A surface acoustic wave device

Abstract

This invention discloses a surface acoustic wave (SAW) device, comprising: a resonant filter element including multiple parallel resonators, one end of which is connected to at least one ground port; wherein at least two of the parallel resonators are connected to the same ground port, and the ground port connected to the at least two parallel resonators is a common ground port; and a packaging substrate located on one side of the resonant filter element; the packaging substrate includes a first substrate, which includes a common ground region and at least one independent cut-out region; the independent cut-out region is correspondingly disposed to at least one of the common ground ports and connected to the corresponding common ground port; the independent cut-out region is connected to the common ground region through a connecting portion, the extension direction of which is perpendicular to the SAW propagation direction of the SAW device. This invention improves the isolation performance of the device.

Description

Technical Field

[0001] This invention relates to the field of microelectronics technology, and more particularly to a surface acoustic wave device. Background Technology

[0002] Surface acoustic wave (SAW) filters have advantages such as low cost, small size, superior performance, and reliable quality, and have been widely used in mobile communications, navigation, and new energy vehicles. Currently, the development trend of SAW filters is miniaturization and multifunctionality. Reducing package size means gradually reducing chip design size. Smaller sizes not only reduce costs but also increase the chip's integration in applications; therefore, small-size solutions are the future trend for filters.

[0003] For duplexers and multiplexers composed of surface acoustic wave filters, the smaller the distance between the transmitter and receiver, the more severe the coupling crosstalk between the resonators, and the worse the product's isolation performance, resulting in failure to meet customer needs. Summary of the Invention

[0004] This invention provides a surface acoustic wave device to solve the problem of severe coupling crosstalk between resonators.

[0005] In a first aspect, the present invention provides a surface acoustic wave (SAW) device, the SAW device comprising:

[0006] The resonant filter includes multiple parallel resonators, one end of which is connected to at least one ground port; wherein, at least two of the multiple parallel resonators are connected to the same ground port, and the ground port connected to the at least two parallel resonators is a common ground port.

[0007] The packaging substrate is located on one side of the resonant filter. The packaging substrate includes a first substrate, which includes a common ground area and at least one independent cut area. The independent cut area is correspondingly disposed with at least one of the common ground ports and is connected to the corresponding common ground port. The independent cut area is connected to the common ground area through a connecting part, and the extension direction of the connecting part is perpendicular to the surface acoustic wave propagation direction of the surface acoustic wave device.

[0008] Optionally, the number of independent cut zones is less than or equal to the number of common grounding ports.

[0009] Optionally, the connecting portion extends from the edge of the independent cut area to the edge of the common connection area, with the extension direction facing the middle area of ​​the first substrate.

[0010] Optionally, the resonant filter may also include multiple series resonators, a transmit port, and a receive port;

[0011] Multiple series resonators are connected in series between the transmitting port and the receiving port, the first end of multiple parallel resonators is connected to the connection node of multiple series resonators, and the second end of multiple parallel resonators is connected to at least one ground port.

[0012] The first substrate further includes a transmitting conductive area and a receiving conductive area, wherein the transmitting conductive area, the receiving conductive area, the common ground area and the independent cut area are arranged alternately; the transmitting conductive area is correspondingly arranged and connected to the transmitting port, and the receiving conductive area is correspondingly arranged and connected to the receiving port.

[0013] The extension direction of the connector is perpendicular to the direction from the transmitting conductive area to the receiving conductive area.

[0014] Optionally, the resonant filter may also include an antenna port;

[0015] The resonant filter body consists of a series resonator and a parallel resonator connected to the series resonator to form a transmitting filter unit, and the remaining series resonators and the parallel resonators connected to the remaining series resonators to form a receiving filter unit. The first end of the transmitting filter unit is connected to the transmitting port, and the second end of the transmitting filter unit is connected to the antenna port. The first end of the receiving filter unit is connected to the antenna port, and the second end of the receiving filter unit is connected to the receiving port.

[0016] The first substrate includes an antenna conductive area, an antenna conductive area, a transmitting conductive area, a receiving conductive area, a common ground area, and an independent cut-off area, which are arranged at intervals; the antenna conductive area is correspondingly arranged and connected to the antenna port.

[0017] Optionally, the top view shape of the independently cut area includes polygons or circles.

[0018] Optionally, the surface acoustic wave device further includes: a first conductive connector; the first conductive connector is disposed between the resonant filter and the first substrate; the first conductive connector is disposed in a one-to-one correspondence with the grounding port, and the first conductive connector is used to connect the grounding port and the common grounding area; or, the first conductive connector is used to connect the common grounding port and the independent cut area.

[0019] Optionally, the surface acoustic wave device further includes: a second conductive connector, a third conductive connector, and a fourth conductive connector;

[0020] The second, third, and fourth conductive connectors are disposed between the resonant filter and the first substrate; the second conductive connector is disposed corresponding to the transmitting port and is used to connect the transmitting port and the transmitting conductive area; the third conductive connector is disposed corresponding to the receiving port and is used to connect the receiving port and the receiving conductive area; the fourth conductive connector is disposed corresponding to the antenna port and is used to connect the antenna port and the antenna conductive area.

[0021] Optionally, the transmitting conductive region and the receiving conductive region are located on opposite sides of the first side of the first substrate, and the antenna conductive region is located in the middle region of the second side of the first substrate.

[0022] The common ground area is located on both sides of the antenna conductive area, between the transmitting conductive area and the receiving conductive area, and on the side of the transmitting conductive area and the receiving conductive area close to the antenna conductive area, and the common ground area is connected; the side of the common ground area between the transmitting conductive area and the receiving conductive area away from the antenna conductive area, the side of the common ground area on the first side of the antenna conductive area away from the receiving conductive area, and / or the side of the common ground area on the second side of the antenna conductive area away from the transmitting conductive area is provided with at least one independent cut area.

