Plasma processing device and method for constructing photo-thermal anti-icing surface through one-step method
By depositing a superhydrophobic thin film with a photothermal component graft structure on the surface of an insulating material and generating an anti-icing film using a plasma processing device, the problems of high energy consumption, chemical pollution, and slow response speed of existing anti-icing technologies are solved, achieving rapid de-icing and inhibition of icing, and improving insulation performance and anti-icing capability.
Patent Information
- Application Number
- CN202511022740.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-24
- Publication Date
- 2025-12-05
AI Technical Summary
Existing anti-icing technologies suffer from high energy consumption, chemical pollution, slow response speed, and insufficient mechanical durability, and are particularly ineffective in extreme environments.
A plasma treatment device and method for constructing photothermal anti-icing surfaces using a one-step process is proposed. This method involves depositing a superhydrophobic thin film with a photothermal component graft structure on the surface of an insulating material, generating a plasma plume using a plasma treatment device, and forming an anti-icing film on the substrate surface.
It achieves rapid de-icing and ice suppression, maintains excellent insulation performance, improves the anti-icing capability and operational reliability of power grid equipment in low-temperature environments, and avoids the complicated steps and chemical reagent pollution of traditional methods.
Smart Images
Figure CN121065666A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of plasma, in particular to a plasma processing device and method for constructing a photo-thermal anti-icing surface by one-step method. BACKGROUND
[0002] In recent years, with the global climate deterioration, the weather of rain and snow occurs frequently, which causes large-area icing on power transmission lines, insulating sleeves and related power facilities in the power system, and this has become one of the main reasons affecting the stable operation of the power grid. Common icing hazards include conductor breakage, fitting damage, cross arm damage, insulator flashover, etc., causing huge economic losses and social influence. Severe icing of conductors can easily cause excessive horizontal load, further causing inter-phase, conductor-to-ground discharge flashover and discharge between conductors and ground; icing on the surface of insulators can easily cause a decrease in insulating performance, and after the ice and snow melt, contamination is caused to reduce the surface resistance, and at the same time, the icing causes changes in the surface structure of the insulator, the surface potential distribution changes, the surface potential is distorted, and the surface flashover voltage is reduced, ultimately leading to potential hazards in the operation of the power system.
[0003] At present, the material surface anti-icing and deicing technology mainly includes active deicing and passive deicing: 1. Active deicing technology (such as mechanical deicing, electric heating deicing and chemical deicing) relies on external energy input or chemical reagent action, although the deicing effect is significant, but there are problems of high energy consumption, high operation cost and chemical pollution, etc. Among them, electric heating deicing needs continuous power supply, and the energy consumption problem is particularly prominent in large equipment applications; and the chemicals such as antifreeze used in chemical deicing will cause persistent pollution to the environment. 2. Passive anti-icing technology (such as super-hydrophobic coating, low surface energy material and self-lubricating surface, etc.) delays or prevents icing by modifying the surface of the material, has the advantages of low energy consumption and good sustainability, but the anti-icing performance is greatly affected by environmental conditions, and the anti-icing effect will decrease significantly in extreme low temperature or high humidity environment, and there are problems of slow response speed and insufficient mechanical durability. For example, the micro-nano structure of the super-hydrophobic surface is easily damaged after long-term use, resulting in degradation of the anti-icing performance.
[0004] In order to overcome the defects of single technology, the present application proposes a plasma processing device and method for constructing a photo-thermal anti-icing surface by one-step method, which deposits a super-hydrophobic film with a photo-thermal component grafting structure on the surface of an insulating material, constructs a photo-thermal-insulating super-hydrophobic anti-icing coating by one-step method, realizes rapid ice melting and icing inhibition, and at the same time maintains excellent insulating performance, effectively solves the problems of complicated steps and chemical reagent pollution in traditional anti-icing treatment, and efficiently improves the anti-icing ability and operation reliability of the insulating material of the power grid equipment in low temperature environment. SUMMARY
[0005] The application aims to provide a one-step method for constructing a plasmonic processing device for a photothermal anti-icing surface to solve the above problems in the prior art.
[0006] The technical scheme is as follows: a one-step method for constructing a plasmonic processing device for a photothermal anti-icing surface, comprising a processing module and a reaction module; the processing module comprises a gas bottle, a gas path component and a fluidization component connected to the output end of the gas bottle respectively, and a gas mixing box connected to the output end of the gas path component and the fluidization component; the reaction module is connected to the output end of the gas mixing box and comprises a reaction component connected to the output end of the gas mixing box and a plasma excitation source connected to the reaction component; wherein the reaction component is provided with a substrate to be processed; the gas bottle outputs gas into the gas path component and the fluidization component respectively to carry out hydrophobic medium and photothermal powder, the gas is mixed in the gas mixing box and is output to the reaction component, and the plasma is generated by discharging through the plasma excitation source to form an anti-icing film on the surface of the substrate to be processed.
