Wafer bearing device and adjusting method of wafer bearing device

Abstract

The invention relates to a wafer bearing device and an adjusting method of the wafer bearing device. The wafer bearing device comprises a bearing table used for bearing a wafer; the bearing table comprises at least one sub-bearing table, and a bearing surface is arranged on the sub-bearing table; the at least one adjusting assembly is arranged corresponding to the sub-platform deck, and the adjusting assembly is arranged on one side, deviating from the bearing surface, of the corresponding sub-platform deck; and the adjusting assembly is used for driving the sub-stage to move so as to adjust the orientation of the bearing surface of the sub-stage and enable the bearing surface to be in contact with the warping position of the wafer. According to the invention, the warped wafer can be better attached to the bearing platform, and the processing precision and the manufacturing yield of the subsequent manufacturing process can be improved.

Description

Technical Field

[0001] This application relates to the field of photomask technology, and in particular to a wafer carrier device and a method for adjusting the wafer carrier device. Background Technology

[0002] A wafer is a chip used in the fabrication of semiconductor integrated circuits. It is called a wafer because of its circular shape. Various circuit element structures can be fabricated on a wafer to create integrated circuit products with specific electrical functions. The manufacturing steps for integrated circuit products typically include: wafer fabrication, masking, etching, doping, testing, and packaging. During wafer fabrication, due to factors such as material and temperature, some wafers may warp. In subsequent processes, the warped wafers cannot fully adhere to the substrate, leading to reduced processing accuracy and manufacturing yield. Summary of the Invention

[0003] Therefore, it is necessary to provide a wafer carrier device and a method for adjusting the wafer carrier device to address the above problems.

[0004] In a first aspect, embodiments of this application provide a wafer carrier device, comprising:

[0005] A support stage for supporting wafers; the support stage includes at least one sub-stage, and the sub-stage is provided with a support surface.

[0006] At least one adjustment component is provided corresponding to the sub-stage, and the adjustment component is located on the side of the corresponding sub-stage away from the bearing surface; the adjustment component is used to drive the sub-stage to move, so as to adjust the orientation of the bearing surface of the sub-stage and make the bearing surface contact the warped position of the wafer.

[0007] In one embodiment, the sub-stage includes a plurality of support regions, which are spaced apart along a direction parallel to the bearing surface;

[0008] The adjustment assembly includes a plurality of adjustment members corresponding one-to-one with the plurality of support regions. Each adjustment member is connected to the sub-platform of the corresponding support region and is used to apply a support force to the corresponding support region.

[0009] In one embodiment, the adjusting member is a linear motion mechanism.

[0010] In one embodiment, the orthographic projection shape of the bearing surface is a polygon along a direction perpendicular to the bearing surface;

[0011] And / or, in the orthographic projection of all the support regions onto the same bearing surface, the orthographic projection of one support region is located at the center of the bearing surface, and the orthographic projections of the remaining support regions are evenly distributed at the edges of the bearing surface.

[0012] In one embodiment, the wafer carrier further includes a detection component disposed on the side of the carrier platform away from the adjustment component and spaced apart from the carrier platform, the detection component being used to detect the warpage of the wafer.

[0013] In one embodiment, the detection component includes a light emitter and a light receiver, the light emitter being used to emit light toward a support region of the substage, and the light receiver being used to receive light reflected from a wafer located in the support region.

[0014] In one embodiment, the wafer carrier further includes a translation mechanism, the detection component is disposed on the translation mechanism, and the translation mechanism is used to drive the detection component to translate along the direction of the wafer region to be detected.

[0015] In one embodiment, the translation mechanism includes:

[0016] Mounting platform, on which the detection component is mounted;

[0017] A first slide rail extends along a first direction, and the mounting platform is slidably disposed on the first slide rail along the first direction;

[0018] The second slide rail extends along the second direction, and the first slide rail is slidably disposed on the second slide rail along the second direction; the first direction and the second direction intersect.

[0019] In one embodiment, the wafer carrier further includes a controller, and the adjustment component, the detection component, and the translation mechanism are all communicatively connected to the controller;

[0020] And / or, the carrier stage includes a plurality of the sub-carrier stages; the wafer carrier device includes a plurality of the adjustment components corresponding one-to-one with the plurality of the sub-carrier stages.

