Method for preparing metal material powder of flexible circuit board through gas atomization

Abstract

The invention relates to the field of metal processing, and provides a method for preparing metal material powder of a flexible circuit board by gas atomization, which comprises the following steps: smelting metal raw materials for preparing the flexible circuit board to obtain molten metal, introducing the molten metal into an atomization device by using a pressure device for atomization, and crushing the molten metal by conveying high-pressure gas in the atomization process to obtain the metal material powder of the flexible circuit board. And metal liquid drops are formed, cooled and collected, and metal powder is obtained. According to the method, the metal powder special for the flexible circuit board, which is high in sphericity degree, narrow in particle size distribution and low in oxygen content, can be effectively prepared through stable control over the molten metal, the flowability and spreading uniformity of the powder are remarkably improved, and the method is suitable for a precise printing or additive manufacturing process; the problems of large particle size deviation, high defect rate and the like caused by a traditional atomization method are solved, the prepared metal powder is excellent in conductivity and flexibility after being sintered, and the method is suitable for manufacturing flexible electronic devices under high-frequency and high-deflection scenes.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of metal processing, in particular to a method for preparing flexible circuit board metal material powder by gas atomization. BACKGROUND

[0002] Flexible circuit board is widely used in various high-density integrated fields. With the development of light and thin electronic products, the manufacturing process of FPC has increasingly strict requirements on line width / line spacing, usually reaching micron level or even higher precision. Electronic paste, as the core material for forming conductive circuit, directly determines the printing quality and conductive performance of FPC.

[0003] Electronic paste is mainly composed of three parts: metal functional phase, bonding phase and organic carrier. The metal functional phase is usually the powder of conductive metals such as silver and copper. The physical properties such as particle size distribution, morphology and tap density of the metal functional phase have a decisive influence on the printing adaptability, sintering behavior and electrical performance of the final circuit of the paste. High fine powder rate is beneficial to realize high densification sintering at low temperature, thereby improving the resolution and conductivity of the circuit. High sphericity powder can improve the rheological properties of the paste, ensure the stability of the printing process and the consistency of sintering shrinkage, and avoid defects such as circuit deformation and warping.

[0004] At present, gas atomization technology is one of the main methods for preparing metal powder for electronic paste. Specifically, high-pressure gas is used to break the molten metal into small droplets, which are then cooled and shaped into spherical powder under the action of surface tension. Traditional gas atomization process often aims to achieve high yield, but it is difficult to simultaneously optimize the fine powder rate and sphericity. For example, increasing the gas-liquid ratio or atomization pressure to improve fine powder yield leads to irregular powder morphology and increased satellite powder. Excessive pursuit of sphericity will reduce the output efficiency of ultra-fine powder. In addition, the stability of the metal liquid flow during atomization has a significant impact on powder quality. If the liquid flow swings, breaks or drips, it will result in wide particle size distribution, inconsistent morphology, and a large amount of waste powder.

[0005] Therefore, the existing gas atomization technology still needs to be further improved to accurately control the behavior of the metal liquid flow, thereby obtaining metal powder with high sphericity while ensuring high fine powder rate, and meeting the manufacturing requirements of high-end FPC. SUMMARY

[0006] The purpose of the present application is to provide a method for preparing flexible circuit board metal material powder by gas atomization, to solve one or more technical problems existing in the prior art, and to provide at least one beneficial option or create conditions.

[0007] The application provides a method for preparing flexible circuit board metal material powder by gas atomization, which comprises the following steps: melting metal raw materials for preparing flexible circuit boards to obtain metal liquid; using a pressure device to pass the metal liquid into an atomization device for atomization; in the atomization process, the metal liquid is broken by conveying high-pressure gas to form metal liquid droplets; the metal liquid droplets are cooled and collected to obtain metal powder.

[0008] In order to achieve the above-mentioned purpose, according to an aspect of the application, a method for preparing flexible circuit board metal material powder by gas atomization is provided, which comprises the following steps: Melting metal raw materials for preparing flexible circuit boards to obtain metal liquid; Using a pressure device to pass the metal liquid into an atomization device for atomization; In the atomization process, the metal liquid is broken by conveying high-pressure gas to form metal liquid droplets; Cooling and collecting the metal liquid droplets to obtain metal powder.