[0023] Optionally, a first enclosing groove is provided in the common grounding area on the first side of the antenna conductive area, a second enclosing groove is provided in the common grounding area on the second side of the antenna conductive area, and / or a third enclosing groove is provided in the common grounding area between the transmitting conductive area and the receiving conductive area;

[0024] The first enclosing groove extends away from the antenna conductive area along the edge of the common ground area closest to the antenna conductive area; the second enclosing groove extends away from the antenna conductive area along the edge of the common ground area closest to the antenna conductive area; the antenna conductive area is located between the first enclosing groove and the second enclosing groove; the third enclosing groove extends away from the antenna conductive area along the side closest to the antenna conductive area, and the common ground area surrounds the third enclosing groove on all four sides.

[0025] At least one independent cut area is provided in the first enclosing groove, the second enclosing groove, and / or the third enclosing groove, and a common contact area between the antenna conductive area, the transmitting conductive area, and the receiving conductive area is connected to the independent cut area.

[0026] In the technical solution of this invention, at least one of the common ground ports connected to at least two parallel resonators in the resonant filter can be correspondingly provided with an independent cut-out region, and the independent cut-out region is connected to the corresponding common ground port. The independent cut-out region is then connected to the common ground port through a connecting part, and the extension direction of the connecting part must be perpendicular to the surface acoustic wave propagation direction of the surface acoustic wave device. Based on existing feasible manufacturing processes, this invention uses a new cut-out structure on the first substrate, with a separately designed small cut-out module, which is then connected to the ground, and its connection method is set to be perpendicular to the signal transmission direction. This invention can reduce the isolation suppression sensitivity caused by two or more parallel resonators sharing a common ground, and can also significantly improve the isolation between the transmitter and receiver of the device.

[0027] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the film cross-sectional structure of a surface acoustic wave device provided in an embodiment of the present invention;

[0030] Figure 2 This is a schematic diagram of the circuit topology of a surface acoustic wave device provided in an embodiment of the present invention;

[0031] Figure 3 This is a schematic diagram of the circuit topology of another surface acoustic wave device provided in an embodiment of the present invention;

[0032] Figure 4 This is a schematic diagram of the circuit topology of another surface acoustic wave device provided in an embodiment of the present invention;

[0033] Figure 5 This is a top view of a first substrate provided in an embodiment of the present invention;

[0034] Figure 6 This is a top view of another first substrate provided in an embodiment of the present invention;

[0035] Figure 7 This is a top view of yet another first substrate provided in an embodiment of the present invention;

[0036] Figure 8 This is a top view of yet another first substrate provided in an embodiment of the present invention;

[0037] Figure 9 This is a top view of yet another first substrate provided in an embodiment of the present invention;

[0038] Figure 10 This is a top view of a first substrate provided by related technologies;

[0039] Figure 11 This is a top view of another first substrate provided by related technologies;

[0040] Figure 12 This is one of the embodiments provided by the present invention. Figure 5 , Figure 8 , Figure 10 and Figure 11 A comparison chart of device isolation levels for different first substrates is provided.

[0041] Figure 13 This is one of the embodiments provided by the present invention. Figure 5 , Figure 8 , Figure 10 and Figure 11 A comparison chart of modern suppression for devices corresponding to different first substrates is provided. Detailed Implementation

[0042] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0043] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0044] Figure 1 This is a schematic diagram of the film cross-sectional structure of a surface acoustic wave device provided in an embodiment of the present invention. Figure 2 This is a schematic diagram of the circuit topology of a surface acoustic wave device provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of the circuit topology of another surface acoustic wave device provided in an embodiment of the present invention. Figure 4 This is a schematic diagram of the circuit topology of another surface acoustic wave device provided in an embodiment of the present invention. Figure 5 This is a top view of a first substrate provided in an embodiment of the present invention. Figure 6 This is a top view of another first substrate provided in an embodiment of the present invention. Figure 7 This is a top view of another first substrate provided in an embodiment of the present invention, wherein, Figure 1 The cross-sectional view of the first substrate 10 in the middle is along Figure 5 It was obtained by cutting along the dashed line AB in the middle; Figure 2 , Figure 3 or Figure 4The circuit topology 31 of the surface acoustic wave device shown can be integrated and fabricated on... Figure 1 An integrated chip is formed on the resonant filter 30 shown. For example... Figures 1-7 As shown, the surface acoustic wave (SAW) device includes: a resonant filter 30, which includes a plurality of parallel resonators 12, one end of which is connected to at least one ground port GND. At least two of the parallel resonators 12 are connected to the same ground port GND, and the ground port GND connected to the at least two parallel resonators 12 is a common ground port. A packaging substrate is located on one side of the resonant filter 30. The packaging substrate includes a first substrate 10, which includes a common ground area 21 and at least one independent cut area 20. The independent cut area 20 is correspondingly disposed to at least one of the common ground ports and is connected to the corresponding common ground port. The independent cut area 20 is connected to the common ground area 21 via a connecting portion 23, the extension direction of which is perpendicular to the SAW propagation direction of the SAW device.

[0045] Specifically, the surface acoustic wave (SAW) devices provided in the embodiments of the present invention may include SAW filters, SAW duplexers, or SAW multiplexers, etc. Figures 2-4 Three exemplary circuit topologies for surface acoustic wave duplexers are shown. Figures 2-4 The circuit topology of the surface acoustic wave duplexer shown can be integrated and fabricated on... Figure 1 The resonant filter element 30 shown is used. In some embodiments of the present invention... Figure 1 The circuit topology of devices such as surface acoustic wave filters or surface acoustic wave multiplexers can also be integrated on the resonant filter 30 shown, without specific limitations here.

