Automatic optimization method of full-automatic ultrasonic detection process scheme

Abstract

The invention provides an automatic optimization method of a full-automatic ultrasonic detection process scheme, which comprises the following steps: automatically importing test block groove parameters and reflector position information, generating an initial focusing rule by a computer, and controlling a mechanical scanner to accurately position and automatically find the highest amplitude position of each reflector; then, key ultrasonic parameters such as transmitting / receiving wafers and angles are adaptively adjusted according to channel types, so that the main wave amplitude meets the standard requirement and is positioned to the center of a time gate, meanwhile, the coverage wave amplitude of adjacent channels is intelligently verified and optimized, special parameter setting is performed on a TOFD channel and a coupling channel, and a time-of-flight diffraction (TOFD) time-of-flight diffraction (TOFD) time-of-flight diffraction (TOFD) signal is obtained. And finally, the full-automatic, high-precision and high-efficiency test block calibration whole process is realized, the problems of errors and low efficiency caused by operation experience differences in traditional manual calibration are effectively avoided, the consistency and reliability of detection are remarkably improved, detection blind areas are comprehensively eliminated, and complete data support is provided for welding quality evaluation.

Description

Technical Field

[0001] This invention relates to the field of fully automated ultrasonic testing of pipeline circumferential welds in oil and gas storage and transportation engineering construction, and particularly to an automated optimization method for a fully automated ultrasonic testing process. Background Technology

[0002] In recent years, with the rapid development of pipeline engineering construction in my country, large-diameter, high-grade steel oil and gas pipelines are becoming increasingly common, leading to the widespread adoption of fully automated welding technology. For the detection of bevel area defects, which are easily generated in fully automated welding, fully automated ultrasonic testing (AUT) technology has become the preferred detection method, gaining unanimous recognition from the industry both domestically and internationally.

[0003] With pipeline construction moving towards digitalization and intelligence, the intelligentization of AUT (Automatic Undertake Test) technology has become particularly important. The main steps of AUT testing include: Focusing on rule generation, test block calibration, and weld inspection.

[0004] Test block calibration involves adjusting the focusing scheme of all channels of the AUT to meet the standard requirements, which is the basis for weld inspection.

[0005] Different calibration test blocks are required for different pipe materials, pipe diameters, wall thicknesses, and bevel types. The signals obtained from each target reflector can help identify the boundaries of each zone. The sensitivity of the system will be affected by the position, size, surface quality, and angle of the target reflector.

[0006] The process schemes for test block calibration are divided into fusion zone scheme design, volumetric channel scheme design, and coupling channel scheme design. Currently, test block calibration in AUT inspection of long-distance oil and gas pipelines is still the traditional manual calibration, which requires operators to repeatedly locate the reflector positions in different zones of the test block, adjust the phased array ultrasonic parameters and focusing rules. This is time-consuming, labor-intensive, and easily affected by the operator's experience and skills. Therefore, the research and application of automated adjustment testing process schemes have become the key to improving the accuracy, efficiency, and intelligence of ultrasonic testing. Summary of the Invention

[0007] The first aspect of this disclosure provides an automatic optimization method for a fully automated ultrasonic testing process, comprising the following steps: S1. Import the bevel parameters of the test block to be calibrated and the position information of all zone reflectors; S2. Calculate the initial focusing rule for all partition channels based on the bevel parameters and the preset AUT detection parameters; S3. Control the mechanical scanner to move to the position of the first reflector on the test block and set it as the reference zero point; record the position information in real time through the encoder. S4. Control the mechanical scanner to move sequentially to the area where each reflector is located. By moving the probe and monitoring the reflected wave amplitude, find the position of the highest wave amplitude of each reflector and record this position as the optimal physical position of the probe. S5. Automatically adjust the corresponding ultrasound parameters according to the channel type so that the amplitude of the primary reflector of each channel reaches the predetermined requirements and is located at the center of the time gate; S6. While keeping the detection scheme of this channel unchanged, check its coverage amplitude to adjacent reflectors and adjust the relevant parameters to make the coverage amplitude meet the standard requirements. S7. Automatically set and adjust the parameters for the TOFD channel and the coupling channel respectively; S8. After all channels have been adjusted, control the mechanical scanner to return to the reference zero point to complete the calibration.

