A kind of fusion ultrasonic, short wave low frequency band radio safety penetration device

Abstract

The application discloses a kind of fusions ultrasonic wave, short wave low frequency band radio safety penetration device, comprising: ultrasonic wave radio signal transceiver link module, short wave / ultra-short wave radio signal transceiver link module and power module;The power module is respectively with the circuit connection between ultrasonic wave radio signal transceiver link module and short wave / ultra-short wave radio signal transceiver link module;The ultrasonic wave radio signal transceiver link module includes ultrasonic wave radio signal receiving link module and ultrasonic wave radio signal transmitting link module;The short wave / ultra-short wave radio signal transceiver link module includes short wave / ultra-short wave radio signal receiving link module and short wave / ultra-short wave radio signal transmitting link module.The application solves the deficiency of existing radio bottom layer safety depth scanning penetration tool.

Description

Technical Field

[0001] This invention relates to the field of radio security penetration testing and attack and defense technology, and in particular to a radio security penetration device that integrates ultrasonic waves and shortwave low-frequency bands. Background Technology

[0002] In today's information age, cybersecurity has become a crucial component of national security, and the underlying network security is the cornerstone of cybersecurity. With the acceleration of global informatization, the importance of underlying network security is increasingly prominent, especially in the niche field of radio security. Radio security involves a wide range of applications, including but not limited to electronic warfare, radio attack and defense penetration, radio ranges, radio countermeasures, radio scanning penetration, and radio security detection and analysis. Its application areas cover many critical infrastructure sectors such as military electronics, connected vehicles, the Internet of Things, and industrial control power. Currently, radio security penetration applications on the market are mainly concentrated in the 70MHz~6GHz frequency band, but there is a lack of targeted deep scanning penetration tools for low-frequency ultrasonic, shortwave, ultra-shortwave, and microwave frequency bands above 6GHz. The main reason is that existing single devices or modules rarely support ultra-wide full-band operation, and existing products are functionally limited and expensive, unable to simultaneously cover low-frequency ultrasonic, shortwave, ultra-shortwave, and microwave frequency bands above 6GHz, especially lacking deep attack and defense penetration capabilities for underlying radio security. Furthermore, similar products from foreign manufacturers are not sold in China due to technological monopolies and restrictions, resulting in high-end radio security penetration applications failing to meet the needs of the domestic market.

[0003] CN117880820A discloses a vehicle-to-everything (V2X) radio safety assurance system and method. The system includes multiple sensor-type radio monitoring receivers configured on both sides of an autonomous driving road to form a seamless radio monitoring layout. This allows for monitoring the distribution of radio spectrum data on the autonomous driving road and uploading the monitored radio spectrum data to a V2X radio safety assurance system cloud platform. Furthermore, the system fuses radio spectrum data received from at least three nearby sensor-type radio monitoring receivers, providing intelligent V2X radio safety monitoring signal data and early warning signal data. While this solution improves wireless communication to ensure the safety of the V2X system for autonomous vehicles and offers enhanced emergency rescue and troubleshooting capabilities, its application scope is limited to V2X. Summary of the Invention

[0004] The main objective of this invention is to propose a device that integrates ultrasonic and shortwave low-frequency radio security penetration techniques, aiming to address the lack of similar targeted radio security deep scanning penetration tools on the market.

[0005] To achieve the above objectives, the present invention provides a device for integrated ultrasonic and shortwave low-frequency radio security penetration, wherein the device comprises: an ultrasonic wireless signal transceiver link module, a shortwave / ultra-shortwave wireless signal transceiver link module, and a power supply module; the power supply module establishes circuit connections with both the ultrasonic wireless signal transceiver link module and the shortwave / ultra-shortwave wireless signal transceiver link module; the ultrasonic wireless signal transceiver link module includes an ultrasonic wireless signal receiving link module and an ultrasonic wireless signal transmitting link module; the shortwave / ultra-shortwave wireless signal transceiver link module includes a shortwave / ultra-shortwave wireless signal receiving link module and a shortwave / ultra-shortwave wireless signal transmitting link module.

[0006] In one preferred embodiment, the ultrasonic wireless signal receiving link module includes, in series, an ultrasonic receiving sensor, an ultrasonic receiving impedance matching circuit 1, a limiting circuit, a pre-coupled amplifier circuit, an AGC / MGC gain control module, a filter buffer circuit, an ultrasonic receiving impedance matching circuit 2, an RMS measurement circuit, an ultrasonic receiving analog switch circuit 2, an amplifier circuit, and a high-speed comparison circuit.