[0046] The resonant filter element 30 can include multiple parallel resonators 12, one end of which can be connected to one or more grounding ports GND. For example,... Figures 1-4 As shown, the resonant filter 30 can integrate a transmitting filter unit 13 and a receiving filter unit 14. The transmitting filter unit 13 may include three parallel resonators 12, and the receiving filter unit 14 may include four parallel resonators. In some embodiments of the present invention, the number of parallel resonators 12 in the resonant filter 30 can be arbitrarily set according to actual conditions, and no specific limitation is made here. Figure 2 One end of the parallel resonator 12 in the transmitting filter unit 13 and one of the parallel resonators 12 in the receiving filter unit 14 can be connected to the first ground port GND1, and one end of the remaining parallel resonators 12 in the receiving filter unit 14 can be connected to the second ground port GND2. Figure 3One end of the parallel resonator 12 in the transmitting filter unit 13 shown can be connected to the first ground port GND1, one end of the parallel resonator 12 in the receiving filter unit 14 can be connected to the third ground port GND3, and one end of the remaining parallel resonators 12 in the receiving filter unit 14 can be connected to the second ground port GND2. Figure 4 One end of each of the two parallel resonators 12 in the transmitting filter unit 13 can be connected to the first ground port GND1. One end of the remaining parallel resonator 12 in the transmitting filter unit 13 and one parallel resonator 12 in the receiving filter unit 14 can be connected to the third ground port GND3. One end of the remaining parallel resonators 12 in the receiving filter unit 14 can be connected to the second ground port GND2. In some embodiments of the present invention, the number of ground ports GND connected to the parallel resonators 12 in the resonant filter body 30 and the connection configuration with the parallel resonators 12 can be arbitrarily set.

[0047] At least two parallel resonators 12 in the resonant filter element 30 can be connected to the same ground port GND, for example. Figure 2 Of the seven parallel resonators 12 shown, four are connected to the same first ground port GND1, and three are connected to the same second ground port GND2. Figure 2 Both the first grounding port GND1 and the second grounding port GND2 can be used as common grounding ports. Figure 3 Of the seven parallel resonators 12 shown, three are connected to the same first ground port GND1, three are connected to the same second ground port GND2, and one is connected to the third ground port GND3. Figure 3 The first grounding port GND1 and the second grounding port GND2 can be used as a common grounding port. Figure 4 Of the seven parallel resonators 12 shown, two parallel resonators 12 are connected to the same first ground port GND1, three parallel resonators 12 are connected to the same second ground port GND2, and two parallel resonators 12 are connected to the same third ground port GND3. Figure 3 The first grounding port GND1, the second grounding port GND2, and the third grounding port GND3 can all be used as a common grounding port. As the size of surface acoustic wave devices continues to shrink, parallel resonators 12 connected to the same grounding port GND may generate coupling crosstalk, resulting in poor isolation performance of the product and thus failing to meet customer requirements.

[0048] To avoid coupling crosstalk between parallel resonators 12 connected to the same ground port GND, this embodiment of the invention, based on existing feasible manufacturing processes, provides at least one independent cut-out region 20 in the first substrate 10 of the packaging substrate. That is, if coupling crosstalk occurs between parallel resonators 12 connected to a common ground port, an independent cut-out region 20 corresponding to this common ground port can be provided in the first substrate 10. For example, this is integrated onto the resonant filter element 30. Figure 2 When the circuit topology 31 of the surface acoustic wave device is shown, the structure of the first substrate 10 can be as follows: Figure 5 As shown, whether coupling crosstalk occurs in the parallel resonator 12 connected to the common ground port can be obtained using simulation measurement methods. Figure 2 The parallel resonator 12 connected to the first ground port GND1 shown in the diagram can be free from coupling crosstalk, while the parallel resonator 12 connected to the second ground port GND2 will experience coupling crosstalk. The second ground port GND2 can be located in the upper left region of the top view of the resonant filter 30, and the first ground port GND1 can be located in the upper right region of the top view of the resonant filter 30. Figure 5 The first substrate 10 shown has a first independent cut area 22 corresponding to the second ground port GND2, while the first ground port GND1 does not need to have a corresponding independent cut area 20. The first independent cut area 22 can be connected to the common ground area 21 through the connecting part 23. The second ground port GND2 can be connected to the first independent cut area 22, and the first ground port GND1 can be directly connected to the common ground area 21.

[0049] For example, an integrated configuration is provided on the resonant filter element 30. Figure 3 When the circuit topology 31 of the surface acoustic wave device is shown, the structure of the first substrate 10 can be as follows: Figure 6 As shown, Figure 3 The parallel resonator 12 connected to the first ground port GND1 can experience coupling crosstalk, as can the parallel resonator 12 connected to the second ground port GND2. However, only one parallel resonator 12 is connected to the third ground port GND3, and therefore no coupling crosstalk occurs. The second ground port GND2 can be located in the upper left region of the top view of the resonant filter 30, and the first ground port GND1 can be located in the upper right region of the top view of the resonant filter 30. Figure 6The first substrate 10 shown has a first independent cut area 22 corresponding to the second ground port GND2, and a second independent cut area 27 corresponding to the first ground port GND1. Both the first independent cut area 22 and the second independent cut area 27 can be connected to the common ground area 21 via the connecting part 23. The second ground port GND2 can be connected to the first independent cut area 22, and the first ground port GND1 can be connected to the second independent cut area 27. The third ground port GND3 can be directly connected to the common ground area 21.

