TGV drilling system and method based on space-time modulation Bessel beam

Abstract

The invention relates to the technical field of laser micromachining, in particular to a TGV drilling machining system and method based on a space-time modulation Bessel beam, an initial laser beam is output through a laser device, the initial laser beam is modulated into a dynamic pulse sequence through a pulse chirp regulation and control module, axial energy attenuation is compensated, a machining subsystem generates the Bessel beam, and the TGV drilling machining system and method based on the space-time modulation Bessel beam are obtained. The angle is finely adjusted in real time through piezoelectric driving, and a dynamic spatial light modulator loads an exponential decay type phase mask, so that light beam airspace shaping, non-diffraction light beam generation, pulse time sequence and phase parameter synchronous control and high-peak power pulse array are realized, and finally, integrated micro-perforation and channel modification of the glass substrate are realized; and the machining efficiency and precision are obviously improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser micro-processing, and in particular to a TGV drilling processing system and method based on a spatiotemporal modulation Bessel beam. BACKGROUND

[0002] With the development of semiconductor packaging technology, the direction of high density and high frequency is promoted, and the traditional through silicon via (TSV) technology gradually faces limitations, and glass material has become the preferred solution to replace TSV due to its low dielectric loss and high thermal stability. In the existing glass via (TGV) processing technology, laser-induced etching and Bessel beam processing technologies are widely used in TGV processes, but these problems have become a bottleneck for technological development. First, the laser-induced etching and Bessel beam processing technologies have the problem of uneven axial energy distribution in the high aspect ratio via processing, resulting in insufficient energy at the bottom of the hole or excessive etching at the hole. Second, the problem of beam shaping, many existing beam shaping relies on static devices such as diffractive optical elements (DOE), gratings, etc., which not only limit the complex deformation ability of the beam, but also make it difficult to adapt to the needs of different glass thickness and hole diameter. For example, the microlens array in CN119057273A only supports fixed mode beam splitting, with poor flexibility and adaptability. Finally, the perforation and modification usually need to be performed in steps, which is complex and easy to introduce alignment errors. For example, CN119077176B uses a multi-focal-depth beam to modify the hole in steps, and the interval time between each process is more than 10 seconds, increasing the complexity of the process and potential alignment errors, affecting the overall processing efficiency and precision. SUMMARY

[0003] In order to overcome the deficiencies of the prior art, the present application provides a TGV drilling processing system and method based on a spatiotemporal modulation Bessel beam, which realizes integrated micro-perforation and channel modification of a glass substrate through a spatiotemporal modulation Bessel beam, and realizes energy homogenization and dynamic regulation.

[0004] The first aspect of the present application provides a TGV drilling processing system based on a spatiotemporal modulation Bessel beam, which comprises: a laser, a pulse chirp regulation module, a processing subsystem, a dynamic spatial light modulator, a focusing objective lens, and a glass substrate; the laser, the pulse chirp regulation module, the processing subsystem, and the dynamic spatial light modulator are electrically connected to the synchronous controller; The laser is configured to output an initial laser beam. The pulse chirp regulation module is configured to modulate the laser pulse width of the initial laser beam into a dynamic pulse sequence that varies linearly with time. The processing subsystem is configured to receive the dynamic pulse sequence, convert the incident laser into a Bessel beam through a first conical lens of a double-cone lens group in the processing subsystem, and perform real-time angle fine adjustment using a piezoelectric driving unit through a second conical lens of the double-cone lens group to compensate for beam transmission drift. The dynamic spatial light modulator is configured to load an exponential decay type radial phase mask to perform spatial shaping on the Bessel beam to generate a non-diffracting beam. The focusing objective is configured to focus the non-diffracting beam onto the glass substrate, and based on the synchronization control of the synchronization controller on the pulse timing and the SLM phase parameter, form a high peak power pulse array to realize integrated micro-perforation and channel modification of the glass substrate to obtain TGV drilling.

