A preparation method of wafer cutting adhesive tape based on ultraviolet light curing

Abstract

The present application relates to the technical field of semiconductor packaging, and particularly relates to a preparation method of wafer cutting adhesive tape based on ultraviolet curing, which comprises the following steps: obtaining a reference tensile rate corresponding to a current substrate thickness to determine a base film ductility risk coefficient, obtaining a target dry adhesive layer thickness to determine an adhesive layer thickness coefficient, determining an adhesive layer dynamic viscosity retention index based on the base film ductility risk coefficient and the adhesive layer thickness coefficient to determine a characteristic state of adhesive tape parameter setting, quantifying energy transfer efficiency based on theoretical UV effective dose, determining an insufficient viscosity reduction risk reason based on the energy transfer efficiency, which is that the adhesive layer UV transmission is insufficient or the adhesive layer curing demand is excessive, obtaining a measured peel force drop rate after main curing of the adhesive layer, combining a saturated dose required by a viscosity reduction performance adjustment unit thickness, and determining a saturation threshold of the viscosity reduction performance of the main curing of the adhesive layer. The present application adaptively regulates and controls the performance risk through dynamic balance of high-strength fixation and UV viscosity reduction.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a method for preparing wafer dicing tape based on ultraviolet light curing. Background Technology

[0002] With the continuous development of semiconductor manufacturing technology, the precision requirements for wafer dicing are constantly increasing. Wafer dicing tape is a core auxiliary material in the dicing process, which can fix, protect, and prevent wafers from scattering during dicing, directly affecting dicing precision, chip yield, and the stability of subsequent packaging processes. Traditional dicing tapes have problems such as insufficient precision in controlling adhesive force and easy chip damage when dicing thin wafers. UV-curable tapes can precisely control the adhesive force of the tape through UV light, thus becoming a research hotspot. However, existing products have defects such as poor tensile properties of the substrate after UV curing and insufficient reduction in adhesive force, which affect chip yield and dicing precision.

[0003] Chinese Patent Publication No. CN115181510A discloses a wafer dicing tape, its preparation method, and its application, relating to the technical field of wafer dicing tape. The tape includes a substrate layer and an adhesive layer. The adhesive layer preparation raw materials include at least one of isooctyl acrylate, butyl acrylate, and butyl methacrylate; at least one of methyl acrylate and methyl methacrylate; at least one of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, and hydroxypropyl methacrylate; and at least one of N-hydroxymethylacrylamide, lauryl acrylate, and lauryl methacrylate. The wafer dicing tape of this invention can be used as a UV-resistant tape or a non-UV tape, alleviating problems such as flyaways, water seepage, edge chipping, and adhesive residue during wafer dicing. It also meets the requirement of no tape residue during the dicing process for other semiconductors such as QFN. Therefore, the wafer dicing tape, its preparation method, and its application have the following problems:

[0004] It is impossible to accurately predict and dynamically balance the core contradiction between "high-strength fixation" and "thorough anti-adhesion after UV treatment" during the wafer dicing tape preparation process, and to conduct real-time diagnosis and closed-loop control of its performance risks. Summary of the Invention

[0005] Therefore, the present invention provides a method for preparing wafer dicing tape based on ultraviolet light curing, which overcomes the problem in the prior art that it is impossible to accurately predict and dynamically balance high-strength fixation and UV de-adhesion during the wafer dicing tape preparation process, and to adaptively control its performance risks.

[0006] The present invention aims to provide a UV-curable wafer dicing tape with precise adhesion control, no residue, and high tensile strength after UV irradiation.

[0007] To achieve the above objectives, the present invention provides a method for preparing a wafer dicing tape based on ultraviolet light curing, comprising:

[0008] Obtain the baseline stretching ratio corresponding to the current substrate thickness to determine the base film stretching risk coefficient, obtain the target dry adhesive layer thickness to determine the adhesive layer thickness coefficient, and determine the adhesive layer dynamic adhesion retention index based on the base film stretching risk coefficient and the adhesive layer thickness coefficient to determine the characteristic state of the tape parameter settings.

[0009] In response to the predicted risk of insufficient adhesive adhesion due to expansion and stretching of the adhesive layer under the current characteristic state, the mass fraction of the adhesive formulation is adjusted according to the adjustment ratio to improve the initial adhesion.

[0010] The pre-curing reactivity is obtained to determine whether the pre-curing effect is ideal. The curing output power is adjusted based on the actual cumulative UV pre-curing dose to predict whether the decrease in the adhesion of the main cured adhesive layer meets the standard.

[0011] The theoretical effective UV dose is obtained based on the UV transmittance of the adhesive layer and the final UV irradiation dose. The energy saturation index is determined based on the theoretical effective UV dose and the saturation dose required per unit thickness. This determines whether there is a risk of insufficient tack reduction in the tack reduction performance of the adhesive layer after primary curing.

[0012] Based on the theoretical effective UV dose, the theoretical energy transfer efficiency is quantified, and based on the energy transfer efficiency, the risk of insufficient viscosity reduction is determined to be insufficient UV transmittance of the adhesive layer or excessive curing demand of the adhesive layer.

[0013] In response to the risk of insufficient viscosity reduction, the coating parameters are adjusted to obtain the maximum allowable adhesive layer thickness, or the final UV irradiation dose is adjusted based on the energy saturation index.

[0014] The measured peel force reduction rate after the adhesive layer is cured is obtained, and the required saturation dosage per unit thickness is adjusted in combination with the anti-tack performance, and the saturation threshold of the anti-tack performance of the adhesive layer after curing is determined.

[0015] Furthermore, the process of determining the characteristic state of the tape parameter settings includes:

[0016] When the dynamic tack retention index of the adhesive layer is greater than or equal to the first safety threshold, the tape parameters are set to the first characteristic state, and it is expected that the adhesive layer of the current batch of tapes will still provide sufficient adhesion after expansion and stretching.

[0017] When the dynamic tack retention index of the adhesive layer is less than the first safety threshold and greater than or equal to the second safety threshold, the tape parameters are determined to be set to the second characteristic state. The combination of the substrate thickness and adhesive layer thickness of the current batch is in a critical state, and there is a risk of insufficient adhesive layer tack during expansion and stretching.