[0050] For example, an integrated configuration is provided on the resonant filter element 30. Figure 4 When the circuit topology 31 of the surface acoustic wave device is shown, the structure of the first substrate 10 can be as follows: Figure 7 As shown, Figure 4 The parallel resonator 12 connected to the first ground port GND1, the parallel resonator 12 connected to the second ground port GND2, and the parallel resonator 12 connected to the third ground port GND3 can all experience coupling crosstalk. The second ground port GND2 can be located in the upper left region of the top view of the resonant filter 30, and the first ground port GND1 can be located in the upper right region of the top view of the resonant filter 30, or in the lower middle region of the top view of the resonant filter 30. Figure 7 The first substrate 10 shown has a first independent cut area 22 corresponding to the second ground port GND2, a second independent cut area 27 corresponding to the first ground port GND1, and a third independent cut area 28 corresponding to the third ground port GND3. The first independent cut area 22, the second independent cut area 27, and the third independent cut area 28 can all be connected to a common ground area 21 via a connecting portion 23. The second ground port GND2 can be connected to the first independent cut area 22, the first ground port GND1 can be connected to the second independent cut area 27, and the third ground port GND3 can be connected to the third independent cut area 28.

[0051] As described above, at least one of the common grounding ports in the resonant filter 30, which are connected to at least two parallel resonators 12, can be correspondingly provided with an independent cut-off region 20, and the independent cut-off region 20 is connected to the corresponding common grounding port. The independent cut-off region 20 is connected to the common grounding region 21 via a connecting part 23. Simultaneously, the extending direction of the connecting part 23 must be perpendicular to the surface acoustic wave propagation direction of the surface acoustic wave device. In the vertical direction, the independent cut-off region 20 can move left and right without being fixed. For example, as... Figures 5-7As shown, the receiving conductive area 25 in the first substrate 10 can be set to correspond to the receiving port RX, and the transmitting conductive area 24 can be set to correspond to the transmitting port TX. That is, the surface acoustic wave propagation direction of the surface acoustic wave device is the first direction X. At this time, the extension direction of the connecting part 23 needs to be set to the second direction Y, and the first direction X is perpendicular to the second direction Y. In some embodiments of the present invention, the surface acoustic wave propagation direction of the surface acoustic wave device can also be the second direction Y or other arbitrary directions, and the extension direction of the connecting part 23 can be the first direction X or other directions perpendicular to the surface acoustic wave propagation direction.

[0052] By setting the extension direction of the connecting part 23 perpendicular to the surface acoustic wave propagation direction of the surface acoustic wave device, and setting the current direction and acoustic direction of the first substrate 10 orthogonal, the orthogonal decoupling of the electric field and sound field is utilized to cut off the path for the electrical signal to directly "take a shortcut" to the output end, forcing the signal to be transmitted only through acoustic conversion. This eliminates electromagnetic feedthrough caused by parasitic capacitance or electromagnetic field coupling on the substrate, blocking the direct transmission of electromagnetic waves. Therefore, the output end can only receive the signal after acoustic delay and filtering, effectively avoiding coupling crosstalk generated by the parallel resonators 12 connected to the same ground port GND, and greatly improving the isolation of the surface acoustic wave device.

[0053] In the technical solution of this invention embodiment, at least one of the common grounding ports in the resonant filter 30 connected to at least two parallel resonators 12 can be correspondingly provided with an independent cut-out region 20, and the independent cut-out region 20 is connected to the corresponding common grounding port. The independent cut-out region 20 is also connected to the common grounding region 21 through a connecting part 23, and the extension direction of the connecting part 23 must be perpendicular to the surface acoustic wave propagation direction of the surface acoustic wave device. Based on existing feasible manufacturing processes, this invention embodiment adopts a new cut-out structure for the first substrate 10, with a separately designed small cut-out module, which is then connected to the ground, and its connection method is set to be perpendicular to the signal transmission direction. This invention embodiment can reduce the isolation suppression sensitivity caused by two or more parallel resonators 12 sharing a common ground, and can also significantly improve the isolation between the transmitter and receiver of the device.

[0054] Optionally, based on the above embodiments, refer to... Figures 1-7 The number of independent cut areas 20 is less than or equal to the number of common grounding ports.

[0055] Specifically, at least two parallel resonators 12 in the resonant filter 30 can be connected to the same ground port GND, and the ground port GND connected to the at least two parallel resonators 12 can serve as a common ground port. To avoid coupling crosstalk between the parallel resonators 12 connected to the same ground port GND, this embodiment of the invention, based on existing feasible manufacturing processes, separately provides at least one independent cut area 20 in the first substrate 10 of the packaging substrate. That is, if coupling crosstalk occurs between the parallel resonators 12 connected to the common ground port, an independent cut area 20 corresponding to this common ground port can be provided in the first substrate 10.

[0056] At least one of the common grounding ports connected to at least two parallel resonators 12 in the resonant filter 30 can be provided with an independent cut area 20. That is, when at least two parallel resonators 12 connected to the common grounding port are coupled and crosstalk occurs, an independent cut area 20 is provided for this common grounding port. If at least two parallel resonators 12 connected to the common grounding port are not coupled and crosstalk occurs, an independent cut area 20 is not required for this common grounding port. The number of independent cut areas 20 can be less than or equal to the number of common grounding ports.

[0057] The independent cut-out region 20 is connected to the common ground region 21 via the connecting part 23, and the extension direction of the connecting part 23 must be perpendicular to the surface acoustic wave propagation direction of the surface acoustic wave device. This embodiment of the invention can reduce the isolation suppression sensitivity caused by two or more parallel resonators 12 sharing a common ground, and can also significantly improve the isolation between the transmitter and receiver of the device.

[0058] Optionally, based on the above embodiments, such as Figures 1-7 As shown, the connecting portion 23 extends from the edge of the independent cut area 20 to the edge of the common connection area 21, with the extending direction toward the middle region of the first substrate 10.

[0059] Specifically, Figure 8 This is a top view of another first substrate provided in an embodiment of the present invention, such as... Figures 1-8 As shown, in this embodiment of the invention, the connecting portion 23 extends from the edge of the independent cutting area 20 to the edge of the common contact area 21. The extending direction can be toward the middle area of ​​the first substrate 10, or the extending direction can be away from the middle area of ​​the first substrate 10.