[0005] In an optional embodiment, the laser is an infrared pulse width adjustable picosecond laser, which outputs an infrared ultrafast laser beam covering the wavelength ranges of 800 nm, 1025-1035 nm, 1059-1070 nm, 1129-1135 nm, and 1940-2100 nm, and the pulse width is continuously adjustable between 0.2 ps and 50 ps or can be set to a specific pulse width.

[0006] In an optional embodiment, the pulse chirp control module includes an acousto-optic modulator and a time delay line, and the peak power of the dynamic pulse sequence is distributed in a stepwise manner over time.

[0007] In an optional embodiment, the processing subsystem is a lens group composed of one or more combinations of single-cone mirrors, single lenses, multiple lenses, focusing mirrors, and objective lenses, and includes the double-cone lens group, which includes a first conical lens, a second conical lens, and a piezoelectric driving unit, the second conical lens is rigidly connected to the piezoelectric driving unit; the cone angle of the double-cone lens group ranges from 1° to 30°, the material is fused quartz, and the optical distance between the first conical lens and the second conical lens is 50-60000 mm.

[0008] In an optional embodiment, the dynamic spatial light modulator is placed in the processing subsystem and is configured to load an exponential decay type radial phase mask.

[0009] The second aspect of the present application provides a TGV drilling processing method based on a spatiotemporal modulation Bessel beam, which is applied to a TGV drilling processing system based on a spatiotemporal modulation Bessel beam, the TGV drilling processing system based on a spatiotemporal modulation Bessel beam includes a laser, a pulse chirp control module, a processing subsystem, a dynamic spatial light modulator, a focusing objective, and a glass substrate, and the method includes: The laser outputs an initial laser beam. The pulse chirp control module modulates the laser pulse width of the initial laser beam into a dynamic pulse sequence that varies linearly with time; The dynamic pulse sequence is incident to a double-taper lens group of the processing subsystem, the incident laser is converted into a Bessel beam by a first taper lens of the double-taper lens group, and a real-time angle fine adjustment is performed by a second taper lens of the double-taper lens group using a piezoelectric driving unit to compensate for beam transmission drift; The dynamic spatial light modulator loads an exponential decay type radial phase mask to perform spatial shaping on the Bessel beam to generate a non-diffracting beam; The non-diffracting beam is focused to the glass substrate by the focusing objective, the pulse timing and SLM phase parameters are synchronously controlled, a high peak power pulse array is formed to realize integrated micro-perforation and channel modification of the glass substrate, and TGV drilling is obtained.

[0010] In an optional embodiment, the pulse width of the dynamic sequence ranges from 0.2 to 10 ps.

[0011] In an optional embodiment, the main lobe diameter of the non-diffracting beam is 0.25-5 μm, and the axial energy uniformity is ≥80%.

[0012] In an optional embodiment, the phase mask expression of the exponential decay type radial phase mask is: ; wherein, is a phase constant, is a decay coefficient, the value of ranges from 0.01 to 0.1 μm 2 , is a linear adjustment factor, r is a radial coordinate.

[0013] In an optional embodiment, the dynamic adjustment of the main lobe diameter of the non-diffracting beam is performed by the dynamic spatial light modulator exponential decay type radial phase mask by real-time updating and values.