[0007] In one preferred embodiment, the output of the filter buffer circuit is further connected to an external signal transmission line, and a branch consisting of a multiplier and an LPF filter circuit for the ultrasonic segment is also connected from the external signal transmission line. The branch is connected to another input of the analog switch 2 circuit for ultrasonic reception.

[0008] In one preferred embodiment, the ultrasonic wireless signal receiving link module further includes an AGC feedback circuit, an MGC signal conditioning circuit, and an analog switch 1 circuit for ultrasonic reception; the output terminals of the AGC feedback circuit and the MGC signal conditioning circuit are respectively connected to different input terminals of the analog switch 1 circuit for ultrasonic reception, and the output terminal of the analog switch 1 circuit for ultrasonic reception is connected to the AGC / MGC gain control module.

[0009] In one preferred embodiment, the ultrasonic wireless signal transmission link module includes an IV conversion circuit and I modulation links and Q modulation links arranged in parallel.

[0010] In one preferred embodiment, the I modulation link and the Q modulation link have the same structure, each including an LPF differential filter circuit, a differential amplifier circuit, a balun conversion circuit, an ultrasonic emission impedance matching 1 circuit, a drive amplifier circuit, an ultrasonic emission impedance matching 2 circuit, a step-up transformer drive module, an ultrasonic emission impedance matching 3 circuit, and an ultrasonic emission sensor connected in series.

[0011] One preferred embodiment is that the shortwave / ultra-shortwave wireless signal receiving link module includes a shortwave / ultra-shortwave receiving sensor, a digital gain attenuation circuit, a shortwave receiving LNA low-noise amplifier circuit, a shortwave band LPF filter circuit, a shortwave receiving mixer circuit, RF switch 1 & 2 circuits, and a local oscillator signal source circuit connected in series.

[0012] In one preferred embodiment, the two channels between RF switch 1 and RF switch 2 in the RF switch 1&2 circuit are respectively connected through a 120MHz~150MHz BPF filter circuit and an 80MHz~120MHz BPF filter circuit.

[0013] In one preferred embodiment, the shortwave / ultra-shortwave wireless signal transmission link module includes a DIV digitally adjustable frequency divider, an LPF low-pass filter matrix circuit, an IQ quadrature modulation module, a shortwave / ultra-shortwave drive amplifier circuit, and a shortwave / ultra-shortwave transmission sensor connected in series.

[0014] In the above technical solution of the present invention, the ultrasonic and shortwave low-frequency band radio security penetration device includes: an ultrasonic wireless signal transceiver link module, a shortwave / ultra-shortwave wireless signal transceiver link module, and a power supply module; the power supply module establishes circuit connections with both the ultrasonic wireless signal transceiver link module and the shortwave / ultra-shortwave wireless signal transceiver link module; the ultrasonic wireless signal transceiver link module includes an ultrasonic wireless signal receiving link module and an ultrasonic wireless signal transmitting link module; the shortwave / ultra-shortwave wireless signal transceiver link module includes a shortwave / ultra-shortwave wireless signal receiving link module and a shortwave / ultra-shortwave wireless signal transmitting link module. The present invention addresses the shortcomings of existing deep scanning penetration tools for low-level radio security.

[0015] This invention expands the scope of radio security by integrating ultrasonic, shortwave, and ultra-shortwave radio frequencies across the entire frequency band, extending coverage to sub-sectors such as underwater acoustic wireless communication security, automotive ultrasonic radar communication security, and microwave communication security. The operating frequency range can be extended to 1Hz~17GHz and above. It achieves a highly efficient cross-integration design of zero-IF architecture, traditional superheterodyne architecture, and IQ quadrature modulation technologies, saving user costs and simplifying system architecture design. It features a high-quality signal link design, employing advanced filtering technology, LNA low-noise amplification, high-speed switching, RMS power conversion acquisition, and IO control, significantly improving key underlying performance of the wireless system, such as signal-to-noise ratio, harmonic suppression, receiver sensitivity, and noise figure. Based on hardware AGC (Automatic / Manual Gain Control), it meets diverse wireless penetration application scenarios; adopting modular stacking design technology, it supports external hardware stacking expansion, ensuring clustered concurrent penetration applications without compromising various analytical performance indicators, meeting the needs of high-end radio penetration applications; it also features a compatible and scalable design with rich external hardware interfaces, facilitating use with the matching host; the ultrasonic transceiver sensor adopts an external modular design, which can be flexibly replaced according to actual application needs, and can simultaneously support two channels of concurrent ultrasonic modulation transmission, each with a different operating frequency band, meeting MIMO-like wireless application scenarios to adapt to different operating frequencies, or multiple devices can be cascaded to form an ultrasonic transceiver sensor array, simultaneously supporting different ultrasonic operating frequency bands. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a wireless security penetration device that integrates ultrasonic waves and shortwave low-frequency bands, according to an embodiment of the present invention.