[0060] In the case where the extension direction is towards the middle region of the first substrate 10, the ground return current of each parallel resonator 12 can be made to flow into the common ground along the shortest and most symmetrical path, which greatly reduces the ground parasitic inductance and ground loop area, reduces the resonant frequency shift and crosstalk caused by the ground return asymmetry, and effectively suppresses the interference superposition between multiple ground return paths and the ground bounce effect, thereby significantly reducing the isolation suppression sensitivity caused by multiple parallel resonators sharing the same ground, and improving the transmit and receive isolation and operating stability of the surface acoustic wave device.

[0061] Optionally, based on the above embodiments, refer to... Figures 1-7 The resonant filter 30 also includes multiple series resonators 11, a transmit port TX, and a receive port RX. The multiple series resonators 11 are connected in series between the transmit port TX and the receive port RX. The first ends of multiple parallel resonators 12 are connected to the connection nodes of the multiple series resonators 11, and the second ends of the multiple parallel resonators 12 are connected to at least one ground port GND. The first substrate 10 also includes a transmit conductive region 24 and a receive conductive region 25. The transmit conductive region 24, the receive conductive region 25, a common ground area 21, and an independent cut area 20 are spaced apart. The transmit conductive region 24 is correspondingly arranged and connected to the transmit port TX, and the receive conductive region 25 is correspondingly arranged and connected to the receive port RX. The extending direction of the connecting portion 23 is perpendicular to the direction from the transmit conductive region 24 to the receive conductive region 25. The resonant filter 30 also includes an antenna port ANT. A portion of the series resonators 11 and the parallel resonators 12 connected to the series resonators 11 constitute a transmitting filter unit 13. The remaining portion of the series resonators 11 and the parallel resonators 12 connected to the remaining portion of the series resonators 11 constitute a receiving filter unit 14. The first end of the transmitting filter unit 13 is connected to the transmitting port TX, and the second end of the transmitting filter unit 13 is connected to the antenna port ANT. The first end of the receiving filter unit 14 is connected to the antenna port ANT, and the second end of the receiving filter unit 14 is connected to the receiving port RX. The first substrate 10 includes an antenna conductive region 26, and the antenna conductive region 26, the transmitting conductive region 24, the receiving conductive region 25, the common ground region 21, and the independently cut region 20 are spaced apart. The antenna conductive region 26 is correspondingly disposed and connected to the antenna port ANT.

[0062] Specifically, Figures 2-4 Three exemplary circuit topologies for surface acoustic wave duplexers are shown. Figures 2-4 The circuit topology of the surface acoustic wave duplexer shown can be integrated and fabricated on... Figure 1 The resonant filter element 30 shown is used. In some embodiments of the present invention... Figure 1 The circuit topology of devices such as surface acoustic wave filters or surface acoustic wave multiplexers can also be integrated on the resonant filter 30 shown, without specific limitations here.

[0063] The resonant filter 30 can integrate a series resonator 11, a parallel resonator 12, a transmit port TX, a receive port RX, and an antenna port ANT. Multiple series resonators 11 are connected in series between the transmit port TX and the receive port RX. The first end of multiple parallel resonators 12 is connected to the connection node of the multiple series resonators 11, and the second end of the multiple parallel resonators 12 is connected to at least one ground port GND. The transmit port TX can be located in the lower right region of the top view of the resonant filter 30, the receive port RX can be located in the lower left region of the top view of the resonant filter 30, and the antenna port ANT can be located in the upper middle region of the top view of the resonant filter 30.

[0064] The series resonator 11 connected between the transmit port TX and the antenna port ANT, and the parallel resonator 12 connected to the connection node of the series resonator, can constitute the transmit filter unit 13. The series resonator 11 connected between the receive port RX and the antenna port ANT, and the parallel resonator 12 connected to the connection node of the series resonator, can constitute the receive filter unit 14.

[0065] The first substrate 10 also includes a transmitting conductive region 24, a receiving conductive region 25, and an antenna conductive region 26. The antenna conductive region 26, the transmitting conductive region 24, the receiving conductive region 25, the common ground area 21, and the independent cut area 20 are arranged at intervals. The transmitting conductive region 24 is correspondingly arranged and connected to the transmitting port TX, the receiving conductive region 25 is correspondingly arranged and connected to the receiving port RX, and the antenna conductive region 26 is correspondingly arranged and connected to the antenna port ANT.

[0066] In this embodiment of the invention, the extending direction of the connecting portion 23 is perpendicular to the direction from the transmitting conductive region 24 to the receiving conductive region 25, that is, the extending direction of the connecting portion 23 is perpendicular to the propagation direction of the surface acoustic wave. For example, as... Figures 5-7 As shown, the surface acoustic wave (SAW) propagation direction of the SAW device can be a first direction X. In this case, the extension direction of the connecting portion 23 needs to be a second direction Y, where the first direction X is perpendicular to the second direction Y. In some embodiments of the present invention, the SAW propagation direction of the SAW device can also be the second direction Y or any other direction, and the extension direction of the connecting portion 23 can be the first direction X or other directions perpendicular to the SAW propagation direction. The embodiments of the present invention can reduce the isolation suppression sensitivity caused by two or more parallel resonators 12 sharing a common ground, and can also significantly improve the isolation between the transmitter and receiver of the device.

[0067] Optionally, based on the above embodiments, Figure 9 This is a top view of another first substrate provided in an embodiment of the present invention, such as... Figures 1-9 As shown, the top view of the independent cut region 20 includes polygons or circles.

[0068] Specifically, the top view shape of the independent cut area 20 can include any regular or irregular shape such as polygons or circles, without any specific limitation.