[0007] Preferably, the output end of the gas bottle is connected to the gas path component and the fluidization component through a three-way joint; and a pressure reducing valve is further arranged between the output end of the gas bottle and the three-way joint.
[0008] Preferably, the gas path component comprises a first flow meter, an anti-suck bottle connected in sequence to the output end of the three-way joint through a pipeline, and a gas washing bottle connected between the anti-suck bottle and the input end of the gas mixing box.
[0009] Preferably, the fluidization component comprises a second flow meter connected to the other output end of the three-way joint through a pipeline, and a fluidization bottle connected between the second flow meter and the input end of the gas mixing box.
[0010] Preferably, the reaction component comprises a dielectric barrier discharge reactor connected to the output end of the gas mixing box, and a glass substrate horizontally arranged below the dielectric barrier discharge reactor through a mechanical shaft; wherein the top end of the glass substrate is placed with the substrate to be processed.
[0011] Preferably, the substrate to be processed is one of an epoxy resin plate, rubber, ceramic, aluminum and copper, and the thickness of the substrate to be processed is 0-1mm.
[0012] Preferably, the hydrophobic medium in the gas washing bottle is one of hexamethyldisiloxane and polydimethylsiloxane.
[0013] Preferably, the photothermal powder in the fluidization bottle is one of black titanium dioxide, graphene oxide and multi-walled carbon nanotube, the particle size of the photothermal powder is 20-30nm, and the weight of the photothermal powder selected at one time is 200-700mg.
[0014] Preferably, the thickness of the fluidization plate in the fluidization bottle is 5-8mm, and the pore size of the fluidization plate is 15-25um.
[0015] The method for constructing a photo-thermal anti-icing surface by plasma treatment in one step comprises the following steps:
[0016] S1: after cleaning the substrate to be treated, place it on the upper surface of the glass substrate, adjust the dielectric barrier discharge reactor to be horizontal to the glass substrate by mechanical shaft, and place the hydrophobic medium and the photo-thermal powder in the gas washing bottle and the fluidization bottle, respectively;
[0017] S2: the argon gas in the gas bottle is divided into two paths through a three-way joint, one path of argon gas passes through the first flowmeter, the anti-suck bottle in sequence, and enters the gas washing bottle, so as to take out the hydrophobic medium in the gas washing bottle by bubbling method and send it into the gas mixing box;
[0018] The other path of argon gas passes through the second flowmeter and then enters the fluidization bottle, fluidizes and takes out the photo-thermal powder in the fluidization bottle, and sends it into the gas mixing box;
[0019] S3: after the two mixed gases entering the gas mixing box are fully mixed, they are introduced into the dielectric barrier discharge reactor, discharge occurs under the action of the plasma excitation source, and a plasma plume is generated;
[0020] S4: the dielectric barrier discharge reactor is moved back and forth by mechanical shaft to re-polymerize and graft a film on the surface of the substrate to be treated.
[0021] The beneficial effects of the present application are: constructing a photo-thermal anti-icing film on the surface of the substrate to be treated by atmospheric pressure plasma, using argon Ar as working gas, taking out the low surface energy hydrophobic medium and the photo-thermal powder by bubbling method and fluidization method respectively, and crushing them under the action of plasma to re-polymerize and graft a film on the surface of the substrate to be treated, which has micro-nano microstructure and light absorption and heating effect at the same time, further enhancing the anti-icing performance. BRIEF DESCRIPTION OF DRAWINGS
[0022] Fig. 1 It is a structural schematic diagram of the present application;
[0023] Fig. 2 It is a schematic diagram of the water contact angle of the substrate to be treated before treatment in the present application;
[0024] Fig. 3 It is a schematic diagram of the water contact angle of the substrate to be treated after treatment in the present application;
[0025] Fig. 4 It is a scanning electron microscope image of the substrate to be treated before treatment in the present application;
[0026] Fig. 5 It is a scanning electron microscope image of the substrate to be treated after treatment in the present application;
[0027] Fig. 6 It is a heating temperature rise diagram of the substrate to be treated before treatment in the present application;
[0028] Fig. 7 Figure 1 is a heating temperature curve of the substrate after the treatment in the present application.
