the volume of the etching waste liquid in the precipitation tank 100 as follows: No more micro-etching waste liquid will be injected into the precipitation tank 100.

[0059] During the drainage process, once the copper sulfate crystals have been completely discharged, the volumetric flow meter 190 detects the volume of the corrosion waste liquid in the precipitation tank 100. The third controller 290 controls the first solenoid valve 300 to open, and under the negative pressure of the vacuum system 280, the micro-etching waste liquid in the precipitation tank 100 is discharged to the outside through the drain pipe 270.

[0060] In the unblocking step, after the micro-etching waste liquid is discharged from the precipitation tank 100, the third controller 290 controls the first solenoid valve 300 to close, the fourth controller 320 controls the second solenoid valve 330 to open, and the air compression system 310 sprays compressed air into the filter plate 360 ​​to clean the blockage holes of the filter plate 360.

[0061] Therefore, the above recycling method brings the following effects: 1. Avoid injecting too much micro-etching waste liquid at one time, which will cause the micro-etching waste liquid in the precipitation tank 100 to cool down slowly and reduce the cooling load; 2. Based on the real-time temperature of the micro-etching waste liquid in the tank, promptly replenish the micro-etching waste liquid to the precipitation tank 100 to improve the recovery efficiency of copper sulfate crystals; 3. The scraper 160 moves and stirs the waste liquid, promoting uniform temperature distribution, improving crystallization purity and precipitation rate. It can also discharge copper sulfate crystals from the precipitation tank 100 in a timely manner, which can lower the liquid level of the precipitation tank 100, increase the amount of liquid that the precipitation tank 100 can receive, and improve the recovery capacity of the precipitation tank 100.

[0062] 4. After copper sulfate has completely precipitated, the vacuum drain is automatically triggered without manual intervention, ensuring a seamless recycling process and reducing downtime.

[0063] 5. Use compressed air to clean the gaps regularly to prevent permanent blockage and reduce spare parts replacement costs and downtime maintenance frequency.

[0064] In the description of this specification, the references to terms such as "an embodiment, some embodiments, illustrative embodiments, example, specific example, or examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0065] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A copper sulfate recovery device for a circuit board copper reduction etching machine, characterized in that, include: A precipitation tank is used to inject micro-etching waste liquid, and a discharge port is provided on one side along the length direction of the precipitation tank; A cooling assembly, comprising a cooling plate and a refrigerator that supplies refrigerant to the cooling plate, the cooling plate being disposed on opposite sides of the precipitation tank to form sidewalls in the width direction of the precipitation tank; A liquid supply assembly includes a liquid inlet pipe and a water pump. The liquid inlet pipe is used to deliver micro-etching waste liquid to the precipitation tank. The water pump and the liquid inlet pipe work together to deliver the micro-etching waste liquid from the etching tank to the precipitation tank. The scraping assembly includes multiple scraper blades, a transmission chain connected to the scraper blades, and a driver for driving the transmission chain. The multiple scraper blades are distributed circumferentially along the transmission chain and match the width of the precipitation groove. The transmission chain is arranged along the length of the precipitation groove and drives the scraper blades to move along the length of the precipitation groove, so that the scraper blades scrape copper sulfate crystals from the discharge port. The detection component includes a volumetric flow meter and a temperature sensor. The volumetric flow meter is disposed in the infusion pipe, and the temperature sensor is disposed in the precipitation tank. The temperature sensor is used to detect the temperature of the micro-etching waste liquid in the precipitation tank, and the volumetric flow meter is used to detect the volume of the micro-etching waste liquid flowing into the precipitation tank. The water pump is equipped with a first controller, which is communicatively connected to the volumetric flow meter and is used to control the amount of micro-corrosion waste liquid pumped by the water pump. The cooler is equipped with a second controller, which is communicatively connected to the temperature sensor and the first controller, and is used to control the output power of the cooler.

2. The copper sulfate recovery device for a circuit board copper reduction etching machine according to claim 1, characterized in that, The scraper has a connecting part and a first scraping part. The connecting part is installed on the transmission chain and connected to the first scraping part. The first scraping part is used to slide against the bottom wall of the precipitation tank to push the copper sulfate crystals in the precipitation tank.

3. The copper sulfate recovery device for a circuit board copper reduction etching machine according to claim 1, characterized in that, The scraper also has two second scraping parts, which are respectively connected to the opposite sides of the first scraping part and slide against the side wall of the cooling plate to scrape out copper sulfate crystals on the surface of the cooling plate. A liquid passage hole is formed between the connecting part, the first scraping part and the second scraping part, which allows micro-etching waste liquid to pass through.