[0069] Optionally, based on the above embodiments, refer to... Figures 1-7 The surface acoustic wave (SAW) device further includes: a first conductive connector 41, a second conductive connector (not shown in the figure), a third conductive connector (not shown in the figure), and a fourth conductive connector 42. The first conductive connector 41, the second conductive connector (not shown in the figure), the third conductive connector (not shown in the figure), and the fourth conductive connector 42 are disposed between the resonant filter 30 and the first substrate 10. The first conductive connector 41 is configured one-to-one with the ground port GND, and is used to connect the ground port GND to the common ground area 21; or, the first conductive connector 41 is used to connect the common ground port to the independent cut area 20. The second conductive connector is configured corresponding to the transmitting port TX, and is used to connect the transmitting port TX to the transmitting conductive area 24. The third conductive connector is configured corresponding to the receiving port RX, and is used to connect the receiving port RX to the receiving conductive area 25. The fourth conductive connector 42 is configured corresponding to the antenna port ANT, and is used to connect the antenna port ANT to the antenna conductive area 26.

[0070] Specifically, the surface acoustic wave (SAW) device may further include a first conductive connector 41, a second conductive connector (not shown in the figure), a third conductive connector (not shown in the figure), and a fourth conductive connector 42. All four conductive connectors 41, 42, and 42 are disposed between the resonant filter 30 and the first substrate 10. The first conductive connector 41 can be configured one-to-one with the ground port GND, enabling the connection between the ground port GND and the independent cut-off area 20 or the common ground area 21. The second conductive connector can be configured one-to-one with the transmitting port TX, enabling the connection between the transmitting port TX and the transmitting conductive area 24. The third conductive connector can be configured one-to-one with the receiving port RX, enabling the connection between the receiving port RX and the receiving conductive area 25. The fourth conductive connector 42 can be configured one-to-one with the antenna port ANT, enabling the connection between the antenna port ANT and the antenna conductive area 26.

[0071] Optionally, based on the above embodiments, refer to... Figures 1-7The transmitting conductive region 24 and the receiving conductive region 25 are located on opposite sides of the first side of the first substrate 10, and the antenna conductive region 26 is located in the middle region of the second side of the first substrate 10. A common ground area 21 is located on both sides of the antenna conductive region 26, between the transmitting conductive region 24 and the receiving conductive region 25, and on the side of the transmitting conductive region 24 and the receiving conductive region 25 closest to the antenna conductive region 26, and the common ground area 21 is connected. At least one independent cut-out area 20 is provided on the side of the common ground area 21 between the transmitting conductive region 24 and the receiving conductive region 25 away from the antenna conductive region 26, on the side of the common ground area 21 on the first side of the antenna conductive region 26 away from the receiving conductive region 25, and / or on the side of the common ground area 21 on the second side of the antenna conductive region 26 away from the transmitting conductive region 24.

[0072] Specifically, the transmitting conductive region 24 in the first substrate 10 can be located in the lower right region of the first substrate 10, the receiving conductive region 25 can be located in the lower left region of the first substrate 10, and the antenna conductive region 26 can be located in the upper middle region of the first substrate 10. A connected common ground area 21 can be located between the receiving conductive region 25 and the transmitting conductive region 24, on both sides of the antenna conductive region 26, on the side of the receiving conductive region 25 closest to the antenna conductive region 26, and on the side of the transmitting conductive region 24 closest to the antenna conductive region 26. In some embodiments of the present invention, the positions of the transmitting conductive region 24, the receiving conductive region 25, the antenna conductive region 26, and the common ground area 21 can be arbitrarily set according to actual conditions, and are not specifically limited here.

[0073] In this embodiment of the invention, one or more independent cut-out regions 20 may be provided on the side of the common ground region 21 between the transmitting conductive region 24 and the receiving conductive region 25 away from the antenna conductive region 26; one or more independent cut-out regions 20 may be provided on the side of the common ground region 21 on one side of the antenna conductive region 26 away from the receiving conductive region 25; and / or one or more independent cut-out regions 20 may also be provided on the side of the common ground region 21 on the other two sides of the antenna conductive region 26 away from the transmitting conductive region 24. In some embodiments of the invention, the number and position of the independent cut-out regions 20 can be arbitrarily set according to actual conditions, and are not specifically limited here. The independent cut-out regions 20 are connected to the common ground region 21 through the connecting part 23, ensuring that the extension direction of the connecting part 23 is perpendicular to the surface acoustic wave propagation direction of the surface acoustic wave device. This embodiment of the invention can reduce the isolation suppression sensitivity caused by two or more parallel resonators 12 sharing a common ground, and can also significantly improve the isolation from the transmitting end to the receiving end of the device.

[0074] Optionally, based on the above embodiments, refer to... Figures 1-7A first enclosing groove 51 is provided on the common ground area 21 on the first side of the antenna conductive area 26, a second enclosing groove 52 is provided on the common ground area 21 on the second side of the antenna conductive area 26, and / or a third enclosing groove 53 is provided on the common ground area 21 between the transmitting conductive area 24 and the receiving conductive area 25. The first enclosing groove 51 extends away from the antenna conductive area 26 along the edge of the common ground area 21 closest to the antenna conductive area 26; the second enclosing groove 52 extends away from the antenna conductive area 26 along the edge of the common ground area 21 closest to the antenna conductive area 26; the antenna conductive area 26 is located between the first enclosing groove 51 and the second enclosing groove 52. The third enclosing groove 53 extends away from the antenna conductive area 26 along the side closest to the antenna conductive area 26, and the common ground area 21 surrounds the third enclosing groove 53 on all four sides. At least one independent cut area 20 is provided in the first enclosing groove 51, the second enclosing groove 52, and / or the third enclosing groove 53, and a common contact area 21 between the antenna conductive area 26, the transmitting conductive area 24, and the receiving conductive area 25 is connected to the independent cut area 20.