[0018] When the dynamic adhesion retention index of the adhesive layer is less than the second safety threshold, the tape parameters are set to the third characteristic state. It is predicted that the adhesive layer adhesion will be insufficient after expansion and stretching under the current batch substrate thickness and adhesive layer thickness, which may easily lead to the displacement of the wafer chip after cutting, and a risk warning is issued.

[0019] Furthermore, when the tape parameters are set to the second characteristic state, the acrylate polymer content is increased, and the adjustment ratio of the acrylate polymer is calculated based on the degree of deviation of the dynamic tack retention index of the adhesive layer from the first safety threshold.

[0020] Furthermore, the process of determining whether the pre-curing effect is ideal includes:

[0021] If the pre-curing reactivity is greater than or equal to the first reaction threshold and less than or equal to the second reaction threshold, then the pre-curing effect is considered ideal.

[0022] If the pre-curing reactivity is less than the first reaction threshold, it is determined that the pre-curing is insufficient, and there is a risk of adhesion when the composite release film is applied.

[0023] If the pre-curing reactivity is greater than the second reaction threshold, it is determined that the pre-curing is excessive and the final viscosity reduction is incomplete.

[0024] Furthermore, if the actual cumulative UV pre-curing dose is lower than the target dose value when pre-curing is insufficient, the cause of insufficient pre-curing is determined to be insufficient energy input, and the output power of the UV lamp is increased.

[0025] If the actual cumulative UV pre-curing dose is higher than the target dose value when the pre-curing is excessive, the output power will be reduced according to the ratio of the actual cumulative UV pre-curing dose to the target dose value.

[0026] Furthermore, the process of predicting whether the decrease in adhesion after the main curing of the adhesive layer meets the standard includes:

[0027] The UV transmittance of the adhesive layer is detected to calculate the theoretical effective UV dose, and the energy saturation index is determined based on the theoretical effective UV dose.

[0028] If the energy saturation index is greater than or equal to the saturation threshold, it is determined that the final tack reduction performance of the predicted adhesive layer after primary curing is sufficient.

[0029] If the energy saturation index is less than the saturation threshold, it is determined that there is a risk of insufficient viscosity reduction during the predicted primary curing of the adhesive layer.

[0030] Furthermore, when there is a risk of insufficient tack reduction during adhesive layer curing, the theoretical energy transfer efficiency is determined based on the theoretical effective UV dose to determine the cause of the risk of insufficient tack reduction.

[0031] If the theoretical energy transfer efficiency is less than the historical low energy transfer efficiency, it is determined that the energy transfer efficiency of the adhesive layer is abnormally low and the UV transmittance of the adhesive layer is insufficient, resulting in the inability of energy to be effectively transferred to the bottom.

[0032] If the theoretical energy transfer efficiency is greater than or equal to the historical low energy transfer efficiency, the reason for the risk of insufficient viscosity reduction is that the curing requirement of the adhesive layer, which is jointly determined by the target dry adhesive layer thickness and the saturation dosage required per unit thickness, is too high.

[0033] Furthermore, when the UV transmittance of the adhesive layer is insufficient, the total dose of the final UV irradiation is increased in a compensatory manner.

[0034] When the curing requirement of the adhesive layer is too high, determine whether the adhesive layer applied in the coating process is too thick based on the maximum allowable adhesive layer thickness.

[0035] Furthermore, if the predicted dry adhesive layer thickness, converted from the current actual wet adhesive layer thickness, is greater than the maximum allowable adhesive layer thickness, then it is determined that the current coating process is too thick.

[0036] Reduce the scraper gap or reduce the feed pump speed to make the actual wet adhesive layer thickness approach the wet film thickness value corresponding to the maximum allowable adhesive layer thickness;

[0037] If the predicted dry adhesive layer thickness, converted from the actual wet adhesive layer thickness, is less than the maximum allowable adhesive layer thickness, then the curing energy requirement for the adhesive layer is deemed too high, and the final UV irradiation dose is adjusted based on the current energy saturation index.

[0038] Furthermore, if there is a risk of insufficient tack reduction during adhesive layer curing, and the measured peel force reduction rate of the current batch of adhesive layer is greater than the critical reduction rate, then the saturation threshold will be lowered.

[0039] If the final tack reduction performance of the adhesive layer after curing is sufficient, and the measured peel force reduction rate of the current batch of adhesive layer is less than the standard reduction rate, then it is determined that the saturation dose calibration value required per unit thickness is too low, and the saturation dose required per unit thickness is increased.

[0040] Compared with existing technologies, the beneficial effects of this invention are as follows: This invention accurately predicts and actively optimizes the performance of wafer dicing tape. Before feeding, it assesses the stretching and tackiness risk of the "substrate-adhesive layer" combination and pre-adjusts the formula to enhance initial adhesion. On the production line, it monitors and controls the light energy transfer and conversion efficiency of pre-curing and main curing in real time. By calculating the energy saturation index, it diagnoses the risk of insufficient adhesion reduction in advance and dynamically adjusts the coating thickness or UV dose to compensate. It uses measured peel force data to form negative feedback and calibrates the key parameters of the prediction model in a closed loop. It transforms the traditional experience-based "black box" production into data-driven transparent precision manufacturing, significantly improving the reliability of product dicing and fixing of ultra-thin wafers and the consistency of UV adhesion reduction, thereby greatly improving chip yield and production efficiency.

[0041] Furthermore, this invention reduces the peeling force from 9-13 N / 25 mm to 0.1-0.4 N / 25 mm after ultraviolet irradiation (230 mJ) with a mercury lamp. This significant reduction in peeling force enables high-strength wafer fixation during the dicing process and reduces chip pick-up residue after dicing. After ultraviolet irradiation, the tape's tensile strength at break reaches 150%, making it suitable for precision dicing of 8 / 12-inch wafers and meeting most stretching and dicing requirements. This significantly improves dicing accuracy and chip yield.