[0021] Secondly, embodiments of this application provide an adjustment method for a wafer carrier device, applied to the wafer carrier device described in the first aspect embodiment, wherein a wafer is supported on the carrier stage;

[0022] The adjustment method includes:

[0023] Based on the warpage of the wafer, the adjustment component is controlled to drive the corresponding sub-stage to move, so as to adjust the orientation of the bearing surface of the sub-stage and make the bearing surface contact the warpage position of the wafer.

[0024] In one embodiment, the adjustment method further includes:

[0025] The warpage of the wafer is detected by a detection component.

[0026] The wafer carrier device and its adjustment method provided in this application embodiment involve setting at least one sub-stage and an adjustment component corresponding to the sub-stage. After the warped wafer is placed on the carrier stage, the adjustment component can be controlled to move the corresponding sub-stage according to the wafer's warpage, thereby adjusting the orientation of the carrier surface of the sub-stage. This ensures that the carrier surface contacts the warped position of the wafer, facilitating better adhesion of the warped wafer to the carrier stage and improving the processing accuracy and manufacturing yield of subsequent fabrication processes. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of a wafer carrier device provided in an embodiment of this application.

[0029] Figure 2 for Figure 1 A top view of the support platform of the wafer carrier shown.

[0030] Figure 3 for Figure 2 The top view of the sub-platform of the support platform shown.

[0031] Figure 4 for Figure 1 The diagram shows the structure of the sub-stage and adjustment components of the wafer carrier device.

[0032] Figure 5 This is a schematic diagram of the structure of the support platform provided in one embodiment of this application before adjustment.

[0033] Figure 6 This is a schematic diagram of the structure of the support platform after adjustment, according to an embodiment of this application.

[0034] Figure 7 for Figure 1 A schematic diagram of the translation mechanism of the wafer carrier device shown.

[0035] Figure 8This is a schematic flowchart of an adjustment method for a wafer carrier device provided in an embodiment of this application.

[0036] Figure 9 This is another schematic flowchart illustrating the adjustment method of the wafer carrier device provided in an embodiment of this application.

[0037] Figure label:

[0038] 1. Wafer carrier; 11. Carrier stage; 111. Sub-carrier stage; 111a. Carrier surface; 111b. Support area; 12. Adjustment assembly; 121. Adjustment component; 13. Detection assembly; 131. Light emitting component; 132. Light receiving component; 14. Translation mechanism; 141. Mounting stage; 142. First slide rail; 143. Second slide rail; 15. Controller; 2. Wafer. Detailed Implementation

[0039] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0040] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0043] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0044] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0045] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0046] As described in the background section, because the surface of the support stage is relatively flat, the warped portion of the wafer cannot adhere to the stage after it is placed on it. Consequently, during subsequent processing, on the one hand, the support stage cannot effectively heat the warped portion, making it impossible to effectively control the real-time temperature of the wafer during processing. This results in poor etching uniformity, thus reducing processing accuracy and manufacturing yield. On the other hand, due to poor contact between the support stage and the wafer, the support stage cannot effectively hold the wafer. Therefore, during high-speed rotation of the support stage, the wafer is prone to detaching and fragmenting.

[0047] To mitigate the impact of wafer warpage on the manufacturing process, related technologies assume a fixed warpage morphology for each wafer based on historical warpage data. During actual processing, the process menu is adjusted according to this assumed warpage morphology (e.g., adjusting the etching rates at the wafer edges and center) to improve thickness and etching uniformity. However, because wafer warpage morphologies are highly variable, a single, fixed process menu cannot cover all process fluctuations, leading to process instability and hindering improvements in processing accuracy and manufacturing yield.

[0048] In view of this, embodiments of this application provide a wafer carrier device and an adjustment method for the wafer carrier device. This involves setting at least one sub-stage and an adjustment component corresponding to the sub-stage. After the warped wafer is placed on the carrier stage, the adjustment component can be controlled to move the corresponding sub-stage according to the wafer's warp, thereby adjusting the orientation of the carrier surface of the sub-stage. This ensures that the carrier surface contacts the warped position of the wafer, facilitating better attachment of the warped wafer to the carrier stage and improving the processing accuracy and manufacturing yield of subsequent fabrication processes.