[0014] In summary, the TGV drilling processing system and method based on spatiotemporal modulation Bessel beam provided by the present application have at least one of the following beneficial effects: 1. The initial laser beam output by the laser is modulated into a dynamic pulse sequence that varies linearly with time. By adjusting the pulse width, the laser energy is matched to the beam transmission depth on the time axis, compensating for energy attenuation in the glass medium; the first conical lens converts the laser into a Bessel beam, and the second conical lens adjusts the angle in real time through a piezoelectric driving unit, compensating for the drift of the beam during transmission in the glass medium, and making the axial energy distribution of the Bessel beam more uniform through dynamic compensation; through joint regulation of the time domain (pulse chirp) and the spatial domain (double conical lens), the problem of uneven energy distribution in high-depth-ratio hole machining is solved, and hole bottom residue or hole orifice ablation is avoided; 2. The SLM loads an exponential decay type radial phase mask to perform spatial shaping on the Bessel beam. The mask adjusts the transverse phase distribution of the beam to suppress the sidelobe energy while retaining the non-diffractive property of the main lobe; the SLM is linked with a synchronous controller, which can adjust the phase mask structure in real time according to the thickness and aperture of the glass substrate, breaking through the limitations of static devices and realizing the dynamic and parameterization of beam shaping. A single system can adapt to various glass processing needs; 3. The focusing objective lens focuses the non-diffractive beam shaped by the SLM to the glass substrate, and the synchronous controller synchronously controls the pulse timing and the SLM phase parameters; through the cooperative optimization of the pulse timing and the phase parameters, a spatial-time double focused pulse array is formed, which forms a local high temperature and high pressure field in the glass and simultaneously completes the perforation and channel modification, the process interval is shortened to the millisecond level, and the alignment error is reduced to the sub-micron level; the integration and synchronous processing of perforation and modification are realized, which significantly improves the yield and reliability of TGV drilling. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a structure schematic diagram of a TGV drilling processing system based on spatiotemporal modulation Bessel beam according to an embodiment of the present application; Figure 2 is a flow schematic diagram of a TGV drilling processing method based on spatiotemporal modulation Bessel beam according to an embodiment of the present application; Figure 3 is a hole diameter measurement schematic diagram after TGV drilling processing according to an embodiment of the present application; Figure 4 is a hole wall perpendicularity measurement schematic diagram after TGV drilling processing according to an embodiment of the present application; Figure 5 is a schematic diagram of axial intensity distribution after TGV drilling processing according to an embodiment of the present application. DETAILED DESCRIPTION

[0016] The present application will be further described in conjunction with the drawings and embodiments.

[0017] The concept, specific structure and generated technical effects of the present application will be described clearly and completely in combination with the embodiments and drawings, so as to fully understand the purposes, features and effects of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all embodiments, and other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative labor are within the scope of protection of the present application. In addition, all the coupling / connection relationships involved in the patent do not mean that the components are directly connected, but that a better coupling structure can be composed by adding or reducing coupling accessories according to the specific implementation. The technical features in the present application can be combined interactively without conflict.

[0018] Referring to Figure 1 Fig. 1 is a structural schematic diagram of a TGV drilling processing system based on a spatiotemporal modulation Bessel beam according to an embodiment of the present application. The TGV drilling processing system based on the spatiotemporal modulation Bessel beam includes a synchronous controller, a laser, a pulse chirp regulation module, a processing subsystem, a dynamic spatial light modulator, a focusing objective lens and a glass substrate.

[0019] The laser, the pulse chirp regulation module, the processing subsystem and the SLM are electrically connected to the synchronous controller, and the synchronous controller is configured to control the cooperative work of the modules.

[0020] The laser is configured to output an initial laser beam, so that the pulse chirp regulation module modulates the laser pulse width of the initial laser beam into a dynamic pulse sequence that changes linearly with time.

[0021] In the embodiment of the present application, the laser can be an infrared pulse width adjustable picosecond laser. The laser outputs a laser beam covering the wavelength ranges of 800 nm, 1025-1035 nm, 1059-1070 nm, 1129-1135 nm and 1940-2100 nm, and simultaneously outputs an infrared ultrafast laser beam containing the above wavelengths with a pulse width continuously adjustable or settable to a specific pulse width in the range of 0.2 ps-50 ps. Moreover, the repetition frequency of the laser is 1-1000 kHz, and the maximum single pulse energy is 400 μJ.

[0022] The pulse chirp regulation module is connected to the output end of the laser and includes an acousto-optic modulator and a time delay line to realize dynamic modulation of the pulse width. The bandwidth of the acousto-optic modulator is 200 MHz, and the adjustment range of the time delay line is 0-100 ns.

