A matrix type multi-band high-gain directional antenna and system

Abstract

The application discloses a kind of matrix type multiband high gain directional antennas, comprising: dielectric substrate, matrix type radiating element array, feed network, reflector and ground layer, matrix type radiating element array is located on the upper surface of dielectric substrate, ground layer is covered on the lower surface of dielectric substrate and closely adheres, reflector is fixed below ground layer and parallel with ground layer, feed network is embedded inside dielectric substrate, two ends are electrically connected with matrix type radiating element array and external feed interface respectively, it is related to matrix type directional antenna technical field, by the structure of each component and installation position of reasonable design, with special controller structure, the directional radiation and reception of multiband signal are realized, effectively improve the stability and directional accuracy of signal transmission, reduce the interference between multiband signals and loss in signal transmission process, adapt long distance, multi-scene communication demand.

Description

Technical Field

[0001] This invention relates to the field of matrix directional antenna technology, specifically a matrix multi-band high-gain directional antenna. Background Technology

[0002] With the rapid development of emerging technologies such as 5G communication, the Internet of Things, and satellite navigation, the performance requirements for antennas in wireless communication systems are increasing. Antennas not only need to be multi-band capable to adapt to the communication needs of different frequency bands, but also need strong directionality to reduce signal interference and improve the stability and transmission efficiency of long-distance communication. Currently, most existing directional antennas are single-band designs. To achieve multi-band communication, multiple single-band antennas are usually required, resulting in bulky antennas, low integration, inconvenient installation, and potential signal interference between multiple antennas, affecting communication quality. Furthermore, some multi-band antennas use non-matrix structures, resulting in poor directionality and significant signal loss during transmission, failing to meet the needs of long-distance communication, especially in complex environments such as smart oceans, where stable multi-band signal coverage is difficult to achieve. In the existing technology, the core components of the antenna include dielectric substrate radiating element array, radiating element, radiating patch, dielectric support layer, loading slot, feed interface, feed network, microstrip feed line, power divider, reflector, positioning post, grounding layer, hollow slot, protective shell, and heat dissipation hole. The design of these components has the problems of simple radiating element structure, narrow bandwidth, and poor impedance matching performance; complex feed network design, large signal loss, and lack of precise control components. Summary of the Invention

[0003] The purpose of this invention is to provide a matrix-type multi-band high-gain directional antenna and directional antenna system to solve the problems mentioned in the background art, such as simple radiating element structure, narrow bandwidth, poor impedance matching performance, complex feed network design, large signal loss, and lack of precise control components.

[0004] To achieve the above objectives, the present invention provides the following technical solution: A matrix-type multi-band high-gain directional antenna and directional antenna system are disclosed, comprising: a dielectric substrate, a matrix-type radiating element array, a feed network, a reflector, and a ground layer. The matrix-type radiating element array is disposed on the upper surface of the dielectric substrate, and the ground layer covers the lower surface of the dielectric substrate and is tightly attached thereto. The reflector is fixed below the ground layer and parallel to the ground layer. The feed network is embedded inside the dielectric substrate, and its two ends are electrically connected to the matrix-type radiating element array and an external feed interface, respectively. The matrix-type radiating element array is composed of multiple radiating elements of different sizes arranged in an M×N matrix to realize directional radiation and reception of multi-band signals. The reflector is used to enhance the directivity.

[0005] In a preferred embodiment of the present invention, M and N in the M×N matrix are both integers ≥2, preferably a 4×4 matrix. The multiple radiating elements are divided into at least three groups, each group having the same size and corresponding to a working frequency band. The three groups are distributed alternately at uniform intervals, and the spacing between adjacent radiating elements of different frequency bands is the same. The center point of all radiating elements is located on the same straight grid to avoid multi-band signal interference.

[0006] In a preferred embodiment of the present invention, the radiating unit is a rectangular microstrip radiating structure, including a radiating patch, a dielectric support layer, and a loading groove. The dielectric support layer is fixed to the upper surface of the dielectric substrate and fully adhered thereto. The radiating patch is fixed to the upper surface of the dielectric support layer and aligned thereto. The loading groove is I-shaped and located in the center of the radiating patch to extend the working bandwidth.

[0007] In a preferred embodiment of the present invention, the length of the loading groove is 1 / 2 to 2 / 3 of the length of the radiating patch, and the width is 1 / 8 to 1 / 6 of its width. The extension direction is consistent with the length of the radiating patch and does not exceed the edge of the radiating patch. The size is adjusted to match the impedance requirements of the corresponding frequency band.

