Marking device and method for displaying batch information of semiconductor wafer in association with Morse code
By using Morse code-associated graphic markers in the peripheral area of semiconductor wafers, the yield reduction problem caused by marker encroachment on silicon areas was solved, and the miniaturization of markers was achieved.
Patent Information
- Application Number
- CN202411736809.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-09-19
- Filing Date
- 2024-11-29
- Publication Date
- 2026-03-20
AI Technical Summary
When marking the periphery of a semiconductor wafer, existing techniques often result in marking encroaching on the silicon area, leading to a decrease in yield.
The combination of letters and numbers is replaced by graphic representations associated with Morse code. A set of geometric shapes consisting of dots, lines, and spaces is generated by laser marking on the periphery of the wafer.
By reducing the size of the markers and preventing them from encroaching on the silicon area, the problem of decreased yield was solved.
Smart Images
Figure CN121712271A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a marking device and method for displaying batch information of semiconductor wafers in association with Morse code. Background Technology
[0002] The content described in this section is merely to provide background information for this embodiment and does not constitute prior art.
[0003] For semiconductor wafers, sometimes a mark is made on the top of the semiconductor wafer to engrave the lot information.
[0004] In this case, for silicon on insulator (SOI) wafers, marking is required in the surrounding area (terrace area) where there is no silicon region (Top Si) to minimize particles that may be generated during the marking process.
[0005] However, due to insufficient space in the surrounding area and inaccurate marking positions, marking operations often result in marking encroaching on the silicon area. In such cases, the silicon area may experience yield loss due to the transfer of particles generated during the marking process. Summary of the Invention
[0006] The problem the invention aims to solve
[0007] The purpose of this invention is to provide a marking device and method that can replace information previously represented by a combination of letters (e.g., English letters) and numbers with markings of graphics associated with Morse code, thereby reducing the size of the markers used to identify individual wafers.
[0008] The objectives of this invention are not limited to those described above. Other objectives and advantages of this invention not mentioned herein will be understood through the following description and will become clearer through embodiments of the invention. Furthermore, the objectives and advantages of this invention can be achieved through methods and combinations thereof within the scope of the claims.
[0009] means for solving problems
[0010] The marking device in some embodiments of the present invention may include: a communication module for receiving identification information of a provided semiconductor wafer; a conversion module for processing the identification information to convert it into display information; and a marking module for marking the display information on the semiconductor wafer, wherein the display information may include the shape of a predetermined geometric pattern.
[0011] Furthermore, the marking module can use a laser to mark the semiconductor wafer.
[0012] Furthermore, the aforementioned semiconductor wafer may include silicon on insulator (SOI) wafers.
[0013] Furthermore, the aforementioned marking module can be used to mark the aforementioned display information on the peripheral area of the upper part of the aforementioned silicon wafer, excluding the silicon region.
[0014] Furthermore, the aforementioned identification information may include the batch information of the aforementioned semiconductor wafer.
[0015] Furthermore, the aforementioned identification information may include at least one of letters and numbers.
[0016] Furthermore, the aforementioned display information may include a set of graphics associated with Morse code.
[0017] Furthermore, the conversion module can convert the identification information containing at least one of the letters and numbers into Morse code, and configure the graphic according to the dots or lines contained in the Morse code to generate the display information.
[0018] Furthermore, as the aforementioned display information, the conversion module can generate a first row representing dots in the aforementioned Morse code and a second row representing lines in the aforementioned Morse code, and arrange multiple of the aforementioned graphics in the respective columns of the aforementioned first row and the aforementioned second row according to the aforementioned Morse code.
[0019] Furthermore, the second row mentioned above can be formed at the top relative to the first row mentioned above.
[0020] Furthermore, as part of the aforementioned display information, the conversion module can also generate a third line associated with the space separator.
[0021] Furthermore, the aforementioned third row can be formed at the top relative to the aforementioned second row.
[0022] Furthermore, when there are blank areas in the aforementioned Morse code, the conversion module can configure the aforementioned graphic in the aforementioned third row in the blank column, and the aforementioned blank column is the column of the aforementioned display information at the position corresponding to the aforementioned blank area.
