Medium-transmission low-reflection double-silver low-radiation coated glass and preparation method thereof

Abstract

The invention belongs to the technical field of glass deep processing, and particularly relates to middle-transmission low-reflection double-silver low-radiation coated glass which comprises a glass substrate layer and a coating layer, the coating layer comprises sixteen film layers which are sequentially compounded from the glass substrate layer to the outside, the first layer is a silicon zirconium nitride layer, the second layer is a titanium oxide layer, and the third layer is a zinc tin oxide layer. The fourth layer is an aluminum zinc oxide layer, the fifth layer is a silver layer, the sixth layer is a nickel-chromium layer, the seventh layer is a tin zinc oxide layer, the eighth layer is an aluminum silicon nitride layer, the ninth layer is the nickel-chromium layer, the tenth layer is an aluminum silicon nitride layer, the eleventh layer is a tin zinc oxide layer, the twelfth layer is an aluminum zinc oxide layer, the thirteenth layer is a silver layer, and the fourteenth layer is the nickel-chromium layer. The fifteenth layer is a silicon aluminum nitride layer, and the sixteenth layer is a zirconium oxide layer. The invention has the advantages of low reflectivity, capability of being processed in different places, good durability and the like.

Description

Technical Field

[0001] This invention belongs to the field of glass deep processing technology, specifically relating to a medium-transparency, low-reflection, double-silver, low-emissivity coated glass and its preparation method. Background Technology

[0002] In modern architecture, glass has become an indispensable component due to its aesthetic appeal, light transmission, and structural properties. As society's demands for architectural aesthetics and functionality continue to rise, glass is no longer merely a transparent structural divider, but is gradually evolving into a smart material that meets diverse functional needs. Low-emissivity (LOW-E) coated glass, in particular, has become a hot topic in the construction industry due to its significant effects on energy saving, heat insulation, and improved indoor comfort.

[0003] Low-emissivity (LEE) glass, coated with one or more layers of metal, metal oxide, or nitride films, effectively reflects indoor heat, reduces heat loss, and allows non-glaring natural light to enter while minimizing indoor-outdoor reflections. However, there is often a trade-off between the light transmittance of this type of glass and its indoor-outdoor reflectivity and shading performance. As light transmittance decreases, indoor-outdoor reflection inevitably increases. While light transmittance is improved, increased indoor-outdoor reflections contribute to urban light pollution, potentially causing dizziness and negatively impacting the living experience for residents. Therefore, a new type of LEE coated glass is needed that maintains moderate light transmittance while offering good indoor-outdoor reflection and low shading performance, thereby achieving green energy conservation in buildings and enhancing resident comfort. Summary of the Invention

[0004] The purpose of this invention is to address the aforementioned problems in existing technologies by providing a medium-transmittance, low-reflection, double-silver, low-emissivity coated glass and its preparation method. The aim is to reduce indoor and outdoor reflections while maintaining medium transmittance, thereby reducing light pollution and improving the comfort of residents.

[0005] The objective of this invention can be achieved through the following technical solution: A medium-transmittance, low-reflection, double-silver, low-emissivity coated glass, characterized in that the coated glass comprises a glass substrate layer and a coating layer, the coating layer comprising sixteen layers sequentially laminated from the glass substrate layer outwards, wherein the first layer is a silicon zirconium nitride layer, the second layer is a titanium oxide layer, the third layer is a zinc tin oxide layer, the fourth layer is a zinc aluminum oxide layer, the fifth layer is a silver layer, the sixth layer is a nickel chromium layer, the seventh layer is a zinc tin oxide layer, the eighth layer is a silicon aluminum nitride layer, the ninth layer is a nickel chromium layer, the tenth layer is a silicon aluminum nitride layer, the eleventh layer is a zinc tin oxide layer, the twelfth layer is a zinc aluminum oxide layer, the thirteenth layer is a silver layer, the fourteenth layer is a nickel chromium layer, the fifteenth layer is a silicon aluminum nitride layer, and the sixteenth layer is a zirconium oxide layer.