[0023] The initial laser beam output by the infrared pulse width adjustable picosecond laser is incident to the pulse chirp control module, and the pulse width of the initial laser beam is modulated into a dynamic pulse sequence linearly changing with time by the pulse chirp control module. The peak power of the dynamic pulse sequence is distributed in a stepwise manner with time, and the pulse width ranges from 0.2 ps to 10 ps.

[0024] The processing subsystem is configured to receive the incident dynamic pulse sequence, convert the incident laser into a Bessel beam by a first conical lens of a double-cone lens group in the processing subsystem, and perform real-time angle fine adjustment by a second conical lens using a piezoelectric driving unit to compensate for beam transmission drift.

[0025] The processing subsystem is connected to the output end of the pulse chirp control module, and is a lens group composed of one or more combinations of a single conical lens, a single lens, a plurality of lenses, a focusing lens, and an objective lens. In some embodiments, the processing subsystem includes a double-cone lens group, which includes a first conical lens, a second conical lens, and a piezoelectric driving unit, and the second conical lens is rigidly connected to the piezoelectric driving unit. The double-cone lens group has a cone angle ranging from 1° to 30°, and is made of fused quartz. The optical distance between the first conical lens and the second conical lens is 50-60,000 mm. In other embodiments, the lens group includes a first conical lens, a second focusing lens, and a piezoelectric driving unit. The cone angle of the first conical lens is 5°, the focal length of the second focusing lens is 50 mm, and the distance between the first conical lens and the second focusing lens is 110 mm. The second focusing lens is connected to the piezoelectric driving unit, and the resolution of the piezoelectric driving unit is 0.01°.

[0026] Specifically, the processing subsystem is electrically connected to the synchronous controller through the piezoelectric driving unit.

[0027] After the pulse chirp control module outputs the dynamic pulse sequence, the dynamic pulse sequence is incident to the double-cone lens group, the incident laser is converted into a basic Bessel beam by the first conical lens of the double-cone lens group, and the second conical lens performs real-time angle fine adjustment within a range of ±0.1° by the piezoelectric driving unit to compensate for beam transmission drift.

[0028] The dynamic spatial light modulator is configured to load an exponential decay type radial phase mask to perform spatial shaping on the Bessel beam to generate a non-diffracting beam.

[0029] The dynamic spatial light modulator (SLM) is connected to the output end of the processing subsystem and is placed in the processing subsystem to load the exponential decay type radial phase mask. In some embodiments, the dynamic SLM can be a reflective pure phase type, the pixel is 1920x1080, and the refresh frequency is 2 kHz.

[0030] The exponential decay type radial phase mask is loaded by the SLM to perform spatial shaping on the basic Bessel beam to generate a non-diffracted beam with a main lobe diameter of 0.25-5 μm and an axial energy uniformity of ≥80%.

[0031] Specifically, the expression of the phase mask of the exponential decay type radial phase mask is: ; wherein, is a phase constant, is a decay coefficient, the value range of is 0.01-0.1 μm 2 , is a linear adjustment factor, r is a radial coordinate.

[0032] The exponential decay type radial phase mask of the dynamic SLM is updated in real time and to achieve dynamic adjustment of the main lobe diameter of the non-diffracted beam.

[0033] The focusing objective is used to focus the non-diffracted beam to the glass substrate, and the pulse timing and SLM phase parameters are synchronously controlled to form a high peak power pulse array to realize integrated micro-perforation and channel modification of the glass substrate to obtain a TGV drill hole.

[0034] The focusing objective is connected to the output end of the dynamic SLM to focus and shape the Bessel beam, i.e., the non-diffracted beam. The glass substrate is connected to the output end of the focusing objective. In some embodiments, the numerical aperture NA of the focusing objective is 0.40, and the working distance is 18 mm.

