Audio equipment operation monitoring equipment and use method thereof

Abstract

The invention discloses audio equipment operation monitoring equipment and a use method thereof, and the equipment comprises a housing, a monitoring assembly used for monitoring audio equipment, and a supporting assembly used for supporting the housing. The monitoring assembly comprises a signal processing module, a multi-channel signal acquisition module, an analog-to-digital conversion module, a synchronization module, a storage module, a power supply module, an alarm module, a communication module and a touch control chip. The multi-channel signal acquisition module is composed of an acquisition chip, an amplifier and a filter. Through cooperation of the multichannel signal acquisition module, the high-precision ADC chip and the self-adaptive impedance matching circuit, synchronous high-precision acquisition of multichannel audio signals is realized, the accuracy and stability of signal acquisition are improved, the signal processing module adopts a dual-core DSP + FPGA architecture, a real-time Fourier transform engine is built in, and the real-time Fourier transform engine is built in the signal processing module. Complex audio signals can be rapidly processed, the analysis requirement of high real-time performance is met, and the problems that a traditional audio analyzer is complex in operation and single in function are effectively solved.

Description

Technical Field

[0001] This invention relates to the technical field of audio equipment operation monitoring devices, specifically to an audio equipment operation monitoring device and its usage method. Background Technology

[0002] Audio equipment is a general term for audio input and output devices, encompassing many product types. Generally, it can be categorized as follows: power amplifiers, speakers, multimedia control consoles, digital mixing consoles, audio sampling cards, synthesizers, mid-to-high frequency speakers, microphones, sound cards in PCs, headphones, etc. Other peripheral audio equipment includes professional microphone series, headphones, and radio / amplification systems. Sound quality is a crucial standard for judging the quality of audio equipment, including indicators such as signal-to-noise ratio, sampling bit depth, sampling frequency, and total harmonic distortion. The levels of these parameters determine the sound quality of the audio equipment. Therefore, audio equipment needs to have its operating status monitored in real time using monitoring equipment, often employing audio analyzers to monitor various parameters.

[0003] Traditional audio analysis instruments have gradually revealed several limitations in long-term practical applications. On the one hand, their monitoring accuracy is constrained by hardware performance and algorithms, making it difficult to achieve high-sensitivity and high-accuracy analysis and judgment of audio signals under complex operating conditions. On the other hand, their functional design is relatively simple, usually only able to achieve basic spectrum display and simple measurement, lacking advanced functions such as fault diagnosis, trend prediction, and intelligent alarm. In addition, the operation interface of such devices is complex, and problems such as misoperation or low efficiency are prone to occur in actual use. Therefore, traditional audio analyzers are no longer able to meet the diverse needs of current audio equipment operation monitoring for multi-functional integration, intelligent operation, and high-precision diagnosis. Summary of the Invention

[0004] The purpose of this invention is to provide an audio device operation monitoring device and its usage method, which has the advantages of high monitoring accuracy, simplified operation and functional expansion, and solves the problems of low monitoring and analysis accuracy, complex operation and single function in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an audio device operation monitoring device and its usage method, comprising a housing, a monitoring component for monitoring the audio device, and a support component for supporting the housing. The monitoring component includes a signal processing module, a multi-channel signal acquisition module, an analog-to-digital conversion module, a synchronization module, a storage module, a power supply module, an alarm module, a communication module, and a touch chip. The multi-channel signal acquisition module consists of an acquisition chip, an amplifier, and a filter. The synchronization module includes a word clock module, a collaborative control module, a preprocessing module, and a data fusion module. The acquisition module is responsible for acquiring various types of audio signals from the audio device under test. The signal processing module performs in-depth processing on the acquired signals, including feature extraction, parameter calculation, and fault analysis. The data storage module is used to store the acquired raw audio data and analysis results. One end of the housing is equipped with an interface module for connecting peripheral devices. The other end of the housing is equipped with a touch screen for display, control keys for adjustment, and a tri-color LED for alarm display. The touch screen is electrically connected to the touch chip, the tri-color LED is electrically connected to the alarm module, and the control keys are electrically connected to the signal processing module.