[0008] In conjunction with the first aspect, the step S4 of finding the highest amplitude position of each reflector specifically includes: The motor drives the probe to move back and forth, monitoring the amplitude change of the main reflected wave of the reflector. When the amplitude reaches its peak value, the probe position corresponding to the peak signal is recorded as the optimal physical position.

[0009] In conjunction with the first aspect, in step S5, for bandgap channels and volumetric channels using a self-transmitting and self-receiving method, the automatic adjustment of ultrasound parameters includes: S51a. Adjust the transmitter master chip number until the amplitude reaches its maximum and then falls back. Then use the transmitter master chip number corresponding to the maximum amplitude. S52a. Adjust the emission angle until the amplitude reaches its maximum and then falls back, then use the emission angle corresponding to the maximum amplitude. S53a, Adjust the amplitude to 80% of the full screen height and move it to the center of the time gate.

[0010] In conjunction with the first aspect, in step S5, for a bandgap channel using a one-transmit, one-receive method, the automatic adjustment of ultrasound parameters includes: S51b: Adjust the transmitter master chip number until the amplitude reaches its maximum and then falls back, then use the transmitter master chip number corresponding to the maximum amplitude. S52b: Adjust the receiver master chip number until the amplitude reaches its maximum and then falls back, then use the receiver master chip number corresponding to the highest amplitude. S53b: Adjust the transmission angle until the amplitude reaches its maximum and then falls back, then use the transmission angle corresponding to the maximum amplitude; S54b: Adjust the receiving angle until the amplitude reaches its maximum and then falls back, then use the receiving angle corresponding to the maximum amplitude. S55b, adjust the amplitude to 80% of the full screen height and move it to the center of the time gate.

[0011] In conjunction with the first aspect, step S6, which involves adjusting the relevant parameters to ensure the coverage amplitude meets the standard requirements, specifically includes: S61. Move the probe to the position of the adjacent reflector; S62. If the coverage amplitude is higher than 40% or lower than 5%, adjust the transmitting and receiving main chip numbers until the coverage amplitude is between 5% and 40%. S63. If adjusting the chip number cannot meet the requirements, further adjust the transmission and reception angles; S64. After the coverage adjustment is completed, move the probe back to the position of the main reflector, adjust the amplitude of the main reflected wave to 80% and position it at the center of the time gate.

[0012] In conjunction with the first aspect, step S7, which involves automatically setting and adjusting the parameters of the TOFD channel, includes: S71a. Move the probe to the middle position between Trans ID / OD and TOFD ID / OD; S72a. Set the initial data acquisition range so that it can acquire both direct wave and bottom surface reflected wave signals; S73a. Determine the positions of the direct wave and the bottom reflected wave, and finally set the data acquisition range to 0.5-1μs before the direct wave to 0.5-1μs after the bottom reflected wave; S74a. Adjust the through wave amplitude to between 40% and 90% and save the settings.

[0013] In conjunction with the first aspect, step S7, which involves automatically setting and adjusting the parameters of the coupling channel, includes: S71b, Move the probe to the middle position between Trans ID / OD and TOFD ID / OD; S72b: Set the initial data acquisition range to include multiple bottom surface reflected waves; S73b, intercept the second bottom surface reflected wave and set the final data acquisition range according to the standard requirements; S74b, adjust the amplitude to 80%, and save the settings.

[0014] In conjunction with the first aspect, the calibration process is performed sequentially in the following order: upstream root weld, blunt edge, hot weld, fill, volume, capping, coupling, TOFD channel, and then downstream coupling, capping, volume, fill, hot weld, blunt edge, and root weld channel.

[0015] A second aspect of this disclosure provides an electronic device, comprising: One or more processors; A storage unit is used to store one or more programs, which, when executed by one or more processors, enable the one or more processors to implement the automatic optimization method of the fully automated ultrasonic testing process.