[0006] Preferably, the thickness of the first layer is 5–15 nanometers, the thickness of the second layer is 3–10 nanometers, the thickness of the third layer is 5–15 nanometers, the thickness of the fourth layer is 5–15 nanometers, the thickness of the fifth layer is 8–15 nanometers, the thickness of the sixth layer is 1–5 nanometers, the thickness of the seventh layer is 35–50 nanometers, the thickness of the eighth layer is 5–15 nanometers, the thickness of the ninth layer is 1–5 nanometers, the thickness of the tenth layer is 5–15 nanometers, the thickness of the eleventh layer is 5–20 nanometers, the thickness of the twelfth layer is 5–15 nanometers, the thickness of the thirteenth layer is 15–30 nanometers, the thickness of the fourteenth layer is 1–5 nanometers, the thickness of the fifteenth layer is 35–50 nanometers, and the thickness of the sixteenth layer is 5–10 nanometers.

[0007] The method for preparing the above-mentioned medium-transmittance, low-reflection, double-silver, low-emissivity coated glass is characterized by comprising the following steps:

[0008] 1) Float glass sheets were selected as the glass substrate layer;

[0009] 2) Use a special film washing machine for coating to clean and dry the glass substrate layer. Before coating, the surface of the glass substrate layer must be dry, free of impurities and static electricity. Use deionized water for cleaning, and the water resistance should be greater than 10μs / cm.

[0010] 3) The above films are deposited using magnetron sputtering vacuum deposition. Before production or experimentation, ensure the vacuum level is below 3 × 10⁻⁶. -3 The bar and various coating material targets are operating normally. The specific steps are as follows:

[0011] A. Magnetron sputtering first layer

[0012] Number of targets: 1-2 AC rotating targets; target material configuration: silicon-zirconium alloy (SiZr); process gases: argon and nitrogen, with an argon to nitrogen ratio of 8:6;

[0013] B. Magnetron sputtering of the second layer

[0014] Number of targets: 1-2 AC rotating targets; target material configuration: titanium (Ti); process gas: argon and oxygen, with an argon to oxygen ratio of 10:1;

[0015] C. Magnetron sputtering third layer

[0016] Number of targets: 1-2 AC rotating targets; target material configuration: zinc-tin alloy (ZnSn); process gas: argon and oxygen, with an argon to oxygen ratio of 5:9;

[0017] D. Magnetron sputtering fourth layer

[0018] Number of targets: 1-2 AC rotating targets; target material configuration: zinc-aluminum alloy (ZnAl); process gases: argon and oxygen, with an argon to oxygen ratio of 5:9.

[0019] E. Magnetron sputtering fifth layer

[0020] Number of targets: 1 DC planar target; target material configuration: silver (Ag); process gas ratio: pure argon;

[0021] F. Magnetron sputtering sixth layer

[0022] Target quantity: 1 DC planar target; target material configuration: nickel-chromium alloy (NiCr); process gas ratio: pure argon;

[0023] G. Magnetron sputtering seventh layer

[0024] Number of targets: 2-4 AC rotating targets; target material configuration: zinc-tin alloy (ZnSn); process gas ratio: argon and oxygen, with an argon to oxygen ratio of 5:9.

[0025] H, Magnetron sputtering eighth layer

[0026] Number of targets: 1-2 AC rotating targets; target material configuration: silicon-aluminum alloy (SiAl); process gases: argon and nitrogen, with an argon to oxygen ratio of 8:6.

[0027] I. Magnetron sputtering, ninth layer

[0028] Number of targets: 1 DC planar target; target material configuration: nickel-chromium alloy (NiCr); process gas: pure argon;

[0029] J. Magnetron sputtering, tenth layer

[0030] Number of targets: 1-2 AC rotating targets; target material configuration: silicon-aluminum alloy (SiAl); process gases: argon and nitrogen, with an argon to oxygen ratio of 8:6.