[0006] Preferably, the signal processing module is equipped with a dual-core DSP+FPGA architecture and has a built-in real-time Fourier transform engine to handle complex signal processing tasks. The fault analysis in the signal processing module adopts a three-level fault diagnosis model.

[0007] Preferably, the multi-channel signal acquisition module, analog-to-digital conversion module, synchronization module, storage module, power supply module, alarm module, communication module, and touch chip are all electrically connected to the signal processing module and are all integrated on the PCB board. The communication module supports multiple communication protocols, including Wi-Fi, Bluetooth, and Ethernet, to achieve flexible communication methods. The acquisition chip of the multi-channel signal acquisition module adopts a high-precision ADC chip + adaptive impedance matching circuit, supporting ≥ channels of synchronous acquisition.

[0008] Preferably, the outer casing includes a housing, a back plate fixed to the back of the housing, a panel fixed to the front of the housing, ventilation holes on both sides of the housing, and a fan fixed to the inner cavity of the housing.

[0009] Preferably, fans are fixedly connected to both sides of the inner cavity of the housing, the monitoring component is fixed to the bottom of the inner cavity of the housing, and a support component is fixedly connected to the bottom of the housing. The support component includes a support plate fixedly connected to the housing, support feet fixed around the support plate, and a fixing component installed on the surface of the support feet.

[0010] Preferably, the fixing assembly includes a support base fixed to the bottom of the support foot, a silicone adsorption pad installed in the inner cavity of the support base, a pressure plate located in the inner cavity of the silicone adsorption pad, a nut fixed to the top of the support foot, a screw engaging with the nut, and a knob fixed to the top of the screw, the end of the knob away from the screw extending into the inner cavity of the silicone adsorption pad and rotatably connected to the pressure plate.

[0011] Preferably, the interface module includes an input interface electrically connected to the multi-channel signal acquisition module, a power interface electrically connected to the power module, and a communication interface electrically connected to the communication module. The interface module is fixed to the surface of the back plate. The inner cavity of the housing is also fixedly connected to a buzzer electrically connected to the alarm module. The touch screen, control keys, and tri-color lights are all fixed to the panel surface.

[0012] Preferably, its usage method includes the following steps:

[0013] S1. First, connect the device to the audio device under test. According to the interface type of the audio device under test, select the appropriate connection method. Connect the multi-channel audio signal acquisition module of the device to the corresponding output interface of the audio device under test through the audio cable. After the connection is completed, initialize the device, including setting the sampling frequency, sampling bit depth, and analysis parameters to ensure that the device can acquire and analyze signals according to the preset parameters.

[0014] S2. After initialization, the device is started to acquire signals. The device acquires the audio signal of the audio device under test in real time according to the set sampling parameters, and stores the acquired raw audio data in the data storage module. During the acquisition process, the acquired signal will be pre-processed to improve the signal quality.

[0015] S3. After collecting data for a certain period of time or meeting certain conditions, the device automatically analyzes and processes the collected audio signals. The signal processing module calculates audio parameters and performs fault analysis according to the preset analysis algorithm. After the analysis is completed, the analysis results are presented intuitively through the touch screen. Users can view the various parameters, fault information, and test results of the audio device through the touch screen and perform further operations as needed.

[0016] S4. If the device detects a fault in the audio equipment during the analysis process, it will promptly issue an alarm signal and display the fault type on the touch screen. Based on this information, the audio equipment can be troubleshooted and repaired. At the same time, the device can also feed back the fault information to relevant maintenance personnel or management systems through the communication module so that timely measures can be taken to handle the problem and improve the maintenance efficiency of the audio equipment.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0018] This invention achieves synchronous high-precision acquisition of multiple audio signals through the combination of a multi-channel signal acquisition module, a high-precision ADC chip, and an adaptive impedance matching circuit. This effectively improves the accuracy and stability of signal acquisition. The signal processing module adopts a dual-core DSP+FPGA architecture and has a built-in real-time Fourier transform engine, enabling it to quickly process complex audio signals and meet the high real-time analysis requirements. The application of a three-level fault diagnosis model allows the device to perform fault analysis step by step, accurately locating the fault point and improving the accuracy of fault diagnosis. The communication module supports multiple communication protocols, flexibly adapting to different usage scenarios and enabling remote monitoring and data transmission. In addition, the device has a compact overall structure, and the ventilation holes and fan design of the shell effectively improve heat dissipation performance, ensuring the stability of the device during long-term operation. The fixing components of the support assembly enhance the stability of the device when placed by the cooperation of silicone adsorption pads and pressure plates, reducing the impact of external vibrations on the monitoring results. The integrated design of the touch screen, control keys, and three-color lights simplifies the operation process, making the operation of the device more intuitive and convenient, effectively solving the problems of complex operation and limited functionality of traditional audio analyzers. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the main structure of the present invention;