[0008] In a preferred embodiment of the present invention, the dielectric substrate is an FR4 epoxy resin substrate with a dielectric constant εr=4.4±0.2, a loss tangent ≤0.02, and a thickness of 1.6-2.0mm. The dielectric support layer is made of polytetrafluoroethylene with a dielectric constant εr=2.6±0.1 and a thickness of 0.8-1.0mm, and is fixed directly below each radiating unit.

[0009] In a preferred embodiment of the present invention, the power supply network includes a microstrip feeder, a power divider, and a power supply interface. The power divider is embedded in the center of the dielectric substrate and located directly below the matrix-type radiating unit array. One end of the microstrip feeder is connected to the power divider, and the other end passes through the dielectric support layer to connect to the radiating patch. The power supply interface is an SMA connector that extends to the outside through the grounding layer and the reflector.

[0010] In a preferred embodiment of the present invention, the reflector is made of aluminum alloy with a thickness of 2.0-3.0 mm and a size larger than the dielectric substrate. The reflector has integrally formed positioning posts at the four corners and the center of its surface, and positioning holes are set at corresponding positions on the dielectric substrate. The positioning posts are inserted into the positioning holes for fixation, and the height is consistent with the thickness of the grounding layer.

[0011] In a preferred embodiment of the present invention, the grounding layer is made of copper foil with a thickness of 0.035-0.05mm, fully covering the lower surface of the dielectric substrate. A hollow groove is provided directly below each radiating unit of the grounding layer, with its horizontal projection consistent with the radiating patch. It does not penetrate the grounding layer to reduce signal obstruction. The multi-frequency band includes a low-frequency band of 600MHz-1000MHz, a mid-frequency band of 2.1GHz-2.8GHz, and a high-frequency band of 3.4GHz-3.7GHz. The low-frequency radiating units are located at the four corners of the matrix, the mid-frequency units are located at the center of the edge, and the high-frequency units are located in the central area.

[0012] In a preferred embodiment of the present invention, a protective shell is also included, which is a square box shape that encloses the components. The inner wall leaves a gap with the reflector and the dielectric substrate. The protective shell is made of waterproof and flame-retardant ABS material, with through holes corresponding to the power supply interface, and through heat dissipation holes on the upper surface and the two side walls.

[0013] A matrix-type multi-band high-gain directional antenna system includes the multi-band matrix-type directional antenna as described in any one of the claims.

[0014] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

[0015] 1. By rationally designing the structure and installation position of each component and matching it with a dedicated controller structure, the directional radiation and reception of multi-band signals can be realized, effectively improving the stability and directional accuracy of signal transmission, reducing interference between multi-band signals and loss during signal transmission, and adapting to long-distance and multi-scenario communication needs. Compared with existing technologies, the communication performance and adaptability are significantly improved. 2. It adopts an integrated structural design with tight fit of all components, small size and high integration. The protective shell has good waterproof, dustproof and flame retardant properties, which can adapt to complex outdoor environments. At the same time, the controller can accurately control the working status of each component, which facilitates later maintenance and debugging, improves the practicality and service life of the antenna, and reduces the cost of use. Attached Figure Description

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the main view structure of a matrix-type multi-band high-gain directional antenna and a directional antenna system. Figure 2 This is a schematic diagram of a matrix-type multi-band high-gain directional antenna and the rear-view structure of a directional antenna system. Figure 3 This is a schematic diagram of the exploded structure of a matrix-type multi-band high-gain directional antenna and a directional antenna system. Figure 4 This is a schematic diagram of the exploded structure of a dielectric substrate in a matrix-type multi-band high-gain directional antenna and a directional antenna system. Figure 5 This is a schematic diagram of a matrix-type multi-band high-gain directional antenna and a reflector structure in a directional antenna system. Figure 6 This is a schematic diagram of a matrix-type multi-band high-gain directional antenna and a radiating patch structure in a directional antenna system.