[0029] In the figure, the reference signs are: 1, treatment module; 2, reaction module; 3, substrate to be treated; 4, plasma plume; 11, gas bottle; 12, gas path component; 13, fluidizing component; 14, gas mixing box; 15, tee joint; 16, pressure reducing valve; 21, reaction component; 22, plasma excitation source; 121, first flow meter; 122, anti-suck back bottle; 123, gas washing bottle; 131, second flow meter; 132, fluidizing bottle; 211, dielectric barrier discharge reactor; 212, mechanical shaft; 213, glass substrate. DETAILED DESCRIPTION
[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application. Specific embodiment 1:
[0032] As shown in the accompanying drawings, Figs. 1-7 in the present embodiment, the plasma treatment device and method for constructing a photo-thermal anti-icing surface in one step include a treatment module 1, which includes a gas bottle 11, gas path components 12 and fluidizing components 13 connected to the output end of the gas bottle 11 respectively, and a gas mixing box 14 connected to the output ends of the gas path components 12 and the fluidizing components 13.
[0033] Among them, the output end of the gas bottle 11 is connected with the gas path components 12 and the fluidizing components 13 through pipelines respectively, and the argon gas in the gas bottle 11 is transported into the gas path components 12 and the fluidizing components 13 respectively, so as to carry out the hydrophobic medium and the photo-thermal powder, and the hydrophobic medium and the photo-thermal powder, gas are fully mixed in the gas mixing box 14 to improve the uniformity of the treatment.
[0034] A reaction module 2 is connected to the output end of the gas mixing box 14, which includes a reaction component 21 connected to the output end of the gas mixing box 14, and a plasma excitation source 22 connected to the reaction component 21.
[0035] The mixed gas in the gas mixing box 14 is transported into the reaction component 21, and is connected to the plasma excitation source 22, so as to break the hydrophobic medium and the photo-thermal powder under the action of the plasma, and re-polymerize and graft a film on the surface of the substrate to be treated 3, so as to complete the construction of the photo-thermal anti-icing surface in one step.
[0036] The reaction piece 21 is provided with a substrate 3 to be treated; the gas bottle 11 outputs gas into the gas path piece 12 and the fluidization piece 13 respectively, carries out the hydrophobic medium and the photothermal powder respectively, mixes in the gas mixing box 14, and is input into the reaction piece 21, discharges via the plasma excitation source 22, generates a plasma body plume 4, and forms an anti-icing film on the surface of the substrate 3 to be treated. The negative electrode of the plasma excitation source 22 is grounded, and the positive electrode of the plasma excitation source 22 is connected to the dielectric barrier discharge reactor 211. The power supply voltage parameter of the plasma excitation source 22 is 9-12kV, and the discharge is too violent when the voltage is too high, which causes the medium to be excessively broken and unable to form a film. When the voltage is too low, the medium may not be broken. The frequency is 6-9kHz, the pulse number is 10000, the rising edge and the falling edge are both 50ns, and the plasma excitation source 22 is opened after 50ns to process the sample.
[0037] The output end of the gas bottle 11 is connected to the gas path piece 12 and the fluidization piece 13 through the three-way joint 15; and a pressure reducing valve 16 is further arranged between the output end of the gas bottle 11 and the three-way joint 15.
[0038] The output end of the gas bottle 11 is connected to the pressure reducing valve 16 through a pipeline, the other end of the pressure reducing valve 16 is connected to the three-way joint 15 through a pipeline, and the other two ends of the three-way joint 15 are respectively connected to the gas path piece 12 and the fluidization piece 13 through pipelines.
[0039] The gas path piece 12 comprises a first flow meter 121, an anti-suck bottle 122 and a gas washing bottle 123 connected in sequence between the output end of the three-way joint 15 and the input end of the gas mixing box 14.
[0040] The first flow meter 121 is used to accurately display the gas volume flow rate flowing into the gas path piece 12, the anti-suck bottle 122 is used to prevent the liquid in the gas washing bottle 123 from flowing back into the first flow meter 121, and the gas washing bottle 123 is provided with a low-surface-energy hydrophobic medium. Argon gas is input into the hydrophobic medium liquid from the top through a pipeline to bring out the hydrophobic medium by the bubbling method, and the argon gas with the hydrophobic medium is input into the gas mixing box 14.
[0041] The fluidization piece 13 comprises a second flow meter 131 connected to the other output end of the three-way joint 15 through a pipeline, and a fluidization bottle 132 connected between the second flow meter 131 and the input end of the gas mixing box 14. The thickness of the fluidization plate in the fluidization bottle 132 is 5-8mm, and the hole diameter of the fluidization plate is 15-25um.
[0042] The second flow meter 131 is used to accurately display the gas volume flow into the fluidizing member 13. The fluidizing bottle 132 is provided with a fluidizing plate at the bottom end, and the light-heat medium powder is placed on the fluidizing plate. Argon gas is input into the fluidizing bottle 132, and the inlet is lower than the height of the fluidizing plate in the fluidizing bottle 132. When the argon gas in the fluidizing bottle 132 escapes upward, it passes through the fluidizing plate and carries the light-heat powder. The argon gas with the light-heat powder is input into the gas mixing box 14. The thickness of the fluidizing plate affects the fluidizing effect of the powder, and the appropriate particle size can further avoid the agglomeration of the powder.