[0042] Furthermore, the thickness of the substrate affects the extensibility of the base film. If the base film is too extensible, it will be overstretched during the cutting and expansion process, resulting in a thinner adhesive layer, reduced adhesion, and inability to fix the chip. The thickness of the substrate and the required thickness of the adhesive layer vary from batch to batch of tape. A thicker adhesive layer can provide higher initial adhesion, but requires higher UV transmittance. A thinner adhesive layer cures more thoroughly under UV, but has slightly weaker initial adhesion. This invention significantly improves the performance reliability and process adaptability of wafer dicing tapes by constructing a precise prediction and control mechanism. Based on the substrate thickness and target adhesive layer thickness, it intelligently calculates the dynamic adhesion retention index of the adhesive layer and classifies the product into three characteristic states accordingly, enabling the identification of insufficient adhesion risks under expansion and stretching from the source. Differentiated control strategies are implemented for different risk levels, such as pre-adjusting the formula at the critical state to enhance initial adhesion. This not only solves the problem of chip fixation failure caused by excessive stretching of the base film in traditional tapes, but also achieves the balance and optimization of key performance characteristics such as adhesion, extensibility, and UV responsiveness through a quantitative model, thereby ensuring high precision and high yield in the dicing process, and is particularly suitable for advanced packaging requirements of ultra-thin wafers and high-density chips.

[0043] Furthermore, this invention effectively resolves the contradiction between adhesion and anti-adhesion performance in wafer dicing tape production by introducing a closed-loop feedback UV pre-curing intelligent control mechanism; it monitors the actual pre-curing dosage and adhesive layer surface hardness in real time, comprehensively calculates the pre-curing reactivity, and accurately compares it with the ideal threshold; when the reactivity deviates from the target range, it automatically diagnoses the cause and dynamically fine-tunes the UV lamp power (adjustment range 2-5%), achieving precise and stable control of the pre-curing effect; it ensures the formation of a uniform and firm "film" on the adhesive layer surface, completely preventing adhesive transfer when laminating with the release film, while avoiding the loss of photoinitiator due to over-curing, thus ensuring the sufficiency and consistency of the final main UV anti-adhesion effect of the tape from the source of the process, significantly improving product yield and production stability.

[0044] Furthermore, this invention establishes a prediction and control model for the main curing performance of the adhesive layer based on the "energy saturation index," achieving precise feedforward control of the adhesive tape's anti-adhesion effect during wafer dicing. It detects the UV transmittance of the adhesive layer online and, combined with a preset curing dose and adhesive layer thickness, calculates in real time the "theoretical effective UV dose" that can reach the bottom of the adhesive layer, thereby assessing its "energy saturation" relative to the material's inherent curing requirements. When an insufficient anti-adhesion risk is predicted, the root cause is automatically diagnosed: if it is "insufficient UV transmittance of the adhesive layer," intelligent compensation is used to increase the total dose of main UV irradiation; if it is "excessive curing requirements of the adhesive layer," the coating thickness is optimized online or the main curing dose is adjusted. This transforms post-event detection into pre-event prediction and online compensation, ensuring that UV light energy fully penetrates and cures the deepest part of the adhesive layer, thereby completely eliminating sticky residue during chip pickup and significantly improving dicing yield and packaging efficiency.

[0045] Furthermore, this invention achieves dynamic optimization and self-calibration of the prediction model for the main curing and tack reduction performance of the adhesive layer by constructing a complete data closed loop from prediction to verification. It correlates the online predicted "energy saturation index" with the "measured peel force reduction rate" of the finished tape. When the model prediction is risky but the measured performance is excellent, the judgment threshold is intelligently lowered to avoid over-conservatism; when the prediction is safe but the measured performance is insufficient, the key material parameter "required saturation dosage per unit thickness" is increased to correct the model deviation. By continuously iterating and optimizing the prediction algorithm using actual production data, the system possesses self-learning and evolution capabilities, significantly improving the accuracy of predicting the final tack reduction performance of the tape under different formulations and process conditions. This fundamentally ensures the stability and reliability of product performance and reduces quality fluctuations. Attached Figure Description

[0046] Figure 1 This is a schematic flowchart of the method for preparing wafer dicing tape based on ultraviolet light curing in an embodiment of the present invention;

[0047] Figure 2 This is a schematic diagram of the wafer dicing tape in an embodiment of the present invention;

[0048] Figure 3 This is a flowchart illustrating the process of determining the characteristic state of the tape parameter settings in an embodiment of the present invention.

[0049] Figure 4 This is a schematic diagram of the process for determining whether the pre-curing effect is ideal in an embodiment of the present invention;

[0050] In the diagram: 1-substrate, 2-adhesive layer, 3-release film. Detailed Implementation

[0051] To make the objectives and advantages of the present invention clearer, the present invention will be further described below with reference to embodiments; it should be understood that the specific embodiments described herein are merely for explaining the present invention and are not intended to limit the present invention.

[0052] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0053] It should be noted that in the description of this invention, the terms "upper", "lower", "left", "right", "inner", "outer", etc., which indicate directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. This is only for the convenience of description and is not intended to indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this invention.

[0054] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0055] Please see Figures 1-4 As shown, Figure 1 This is a schematic flowchart of the method for preparing wafer dicing tape based on ultraviolet light curing in an embodiment of the present invention; Figure 2 This is a schematic diagram of the wafer dicing tape in an embodiment of the present invention; Figure 3 This is a flowchart illustrating the process of determining the characteristic state of the tape parameter settings in an embodiment of the present invention. Figure 4 This is a schematic diagram illustrating the process for determining whether the pre-curing effect is ideal in an embodiment of the present invention.

[0056] This invention provides a method for preparing a wafer dicing tape based on ultraviolet light curing, comprising:

[0057] Step S1: Obtain the reference elongation rate corresponding to the current substrate thickness to determine the base film stretching risk coefficient; obtain the target dry adhesive layer thickness to determine the adhesive layer thickness coefficient; and determine the adhesive layer dynamic adhesion retention index based on the base film stretching risk coefficient and the adhesive layer thickness coefficient to determine the characteristic state of the tape parameter settings.

[0058] Step S2: In response to the prediction that the adhesive layer has insufficient adhesion due to expansion and stretching under the current characteristic state, the mass fraction of the adhesive formulation is adjusted according to the adjustment ratio to improve the initial adhesion.

[0059] Step S3: Obtain the pre-curing reactivity to determine whether the pre-curing effect is ideal. Adjust the curing output power based on the actual cumulative UV pre-curing dose to predict whether the decrease in the adhesion of the main cured adhesive layer meets the standard.

[0060] Step S4: Obtain the theoretical effective UV dose based on the UV transmittance of the adhesive layer and the final UV irradiation dose. Determine the energy saturation index based on the theoretical effective UV dose and the saturation dose required per unit thickness to determine whether there is a risk of insufficient tack reduction in the tack reduction performance of the adhesive layer after primary curing.

