Infrared composite detection information processing system and method

Abstract

The invention belongs to the technical field of multi-detector composite detection, and more particularly relates to an infrared composite detection information processing system and method, the infrared composite detection information processing system is constructed through a DSP processor, an SOC processor, an infrared signal acquisition circuit and a laser signal acquisition circuit, the DSP processor and an FPGA circuit do not need to be additionally added, and the system is simple in structure and convenient to operate. Therefore, the accuracy of the detection result can be guaranteed, and the hardware cost and the operation power consumption of the system can be reduced; a laser signal acquisition circuit is constructed through a gain control circuit, a high-speed ADC acquisition circuit and a buffer amplification circuit, the gain control circuit and the buffer amplification circuit can be effectively utilized to filter interference noise of a target pulse signal of a laser detector, and high-speed synchronous acquisition and digital conversion of the target pulse signal can be realized in cooperation with the high-speed ADC acquisition circuit. Therefore, the SOC processor can obtain the laser detection result more accurately.

Description

Technical Field

[0001] This application belongs to the field of multi-detector composite detection technology, and more specifically, relates to an infrared composite detection information processing system and method. Background Technology

[0002] With the widespread application of smart devices, target detection technology has begun to be widely used in scenarios such as border patrol, low-altitude security, industrial monitoring, and emergency rescue. These environments generally present problems such as variable weather (rain, fog, sandstorms, day and night cycles) and diverse interference (electromagnetic radiation, target obstruction, and human camouflage). For example, border patrols need to cope with signal attenuation caused by rain and fog, industrial monitoring needs to resist electromagnetic interference from equipment, and emergency rescue needs to overcome the limitations of smoke obstruction and high-temperature environments. Complex environments place stringent requirements on the all-weather, anti-interference, and high-precision capabilities of detection systems.

[0003] In complex environments, single laser detection has the advantages of high accuracy and accurate ranging, but it is weak against weather interference. Rain, fog and dust will significantly shorten the detection distance and it is easily blocked to form blind spots, making it impossible to capture the target outline. Single infrared detection is suitable for nighttime and low-light environments and can identify camouflaged targets, but it has the problems of low accuracy and great influence from ambient temperature. In high-temperature environments, the difference between the target and the background thermal radiation is reduced, which can easily lead to missed detection. Strong light or electromagnetic interference can also cause image distortion.

[0004] Most existing infrared composite detection systems employ complex systems combining multiple DSPs (Digital Signal Processors) and multiple processors, resulting in slow detection speeds, high hardware costs, and high computing power consumption. Summary of the Invention

[0005] To address the aforementioned deficiencies in existing technologies, this application provides an infrared composite detection information processing system and method. The system aims to rapidly and accurately acquire composite detection results by performing high-speed acquisition and feature extraction of detection signals from both the detector and the laser detector using a low-cost DSP+SOC (System on Chip) framework.

[0006] In a first aspect, this application provides an infrared composite detection information processing system, comprising: The system includes a DSP processor, a SOC processor, an infrared signal acquisition circuit, and a laser signal acquisition circuit. The SOC processor includes a PL unit and a PS unit. The PS unit is connected to the PL unit and the DSP processor, respectively. The PL unit is connected to the infrared signal acquisition circuit and the laser signal acquisition circuit, respectively. The laser signal acquisition circuit is used to acquire the target pulse signal of the laser detector, and to perform high-speed synchronous acquisition and digital conversion of the target pulse signal to obtain the first digital signal; The infrared signal acquisition circuit is used to acquire the second digital signal from the infrared detector and send the second digital signal to the PL unit in a preset protocol format. The PL unit is used to transmit the first digital signal and the second digital signal to the PS unit. The PS unit is used to cooperate with the DSP processor to perform target angle calculation processing on the first digital signal and the second digital signal, and to fuse the target angle calculation results of the first digital signal and the second digital signal to obtain the composite detection result.