[0031] K, Magnetron Sputtering, Eleventh Layer

[0032] Number of targets: 1-2 AC rotating targets; target material configuration: zinc-tin alloy (ZnSn); process gas: argon and oxygen, with an argon to oxygen ratio of 5:9;

[0033] L, Magnetron sputtering twelfth layer

[0034] Number of targets: 2-4 AC rotating targets; target material configuration: zinc-aluminum alloy (ZnAl); process gas: argon and oxygen, with an argon to oxygen ratio of 5:9;

[0035] M, Magnetron sputtering thirteenth layer

[0036] Number of targets: 1 DC planar target; target material configuration: silver (Ag); process gas ratio: pure argon;

[0037] N, Magnetron sputtering, fourteenth layer

[0038] Target quantity: 1 DC planar target; target material configuration: nickel-chromium alloy (NiCr); process gas ratio: pure argon;

[0039] O, Magnetron sputtering, fifteenth layer

[0040] Number of targets: 2-5 AC rotating targets; target material configuration: silicon-aluminum alloy (SiAl); process gases: argon and nitrogen, with an argon to oxygen ratio of 8:6;

[0041] P, Magnetron sputtering, sixteenth layer

[0042] Number of targets: 1-2 AC planar targets; target material configuration: zirconium (Zr); process gases: argon and oxygen, with an argon to oxygen ratio of 20:1;

[0043] 4) The total film thickness is controlled between 139 and 275 nm, and the general sputtering chamber drive speed is controlled between 3.0 and 6.0 m / min.

[0044] The advantages of this invention are:

[0045] 1. The transmittance of this 6mm ultra-clear single-pane coated glass is as follows: transmittance color is T∈[45, 60], a*∈[-3, -6], b*∈[0, +4]; glass surface color is a*∈[-1, -3], b*∈[-7, -11]; film surface color is a*∈[0, -5], b*∈[-10, -16];

[0046] 2. This coated glass can be further processed by cutting, edge grinding, tempering or bending tempering, etc. It can be produced in large areas and is not easily scratched or oxidized during long-term transportation and storage.

[0047] 3. The photothermal ratio of this coated glass is 1.9, and the double-silver product meets the optical performance of the triple-silver product. Attached Figure Description

[0048] Figure 1 This is a schematic diagram of the layered structure of the coated glass.

[0049] Figure 2 This is a table showing the color parameters of the coated glass before and after tempering.

[0050] Figure 3 This is a table of performance parameters for the coated glass before and after tempering.

[0051] In the diagram, G represents the glass substrate layer; 1 represents the first layer; 2 represents the second layer; 3 represents the third layer; 4 represents the fourth layer; 5 represents the fifth layer; 6 represents the sixth layer; 7 represents the seventh layer; 8 represents the eighth layer; 9 represents the ninth layer; 10 represents the tenth layer; 11 represents the eleventh layer; 12 represents the twelfth layer; 13 represents the thirteenth layer; 14 represents the fourteenth layer; 15 represents the fifteenth layer; and 16 represents the sixteenth layer. Detailed Implementation

[0052] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0053] Example 1: The structure of the low-reflection, double-silver low-emissivity coated glass in this embodiment of the invention is as follows:

[0054] like Figure 1 As shown, a medium-transmittance, low-reflection, double-silver, low-emissivity coated glass includes a glass substrate layer G and a coating layer. The coating layer comprises sixteen layers sequentially laminated from the glass substrate layer G outwards, wherein the first layer 1 is a silicon nitride zirconium layer, the second layer 2 is a titanium oxide layer, the third layer 3 is a zinc tin oxide layer, the fourth layer 4 is a zinc aluminum oxide layer, the fifth layer 5 is a silver layer, the sixth layer 6 is a nickel chromium layer, the seventh layer 7 is a zinc tin oxide layer, the eighth layer 8 is a silicon aluminum nitride layer, the ninth layer 9 is a nickel chromium layer, the tenth layer 10 is a silicon aluminum nitride layer, the eleventh layer 11 is a zinc tin oxide layer, the twelfth layer 12 is a zinc aluminum oxide layer, the thirteenth layer 13 is a silver layer, the fourteenth layer 14 is a nickel chromium layer, the fifteenth layer 15 is a silicon aluminum nitride layer, and the sixteenth layer 16 is a zirconium oxide layer.