[0049] Specifically, in the first aspect, referring to Figures 1 to 7 As shown in the figure, this application provides a wafer carrier device 1, which includes a carrier stage 11 and at least one adjustment component 12. The carrier stage 11 is used to carry a wafer 2. The carrier stage 11 includes at least one sub-carrier stage 111, and the sub-carrier stage 111 is provided with a carrier surface 111a. The adjustment component 12 is correspondingly disposed with the sub-carrier stage 111, and the adjustment component 12 is disposed on the side of the corresponding sub-carrier stage 111 opposite to the carrier surface 111a; the adjustment component 12 is used to drive the corresponding sub-carrier stage 111 to move, so as to adjust the orientation of the carrier surface 111a of the sub-carrier stage 111 and to make the carrier surface 111a contact the warped position of the wafer 2. Here, the orientation of the carrier surface 111a is the normal direction of the carrier surface 111a. In one example, the sub-carrier stage 111 moves toward the direction closer to the wafer 2 to adjust the orientation of the carrier surface 111a.

[0050] It should be noted that "adjusting the orientation of the bearing surface 111a of the sub-stage 111" can be considered as adjusting the "posture" of the sub-stage 111 so that at least a portion of the bearing surface 111a of the sub-stage 111 contacts the wafer 2. Initially, the bearing surface 111a of the sub-stage 111 faces directly upwards. When a wafer 2 on a sub-stage 111 warps and fails to contact the bearing surface 111a, the orientation of the bearing surface 111a is adjusted to tilt the sub-stage 111, thereby bringing it into contact with the warped wafer 2. It is understood that during the adjustment of the sub-stage 111, it can also be moved vertically.

[0051] The wafer carrier device 1 provided in this application embodiment, when in use, after placing the warped wafer 2 on the carrier stage 11, can control the adjustment component 12 to drive the corresponding sub-carrier stage 111 to move according to the warp degree of the wafer 2, thereby adjusting the orientation of the carrier surface 111a of the sub-carrier stage 111, so that the carrier surface 111a contacts the warped position of the wafer 2, which is beneficial to better attach the warped wafer 2 to the carrier stage 11, and is beneficial to improve the processing accuracy and manufacturing yield of subsequent manufacturing processes.

[0052] In one embodiment, the carrier stage 11 includes a plurality of sub-stages 111; the wafer carrier device 1 includes a plurality of adjustment components 12 corresponding one-to-one with the plurality of sub-stages 111. Here, the carrier stage 11 can be considered as being divided into a plurality of sub-stages 111, with a bearing surface 111a disposed on the top of each sub-stage 111, and the plurality of sub-stages 111 jointly bearing the wafer 2. In this way, the carrier stage 11 has a greater number of adjustable sub-stages 111, which can improve the contact effect between the carrier stage 11 and the wafer 2, and facilitate better attachment of the warped wafer 2 to the carrier stage 11, thereby improving the processing accuracy and manufacturing yield of subsequent manufacturing processes.

[0053] In a preferred embodiment, the plurality of substations 111 are arranged in an array.

[0054] In one embodiment, such as Figure 2 As shown, the carrier platform 11 can be divided into multiple rows of sub-carrier platforms 111 and multiple columns of sub-carrier platforms 111. The number of sub-carrier platforms 111 in each row of sub-carrier platforms 111 can be equal or unequal, and the number of sub-carrier platforms 111 in each column of sub-carrier platforms 111 can be equal or unequal. The arrangement of the sub-carrier platforms 111 is not limited in this embodiment.

[0055] In one embodiment, reference Figure 3 and Figure 4As shown, the substage 111 includes multiple support regions 111b, which are spaced apart along a direction parallel to the bearing surface 111a. The adjustment assembly 12 includes multiple adjustment members 121 corresponding to each of the support regions 111b. Each adjustment member 121 is connected to the substage 111 of its corresponding support region 111b and is used to apply a supporting force to the corresponding support region 111b. Thus, with the cooperation of the multiple adjustment assemblies 12, the "attitude" of the substage 111 can be better adjusted, thereby allowing the bearing surface 111a to better contact the wafer 2.

[0056] In one embodiment, the adjusting member 121 is a linear motion mechanism. Exemplarily, the adjusting member 121 can be an electric cylinder, a pneumatic cylinder, a hydraulic cylinder, etc. This simplifies the structure of the adjusting member 121 and reduces costs.

