Radio frequency module, radar and electronic equipment

Abstract

The embodiment of the invention relates to the technical field of semiconductors, and discloses a radio frequency module, radar and electronic equipment, the radio frequency module comprises a chip packaging body, the chip packaging body is provided with at least one radiation part, and a plurality of salient points are arranged around the radiation part and form a first waveguide channel; a second waveguide channel is arranged at the position, corresponding to each first waveguide channel, of the PCB carrier plate; the waveguide antenna is provided with at least one antenna unit and a third waveguide channel; wherein the first waveguide channel, the second waveguide channel and the third waveguide channel are communicated to form a radio frequency signal transmission channel. According to the scheme, the loss of the module on the feeder line can be effectively reduced, and the waveguide antenna is externally connected to the PCB, so that replacement is convenient to realize.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a radio frequency module, radar, and electronic device. Background Technology

[0002] In traditional packaging technology, radio frequency (RF) signals are generated by integrated circuits (ICs) and connected to external circuits through the package. After fan-out, the RF signal is connected to a planar waveguide in a printed circuit board (PCB) via solder balls, establishing a signal path. The RF signal then connects to the antenna via a planar waveguide feed line on the PCB. Because planar waveguides have significant dielectric and radiation losses, which are proportional to the length of the feed line, this type of RF module using a planar waveguide to feed the antenna suffers from high losses. Furthermore, since the antenna is designed on the PCB, once the chip is soldered to the PCB, the antenna cannot be replaced. Summary of the Invention

[0003] The purpose of this application is to provide a radio frequency module, radar, and electronic device that can effectively reduce the loss of the module on the feed line, and the waveguide antenna is externally connected to the PCB board for easy replacement.

[0004] To address the aforementioned technical problems, one embodiment of this application provides a radio frequency module, comprising:

[0005] A chip package, wherein at least one radiating portion is provided on a first surface of the chip package, and a plurality of bumps are provided on the first surface, the plurality of bumps being arranged around the radiating portion and forming a first waveguide channel;

[0006] The PCB carrier has a second surface and a third surface, the second surface being mated with the first surface of the chip package, and a second waveguide channel is provided on the PCB carrier at the location corresponding to the first waveguide channel;

[0007] A waveguide antenna has a fourth surface and a fifth surface opposite to each other, the fourth surface being mated with the third surface, the fifth surface being provided with at least one antenna element, and a third waveguide channel being provided inside the waveguide antenna;

[0008] The first waveguide channel, the second waveguide channel, and the third waveguide channel are connected to form a radio frequency signal transmission channel.

[0009] Compared with related technologies, the embodiments of this application design a radiating portion on the outer surface of the chip package, and set multiple bumps around the radiating portion to form a first waveguide channel around each radiating portion; a second waveguide channel is set at the corresponding position of the PCB carrier and each first waveguide channel; a third waveguide channel is set inside the waveguide antenna; the radio frequency signal is connected through the first waveguide channel, the second waveguide channel and the third waveguide channel to form a radio frequency signal transmission channel, transmitting the radio frequency signal inside the package to the external waveguide antenna without the need for other conversion structures, reducing the complexity of the design, and also helping to reduce the chip size, increase the channel isolation of the multi-channel system and reduce system loss; the use of waveguide antenna technology can also effectively reduce feeder loss and improve the performance of the radio frequency module.

[0010] In some embodiments, the chip package includes at least a substrate and an IC die; the side of the substrate facing away from the IC die is the first surface, and a feed line is provided inside the substrate, through which the radio frequency signal is transmitted to the radiating part.

[0011] In some embodiments, the substrate includes at least a metal ground layer, a feed line layer, and a patch layer; the feed line is disposed on the feed line layer, and the radiating portion is disposed on the patch layer; wherein the radio frequency signal is coupled to the radiating portion through the feed line.

[0012] In some embodiments, an isolation structure is provided on the fourth surface, the isolation structure comprising a plurality of periodically arranged protrusions.

[0013] In some embodiments, the protrusion structure includes a plurality of first protrusion structures and a plurality of second protrusion structures, wherein the cross-sectional area of ​​the first protrusion structure is greater than or equal to the cross-sectional area of ​​the second protrusion structure.

[0014] In some embodiments, the gap between the upper surfaces of the first protrusion structure and the second protrusion structure and the third surface does not exceed 400 μm.

[0015] In some embodiments, the plurality of first protrusion structures are located on the centerline of the long side of the third waveguide channel.