[0055] The thickness of the first layer (1) is 5–15 nanometers; the thickness of the second layer (2) is 3–10 nanometers; the thickness of the third layer (3) is 5–15 nanometers; the thickness of the fourth layer (4) is 5–15 nanometers; the thickness of the fifth layer (5) is 8–15 nanometers; the thickness of the sixth layer (6) is 1–5 nanometers; the thickness of the seventh layer (7) is 35–50 nanometers; the thickness of the eighth layer (8) is 5–15 nanometers; the thickness of the ninth layer (9) is 1–5 nanometers; the thickness of the tenth layer (10) is 5–15 nanometers; the thickness of the eleventh layer (11) is 5–20 nanometers; the thickness of the twelfth layer (12) is 5–15 nanometers; the thickness of the thirteenth layer (13) is 15–30 nanometers; the thickness of the fourteenth layer (14) is 1–5 nanometers; the thickness of the fifteenth layer (15) is 35–50 nanometers; and the thickness of the sixteenth layer (16) is 5–10 nanometers.

[0056] The design principle of the coating layer of this coated glass:

[0057] 1. This coated glass uses a silicon nitride zirconium layer as the bottom layer, which makes the bonding between the film and the glass stronger, thus effectively preventing the film from peeling off during subsequent processing. Simultaneously, the second titanium dioxide layer has a "refractive index conversion" function, creating a smoother optical gradient; that is, the refractive index change is gradual (Δn is small) from the SiZrN layer to the TiO2 layer. This design minimizes the reflection loss of visible light when passing through the multilayer interface. More light energy participates in the subsequent interference effect, laying the physical foundation for achieving extremely high visible light transmittance. This is like building a smoother bridge (TiO2) between the gentle slope (SiZrN) and a higher point, allowing light energy to pass through more smoothly. One of the core roles of the titanium dioxide layer here is as a high-refractive-index "shield," establishing a more optimized optical transition between the SiZrN layer and any subsequent layers with higher refractive indices or metal layers.

[0058] 2. In this coated glass, the design concept of the third to seventh layers (3) and the eleventh to fifteenth layers (11) is the same: a ZnAlO2 layer is placed between the two outer protective layers. x The " / Ag / NiCr" combination, a core engine for modern high-performance Low-E coatings based on silver layers, is one of the optimal solutions for achieving high transmittance and low emissivity. ZnAlO x The high quality of the Ag layer is ensured, while NiCr ensures its stability, providing the core functionality. Protected by the NiCr layer, this core unit is more stable during subsequent processing (such as tempering and bending heat treatments), less prone to oxidation and damage, significantly improving product yield and durability. By precisely controlling the Ag layer thickness, product performance can be flexibly adjusted: a thinner Ag layer results in higher light transmittance and lower shading; a thicker Ag layer reduces light transmittance and increases shading (reflecting more solar heat radiation). Furthermore, at the fifteenth layer, we replaced the outer protective layer with a thicker silicon aluminum nitride layer, aiming to enhance the durability of this coated glass (weather resistance, corrosion resistance, and abrasion resistance), improve its off-site processing capabilities, and achieve superior optical performance meeting the standards of triple-silver products. The product is also more energy-efficient, providing residents with a better living experience.