[0007] The infrared composite detection information processing system provided in this application only requires one DSP processor and one SOC processor to accurately obtain the detection results of the infrared signal acquisition circuit and the laser signal acquisition circuit, and can effectively fuse the detection results to facilitate the rapid transmission of the detection results to other devices.

[0008] Furthermore, it includes a communication circuit, which is connected to the PS unit signal and is used to send the composite detection results generated by the PS unit to the host computer.

[0009] Furthermore, the laser signal acquisition circuit includes a gain control circuit, a high-speed ADC acquisition circuit, and a buffer amplifier circuit. The gain control circuit and the high-speed ADC acquisition circuit are respectively connected to the PL unit, and the buffer amplifier circuit is connected to the high-speed ADC acquisition circuit.

[0010] Furthermore, the gain control circuit is used to adjust the amplification factor of the target pulse signal of the laser detector under the control of the PL unit, and the high-speed ADC acquisition circuit is used to perform high-speed synchronous acquisition and digital conversion of the target pulse signal.

[0011] Furthermore, the buffer amplifier circuit includes a low-noise operational amplifier and a passive filter to filter out interference noise from the target pulse signal.

[0012] Furthermore, the gain control circuit is an AD603AR type variable gain amplifier.

[0013] Furthermore, the high-speed ADC acquisition circuit is the AD9253 series high-speed analog-to-digital converter.

[0014] Furthermore, the preset protocol standard format for the infrared signal acquisition circuit is Camera Link.

[0015] Secondly, this application also provides an infrared composite detection information processing method, applied to the infrared composite detection information processing system of any one of the first aspects, comprising: The target pulse signal of the laser detector is acquired by the laser signal acquisition circuit, and the target pulse signal is subjected to interference and noise filtering, high-speed synchronous acquisition and digital conversion to obtain the first digital signal. The PL unit decodes and identifies the first digital signal and extracts peak features according to the preset coding rules to obtain the peak data in the gate corresponding to the target pulse signal. Based on the PS unit, the peak data in the gate is optimized by anti-interference algorithm and the target angle is calculated to obtain the laser detection result. The second digital signal from the infrared detector is acquired by the infrared signal acquisition circuit, and then filtered by the PS unit. The filtered second digital signal is transmitted to the DSP processor, and the target angle is calculated based on the target recognition algorithm stored in the DSP processor to obtain the infrared detection result. The laser detection results and infrared detection results are fused by the PS unit to obtain composite detection results.

[0016] Thirdly, this application also provides an electronic device, comprising: at least one memory for storing a program; and at least one processor for executing the program stored in the memory, wherein when the program stored in the memory is executed, the processor is configured to execute any of the methods of the second aspect.

[0017] In summary, the technical solutions conceived by this invention have the following beneficial effects compared with the prior art: This application constructs an infrared composite detection information processing system using a DSP processor, a SOC processor, an infrared signal acquisition circuit, and a laser signal acquisition circuit. It achieves composite detection results without requiring additional DSP processors and FPGA circuits, thus reducing system hardware costs and power consumption while ensuring the accuracy of the detection results. The laser signal acquisition circuit is constructed using a gain control circuit, a high-speed ADC acquisition circuit, and a buffer amplification circuit. The gain control circuit and buffer amplification circuit effectively filter out interference noise from the target pulse signal of the laser detector, and the high-speed ADC acquisition circuit enables high-speed synchronous acquisition and digital conversion of the target pulse signal, facilitating more accurate acquisition of laser detection results by the SOC processor. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this application or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of the infrared composite detection information processing system provided in the embodiments of this application.

[0020] Figure 2 This is a schematic diagram of the main structure of the infrared composite detection information processing system provided in the embodiments of this application.

[0021] Figure 3 This is a flowchart illustrating the infrared composite detection information processing method provided in the embodiments of this application.