[0016] In some embodiments, the heights of the first protrusion structure and the second protrusion structure are . Where λ is the operating wavelength of the radio frequency signal.

[0017] In some embodiments, a plurality of second protrusion structures are arranged around the first protrusion structure, and the first protrusion structure and the second protrusion structure are cylinders.

[0018] In some embodiments, the diameter of the second protrusion structure is Where λ is the operating wavelength of the radio frequency signal.

[0019] In some embodiments, the distance between the first protrusion structure and the adjacent second protrusion structure is . Where λ is the operating wavelength of the radio frequency signal.

[0020] In some embodiments, the third waveguide channel is connected to the antenna element from one end of the wide side or at the middle of the wide side.

[0021] In some embodiments, the third waveguide channel includes at least two cavity segments with rectangular cross-sections, and a stepped transition structure is provided at the connection between adjacent cavity segments.

[0022] In some embodiments, the radiating part is a radiating patch.

[0023] In some embodiments, the cross-section of the second waveguide channel is single-ridge type.

[0024] In some embodiments, the bump is a solder ball.

[0025] In some embodiments, the second surface is connected to the first surface via a plurality of solder balls.

[0026] In some embodiments, the second waveguide channels are arranged in an array, and the long sides of two adjacent second waveguide channels are perpendicular to each other.

[0027] In some embodiments, the antenna element includes a plurality of radiating slots for transmitting and / or receiving the radio frequency signals.

[0028] Another aspect of this application provides a radar, including: a radio frequency module as described in any of the above embodiments.

[0029] Another embodiment of this application provides an electronic device, including: the radar described above. Attached Figure Description

[0030] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0031] Figure 1 This is a cross-sectional view of a radio frequency module in the prior art;

[0032] Figure 2 This is a cross-sectional view of a radio frequency module provided according to an embodiment of this application;

[0033] Figure 3This is a cross-sectional view of the connection between the substrate and the PCB carrier according to an embodiment of this application;

[0034] Figure 4 This is a top view of the substrate and bump connection provided according to an embodiment of this application;

[0035] Figure 5 This is a top view of the connection between the substrate, bumps, and PCB carrier according to an embodiment of this application;

[0036] Figure 6 This is a top view of a PCB carrier provided according to an embodiment of this application;

[0037] Figure 7 This is a top view of a waveguide antenna provided according to an embodiment of this application;

[0038] Figure 8 This is a schematic diagram of the connection method between the feeder and the antenna element according to an embodiment of this application;

[0039] Figure 9 This is a schematic diagram of the feeder and antenna unit layout according to an embodiment of this application;

[0040] Figure 10 This is a schematic diagram of a double-layer waveguide antenna structure according to an embodiment of this application;

[0041] Figure 11 This is a schematic diagram of a stepped transition structure provided according to an embodiment of this application. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the various embodiments of this application will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details are presented in the various embodiments of this application to enable readers to better understand this application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in this application can be implemented. The division of the following embodiments is for the convenience of description and should not constitute any limitation on the specific implementation of this application. The various embodiments can be combined with and referenced by each other without contradiction.

[0043] In traditional packaging technologies, such as Figure 1As shown, the radio frequency (RF) signal is generated by the IC in chip 01 and connected to the external circuit through the package. After being fanned out by the package substrate, the RF signal passes through solder balls 02 and the planar waveguide in PCB board 03 to establish a signal path. Then, it is connected to antenna 04 on PCB board 03 via a planar waveguide feed line. In other words, the transmission process of the RF signal from the IC to antenna 04 is entirely completed using a planar waveguide mode, and antenna 04 is also fixedly mounted on the surface of PCB board 03 facing chip 01. Because planar waveguides have significant dielectric and radiation losses, which are proportional to the length of the feed line, RF modules using planar waveguides to feed the antenna have high system losses. Furthermore, once the chip is soldered to the PCB board, the antenna cannot be replaced.

[0044] One embodiment of this application relates to a radio frequency module, such as Figure 2 As shown, the RF module includes: a chip package 11, a PCB carrier 21, and a waveguide antenna 31.

[0045] The chip package 11 has at least one radiating portion 12 on its first surface S1 and a plurality of bumps 13 on its first surface S1. The plurality of bumps 13 are arranged around the radiating portion 12 and form a first waveguide channel 14.