[0009] Further, the method for melting metal raw materials to obtain metal liquid comprises the following steps: placing the metal raw materials into a melting furnace for melting; melting the metal raw materials by generating heat in the metal through electromagnetic induction to obtain metal liquid; wherein, in the melting process, an inert gas is provided to maintain a low-oxygen environment (oxygen content is less than 20 ppm, and some active metals which are prone to oxidation can be controlled to be less than 1-10 ppm); a crucible is arranged in the melting furnace for containing the metal liquid, and the crucible is provided with a flow guide pipe at the bottom.

[0010] Further, the method for using a pressure device to pass the metal liquid into an atomization device comprises the following steps: A pressure device is installed at the top of the crucible, and the pressure device is used to continuously apply pressure to the metal liquid so that the metal liquid flows out of the crucible and enters an atomization cabin in the atomization device.

[0011] Preferably, the pressure device is a back pressure regulator or a hydraulic servo valve.

[0012] Further, the method for passing the metal liquid into the atomization device further comprises metal liquid stability control.

[0013] Further, the method for metal liquid stability control comprises the following steps: installing a camera outside the atomization cabin in the atomization device, aligning the lens of the camera with the lower part of the flow guide pipe of the crucible through the observation window, and the camera is a CCD industrial camera equipped with a telecentric lens. The camera continuously captures images of the metal liquid flowing out of the crucible and transmits the images to the terminal. The camera shooting interval is manually set, usually set to [100, 1000] frame rate. In the terminal, the received images are detected in real time. If an abnormal liquid flow image is detected, the liquid flow pressure is adjusted to keep the metal liquid stable. The beneficial effect of this step is that the stability of the metal liquid flow directly determines the particle size distribution and morphology consistency of the powder after atomization. If the liquid flow fluctuates or breaks during atomization, it is easy to produce irregular powder or satellite particles, reducing product quality. This step uses a high-resolution CCD industrial camera to capture the morphological characteristics of the metal liquid flow below the flow guide pipe in real time, combined with image processing technology and feedback control, dynamically maintaining the continuity and stability of the metal liquid flow, which can make the metal liquid droplets form uniformly, significantly reducing the particle size deviation and defect rate of the powder.

[0014] Further, the received metal liquid flow image is detected in real time, specifically including detecting whether the liquid flow diameter of the metal liquid deviates from the preset interval, whether the liquid flow of the metal liquid swings, whether the liquid flow of the metal liquid breaks, drips or disappears.

[0015] Further, if an abnormal liquid flow image is detected, the liquid flow pressure is adjusted, including: If it is detected that the liquid flow diameter of the metal liquid deviates from the preset interval, the back pressure of the crucible is changed by adjusting the pressure device to make the liquid flow of the metal liquid return to the preset interval; If it is detected that the liquid flow of the metal liquid swings, the liquid flow of the metal liquid is stabilized without swinging by adjusting the pressure of the high-pressure gas; the size of the high-pressure gas pressure is specifically adjusted by the control system of the atomization device; If it is detected that the liquid flow of the metal liquid breaks, drips or disappears, a warning signal is sent to the monitoring room, the crucible is quickly lifted to make the flow guide pipe leave the atomization cabin, preventing the metal liquid from solidifying at the nozzle to cause serious equipment accidents, and at the same time stopping the atomization process to avoid waste powder.

[0016] Preferably, the image processing algorithm used to detect whether the liquid flow diameter of the metal liquid deviates from the preset interval is an edge detection algorithm, the image processing algorithm used to detect whether the liquid flow of the metal liquid swings is an optical flow estimation difference method, and the image processing algorithm used to detect whether the liquid flow of the metal liquid breaks, drips or disappears is a connected domain analysis algorithm.

[0017] Since early abnormal identification of the metal liquid flow state can better improve the quality of powder production, preferably, the method of detecting the abnormal liquid flow image can also be: The N most recently received images from the terminal are arranged in ascending order of reception time (i.e., the most recently received image is placed last) and formed into an image sequence SCN. Let SCN(i) be the i-th image in the N images in the image sequence SCN (SCN(N) represents the most recently received image), where i is the sequence number, i=1,2,…,N, and SV is the last image. i This represents the sum of all pixel values ​​within the image SCN(i), where SV1, SV2, ..., SV N The average of these N values ​​is denoted as ASV; N is set to the value within the interval [50, 200].