[0035] After the dynamic SLM outputs the non-diffracted beam, the non-diffracted beam is incident to the focusing objective, and the focusing objective can focus the non-diffracted beam to the glass substrate. By synchronously controlling the pulse timing and SLM phase parameters, a series of high peak power pulse arrays can be formed to complete micro-perforation and channel modification of the glass substrate, and a TGV drill hole with a depth-to-diameter ratio of ≥200:1 can be obtained.

[0036] This application achieves coordinated control of "temporal pulse shaping and spatial phase modulation" through a synchronous controller, laser, pulse chirp control module, processing subsystem, dynamic spatial light modulator, focusing objective, and glass substrate. In the temporal domain, pulse array control reduces the laser pulse width with increasing glass processing depth to compensate for energy loss during deep processing and ensure axial energy uniformity. In the spatial domain, a Bessel beam is generated using a lens group and a dynamic SLM, and an exponentially decaying phase mask is applied to the SLM to overcome the limitations of high-order polynomial phase functions, achieving real-time adjustment of the main lobe diameter. Simultaneously, by synchronously controlling the pulse timing and phase parameters, integrated processing (using high-peak-power short pulses) and modification (using low-peak-power long pulses) is achieved without the need for step-by-step optical path switching.

[0037] Reference Figure 2 The diagram shown is a flowchart illustrating a TGV drilling method based on a time-controlled Bessel beam, according to an embodiment of this application. The TGV drilling method based on a time-controlled Bessel beam includes the following steps.

[0038] S21, outputs the initial laser beam.

[0039] The initial laser beam output from the laser is used as an energy source, and this output laser beam is then injected into the pulse chirp control module.

[0040] S22 modulates the pulse width of the initial laser beam into a dynamic pulse sequence that changes linearly with time.

[0041] When the laser outputs the initial laser beam, it will send the initial laser beam into the pulse chirp control module. The acousto-optic modulator and time delay line of the pulse chirp control module can modulate the pulse width of the initial laser beam into a dynamic pulse sequence that changes linearly with time, so as to compensate for the energy loss in deep glass processing.

[0042] S23 converts the incident laser into a Bessel beam and performs real-time angle fine-tuning.

[0043] When the pulse chirp control module outputs a dynamic pulse sequence, it uses this sequence as the incident laser and injects it into the processing subsystem. The processing subsystem converts the incident laser into a basic Bessel beam and simultaneously performs real-time angle fine-tuning to compensate for beam transmission drift. Specifically, the processing subsystem includes a biconical lens group (a first conical lens and a second conical lens) and a piezoelectric drive unit. The first conical lens converts the incident laser into a Bessel beam, and the second conical lens has its angle fine-tuned in real time by the piezoelectric drive unit.

[0044] S24, Apply an exponentially decaying radial phase mask to spatially shape the Bessel beam and generate a diffraction-free beam.

[0045] The processing subsystem shoots the Bessel beam into the SLM when outputting the Bessel beam, and performs spatial shaping on the Bessel beam by loading an exponential decay type radial phase mask on the SLM to generate a non-diffracting beam. Specifically, the SLM controls the optical performance (refractive index or optical path difference) of each pixel through an electrical signal, thereby performing pixel-level and programmable accurate modulation on the phase of the incident light wave, that is, loading a phase map into software (for example, MATLAB, LabVIEW, HoloEye SLM PatternGenerator, Meadowlark Optics SLM Display, etc.), which controls the liquid crystal array in the SLM camera to adjust the arrangement, so that the reflected light has a specific phase. After the incident Bessel beam is modulated by the SLM, the wavefront phase distribution is reshaped as an exponential decay type, and through Fourier transform or free space propagation, the spatial distribution of the light beam changes to generate a non-diffracting beam (such as an Airy beam, a flat-top beam, etc.). The main lobe diameter of the non-diffracting beam can be adjusted in real time through the exponential decay type radial phase mask, avoiding the limitations of high-order polynomial phase functions (such as traditional high-order curved surface design), and realizing more flexible beam control.