[0020] Figure 2 This is a schematic diagram of the rear view structure of the present invention;

[0021] Figure 3 This is a cross-sectional view of the housing of the present invention;

[0022] Figure 4 This is a schematic diagram of the system architecture of the present invention;

[0023] Figure 5 This is a schematic diagram of the separated state structure of the fixing component of the present invention.

[0024] In the diagram: 100, outer casing; 110, housing; 120, back panel; 130, front panel; 140, ventilation hole; 150, fan; 200, monitoring component; 300, support component; 310, support plate; 320, support foot; 330, fixing component; 331, support base; 332, silicone suction pad; 333, pressure plate; 334, nut; 335, screw; 336, knob; 400, interface module; 410, input interface; 420, power interface; 430, communication interface; 500, touch screen; 600, control key; 700, tri-color light; 800, buzzer. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Example 1

[0027] like Figures 1 to 5 As shown, this is the first embodiment of the present invention. This embodiment provides an audio device operation monitoring device and its usage method, including a housing 100, a monitoring component 200 for monitoring audio devices, and a support component 300 for supporting the housing 100. The monitoring component 200 includes a signal processing module, a multi-channel signal acquisition module, an analog-to-digital conversion module, a synchronization module, a storage module, a power supply module, an alarm module, a communication module, and a touch chip. The multi-channel signal acquisition module consists of an acquisition chip, an amplifier, and a filter. The synchronization module includes a word clock module, a collaborative control module, a preprocessing module, and a data fusion module. The system is responsible for collecting various types of audio signals from the audio device under test. The signal processing module performs in-depth processing on the collected signals, including feature extraction, parameter calculation, and fault analysis. The data storage module is used to store the collected raw audio data and analysis results. One end of the housing 100 is equipped with an interface module 400, which is used to connect peripheral devices. The other end of the housing 100 is equipped with a touch screen 500 for display, control keys 600 for adjustment, and a tri-color light 700 for alarm display. The touch screen 500 is electrically connected to the touch chip, the tri-color light 700 is electrically connected to the alarm module, and the control keys 600 are electrically connected to the signal processing module.

[0028] like Figures 1 to 5As shown, the monitoring device and the audio device under test are connected via interface module 400 to ensure a stable connection and normal signal transmission. After connection, the device power is turned on, and the power module provides a stable operating voltage for the entire monitoring device. The monitoring program is started via control key 600. At this time, the multi-channel signal acquisition module starts working. The acquisition chip, amplifier, and filter work together to acquire multiple types of audio signals from the audio device under test. The acquired signals are transmitted to the signal processing module, which performs in-depth processing, including feature extraction, parameter calculation, and fault analysis. During signal processing, the word clock module, collaborative control module, preprocessing module, and data fusion module of the synchronization module ensure the synchronization and data consistency between the modules. The raw audio data and analysis results generated during processing are stored in the storage module. If the signal processing module detects a fault or abnormality in the audio device, the alarm module will be triggered, activating 700 tri-color LEDs. Different colors are displayed to indicate different fault levels. Simultaneously, the raw audio data, analysis results, and device operating status can be viewed via the touchscreen 500. The touchscreen 500, supported by a touch chip, enables convenient operation and interaction. If monitoring data needs to be transmitted to other devices or systems, it can be done through the communication module. This effectively solves the limitations of traditional audio analyzers in data transmission and remote monitoring. The communication module supports multiple communication protocols including Wi-Fi, Bluetooth, and Ethernet, allowing the device to flexibly adapt to different usage scenarios. Whether it's a portable application requiring wireless transmission or a fixed location requiring a wired connection to ensure data stability, it meets the needs. Through the communication module, monitoring data can be uploaded to a cloud server or local management system in real time, facilitating remote monitoring and data analysis of the audio equipment's operating status anytime, anywhere, greatly improving the efficiency and timeliness of audio equipment maintenance.