[0046] The first surface S1 is the side of the chip package 11 facing the PCB carrier 21. A radiating part 12 is disposed on the first surface S1, which is used to transmit and receive radio frequency signals. The radiating part 12 can be a radiating patch, but it is not limited to a radiating patch; it can also be other forms of radiating structure. The shape of the radiating patch can be at least one of rectangular, rhomboid, and butterfly shapes, or it can be any other arbitrary pattern shape. The radiating patch is disposed in a patterned form in the metal layer of the integrated circuit.

[0047] Multiple radiating sections 12 can be provided, and each radiating section 12 is surrounded by multiple protrusions 13. The protrusions 13 can be solder balls or can be made by means of conductive adhesive. The shape of the protrusions 13 can be spherical, columnar, block, or any other shape; the protrusions 13 can be metal solder balls, and their material can be gold, copper, copper-nickel-gold, tin, etc.

[0048] Figure 2 and Figure 3 In the middle, the space surrounded by multiple protrusions 13 serves as a waveguide channel for radio frequency signal transmission, and is called the first waveguide channel 14.

[0049] Figure 2 and Figure 4In the process, the radio frequency signal inside the chip package 11 can be radiated into the first waveguide channel through the radiating part 12. The protrusions 13 arranged around the radiating part 12 are connected to the chip package 11 at one end and to the PCB carrier 21 at the other end. The closed rectangular circle formed by these protrusions can confine the electromagnetic wave in a single signal transmission channel, thereby effectively preventing signal leakage between channels, reducing crosstalk between channels, and improving isolation.

[0050] Figure 2 In the PCB carrier 21, there are opposing second surfaces S2 and third surfaces S3. The second surface S2 is connected to the first surface S1 of the chip package 11. The second waveguide channel 22 is provided at the corresponding position of the PCB carrier 21 and the first waveguide channel 14.

[0051] The second surface S2 and the third surface S3 are two surfaces parallel to the metal layers in the PCB board 21. The second surface S2 directly contacts the bump 13 to achieve the docking between the PCB carrier 21 and the chip package 11. When the bump 13 is a solder ball, the second surface S2 and the first surface S1 can be connected by the solder ball through the soldering action to achieve a stable docking. On the docked second surface S2, a second waveguide channel 22 is provided at the position corresponding to each first waveguide channel 14, penetrating the second surface S2 and the third surface S3. The cross-section of the second waveguide channel 22 can be single-ridge type, or it can be rectangular, double-ridge type, or other structures.

[0052] Setting the cross-section of the second waveguide channel 22 to a single ridge type can effectively reduce the area occupied by the second waveguide channel 22 on the PCB carrier board 21 compared to the conventional rectangular waveguide. Since the channel port size of the first waveguide channel 14 surrounded by the bumps 13 is consistent with that of the second waveguide channel 22, the setting of the single ridge type waveguide channel can reduce the size of the chip package 11 by reducing the size of the first waveguide channel 14.

[0053] Figure 2 In the middle, the waveguide antenna 31 has a fourth surface S4 and a fifth surface S5 opposite to each other. The fourth surface S4 is connected to the third surface S3. At least one antenna element 32 is provided on the fifth surface S5. A third waveguide channel 33 is provided in the waveguide antenna 31.

[0054] The fourth surface S4 is the side where the waveguide antenna 31 mates with the third surface S3 of the PCB carrier 21, and the fifth surface S5 is the side of the waveguide antenna 31 facing away from the PCB carrier 21 when it is mated with the PCB carrier 21. An antenna element 32 is disposed on the fifth surface S5. The antenna element 32 is used to transmit and receive radio frequency signals. Each antenna element 32 may include multiple radiating slots (waveguide slot antennas) for transmitting and / or receiving radio frequency signals. Multiple third waveguide channels 33 are disposed within the waveguide antenna 31. One end of each third waveguide channel 33 is connected to a second waveguide channel 22, and the other end is connected to an antenna element 32.

[0055] Figure 2 In the chip package 11, the radio frequency signal generated is coupled to the radiating part 12 and radiated outward. It is then transmitted to the antenna unit 32 through the radio frequency signal transmission channel formed by the sequential connection of the first waveguide channel 14, the second waveguide channel 22 and the third waveguide channel 33. The antenna unit 32 then radiates the signal outward as a radio signal. Conversely, after receiving the radio signal, the antenna unit 32 transmits it to the radiating part 12 through the radio frequency signal transmission channel formed by the third waveguide channel 33, the second waveguide channel 22 and the first waveguide channel 14. The radiating part 12 then couples the received signal into the chip package 11 for processing.