[0057] In one embodiment, such as Figure 3 As shown, along the direction perpendicular to the bearing surface 111a, the orthographic projection shape of the bearing surface 111a is a polygon. It can be understood that the orthographic projection shape of the bearing surface 111a can be a triangle, a square, a rectangle, etc. This facilitates the neat arrangement of all the sub-stages 111 and reduces the gaps between adjacent sub-stages 111, thereby increasing the contact area between the wafer 2 and the bearing surface 11.

[0058] In one embodiment, all support regions 111b are projected onto the same support surface 111a, with the projection of one support region 111b located at the center of the support surface 111a, and the projections of the remaining support regions 111b evenly distributed along the edges of the support surface 111a. Thus, with the cooperation of multiple adjustment components 12, the "orientation" of the sub-stage 111 can be better adjusted, thereby allowing the support surface 111a to better contact the wafer 2.

[0059] In one example, refer to Figure 3 and Figure 4 As shown, the orthographic projection shape of the bearing surface 111a is a quadrilateral, and there are 5 supporting regions 111b. One supporting region 111b is located at the center of the bearing surface 111a, and the other 4 supporting regions 111b are distributed at the four corners of the bearing surface 111a.

[0060] Specifically, assuming that the bearing surface 111a of the sub-stage 111 needs to be oriented towards the 10 o'clock position, the adjusting member 121 corresponding to the support area 111b at the control center and the adjusting members 121 corresponding to the two support areas 111b on the right edge move upwards together. It can be understood that during the adjustment process, the adjusting members 121 corresponding to the two support areas 111b on the left edge can also be moved slightly upwards.

[0061] In one embodiment, reference Figure 1 As shown, the wafer carrier device 1 also includes a detection component 13. The detection component 13 is located on the side of the carrier stage 11 away from the adjustment component 12 and is spaced apart from the carrier stage 11. The detection component 13 is used to detect the warpage of the wafer 2. Thus, before adjusting the sub-carrier stage 111, the warpage of the wafer 2 can be detected by the detection component 13, and then the portion of the sub-carrier stage 111 of the carrier stage 11 can be adjusted according to the detected warpage.

[0062] It should be noted that the inspection component 13 can perform front-side inspection of wafer 2 or partial inspection of wafer 2. Taking partial inspection as an example, refer to... Figure 5 The detection component 13 detects the wafer 2 region corresponding to the support region 111b of each sub-stage 111. This can also be understood as the detection area of ​​the detection component 13 corresponding to the support region 111b. Figure 3 For example, when the detection component 13 detects the warpage of the portion of wafer 2 located above the sub-stage 111, it only needs to detect data at five detection points. The positions of these five detection points correspond to the positions of the five support regions 111b. Then, the warpage of the portion of wafer 2 corresponding to the sub-stage 111 is obtained. (Refer to...) Figure 6 As shown, after all wafer 2 portions corresponding to all sub-stages 111 have been inspected, the corresponding sub-stages 111 are adjusted according to the detected warpage.

[0063] Understandably, the size of the detection component 13 can be approximately the same as the size of the substage 111.

[0064] In one embodiment, the detection component 13 is a Fizeau interferometer, used to detect the warpage of wafer 2 using the principle of light interference. The Fizeau interferometer includes: a first focusing lens, a spatial filter, a first collimating lens, a beam splitter, a reference mirror, a second focusing lens, a second collimating lens, and an image sensor. The detection light sequentially passes through the first focusing lens, the spatial filter, the first collimating lens, the beam splitter, and the reference mirror. Part of the light is reflected by the reference surface of the reference mirror to form reference reflected light, and part of the light passes through the reference mirror and is incident on the surface of wafer 2 and reflected to form sample reflected light. Subsequently, both the sample reflected light and the reference reflected light sequentially pass through the reference mirror, the beam splitter, the second focusing lens, and the second collimating lens before being incident on the image sensor. Similarly, due to the uneven surface of wafer 2, different optical path differences will form between the sample reflected light and the reference reflected light. Furthermore, the interference between the reference reflected light and the sample reflected light will form alternating bright and dark interference fringes. Since the spacing between the bright and dark stripes is related to the relative height of the wafer 2 surface, the image sensor can obtain the height information of the wafer 2 surface and thus determine its flatness (warpage).

