Wafer bearing device and adjusting method of wafer bearing device

By setting a sub-stage and adjustment components in the wafer carrier device, the contact between the carrier surface and the wafer is adjusted according to the warpage, which solves the problem of poor attachment of warped wafers on the carrier stage and improves processing accuracy and yield.

CN122073977APending Publication Date: 2026-05-22CSMC TECH FAB2 CO LTD
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Patent Information

Application Number
CN202411677671.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-21
Publication Date
2026-05-22

AI Technical Summary

Technical Problem

Warped wafers cannot be fully attached to the substrate, resulting in reduced processing accuracy and manufacturing yield.

Method used

By setting up a sub-stage and adjusting components, the orientation of the sub-stage's bearing surface is adjusted according to the wafer's warp to make it contact the warped position of the wafer. The warp is detected by a detection component, and the contact between the bearing surface and the wafer is adjusted by a translation mechanism.

Benefits of technology

This improves the processing precision and manufacturing yield of subsequent manufacturing processes, ensures stable attachment of wafers on the carrier stage, and enhances etching uniformity and thickness uniformity.

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Abstract

The invention relates to a wafer bearing device and an adjusting method of the wafer bearing device. The wafer bearing device comprises a bearing table used for bearing a wafer; the bearing table comprises at least one sub-bearing table, and a bearing surface is arranged on the sub-bearing table; the at least one adjusting assembly is arranged corresponding to the sub-platform deck, and the adjusting assembly is arranged on one side, deviating from the bearing surface, of the corresponding sub-platform deck; and the adjusting assembly is used for driving the sub-stage to move so as to adjust the orientation of the bearing surface of the sub-stage and enable the bearing surface to be in contact with the warping position of the wafer. According to the invention, the warped wafer can be better attached to the bearing platform, and the processing precision and the manufacturing yield of the subsequent manufacturing process can be improved.
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