[0059] 3. In this coated glass, we incorporated a sandwich structure in the eighth, ninth, and tenth layers. This "silicon nitride aluminum / nickel-chromium / silicon nitride aluminum" sandwich structure cleverly utilizes a hard and stable silicon nitride aluminum protective layer to encapsulate the functional but relatively fragile metal layer. This maximizes the Low-E energy-saving advantages while overcoming the inherent poor durability and difficulty in processing of metal films, ultimately producing a high-performance, highly durable, and aesthetically pleasing energy-saving coated glass product. This combination allows our double-silver coated glass to achieve optical performance comparable to triple-silver products.

[0060] 4. In this coated glass, a zinc oxide aluminum layer is placed beneath the silver layer to ensure a denser and more stable coating during subsequent tempering and heat treatment, preventing coating peeling. The zinc oxide aluminum layer improves the film-forming properties of the silver film, provides chemical protection, optimizes optical matching, and enhances electrical performance.

[0061] Example 2: The preparation process of the low-reflection, high-transmittance double-silver low-emissivity coated glass in this embodiment of the invention is as follows:

[0062] 1) Float glass sheets were selected as the glass substrate layer G;

[0063] 2) Use a special film washing machine for coating to clean and dry the glass substrate layer G. Before coating, the surface of the glass substrate layer G must be dry, free of impurities and static electricity. Use deionized water for cleaning, and the water resistance should be greater than 10μs / cm.

[0064] 3) The above films are deposited using magnetron sputtering vacuum deposition. Before production or experimentation, ensure the vacuum level is below 3 × 10⁻³ bar and that the targets for various coating materials are functioning normally. The specific steps are as follows:

[0065] A. Magnetron sputtering of the first layer 1

[0066] Number of targets: 1-2 AC rotating targets; target material configuration: silicon-zirconium alloy (SiZr); process gases: argon and nitrogen, with an argon to nitrogen ratio of 8:6;

[0067] B. Magnetron sputtering of the second layer 2

[0068] Number of targets: 1-2 AC rotating targets; target material configuration: titanium (Ti); process gas: argon and oxygen, with an argon to oxygen ratio of 10:1;

[0069] C. Magnetron sputtering third layer 3

[0070] Number of targets: 1-2 AC rotating targets; target material configuration: zinc-tin alloy (ZnSn); process gas: argon and oxygen, with an argon to oxygen ratio of 5:9;

[0071] D. Magnetron sputtering fourth layer 4

[0072] Number of targets: 1-2 AC rotating targets; target material configuration: zinc-aluminum alloy (ZnAl); process gases: argon and oxygen, with an argon to oxygen ratio of 5:9.

[0073] E. Magnetron sputtering fifth layer 5

[0074] Number of targets: 1 DC planar target; target material configuration: silver (Ag); process gas ratio: pure argon;

[0075] F, Magnetron sputtering sixth layer 6

[0076] Target quantity: 1 DC planar target; target material configuration: nickel-chromium alloy (NiCr); process gas ratio: pure argon;

[0077] G, Magnetron sputtering seventh layer 7

[0078] Number of targets: 2-4 AC rotating targets; target material configuration: zinc-tin alloy (ZnSn); process gas ratio: argon and oxygen, with an argon to oxygen ratio of 5:9.

[0079] H, Magnetron sputtering, eighth layer 8

[0080] Number of targets: 1-2 AC rotating targets; target material configuration: silicon-aluminum alloy (SiAl); process gases: argon and nitrogen, with an argon to oxygen ratio of 8:6.

[0081] I. Magnetron sputtering, ninth layer 9

[0082] Number of targets: 1 DC planar target; target material configuration: nickel-chromium alloy (NiCr); process gas: pure argon;

[0083] J, Magnetron sputtering, tenth layer, 10

[0084] Number of targets: 1-2 AC rotating targets; target material configuration: silicon-aluminum alloy (SiAl); process gases: argon and nitrogen, with an argon to oxygen ratio of 8:6.