[0023] Furthermore, as the aforementioned display information, the conversion module can generate rows four through six. If the row belongs to the column displaying dots in the Morse code, the graphic is placed in any row of rows four through six. If the row belongs to the column displaying lines in the Morse code, the graphic is placed in all rows of rows four through six.
[0024] Furthermore, the fifth row is positioned above the fourth row, and the sixth row is positioned above the fifth row. If it belongs to the column displaying dots in the Morse code, the conversion module can configure the graphic in the fourth row.
[0025] The marking method performed by the marking apparatus according to some embodiments of the present invention may include the following steps: receiving a semiconductor wafer; receiving identification information of the semiconductor wafer provided; converting the identification information into display information by processing the identification information; and marking the display information on the semiconductor wafer, wherein the display information may include the shape of a geometric pattern of a predetermined shape.
[0026] Furthermore, the aforementioned identification information may include at least one of letters and numbers, and the aforementioned display information may include a set of the aforementioned graphics associated with Morse code. The step of processing the aforementioned identification information to convert it into display information may include the following steps: converting the aforementioned identification information containing at least one of the aforementioned letters and numbers into the aforementioned Morse code; and generating the aforementioned display information by converting the aforementioned Morse code into the form of the aforementioned graphics.
[0027] Furthermore, the step of generating the display information by converting the Morse code into the form of the graphic may include the following steps: generating a first row representing dots in the Morse code and a second row representing lines in the Morse code as the display information; and arranging a plurality of the graphic in each column of the first row and the second row.
[0028] Furthermore, the step of generating the display information by converting the Morse code into the form of the graphic may also include the following steps: generating a third row associated with a space delimiter as the display information; and, when a space area exists, configuring the graphic in all rows of the first to third rows in the space column, wherein the space column is the column of the display information at the position corresponding to the space area.
[0029] Furthermore, the step of generating the display information by converting the Morse code into the form of the graphic may include the following steps: generating the fourth to sixth rows as the display information; and if it belongs to a column displaying dots in the Morse code, then arranging the graphic in any one of the fourth to sixth rows; and if it belongs to a column displaying lines in the Morse code, then arranging the graphic in all the rows of the fourth to sixth rows.
[0030] The effects of the invention
[0031] According to some embodiments of the marking apparatus and method of the present invention, information previously represented by a combination of letters (e.g., English letters) and numbers can be replaced by marking with graphics associated with Morse code, thereby having a new effect of reducing the size of the markers used to identify individual wafers.
[0032] In this context, according to some embodiments of the marking apparatus and method of the present invention, by miniaturizing the markers used to identify each wafer, it is possible to prevent the markers from encroaching on the silicon area during the marking operation, thereby solving the problem of yield reduction that may occur when marking in the silicon area.
[0033] As described above, the specific effects of the present invention will be described in conjunction with the following detailed description of the embodiments. Attached Figure Description
[0034] Figure 1 This is a block diagram of a marking device according to some embodiments of the present invention.
[0035] Figure 2A and Figure 2B A diagram illustrating the identification information of semiconductor wafers that were previously marked with letters and numbers.
[0036] Figure 3 This is a diagram illustrating the operation of the conversion module in some embodiments of the present invention.
[0037] Figure 4 This is a diagram used to illustrate display information generated according to some embodiments of the present invention.
[0038] Figure 5 This is a diagram used to illustrate display information generated according to other embodiments of the present invention.
[0039] Figure 6 This is a diagram used to illustrate display information generated according to other embodiments of the present invention.
[0040] Figure 7 This is a flowchart of a marking method according to some embodiments of the present invention. Detailed Implementation
[0041] The terms and words used in this specification and claims should not be interpreted in their ordinary or dictionary sense. Based on the principle that inventors may define the concepts of terms and words to best illustrate their invention, they should be interpreted in the sense of meaning and concept that conforms to the technical concept of the invention. Furthermore, the embodiments described in this specification and the structures shown in the accompanying drawings are merely one embodiment of the invention and do not represent all the technical concepts of the invention. Therefore, it should be understood that at the time of this application, there may be various equivalent technical solutions and variations and applications that can replace these.