[0017] In the figure: dielectric substrate 100, positioning hole 110, matrix-type radiating unit array 200, radiating unit 210, radiating patch 220, dielectric support layer 230, loading slot 221, power supply network, microstrip feeder, power divider, power supply interface, reflector, positioning post 410, grounding layer, hollow slot 510, protective shell 600, heat dissipation hole 610, top plate 620. Detailed Implementation

[0018] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0019] Example 1: As Figures 1-6 The system includes: a dielectric substrate 100, a matrix-type radiating unit array 200, a power supply network, a reflector 400, and a ground layer 500. The matrix-type radiating unit array 200 is disposed on the upper surface of the dielectric substrate 100. The ground layer 500 covers the lower surface of the dielectric substrate 100 and is tightly attached to it. The reflector 400 is fixed below the ground layer 500 and parallel to the ground layer 500. The power supply network is embedded inside the dielectric substrate 100 and its two ends are electrically connected to the matrix-type radiating unit array 200 and the external power supply interface 300, respectively. The matrix-type radiating unit array 200 is composed of multiple radiating units 210 of different sizes arranged in an M×N matrix to realize directional radiation and reception of multi-band signals. The reflector 400 is used to enhance the directionality.

[0020] The specific application scenario of this embodiment is as follows: the feed interface 300 adopts the SMA-KHD model, the reflector 400 is made of 6061 aluminum alloy, and the grounding layer 500 is made of copper foil. An external start command is received through the communication module to drive the feed network into operation. External signals are input to the feed network through the feed interface 300 and transmitted to the matrix-type radiating element array 200. The radiating elements 210 of the matrix-type radiating element array 200 convert electrical signals into electromagnetic waves and radiate them directionally. Simultaneously, the radiating elements 210 can receive external multi-band electromagnetic wave signals, convert them into electrical signals, and transmit them to external devices through the feed network. The reflector 400 directionally reflects the electromagnetic waves radiated downwards by the radiating elements 210, reducing signal loss and enhancing the antenna's directional radiation and reception effects. The grounding layer 500 acts as a shield against interference signals, ensuring the stability of signal transmission. The controller monitors the operating status of the matrix-type radiating element array 200 in real time and adjusts the transmission parameters of the feed network accordingly to ensure stable transmission of multi-band signals.

[0021] Example 2: Figures 3-6 In the M×N matrix, M and N are both integers ≥2, preferably a 4×4 matrix. The multiple radiating units 210 are divided into at least three groups, each group has the same size and corresponds to a working frequency band. The three groups are distributed alternately at uniform intervals. The spacing between adjacent radiating units 210 of different frequency bands is the same. The center point of all radiating units 210 is located on the same straight grid to avoid multi-band signal interference. The radiating unit 210 is a rectangular microstrip radiating structure, including a radiating patch 220, a dielectric support layer 230 and a loading groove 221. The dielectric support layer 230 is fixed to the upper surface of the dielectric substrate 100 and fully adhered. The radiating patch 220 is fixed to the upper surface of the dielectric support layer 230 and aligned. The loading groove 221 is I-shaped and opened in the center of the radiating patch 220 to expand the working bandwidth.

[0022] The specific application scenario of this embodiment is as follows: the radiating patch 220 is made of copper foil, the dielectric support layer 230 is made of polytetrafluoroethylene (PTFE), and the loading groove 221 is formed by laser cutting. The working principle is as follows: the controller STM32F103C8T6 acquires the signal strength of each frequency band through the signal acquisition module, analyzes and determines the currently required operating frequency band, and drives the corresponding radiating unit 210 to start; the radiating patch 220 of the radiating unit 210 receives the electrical signal transmitted from the power supply network, and under the action of the loading groove 221, expands the working band of the radiating patch 220. The wide distribution allows the radiating unit 210 to adapt to the radiation and reception of signals in the corresponding frequency band; the dielectric support layer 230 supports the radiating patch 220 and reduces signal loss between the radiating patch 220 and the dielectric substrate 100; since the three sets of radiating units 210 are evenly spaced and their center points are located on the same straight grid, mutual interference between signals of different frequency bands can be effectively avoided; the controller monitors the signal strength of each radiating unit 210 in real time and adjusts the working state of the radiating unit 210 according to the signal changes to ensure independent and stable transmission of multi-frequency signals.

[0023] Example 3: Figures 3-6 The loading groove 221 has a length of 1 / 2 to 2 / 3 of the length of the radiating patch 220, a width of 1 / 8 to 1 / 6 of its width, and extends in the same direction as the length of the radiating patch 220 without exceeding the edge of the radiating patch 220. The size is adjusted to match the impedance requirements of the corresponding frequency band. The dielectric substrate 100 is an FR4 epoxy resin substrate with a dielectric constant εr = 4.4 ± 0.2, a loss tangent ≤ 0.02, and a thickness of 1.6-2.0 mm. The dielectric support layer 230 is made of polytetrafluoroethylene with a dielectric constant εr = 2.6 ± 0.1 and a thickness of 0.8-1.0 mm. It is fixed directly below each radiating unit 210.