[0061] Step S5: Quantify the theoretical energy transfer efficiency based on the theoretical effective UV dose, and determine the cause of insufficient viscosity reduction risk based on the energy transfer efficiency as insufficient UV transmittance of the adhesive layer or excessive curing demand of the adhesive layer.

[0062] Step S6: In response to the risk of insufficient viscosity reduction, obtain the maximum allowable adhesive layer thickness to adjust the coating parameters, or adjust the final UV irradiation dose based on the energy saturation index.

[0063] Step S7: Obtain the measured peel force reduction rate after the adhesive layer is cured, and adjust the required saturation dosage per unit thickness in combination with the anti-tack performance and determine the saturation threshold of the anti-tack performance of the adhesive layer after curing.

[0064] Specifically, this invention provides precise prediction and proactive optimization of wafer dicing tape performance. Before material feeding, it assesses the stretching and tackiness risk of the "substrate-adhesive layer" combination and pre-adjusts the formulation to enhance initial adhesion. On the production line, it monitors and controls the light energy transfer and conversion efficiency of pre-curing and main curing in real time, diagnoses insufficient adhesion reduction risk in advance by calculating the energy saturation index, and dynamically adjusts the coating thickness or UV dose to compensate. It utilizes measured peel force data to form negative feedback and calibrate key parameters of the prediction model in a closed loop. This transforms traditional experience-dependent "black box" production into data-driven, transparent precision manufacturing, significantly improving the reliability of cutting and fixing ultra-thin wafers and the consistency of UV adhesion reduction, thereby greatly improving chip yield and production efficiency.

[0065] In this embodiment, the wafer cutting tape consists of a substrate 1, an adhesive layer 2, and a release film 3.

[0066] In practice, the substrate is a polyethylene terephthalate (PET) film with a thickness of 25-50 micrometers and a dyne value of 42 or higher;

[0067] The adhesive layer is distributed by mass fraction and contains 50-80 parts of acrylate polymer, 1-10 parts of photoinitiator (1-hydroxycyclohexylphenyl ketone), 1-10 parts of curing agent (1,3-bis(N,N-diglycidylaminomethyl)cyclohexane), and the amount of solvent (ethyl acetate, toluene) added is adjusted according to the required coating thickness.

[0068] The preparation process of the wafer dicing tape includes:

[0069] Formulation mixing: Mix the acrylate polymer, photoinitiator, curing agent and solvent (ethyl acetate / toluene) in proportion to form a uniform adhesive solution;

[0070] Coating and drying: The adhesive is evenly coated onto the corona-treated PET substrate using a precision coating machine, and then dried in an oven at 100-120℃ to remove the solvent.

[0071] UV pre-curing: Use a low-intensity UV lamp to lightly irradiate the adhesive layer to initially set the surface and prevent adhesion.

[0072] Composite curing: A release film is applied to the surface, and after the release film is applied, it is rolled up and cured in an oven at 45°C for 96 hours to allow the adhesive layer to fully cure and stabilize, thus obtaining the finished wafer cutting tape.

[0073] Finished products are slit: The finished wafer dicing tape is slit into wafer dicing tapes of the required specifications.

[0074] Specifically, after irradiation with ultraviolet light (230mJ) using a mercury lamp, the peel force decreased from 9-13N / 25mm to 0.1-0.4N / 25mm. The significant reduction in peel force enables high-strength wafer fixation during the dicing process and reduces chip pick-up residue after dicing. After ultraviolet irradiation, the tape's tensile strength at break reaches 150%, making it suitable for precision dicing of 8 / 12-inch wafers. It meets most stretching and dicing requirements and can significantly improve dicing accuracy and chip yield.

[0075] It is understood that the wafer dicing tape is used to firmly fix the wafer when it is diced into individual chips (dies). After dicing, the tape is irradiated with ultraviolet light to significantly reduce its stickiness, making it easier for the chips to be picked up.

[0076] In practice, the release film serves as a protective adhesive layer and is peeled off before the wafer dicing tape is used.

[0077] Obtain the substrate thickness and target dry adhesive layer thickness of the current batch. The target dry adhesive layer thickness is the thickness of the adhesive layer after drying as required by the process. The substrate thickness can be selected from 25-50µm, and the target dry adhesive layer thickness can be selected from 5-30µm.

[0078] The reference tensile strength at break of the substrate is retrieved based on the substrate type. In this embodiment, the substrate type is polyethylene terephthalate (PET) film. The table of typical maximum tensile strength at break (%) for different substrate thicknesses is provided for different substrate types. The reference tensile strength corresponding to the current substrate thickness is obtained from the table of typical maximum tensile strength at break. Generally, the thinner the substrate, the better the ductility.

[0079] Understandably, the thinner the substrate, the higher the baseline elongation, the greater the proportion stretched under the same expansion force, the more significant the "thinning effect" on the adhesive layer, and the higher the risk.

[0080] The base film stretching risk coefficient is calculated as follows: base film stretching risk coefficient = (baseline stretching rate / 100) × (1 / substrate thickness); the risk coefficient of a 35µm thick substrate (baseline stretching rate 150%) is approximately (150 / 100) × (1 / 35) ≈ 0.0429.

[0081] The higher the base film stretch risk coefficient, the higher the risk that the base film is easily overstretched during expansion.

[0082] Obtain the target dry adhesive layer thickness for the current batch and calculate the adhesive layer thickness coefficient. Specifically, the thicker the adhesive layer, the greater the amount of tensile deformation it can withstand (good buffering), and the more viscous material it provides per unit area. After stretching and thinning, the remaining "effective adhesive layer" is also thicker.

[0083] Adhesive layer thickness coefficient = target dry adhesive layer thickness × [1 + 0.05 × (target dry adhesive layer thickness - reference adhesive layer thickness)], where the reference adhesive layer thickness is set to 15µm in practice.

[0084] Specifically, when the adhesive layer thickness is in the range of 15µm to 30µm, after the adhesive layer thickness exceeds the benchmark value (15µm), for every 1µm increase in thickness, its contribution to the ability to reduce tack due to tensile stress is increased by an additional 5%, which reflects the non-linear enhancement effect of increasing adhesive layer thickness on performance.