[0056] The radio frequency signal transmission channel enables the connection and matching of the chip package 11, PCB carrier 21 and waveguide antenna 31. The waveguide antenna 31 can be directly connected to the chip package 11 without other conversion structures, reducing the load on the design. Compared with planar waveguides, the use of waveguide antenna 31 can effectively reduce feeder loss and improve the output performance of the radio frequency module.

[0057] In addition, the PCB carrier 21 is located between the chip package 11 and the waveguide antenna 31. Besides connecting the chip package 11 and the waveguide antenna 31, it can also carry other peripheral circuits. These peripheral circuits and the second waveguide channel 22 can be isolated from each other by setting a gap in the non-metallic area.

[0058] In some embodiments, such as Figure 2 As shown, the chip package 11 includes at least a substrate 15 and an IC die 16. The side of the substrate 15 facing away from the IC die 16 is a first surface S1, and a feed line 17 is provided inside the substrate, through which radio frequency signals are transmitted to the radiating part 12.

[0059] The substrate 15 serves both as a carrier for the IC die 16 and as a medium for transmitting the radio frequency signals generated by the IC die 16 to the radiating sections 12. By providing feed lines 17 inside the substrate, the radio frequency signals generated by the IC die 16 can be fanned out to multiple radiating sections 12 that are arranged in a relatively dispersed manner.

[0060] In some embodiments, such as Figures 3-5 As shown, the substrate 15 includes at least a metal ground layer 151, a feed line layer 152, and a patch layer 153; a feed line 17 is disposed on the feed line layer 151, and a radiating part 12 is disposed on the patch layer 153, wherein radio frequency signals are coupled to the radiating part 12 through the feed line 17.

[0061] Figure 3 This is a top view of the feed layer 152 and the surface mount layer 153, viewed from inside the chip package 11 to outside the chip package 11. Figure 2 and Figure 3 In this process, the radio frequency signal generated by the IC die 16 is transmitted to the feed layer 152 via via 18, and coupled to the radiating portion 12 of the surface mount layer 153 at the end of the feed line 17. The feed layer 152 and the surface mount layer 153 have opposing rectangular openings 19. The two rectangular openings 19 can be the same or different in size. The feed line 17 and the radiating portion 12 are located within the rectangular openings 19 of their respective metal layers, and the outside of the rectangular openings 19 is the GND. The gap created by the rectangular openings 19 can isolate the feed line 17 and the radiating portion 12 from the external GND. Vias 18 arranged at equal intervals can also be provided near the inner side of the rectangular openings 19 near the GND. These vias 18 connect the GND of the feed layer 152 and the GND of the surface mount layer 153. Below the surface mount layer 153, a ring of grounded solder balls 13 is soldered below the GND of the outer ring of the rectangular openings 19, and the lower surface of the solder balls is soldered to the PCB carrier board 21.

[0062] Figures 4-5 In this configuration, when the radiating section 12 radiates the millimeter-wave signal obtained from the feed line 17 via coupling, the closed first waveguide channel 14, enclosed by the solder balls 13 surrounding the radiating section 12, can confine the electromagnetic wave within a single signal transmission channel, thereby reducing crosstalk between channels and improving isolation. The cavity formed by the GND of the patch layer 153 within the substrate 15, the solder balls 13, and the metal on the upper surface of the PCB carrier 21 serves as mode matching and impedance matching between the radiating section 12 and the single-ridged window (second waveguide channel 22), allowing the electromagnetic wave to be effectively converted from the planar microstrip line transmission mode to the waveguide transmission mode.

[0063] Figure 5 This is a top view of the connection between the feeder layer 152, the surface mount layer 153 and the PCB carrier 21, viewed from inside the chip package 11 to outside the chip package 11. Figure 3 and Figure 5In the PCB carrier 21, a single-ridge window is opened as a second waveguide channel 22, which is positioned directly opposite the position of the radiating part 12 in the chip package. The sidewalls and upper and lower surfaces of the single-ridge window are plated with conductive metal layers, and the metal plating on the upper and lower surfaces extends outward from the edge of the single-ridge window to cover the soldering area of ​​the solder ball 13.