[0024] The specific application scenario of this embodiment is as follows: the dielectric substrate 100 adopts the FR-4 model, the dielectric support layer 230 adopts the PTFE-7 model, and the size of the loading slot 221 is preset and adjusted according to the corresponding frequency band. The working principle is as follows: the controller STM32F103C8T6 sends adjustment commands through the drive module according to the impedance requirements of the current working frequency band. The operator can adjust the length and width of the loading slot 221 according to the commands so that the loading slot 221 matches the radiating patch 220 to achieve impedance matching of the corresponding frequency band and reduce signal reflection loss. The dielectric substrate 100 serves as the mounting carrier for each component. Its FR4 epoxy resin material has good insulation performance and mechanical strength, which can ensure the stable installation and operation of the power supply network and the radiating unit 210. The polytetrafluoroethylene material of the dielectric support layer 230 has excellent dielectric properties, which can effectively reduce the signal loss between the radiating unit 210 and the dielectric substrate 100 and improve the signal radiation and reception efficiency of the radiating unit 210. The controller monitors the impedance matching status in real time. If impedance mismatch occurs and the signal loss increases, it will issue a prompt signal in time, so that the operator can adjust the size of the loading slot 221.

[0025] Example 4: Figure 3 The power supply network includes a microstrip feeder, a power divider, and a power supply interface 300. The power divider is embedded in the center of the dielectric substrate 100 and located directly below the matrix-type radiating unit array 200. One end of the microstrip feeder is connected to the power divider, and the other end passes through the dielectric support layer 230 and connects to the radiating patch 220. The power supply interface 300 is an SMA connector that extends to the outside through the grounding layer 500 and the reflector 400.

[0026] The specific application scenario of this embodiment is as follows: The power divider adopts the MSW-2-1800-2000 model, and the feed interface 300 adopts the SMA-KHD model. The external signal is input to the power divider through the feed interface 300. The controller STM32F103C8T6 adjusts the signal distribution ratio of the power divider according to the current operating frequency band and signal strength, and evenly distributes the input signal to each microstrip feed line. The microstrip feed line stably transmits the distributed signal to the radiating patch 220 of the corresponding radiating unit 210, driving the radiating patch 220 to radiate electromagnetic waves. At the same time, the external signal received by the radiating patch 220 is collected by the microstrip feed line to the power divider, and then transmitted by the power divider to the feed interface 300 for output to external devices. The microstrip feed line passes through the dielectric support layer 230 and connects to the radiating patch 220 to ensure the continuity and stability of signal transmission. The controller monitors the signal distribution status of the power divider and the transmission power of the microstrip feed line in real time, and adjusts the power divider parameters in a timely manner to avoid communication quality degradation caused by uneven signal distribution.

[0027] Example 5: Figure 1 and Figure 2The reflector 400 is made of aluminum alloy with a thickness of 2.0-3.0mm and a size larger than the dielectric substrate 100. The reflector 400 has integrated positioning posts 410 at the four corners and center of its surface. The dielectric substrate 100 has positioning holes 110 at corresponding positions. The positioning posts 410 are inserted into the positioning holes 110 for fixation, and their height is consistent with the thickness of the grounding layer 500.

[0028] The specific application scenario of this embodiment is as follows: The reflector 400 is made of 6061 aluminum alloy. The positioning post 410 is integrally die-cast with the reflector 400, and the positioning hole 110 is formed by drilling. The working principle is as follows: The reflector 400 is precisely fixed to the dielectric substrate 100 by the positioning post 410 engaging with the positioning hole 110. The height of the positioning post 410 is consistent with the thickness of the grounding layer 500, ensuring that the upper surface of the reflector 400 and the lower surface of the grounding layer 500 are fully and tightly fitted, improving the grounding shielding effect and electromagnetic wave reflection effect. When the radiating unit 210 radiates electromagnetic waves downwards, the reflector 400 directionally reflects the electromagnetic waves back to the direction of the radiating unit 210, superimposing them with the electromagnetic waves radiated upwards by the radiating unit 210, thereby enhancing the directional radiation intensity of the antenna and reducing signal loss downwards. The controller STM32F103C8T6 monitors the reflection effect of the reflector 400 through the signal acquisition module. If the reflected signal weakens, it will issue a prompt signal in a timely manner, which will facilitate the staff to check the fit between the positioning post 410 and the positioning hole 110, ensuring the stable operation of the reflector 400.