[0085] The larger the value of the adhesive layer thickness coefficient, the stronger the adhesive layer's ability to resist the decrease in adhesion caused by stretching.

[0086] Calculate the dynamic adhesion retention index of the adhesive layer: Adhesive layer dynamic adhesion retention index = adhesive layer thickness coefficient / base film elongation risk coefficient;

[0087] Understandably, the dynamic tack retention index of the adhesive layer reflects the ratio between the "risk resistance of the adhesive layer" and the "risk brought by the base film". The higher the index, the stronger the adhesive layer's ability to maintain sufficient adhesion after expansion and stretching.

[0088] When the dynamic tack retention index of the adhesive layer is greater than or equal to the first safety threshold, the tape parameters are set to the first characteristic state, and it is expected that the adhesive layer of the current batch of tapes will still provide sufficient adhesion after expansion and stretching.

[0089] When the dynamic tack retention index of the adhesive layer is less than the first safety threshold and greater than or equal to the second safety threshold, the tape parameters are determined to be set to the second characteristic state. The combination of the substrate thickness and adhesive layer thickness of the current batch is in a critical state, and there is a risk of insufficient adhesive layer tack during expansion and stretching.

[0090] When the dynamic adhesion retention index of the adhesive layer is less than the second safety threshold, the tape parameters are set to the third characteristic state. It is predicted that the adhesive layer adhesion will be insufficient after expansion and stretching under the current batch substrate thickness and adhesive layer thickness, which may easily lead to the displacement of the wafer chip after cutting, and a risk warning is issued.

[0091] The first security threshold is 800, and the second security threshold is 400.

[0092] Specifically, the thickness of the substrate affects the extensibility of the base film. If the base film is too extensible, the adhesive layer will become thinner and the adhesion will decrease after excessive stretching during the cutting and expansion process, making it impossible to fix the chip. The thickness of the substrate and the required thickness of the adhesive layer vary from batch to batch of tape. A thicker adhesive layer can provide higher initial adhesion, but requires higher UV transmittance. A thinner adhesive layer cures more thoroughly under UV, but the initial adhesion is slightly weaker. This invention significantly improves the performance reliability and process adaptability of wafer dicing tapes by constructing a precise prediction and control mechanism. Based on the substrate thickness and target adhesive layer thickness, it intelligently calculates the dynamic adhesion retention index of the adhesive layer and classifies the product into three characteristic states accordingly, enabling the identification of insufficient adhesion risks under expansion and stretching from the source. Differentiated control strategies are implemented for different risk levels, such as pre-adjusting the formula at the critical state to enhance initial adhesion. This not only solves the problem of chip fixation failure caused by excessive stretching of the base film in traditional tapes, but also achieves the balance and optimization of key performance characteristics such as adhesion, extensibility, and UV responsiveness through a quantitative model, thereby ensuring high precision and high yield in the dicing process, and is particularly suitable for advanced packaging requirements of ultra-thin wafers and high-density chips.

[0093] High and stable initial adhesion ensures that the wafer is firmly fixed without displacement under high-speed rotation and high-pressure water rinsing;

[0094] If the tape itself has poor UV transmittance, the adhesive layer close to the back of the wafer will not cure properly, resulting in a "shadow effect" and causing localized adhesive residue.

[0095] After UV irradiation, the adhesion must decrease rapidly, uniformly, and significantly, typically requiring a decrease of over 90%, to achieve easy and clean chip pickup.

[0096] When the tape parameters are set to the second characteristic state, the acrylate polymer content is increased to enhance the initial adhesion, in order to offset the decrease in effective adhesion of the adhesive layer caused by the stretching of the base film; the adjustment ratio of the acrylate polymer is calculated based on the degree of deviation of the dynamic adhesion retention index of the adhesive layer from the first safety threshold.

[0097] Adjustment ratio (%) = k × (first safety threshold - adhesive layer dynamic adhesion retention index) / first safety threshold;

[0098] Where k is an empirical coefficient, and the empirical coefficient in practice is 5, which represents the maximum adjustment range.

[0099] During the formulation mixing stage, the adjustment ratio is calculated by increasing the mass of the acrylate polymer in the adhesive formulation.

[0100] The purpose of pre-curing is to form a rigid "film" on the surface of the adhesive layer, thereby preventing it from sticking (adhesive transfer) when it is subsequently laminated with the release film. However, it should not be over-cured to avoid excessive consumption of photoinitiator and affecting the final UV tack reduction effect.

[0101] The effective irradiation intensity of ultraviolet light on the adhesive layer is obtained. The curing irradiance of the pre-cured layer is detected in real time by a UV intensity sensor. The production line speed is measured by an encoder. The exposure time of pre-curing = effective irradiation length / production line speed.

[0102] Actual cumulative UV pre-curing dose (unit: mJ / cm²) = average curing irradiance × exposure time.

[0103] The microindentation probe of the online microindenter presses against the adhesive layer surface with a tiny force and a very short contact time as the tape passes by, obtaining the surface hardness value of the adhesive layer.

[0104] During implementation, experiments were conducted to determine the optimal hardness and dosage target values ​​for pre-curing when the desired "ideal pre-cured surface shaping effect" is achieved, meaning that there is no adhesion after the composite release film is applied and the effect on the final adhesion reduction is less than 1%.

[0105] Pre-curing reactivity = Hardness weighting coefficient × (adhesive layer surface hardness value / target hardness value) + Dosage weighting coefficient × (actual cumulative UV pre-curing dose / target dose value);

[0106] In the formula, the hardness weight coefficient + the dose weight coefficient = 1. In practice, the hardness weight coefficient is 0.7 and the dose weight coefficient is 0.3.

[0107] If the pre-curing reactivity is greater than or equal to the first reaction threshold and less than or equal to the second reaction threshold, then the pre-curing effect is considered ideal.

[0108] If the pre-curing reactivity is less than the first reaction threshold, it is determined that the pre-curing is insufficient and that the adhesive layer surface has not formed a sufficient "film", which poses a risk of adhesion when composite release film is applied.

[0109] During implementation, if the actual cumulative UV pre-curing dose is lower than the target dose value, the reason for insufficient pre-curing is determined to be insufficient energy input.

[0110] Increase the output power of the UV lamp. During implementation, adjust the output power by 2-5% based on the ratio of the actual cumulative UV pre-curing dose to the target dose value to increase the irradiance, thereby increasing the dose received by the subsequent tape.