[0016] A third aspect of this disclosure provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, enables an automatic optimization method for the fully automated ultrasonic testing process.

[0017] Beneficial Effects: This invention provides an automatic optimization method for a fully automated ultrasonic testing process. By automatically importing the bevel parameters of the test block and the position information of the reflectors, generating an initial focusing rule by computer, controlling a mechanical scanner to precisely locate and automatically find the highest amplitude position of each reflector, and then adaptively adjusting key ultrasonic parameters such as the transmitting / receiving wafers and angles according to the channel type, the main amplitude meets the standard requirements and is positioned at the time gate center. Simultaneously, it intelligently verifies and optimizes the coverage amplitude of adjacent channels and sets specific parameters for the TOFD and coupling channels. Ultimately, it achieves a fully automated, high-precision, and high-efficiency test block calibration process, effectively avoiding the errors and inefficiencies caused by differences in operational experience in traditional manual calibration. This significantly improves the consistency and reliability of the testing, completely eliminates blind spots in the testing, provides complete data support for welding quality assessment, and powerfully promotes the development of fully automated ultrasonic testing technology towards intelligence and digitalization. Attached Figure Description

[0018] Figure 1 This is a flowchart illustrating an automatic optimization method for a fully automated ultrasonic testing process according to an embodiment of the present disclosure. Figure 2 An electronic device according to an embodiment of this disclosure. Detailed Implementation

[0019] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with those disclosed herein.

[0020] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0021] like Figure 1 The diagram shown is a flowchart illustrating an automatic optimization method for a fully automated ultrasonic testing process according to an embodiment of this disclosure, including: S1. Import the bevel parameters of the test block to be calibrated and the position information of all zone reflectors; This step relies on a pre-built digital workpiece model interface. Specifically, operators or upstream process systems will follow standardized data formats (such as XML or JSON configuration files) to provide digital information including detailed geometric dimensions, angles, depths, and other parameters of the bevel, as well as the theoretical coordinate positions of each reflector in the test block design drawings.

[0022] The system automatically reads and verifies the completeness and rationality of this information by calling the data parsing module. Bevel parameters typically include key features such as bevel type, angle, blunt edge dimensions, and the height of each section, while the reflector location information precisely describes the preset locations of artificial defects in different sections such as the root, blunt edge, hot weld, filler area, and capping. This data constitutes the benchmark and input conditions for the subsequent automatic optimization algorithm, ensuring that the entire calibration process is based on an accurate object model.

[0023] S2. Calculate the initial focusing rule for all partition channels based on the bevel parameters and the preset AUT detection parameters; In step S2, the system automatically calculates the initial focusing rule applicable to all zone channels based on the bevel parameters imported in S1 and the pre-set fully automatic ultrasonic testing (AUT) core parameters in the system through the built-in acoustic calculation model.

[0024] The system first processes parameters such as the geometry of the bevel (e.g., angle, depth) and wall thickness, and combines these with preset AUT hardware and physical parameters such as probe model, number of wafers, wedge angle, sound velocity, and detection frequency. The core calculation is based on the physical principles of sound wave propagation (e.g., Snell's law) and phased array delay rules, simulating and calculating the initial theoretical values ​​of key parameters such as the excitation wafer group, receiving wafer group, emission angle, receiving angle, and focusing depth for each detection channel (including root weld, hot weld, fill, volume, TOFD, etc.).

[0025] These calculated initial focusing rules form the baseline for subsequent automatic optimization adjustments. They ensure that the ultrasound beam can be theoretically optimally pointed to and focused on the target reflectors in each zone before the automatic scan begins, laying a solid foundation for subsequent precise fine-tuning. This avoids completely blind searching and greatly improves the efficiency and reliability of the entire optimization process.

[0026] S3. Control the mechanical scanner to move to the position of the first reflector on the test block and set it as the reference zero point; record the position information in real time through the encoder. In step S3, the calculation module first calculates the absolute coordinates of the first reflector on the test block based on the reflector position information imported in S1. Then, the system sends a command to the motor driver controlling the mechanical scanner, driving the scanner to move with the probe array to the calculated target position.