[0029] Example 6: Figure 4 The grounding layer 500 is made of copper foil with a thickness of 0.035-0.05mm, and fully covers the lower surface of the dielectric substrate 100. The grounding layer 500 has a hollowed-out groove 510 directly below each radiating unit 210. The horizontal projection is consistent with the radiating patch 220. It does not penetrate the grounding layer 500 to reduce signal obstruction. The multi-frequency band includes a low-frequency band of 600MHz-1000MHz, a mid-frequency band of 2.1GHz-2.8GHz, and a high-frequency band of 3.4GHz-3.7GHz. The low-frequency radiating units 210 are located at the four corners of the matrix, the mid-frequency band is located in the middle of the edge, and the high-frequency band is located in the central area. A matrix-type multi-band high-gain directional antenna system includes the multi-band matrix-type directional antenna as described in any one of the claims.

[0030] The specific application scenario of this embodiment is as follows: The grounding layer 500 fully covers the lower surface of the dielectric substrate 100, serving to shield external interference signals and ensure the stable operation of the power supply network and the radiating unit 210; the hollowed-out groove 510 on the grounding layer 500 is consistent with the horizontal projection of the radiating patch 220, which can effectively reduce the obstruction of the grounding layer 500 on the radiating unit 210's radiated and received signals, and reduce signal loss; the controller STM32F103C8T6 adjusts the activation of the radiating unit 210 of the corresponding frequency band according to the external communication requirements. The low-frequency radiating unit 210 is located at the four corners of the matrix, which can enhance the coverage of low-frequency signals; the mid-frequency radiating unit 210 is located in the middle of the edge; and the high-frequency radiating unit 210 is located in the central area, which can improve the directional accuracy of high-frequency signals. The three work together to achieve synchronous directional radiation and reception of multi-frequency band signals.

[0031] The working principle of this invention is as follows: When used by those skilled in the art, the STM32F103C8T6 controller serves as the core control component, coordinating and regulating the coordinated operation of all antenna components. External signals are input to the MSW-2-1800-2000 power divider via the SMA-KHD feed interface 300. Under the control of the controller, the power divider proportionally distributes the signal to each copper foil microstrip feed line. The microstrip feed line transmits the signal to the radiating patch 220 of the corresponding radiating unit 210. With the cooperation of the I-shaped loading slot 221, the radiating patch 220 expands the working bandwidth, converting the electrical signal into directional electromagnetic wave radiation. The polytetrafluoroethylene dielectric support layer 230 reduces the signal loss between the radiating patch 220 and the FR4 epoxy resin dielectric substrate 100. The 6061 aluminum alloy reflector 400 is precisely fixed to the positioning holes 110 of the dielectric substrate 100 via positioning posts 410, and to the copper foil grounding layer 5. The antenna is tightly fitted to the ground layer 500, which reflects downward-radiated electromagnetic waves in a directional manner, enhancing the directional radiation effect. The hollowed-out groove 510 on the ground layer 500 reduces signal obstruction and further reduces signal loss. The radiating elements 210 of the matrix-type radiating element array 200 are arranged in a 4×4 matrix, divided into three groups: low-frequency, mid-frequency, and high-frequency, and are located at different positions in the matrix to collaboratively achieve the radiation and reception of multi-band signals. The protective shell 600 provides waterproof, dustproof, and flame-retardant protection for each component. The top of the protective shell 600 is sealed with a top plate 620, and the heat dissipation holes 610 accelerate the dissipation of internal heat to ensure long-term stable operation of the antenna. At the same time, the external multi-band signals received by the radiating element 210 are collected by the microstrip feeder to the power divider, and then output to the external device through the feed interface 300. The controller collects the working parameters and signal status of each component in real time, and dynamically adjusts the signal distribution ratio of the power divider and the working status of the radiating element 210 to achieve stable and efficient transmission of multi-band signals.

[0032] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A matrix-type multi-band high-gain directional antenna, characterized in that, include: The dielectric substrate (100), matrix radiating unit array (200), feed network, reflector (400) and ground layer (500) are arranged on the upper surface of the dielectric substrate (100), the ground layer (500) covers the lower surface of the dielectric substrate (100) and is tightly attached, the reflector (400) is fixed below the ground layer (500) and parallel to the ground layer (500), the feed network is embedded inside the dielectric substrate (100) and its two ends are electrically connected to the matrix radiating unit array (200) and the external feed interface (300) respectively. The matrix radiating unit array (200) is composed of multiple radiating units (210) of different sizes arranged in an M×N matrix to realize multi-band signal directional radiation and reception, and the reflector (400) is used to enhance the directionality.