[0043] The sealing of the fluidizing bottle 132 is ensured, and the powder is in a suspended state after being fluidized by the argon gas. 3L / min to 4L / min of working gas Ar is input into the bottom of the fluidizing bottle 132 through the gas interface, and the powder is fluidized into a suspended state by observing the fluidizing plate above the fluidizing bottle 132. If the argon gas flow is lower than 3L / min, the powder cannot be fluidized, and if it is higher than 4L / min, it will affect the other medium and make it not be able to be broken and regrafted into a film before being blown away.
[0044] The reaction member 21 includes a dielectric barrier discharge reactor 211 connected to the output end of the gas mixing box 14, and a glass substrate 213 horizontally arranged below the dielectric barrier discharge reactor 211 through a mechanical shaft 212. The top end of the glass substrate 213 is placed with the substrate 3 to be treated. Before treatment, the internal gas passage of the dielectric barrier discharge reactor 211 needs to be checked again, and the powder and medium need to be checked again.
[0045] The two groups of mixed gas entering the gas mixing box 14 are fully mixed in the gas mixing box 14, and then input into the dielectric barrier discharge reactor 211. The plasma excitation source 22 is started, and discharge occurs under the action of the plasma excitation source 22 to generate a plasma plume 4.
[0046] In use, the dielectric barrier discharge reactor 211 is placed 2-4mm above the glass substrate 213 through two cross bars, and the dielectric barrier discharge reactor 211 is lifted left and right through the mechanical shaft 211, so that the bottom of the dielectric barrier discharge reactor 211 is parallel to the glass substrate 213. If the distance between the dielectric barrier discharge reactor 211 and the glass substrate 213 is too low or too high, the dielectric barrier discharge will be uneven. If the distance is too low, the discharge will be intense, and the medium will not be able to graft and grow after being broken. If the discharge is weak, the medium cannot be broken.
[0047] The substrate 3 to be treated is placed on the upper surface of the glass substrate 213 below the dielectric barrier discharge reactor 211, and the distance between them is kept at 1-3 mm; the dielectric barrier discharge reactor 211 is driven by the mechanical shaft 211 to move back and forth with a moving distance of 20 mm, and the moving time is 1-5 min, so that the dielectric barrier discharge reactor 211 uniformly processes the substrate 3 to be treated. Here, the moving time needs to be synchronized with the processing time to maintain the uniformity of the film. The moving distance is controlled at 10-30 mm to match the size of the substrate 3 to be treated. At the same time, the moving speed should not be too fast and should be kept at 1-2 mm / s, so that the medium has sufficient time to regraft and grow on the surface of the substrate 3 to be treated, and the photo-thermal anti-icing surface structure is completed.
[0048] The substrate 3 to be treated is one of an epoxy resin plate, rubber, ceramic, aluminum, and copper, and the thickness of the substrate 3 to be treated is 0-1 mm.
[0049] The dielectric barrier discharge reactor 211 is internally attached to a high-voltage electrode, and the bottom of the glass substrate 213 is attached to a copper foil as a ground electrode. The substrate 3 to be treated is placed on the upper surface of the glass substrate 213. The thickness of the substrate 3 to be treated is 0-1 mm. When the substrate 3 to be treated is too thick, it affects the uniformity and discharge effect of the discharge, causing the hydrophobic medium to be unable to be broken and regrafted and grown on the surface of the substrate 3 to be treated, and the photo-thermal powder loses the attachment bed and cannot form a film.
[0050] The substrate 3 to be treated is placed directly below the dielectric barrier discharge reactor 211, and the distance between the substrate 3 to be treated and the bottom of the dielectric barrier discharge reactor 211 is 1-3 mm. The distance between the two ends of the substrate 3 to be treated and the left and right ends of the dielectric barrier discharge reactor 211 is within 0-2 cm.
[0051] The hydrophobic medium in the gas washing bottle 123 is one of hexamethyldisiloxane and polydimethylsiloxane.
[0052] The modified medium in the gas washing bottle 123 can be selected from siloxanes such as hexamethyldisiloxane and polydimethylsiloxane, which can graft low-surface-energy groups on the surface of the substrate 3 to be treated to form a micro-nano structure and combine into a hydrophobic film, thereby improving the water contact angle and inhibiting ice formation.
[0053] The photo-thermal powder in the fluidization bottle 132 is one of black titanium dioxide, graphene oxide, and multi-walled carbon nanotubes. The particle size of the photo-thermal powder is 20-30 nm, and the weight of the photo-thermal powder selected at one time is 200-700 mg.