[0027] To achieve precise positioning, the system employs a closed-loop control strategy. A high-precision photoelectric encoder or magnetic encoder monitors the rotation angle of the motor or the linear displacement of the scanner in real time and continuously transmits the position feedback signal back to the central controller. The controller compares the real-time position with the target position and dynamically adjusts the motor speed and direction using control algorithms such as PID control until the scanner stably stops at the theoretical position of the first reflector, establishing this point as the reference zero point (i.e., the origin) of the entire detection coordinate system.

[0028] Subsequently, during the entire calibration process, all movements of the scanner and their relative positions were measured and recorded with this zero point as the reference. The encoder continuously provided high-resolution position feedback, ensuring the consistency and accuracy of the spatiotemporal reference for all probe positioning and subsequent reflector searching operations throughout the process.

[0029] S4. Control the mechanical scanner to move sequentially to the area where each reflector is located. By moving the probe and monitoring the reflected wave amplitude, find the position of the highest wave amplitude of each reflector and record this position as the optimal physical position of the probe. Step S4, which involves finding the position of the highest amplitude of each reflector, specifically includes: The motor drives the probe to move back and forth, monitoring the amplitude change of the main reflected wave of the reflector. When the amplitude reaches its peak value, the probe position corresponding to the peak signal is recorded as the optimal physical position.

[0030] In step S4, the system executes a core automated optimization process, which precisely finds the optimal detection point for each reflector in physical space. This step deeply integrates mechanical control, data acquisition, and real-time signal processing.

[0031] First, based on a pre-stored map of reflector locations, the system controls the mechanical scanner, carrying the probe, to roughly move to the theoretical region where the current target reflector is located. However, due to minor deviations in mechanical assembly, sample processing, and the theoretical calculations themselves, the theoretical location is often not the optimal location to obtain the strongest ultrasonic signal.

[0032] Therefore, the system sends commands to the motor controlling the probe's movement, causing it to reciprocate within a small range before and after the theoretical position of the reflector. Throughout the scanning process, the ultrasonic board continuously excites the probe and acquires the echo signals returned from the test block, while the system's signal processing algorithm monitors and extracts the reflected wave amplitude values ​​within a specific monitoring gate in real time.

[0033] The system continuously compares the real-time amplitude with previously recorded peak amplitude values. When the amplitude value is detected to be continuously rising as the probe moves, it indicates that the probe is approaching the optimal response point of the reflector; when the amplitude value reaches its maximum value and begins to decline, it indicates that the probe has passed the optimal point. At this point, the system immediately records the precise physical coordinates fed back by the encoder when the peak amplitude occurs.

[0034] The location that yields the highest echo signal, found through automatic scanning and feedback confirmation, is determined by the system to be the "optimal physical position" of the reflector relative to the current detection channel. This positional data is precisely stored as the spatial reference for all subsequent parameter fine-tuning (such as wafer and angle adjustments) and the final process design. This process is entirely computer-controlled, eliminating the uncertainties, subjectivity, and fatigue errors inherent in manual searching, ensuring the reproducibility and extremely high accuracy of the detection scheme.

[0035] S5. Automatically adjust the corresponding ultrasound parameters according to the channel type so that the amplitude of the primary reflector of each channel reaches the predetermined requirements and is located at the center of the time gate; In step S5, for bandgap channels and volumetric channels using a self-transmitting and self-receiving method, the automatic adjustment of ultrasound parameters includes: S51a. Adjust the transmitter master chip number until the amplitude reaches its maximum and then falls back. Then use the transmitter master chip number corresponding to the maximum amplitude. S52a. Adjust the emission angle until the amplitude reaches its maximum and then falls back, then use the emission angle corresponding to the maximum amplitude. S53a, Adjust the amplitude to 80% of the full screen height and move it to the center of the time gate.