[0111] If the pre-curing reactivity is greater than the second reaction threshold, it is determined that the pre-curing is excessive, the surface of the adhesive layer is cured too deeply, and too much photoinitiator is consumed, which may lead to incomplete final tack reduction.

[0112] During implementation, if the actual cumulative UV pre-curing dose is higher than the dose target value, the output power will be reduced by 2-5% based on the ratio of the actual cumulative UV pre-curing dose to the dose target value.

[0113] Wherein, the first reaction threshold is 0.9 and the second reaction threshold is 1.1.

[0114] Specifically, this invention effectively resolves the contradiction between adhesion and anti-adhesion performance in wafer dicing tape production by introducing a closed-loop feedback UV pre-curing intelligent control mechanism. It monitors the actual pre-curing dosage and adhesive layer surface hardness in real time, comprehensively calculates the pre-curing reactivity, and accurately compares it with the ideal threshold. When the reactivity deviates from the target range, it automatically diagnoses the cause and dynamically fine-tunes the UV lamp power (adjustment range 2-5%), achieving precise and stable control of the pre-curing effect. This ensures the formation of a uniform and firm "film" on the adhesive layer surface, completely preventing adhesive transfer during lamination with the release film, while avoiding the loss of photoinitiator due to over-curing. From the source of the process, it guarantees the sufficiency and consistency of the final main UV anti-adhesion effect of the tape, significantly improving product yield and production stability.

[0115] After adjusting the curing output power, predict whether the decrease in adhesion of the current batch of tape after primary curing with the adjusted curing output power meets the standard.

[0116] It is understood that the main curing refers to the curing of the adhesive layer of the tape after wafer dicing.

[0117] The transmittance of the adhesive layer at the target wavelength is detected by an online UV-Vis spectrophotometer. In practice, either a reflective or transmissive fiber optic probe is used. For opaque substrates such as colored PET, a reflective probe is used to measure the reflection / absorption characteristics of UV light at a specific wavelength in the adhesive layer and convert them into the equivalent UV transmittance or absorbance of the adhesive layer. For transparent substrates, a transmissive probe can be used.

[0118] The UV transmittance of the adhesive layer is detected and the theoretical effective UV dose is calculated. The UV transmittance of the adhesive layer reflects the sum of the absorption and scattering capabilities of the adhesive layer for that specific wavelength.

[0119] The theoretical effective UV dose = final UV irradiation dose × (UV transmittance of adhesive layer / 100)^(target dry adhesive layer thickness / reference transmittance thickness);

[0120] In the formula, the final UV irradiation dose is the curing process parameter of the main curing after adjusting the output power, such as 230mJ / cm², and is the total energy irradiated onto the tape surface;

[0121] (UV transmittance of adhesive layer / 100) is used to convert the percentage transmittance to a decimal, representing the proportion of light remaining after passing through a unit feature thickness of adhesive layer; for example, a transmittance of 80% means that the intensity of light decreases by 0.8 times for every "feature thickness" it passes through.

[0122] (Target dry adhesive layer thickness / reference transmission thickness) is the equivalent optical thickness of the adhesive layer. The reference transmission thickness, such as 10µm, is a calibration constant that represents the actual physical size of the "characteristic thickness" in the formula. The target dry adhesive layer thickness divided by the reference transmission thickness gives the number of such "characteristic thicknesses" contained in the adhesive layer. The target dry adhesive layer thickness is a preset value.

[0123] (Target dry adhesive layer thickness / reference transmission thickness) is the equivalent thickness, which is the proportion of remaining light intensity at the adhesive layer-wafer interface after UV light passes through the entire adhesive layer thickness; for example, if the UV transmittance of the adhesive layer is 80%, the target dry adhesive layer thickness is 30µm, and the reference transmission thickness is 10µm, then the equivalent thickness is 3, and the proportion of light intensity reaching the bottom is approximately 0.8^3 = 0.512.

[0124] The product of the final UV irradiation dose and the ratio of light intensity reaching the bottom represents the estimated "theoretical effective UV dose" that can effectively trigger the curing reaction at the bottom of the adhesive layer. This directly determines the degree of curing of the deepest part of the adhesive layer, which is also the most difficult to cure and the easiest to leave adhesive residue.

[0125] Based on the theoretical effective UV dose, determine whether the actual effective energy reaching the bottom of the adhesive layer has reached the minimum saturation energy required for the thickness of the adhesive layer.

[0126] The saturation dose required per unit thickness of the adhesive layer is determined by experiments. This indicates how much mJ / cm² UV energy is needed within the adhesive layer per micrometer of thickness to achieve full curing, expressed in mJ / cm²·µm.

[0127] In practice, the adhesive layer is made using a standard formula. The thickness of the adhesive layer and the UV dose are changed to find the minimum critical dose at which the viscosity decreases by more than 99% for each thickness. The critical dose / adhesive layer thickness is calculated, and the average value is taken to obtain the saturation dose required per unit thickness.

[0128] Energy saturation index = Theoretical effective UV dose / (Target dry adhesive layer thickness × Saturation dose required per unit thickness);

[0129] If the energy saturation index is greater than or equal to the saturation threshold, it is determined that the final tack reduction performance of the predicted adhesive layer after primary curing is sufficient.

[0130] If the energy saturation index is less than the saturation threshold, it is determined that there is a risk of insufficient viscosity reduction during the predicted primary curing of the adhesive layer.

[0131] When there is a risk of insufficient tack reduction during adhesive layer curing, the theoretical energy transfer efficiency is determined based on the theoretical effective UV dose to determine the cause of the risk of insufficient tack reduction.

[0132] Specifically, the theoretical energy transfer efficiency = theoretical effective UV dose / set final UV irradiation dose; the theoretical energy transfer efficiency quantifies the percentage of UV light that penetrates from the tape surface to the bottom wafer interface. For example, an efficiency of 0.4 means that only 40% of the incident light energy reaches the bottom.

[0133] If the theoretical energy transfer efficiency is less than the historical low energy transfer efficiency, it is determined that the energy transfer efficiency of the adhesive layer is abnormally low and the UV transmittance of the adhesive layer is insufficient, resulting in the inability of energy to be effectively transferred to the bottom.