[0054] Wherein, in the thin film is added light heat medium, it has the light heat characteristic, achieves further inhibiting the ice. The light heat powder is selected once the weight is 200-700 mg, otherwise will cause the powder itself weight to lead to the fluidization uneven, the powder forms the reunion and attaches on the film, makes the light heat effect uneven causes the local overheating or not heating phenomenon.
[0055] The method for constructing the light heat anti-icing surface by one-step plasma treatment, and the device for constructing the light heat anti-icing surface by one-step plasma treatment, comprising the following steps:
[0056] S1: after cleaning the substrate 3 to be processed, place it on the upper surface of the glass substrate 213, adjust the dielectric barrier discharge reactor 211 to be horizontal to the glass substrate 213 through the mechanical shaft 212; and respectively place the hydrophobic medium and the light heat powder in the gas washing bottle 123 and the fluidization bottle 132;
[0057] S2: the argon in the gas bottle 11 is divided into two ways through the three-way joint 15, one way of argon passes through the first flow meter 121, the anti-suck bottle 122 and enters the gas washing bottle 123 in turn, and the hydrophobic medium in the gas washing bottle 123 is taken out by the bubble method and sent into the gas mixing box 14;
[0058] The other way of argon enters the fluidization bottle 132 after passing through the second flow meter 131, fluidizes and takes out the light heat powder in the fluidization bottle 132, and sends it into the gas mixing box 14;
[0059] S3: after the two mixed gases entering the gas mixing box 14 are mixed, they are introduced into the dielectric barrier discharge reactor 211, and discharge occurs under the action of the plasma excitation source 22 to generate the plasma plume 4;
[0060] S4: the dielectric barrier discharge reactor 211 is moved back and forth by the mechanical shaft 212 to re-polymerize and graft on the surface of the substrate 3 to be processed to form a film.
[0061] Working principle:
[0062] Firstly, select the appropriate substrate 3 to be processed, clean it, use dust-free paper soaked in alcohol to wipe it, dry it again, and then wipe it back and forth with dust-free paper to ensure the surface is clean. Then add the hydrophobic medium and the light heat powder into the gas washing bottle 123 and the fluidization bottle 132 respectively, ensure the sealing of the fluidization bottle 132, input one way of argon in the gas bottle 11 into the fluidization bottle 132, so that the powder is fluidized and suspended, and the light heat powder is taken out when it escapes upward. The other way of argon in the gas bottle 11 enters the gas washing bottle 123 through the first flow meter 121 and the anti-suck bottle 122 in turn to take out the hydrophobic medium by the bubble method.
[0063] Argon gas containing photothermal powder and argon gas containing a hydrophobic medium are thoroughly mixed in mixing chamber 14 and then introduced into dielectric barrier discharge reactor 211. Before treatment, the gas path of dielectric barrier discharge reactor 211 needs to be checked for smoothness, and the smooth extrusion of powder and medium needs to be checked. Next, the substrate 3 to be treated is placed on glass substrate 213, and dielectric barrier discharge reactor 211 is adjusted by mechanical shaft 212 so that the bottom of dielectric barrier discharge reactor 211 is parallel to glass substrate 213. Plasma excitation source 22 is started, and appropriate treatment parameters are adjusted for treatment. Dielectric barrier discharge reactor 211 discharges under the action of plasma excitation source 22, generating plasma plume 4; and mechanical shaft 212 is controlled to drive dielectric barrier discharge reactor 211 to move back and forth, so that dielectric barrier discharge reactor 211 uniformly regrafts film on the surface of substrate 3 to be treated. Specific Implementation Example 2:
[0065] As attached Figs. 1-7 As shown, in this embodiment, the processing of epoxy resin boards is taken as an example:
[0066] First, before processing, wipe and clean the epoxy resin board with alcohol for 1 minute to remove stains from the surface of the epoxy resin board. The epoxy resin board is 5-10cm long, 3-5cm wide, and 0-0.1cm high. This size is compatible with the dielectric barrier discharge reactor 211, and the thickness of the epoxy resin board is limited to 0-0.1cm.
[0067] Next, nano-sized black titanium dioxide powder is placed on top of the fluidizing plate inside the fluidizing bottle 132. The weight of the black titanium dioxide powder is between 200-700mg. Then, hexamethyldisiloxane is selected as a hydrophobic anti-icing medium, added to the gas washing bottle 123 and connected to the gas line.
[0068] The argon gas in gas cylinder 11 is then split into two streams and fed into gas washing bottle 123 and fluidizing bottle 132, respectively. Argon gas is introduced into gas washing bottle 123, and the hydrophobic medium is blown out with the working gas by bubbling. Argon gas is introduced into fluidizing bottle 132 at a flow rate of 3-4 L / min to fluidize the photothermal powder so that it can be smoothly blown out with the working gas.