[0042] While the terms "first," "second," "A," and "B," as used in this specification and claims, can describe various structural elements, these structural elements should not be limited by these terms. The terms are used only to distinguish one structural element from others. For example, without departing from the scope of this invention, a first structural element may be referred to as a second structural element, and similarly, a second structural element may be referred to as a first structural element. The term "and / or" includes a combination of multiple related described items or any one of multiple related described items.
[0043] The terminology used in this specification and claims is for illustrative purposes only and is not intended to limit the invention. Unless the context clearly indicates otherwise, singular expressions include plural expressions. In this application, terms such as "comprising" or "having" do not preclude the presence or additional possibilities of features, numbers, steps, actions, structural elements, components, or combinations thereof described in the specification.
[0044] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains.
[0045] Multiple terms defined in commonly used dictionaries should be interpreted as having the same meaning as those in the context of the relevant technology, and should not be interpreted in an idealized or overly formal sense unless explicitly defined in this application. Furthermore, the various structures, steps, processes, or methods included in the various embodiments of this invention can be shared to the extent that they are not technically contradictory.
[0046] The following is for reference Figures 1 to 7 This section describes the marking device and method according to embodiments of the present invention.
[0047] Figure 1 This is a block diagram of a marking device according to some embodiments of the present invention.
[0048] Reference Figure 1In some embodiments of the present invention, the marking device 100 may include a communication module 110, a conversion module 120, and a marking module 130. However, the embodiments of the present invention are not limited thereto, and the communication module 110 may be omitted in the marking device 100 of the present invention.
[0049] The communication module 110 can receive identification data (hereinafter referred to as "ID") of semiconductor wafers. That is, the communication module 110 can receive the identification information ID of semiconductor wafers provided and loaded to the work unit linked to the marking device 100. In one example, the communication module 110 can receive the identification information ID of the corresponding semiconductor wafer from a manager terminal or similar device carried by the manager of the marking device 100 linked to the marking device 100.
[0050] In this case, the semiconductor wafer may include a silicon on insulator (SOI) wafer, but the embodiments of the present invention are not limited thereto. Obviously, the semiconductor wafer can be composed of a variety of materials.
[0051] The identification information ID can be information associated with the identification of a semiconductor wafer. In one example, the identification information ID may include the lot information of the semiconductor wafer. However, embodiments of the present invention are not limited thereto, and the identification information ID may include various information used to identify, distinguish, and define the semiconductor wafer.
[0052] In some examples, the identification information ID may include at least one of letters and numbers. In this case, the letters may include text composed of multiple languages such as Korean, English, Chinese, and Japanese. For example, the identification information ID may be text composed of a combination of English letters and numbers, but embodiments of the present invention are not limited thereto.
[0053] The communication module 110 can transmit the identification information ID to the conversion module 120, but embodiments of the present invention are not limited thereto. In the tagging device 100 of the present invention, the communication module 110 can be omitted. In this case, the conversion module 120 can receive and utilize the identification information ID pre-stored in the internal database of the tagging device 100.
[0054] The conversion module 120 can generate display information (Description Data, hereinafter referred to as "DD") by processing the identification information ID. In other words, the conversion module 120 can generate display information DD by converting the form of the identification information ID.
[0055] In this case, the conversion module 120 has a new effect: by converting the identification information ID to be marked on the semiconductor wafer into the form of display information DD, the size of the markers used to identify each semiconductor wafer is reduced. That is, by miniaturizing the markers used to identify each semiconductor wafer through the conversion module 120, the marking process can be prevented from encroaching on the silicon area of the semiconductor wafer, thereby solving the problem of yield reduction that may occur when marking in the silicon area.
[0056] The following is for reference Figure 2A and Figure 2B To provide a more detailed explanation.
[0057] Figure 2A and Figure 2B A diagram illustrating the identification information of semiconductor wafers that were previously marked with letters and numbers.
[0058] Reference Figure 1 , Figure 2A as well as Figure 2B Semiconductor wafers (hereinafter referred to as "W") may include silicon on insulator (SOI) wafers.
[0059] In this case, wafer W may include a silicon region (hereinafter referred to as "SR") and an edge region (hereinafter referred to as "ER"). That is, the silicon region SR and the edge region ER can be formed in the upper region of wafer W. In this case, the silicon region SR can be referred to as "Top Si" and the edge region ER can be referred to as "Terrace".