[0022] Figure 4 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0023] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0024] In the following description, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The following description provides multiple embodiments of this application, which can be substituted or combined with each other. Therefore, this application can also be considered to include all possible combinations of the same and / or different embodiments described. Thus, if one embodiment includes features A, B, and C, and another embodiment includes features B and D, then this application should also be considered to include embodiments containing one or more other possible combinations of A, B, C, and D, even if such embodiments are not explicitly described in the following text.

[0025] The following description provides examples and does not limit the scope, applicability, or examples set forth in the claims. Changes may be made to the function and arrangement of the described elements without departing from the scope of this application. Various processes or components may be appropriately omitted, substituted, or added to the examples. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Furthermore, features described with respect to some examples may be combined into other examples.

[0026] like Figure 1 and Figure 2 As shown in the embodiment of this application, an infrared composite detection information processing system includes: The system includes a DSP processor, a SOC processor, an infrared signal acquisition circuit, and a laser signal acquisition circuit. The SOC processor includes a PL unit and a PS unit. The PS unit is connected to the PL unit and the DSP processor, respectively. The PL unit is connected to the infrared signal acquisition circuit and the laser signal acquisition circuit, respectively. The laser signal acquisition circuit is used to acquire the target pulse signal of the laser detector, and to perform high-speed synchronous acquisition and digital conversion of the target pulse signal to obtain the first digital signal; The infrared signal acquisition circuit is used to acquire the second digital signal from the infrared detector and send the second digital signal to the PL unit in a preset protocol format. The PL unit transmits the first and second digital signals to the PS unit. The PS unit, in conjunction with the DSP processor, performs target angle calculations on the first and second digital signals and fuses the calculated results to obtain a composite detection result. Furthermore, since the infrared signal acquisition circuit primarily acquires infrared image information, the second digital signal will have a large data volume. Given that the core advantages of the Camera Link protocol are high-speed transmission, stable anti-interference, and strong hardware compatibility, Camera Link is chosen as the default protocol standard format.

[0027] In this embodiment, the execution entity of the method and system is a System-on-a-Chip (SOC) processor. The PS (Processing System) unit of the SOC is a quad-core high-performance ARM processor with a single-core operating frequency of 1.0 GHz, and the PL (Programmable Logic) unit is a K7 series FPGA logic control circuit, which has strong anti-electromagnetic interference capabilities and low-latency parallel computing capabilities. One end of the PS unit is also connected to a communication circuit, which can then send the composite detection results generated by the PS unit to the host computer.

[0028] In one embodiment, the laser signal acquisition circuit includes a gain control circuit, a high-speed ADC acquisition circuit, and a buffer amplifier circuit. The gain control circuit and the high-speed ADC acquisition circuit are respectively connected to the PL unit, and the buffer amplifier circuit is connected to the high-speed ADC acquisition circuit.

[0029] In the embodiments of this application, such as Figure 2 As shown, the gain control circuit is connected to the PL unit and the laser detector signal, and can adjust the amplification factor of the target pulse signal of the laser detector under the control of the PL unit. Since the target pulse signal acquired by the laser detector in a complex electromagnetic environment is a four-channel narrow pulse signal, the peak value of the effective part of the signal may be interfered with by environmental noise. Therefore, a gain control circuit is needed to amplify the target pulse signal. In this application, the gain control circuit can be an AD603AR variable gain amplifier, which has the advantages of simple structure and strong anti-interference capability, and can amplify weak signals and suppress strong signals in the target pulse signal.

[0030] The buffer amplifier circuit includes a low-noise operational amplifier and a passive filter, which are used to filter out interference noise in the target pulse signal. After being processed by the gain control circuit and the buffer amplifier circuit, the effective information in the target pulse signal can be effectively retained and amplified.

[0031] The high-speed ADC acquisition circuit is used to perform high-speed synchronous acquisition and digital conversion of target pulse signals. The high-speed ADC acquisition circuit is the AD9253 series high-speed analog-to-digital converter, which has the advantages of four-channel high-density integration, 14-bit high precision, 125MSPS high-speed sampling, low power consumption and fully differential anti-interference.