[0029] Example 2

[0030] Reference Figures 1 to 5 This is the second embodiment of the present invention, which is based on the previous embodiment.

[0031] In this embodiment, the signal processing module is equipped with a dual-core DSP+FPGA architecture and a built-in real-time Fourier transform engine to handle complex signal processing tasks. The fault analysis in the signal processing module adopts a three-level fault diagnosis model.

[0032] The multi-channel signal acquisition module, analog-to-digital conversion module, synchronization module, storage module, power supply module, alarm module, communication module, and touch chip are all electrically connected to the signal processing module and are all integrated on the PCB board. The communication module supports multiple communication protocols, including Wi-Fi, Bluetooth, and Ethernet, to achieve flexible communication methods. The acquisition chip of the multi-channel signal acquisition module adopts a high-precision ADC chip + adaptive impedance matching circuit, which supports ≥3 channels of synchronous acquisition.

[0033] The interface module 400 includes an input interface 410 electrically connected to the multi-channel signal acquisition module, a power interface 420 electrically connected to the power module, and a communication interface 430 electrically connected to the communication module. The interface module 400 is fixed to the surface of the back plate 120. The inner cavity of the housing 110 is also fixedly connected to a buzzer 800 electrically connected to the alarm module. The touch screen 500, control keys 600 and tri-color lights 700 are all fixed to the surface of the panel 130.

[0034] like Figures 1 to 5 As shown, the PCB board adopts a multi-layer wiring design, which effectively reduces signal interference and improves equipment stability. The signal processing module interacts with the storage module through a high-speed bus to ensure the real-time performance and accuracy of data transmission. The power module adopts a wide voltage input design to adapt to different working environments, and also has overvoltage and overcurrent protection functions to ensure safe operation of the equipment. The alarm module is linked with the buzzer 800. When an abnormal signal is detected, it immediately triggers an audible and visual alarm and uploads the alarm information through the communication module. The touch screen 500 supports multi-touch operation. Users can quickly switch monitoring modes through the control key 600. The three-color indicator 700 intuitively displays the operating status of the equipment: green indicates normal, yellow indicates warning, and red indicates fault.

[0035] Example 3

[0036] Reference Figure 1 , Figure 2 , Figure 3 and Figure 5 This is the second embodiment of the present invention, which is based on the first two embodiments.

[0037] In this embodiment, the outer casing 100 includes a casing 110, a back plate 120 fixed to the back of the casing 110, a panel 130 fixed to the front of the casing 110, ventilation holes 140 opened on both sides of the casing 110, and a fan 150 fixed to the inner cavity of the casing 110.

[0038] Fans 150 are fixedly connected to both sides of the inner cavity of housing 110. Monitoring component 200 is fixed to the bottom of the inner cavity of housing 110. Support component 300 is fixedly connected to the bottom of housing 110. Support component 300 includes support plate 310 fixedly connected to housing 110, support feet 320 fixed around support plate 310, and fixing component 330 installed on the surface of support feet 320.

[0039] The fixing assembly 330 includes a support base 331 fixed to the bottom of the support foot 320, a silicone adsorption pad 332 installed in the inner cavity of the support base 331, a pressure plate 333 located in the inner cavity of the silicone adsorption pad 332, a nut 334 fixed to the top of the support foot 320, a screw 335 meshing with the nut 334, and a knob 336 fixed to the top of the screw 335. The end of the knob 336 away from the screw 335 extends into the inner cavity of the silicone adsorption pad 332 and is rotatably connected to the pressure plate 333.