[0018] Figure 2 This is a schematic diagram of the power supply logic of the power module in an embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of the impedance matching circuit 1 for ultrasonic receiver according to an embodiment of the present invention;

[0020] Figure 4 This is a schematic diagram of the limiting circuit according to an embodiment of the present invention;

[0021] Figure 5 This is a schematic diagram of the pre-coupled amplifier circuit according to an embodiment of the present invention;

[0022] Figure 6 This is a schematic diagram of the AGC / MGC gain control module according to an embodiment of the present invention;

[0023] Figure 7 This is a schematic diagram of the filter buffer circuit according to an embodiment of the present invention;

[0024] Figure 8 This is a schematic diagram of the RMS measurement circuit according to an embodiment of the present invention;

[0025] Figure 9 This is a schematic diagram of the AGC feedback circuit according to an embodiment of the present invention;

[0026] Figure 10 This is the analog switch 1 circuit for ultrasonic receiving according to an embodiment of the present invention;

[0027] Figure 11 This is a schematic diagram of a multiplier according to an embodiment of the present invention;

[0028] Figure 12 This is a schematic diagram of the LPF filter circuit for the ultrasonic segment in an embodiment of the present invention.

[0029] Figure 13 This is a schematic diagram of the analog switch 2 circuit for ultrasonic receiving according to an embodiment of the present invention;

[0030] Figure 14 This is a schematic diagram of the amplifier circuit according to an embodiment of the present invention;

[0031] Figure 15 This is a schematic diagram of a high-speed comparison circuit according to an embodiment of the present invention;

[0032] Figure 16 This is a schematic diagram of the IV conversion circuit according to an embodiment of the present invention;

[0033] Figure 17 This is a schematic diagram of the LPF differential filter circuit according to an embodiment of the present invention;

[0034] Figure 18 This is a schematic diagram of a differential amplifier circuit according to an embodiment of the present invention;

[0035] Figure 19 This is a schematic diagram of a balun converter circuit according to an embodiment of the present invention;

[0036] Figure 20 This is a schematic diagram of the driving amplifier circuit according to an embodiment of the present invention;

[0037] Figure 21 This is a schematic diagram of the step-up transformer drive module according to an embodiment of the present invention;

[0038] Figure 22This is a schematic diagram of the digital gain attenuation circuit according to an embodiment of the present invention;

[0039] Figure 23 This is a schematic diagram of the LNA low-noise amplifier circuit for shortwave reception according to an embodiment of the present invention.

[0040] Figure 24 This is a schematic diagram of a short-wavelength LPF filter circuit according to an embodiment of the present invention;

[0041] Figure 25 This is a schematic diagram of a mixer circuit for shortwave reception according to an embodiment of the present invention;

[0042] Figure 26 This is a schematic diagram of the radio frequency switch 1 & 2 circuit according to an embodiment of the present invention;

[0043] Figure 27 This is a schematic diagram of the radio frequency switch 1 circuit according to an embodiment of the present invention;

[0044] Figure 28 This is a schematic diagram of a DIV digital adjustable frequency divider according to an embodiment of the present invention;

[0045] Figure 29 This is a schematic diagram of the LPF low-pass filter matrix circuit according to an embodiment of the present invention;

[0046] Figure 30 This is a schematic diagram of the IQ quadrature modulation module according to an embodiment of the present invention;

[0047] Figure 31 This is a schematic diagram of a shortwave / ultra-shortwave drive amplifier circuit according to an embodiment of the present invention;

[0048] Figure label:

[0049] 1. Ultrasonic wireless signal transceiver link module;