[0046] Specifically, the phase mask expression of the exponential decay type radial phase mask is: ; wherein, is a phase constant, is a decay coefficient, the value range of a is 0.01-0.1 μm 2 , is a linear adjustment factor, r is a radial coordinate.

[0047] In addition, the main lobe diameter of the non-diffracting beam can be dynamically adjusted, specifically by using the SLM exponential decay type radial phase mask to realize by updating and values in real time. In the implementation of the present application, the phase distribution constructed by using the exponential decay type function naturally avoids the oscillation problem of high-order polynomials at the boundary, and has higher fitting accuracy; in addition, a phase mask constructed by a smooth exponential function has fewer, smoother and more regular phase jump lines after being wrapped by the SLM within 2π phase, which is equivalent to the effect of a blazed grating, can highly concentrate the light energy to the first order of diffraction of the target, significantly improves the energy utilization efficiency (sometimes more than 80%), and greatly suppresses speckle and background noise, generates a purer and higher quality target light field, that is, a Bessel beam.

[0048] S25, focusing the non-diffracting beam to the glass substrate.

[0049] S26, synchronously control the pulse timing and the SLM phase parameter.

[0050] S27, form a high peak power pulse array, realize integrated micro-perforation and channel modification, and obtain a TGV drilling hole.

[0051] When the SLM outputs a non-diffracting beam, the non-diffracting beam is incident to a focusing objective, and the focusing objective focuses the non-diffracting beam to a glass substrate. At the same time, the pulse timing and the SLM phase parameter are synchronously controlled by a synchronous controller, so that the integrated processing of perforation (high peak power short pulse) and modification (low peak power long pulse) is realized without step switching of an optical path. The high peak power short pulse is used for quickly penetrating the glass, and the low peak power long pulse is used for optimizing the hole wall quality (such as reducing the heat affected zone and improving the surface roughness). Finally, a TGV drilling hole can be realized.

[0052] The application realizes dynamic optimization of processing parameters, improves processing efficiency and quality through the cooperation of time domain pulse shaping and space domain phase modulation; reduces focusing errors through the long focal depth characteristics of the Bessel beam, and further enhances the controllability of the beam through the exponential decay type phase mask; and the synchronous control technology simplifies the optical path design and reduces the system complexity, which is suitable for high-precision TGV drilling requirements. That is, the application realizes high-precision and high-efficiency processing of TGV drilling by spatiotemporal modulation of the Bessel beam, effectively avoiding the limitations of static shaping and step-by-step processing in the prior art, and is suitable for fields such as 5G communication and optoelectronic co-packaging. In order to facilitate understanding of the inventive idea of the application, a specific example is provided as follows: Suppose that a 1.1mm thick AF35G glass substrate needs to be drilled, and the target through-hole diameter is 50μm.

[0053] Step 1, the laser outputs an initial pulse, and after chirp control, a dynamic pulse sequence of 20ps→2ps is generated, and the peak power is linearly increased from 20MW to 200MW.

[0054] Step 2, the lens group converts the laser into a basic Bessel beam, and the piezoelectric driving unit adjusts the angle of the second conical lens in real time (±0.05°) to compensate for the drift of the beam.

[0055] Step 3, the SLM loads α =0.05μm⁻², β =0.1 of the exponential phase mask to generate a non-diffracting beam with a main lobe diameter of 2μm.

[0056] Step 4, after focusing, the glass is processed, the first 100ns is perforated with a 20ps pulse, and the subsequent 500ns is modified with a 2ps pulse. The SLM updates the phase to ensure that the axial energy uniformity is ≥80% and the hole wall roughness Ra is <150nm.

