Stretchable flexible circuit based on metal-liquid metal slip structure
By introducing an interlaced metal-liquid metal slip structure into the conductive layer, the problems of easy leakage and decreased reliability of liquid metal circuits under repeated stretching are solved, realizing a stretchable flexible circuit with high density integration and high conductivity, which is suitable for applications such as health monitoring and soft robot sensing skin.
CN122094019APending Publication Date: 2026-05-26ZHEJIANG UNIV
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-23
- Publication Date
- 2026-05-26
Smart Images

Figure CN122094019A_ABST
Abstract
This invention provides a stretchable flexible circuit based on a metal-liquid metal sliding structure, belonging to the field of flexible electronics. It includes a flexible substrate, at least one conductive layer, an electronic component layer, and a flexible packaging layer, all arranged in a stacked configuration. The conductive layer comprises an alternating stack of metal and liquid metal layers. The metal layers consist of at least two groups, each containing multiple metal segments isolated by scribe lines. The projections of the metal segments from adjacent groups of metal layers perpendicular to the stacking direction are staggered, forming a sliding-like structure during stretching. The liquid metal layer fills the spaces between adjacent metal layers and the gaps between the metal segments. During stretching, this structure dissipates stress through the cohesive flow of the liquid metal layer and the interfacial sliding between the metal segments, enabling the circuit to achieve a stretchability of 80%-150% without the need for serpentine wiring, while maintaining high conductivity and high wiring density. This makes it suitable for flexible electronics and wearable sensing applications.
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Multilayer flexible circuit, preparation method thereof and flexible electronic system
CN121057097A
Capacitive elastic strain sensor and wearable product
CN210014750U
Method for forming reflowed solder ball with low melting point metal cap
US6344234B1
Stretchable electronics for dentistry applications and method of making the same
WO2017001978A1