[0069] Two gas streams containing the medium and powder are connected to the mixing box 14 via a gas tee connector, so that the medium, powder and gas are fully mixed and uniform before being connected to the gas inlet of the dielectric barrier discharge reactor 211.
[0070] The dielectric barrier discharge reactor 211 is placed 2-4 mm above the glass substrate 213 by two fixed crossbars, and the dielectric barrier discharge reactor 211 is parallel to the glass substrate 213 by adjusting the mechanical shaft 212 to lift the platform left and right. The epoxy resin plate to be treated is placed below the dielectric barrier discharge reactor 211, i.e. on the upper surface of the glass substrate 213 to be treated, and the distance between the two is kept at 1-3 mm.
[0071] By controlling the mechanical shaft 212, the dielectric barrier discharge reactor 211 is driven to move back and forth within a range of 20 mm in moving distance, and the moving time is 1-5 min, so that the dielectric barrier discharge reactor 211 uniformly processes the epoxy resin plate.
[0072] Start the plasma excitation source 22, set reasonable parameters, so that the dielectric barrier discharge reactor 211 discharges under the action of the plasma excitation source 22, crushes the medium, and generates a plasma plume 4.
[0073] The power supply voltage parameter of the plasma excitation source 22 is set to 9-12 kV, the frequency is 6-9 kHz, the pulse number is 10000, the rising and falling edges are both 50 ns, and the plasma excitation source 22 is turned on after 50 ns for sample processing. The processing time is limited to 1-5 min (the processing time must be strictly controlled within 1-5 min, otherwise the medium cannot be re-grafted into a film on the surface of the epoxy resin plate in a short time, and the increase in titanium dioxide content will increase the overall thermal conductivity of the film, which is not conducive to the suppression of icing).
[0074] Under the action of plasma discharge, free electrons will collide with working gas Ar, medium hexamethyl disiloxane and black titanium dioxide powder to generate high-energy particles such as Ar*, Ar+, N2*, O2* and the like, as shown in formulas (1)-(4).
[0075] Ar+e * →Ar * +e (1)
[0076] Ar+e * →Ar + +2e (2)
[0077] N2+e * →N2 * +e (3)
[0078] O2+e * →O2 * +e (4)
[0079] In addition, the Penning ionization between the above active particles can further enhance the plasma discharge, thereby causing the medium hexamethyl disiloxane to break, as shown in formulas (5)-(8).
[0080]
[0081] Meanwhile, high-energy particles bombard the surface of the epoxy resin plate, simultaneously opening its chemical bonds, allowing hexamethyldisiloxane fragments [SiOSi+(CH3)5, SiO(CH3)3, SiOSi, Si(CH3)3] to be grafted and further crosslinked, forming a dense silicon-containing film on the surface of the substrate. In this process, the black titanium dioxide powder, which is the photo-thermal medium, is fluidized into a suspended state by the fluidization bottle 132, and under the action of the working gas Ar, it is uniformly attached and grafted inside and on the surface of the film through the uniform gas valve in the dielectric barrier discharge reactor 211.
[0082] Finally, the crosslinked cluster film formed by the deposition of black titanium dioxide powder and hexamethyldisiloxane particles is deposited on the surface of the epoxy resin plate, not only increasing the surface roughness, but also introducing low-polarity silicon-containing groups (SiOSi, Si-CHx, Si-O2, Si-O4), and due to the addition of photo-thermal powder, the treated substrate has excellent photo-thermal effect under 808 nm laser irradiation.
[0083] Table 1 is a comparison of the water contact angle, ice drop time, photo-thermal performance, and flashover voltage of the above-mentioned epoxy resin plate surface treated by atmospheric pressure plasma and untreated. The water contact angle is measured by dropping 2uL of liquid droplet on the surface of the material on the water contact angle measuring instrument; the ice formation time is placing the sample on a -15℃ ice formation platform, dropping 2uL of liquid droplet on the surface of the material in a 20℃ environment, and the time from the liquid droplet contacting the ice formation platform to the liquid droplet freezing is the ice formation time; the photo-thermal performance is detected by irradiating the surface of the material with 808nm laser at a power density of 1500mW / cm 2 for 2min, and then detecting the temperature rise with an infrared thermal imager; two finger electrodes are pressed to the ends of the sample and the distance is controlled to be 5mm, and the surface flashover is caused by increasing the voltage with an adjustable high-voltage DC source, and the detection and analysis are performed by a high-voltage probe and an oscilloscope.