[0018] Let fc(i) be the fluid structure of image SCN(i). The calculation method of fc(i) is as follows: let Sp(i) represent the number of pixels contained in SCN(i), let the value obtained by dividing ASV by Sp(i) be D(i), and let the sum of all pixel values ​​in image SCN(i) greater than D(i) be divided by the sum of all pixel values ​​in image SCN(i) less than D(i) as the fluid structure of SCN(i) fc(i). For N fluid properties fc(1), fc(2), ..., fc(N) corresponding to N images, let fc(N) minus fc(1) be the value of f1; if the value of f1 is positive, the flow interval is defined as [0, f1]; if the value of f1 is negative, the flow interval is defined as [f1, 0]; The anomaly intensity is calculated based on N fluid flow properties. If the anomaly intensity value is outside the flow range, SCN(N) is marked as an abnormal fluid flow image. At the same time, the molten metal is stabilized by adjusting the pressure of the high-pressure gas, and an early warning signal is sent to the monitoring room.

[0019] Furthermore, the method for calculating the heterofluidity based on N fluid configurations is as follows: S1, set variable j, initialize j to 2, and let the traversal range of j be [2, N-1]. Let fp j-1 =fp1=fc(2)-fc(1), initialize variable C0=fp j-1 Switch to S2; S2, let fp be the value obtained by subtracting fc(j) from fc(j+1). j If fp j ×fp j-1 If the value of C0 is greater than 0, then update the value of C0 to fp. j +C0; if fp j ×fp j-1 If the value of C0 is less than 0, then update the value of C0 to fp. j ×(1+|C0|÷j)+C0, go to S3; S3, if the value of the variable j is less than N-1, then the value of j is increased by 1 and turn to S2; if the value of the variable j is equal to or greater than N-1, then turn to S4; S4, record the value of C0 as the heteroflow degree.

[0020] The beneficial effect of this step is that: traditional edge detection and optical flow estimation algorithms can identify specific types of abnormalities such as diameter deviation or oscillation, but it is difficult to capture the early abnormal characteristics of the liquid flow. The slight high-frequency tremor of the liquid flow edge and the change of the overall brightness of the liquid flow in the flowing state are often the signal that the balance between the internal pressure of the liquid flow and the external atomization gas dynamic field is broken. At the same time, due to the inherent physical delay and inertia of the gas atomization process system, there is a response window that needs a fixed time from the perception of the abnormality to the pressure regulation. If the liquid flow has already appeared obvious oscillation or flow break, the intervention of the control system of the atomization device has already lagged a lot. Therefore, capturing and regulating the early abnormal characteristics of the liquid flow is the key to ensure high fine powder rate and obtain high sphericity of the metal powder. The method of this step determines the abnormality by analyzing the dynamic change trend of the liquid flow structure in the continuous image sequence, and amplifies the change mode of the liquid flow (is it continuous or oscillating) in an accumulative differential C0 and directional weighting (statement S2) manner. If the value of the liquid flow structure representing the liquid flow state shows a large amplitude of continuous decline or rise, the heteroflow degree will exceed the through-flow interval, which represents that it has appeared a trend of instability and needs to be intervened in advance. On the contrary, if the liquid flow structure shows a fluctuation mode (as long as the overall fluctuation amplitude is not too large, too large will cause the difference between the heteroflow degree and fc(1) and fc(N) to be large and will also trigger an early warning), the heteroflow degree will not exceed the through-flow interval, and pressure adjustment intervention is not needed at this time. Therefore, the early warning of the liquid flow stability through the heteroflow degree can obtain more response time when the liquid flow diameter has not yet deviated obviously or has just appeared slight oscillation, which can effectively avoid the generation of waste powder.

[0021] Further, the method for atomizing the metal liquid by delivering high-pressure gas to break the metal liquid into metal liquid droplets is specifically as follows: The high-pressure gas is delivered and accelerated by the annular slit nozzle in the atomization device to form a high-speed gas flow, and the high-speed gas flow breaks the metal liquid into metal liquid droplets; wherein the high-pressure gas refers to high-pressure liquefied argon or high-pressure liquefied nitrogen.

[0022] Further, the method for cooling the metal liquid droplets and collecting to obtain metal powder is specifically as follows: the metal liquid droplets are cooled and solidified during the flight process to obtain spherical metal powder, and the spherical metal powder is collected, screened and vacuum packaged by the collecting device located at the bottom of the atomization tower in the atomization device.