[0036] In step S5, for a bandgap channel using a one-transmit, one-receive method, the automatic adjustment of ultrasound parameters includes: S51b: Adjust the transmitter master chip number until the amplitude reaches its maximum and then falls back, then use the transmitter master chip number corresponding to the maximum amplitude. S52b: Adjust the receiver master chip number until the amplitude reaches its maximum and then falls back, then use the receiver master chip number corresponding to the highest amplitude. S53b: Adjust the transmission angle until the amplitude reaches its maximum and then falls back, then use the transmission angle corresponding to the maximum amplitude; S54b: Adjust the receiving angle until the amplitude reaches its maximum and then falls back, then use the receiving angle corresponding to the maximum amplitude. S55b, adjust the amplitude to 80% of the full screen height and move it to the center of the time gate.

[0037] In step S5, the system performs deeper optimization and fine-tuning of ultrasound parameters at the determined optimal physical position of the probe. The core of this step is that even with the optimal probe position, the excitation and reception characteristics of the ultrasound beam must precisely match the geometric features of the reflector to capture the strongest echo signal. The system intelligently calls different optimization algorithms based on the currently active channel type.

[0038] For self-transmitting and self-receiving channels (such as volumetric channels), optimization is a gradual, unidirectional adjustment process. The system first keeps other parameters constant and automatically iterates through and switches between different transmitting master chip numbers (S51a). Each time it switches, it acquires an echo signal and records its amplitude. By comparing amplitude change trends, the system accurately identifies the transmitting chip that maximizes the amplitude. After locking onto the optimal transmitting chip, the system then fine-tunes the transmission angle (S52a), again finding the optimal angle for generating the highest echo through iterative trials and feedback comparisons. Finally (S53a), the system adjusts the instrument gain, standardizing the optimized highest amplitude to a standard quantization level of 80% of the full-screen height, and simultaneously adjusts the starting point and width of the time gate to ensure the echo signal is precisely framed at the center of the time gate. All these adjustments are performed automatically by the algorithm, ensuring consistency and repeatability of the results.

[0039] For more complex transmit-receive channels (such as certain stripline channels), optimization is a bidirectional, collaborative adjustment process. Because it involves independent transmitting and receiving wafers and angles, the system needs to optimize both the transmitting and receiving ends simultaneously. This process, based on self-transmitting and self-receiving adjustment, adds independent optimization loops for the receiving master wafer number (S52b) and the receiving angle (S54b). The system uses a similar iterative search method to find the optimal combination of transmitting wafer, receiving wafer, transmitting angle, and receiving angle, ensuring that both the emitted ultrasonic energy and the received echo signal sensitivity reach peak levels. Finally (S55b), amplitude normalization and signal gating are performed.

[0040] Through step S5, the system achieves a deeper understanding from "physical location identification" to "acoustic parameter optimization," ensuring that the detection sensitivity of each channel is calibrated to the optimal state, laying a precise benchmark for subsequent coverage verification.

[0041] S6. While keeping the detection scheme of this channel unchanged, check its coverage amplitude to adjacent reflectors and adjust the relevant parameters to make the coverage amplitude meet the standard requirements. Step S6, adjusting the relevant parameters to ensure the coverage amplitude meets the standard requirements, specifically includes: S61. Move the probe to the position of the adjacent reflector; S62. If the coverage amplitude is higher than 40% or lower than 5%, adjust the transmitting and receiving main chip numbers until the coverage amplitude is between 5% and 40%. S63. If adjusting the chip number cannot meet the requirements, further adjust the transmission and reception angles; S64. After the coverage adjustment is completed, move the probe back to the position of the main reflector, adjust the amplitude of the main reflected wave to 80% and position it at the center of the time gate.

[0042] In step S6, the system performs a crucial operation—channel coverage verification and optimization. The purpose of this operation is to ensure that each detection channel can not only effectively detect the primary reflector it is responsible for, but also provide effective detection coverage for adjacent areas, thereby eliminating detection blind spots and ensuring the continuity of weld inspection.

[0043] This step begins with the system controlling the mechanical scanner to move the probe from the current optimal position of the primary reflector to the position of the adjacent reflector (S61). At this time, the system keeps all the ultrasound parameters of the current channel (i.e., the wafer and angle scheme optimized in step S5) completely unchanged, and acquires the echo signal at this new position, measuring its amplitude value, which is the "coverage amplitude".