[0064] In actual process design, no other metal layer may be provided on the other side of the metal ground layer 151 in the substrate 15, and the IC die 16 can be directly placed above the metal ground layer 151. The function of the metal ground layer 151 is to provide isolation between the IC die 16 and the feed layer 152. Alternatively, other metal layers may be provided on the other side of the metal ground layer 151 in the substrate 15, and the IC die 16 can be directly placed above other metal ground layers. The function of the metal ground layer 151 is to provide isolation between other metal layers and the feed layer 152. In the metal ground layer 151, feed layer 152, and surface mount layer 153, a dielectric layer is provided between each adjacent pair of layers, and connections can be achieved between the metal layers by providing vias 18.

[0065] In some embodiments, the second waveguide channels 33 are arranged in an array, and the long sides of two adjacent second waveguide channels 33 are perpendicular to each other.

[0066] like Figure 6 The figure shows the port layout of the second waveguide channel 33 in a 4T4R (4 transmit, 4 receive) RF module. The viewpoint is from the third surface S3 of the PCB carrier 21 towards the second surface S2. Figure 6 The cross-section of the second waveguide channel 33 is a single-ridge type (single-ridge waveguide), and the electric field direction of electromagnetic waves propagating within it is mainly perpendicular to the long side where the ridge is located. The port arrangement shown in this example ensures that the polarization between adjacent ports is perpendicular to each other, thereby reducing signal crosstalk at the ports. Simultaneously, each second waveguide channel 33 can successfully output a cable.

[0067] In some embodiments, such as Figure 2 As shown, an isolation structure 34 is also provided on the fourth surface S4, which includes a plurality of periodically arranged protrusions.

[0068] When the waveguide antenna 31 is assembled onto the PCB carrier board 21, due to processing and assembly errors, the surface connection between the two is not tight, which inevitably results in gaps. When the radio frequency signal leaks from the gap, it will reduce the transmission efficiency of the radio frequency signal in the channel. At the same time, the signal will also couple to other channels through the gap, forming channel crosstalk, which will reduce the isolation and seriously affect the performance of the radio frequency module.

[0069] Therefore, this embodiment proposes to provide an isolation structure 34 on the fourth surface S4 to prevent signals from propagating laterally along the gap surface. The isolation structure can be composed of multiple protrusions on the fourth surface S4. In this embodiment, the shape, number, and arrangement of these protrusions are not limited. The protrusions can be cylinders, cuboids, hexagonal prisms, etc.; the protrusions can be metal structures or structures with metal-plated surfaces; multiple periodically arranged protrusions can prevent the propagation of surface waves, thereby preventing radio frequency signals from leaking from the transmission channel to the outside, and can also prevent free radio frequency signals in the gap between the PCB carrier board 21 and the waveguide antenna 31 from entering adjacent transmission channels, thereby achieving signal isolation within each transmission channel. In some embodiments, the waveguide antenna 31 is connected to the PCB carrier board 21 by fasteners such as screws and bolts.

[0070] In some embodiments, such as Figure 7 As shown, the above-mentioned protrusion structure includes a plurality of first protrusion structures 35 and a plurality of second protrusion structures 36, wherein the cross-sectional area of ​​the first protrusion structure 35 is greater than or equal to the cross-sectional area of ​​the second protrusion structure 36.

[0071] Figure 7 This is a top view of the third waveguide channel 33 on the fourth surface S4 of the waveguide antenna 31, viewed from the fourth surface S4 into the interior of the waveguide antenna 31. This example uses a rectangular waveguide antenna, which places fewer demands on computer numerical control (CNC) or plastic injection molding / electroplating processes. The port shape on the fourth surface S4 is rectangular. Non-uniform raised structures can be arranged around the port.

[0072] When the end port of the third waveguide channel 33 used to connect to the second waveguide channel 22 is rectangular (rectangular waveguide aperture), the middle position of the two long sides of the rectangular waveguide aperture is the region with the strongest signal field. The signal field strength gradually decreases as it extends outward from this middle position. Therefore, protrusion structures with different cross-sectional areas can be set in signal field regions of different intensities to achieve differentiation and isolation. In this embodiment, two types of protrusion structures are set on the fourth surface S4, namely the first protrusion structure 35 and the second protrusion structure 36, wherein the cross-sectional area of ​​the first protrusion structure 35 is greater than or equal to the cross-sectional area of ​​the second protrusion structure 36.

[0073] In some embodiments, a plurality of first protrusion structures 35 are located on the center line of the long side of the third waveguide channel 33.

[0074] In some embodiments, a plurality of second protrusions 36 are disposed around a first protrusion 35.

[0075] In some embodiments, the gap between the upper surfaces of the first protrusion structure 35 and the second protrusion structure 36 and the third surface S3 does not exceed 400 μm.