[0075] Specifically, a first enclosing groove 51, a second enclosing groove 52, and / or a third enclosing groove 53 may be provided in the common grounding area 21. The common grounding area 21 on one side of the antenna conductive area 26 may be provided with a first enclosing groove 51, and the common grounding area 21 on one side of the antenna conductive area 26 may surround the first enclosing groove 51 on three sides. The common grounding area 21 on the other side of the antenna conductive area 26 may also be provided with a second enclosing groove 52, and the common grounding area 21 on the other side of the antenna conductive area 26 may surround the second enclosing groove 52 on three sides. And / or, the common grounding area 21 between the transmitting conductive area 24 and the receiving conductive area 25 may also be provided with a third enclosing groove 53, and the common grounding area 21 between the transmitting conductive area 24 and the receiving conductive area 25 may surround the third enclosing groove 53 on four sides. The first substrate 10 provided in this embodiment of the invention can be provided with any one, any two, or three of the first enclosing groove 51, the second enclosing groove 52, and the third enclosing groove 53. The positions of the first enclosing groove 51, the second enclosing groove 52, and the third enclosing groove 53 can be arbitrarily set according to the actual situation, and no specific limitation is made here.

[0076] Independent cut-out regions 20 can be provided within the enclosing groove in the common ground region 21. That is, in this embodiment of the invention, the number and position of the independent cut-out regions 20 to be provided in the first substrate 10 can be determined first, and then the common ground region 21 can be etched at the corresponding positions where the independent cut-out regions 20 need to be provided to form the enclosing groove. At least one independent cut-out region 20 can be provided in each enclosing groove. Each independent cut-out region 20 can be connected to the common ground region 21 between the antenna conductive region 26, the transmitting conductive region 24, and the receiving conductive region 25, such that the extension direction of the connection portion 23 connecting the independent cut-out region 20 and the common ground region 21 is perpendicular to the surface acoustic wave propagation direction. This embodiment of the invention can reduce the isolation suppression sensitivity caused by two or more parallel resonators 12 sharing a common ground, and can also significantly improve the isolation from the transmitting end to the receiving end of the device.

[0077] Figure 10 This is a top view of a first substrate provided by related technologies. Figure 11 This is a top view of another first substrate provided by related technologies. Figure 12 This is one of the embodiments provided by the present invention. Figure 5 , Figure 8 , Figure 10 and Figure 11 A comparison chart of device isolation levels for different first substrates is provided. Figure 13 This is one of the embodiments provided by the present invention. Figure 5 , Figure 8 , Figure 10 and Figure 11 A comparison chart of modern suppression for devices corresponding to different first substrates is provided, such as... Figure 10 As shown, the related technology does not have an independently segmented area structure; it uses a conventional common ground substrate structure. It includes a transmitting conductive area 24, a receiving conductive area 25, an antenna conductive area 26, and a single, continuous common ground area 21. (See diagram below.) Figure 11 As shown, the related technology provides an independent cut area 20, which is connected to a common contact area 21 via a connecting part 23, but the extending direction of the connecting part 23 is parallel to the propagation direction of the surface acoustic wave.

[0078] like Figure 12 As shown in the figure, the horizontal axis represents frequency (freq) in MHz, and the vertical axis represents device isolation (ISO). A more negative ISO value indicates better isolation. (Including...) Figure 5 The isolation curve of the surface acoustic wave device on the first substrate 10 shown is curve B, which includes... Figure 8 The isolation curve of the surface acoustic wave device on the first substrate 10 shown is curve C, which includes... Figure 10 The isolation curve of the surface acoustic wave device of the first substrate 10 shown is curve A, which includes... Figure 11The isolation curve of the surface acoustic wave device on the first substrate 10 shown is curve D, which is derived from... Figure 12 It can be seen that, including Figure 5 The surface acoustic wave device on the first substrate 10 shown has the best isolation, including Figure 8 The isolation of the surface acoustic wave device on the first substrate 10 shown is slightly worse than that of the device including... Figure 5 The isolation of the surface acoustic wave device on the first substrate 10 shown, including... Figure 10 and Figure 11 The isolation of the surface acoustic wave device on the first substrate 10 shown is much worse than that of the device including... Figure 5 The isolation of the surface acoustic wave (SAW) device on the first substrate 10 is shown. It can be seen that by providing an independent cut-out region 20 and a connection portion 23 perpendicular to the SAW propagation direction, the isolation suppression sensitivity caused by the common ground of two or more parallel resonators 12 can be reduced, and the isolation from the transmitter to the receiver of the device can be significantly improved. Furthermore, by providing the connection portion 23 to extend from the edge of the independent cut-out region 20 to the edge of the common ground region 21, with the extension direction towards the middle region of the first substrate 10, the isolation of the device can be further improved.

[0079] like Figure 13 As shown in the figure, the horizontal axis represents frequency (freq) in MHz, and the vertical axis represents modern suppression (NB). A more negative NB value indicates better modern suppression. (Including...) Figure 5 The modern suppression curve of the surface acoustic wave device of the first substrate 10 shown is curve b, which includes... Figure 8 The modern suppression curve of the surface acoustic wave device of the first substrate 10 shown is curve c, which includes... Figure 10 The modern suppression curve of the surface acoustic wave device of the first substrate 10 shown is curve a, including... Figure 11 The modern suppression curve of the surface acoustic wave device of the first substrate 10 shown is curve d, which is derived from... Figure 13 It can be seen that, including Figure 5 The surface acoustic wave device on the first substrate 10 shown has the best modern suppression, including Figure 8 The surface acoustic wave device on the first substrate 10 shown has slightly worse modern suppression than that of devices including... Figure 5 The modern suppression of the surface acoustic wave device on the first substrate 10 shown, including... Figure 10 and Figure 11 The surface acoustic wave device on the first substrate 10 shown exhibits significantly worse modern suppression than devices including... Figure 5The first substrate 10 is shown to exhibit near-terminus suppression of the surface acoustic wave (SAW) device. It can be seen that by providing an independent cut area 20 and a connecting portion 23 perpendicular to the SAW propagation direction, the near-terminus suppression of the device can be effectively improved. Furthermore, by providing the connecting portion 23 to extend from the edge of the independent cut area 20 to the edge of the common contact area 21, with the extension direction towards the middle region of the first substrate 10, the near-terminus suppression of the device can be further improved.