[0060] In principle, the identification information ID should be marked in the peripheral area ER of the semiconductor wafer W. However, due to the shape of the semiconductor wafer W, there may be insufficient space in the peripheral area ER, resulting in deviations in the marking position of the identification information ID. Therefore, if... Figure 2A and Figure 2B As shown, during actual marking operations, a situation arises where the marker encroaches on the silicon region SR. In this case, when marking the silicon region SR, a yield loss problem occurs due to the transfer of particles generated during the marking process.
[0061] Re-reference Figure 1 To solve this problem, the conversion module 120 can generate display information DD by converting the form of the identification information ID.
[0062] In some examples, the conversion module 120 can generate display information DD by converting the identification information ID into the shape of a predetermined geometric shape. That is, the display information DD may contain a set of geometric shapes of a predetermined shape.
[0063] For example, conversion module 120 can convert identification information ID into display information DD based on Morse code. For example, after converting the identification information ID to Morse code, conversion module 120 can generate display information DD by configuring graphics to represent the dots or lines of the Morse code. In this case, display information DD may contain the form of a set of graphics associated with the Morse code.
[0064] The following is for reference Figures 3 to 6 This document details the process of generating display information DD in the conversion module 120 of some embodiments of the present invention.
[0065] Figure 3 This is a diagram illustrating the operation of the conversion module in some embodiments of the present invention. Figure 4 This is a diagram used to illustrate display information generated according to some embodiments of the present invention. Figure 5 This is a diagram used to illustrate display information generated according to other embodiments of the present invention. Figure 6 This is a diagram used to illustrate display information generated according to other embodiments of the present invention.
[0066] Reference Figure 1 and Figure 3 The conversion module 120 can convert the identification information ID into display information DD based on Morse code (hereinafter referred to as "MS"). In this case, Morse code MC, as a symbol system composed of two types of symbols, dot and line, represents a method of expression in a visual or auditory manner.
[0067] For example, after converting the identification information ID to Morse code MC, the conversion module 120 can generate display information DD by configuring graphics in the manner of representing Morse code MC as dots or lines.
[0068] More specifically, firstly, the conversion module 120 can convert the identification information ID into Morse code MC. If... Figure 3 Taking an example, the conversion module 120 can convert identification information IDs such as "R37N03", which are combinations of English letters and numbers, into Morse code MCs such as ".-....----...-.-----...--", which are combinations of dots and lines. For example, the conversion module 120 can use a known Morse code conversion formula to convert the identification information ID into Morse code MCs.
[0069] Next, the conversion module 120 can generate display information DD based on Morse code MC. If... Figure 3 Taking an example, the conversion module 120 can generate display information DD by configuring predetermined graphics to represent the points and lines of Morse code MC such as ".-....----...-.-----...--". In this case, the multiple graphics configured in the display information DD may include points, circles, polygons (e.g., triangles, quadrilaterals, pentagons), etc., but the embodiments of the present invention are not limited to this.
[0070] The following will explain in more detail the process by which the conversion module 120 generates the display information DD based on Morse code MC. Figures 4 to 6 For ease of explanation, the case where the geometry contained in the display information DD is assumed to be points is shown.
[0071] In one example, refer to Figure 1 , Figure 3 as well as Figure 4 The conversion module 120 can generate first display information DD_1 based on Morse code MC. Specifically, when generating the first display information DD_1, the conversion module 120 can generate a first row R1 representing points in the Morse code MC and a second row R2 representing lines in the Morse code MC, and arrange multiple graphics in the columns (e.g., C1, C2, C3) of the first row R1 and the second row R2. That is, it can be interpreted that in the first display information DD_1, if a graphic is arranged in the first row R1, the value of the Morse code MC corresponding to the column with the graphic is a point; if a graphic is arranged in the second row R2, the value of the Morse code MC corresponding to the column with the graphic is a line. If compared... Figure 3 and Figure 4 To explain, the first three digits of the Morse code MC are represented as ".-.", with dots, lines, and dots appearing sequentially. Therefore, in the first display information DD_1, if it belongs to the first column C1, the graphic can be configured in the first row R1; if it belongs to the second column C2, the graphic can be configured in the second row R2; and if it belongs to the third column C3, the graphic can be configured in the first row R1. In this case, the second row R2 can be formed at the top relative to the first row R1, but embodiments of the present invention are not limited to this.