[0076] Figure 7 In this embodiment, a coarse cylinder (approximately 1 mm in diameter and height, operating in the 77 GHz automotive millimeter-wave band) serving as the first protrusion structure 35 is symmetrically positioned at the center of the long side of the rectangular waveguide aperture of the third waveguide channel 33. When electromagnetic waves propagate from the second waveguide channel 22 of the PCB carrier 21 to the third waveguide channel 33, this coarse cylinder maintains normal electromagnetic wave transmission, ensuring good matching. This embodiment allows for a certain gap between the waveguide antenna 31 and the PCB carrier 21; this gap is the distance between the upper surface of the protrusion structure and the third surface. For the automotive millimeter-wave band, this gap is approximately 0–400 μm. Around the coarse cylinder are thin cylinders serving as the second protrusion structure 36, used to block minute energy escaping through the gap. The dimensions of these thin cylinders are not strictly required (the height is consistent with the coarse cylinder, and the diameter and gap with the surrounding cylinders can be within half a wavelength). The distance error between the coarse cylinder and the center of the long side of the rectangular waveguide aperture is kept within ±100um to improve the consistency between channels.

[0077] In some embodiments, the heights of the first protrusion structure 35 and the second protrusion structure 36 are: Where λ is the operating wavelength of the radio frequency signal.

[0078] In some embodiments, the diameter of the second protrusion structure 36 is Where λ is the operating wavelength of the radio frequency signal.

[0079] In some embodiments, the distance between the first protrusion 35 and the adjacent second protrusion 36 is . Where λ is the operating wavelength of the radio frequency signal.

[0080] In some embodiments, such as Figure 8 As shown, the third waveguide channel 33 is connected to the antenna element 32 from one end of the wide side or the middle of the wide side.

[0081] Combination Figure 10 The cross-section of the waveguide cavity of the antenna element 32 is rectangular, where the side containing the long side of the rectangle is called the long side side and the side containing the wide side of the rectangle is called the wide side side. Figure 8 A slit is provided on the middle and long side for radiating radio frequency signals outward. Figure 8 The figure shows two feeding methods for waveguide antennas: the left figure shows that the radio frequency signal in the third waveguide channel 33 is fed into the antenna element 32 from one end of the wide side of the antenna element 32, which is called "side feeding"; the right figure shows that the radio frequency signal in the third waveguide channel 33 is fed into the antenna element 32 from the middle position of the wide side of the antenna element 32, which is called "center feeding".

[0082] like Figure 9 The diagram shown is a layout of the feed line formed by the third waveguide channel 33 in the waveguide antenna 31 and the array formed by the antenna element 32.

[0083] In some embodiments, such as Figure 10 As shown, the waveguide antenna 31 comprises two parts (an upper half and a lower half divided along a dividing line), the splicing surface of the two parts is parallel to the surface current direction of the radio frequency signal, and the path of the surface current is located on the splicing surface.

[0084] For example Figure 10 In the diagram, waveguide antenna 31 is designed as a double-layer structure, divided into upper and lower parts by the dividing line. For the rectangular waveguide in the diagram, the path of the surface current parallel to the waveguide extension direction coincides with the dividing line. When the connection between the upper and lower structures is not tight, Figure 10 The segmentation method in the process can effectively reduce energy leakage.

[0085] In some embodiments, such as Figure 11 As shown, the third waveguide channel 33 includes at least two cavity segments 37 with rectangular cross sections, and a stepped transition structure 38 is provided at the connection between adjacent cavity segments 37.

[0086] For example Figure 11 In (a) the cavity segment comprises two cavity segments 37 from bottom to top, wherein the upper cavity segment 37 extends out from the long side of the lower cavity segment 37, also known as "long side extension"; in (b) and (c) the cavity segments comprise two cavity segments 37 from bottom to top, wherein the upper cavity segment 37 extends out from the wide side of the lower cavity segment 37, also known as "wide side extension". At the connection between the adjacent cavity segments 37, i.e., the "extension position", a stepped transition structure 38 is designed. By reasonably designing the recessed and protruding steps to form the stepped transition structure 38, better impedance matching can be achieved and electromagnetic wave reflection at the discontinuity of the bend can be reduced. The stepped transition structure 38 can be a single-step structure as in (a) and (b), or a multi-step structure as in (c). In this embodiment, the number of steps in the stepped structure is not limited.