[0080] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0081] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A surface acoustic wave device, characterized in that, include: A resonant filter element includes multiple parallel resonators, one end of which is connected to at least one ground port; wherein, at least two of the multiple parallel resonators are connected to the same ground port, and the ground port connected to the at least two parallel resonators is a common ground port. A packaging substrate is located on one side of the resonant filter; the packaging substrate includes a first substrate, the first substrate including a common ground area and at least one independent cut area; the independent cut area is correspondingly disposed to at least one of the common ground ports, and the independent cut area is connected to the corresponding common ground port; the independent cut area is connected to the common ground area through a connecting portion. The resonant filter also includes multiple series resonators, a transmitting port, and a receiving port; Multiple series resonators are connected in series between the transmitting port and the receiving port, the first end of multiple parallel resonators is connected to the connection node of multiple series resonators, and the second end of multiple parallel resonators is connected to at least one ground port; The first substrate further includes a transmitting conductive region and a receiving conductive region, wherein the transmitting conductive region, the receiving conductive region, the common ground region and the independent cut region are arranged at intervals; the transmitting conductive region is correspondingly arranged and connected to the transmitting port, and the receiving conductive region is correspondingly arranged and connected to the receiving port; The extending direction of the connecting portion is perpendicular to the direction from the transmitting conductive region to the receiving conductive region; The common contact area and the independent cut area are located on the same side of the first substrate.

2. The surface acoustic wave device according to claim 1, characterized in that, The number of independent cut areas is less than or equal to the number of common grounding ports.

3. The surface acoustic wave device according to claim 1, characterized in that, The connecting portion extends from the edge of the independent cut area to the edge of the common connection area, with the extension direction facing the middle region of the first substrate.

4. The surface acoustic wave device according to claim 1, characterized in that, The resonant filter also includes an antenna port; The series resonators in the resonant filter body and the parallel resonators connected to the series resonators constitute a transmitting filter unit, and the remaining series resonators and the parallel resonators connected to the remaining series resonators constitute a receiving filter unit. The first end of the transmitting filter unit is connected to the transmitting port, and the second end of the transmitting filter unit is connected to the antenna port; the first end of the receiving filter unit is connected to the antenna port, and the second end of the receiving filter unit is connected to the receiving port. The first substrate includes an antenna conductive region, and the antenna conductive region, the transmitting conductive region, the receiving conductive region, the common ground region and the independent cut-out region are arranged at intervals; the antenna conductive region is correspondingly arranged and connected to the antenna port.

5. The surface acoustic wave device according to claim 1, characterized in that, The top view shape of the independently cut area includes polygons or circles.

6. The surface acoustic wave device according to claim 1, characterized in that, Also includes: First conductive connector; The first conductive connector is disposed between the resonant filter and the first substrate; The first conductive connector is provided in a one-to-one correspondence with the grounding port, and the first conductive connector is used to connect the grounding port and the common grounding area; or, the first conductive connector is used to connect the common grounding port and the independent cut area.

7. The surface acoustic wave device according to claim 4, characterized in that, Also includes: The second conductive connector, the third conductive connector, and the fourth conductive connector; The second conductive connector, the third conductive connector, and the fourth conductive connector are disposed between the resonant filter and the first substrate; the second conductive connector is disposed corresponding to the transmitting port and is used to connect the transmitting port and the transmitting conductive area; the third conductive connector is disposed corresponding to the receiving port and is used to connect the receiving port and the receiving conductive area; the fourth conductive connector is disposed corresponding to the antenna port and is used to connect the antenna port and the antenna conductive area.

8. The surface acoustic wave device according to claim 4, characterized in that, The transmitting conductive area and the receiving conductive area are respectively located on opposite sides of the first side of the first substrate, and the antenna conductive area is located in the middle region of the second side of the first substrate. The common ground area is located on both sides of the antenna conductive area, between the transmitting conductive area and the receiving conductive area, and on the side of the transmitting conductive area and the receiving conductive area close to the antenna conductive area, and the common ground area is connected; at least one independent cut area is provided on the side of the common ground area between the transmitting conductive area and the receiving conductive area away from the antenna conductive area, on the side of the common ground area on the first side of the antenna conductive area away from the receiving conductive area, and / or on the side of the common ground area on the second side of the antenna conductive area away from the transmitting conductive area.

9. The surface acoustic wave device according to claim 8, characterized in that, The common grounding area on the first side of the antenna conductive area is provided with a first enclosing groove, the common grounding area on the second side of the antenna conductive area is provided with a second enclosing groove, and / or, the common grounding area between the transmitting conductive area and the receiving conductive area is provided with a third enclosing groove; The first enclosing groove extends away from the antenna conductive area along the edge of the common contact area closest to the antenna conductive area. The second enclosing groove extends away from the antenna conductive area along the edge of the common contact area closest to the antenna conductive area; the antenna conductive area is located between the first enclosing groove and the second enclosing groove; the third enclosing groove extends away from the antenna conductive area along the side closest to the antenna conductive area, and the common contact area surrounds the third enclosing groove on all four sides; At least one of the independent cut regions is provided in the first enclosing groove, the second enclosing groove, and / or the third enclosing groove, and the common contact area between the antenna conductive area, the transmitting conductive area, and the receiving conductive area is connected to the independent cut region.

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