[0032] like Figure 3 As shown in the embodiment of this application, an infrared composite detection information processing method includes: S1. The target pulse signal of the laser detector is acquired through the laser signal acquisition circuit, and the target pulse signal is subjected to interference noise filtering, high-speed synchronous acquisition and digital conversion to obtain the first digital signal. S2. The first digital signal is decoded and identified and peak feature extracted by the PL unit according to the preset coding rules to obtain the peak data in the gate corresponding to the target pulse signal. Based on the PS unit, the peak data in the gate is optimized by anti-interference algorithm and the target angle is calculated to obtain the laser detection result. S3. The second digital signal from the infrared detector is acquired through the infrared signal acquisition circuit, and the second digital signal is filtered by the PS unit. S4. The filtered second digital signal is transmitted to the DSP processor, and the target angle is calculated based on the target recognition algorithm stored in the DSP processor to obtain the infrared detection result. S5. The laser detection results and infrared detection results are fused by the PS unit to obtain composite detection results.

[0033] In the embodiments of this application, the target angle calculation process is to deduce the physical angular coordinates of the target relative to the optical axis of the detection device by using a preset geometric model and algorithm. This is a conventional method for obtaining detection results based on detector data.

[0034] The target pulse signal output by the laser detector is analog-conditioned and then rapidly acquired and digitized by an FPGA + high-speed ADC acquisition circuit to obtain the first digital signal. Subsequently, the PL unit decodes and identifies the first digital signal according to a pre-set encoding rule, extracts the peak value within the gate at preset time points, and finally transmits the peak value data within the gate to the ARM processor for anti-interference algorithm processing and target angle calculation to obtain the laser detection result.

[0035] The image information output by the infrared detector is sent to the PL unit of the SOC in the form of a second digital signal according to the Camera Link standard protocol format. The PS unit then completes the image acquisition and filtering process, and the signal is transmitted to the DSP processor for image target recognition algorithm processing to complete the target angle calculation. The calculation result is sent back to the PS unit. The PS unit fuses the laser detection result and the infrared detection result, communicates with the host computer, and outputs the detection result.

[0036] like Figure 4 As shown, Figure 4 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device may include: a processor 401, a communications interface 402, a memory 403, and a communication bus 404. The processor 401, communications interface 402, and memory 403 communicate with each other via the communication bus 404. The processor 401 can call software instructions in the memory 403 to execute the methods described in the above embodiments.

[0037] Furthermore, the logical instructions in the aforementioned memory 403 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application.

[0038] Based on the methods in the above embodiments, this application provides a computer-readable storage medium storing a computer program that, when run on a processor, causes the processor to execute the methods in the above embodiments.

[0039] Based on the methods in the above embodiments, this application provides a computer program product that, when run on a processor, causes the processor to execute the methods in the above embodiments.

[0040] It is understood that the processor in the embodiments of this application can be a CPU (Central Processing Unit), or other general-purpose processors, DSPs (Digital Signal Processors), ASICs (Application Specific Integrated Circuits), FPGAs (Field Programmable Gate Arrays), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. A general-purpose processor can be a microprocessor or any conventional processor.

[0041] The method steps in this application embodiment can be implemented in hardware or by a processor executing software instructions. The software instructions can consist of corresponding software modules, which can be stored in random access memory (RAM), flash memory, ROM (Read-only Memory), PROM (Programmable ROM), EPROM (Erasable PROM), EEPROM (Electrically Erasable EPROM), registers, hard disks, portable hard disks, CD-ROMs, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor, enabling the processor to read information from and write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and the storage medium can reside in an ASIC.

[0042] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product. A computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the flow or function according to the embodiments of this application is generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in or transmitted through a computer-readable storage medium. The computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line DSL) or wireless (e.g., infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., SSD (Solid State Disk)).