[0044] The system then automatically compares the coverage amplitude value with preset standard requirements (typically 5% to 40% of the full screen height) (S62). If the amplitude is outside this range (i.e., above 40% or below 5%), the system initiates an automatic adjustment cycle. It first attempts to adjust the transmitting and receiving master chip numbers, fine-tuning the focusing characteristics and width of the sound beam by changing the active chip group, thereby adjusting the coverage amplitude to the acceptable range.

[0045] If the goal cannot be achieved by simply adjusting the chip number (S63), it indicates that more precise beam steering control is needed. The system will then automatically fine-tune the transmission and reception angles to change the projection direction of the beam so that it can better cover adjacent reflectors.

[0046] After coverage adjustment is completed (S64), the system controls the scanner to move the probe back to its original position on the primary reflector. Since the parameters adjusted to optimize coverage may slightly affect the primary reflector signal, the system performs a final confirmation and fine-tuning to ensure the amplitude of the primary reflected wave remains stable at 80% and is centered at the time gate. This process ensures that while expanding channel coverage, the accuracy of the primary reflector is not sacrificed, achieving the optimal balance between point and area detection effects.

[0047] S7. Automatically set and adjust the parameters for the TOFD channel and the coupling channel respectively; Step S7 involves automatically setting and adjusting the parameters of the TOFD channel, including: S71a. Move the probe to the middle position between Trans ID / OD and TOFD ID / OD; S72a. Set the initial data acquisition range so that it can acquire both direct wave and bottom surface reflected wave signals; S73a. Determine the positions of the direct wave and the bottom reflected wave, and finally set the data acquisition range to 0.5-1μs before the direct wave to 0.5-1μs after the bottom reflected wave; S74a. Adjust the through wave amplitude to between 40% and 90% and save the settings.

[0048] Step S7, which involves automatically setting and adjusting the parameters of the coupling channel, includes: S71b, Move the probe to the middle position between Trans ID / OD and TOFD ID / OD; S72b: Set the initial data acquisition range to include multiple bottom surface reflected waves; S73b, intercept the second bottom surface reflected wave and set the final data acquisition range according to the standard requirements; S74b, adjust the amplitude to 80%, and save the settings.

[0049] In step S7, the system performs a proprietary automatic parameter setting procedure for the special TOFD (Time Difference of Diffraction) channel and coupling monitoring channel. The calibration objectives of these two channels differ from those of conventional fusion zone or volumetric channels. They do not pursue the highest amplitude of a single reflector, but rather need to ensure that specific reference signals (such as through waves or multiple bottom reflections) are clearly and completely acquired and standardized for use in subsequent defect identification and coupling status monitoring during inspection.

[0050] For the TOFD channel setup (S71a-S74a), the system first moves the pair of transmitting and receiving probes to the predetermined midpoint between Trans ID / OD and TOFD ID / OD (S71a). Then, the system sets a relatively wide initial data acquisition time range (S72a) to ensure the capture of critical reference signals—the through wave directly from the transmitting probe to the receiving probe and the bottom-reflected wave reflected from the inner (or outer) wall of the test block. Next, the system automatically identifies and locates the precise positions of these two characteristic waves on the time axis using an algorithm (S73a). Following standard procedures, the system uses these two signals as a reference to ultimately set the data acquisition time gate from 0.5-1 μs before the arrival of the through wave signal to 0.5-1 μs after the end of the bottom-reflected wave signal, ensuring complete recording of all possible diffraction signals. Finally, the system adjusts the gain, normalizes the through wave amplitude to an optimal level between 40% and 90%, and saves all settings (S74a).

[0051] For the coupling channel setup (S71b-S74b), the system first moves the probe to the designated intermediate position (S71b). The purpose of this channel is to monitor the stability of ultrasonic energy transmission in the coupling medium. The system sets a sufficiently long initial acquisition range to include multiple consecutive bottom-side reflected waves (multiple echoes) (S72b). Then, according to standard specifications, the system intercepts the second bottom-side reflected wave as the evaluation benchmark (S73b). This is because earlier echoes may be affected by the initial pulse, while later echo signals are too weak; the second echo is usually the most stable and reliable evaluation indicator. The system sets the final data acquisition gate accordingly. Finally, the amplitude of the second bottom-side echo is normalized to 80% through gain adjustment and the settings are saved (S74b).