[0084] Table 1 Comparison of performance parameters of untreated and treated samples
[0085]
[0086] Table 1 shows that the water contact angle of the untreated epoxy resin sample surface is only 79.27°, indicating a hydrophilic surface, while the treated surface reaches 150.52°, achieving a superhydrophobic effect. Due to the micro-nano structure and low surface energy groups of the superhydrophobic surface, the adhesion of ice is significantly reduced, and a self-cleaning effect is achieved during the melting process. Compared with the untreated sample, the icing time of the treated sample is more than 4 times longer, and the anti-icing performance is improved by 400%. Simultaneously, the sample modified by atmospheric pressure plasma under the same irradiation conditions is nearly 30°C higher than the untreated sample, and the increased temperature significantly improves the surface anti-icing performance. Finally, the comparison of flashover voltage shows that the insulation performance of the treated sample is simultaneously improved.
[0087] like Fig. 2 , 3 As shown, compared to hydrophilic surfaces, the contact area between droplets and material surfaces is greatly reduced on superhydrophobic surfaces, resulting in air between the droplet surface and the material surface. This weakens heat conduction and delays droplet icing, thus achieving the anti-icing function.
[0088] like Fig. 4 , 5 As shown, electron microscopy scanning of samples before and after treatment clearly shows that the untreated sample has a smooth, particle-free surface, maximizing the contact area between the droplets and the material surface, resulting in strong thermal conductivity between the droplets and the material, which allows it to freeze rapidly at low temperatures. The treated sample has a complex micro-nano structure on its surface, which reduces the contact area between the droplets and the material surface, reduces thermal conductivity, and improves ice-repellent properties. At the same time, photothermal powder particles are attached and grafted into the micro-nano structure film, which has a significant photothermal effect when irradiated with light, causing the temperature to rise and further delaying the freezing of the material surface.
[0089] The following are infrared thermal imaging comparisons of the epoxy resin boards before and after plasma treatment, after 2 minutes of laser irradiation: Fig. 6 , 7 As shown, the surface temperature of the treated epoxy resin board can reach a maximum of 90.1℃, while the untreated board only reaches 50.7℃, representing an improvement of approximately 50%.
[0090] The preferred embodiments have been shown and described, but should not be construed as limiting the invention itself. Various changes in form and detail may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims
1. A plasmonic device for constructing a photothermal anti-icing surface in a one-step process, characterized in that: The utility model relates to a kind of plasma surface treatment equipment, including, Processing module (1), including gas bottle (11), gas path member (12) and fluidizing member (13) respectively and the output end of gas bottle (11) are connected, and with the output end of gas path member (12) and fluidizing member (13) is connected mixed gas box (14);And, Reaction module (2), the output end of mixed gas box (14) is connected, including reaction member (21) and plasma excitation source (22) connected with reaction member (21) with the output end of mixed gas box (14) is connected; Wherein, the reaction member (21) is provided with to be handled substrate (3);The output gas of gas bottle (11) is respectively input gas path member (12) and fluidizing member (13) in, respectively take out hydrophobic medium and photo-thermal powder, mix in mixed gas box (14), and input to reaction member (21), discharge via plasma excitation source (22), generate plasma body plume (4), form anti-icing film for to be handled substrate (3) surface.
2. The one-step method plasmonic device for constructing photothermal de-icing surfaces according to claim 1, wherein: The output end of the gas bottle (11) is connected with the gas path member (12) and the fluidizing member (13) through the tee joint (15) respectively;Between the output end of the gas bottle (11) and the tee joint (15) is further provided with a pressure reducing valve (16).
3. The one-step method plasmonic device for constructing photothermal de-icing surfaces according to claim 2, wherein: The gas path member (12) includes a first flow meter (121), an anti-suck bottle (122) and a gas washing bottle (123) connected between the anti-suck bottle (122) and the input end of the mixed gas box (14) in sequence by pipelines and the output end of the tee joint (15).
4. The one-step method plasmonic device for constructing photothermal de-icing surfaces according to claim 3, wherein: The fluidizing member (13) includes a second flow meter (131) and a fluidizing bottle (132) connected between the second flow meter (131) and the input end of the mixed gas box (14) by pipelines and the other output end of the tee joint (15).
5. The one-step method plasmonic device for constructing photothermal de-icing surfaces according to claim 4, wherein: The reaction member (21) includes a dielectric barrier discharge reactor (211) connected to the output end of the mixed gas box (14) and a glass substrate (213) horizontally arranged below the dielectric barrier discharge reactor (211) by a mechanical shaft (212). Wherein, the top end of the glass substrate (213) is placed with the to-be-handled substrate (3).
6. The one-step method plasmonic device for constructing photothermal de-icing surfaces according to claim 5, wherein: The to-be-handled substrate (3) is one of epoxy resin plate, rubber, ceramic, aluminum and copper, and the thickness of the to-be-handled substrate (3) is 0-1mm.