[0085] K, Magnetron Sputtering, Layer 11

[0086] Number of targets: 1-2 AC rotating targets; target material configuration: zinc-tin alloy (ZnSn); process gas: argon and oxygen, with an argon to oxygen ratio of 5:9;

[0087] L, Magnetron sputtering, 12th layer

[0088] Number of targets: 2-4 AC rotating targets; target material configuration: zinc-aluminum alloy (ZnAl); process gas: argon and oxygen, with an argon to oxygen ratio of 5:9;

[0089] M, Magnetron sputtering, thirteenth layer, 13

[0090] Number of targets: 1 DC planar target; target material configuration: silver (Ag); process gas ratio: pure argon;

[0091] N, Magnetron Sputtering, Layer 14

[0092] Target quantity: 1 DC planar target; target material configuration: nickel-chromium alloy (NiCr); process gas ratio: pure argon;

[0093] O, Magnetron sputtering, 15th layer 15

[0094] Number of targets: 2-5 AC rotating targets; target material configuration: silicon-aluminum alloy (SiAl); process gases: argon and nitrogen, with an argon to oxygen ratio of 8:6;

[0095] P, Magnetron sputtering, 16th layer

[0096] Number of targets: 1-2 AC planar targets; target material configuration: zirconium (Zr); process gases: argon and oxygen, with an argon to oxygen ratio of 20:1;

[0097] 4) The total film thickness is controlled between 139 and 275 nm, and the general sputtering chamber drive speed is controlled between 3.0 and 6.0 m / min.

[0098] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A medium-transmittance, low-reflection, double-silver, low-emissivity coated glass, characterized in that, This coated glass includes a glass substrate layer (G) and a coating layer. The coating layer includes sixteen layers sequentially laminated from the glass substrate layer (G) outwards. The first layer (1) is a silicon zirconium nitride layer, the second layer (2) is a titanium oxide layer, the third layer (3) is a zinc tin oxide layer, the fourth layer (4) is a zinc aluminum oxide layer, the fifth layer (5) is a silver layer, the sixth layer (6) is a nickel chromium layer, the seventh layer (7) is a zinc tin oxide layer, the eighth layer (8) is a silicon aluminum nitride layer, the ninth layer (9) is a nickel chromium layer, the tenth layer (10) is a silicon aluminum nitride layer, the eleventh layer (11) is a zinc tin oxide layer, the twelfth layer (12) is a zinc aluminum oxide layer, the thirteenth layer (13) is a silver layer, the fourteenth layer (14) is a nickel chromium layer, the fifteenth layer (15) is a silicon aluminum nitride layer, and the sixteenth layer (16) is a zirconium oxide layer.

2. The medium-transmittance, low-reflection, double-silver, low-emissivity coated glass according to claim 1, characterized in that, The thickness of the first layer (1) is 5–15 nanometers, the thickness of the second layer (2) is 3–10 nanometers, the thickness of the third layer (3) is 5–15 nanometers, the thickness of the fourth layer (4) is 5–15 nanometers, the thickness of the fifth layer (5) is 8–15 nanometers, and the thickness of the sixth layer (6) is 1–5 nanometers. The thickness of the seventh layer (7) is 35-50 nanometers, the thickness of the eighth layer (8) is 5-15 nanometers, the thickness of the ninth layer (9) is 1-5 nanometers, the thickness of the tenth layer (10) is 5-15 nanometers, the thickness of the eleventh layer (11) is 5-20 nanometers, the thickness of the twelfth layer (12) is 5-15 nanometers, the thickness of the thirteenth layer (13) is 15-30 nanometers, the thickness of the fourteenth layer (14) is 1-5 nanometers, the thickness of the fifteenth layer (15) is 35-50 nanometers, and the thickness of the sixteenth layer (16) is 5-10 nanometers.