[0040] like Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, a rubber pad is provided between the housing 110 and the support plate 310, and the support foot 320 is used to provide support. It can be fixed on the table by the fixing component 330. The monitoring device is placed in a suitable position on the table by the support component 300. Then, the knob 336 is rotated. Since the knob 336 is fixedly connected to the screw 335 and the screw 335 is engaged with the nut 334, rotating the knob 336 will cause the screw 335 to move downward, thereby pushing the pressure plate 333 to move downward in the inner cavity of the silicone adsorption pad 332. The silicone adsorption pad 332 will be squeezed and better adsorbed on the table. At the same time, the pressure plate 333 will exert a certain pressure on the table, which will enhance the stability of the fixation. The rubber pad provided between the housing 110 and the support plate 310 can play a role in shock absorption and buffering, reducing the impact of vibration generated during the operation of the device on the device itself and the fixation state. The cooperation of the ventilation hole 140 and the fan 150 is conducive to heat dissipation during the operation of the device, ensuring that the internal components of the device work in a suitable temperature environment and extending the service life of the device.

[0041] A method for using an audio device operation monitoring device, the method comprising the following steps:

[0042] S1. First, connect the device to the audio device under test. According to the interface type of the audio device under test, select the appropriate connection method. Connect the multi-channel audio signal acquisition module of the device to the corresponding output interface of the audio device under test through the audio cable. After the connection is completed, initialize the device, including setting the sampling frequency, sampling bit depth, and analysis parameters to ensure that the device can acquire and analyze signals according to the preset parameters.

[0043] S2. After initialization, the device is started to acquire signals. The device acquires the audio signal of the audio device under test in real time according to the set sampling parameters, and stores the acquired raw audio data in the data storage module. During the acquisition process, the acquired signal will be pre-processed to improve the signal quality.

[0044] S3. After collecting data for a certain period of time or meeting certain conditions, the device automatically analyzes and processes the collected audio signals. The signal processing module calculates audio parameters and performs fault analysis according to the preset analysis algorithm. After the analysis is completed, the analysis results are presented intuitively through the touch screen 500. Users can view the various parameters, fault information, and test results of the audio device through the touch screen 500 and perform further operations as needed.

[0045] S4. If the device detects a fault in the audio equipment during the analysis process, it will promptly issue an alarm signal and display the fault type on the touch screen 500. Based on this information, the audio equipment can be troubleshooted and repaired. At the same time, the device can also feed back the fault information to relevant maintenance personnel or management systems through the communication module so that timely measures can be taken to handle the problem and improve the maintenance efficiency of the audio equipment.

[0046] All standard parts used in this application can be purchased from the market, and can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. The control method is automatic control through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art and is common knowledge in the field. Since this application is mainly used to protect mechanical devices, the control method and circuit connection will not be explained in detail in this application.

[0047] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0048] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An audio device operation monitoring device and method of using the same, comprising a housing (100), a monitoring assembly (200) for monitoring of an audio device, and a support assembly (300) for supporting the housing (100), characterized in that: The monitoring assembly (200) comprises a signal processing module, a multi-channel signal acquisition module, an analog-digital conversion module, a synchronization module, a storage module, a power module, an alarm module, a communication module, and a touch chip, the multi-channel signal acquisition module is composed of an acquisition chip, an amplifier and a filter, the synchronization module comprises a word clock module, a cooperative control module, a preprocessing module and a data fusion module, the multi-channel signal acquisition module is responsible for collecting multiple types of audio signals from the audio equipment to be measured, the signal processing module performs in-depth processing on the collected signals, including feature extraction, parameter calculation and fault analysis, the data storage module is used for storing the collected original audio data and analysis results, one end of the shell (100) is provided with an interface module (400), the interface module (400) is used for connecting external devices, the other end of the shell (100) is provided with a touch screen (500) for display, a control key (600) for regulation and control, and a three-color lamp (700) for alarm display, the touch screen (500) is electrically connected with the touch chip, the three-color lamp (700) is electrically connected with the alarm module, and the control key (600) is electrically connected with the signal processing module.

2. An audio device operation monitoring device and method of using the same according to claim 1, characterized by: The signal processing module is equipped with a dual-core DSP+FPGA architecture, and a real-time Fourier transform engine is built-in to cope with complex signal processing tasks, and a three-level fault diagnosis model is adopted in the signal processing module for fault analysis.