[0043] It is understood that the various numerical designations used in the embodiments of this application are merely for the convenience of description and are not intended to limit the scope of the embodiments of this application.

[0044] Those skilled in the art will readily understand that the above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. An infrared complex detection information processing system, characterized by comprising: The infrared composite detection information processing system comprises a DSP processor, a SOC processor, an infrared signal acquisition circuit and a laser signal acquisition circuit; the SOC processor comprises a PL unit and a PS unit, the PS unit is in signal connection with the PL unit and the DSP processor respectively, and the PL unit is in signal connection with the infrared signal acquisition circuit and the laser signal acquisition circuit respectively. The laser signal acquisition circuit is used for acquiring a target pulse signal of a laser detector, and performing high-speed synchronous acquisition and digital conversion on the target pulse signal to obtain a first digital signal. The infrared signal acquisition circuit is used for acquiring a second digital signal of an infrared detector, and sending the second digital signal to the PL unit in a preset protocol format. The PL unit is used for transmitting the first digital signal and the second digital signal to the PS unit, and the PS unit is used for cooperating with the DSP processor to perform target angle solving processing on the first digital signal and the second digital signal, and fusing target angle solving results of the first digital signal and the second digital signal to obtain a composite detection result. The communication circuit is in signal connection with the PS unit, and is used for sending the composite detection result generated by the PS unit to an upper computer.

2. The infrared compound detection information processing system according to claim 1, characterized in that, The laser signal acquisition circuit comprises a gain control circuit, a high-speed ADC acquisition circuit and a buffer amplification circuit, the gain control circuit and the high-speed ADC acquisition circuit are connected with the PL unit respectively, and the buffer amplification circuit is connected with the high-speed ADC acquisition circuit.

3. The infrared compound detection information processing system of claim 1, wherein, The gain control circuit is used for adjusting an amplification multiple of the target pulse signal of the laser detector under the control of the PL unit, and the high-speed ADC acquisition circuit is used for performing high-speed synchronous acquisition and digital conversion on the target pulse signal.

4. The infrared complex probe information processing system according to claim 3, wherein The buffer amplification circuit comprises a low-noise operational amplifier and a passive filter, and is used for filtering out interference noise of the target pulse signal.

5. The infrared complex probe information processing system according to claim 3, wherein The gain control circuit is an AD603AR type variable gain amplifier.

6. The infrared complex probe information processing system according to claim 3, wherein The high-speed ADC acquisition circuit is an AD9253 series high-speed analog-to-digital converter.

7. The infrared multiplexed detection information processing system of claim 3, wherein, The preset protocol standard format corresponding to the infrared signal acquisition circuit is Camera Link.

8. The infrared multiplexed detection information processing system of claim 3, wherein, The infrared composite detection information processing system comprises:

9. An infrared complex detection information processing method, characterized by, acquiring a target pulse signal of a laser detector through a laser signal acquisition circuit, filtering out interference noise, performing high-speed synchronous acquisition and digital conversion on the target pulse signal to obtain a first digital signal; performing decoding recognition and peak feature extraction processing on the first digital signal according to a preset coding rule through a PL unit to obtain in-gate peak value data corresponding to the target pulse signal, and performing anti-interference algorithm optimization and target angle solving processing on the in-gate peak value data based on a PS unit to obtain a laser detection result; acquiring a second digital signal of an infrared detector through an infrared signal acquisition circuit, and performing filtering processing on the second digital signal through the PS unit; ​ The second digital signal after filtering is transmitted to a DSP processor, and a target angle resolving process is performed on the second digital signal based on a target recognition algorithm stored in the DSP processor, to obtain an infrared detection result; The laser detection result and the infrared detection result are fused by a PS unit to obtain a composite detection result.

10. An electronic device, comprising: The method comprises the steps of: at least one memory for storing a computer program; at least one processor for executing the program stored in the memory, and when the program stored in the memory is executed, the processor is used for executing the method as claimed in claim 9.

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