[0052] Through step S7, the system completed the fully automated configuration of the two special but crucial detection channels, ensuring the standardization of data acquisition and the consistency of evaluation benchmarks in subsequent actual testing.

[0053] S8. After all channels have been adjusted, control the mechanical scanner to return to the reference zero point to complete the calibration.

[0054] In step S8, the system performs the final closing action of the entire automatic optimization process, marking the completion of the calibration work.

[0055] Once the parameters of all channels—including upstream and downstream fusion zone channels, volume channels, TOFD channels, and coupling channels—have been adjusted and optimized according to standard requirements, the system will generate a final command. This command controls the mechanical scanner, carrying the probe, to smoothly and automatically move back from its last position to the reference zero point position set in step S3.

[0056] Electronic device 200 can be a desktop computer, laptop, handheld computer, cloud server, or other electronic device. Electronic device 200 may include, but is not limited to, processor 201 and memory 202. Those skilled in the art will understand that... Figure 2 This is merely an example of electronic device 200 and does not constitute a limitation on electronic device 200. It may include more or fewer components than shown, or combine certain components, or different components. For example, electronic device may also include input / output devices, network access devices, buses, etc.

[0057] The processor 201 can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor can be a microprocessor or any conventional processor.

[0058] The memory 202 can be an internal storage unit of the electronic device 200, such as a hard disk or RAM of the electronic device 200. The memory 202 can also be an external storage device of the electronic device 200, such as a plug-in hard disk, Smart Media Card (SMC), Secure Digital (SD) card, or Flash Card equipped on the electronic device 200. Furthermore, the memory 202 can include both internal and external storage units of the electronic device 200. The memory 202 is used to store the computer program 203 and other programs and data required by the electronic device. The memory 202 can also be used to temporarily store data that has been output or will be output.

[0059] In the embodiments provided in this disclosure, it should be understood that the disclosed devices / electronic devices and methods can be implemented in other ways. For example, the device / electronic device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. Multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0060] If an integrated module / unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program may include computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. A computer-readable medium may include: any entity or device capable of carrying computer program code, recording media, USB flash drives, portable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the content included in a computer-readable medium may be appropriately added to or subtracted according to the requirements of legislation and patent practice in a jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media may not include electrical carrier signals and telecommunication signals.

[0061] The above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit it. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure, and should all be included within the protection scope of this disclosure.

Claims

1. An automatic optimization method for a fully automated ultrasonic testing process, characterized in that, Includes the following steps: S1. Import the bevel parameters of the test block to be calibrated and the position information of all zone reflectors; S2. Calculate the initial focusing rule for all partition channels based on the bevel parameters and the preset AUT detection parameters; S3. Control the mechanical scanner to move to the position of the first reflector on the test block and set it as the reference zero point; record the position information in real time through the encoder. S4. Control the mechanical scanner to move sequentially to the area where each reflector is located. By moving the probe and monitoring the reflected wave amplitude, find the position of the highest wave amplitude of each reflector and record this position as the optimal physical position of the probe. S5. Automatically adjust the corresponding ultrasound parameters according to the channel type so that the amplitude of the primary reflector of each channel reaches the predetermined requirements and is located at the center of the time gate; S6. While keeping the detection scheme of this channel unchanged, check its coverage amplitude to adjacent reflectors and adjust the relevant parameters to make the coverage amplitude meet the standard requirements. S7. Automatically set and adjust the parameters for the TOFD channel and the coupling channel respectively; S8. After all channels have been adjusted, control the mechanical scanner to return to the reference zero point to complete the calibration.

2. The automatic optimization method for the fully automated ultrasonic testing process according to claim 1, characterized in that, Step S4, which involves finding the position of the highest amplitude of each reflector, specifically includes: The motor drives the probe to move back and forth, monitoring the amplitude change of the main reflected wave of the reflector. When the amplitude reaches its peak value, the probe position corresponding to the peak signal is recorded as the optimal physical position.