[0023] The method can effectively prepare the special metal powder for the flexible circuit board with high sphericity, narrow particle size distribution and low oxygen content, significantly improves the flowability and spreading uniformity of the powder, is suitable for the precision printing or additive manufacturing process, avoids the problems of large particle size deviation and high defect rate caused by the traditional atomization method, and the prepared metal powder has excellent conductivity and flexibility after sintering, and is suitable for the manufacturing of flexible electronic devices in high-frequency and high-flexure scenes. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 Fig. 1 shows a flowchart of a method for preparing a flexible circuit board metal material powder by gas atomization. DETAILED DESCRIPTION

[0025] The concept, specific structure and technical effects of the present application will be described clearly and completely in combination with the embodiments and the drawings, so as to fully understand the purpose, scheme and effect of the present application. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0026] In the description of the present application, one or more is meant to be one or more, more than two is meant to be two or more, greater than, less than, more than, etc. are understood to not include the number, above, below, etc. are understood to include the number. If it is described as first, second, it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the sequence of indicated technical features.

[0027] As shown in Figure 1 Fig. 1 shows a flowchart of a method for preparing a flexible circuit board metal material powder by gas atomization according to the present application, and the method for preparing a flexible circuit board metal material powder by gas atomization according to the embodiment of the present application will be described below in combination with Figure 1

[0028] The present application provides a method for preparing a flexible circuit board metal material powder by gas atomization, which comprises the following steps: Melting the metal raw material for preparing the flexible circuit board to obtain a metal liquid; Using a pressure device to pass the metal liquid into an atomization device for atomization; In the atomization process, the metal liquid is broken by conveying high-pressure gas to form metal liquid droplets; Cooling the metal liquid droplets and collecting to obtain metal powder.

[0029] ​Further, the method for obtaining the metal liquid by smelting the metal raw material specifically comprises: placing the metal raw material into a smelting furnace for smelting, generating heat in the metal by electromagnetic induction to melt the metal raw material, and obtaining the metal liquid; wherein, a low-oxygen environment is maintained by providing inert gas during the smelting process; a crucible is arranged in the smelting furnace for containing the metal liquid, and the crucible is provided with a flow guide pipe at the bottom.

[0030] Further, the method for passing the metal liquid into the atomization device by using the pressure device specifically comprises: A pressure device is arranged at the top of the crucible, which is used to push the metal liquid out of the crucible and accurately control the flow rate of the metal liquid. The pressure device is used to continuously apply pressure to the metal liquid, so that the metal liquid slowly flows out of the crucible in the form of a thin stream and enters the atomization cabin in the atomization device.

[0031] Specifically, the pressure device is a back pressure regulator.

[0032] Further, the method for passing the metal liquid into the atomization device by using the pressure device specifically comprises:

[0033] Further, the method for stabilizing the metal liquid specifically comprises: arranging a camera outside the atomization cabin in the atomization device, aiming the lens of the camera at the lower part of the flow guide pipe of the crucible through the observation window, providing backlight or sidelight (high-brightness LED light source) for the camera so that the camera can clearly capture the image of the liquid stream of the metal liquid, and the camera is a CCD industrial camera equipped with a telecentric lens. The camera is used to continuously capture the image of the metal liquid flowing out of the crucible and transmit the image to a terminal. The received image is detected in real time in the terminal. If an abnormal liquid stream image is detected, the liquid stream pressure is adjusted to keep the metal liquid stable. The stability of the metal liquid refers to that the diameter and center line position of the metal liquid do not deviate from the preset interval, and the liquid stream of the metal liquid is straight, continuous and without swing.

[0034] Specifically, the received liquid stream image of the metal liquid is detected in real time, and the liquid stream image of the metal liquid is saved after foreground extraction before detection (the purpose is to extract the liquid stream target and delete the irrelevant background part).

[0035] Further, the received liquid stream image of the metal liquid is detected in real time, which specifically comprises detecting whether the liquid stream diameter of the metal liquid deviates from the preset interval, whether the liquid stream of the metal liquid swings, whether the liquid stream of the metal liquid breaks, leaks or disappears.