2. The matrix-type multi-band high-gain directional antenna according to claim 1, characterized in that, In the M×N matrix, M and N are both integers ≥2, preferably a 4×4 matrix. The multiple radiation units (210) are divided into at least three groups, each group has the same size and corresponds to a working frequency band. The three groups are distributed alternately at uniform intervals. The spacing between adjacent radiation units (210) of different frequency bands is the same. The center point of all radiation units (210) is located on the same straight grid to avoid multi-band signal interference.

3. A matrix-type multi-band high-gain directional antenna according to claim 2, characterized in that, The radiation unit (210) is a rectangular microstrip radiation structure, including a radiation patch (220), a dielectric support layer (230), and a loading groove (221). The dielectric support layer (230) is fixed to the upper surface of the dielectric substrate (100) and fully adhered. The radiation patch (220) is fixed to the upper surface of the dielectric support layer (230) and aligned. The loading groove (221) is I-shaped and opened in the center of the radiation patch (220) to expand the working bandwidth.

4. A matrix-type multi-band high-gain directional antenna according to claim 3, characterized in that, The length of the loading slot (221) is 1 / 2 to 2 / 3 of the length of the radiating patch (220), and the width is 1 / 8 to 1 / 6 of its width. The extension direction is consistent with the length of the radiating patch (220) and does not exceed the edge of the radiating patch (220). The size is adjusted to match the impedance requirements of the corresponding frequency band.

5. A matrix-type multi-band high-gain directional antenna according to claim 4, characterized in that, The dielectric substrate (100) is an FR4 epoxy resin substrate with a dielectric constant εr=4.4±0.2, a loss tangent ≤0.02, and a thickness of 1.6-2.0mm. The dielectric support layer (230) is made of polytetrafluoroethylene with a dielectric constant εr=2.6±0.1 and a thickness of 0.8-1.0mm, and is fixed directly below each radiating unit (210).

6. A matrix-type multi-band high-gain directional antenna according to claim 1, characterized in that, The power supply network includes a microstrip feeder, a power divider, and a power supply interface (300). The power divider is embedded in the center of the dielectric substrate (100) and located directly below the matrix-type radiating unit array (200). One end of the microstrip feeder is connected to the power divider, and the other end passes through the dielectric support layer (230) and connects to the radiating patch (220). The power supply interface (300) is an SMA connector that extends to the outside through the ground layer (500) and the reflector (400).

7. A matrix-type multi-band high-gain directional antenna according to claim 1, characterized in that, The reflector (400) is made of aluminum alloy with a thickness of 2.0-3.0 mm and a size larger than the dielectric substrate (100). The reflector (400) has integrated positioning posts (410) at the four corners and center of its surface. The dielectric substrate (100) has positioning holes (110) at corresponding positions. The positioning posts (410) are inserted into the positioning holes (110) for fixation, and their height is consistent with the thickness of the grounding layer (500).

8. A matrix-type multi-band high-gain directional antenna according to claim 1, characterized in that, The grounding layer (500) is made of copper foil with a thickness of 0.035-0.05mm, and fully covers the lower surface of the dielectric substrate (100). The grounding layer (500) has a hollowed-out groove (510) directly below each radiating unit (210), and its horizontal projection is consistent with the radiating patch (220). It does not penetrate the grounding layer (500) to reduce signal obstruction. The multi-frequency band includes a low-frequency band of 600MHz-1000MHz, a mid-frequency band of 2.1GHz-2.8GHz, and a high-frequency band of 3.4GHz-3.7GHz. The low-frequency radiating units (210) are located at the four corners of the matrix, the mid-frequency band is located in the middle of the edge, and the high-frequency band is located in the central area.

9. A matrix-type multi-band high-gain directional antenna according to claim 1, characterized in that, It also includes a protective shell (600), which is a square box that encloses all components. The inner wall leaves a gap with the reflector (400) and the dielectric substrate (100). The protective shell (600) is made of waterproof and flame-retardant ABS material. It has through holes corresponding to the power supply interface (300) and through-type heat dissipation holes (610) on the upper surface and both side walls.

10. A matrix-type multi-band high-gain directional antenna system, characterized in that, Includes the multi-band matrix directional antenna as described in any one of claims 1-9.

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