[0072] In another example, refer to Figure 1 , Figure 3 as well as Figure 5The conversion module 120 can generate second display information DD_2 based on Morse code MC. Specifically, when generating the second display information DD_2, the conversion module 120 can generate a first row R1 representing points in the Morse code MC, a second row R2 representing lines in the Morse code MC, and a third row R3 representing the Morse code MC associated with space delimiters, and arrange multiple graphics in the columns (e.g., C1, C2, C3, C4) of the first row R1 to the third row R3. In this case, when there are space areas in the Morse code MC, the conversion module 120 can arrange the graphics in the third row in the space column R_S, where the space column R_S is the column of the second display information DD_2 corresponding to the space area. That is, it can be interpreted as follows: in the second display information DD_2, if the graphic is configured in the first row R1, the value of the Morse code MC corresponding to the column of the configured graphic is a dot; in the second display information DD_2, if the graphic is configured in the second row R2, the value of the Morse code MC corresponding to the column of the configured graphic is a line; in the second display information DD_2, if the graphic is configured in the third row R3, the value of the Morse code MC corresponding to the column of the configured graphic is a blank (empty area). If compared... Figure 3 and Figure 5 To explain, the initial four digits of the Morse code MC are represented as ".-.", which in turn represent a dot, a line, another dot, and a space. Therefore, in the second display information DD_2, a graphic can be configured in the first row R1 of the first column C1, the second row R2 of the second column C2, the first row R1 of the third column C3, and the third row R3 of the fourth column C4. That is, a graphic can be configured in the third row R3 of the space column R_S. In this case, Figure 5 In this embodiment, while configuring a graphic in the third row R3 of the empty column R_S, the graphic is also configured in the first row R1 and the second row R2. However, embodiments of the present invention are not limited to this; the graphic may be configured only in the third row R3 of the empty column R_S, without configuring the graphic in the first row R1 and the second row R2. On the other hand, the second row R2 may be formed at the upper end relative to the first row R1, and the third row R3 may be formed at the upper end relative to the second row R2, but embodiments of the present invention are not limited to this.
[0073] In another example, refer to Figure 1 , Figure 3 as well as Figure 6The conversion module 120 can generate third display information DD_3 based on Morse code MC. Specifically, when generating the third display information DD_3, the conversion module 120 can generate rows 4 through 6, and arrange multiple graphics in the columns (e.g., C1, C2, C3) of rows 4 through 6. In one example, if the graphic belongs to column R_D (displaying points in Morse code MC), the conversion module 120 can arrange multiple graphics in any row of rows 4 through 6 (e.g., row 4); if the graphic belongs to column R_L (displaying lines in Morse code MC), it can be arranged in all rows of rows 4 through 6. That is, it can be interpreted that in the third display information DD_3, if the graphic is only configured in the fourth row R4, then the value of the Morse code MC corresponding to the column R_D with the configured graphic is a point; in the third display information DD_3, if the graphic is configured in all rows from the fourth row R4 to the sixth row R6, then the value of the Morse code MC corresponding to the corresponding column R_L is a line. If compared... Figure 3 and Figure 6 To explain, the first three digits of the Morse code MC are represented as ".-.", with dots, lines, and dots appearing sequentially. In the third display information DD_3, the graphic can be configured only in the fourth row R4 of the first column C1, all rows from the fourth row R4 to the sixth row R6 of the second column C2, and only in the fourth row R4 of the third column C3. On the other hand, the fifth row R5 can be formed at the top relative to the fourth row R4, and the sixth row R6 can be formed at the top relative to the fifth row R5, but the embodiments of the present invention are not limited to this. Furthermore, in Figure 6 The diagram shows the case where the graphic is configured only in the fourth row R4 of the fourth row R4 to the sixth row R6 when it belongs to the column R_D of the display of points in Morse code MC. However, this is only for illustrative purposes. If it belongs to the column R_D of the display of points in Morse code MC, the graphic can also be configured only in the fifth row R5 or the sixth row R6 of the fourth row R4 to the sixth row R6.
