Method for improving ink color consistency of Mini LED display
CN121358079APending Publication Date: 2026-01-16山西星心半导体科技有限公司
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Patent Information
- Application Number
- CN202511495098.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-20
- Publication Date
- 2026-01-16
AI Technical Summary
Technical Problem
During the PCB board packaging process of Mini LED displays, color differences in solder resist ink can lead to inconsistent ink color, affecting the contrast and appearance of the display.
Method used
A black molding epoxy resin is applied to the solder resist ink layer of the PCB board, and a transparent epoxy resin is filled on the surface of the LED chip. Finally, a matte black adhesive film is applied, and a stable adhesive layer structure is formed through 3D stencil printing and molding injection processes.
Benefits of technology
It improves the black color consistency and contrast of the Mini LED display, reduces reflected brightness, enhances the sense of layering and visual experience of the picture, and provides higher blackness and color uniformity.
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Smart Images
Figure CN121358079A_ABST
Abstract
The invention relates to the technical field of Mini LED packaging, in particular to a method for improving Mini LED display ink color consistency, which comprises the following steps: providing a PCB (Printed Circuit Board) on which lamp surface and drive welding is completed, and arranging a solder resist ink layer and an LED chip on the PCB; comprising the following steps that S1, the surface of a solder resist ink layer is covered with a layer of black ink color forming epoxy glue to be cured; s2, the surface of the LED chip is filled with transparent epoxy glue to be cured; and S3, the surface films of the black ink color forming epoxy glue and the transparent epoxy glue are pressed with matt black glue films, and module packaging is completed after curing. According to the invention, a layer of black ink color forming epoxy glue is covered on the solder resist ink layer of the PCB, and the black ink color forming epoxy glue completely covers the solder resist ink layer of the PCB, so that the surfaces of the same batch or different PCBs present a uniform black ink color optical effect, the blackening effect and color consistency of the surfaces of the PCBs are improved, and the ink color background and the ink color consistency required by the MiniLED module are provided.
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