[0057] The roughness of the hole wall after drilling is measured by a white light interferometer. Among them, samples 1, 2, 3, and 4 are AF35G original glass without any surface treatment, and samples 5, 6, 7, and 8 are structured glass (AF35G) after drilling. For structured glass, the surface roughness and the roughness of the inner wall of the hole are measured. The specific glass surface roughness measurement results are as shown in Table 1.

[0058] Table 1:

[0059] Among them, the original glass refers to the AF35G glass without any surface grinding and polishing treatment, and the structured glass refers to the glass after drilling. Sq is a two-dimensional parameter, and Ra is a corresponding one-dimensional parameter.

[0060] The roughness data (Ra) of the inner wall of the through hole is as shown in Table 2.

[0061] Table 2:

[0062] Referring to Figure 3 , by observing the cross section by cutting the hole, the thickness and the hole diameter of the structured glass after drilling can be measured by using a Keyence microscope (model VHX-S650), and the depth-diameter ratio data can be determined according to the thickness and the hole diameter as shown in Table 3.

[0063] Table 3:

[0064] Similarly, referring to Figure 4 , by observing the cross section by cutting the hole, the hole wall perpendicularity is measured by using a Keyence microscope, and the hole wall perpendicularity data is as shown in Table 4.

[0065] Table 4:

[0066] Referring to Figure 5 , the axial energy uniformity is measured by using a beam analyzer, the horizontal direction is the distance of axial transmission, the unit is μm, and the vertical coordinate is the measured light intensity. The axial energy uniformity can be determined to be ≥80% by taking the theoretical Bessel non-diffraction region (i.e. the corresponding region with a vertical coordinate greater than 200 in the positive direction).

[0067] Through verification, the roughness Ra of the side wall of the through hole after processing is ≤150 nm, the depth-diameter ratio can reach 200:1, the hole wall perpendicularity deviation is <0.5°, and the axial energy uniformity is ≥80%, which meets the packaging requirements.

[0068] The application adopts a space-time modulation cooperation mechanism, is different from the existing static light beam shaping technology, realizes dynamic adaptation to processing requirements, and improves axial energy uniformity to >=80%, breaks through 200:1 in depth-diameter ratio, and the side wall roughness Ra is <=150nm; integrated perforation and modification are completed, the process time is shortened by 50%, and compatibility covers borosilicate glass, quartz and various substrates.

[0069] It should be noted that, for the foregoing method embodiments, in order to facilitate description, they are all expressed as a series of action combinations, but those skilled in the art should know that the present application is not limited by the action sequence described, because according to the present application, certain steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should know that the embodiments described in the specification all belong to preferred embodiments, and the actions and modules involved are not necessarily essential to the present application.

[0070] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0071] The above is a specific description of the preferred implementation of the present application, but the present application is not limited to the described embodiments, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the present application. These equivalent modifications or replacements are all included in the scope defined by the claims of the present application.

Claims

1. A TGV drilling system based on spatiotemporally modulated Bessel beams, characterized in that, The system comprises a synchronous controller, and further comprises: The laser, the pulse chirp control module, the processing subsystem, the dynamic spatial light modulator, the focusing objective and the glass substrate; the laser, the pulse chirp control module, the processing subsystem, the dynamic spatial light modulator are electrically connected to the synchronous controller; The laser is configured to output an initial laser beam; The pulse chirp control module is configured to modulate the laser pulse width of the initial laser beam into a dynamic pulse sequence that linearly changes over time; The processing subsystem is configured to receive the dynamic pulse sequence, convert the incident laser into a Bessel beam through a first conical lens of a double-cone lens group in the processing subsystem, and use a piezoelectric driving unit to perform real-time angle fine adjustment through a second conical lens of the double-cone lens group to compensate for beam transmission drift; The dynamic spatial light modulator is configured to load an exponential decay type radial phase mask, spatially shape the Bessel beam, and generate a non-diffracting beam; The focusing objective is configured to focus the non-diffracting beam to the glass substrate, synchronize the pulse timing and SLM phase parameters based on the synchronous controller, form a high peak power pulse array to realize integrated micro-perforation and channel modification of the glass substrate, and obtain a TGV drill hole.