[0065] Understandably, the warpage values ​​measured for each wafer 2 can be saved, making it easier for process engineers to analyze and monitor the overall warpage of wafer 2.

[0066] In one embodiment, reference Figure 7 As shown, the detection component 13 includes a light emitter 131 and a light receiver 132. The light emitter 131 emits light towards the support region 111b of the sub-stage 111, and the light receiver 132 receives the light reflected from the wafer 2 located in the support region 111b. The light emitted by the light emitter 131 can be laser light or other types of light. Specifically, the speed of light is known, the time it takes for the light to hit the wafer 2 and be reflected back to the light receiver 132 is known, and the distance between the detection component 13 and the support region 111b of the sub-stage 111 is known. The corresponding warpage can be calculated using the time difference.

[0067] In one embodiment, reference Figure 1 As shown, the wafer carrier device 1 also includes a translation mechanism 14, and a detection component 13 is mounted on the translation mechanism 14. The translation mechanism 14 is used to drive the detection component 13 to translate along the direction of the wafer area to be detected, that is, to drive the detection component 13 to translate towards the area to be detected on the wafer 2. In this way, by driving the detection component 13 to translate directly above the wafer 2 through the translation mechanism 14, the warpage at different positions on the wafer 2 can be detected.

[0068] In one example, with Figure 3 Taking the sub-stage 111 as an example, when the detection component 13 detects the wafer 2 above a certain sub-stage 111, it first detects the first detection area (i.e., the support area 111b). Then, the translation mechanism 14 moves the detection component 13 above the second detection area and detects the second detection area, and so on. After the wafer 2 above a certain sub-stage 111 is detected, the translation mechanism 14 moves the detection component 13 above the next sub-stage 111.

[0069] In one embodiment, reference Figure 7 As shown, the translation mechanism 14 also includes a mounting platform 141, a first slide rail 142, and a second slide rail 143. The detection component 13 is mounted on the mounting platform 141. The first slide rail 142 extends along a first direction A, and the mounting platform 141 is slidably mounted on the first slide rail 142 along the first direction A. The second slide rail 143 extends along a second direction B, and the first slide rail 142 is slidably mounted on the second slide rail 143 along the second direction B; the first direction A and the second direction B intersect. Thus, on the one hand, the structure of the translation mechanism 14 can be simplified, which is beneficial for cost reduction; on the other hand, the detection component 13 can be easily moved above the area of ​​the wafer to be inspected.

[0070] In one embodiment, reference Figure 1 As shown, the wafer carrier device 1 also includes a controller 15, and the adjustment component 12, the detection component 13, and the translation mechanism 14 are all communicatively connected to the controller 15. Thus, the controller 15 can control the translation mechanism 14 to move the detection component 13 above the wafer area to be detected, control the detection component 13 to detect the wafer area to be detected, and control the adjustment component 12 to adjust the sub-stage 111.

[0071] Secondly, referring to Figure 8 As shown, this application provides an adjustment method for a wafer carrier device, which is applied to a wafer carrier device 1 in the first aspect embodiment, wherein a wafer 2 is carried on a carrier stage 11.

[0072] The adjustment method includes the following steps:

[0073] S100: The warpage control and adjustment component 12 based on wafer 2 drives the corresponding sub-stage 111 to move, so as to adjust the orientation of the bearing surface 111a of the sub-stage 111 and make the bearing surface 111a contact the warpage position of wafer 2. The warpage data here can be pre-acquired or detected in real time.

[0074] The wafer carrier adjustment method provided in this application embodiment allows for the adjustment of the wafer carrier 12 after the warped wafer 2 is placed on the carrier stage 11. The adjustment component 12 is controlled to move the corresponding sub-carrier stage 111 according to the warp degree of the wafer 2, thereby adjusting the orientation of the carrier surface 111a of the sub-carrier stage 111. This ensures that the carrier surface 111a contacts the warped position of the wafer 2, facilitating better adhesion of the warped wafer 2 to the carrier stage 11. This improves the etching uniformity and thickness uniformity of the wafer 2, enhancing processing accuracy and manufacturing yield. Compared to the related technologies described above, this method helps maintain a stable manufacturing process.

[0075] In one embodiment, reference Figure 9 As shown, the adjustment method also includes the following steps:

[0076] S100: The warpage of wafer 2 is detected by the detection component 13. Specifically, the detection component 13 can be moved directly above wafer 2 by the translation mechanism 14, and then the warpage of wafer 2 is detected by the detection component 13.