[0074] Re-reference Figure 1 The marking module 130 can display information DD marking (hereinafter referred to as "M") on the semiconductor wafer.
[0075] In some examples, the marking module 130 may include a laser unit, which can be used to perform marking (M). In this case, the marking module 130 can use the laser unit to mark information DD on the peripheral area of the semiconductor wafer (M). Figures 4 to 6 (ER in the text).
[0076] Figure 7 This is a flowchart of a marking method according to some embodiments of the present invention. Figure 7Each step (steps S100 to S400) can be achieved through Figure 1 The marking device 100 in the middle is used. Hereinafter, a brief description will be given without repeating the content.
[0077] First, the marking device 100 can receive a semiconductor wafer (step S100).
[0078] In this case, the semiconductor wafer may include a silicon on insulator (SOI) wafer, but the embodiments of the present invention are not limited thereto. Obviously, the semiconductor wafer can be composed of a variety of materials.
[0079] Next, the marking device 100 can receive the identification information ID of the provided semiconductor wafer (step S200).
[0080] The identification information ID can be information associated with the identification of a semiconductor wafer. In one example, the identification information ID may include the lot information of the semiconductor wafer. However, embodiments of the present invention are not limited to this, and the identification information ID may include various information for identifying, distinguishing, and defining the semiconductor wafer.
[0081] In some examples, the identification information ID may contain at least one of letters and numbers. In this case, the letters may include text composed of multiple languages such as Korean, English, Chinese, and Japanese. For example, the identification information ID may be text composed of a combination of English letters and numbers, but embodiments of the present invention are not limited thereto.
[0082] Next, the marking device 100 can convert the identification information ID into display information DD by processing the identification information ID (step S300).
[0083] In some examples, the marking device 100 can convert the identification information ID into the shape of a predetermined geometric figure to generate display information DD. That is, the display information DD may contain a set of geometric figures of a predetermined shape. For example, the marking device 100 can convert the identification information ID into display information DD based on Morse code. For example, after converting the identification information ID into Morse code, the marking device 100 can generate display information DD by configuring graphics to represent points or lines of the Morse code. In this case, the display information DD may contain the shape of a set of graphics associated with the Morse code. Detailed explanation of this part will be omitted.
[0084] Therefore, the marking device 100 has a new effect: by converting the identification information ID to be marked on the semiconductor wafer into the form of display information DD, the size of the markers used to identify each semiconductor wafer is reduced. That is, by miniaturizing the markers used to identify each semiconductor wafer through the marking device 100, the marking process can prevent the markers from encroaching on the silicon area of the semiconductor wafer, thereby solving the problem of yield reduction that may occur when marking in the silicon area.
[0085] Next, the marking device 100 can mark the display information on the semiconductor wafer (step S400).
[0086] In some examples, the marking device 100 may include a laser unit, which can be used to perform marking (M). In this case, the marking device 100 can use the laser unit to mark information DD laser markings on the peripheral area of the semiconductor wafer (M). Figures 4 to 6 (ER in the text).
[0087] The above description is merely illustrative of the technical concept of this embodiment. Those skilled in the art can make various modifications and variations without departing from the essential characteristics of this embodiment. Therefore, this embodiment is not intended to limit the technical concept of this embodiment, but rather to illustrate it. The scope of the technical concept of this embodiment is not limited to these embodiments. The protection scope of this embodiment should be interpreted according to the appended claims, and all technical concepts within the equivalent scope should be interpreted as included within the scope of the claims of this embodiment.
Claims
1. A marking device, characterized in that, include: The communication module receives the identification information of the provided semiconductor wafer; The conversion module processes the aforementioned identification information to convert it into display information; and The marking module marks the aforementioned display information on the aforementioned semiconductor wafer. The above-displayed information includes the shape of a predetermined geometric shape.
2. The marking device according to claim 1, characterized in that, The marking module described above uses a laser to mark the semiconductor wafer.