[0087] The RF module in this embodiment has the following advantages over traditional RF modules:

[0088] In the packaging design of the chip package 11, the feed line 17 is fan-out inside the substrate 15 and a radiating part 12 is provided on the outside of the chip package 11; the radiating part 12 can couple the radio frequency signal from inside the chip package to the external waveguide antenna, which improves the flexibility of chip and antenna design and is more conducive to miniaturization design.

[0089] To prevent leakage between channels, the radiating part 12 is surrounded by bumps 13 to form a first waveguide channel 14. When the bumps 13 are solder balls, one end of the solder ball is connected to the chip package 11, and the other end is soldered to the PCB carrier board 21, thereby realizing channel docking.

[0090] A single-ridge window is cut out in the area surrounded by solder balls in the PCB carrier 21 to serve as the second waveguide channel 22 for connecting the chip package 11, the PCB carrier 21 and the waveguide antenna 31 and matching the radio frequency signal.

[0091] The waveguide antenna 31 adopts a two-layer structure for ease of fabrication. The upper layer includes antenna element 32 and part of the feed line 17, while the lower layer includes part of the feed line 17 and the interface of the feed line 17 that connects to the first waveguide channel 14. The dividing line of the two-layer structure is parallel to the direction of the surface current inside the rectangular waveguide, effectively reducing energy leakage at the dividing line.

[0092] Using waveguide antenna 31 can reduce feed line loss and increase radar output power.

[0093] In summary, the RF module provided in the above embodiments of this application reduces the chip package size and has the advantages of low cost, high power, good isolation and robustness.

[0094] Another embodiment of this application provides a radar, including: the radio frequency module as described in any of the above embodiments.

[0095] The radar is used to transmit electromagnetic wave signals via a transmitting antenna based on a reference frequency, and to receive echoes reflected by target objects using a receiving antenna. It then performs down-conversion processing on the transmitted radio frequency signals to generate and output intermediate frequency (IF) signals. The radar also converts the IF signals into digital signals for further signal processing.

[0096] Optionally, in some embodiments, the frequency-modulated continuous wave signal is a millimeter-wave signal, so that the electronic device equipped with the radar can be applied to fields such as autonomous driving, industrial automation, smart home appliances, and security inspection. The radar can be an AiP millimeter-wave radar chip with an integrated antenna.

[0097] For example, the radar generates a chirp signal according to a preset continuous frequency modulation method; it obtains a radio frequency transmission signal through frequency doubling processing and feeds it to the transmitting antenna to transmit a corresponding detection signal wave. When the detection signal wave is reflected by an object, an echo signal wave is formed. The echo signal wave is converted into a radio frequency received signal through a receiving antenna. The radar uses the radio frequency transmitted signal to perform down-conversion, filtering, and other processing on the radio frequency received signal, and then performs analog-to-digital conversion processing to output a baseband digital signal representing the difference frequency between the detection signal wave and the echo signal wave. Then, through signal processing, measurement information is extracted from the baseband digital signal, and measurement data is output. The signal processing includes digital signal processing calculations based on phase, frequency, and time domain of at least one signal to be processed provided by at least one receiving antenna. The measurement data includes at least one of the following: distance data representing the relative distance to at least one detected obstacle; velocity data representing the relative velocity of at least one detected obstacle; angle data representing the relative angle of at least one detected obstacle, etc.

[0098] In some embodiments, this disclosure also provides an electronic device including the aforementioned radar.

[0099] In some embodiments, the electronic device includes: a device body; and electronic components such as radar as described in the above embodiments disposed on the device body. The device body is a structure that carries and is signal-connected to a radio device. The radio device transmits and / or receives radio signals processed by a phase shifter to achieve functions such as target detection and / or communication within the beam scanning range, thereby providing the device body with target detection information and / or communication information, and thus assisting or even controlling the operation of the device body.

[0100] In some embodiments, the electronic device comprising the device body and at least one of the aforementioned wireless devices can be a component or product applied in fields such as smart homes, transportation, smart homes, consumer electronics, surveillance, industrial automation, in-cabin detection, and healthcare. For example, the device body can be intelligent transportation equipment (such as automobiles, bicycles, motorcycles, ships, subways, trains, etc.), security equipment (such as cameras), liquid level / flow rate detection equipment, smart wearable devices (such as wristbands, glasses, etc.), smart home equipment (such as robot vacuum cleaners, door locks, televisions, air conditioners, smart lights, etc.), various communication devices (such as mobile phones, tablets, etc.), as well as devices such as barriers, intelligent traffic lights, intelligent signs, traffic cameras, and various industrial robotic arms (or robots). It can also be various instruments for detecting vital signs parameters and various devices equipped with such instruments, such as in-cabin detection in automobiles, indoor personnel monitoring, intelligent medical devices, and consumer electronic devices.