3. An audio device operation monitoring device and method of using the same according to claim 1, wherein: The multi-channel signal acquisition module, the analog-digital conversion module, the synchronization module, the storage module, the power module, the alarm module, the communication module and the touch chip are electrically connected with the signal processing module, and are all integrated on a PCB board, the communication module supports multiple communication protocols, including Wi-Fi, Bluetooth and Ethernet, to realize flexible communication mode, the acquisition chip of the multi-channel signal acquisition module adopts a high-precision ADC chip+adaptive impedance matching circuit, and supports ≥3-way synchronous acquisition.

4. An audio device operation monitoring device and method of using the same according to claim 1, wherein: The shell (100) comprises a shell body (110), a back plate (120) fixed to the back of the shell body (110), a front panel (130) fixed to the front end of the shell body (110), ventilation holes (140) opened on both sides of the shell body (110), and a fan (150) fixed in the inner cavity of the shell body (110).

5. An audio device operation monitoring device and method of using the same according to claim 4, characterized by: The inner cavity of the shell body (110) is fixedly connected with the fan (150) on both sides, the monitoring assembly (200) is fixed to the bottom of the inner cavity of the shell body (110), the bottom of the shell body (110) is fixedly connected with a supporting assembly (300), and the supporting assembly (300) comprises a supporting plate (310) fixedly connected with the shell body (110), supporting legs (320) fixed to the periphery of the supporting plate (310), and a fixing assembly (330) mounted on the surface of the supporting leg (320).

6. An audio device operation monitoring device and method of using the same according to claim 5, wherein: The fixing assembly (330) comprises a supporting base (331) fixed to the bottom of the supporting leg (320), a silica gel adsorption pad (332) installed in the inner cavity of the supporting base (331), a pressing plate (333) located in the inner cavity of the silica gel adsorption pad (332), a nut (334) fixed to the top of the supporting leg (320), a screw rod (335) engaged with the nut (334), and a knob (336) fixed to the top of the screw rod (335), wherein the end of the knob (336) away from the screw rod (335) extends into the inner cavity of the silica gel adsorption pad (332) and is rotationally connected with the pressing plate (333).

7. An audio device operation monitoring device and method of using the same according to claim 4, wherein: The interface module (400) comprises an input interface (410) electrically connected with the multi-channel signal acquisition module, a power interface (420) electrically connected with the power module, and a communication interface (430) electrically connected with the communication module, and the interface module (400) is fixed to the surface of the back plate (120). The inner cavity of the shell (110) is further fixedly connected with a buzzer (800) electrically connected with the alarm module. The touch screen (500), the control key (600) and the three-color lamp (700) are all fixed to the surface of the panel (130).

8. The audio device operation monitoring device and method of using the same according to any one of claims 1 to 7, wherein: The use method thereof comprises the following steps: S1. First, connect the device with the audio equipment to be tested. According to the interface type of the audio equipment to be tested, select the appropriate connection method, connect the multi-channel audio signal acquisition module of the device with the corresponding output interface of the audio equipment to be tested through the audio cable, and after the connection is completed, initialize the device, including setting the sampling frequency, sampling bit number and analysis parameters, to ensure that the device can collect and analyze signals according to the preset parameters; S2. After the initialization setting is completed, start the device to collect signals. The device collects audio signals of the audio equipment to be tested in real time according to the set sampling parameters, and stores the collected original audio data into the data storage module. In the collection process, the collected signals are preliminarily pretreated to improve the quality of the signals; S3. After a certain time or under certain conditions, the device automatically analyzes and processes the collected audio signals. The signal processing module calculates audio parameters and performs fault analysis according to the preset analysis algorithm. After the analysis is completed, the analysis results are intuitively presented through the touch screen (500). The parameters, fault information and detection results of the audio equipment can be viewed through the touch screen (500), and further operation can be performed according to the needs; S4. The device detects that the audio equipment has a fault during the analysis process, and sends an alarm signal in time and displays the fault type on the touch screen (500). The audio equipment can be checked and repaired according to these information. Meanwhile, the device can also feed back the fault information to the relevant maintenance personnel or management system through the communication module, so as to take timely measures for processing and improve the maintenance efficiency of the audio equipment.

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