[0134] If the theoretical energy transfer efficiency is greater than or equal to the historical low energy transfer efficiency, the reason for the risk of insufficient viscosity reduction is that the curing requirement of the adhesive layer, which is jointly determined by the target dry adhesive layer thickness and the saturation dosage required per unit thickness, is too high.

[0135] Specifically, the historical energy transfer efficiency is calculated from data of at least 50 historical production batches of the same product with the same substrate, the same target dry adhesive layer thickness, and the same formula. The average value and standard deviation of the theoretical energy transfer efficiency are calculated, and the historical energy transfer efficiency is calculated as: average value - 2 × standard deviation.

[0136] The saturation threshold is 1.2.

[0137] When the UV transmittance of the adhesive layer is insufficient, the total dose of the final UV irradiation is increased in compensation. The final UV irradiation dose after compensation = final UV irradiation dose × (historical low energy transfer efficiency / theoretical energy transfer efficiency).

[0138] When the adhesive layer curing requirement is too high, determine whether the adhesive layer applied in the coating process is too thick based on the maximum allowable adhesive layer thickness.

[0139] Specifically, the maximum permissible adhesive layer thickness is the maximum permissible adhesive layer thickness required to achieve the energy saturation index = saturation threshold under the currently determined final UV irradiation dose.

[0140] Energy saturation index = (final UV irradiation dose × UV transmittance of adhesive layer) / (maximum allowable adhesive layer thickness × saturation dose required per unit thickness). The maximum allowable adhesive layer thickness can be obtained by reverse calculation based on the formula.

[0141] In the formula, the unit of final UV irradiation dose is mJ / cm², the unit of maximum allowable adhesive layer thickness is µm, and the unit of saturation dose required per unit thickness is mJ / (cm²·µm).

[0142] If the predicted dry adhesive layer thickness, converted from the current actual wet adhesive layer thickness, is greater than the maximum allowable adhesive layer thickness, then the current coating process is judged to be too thick.

[0143] Reduce the scraper gap or lower the feed pump speed to bring the actual wet adhesive layer thickness closer to the wet film thickness value corresponding to the maximum allowable adhesive layer thickness.

[0144] If the predicted dry adhesive layer thickness, converted from the current actual wet adhesive layer thickness, is less than the maximum allowable adhesive layer thickness, then the adhesive layer curing energy requirement is deemed too high, and the final UV irradiation dose is adjusted according to the current energy saturation index.

[0145] Specifically, the adjusted final UV irradiation dose = final UV irradiation dose × (saturation threshold / current predicted energy saturation index).

[0146] Specifically, this invention achieves precise feedforward control of the adhesive tape's anti-adhesion effect by establishing a prediction and control model for the main curing performance of the adhesive layer based on the "energy saturation index." It detects the UV transmittance of the adhesive layer online and, combined with a preset curing dose and adhesive layer thickness, calculates in real time the "theoretical effective UV dose" that can reach the bottom of the adhesive layer, thereby assessing its "energy saturation" relative to the material's inherent curing requirements. When an insufficient anti-adhesion risk is predicted, the root cause is automatically diagnosed: if it is "insufficient UV transmittance of the adhesive layer," intelligent compensation is used to increase the total dose of main UV irradiation; if it is "excessive curing requirements of the adhesive layer," the coating thickness is optimized online or the main curing dose is adjusted. This transforms post-event detection into pre-event prediction and online compensation, ensuring that UV light energy fully penetrates and cures the deepest part of the adhesive layer, thereby completely eliminating sticky residue during chip pickup and significantly improving dicing yield and packaging efficiency.

[0147] Obtain the measured peel force reduction rate after the adhesive layer has been cured, and establish a table showing the correspondence between the predicted energy saturation index and the measured peel force reduction rate.

[0148] If there is a risk of insufficient tack reduction during adhesive layer curing, and the measured peel force reduction rate of the current batch of adhesive layer is greater than the critical reduction rate, then the saturation threshold will be lowered. In practice, the saturation threshold will be adjusted to 1.15.

[0149] If the final tack reduction performance of the adhesive layer after curing is sufficient, and the measured peel force reduction rate of the current batch of adhesive layer is less than the standard reduction rate, then it is judged that the saturation dose calibration value required per unit thickness is too low, and the saturation dose required per unit thickness is increased by 5% during implementation.

[0150] The critical decline rate is 99%, and the standard decline rate is 95%.

[0151] Specifically, this invention achieves dynamic optimization and self-calibration of the prediction model for the main curing and tack reduction performance of the adhesive layer by constructing a complete data closed loop from prediction to verification. It correlates the online predicted "energy saturation index" with the "measured peel force reduction rate" of the finished tape. When the model prediction is risky but the measured performance is excellent, the judgment threshold is intelligently lowered to avoid over-conservatism; when the prediction is safe but the measured performance is insufficient, the key material parameter "required saturation dosage per unit thickness" is increased to correct the model deviation. By continuously iterating and optimizing the prediction algorithm using actual production data, the system possesses self-learning and evolution capabilities, significantly improving the accuracy of predicting the final tack reduction performance of the tape under different formulations and process conditions. This fundamentally ensures the stability and reliability of product performance and reduces quality fluctuations.

[0152] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of the present invention.

[0153] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for preparing a wafer dicing tape based on ultraviolet light curing, characterized in that, include: Obtain the baseline elongation rate corresponding to the current substrate thickness to determine the base film stretching risk coefficient, obtain the target dry adhesive layer thickness to determine the adhesive layer thickness coefficient, and determine the adhesive layer dynamic adhesion retention index based on the base film stretching risk coefficient and the adhesive layer thickness coefficient to determine the characteristic state of the tape parameters. In response to the predicted risk of insufficient adhesive adhesion due to expansion and stretching of the adhesive layer under the current characteristic state, the mass fraction of the adhesive formulation is adjusted according to the adjustment ratio to improve the initial adhesion. The pre-curing reactivity is obtained by adjusting the mass fraction to determine whether the pre-curing effect meets the standard. The curing output power is adjusted based on the actual cumulative UV pre-curing dose to predict whether the decrease in the adhesion of the main cured adhesive layer meets the standard. In response to the curing output power adjustment, the theoretical effective UV dose is obtained based on the UV transmittance of the adhesive layer and the final UV irradiation dose. Based on the theoretical effective UV dose and the saturation dose required per unit thickness, the energy saturation index is determined to determine whether there is a risk of insufficient tack reduction in the tack reduction performance of the main curing of the adhesive layer. Based on the theoretical effective UV dose, the theoretical energy transfer efficiency is quantified, and based on the energy transfer efficiency, the risk of insufficient viscosity reduction is determined to be insufficient UV transmittance of the adhesive layer or excessive curing demand of the adhesive layer. In response to the risk of insufficient viscosity reduction, adjust the coating parameters to obtain the maximum permissible adhesive layer thickness, or adjust the final UV irradiation dose based on the energy saturation index; The measured peel force reduction rate after the adhesive layer is cured is obtained, and the required saturation dosage per unit thickness is adjusted in combination with the anti-tack performance, and the saturation threshold of the anti-tack performance of the adhesive layer after curing is determined.