4. The copper sulfate recovery device for a circuit board copper reduction etching machine according to claim 1, characterized in that, It also includes a filtration assembly, which includes a drain pipe disposed on the bottom wall of the precipitation tank and a filter plate disposed on the drain pipe. The drain pipe is used to discharge the micro-etching waste liquid in the precipitation tank. The filter plate is made of titanium alloy nano-sintered plate and is embedded in the bottom wall of the precipitation tank and flush with the inner bottom wall of the precipitation tank to filter copper sulfate crystals.

5. The copper sulfate recovery device for a circuit board copper reduction etching machine according to claim 4, characterized in that, It also includes a vacuum system for generating negative pressure. The vacuum system is equipped with a third controller. The drain pipe has a first connector and a first solenoid valve disposed at the first connector. The first connector is connected to the vacuum system. The first solenoid valve is used to open or close the first connector. The vacuum system draws micro-etching waste liquid from the precipitation tank through the drain pipe. The third controller is communicatively connected to the first solenoid valve and the volumetric flow meter, and is used to control the on / off action between the drain pipe and the vacuum system.

6. The copper sulfate recovery device for a circuit board copper reduction etching machine according to claim 5, characterized in that, It also includes an air compression system for generating compressed air. The air compression system is equipped with a fourth controller. The drain pipe has a second connector and a second solenoid valve disposed at the first connector. The second connector is connected to the air compression system. The second solenoid valve is used to open or close the second connector. The fourth controller is communicatively connected to the first solenoid valve, the second solenoid valve and the volumetric flow meter, and is used to control the on / off action between the drain pipe and the air compression system. When the first solenoid valve is closed, the air compression system provides compressed air through the drain pipe to clean the blockage of the filter plate.

7. The copper sulfate recovery device and method for a circuit board copper reduction etching machine according to claim 1, characterized in that, The precipitation tank has an inclined surface located on the side wall where the discharge port is located. The inclined surface is used to guide the copper sulfate crystals to be discharged. The transmission chain has an inclined section parallel to the inclined surface, and the inclined section drives the scraper to move along the inclined surface.

8. A recycling method, characterized in that, A copper sulfate recovery device for a circuit board copper reduction etching machine according to any one of claims 1 to 7, wherein the recovery method includes: In the liquid injection step, the first controller controls the water pump to start, the water pump draws micro-etching waste liquid from the etching tank, and injects the micro-etching waste liquid into the precipitation tank through the liquid delivery pipe. The volume of micro-etching waste liquid injected into the precipitation tank each time is [volume value missing]. The volumetric flow meter detected the volume of the micro-etched waste liquid in the precipitation tank as follows: The first controller controls the water pump to stop working; In the cooling step, the second controller controls the cooler to generate refrigerant, which is introduced into the cooling plate to lower the temperature of the micro-etching waste liquid in the precipitation tank. Simultaneously, the driver drives the transmission chain to move the scraper along the precipitation tank, agitating the micro-etching waste liquid and ensuring uniform cooling. Let the threshold temperature for copper sulfate crystal precipitation be [value missing]. The temperature sensor detected that the temperature of the micro-etching waste liquid was less than The second controller controls the cooler's output power to be increased to the maximum, and the temperature sensor detects that the temperature of the micro-etching waste liquid is greater than [a certain value]. The second controller controls the cooler to maintain maximum output power, and controls the water pump to extract the micro-etching waste liquid again through the first controller; In the precipitation step, the micro-etching waste liquid reaches a temperature that drops to a certain range, and copper sulfate crystals precipitate in the precipitation tank. The driver drives the transmission chain to move the scraper along the precipitation tank, and the scraper moves the copper sulfate crystals in the precipitation tank, so that the copper sulfate crystals are discharged to the outside through the discharge port. Repeat the above steps multiple times, setting the threshold for the precipitation tank to hold the micro-etching waste liquid as follows: , After n injections of micro-etching waste liquid, the volumetric flow meter detected the volume of the etching waste liquid in the precipitation tank as follows: No more micro-etching waste liquid will be injected into the precipitation tank.

9. A recycling method, characterized in that, A copper sulfate recovery device for a circuit board copper reduction etching machine according to any one of claims 5, wherein the recovery method includes: During the drainage step, when the copper sulfate crystals are completely discharged, and the volumetric flow meter detects the volume of the corrosion waste liquid in the precipitation tank, the volumetric flow meter is... The third controller controls the first solenoid valve to open, and under the negative pressure of the vacuum system, the micro-etching waste liquid in the precipitation tank is discharged to the outside through the drain pipe.

10. A recycling method, characterized in that, A copper sulfate recovery device for a circuit board copper reduction etching machine according to any one of claims 6, wherein the recovery method includes: In the unclogging step, after the micro-etching waste liquid is discharged from the precipitation tank, the third controller controls the first solenoid valve to close, the fourth controller controls the second solenoid valve to open, and the air compression system sprays compressed air onto the filter plate to clean the blockage holes of the filter plate.

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