[0036] Further, if an abnormal liquid stream image is detected, the liquid stream pressure is adjusted, which comprises: If the flow diameter of the metal liquid deviates from the preset interval, the back pressure of the crucible is changed by adjusting the pressure device to return the flow of the metal liquid to the preset interval. Specifically, when the flow diameter of the metal liquid exceeds the upper limit of the preset interval, the pressure supplied by the pressure device is reduced to slow down the flow rate of the metal liquid and make the flow thin; when the flow diameter of the metal liquid is lower than the lower limit of the preset interval, the pressure supplied by the pressure device is increased to accelerate the flow rate of the metal liquid and make the flow thick. If it is detected that the flow of the metal liquid swings, the pressure of the high-pressure gas is adjusted to stabilize the flow of the metal liquid without swinging; the size of the high-pressure gas pressure is specifically adjusted by the control system of the atomization device; If it is monitored that the flow of the metal liquid breaks, leaks or disappears, a pre-warning signal is sent to the monitoring room, and the crucible is quickly lifted to make the flow guide pipe leave the atomization cabin, so as to prevent the metal liquid from solidifying at the nozzle and causing serious equipment accidents, and at the same time, the atomization process is stopped to avoid waste powder in production.

[0037] Since early abnormal identification of the metal liquid flow state can better improve the quality of powder production, preferably, the method for detecting the liquid flow abnormal image can also be: The N latest images received by the terminal are arranged in ascending order of receiving time (i.e. the latest received image is arranged at the end) and composed into an image sequence SCN, SCN(i) is the i-th of the N images in the image sequence SCN (SCN(N) means the latest received image), i is the serial number, i=1, 2, …, N, and SV i represents the sum of all pixel values in the image SCN(i), and SV1, SV2, …, SV N The average value of the N values is denoted as ASV; N is set to 100; fc(i) is the flow configuration of the image SCN(i), and the calculation method of fc(i) is: Sp(i) represents the number of pixels contained in SCN(i), and the value obtained by dividing ASV by Sp(i) is denoted as D(i); the value obtained by dividing the sum of all pixel values greater than D(i) in the image SCN(i) by the sum of all pixel values less than D(i) in the image SCN(i) is taken as the flow configuration fc(i) of SCN(i); For the N flow configurations fc(1), fc(2), …, fc(N) corresponding to the N images, the value obtained by subtracting fc(1) from fc(N) is denoted as f1; if the value of f1 is positive, the through-flow interval is defined as [0, f1]; if the value of f1 is negative, the through-flow interval is defined as [f1, 0]; According to the N flow configurations, the abnormal flow degree is calculated, and if the value of the abnormal flow degree is located outside the through-flow interval, SCN(N) is marked as a liquid flow abnormal image, the metal liquid is stabilized by adjusting the pressure of the high-pressure gas, and a pre-warning signal is sent to the monitoring room.

[0038] Further, the method for calculating the heteroflux degree according to the N flow configuration degrees is as follows: S1, set a variable j, the initial value of j is set as 2, the traversal range of j is [2, N-1], fc(j) represents the jth value of the N flow configuration degrees, and fp j-1 = fp1= fc(2)-fc(1), initialize the variable C0= fp j-1 , and turn to S2; S2, record the value obtained by subtracting fc(j) from fc(j+1) as fp j , if the value of fp j × fp j-1 is greater than 0, update the value of C0 as fp j +C0; if the value of fp j × fp j-1 is less than 0, update the value of C0 as fp j ×(1+|C0|÷j)+C0, and turn to S3; S3, if the value of the variable j is less than N-1, increase the value of j by 1 and turn to S2; if the value of the variable j is equal to or greater than N-1, turn to S4; S4, record the value of C0 as the heteroflux degree.

[0039] Further, the method for forming metal liquid droplets by breaking the metal liquid through the delivery of high-pressure gas in the atomization process is specifically as follows: high-pressure gas is introduced, and the high-pressure gas is accelerated by the annular slit nozzle in the atomization device to form a high-speed gas flow, and the high-speed gas flow breaks the metal liquid into a large amount of micron-level metal liquid droplets; wherein the high-pressure gas refers to high-pressure liquefied argon gas or high-pressure liquefied nitrogen gas.

[0040] Further, the method for cooling the metal liquid droplets and collecting to obtain metal powder is specifically as follows: the metal liquid droplets are cooled and solidified in the flying process to obtain spherical metal powder, and the spherical metal powder is collected, screened and vacuum packaged by the collecting device located at the bottom of the atomization tower in the atomization device.