2. The method for preparing wafer dicing tape based on ultraviolet light curing according to claim 1, characterized in that, The process of determining the characteristic state of the tape parameter settings includes: When the dynamic tack retention index of the adhesive layer is greater than or equal to the first safety threshold, the tape parameters are determined to be set to the first characteristic state, which is that the adhesive layer of the current batch of tape is expected to provide sufficient adhesion after expansion and stretching. When the dynamic tack retention index of the adhesive layer is less than the first safety threshold and greater than or equal to the second safety threshold, the tape parameters are determined to be set to the second characteristic state. The second characteristic state is that the combination of the substrate thickness and the adhesive layer thickness of the current batch is in a critical state, and there is a risk of insufficient adhesive layer tack during expansion and stretching. When the dynamic adhesion retention index of the adhesive layer is less than the second safety threshold, the tape parameters are set to the third characteristic state. The third characteristic state is to predict that the adhesive layer adhesion will be insufficient after expansion and stretching under the current batch substrate thickness and adhesive layer thickness, and to provide a risk warning for the displacement of the wafer chip after cutting.

3. The method for preparing wafer dicing tape based on ultraviolet light curing according to claim 2, characterized in that, When the tape parameters are set to the second characteristic state, the acrylate polymer content is increased, and the adjustment ratio of the acrylate polymer is calculated based on the degree of deviation of the dynamic tack retention index of the adhesive layer from the first safety threshold.

4. The method for preparing wafer dicing tape based on ultraviolet light curing according to claim 3, characterized in that, The process of determining whether the pre-curing effect is ideal includes: If the pre-curing reactivity is greater than or equal to the first reaction threshold and less than or equal to the second reaction threshold, then the pre-curing effect is considered ideal. If the pre-curing reactivity is less than the first reaction threshold, it is determined that the pre-curing is insufficient, and there is a risk of adhesion when the composite release film is applied. If the pre-curing reactivity is greater than the second reaction threshold, it is determined that the pre-curing is excessive and the final viscosity reduction is incomplete.

5. The method for preparing wafer dicing tape based on ultraviolet light curing according to claim 4, characterized in that, If the actual cumulative UV pre-curing dose is lower than the target dose value when pre-curing is insufficient, the cause of insufficient pre-curing is determined to be insufficient energy input, and the output power of the UV lamp should be increased. If the actual cumulative UV pre-curing dose is higher than the target dose value when the pre-curing is excessive, the output power will be reduced according to the ratio of the actual cumulative UV pre-curing dose to the target dose value.

6. The method for preparing wafer dicing tape based on ultraviolet light curing according to claim 5, characterized in that, The process of predicting whether the decrease in adhesion after primary curing of the adhesive layer meets the standard includes: The UV transmittance of the adhesive layer is detected to calculate the theoretical effective UV dose, and the energy saturation index is determined based on the theoretical effective UV dose. If the energy saturation index is greater than or equal to the saturation threshold, it is determined that the final tack reduction performance of the predicted adhesive layer after primary curing is sufficient. If the energy saturation index is less than the saturation threshold, it is determined that there is a risk of insufficient viscosity reduction during the predicted primary curing of the adhesive layer.

7. The method for preparing wafer dicing tape based on ultraviolet light curing according to claim 6, characterized in that, When there is a risk of insufficient tack reduction during adhesive layer curing, the theoretical energy transfer efficiency is determined based on the theoretical effective UV dose to determine the cause of the risk of insufficient tack reduction. If the theoretical energy transfer efficiency is less than the historical low energy transfer efficiency, then the energy transfer efficiency of the adhesive layer is determined to be abnormally low, and the UV transmittance of the adhesive layer is insufficient. If the theoretical energy transfer efficiency is greater than or equal to the historical low energy transfer efficiency, the reason for the risk of insufficient viscosity reduction is that the curing requirement of the adhesive layer, which is jointly determined by the target dry adhesive layer thickness and the saturation dosage required per unit thickness, is too high.

8. The method for preparing wafer dicing tape based on ultraviolet light curing according to claim 7, characterized in that, When the UV transmittance of the adhesive layer is insufficient, the total dose of final UV irradiation is increased; When the curing requirement of the adhesive layer is too high, determine whether the adhesive layer applied in the coating process is too thick based on the maximum allowable adhesive layer thickness.

9. The method for preparing wafer dicing tape based on ultraviolet light curing according to claim 8, characterized in that, If the predicted dry adhesive layer thickness, converted from the current actual wet adhesive layer thickness, is greater than the maximum allowable adhesive layer thickness, then the current coating process is judged to be too thick. Reduce the scraper gap or reduce the feed pump speed so that the actual wet adhesive layer thickness is close to the wet film thickness value corresponding to the maximum allowable adhesive layer thickness; If the predicted dry adhesive layer thickness, converted from the actual wet adhesive layer thickness, is less than the maximum allowable adhesive layer thickness, then the curing energy requirement for the adhesive layer is deemed too high, and the final UV irradiation dose is adjusted based on the current energy saturation index.

10. The method for preparing wafer dicing tape based on ultraviolet light curing according to claim 9, characterized in that, If there is a risk of insufficient tack reduction during adhesive layer curing, and the measured peel force reduction rate of the current batch of adhesive layer is greater than the critical reduction rate, then the saturation threshold should be lowered. If the final tack reduction performance of the adhesive layer after curing is sufficient, and the measured peel force reduction rate of the current batch of adhesive layer is less than the standard reduction rate, then it is determined that the saturation dose calibration value required per unit thickness is too low, and the saturation dose required per unit thickness is increased.

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