[0101] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0102] Those skilled in the art will understand that the above embodiments are specific implementations of this application, and in practical applications, various changes can be made in form and detail without departing from the spirit and scope of this application.

Claims

1. A radio frequency module, characterized in that, include: A chip package, wherein at least one radiating portion is provided on a first surface of the chip package, and a plurality of bumps are provided on the first surface, the plurality of bumps being arranged around the radiating portion and forming a first waveguide channel; The PCB carrier has a second surface and a third surface, the second surface being mated with the first surface of the chip package, and a second waveguide channel is provided on the PCB carrier at the location corresponding to the first waveguide channel; A waveguide antenna has a fourth surface and a fifth surface opposite to each other, the fourth surface being mated with the third surface, the fifth surface being provided with at least one antenna element, and a third waveguide channel being provided inside the waveguide antenna; The first waveguide channel, the second waveguide channel, and the third waveguide channel are connected to form a radio frequency signal transmission channel.

2. The radio frequency module according to claim 1, characterized in that, The chip package includes at least a substrate and an IC die; The side of the substrate facing away from the IC die is the first surface. A feed line is provided inside the substrate, and the radio frequency signal is transmitted to the radiating part through the feed line.

3. The radio frequency module according to claim 2, characterized in that, The substrate includes at least a metal ground layer, a feed layer, and a patch layer; The feed line is disposed on the feed line layer, and the radiating part is disposed on the patch layer; wherein, the radio frequency signal is coupled to the radiating part through the feed line.

4. The radio frequency module according to claim 1, characterized in that, An isolation structure is provided on the fourth surface, the isolation structure comprising a plurality of periodically arranged protrusions.

5. The radio frequency module according to claim 4, characterized in that, The protrusion structure includes a plurality of first protrusion structures and a plurality of second protrusion structures, wherein the cross-sectional area of ​​the first protrusion structure is greater than or equal to the cross-sectional area of ​​the second protrusion structure.

6. The radio frequency module according to claim 5, characterized in that, The gap between the upper surface of the first protrusion structure and the second protrusion structure and the third surface does not exceed 400 μm.

7. The radio frequency module according to claim 5, characterized in that, The plurality of first protrusion structures are located on the centerline of the long side of the third waveguide channel.

8. The radio frequency module according to claim 5, characterized in that, The heights of the first protrusion and the second protrusion are Where λ is the operating wavelength of the radio frequency signal.

9. The radar module according to claim 5, characterized in that, Multiple second protrusions are arranged around the first protrusion, and both the first and second protrusions are cylinders.

10. The radio frequency module according to claim 5, characterized in that, The diameter of the second protrusion structure is Where λ is the operating wavelength of the radio frequency signal.

11. The radio frequency module according to claim 5, characterized in that, The distance between the first protrusion and the adjacent second protrusion is Where λ is the operating wavelength of the radio frequency signal.

12. The radio frequency module according to claim 1, characterized in that, The third waveguide channel is connected to the antenna element from one end of the wide side or at the middle of the wide side.

13. The radio frequency module according to claim 12, characterized in that, The third waveguide channel includes at least two cavity segments with rectangular cross-sections, and a stepped transition structure is provided at the connection between the adjacent cavity segments.

14. The radio frequency module according to any one of claims 1-13, characterized in that, The radiating part is a radiating patch.

15. The radio frequency module according to any one of claims 1-13, characterized in that, The cross-section of the second waveguide channel is single-ridge type.

16. The radio frequency module according to any one of claims 1-13, characterized in that, The protrusions are solder balls.

17. The radio frequency module according to claim 16, characterized in that, The second surface is connected to the first surface by a plurality of solder balls.

18. The radio frequency module according to claims 1-13, characterized in that, The second waveguide channels are arranged in an array, and the long sides of two adjacent second waveguide channels are perpendicular to each other.

19. The radio frequency module according to claims 1-13, characterized in that, The antenna element includes multiple radiating slots for transmitting and / or receiving the radio frequency signals.

20. A radar, characterized in that, include: The radio frequency module as described in any one of claims 1 to 19.

21. An electronic device, characterized in that, include: The radar as described in claim 20.

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