[0041] The application provides a method for preparing flexible circuit board metal material powder by gas atomization. The method comprises the following steps: melting metal raw materials for preparing flexible circuit boards to obtain a metal liquid; using a pressure device to pass the metal liquid into an atomization device for atomization; and smashing the metal liquid by conveying high-pressure gas during the atomization process to form metal liquid droplets, cooling the metal liquid droplets, and collecting to obtain metal powder. The method can effectively prepare flexible circuit board special metal powder with high sphericity, narrow particle size distribution, and low oxygen content by stable control of the metal liquid, significantly improve the flowability and spreading uniformity of the powder, and is suitable for precision printing or additive manufacturing process, avoids the problems of large particle size deviation and high defect rate caused by traditional atomization method, and the prepared metal powder has excellent conductivity and flexibility after sintering, and is suitable for the manufacturing of flexible electronic devices in high-frequency and high-flexure scenarios. Although the description of the application has been quite detailed and several embodiments have been described in particular, it is not intended to be limited to any of these details or embodiments or any special embodiment, thereby effectively covering the intended scope of the application. In addition, the application is described above in the embodiments that the inventors can foresee, and the purpose is to provide a useful description, and non-substantial modifications to the application that have not yet been foreseen can still represent equivalent modifications to the application.

Claims

1. A method for preparing flexible circuit board metal material powder by gas atomization, characterized in that, The method includes the following steps: The metal raw materials for preparing flexible circuit boards are melted to obtain molten metal; A pressure device is used to pass molten metal into an atomizing device for atomization; During atomization, high-pressure gas is delivered to break up the molten metal and form molten metal droplets; The molten metal droplets are cooled and collected to obtain metal powder.

2. The method for preparing flexible circuit board metal material powder by gas atomization according to claim 1, characterized in that, The specific method for obtaining molten metal by smelting metal raw materials is as follows: the metal raw materials are placed in a smelting furnace for smelting, and heat is generated inside the metal through electromagnetic induction to melt the metal raw materials and obtain molten metal; during the smelting process, an inert gas is provided to maintain a low oxygen environment; a crucible is placed in the smelting furnace to hold the molten metal, and the bottom of the crucible is equipped with a guide pipe.

3. The method for preparing flexible circuit board metal material powder by gas atomization according to claim 1, characterized in that, The method of using a pressure device to introduce molten metal into the atomizing device is as follows: a pressure device is installed on the top of the crucible, and the pressure device is used to continuously apply pressure to the molten metal, so that the molten metal flows out of the crucible and enters the atomizing chamber in the atomizing device.

4. The method for preparing flexible circuit board metal material powder by gas atomization according to claim 1, characterized in that, The process of introducing molten metal into the atomizing device also includes molten metal stabilization control.

5. The method for preparing flexible circuit board metal material powder by gas atomization according to claim 4, characterized in that, The specific method for stabilizing molten metal is as follows: a camera is installed outside the atomization chamber in the atomization device, and the camera lens is aimed at the bottom of the guide tube of the crucible through the observation window. The camera is a CCD industrial camera equipped with a telecentric lens. The camera continuously captures images of the molten metal flowing out of the crucible and transmits the images to the terminal. The received images are detected in real time at the terminal. If an abnormal liquid flow image is detected, the liquid flow pressure is adjusted to keep the molten metal stable.

6. The method for preparing flexible circuit board metal material powder by gas atomization according to claim 5, characterized in that, If an abnormal flow image is detected, the flow pressure is adjusted, including: if the flow diameter of the molten metal deviates from the preset range, the back pressure of the crucible is changed by adjusting the pressure device to bring the flow of the molten metal back to the preset range. If oscillation is detected in the flow of molten metal, the pressure of the high-pressure gas is adjusted to stabilize the flow of molten metal without oscillation; the specific adjustment of the high-pressure gas pressure is executed by the control system of the atomizing device. If the flow of molten metal is detected to be interrupted, dripping, or disappearing, an early warning signal is sent to the monitoring room, and the crucible is lifted so that the guide tube leaves the atomization chamber.

7. The method for preparing flexible circuit board metal material powder by gas atomization according to claim 1, characterized in that, The method of breaking up molten metal into droplets by delivering high-pressure gas during atomization is as follows: high-pressure gas is introduced and accelerated through an annular nozzle in the atomizing device to form a high-speed airflow, which breaks up the molten metal into droplets.

8. The method for preparing flexible circuit board metal material powder by gas atomization according to claim 1, characterized in that, The method for cooling and collecting metal droplets to obtain metal powder is as follows: the metal droplets are cooled and solidified during their flight to obtain spherical metal powder, which is then collected, sieved, and vacuum-sealed by a collection device located at the bottom of the atomization tower in the atomization device.

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