7. The one-step method of constructing a plasmonic photothermal de-icing surface according to any one of claims 6, wherein: The hydrophobic medium in the gas washing bottle (123) is one of hexamethyldisiloxane and polydimethylsiloxane.
8. The one-step method plasmonic device for constructing photothermal de-icing surfaces according to claim 7, wherein: The photo-thermal powder in the fluidizing bottle (132) is one of black titanium dioxide, graphene oxide and multi-walled carbon nanotube, the particle size of the photo-thermal powder is 20-30nm, and the weight of the photo-thermal powder selected at one time is 200-700mg.
9. The one-step method plasmonic device for constructing photothermal de-icing surfaces according to claim 8, wherein: The thickness of the fluidizing plate in the fluidizing bottle (132) is 5-8mm, and the pore size of the fluidizing plate is 15-25um.
10. A method of plasma treatment for constructing a photothermal anti-icing surface by one-step method, based on the plasma treatment device for constructing a photothermal anti-icing surface by one-step method according to any one of claims 1 to 9, characterized in that: The utility model relates to a kind of plasma surface treatment equipment, including, Processing module (1), including gas bottle (11), gas path member (12) and fluidizing member (13) respectively and the output end of gas bottle (11) are connected, and with the output end of gas path member (12) and fluidizing member (13) is connected mixed gas box (14);And, Reaction module (2), the output end of mixed gas box (14) is connected, including reaction member (21) and plasma excitation source (22) connected with reaction member (21) with the output end of mixed gas box (14) is connected; Wherein, the reaction member (21) is provided with to be handled substrate (3);The output gas of gas bottle (11) is respectively input gas path member (12) and fluidizing member (13) in, respectively take out hydrophobic medium and photo-thermal powder, mix in mixed gas box (14), and input to reaction member (21), discharge via plasma excitation source (22), generate plasma body plume (4), form anti-icing film for to be handled substrate (3) surface. The output end of the gas bottle (11) is connected with the gas path member (12) and the fluidizing member (13) through the tee joint (15) respectively;Between the output end of the gas bottle (11) and the tee joint (15) is further provided with a pressure reducing valve (16). The gas path member (12) includes a first flow meter (121), an anti-suck bottle (122) and a gas washing bottle (123) connected between the anti-suck bottle (122) and the input end of the mixed gas box (14) in sequence by pipelines and the output end of the tee joint (15). The fluidizing member (13) includes a second flow meter (131) and a fluidizing bottle (132) connected between the second flow meter (131) and the input end of the mixed gas box (14) by pipelines and the other output end of the tee joint (15). The reaction member (21) includes a dielectric barrier discharge reactor (211) connected to the output end of the mixed gas box (14) and a glass substrate (213) horizontally arranged below the dielectric barrier discharge reactor (211) by a mechanical shaft (212). Wherein, the top end of the glass substrate (213) is placed with the to-be-handled substrate (3). The to-be-handled substrate (3) is one of epoxy resin plate, rubber, ceramic, aluminum and copper, and the thickness of the to-be-handled substrate (3) is 0-1mm. The hydrophobic medium in the gas washing bottle (123) is one of hexamethyldisiloxane and polydimethylsiloxane. The photo-thermal powder in the fluidizing bottle (132) is one of black titanium dioxide, graphene oxide and multi-walled carbon nanotube, the particle size of the photo-thermal powder is 20-30nm, and the weight of the photo-thermal powder selected at one time is 200-700mg. The thickness of the fluidizing plate in the fluidizing bottle (132) is 5-8mm, and the pore size of the fluidizing plate is 15-25um. Including following steps: S1: the substrate (3) to be treated is placed on the upper surface of the glass substrate (213) after cleaning, the dielectric barrier discharge reactor (211) is adjusted to be horizontal to the glass substrate (213) through the mechanical shaft (212), and the hydrophobic medium and the photo-thermal powder are respectively placed in the gas washing bottle (123) and the fluidization bottle (132); S2: the argon in the gas bottle (11) is divided into two paths through the three-way joint (15), one path of the argon passes through the first flow meter (121) and the anti-suck bottle (122) into the gas washing bottle (123) in turn, the hydrophobic medium in the gas washing bottle (123) is taken out by bubbling and sent into the gas mixing box (14); the other path of the argon passes through the second flow meter (131) and then enters the fluidization bottle (132), the photo-thermal powder in the fluidization bottle (132) is fluidized and taken out, and is sent into the gas mixing box (14); S3: after the two mixed gases entering the gas mixing box (14) are fully mixed, they are introduced into the dielectric barrier discharge reactor (211), discharge occurs under the action of the plasma excitation source (22), and a plasma plume (4) is generated; S4: the dielectric barrier discharge reactor (211) is moved back and forth through the mechanical shaft (212) to re-polymerize and graft on the surface of the substrate (3) to be treated to form a film.