3. The marking device according to claim 2, characterized in that, The aforementioned semiconductor wafers include silicon-on-insulator wafers.
4. The marking device according to claim 3, characterized in that, The aforementioned marking module is used to mark the aforementioned display information in the peripheral area of the upper part of the aforementioned silicon wafer, excluding the silicon region.
5. The marking device according to claim 1, characterized in that, The aforementioned identification information includes batch information for the aforementioned semiconductor wafers.
6. The marking device according to claim 5, characterized in that, The aforementioned identification information includes at least one of letters and numbers.
7. The marking device according to claim 6, characterized in that, The above-displayed information includes the set of graphics associated with Morse code.
8. The marking device according to claim 7, characterized in that, The aforementioned conversion module converts the aforementioned identification information, which contains at least one of the aforementioned letters and numbers, into the aforementioned Morse code. The above-mentioned graphic is configured according to the dots or lines contained in the above-mentioned Morse code, thereby generating the above-mentioned display information.
9. The marking device according to claim 8, characterized in that, As the aforementioned display information, the conversion module generates a first row representing dots in the Morse code and a second row representing lines in the Morse code. Based on the aforementioned Morse code, multiple of the aforementioned graphics are arranged in the columns of the aforementioned first row and the aforementioned second row.
10. The marking device according to claim 9, characterized in that, The second row mentioned above is formed at the top relative to the first row mentioned above.
11. The marking device according to claim 9, characterized in that, As part of the above display information, the conversion module also generates a third line associated with the space separator.
12. The marking device according to claim 11, characterized in that, The third row mentioned above is positioned above the second row mentioned above.
13. The marking device according to claim 11, characterized in that, When there are blank areas in the Morse code, the conversion module will configure the graphic in the third row in the blank column, and the blank column is the column of the display information corresponding to the blank area.
14. The marking device according to claim 8, characterized in that, As the aforementioned display information, the conversion module generates lines four through six. If it belongs to a column displaying dots in the Morse code above, then place the graphic in any one of the rows from the fourth to the sixth row. If it belongs to a column that displays lines in the Morse code above, then the above graphic will be placed in all rows from the fourth to the sixth row above.
15. The marking device according to claim 14, characterized in that, The fifth row above the fourth row is positioned above the sixth row above the fifth row. If it belongs to a column displaying dots in the Morse code above, the conversion module will configure the graphic in the fourth row.
16. A marking method using a marking device, characterized in that, Includes the following steps: Receive semiconductor wafers; Receive the identification information of the aforementioned semiconductor wafer; The aforementioned identification information is processed to convert it into display information; and The aforementioned display information is marked on the aforementioned semiconductor wafer. The above-displayed information includes the shape of a predetermined geometric figure.
17. The marking method according to claim 16, characterized in that, The aforementioned identification information includes at least one of letters and numbers. The above-displayed information includes the set of graphics associated with Morse code. The steps of processing the above-mentioned identification information to convert it into display information include the following steps: The identification information containing at least one of the aforementioned letters and numbers is converted into the aforementioned Morse code; and The above display information is generated by converting the Morse code into the form of the above graphic.
18. The marking method according to claim 17, characterized in that, The steps for generating the above display information by converting the above Morse code into the form of the above graphic include the following steps: As the aforementioned display information, a first row representing dots in the aforementioned Morse code and a second row representing lines in the aforementioned Morse code are generated; and Arrange multiple of the above graphics in the columns of the first row and the second row.
19. The marking method according to claim 18, characterized in that, The step of generating the above display information by converting the above Morse code into the form of the above graphic further includes the following steps: As part of the above display information, a third line associated with the space separator is generated; and When a blank area exists, the above graphics are configured in all rows from the first row to the third row in the blank column, and the above blank column is the column of the above display information at the position corresponding to the above blank area.
20. The marking method according to claim 17, characterized in that, The steps for generating the above display information by converting the above Morse code into the form of the above graphic include the following steps: As per the above displayed information, lines four through six are generated; and If the column belongs to the column displaying the dots in the Morse code above, then place the graphic in any one of the rows from the fourth to the sixth row; and If it belongs to a column that displays lines in the Morse code above, then the above graphic will be placed in all rows from the fourth to the sixth row above.