3. A method for preparing the medium-transmittance, low-reflection, double-silver, low-emissivity coated glass according to claim 1, characterized in that, This method includes the following steps: 1) Float glass sheets are selected as the glass substrate layer (G); 2) Use a coating-specific film washing machine to clean and dry the glass substrate layer (G). Before coating, the surface of the glass substrate layer (G) must be dry, free of impurities, and free of static electricity. Use deionized water for cleaning, and the water resistance should be greater than 10 μs / cm. 3) The above films are deposited using magnetron sputtering vacuum deposition. Before production or experimentation, ensure the vacuum level is below 3 × 10⁻⁶. -3 The bar and various coating material targets are operating normally. The specific steps are as follows: A. Magnetron sputtering of the first layer (1) Number of targets: 1-2 AC rotating targets; target material configuration: silicon-zirconium alloy (SiZr); process gases: argon and nitrogen, with an argon to nitrogen ratio of 8:6; B. Magnetron sputtering of the second layer (2) Number of targets: 1-2 AC rotating targets; target material configuration: titanium (Ti); process gas: argon and oxygen, with an argon to oxygen ratio of 10:1; C. Magnetron sputtering of the third layer (3) Number of targets: 1-2 AC rotating targets; target material configuration: zinc-tin alloy (ZnSn); process gas: argon and oxygen, with an argon to oxygen ratio of 5:9; D. Magnetron sputtering of the fourth layer (4) Number of targets: 1-2 AC rotating targets; target material configuration: zinc-aluminum alloy (ZnAl); process gases: argon and oxygen, with an argon to oxygen ratio of 5:

9. E. Magnetron sputtering fifth layer (5) Number of targets: 1 DC planar target; target material configuration: silver (Ag); process gas ratio: pure argon; F. Magnetron sputtering of the sixth layer (6) Target quantity: 1 DC planar target; target material configuration: nickel-chromium alloy (NiCr); process gas ratio: pure argon; G. Magnetron sputtering of the seventh layer (7) Number of targets: 2-4 AC rotating targets; target material configuration: zinc-tin alloy (ZnSn); process gas ratio: argon and oxygen, with an argon to oxygen ratio of 5:

9. H, Magnetron sputtering of the eighth layer (8) Number of targets: 1-2 AC rotating targets; target material configuration: silicon-aluminum alloy (SiAl); process gases: argon and nitrogen, with an argon to oxygen ratio of 8:6; I. Magnetron sputtering of the ninth layer (9) Target quantity: 1 DC planar target; target material configuration: nickel-chromium alloy (NiCr); process gas: pure argon; J. Magnetron sputtering, tenth layer (10) Number of targets: 1-2 AC rotating targets; target material configuration: silicon-aluminum alloy (SiAl); process gases: argon and nitrogen, with an argon to oxygen ratio of 8:6; K, Magnetron sputtering eleventh layer (11) Number of targets: 1-2 AC rotating targets; target material configuration: zinc-tin alloy (ZnSn); process gas: argon and oxygen, with an argon to oxygen ratio of 5:9; L, Magnetron sputtering of the twelfth layer (12) Number of targets: 2-4 AC rotating targets; target material configuration: zinc-aluminum alloy (ZnAl); process gas: argon and oxygen, with an argon to oxygen ratio of 5:9; M, Magnetron sputtering thirteenth layer (13) Number of targets: 1 DC planar target; target material configuration: silver (Ag); process gas ratio: pure argon; N, Magnetron sputtering of the fourteenth layer (14) Target quantity: 1 DC planar target; target material configuration: nickel-chromium alloy (NiCr); process gas ratio: pure argon; O, Magnetron sputtering of the fifteenth layer (15) Number of targets: 2-5 AC rotating targets; target material configuration: silicon-aluminum alloy (SiAl); process gases: argon and nitrogen, with an argon to oxygen ratio of 8:6; P, Magnetron sputtering, sixteenth layer (16) Number of targets: 1-2 AC planar targets; target material configuration: zirconium (Zr); process gases: argon and oxygen, with an argon to oxygen ratio of 20:

1. 4) The total film thickness is controlled between 139 and 275 nm, and the general sputtering chamber drive speed is controlled between 3.0 and 6.0 m / min.

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