3. The automatic optimization method for the fully automated ultrasonic testing process according to claim 1, characterized in that, In step S5, for the bandgap channel and volumetric channel using the self-transmitting and self-receiving method, the automatic adjustment of ultrasound parameters includes: S51a. Adjust the transmitter master chip number until the amplitude reaches its maximum and then falls back. Then use the transmitter master chip number corresponding to the maximum amplitude. S52a. Adjust the emission angle until the amplitude reaches its maximum and then falls back, then use the emission angle corresponding to the maximum amplitude. S53a, Adjust the amplitude to 80% of the full screen height and move it to the center of the time gate.

4. The automatic optimization method for the fully automated ultrasonic testing process according to claim 1, characterized in that, In step S5, for the bandgap channel using a one-transmit, one-receive method, the automatic adjustment of ultrasound parameters includes: S51b: Adjust the transmitter master chip number until the amplitude reaches its maximum and then falls back, then use the transmitter master chip number corresponding to the maximum amplitude. S52b: Adjust the receiver master chip number until the amplitude reaches its maximum and then falls back, then use the receiver master chip number corresponding to the highest amplitude. S53b: Adjust the transmission angle until the amplitude reaches its maximum and then falls back, then use the transmission angle corresponding to the maximum amplitude; S54b: Adjust the receiving angle until the amplitude reaches its maximum and then falls back, then use the receiving angle corresponding to the maximum amplitude. S55b, adjust the amplitude to 80% of the full screen height and move it to the center of the time gate.

5. The automatic optimization method for the fully automated ultrasonic testing process according to claim 1, characterized in that, Step S6, adjusting the relevant parameters to ensure the coverage amplitude meets the standard requirements, specifically includes: S61. Move the probe to the position of the adjacent reflector; S62. If the coverage amplitude is higher than 40% or lower than 5%, adjust the transmitting and receiving main chip numbers until the coverage amplitude is between 5% and 40%. S63. If adjusting the chip number cannot meet the requirements, further adjust the transmission and reception angles; S64. After the coverage adjustment is completed, move the probe back to the position of the main reflector, adjust the amplitude of the main reflected wave to 80% and position it at the center of the time gate.

6. The automatic optimization method for the fully automated ultrasonic testing process according to claim 1, characterized in that, Step S7 involves automatically setting and adjusting the parameters of the TOFD channel, including: S71a. Move the probe to the middle position between Trans ID / OD and TOFD ID / OD; S72a. Set the initial data acquisition range so that it can acquire both direct wave and bottom surface reflected wave signals; S73a. Determine the positions of the direct wave and the bottom reflected wave, and finally set the data acquisition range to 0.5-1μs before the direct wave to 0.5-1μs after the bottom reflected wave; S74a. Adjust the through wave amplitude to between 40% and 90% and save the settings.

7. The automatic optimization method for the fully automated ultrasonic testing process according to claim 1, characterized in that, Step S7, which involves automatically setting and adjusting the parameters of the coupling channel, includes: S71b, Move the probe to the middle position between Trans ID / OD and TOFD ID / OD; S72b: Set the initial data acquisition range to include multiple bottom surface reflected waves; S73b, intercept the second bottom surface reflected wave and set the final data acquisition range according to the standard requirements; S74b, adjust the amplitude to 80%, and save the settings.

8. The automatic optimization method for a fully automated ultrasonic testing process according to any one of claims 1 to 7, characterized in that, The calibration process is performed sequentially in the following order: upstream root weld, blunt edge, hot weld, filler, volume, capping, coupling, TOFD channel, and then downstream coupling, capping, volume, filler, hot weld, blunt edge, and root weld channel.

9. An electronic device, characterized in that, include: One or more processors; A storage unit is used to store one or more programs, which, when executed by the one or more processors, enable the one or more processors to implement the automatic optimization method of the fully automated ultrasonic testing process according to any one of claims 1 to 8.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it can realize the automatic optimization method of the fully automatic ultrasonic testing process according to any one of claims 1 to 8.

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