[0050] 11. Ultrasonic wireless signal receiving link module; 111. Ultrasonic receiving sensor; 112. Impedance matching circuit 1 for ultrasonic receiving; 113. Limiting circuit; 114. Pre-coupled amplifier circuit; 115. AGC / MGC gain control module; 116. Filter buffer circuit; 117. Impedance matching circuit 2 for ultrasonic receiving; 118. RMS measurement circuit; 119. Analog switch 2 circuit for ultrasonic receiving; 1110. Amplifier circuit; 1111. High-speed comparator circuit; 1112. Multiplier; 1113. LPF filter circuit for ultrasonic band; 1114. AGC feedback circuit; 1115. MGC signal conditioning circuit; 1116. Analog switch 1 circuit for ultrasonic receiving;

[0051] 12. Ultrasonic wireless signal transmission link module; 121. IV conversion circuit; 122. LPF differential filter circuit; 123. Differential amplifier circuit; 124. Balun converter circuit; 125. Impedance matching circuit 1 for ultrasonic transmission; 126. Drive amplifier circuit; 127. Impedance matching circuit 2 for ultrasonic transmission; 128. Step-up transformer drive module; 129. Impedance matching circuit 3 for ultrasonic transmission; 1210. Ultrasonic transmitting sensor;

[0052] 2. Shortwave / UHF wireless signal transceiver link module;

[0053] 21. Shortwave / UHF wireless signal receiving link module; 211. Shortwave / UHF receiving sensor; 212. Digital gain attenuation circuit; 213. LNA low-noise amplifier circuit for shortwave reception; 214. Shortwave band LPF filter circuit; 215. Mixer circuit for shortwave reception; 216. RF switch 1 & 2 circuit; 217. Local oscillator signal source circuit; 218. Mixer circuit for shortwave reception;

[0054] 22. Shortwave / UHF wireless signal transmission link module; 221. DIV digital adjustable frequency divider; 222. LPF low-pass filter matrix circuit; 223. IQ quadrature modulation module; 224. Shortwave / UHF drive amplifier circuit; 225. Shortwave / UHF transmitting sensor.

[0055] The realization of the objective, functional characteristics and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0056] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0057] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0058] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0059] See Figures 1-31 According to one aspect of the present invention, the present invention provides a device for integrated ultrasonic and shortwave low-frequency radio security penetration, wherein the device comprises: an ultrasonic wireless signal transceiver link module 1, a shortwave / ultra-shortwave wireless signal transceiver link module 2, and a power supply module; the power supply module establishes circuit connections with the ultrasonic wireless signal transceiver link module 1 and the shortwave / ultra-shortwave wireless signal transceiver link module 2 respectively; the ultrasonic wireless signal transceiver link module 1 includes an ultrasonic wireless signal receiving link module 11 and an ultrasonic wireless signal transmitting link module 12; the shortwave / ultra-shortwave wireless signal transceiver link module 2 includes a shortwave / ultra-shortwave wireless signal receiving link module 21 and a shortwave / ultra-shortwave wireless signal transmitting link module 22.

[0060] Specifically, in this embodiment, the ultrasonic wireless signal receiving link module 11 includes, in series, an ultrasonic receiving sensor 111, an ultrasonic receiving impedance matching 1 circuit 112, a limiting circuit 113, a pre-coupled amplifier circuit 114, an AGC / MGC gain control module 115, a filter buffer circuit 116, an ultrasonic receiving impedance matching 2 circuit 117, an RMS measurement circuit 118, an ultrasonic receiving analog switch 2 circuit 119, an amplifier circuit 1110, and a high-speed comparator circuit 111.

[0061] Specifically, in this embodiment, the impedance matching circuit 112 of the ultrasonic receiver consists of a resistor R, which is connected between the two pins of the external ultrasonic receiver sensor 111 probe; it realizes impedance matching between the front and rear circuits. Its main function is impedance matching, reducing the duration of the inherent residual resonance signal of the ultrasonic receiver sensor 111, and improving the performance of the receiving link. The output signal is ULTRA_SIG, which is output to the subsequent limiting circuit 113.

[0062] Specifically, in this embodiment, the amplitude limiting circuit 113 is a pre-protection circuit located at the very front end of the ultrasonic wireless signal receiving link. Its main function is to prevent the overvoltage of the received signal caused by receiving a strong signal from affecting or damaging the normal operation of the subsequent circuits. Its front end is the ultrasonic receiving sensor 111. The signal amplitude is limited mainly by two sets of four Schottky diodes, D1, D2, D3, and D4, connected in series. R1 is a current-limiting resistor. The present invention is designed to limit the received signal amplitude to within approximately ±1V. The input signal ULTRA_SIG is provided by the pre-stage impedance matching circuit 1, and the output signal ULTRA_SIG_RA is provided to the subsequent pre-coupled amplifier circuit 114.