2. The TGV drilling machining system based on spatiotemporal modulated Bessel beam of claim 1, wherein, The laser is an infrared pulse width adjustable picosecond laser, which outputs an infrared ultrafast laser beam covering the wavelength ranges of 800 nm, 1025-1035 nm, 1059-1070 nm, 1129-1135 nm and 1940-2100 nm, and the pulse width is continuously adjustable between 0.2 ps and 50 ps or can be set to a specific pulse width.

3. The TGV drilling machining system based on spatiotemporal modulated Bessel beam of claim 1, wherein, The pulse chirp control module comprises an acousto-optic modulator and a time delay line, and the peak power of the dynamic pulse sequence is distributed in a stepwise manner over time.

4. The TGV drilling machining system based on spatiotemporal modulated Bessel beam of claim 1, wherein, The processing subsystem is a lens group composed of one or more combinations of single-cone mirrors, single lenses, multiple lenses, focusing mirrors and objectives, and comprises the double-cone lens group, which comprises a first conical lens, a second conical lens and a piezoelectric driving unit, the second conical lens is rigidly connected to the piezoelectric driving unit; the cone angle of the double-cone lens group ranges from 1° to 30°, the material is fused quartz, and the optical distance between the first conical lens and the second conical lens is 50-60000 mm.

5. The TGV drilling machining system based on spatiotemporal modulated Bessel beam of claim 1, wherein, The dynamic spatial light modulator is placed in the processing subsystem and is configured to load an exponential decay type radial phase mask.

6. A TGV drilling method based on spatiotemporally modulated Bessel beams, characterized in that, The method is applied to the TGV drilling processing system based on the spatiotemporal modulation Bessel beam in any one of claims 1 to 5, the TGV drilling processing system based on the spatiotemporal modulation Bessel beam comprises a laser, a pulse chirp control module, a processing subsystem, a dynamic spatial light modulator, a focusing objective and a glass substrate, and the method comprises: The laser outputs an initial laser beam; The pulse chirp control module modulates the laser pulse width of the initial laser beam into a dynamic pulse sequence that linearly changes over time; The dynamic pulse sequence is incident to a double-taper lens group of the processing subsystem, the incident laser is converted into a Bessel beam by a first taper lens of the double-taper lens group, and real-time angle fine adjustment is performed on the Bessel beam by a second taper lens of the double-taper lens group using a piezoelectric driving unit to compensate for beam transmission drift; The dynamic spatial light modulator loads an exponential attenuation type radial phase mask to perform spatial shaping on the Bessel beam to generate a non-diffracting beam; The non-diffracting beam is focused to the glass substrate by the focusing objective, the pulse timing and the SLM phase parameters are synchronously controlled, a high peak power pulse array is formed to realize integrated micro-perforation and channel modification of the glass substrate, and TGV drilling is obtained.

7. The TGV drilling process based on spatiotemporally modulated Bessel beams according to claim 6, wherein, The pulse width of the dynamic sequence ranges from 0.2 to 10 ps.

8. The TGV drilling process based on spatiotemporally modulated Bessel beams according to claim 6, wherein, The main lobe diameter of the non-diffracting beam is 0.25-5 μm, and the axial energy uniformity is greater than or equal to 80%.

9. The TGV drilling process based on spatiotemporally modulated Bessel beams according to claim 6, wherein, The phase mask expression of the exponential attenuation type radial phase mask is: ； wherein, is a phase constant, is an attenuation coefficient, has a value in the range 0.01-0.1 μm 2 , is a linear adjustment factor, r is a radial coordinate.

10. The TGV drilling process based on spatiotemporally modulated Bessel beams according to claim 9, wherein, by the dynamic spatial light modulator exponential decay type radial phase mask by real-time updating with values, dynamic adjustment of the main lobe diameter of the non-diffracting beam is performed.

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