[0077] In one embodiment, with Figure 3As shown in the example, when adjusting the sub-stage 111, a first average value is calculated based on the heights of the upper left and upper right corners. Then, a second average value is calculated based on the heights of the lower left and lower right corners. The slope in the Y direction is obtained from the first and second average values. Next, a third average value is calculated based on the heights of the upper left and lower left corners. Finally, a fourth average value is calculated based on the heights of the upper right and lower right corners. The slope in the X direction is obtained from the third and fourth average values. The extension / retraction length of each adjusting component 121 is adjusted accordingly based on the slopes in the X and Y directions.

[0078] It should be noted that wafer 2 with high flatness does not need adjustment. Therefore, in the manufacturing process, the adjustment of the sub-stage 111 can be selective. Adjustment is performed when wafer 2 is warped, and no adjustment is performed when wafer 2 is not warped.

[0079] In the description of this specification, the references to terms such as "some embodiments," "other embodiments," "ideal embodiments," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example that are included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0080] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0081] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A wafer carrier device, characterized in that, include: A support stage for supporting wafers; the support stage includes at least one sub-stage, and the sub-stage is provided with a support surface. At least one adjustment component is provided corresponding to the sub-stage, and the adjustment component is located on the side of the corresponding sub-stage away from the bearing surface; the adjustment component is used to drive the sub-stage to move, so as to adjust the orientation of the bearing surface of the sub-stage and make the bearing surface contact the warped position of the wafer.

2. The wafer carrier device according to claim 1, characterized in that, The sub-platform includes multiple support areas, which are spaced apart along a direction parallel to the bearing surface; The adjustment assembly includes a plurality of adjustment members corresponding one-to-one with the plurality of support regions. Each adjustment member is connected to the sub-platform of the corresponding support region and is used to apply a support force to the corresponding support region.

3. The wafer carrier device according to claim 2, characterized in that, The adjusting component is a linear motion mechanism.

4. The wafer carrier device according to claim 2, characterized in that, Along a direction perpendicular to the bearing surface, the orthographic projection shape of the bearing surface is a polygon; And / or, in the orthographic projection of all the support regions onto the same bearing surface, the orthographic projection of one support region is located at the center of the bearing surface, and the orthographic projections of the remaining support regions are evenly distributed at the edges of the bearing surface.

5. The wafer carrier device according to claim 1, characterized in that, The wafer carrier device further includes a detection component, which is located on the side of the carrier platform away from the adjustment component and spaced apart from the carrier platform. The detection component is used to detect the warpage of the wafer.

6. The wafer carrier device according to claim 5, characterized in that, The detection component includes a light emitter and a light receiver. The light emitter emits light toward the support region of the sub-stage, and the light receiver receives light reflected from the wafer located in the support region.

7. The wafer carrier device according to claim 5, characterized in that, The wafer carrier device further includes a translation mechanism, and the detection component is disposed on the translation mechanism. The translation mechanism is used to drive the detection component to translate along the direction of the wafer region to be detected.

8. The wafer carrier device according to claim 7, characterized in that, The translation mechanism includes: Mounting platform, on which the detection component is mounted; A first slide rail extends along a first direction, and the mounting platform is slidably disposed on the first slide rail along the first direction; The second slide rail extends along the second direction, and the first slide rail is slidably disposed on the second slide rail along the second direction; the first direction and the second direction intersect.

9. The wafer carrier device according to claim 7, characterized in that, The wafer carrier device also includes a controller, and the adjustment component, the detection component and the translation mechanism are all communicatively connected to the controller; And / or, the carrier stage includes a plurality of the sub-carrier stages; the wafer carrier device includes a plurality of the adjustment components corresponding one-to-one with the plurality of the sub-carrier stages.

10. A method for adjusting a wafer carrier device, characterized in that, Applied to the wafer carrier apparatus as described in any one of claims 1-9, wherein a wafer is supported on the carrier stage; The adjustment method includes: Based on the warpage of the wafer, the adjustment component is controlled to drive the corresponding sub-stage to move, so as to adjust the orientation of the bearing surface of the sub-stage and make the bearing surface contact the warpage position of the wafer.

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