[0063] Specifically, in this embodiment, the pre-coupled amplifier circuit 114 primarily ensures the quality of the signal received from the ultrasonic receiving sensor 111 and performs pre-primary amplification. It is mainly based on a BJT bipolar transistor, operating in the current linear amplification range. C1 is the input AC coupling capacitor, and C2 is the output AC coupling capacitor. R1, R2, and R3 are configured to ensure that the BJT transistor Q1 operates at a suitable quiescent operating point. After receiving the signal, the ultrasonic receiving signal is converted into a high-gain current signal, which is then converted into a voltage signal through the collector resistor R2 and finally coupled out to the subsequent AGC / MGC gain control circuit through the output capacitor. The input signal ULTRA_SIG_RA is provided by the pre-amplifier circuit 113, and the output signal ULTRA_SIG_OUT is provided to the subsequent AGC / MGC gain control module 115.

[0064] Specifically, in this embodiment, the AGC / MGC gain control module 115 is one of the core modules of the ultrasonic wireless signal receiving link module 11. It can be controlled by external IO and supports two modes: AGC automatic gain control and MGC manual gain control, so as to adapt to different wireless signal penetration application requirements. The input signal is ULTRA_SIG_OUT, which is provided by the output of the pre-amplifier circuit 114. The V_GAIN signal is a gain control voltage signal with an effective input range of -0.5V to +0.5V, corresponding to a gain control range of -10dB to +30dB. The V_GAIN signal is provided by the MGC signal conditioning circuit 1115 and the AGC feedback circuit 1114 through the analog switch 1. The main function of this signal is to control the signal amplification gain through different voltages, thereby realizing the working mechanism of the two modes: AGC and MGC. The output signal of this module is AGC_SIG_OUT, which is provided to the subsequent filter buffer circuit 116.

[0065] Specifically, in this embodiment, the filter buffer circuit 116 mainly realizes buffer isolation between the front and rear stage circuits to ensure the quality of the signal chain; the input signal AGC_SIG_OUT is provided by the output of the front-stage AGC / MGC gain control module 115, and the output signal AGC_SIG_OUT2 is provided to the subsequent impedance matching 2 circuit and multiplier 1112 circuit respectively. At the same time, the signal is led out through an external connector as a carrier signal analog output, which is convenient for users to analyze and process, so as to realize quantitative and qualitative analysis of the ultrasonic signal emitted by the device under test.

[0066] Specifically, in this embodiment, the RMS measurement circuit 118 mainly realizes the power measurement of the ultrasonic wireless signal, provides effective input to the AGC feedback circuit 1114, and is one of the core modules of AGC automatic gain control. The input signal ULTRA_SIG_OUT2 of this module is provided by the front-stage impedance matching circuit 2, and the output signal V_RMS is provided to the AGC feedback circuit 1114 and the analog switch circuit 2 respectively. The main purpose of outputting to the analog switch circuit 2 is to realize ASK digital demodulation output based on the RMS power measurement principle.

[0067] Specifically, in this embodiment, the output terminal of the filter buffer circuit 116 is also led out to an external signal transmission line, and a branch consisting of a multiplier 1112 and an LPF filter circuit 1113 of the ultrasonic segment is also led out from the external signal transmission line. The branch is connected to another input terminal of the analog switch 2 circuit 119 for ultrasonic reception.

[0068] Specifically, in this embodiment, the multiplier 1112 is designed based on the working principle of the four-quadrant multiplier 1112. The main function of this module is to perform square law operation on the frequency of the received signal to achieve a frequency doubling effect, and at the same time convert the AC signal into a positive signal above 0V, which facilitates the ASK digital demodulation output based on LC low-pass filtering. The AGC_SIG_OUT2 signal is provided by the buffer circuit. After the square law operation by the multiplier 1112, the MUL_ASK_F signal is output. The frequency of this signal is twice that of the AGC_SIG_OUT2 signal. The MUL_ASK_F signal is finally output to the LPF filter circuit 1113 of the subsequent ultrasonic segment.

[0069] Specifically, in this embodiment, the LPF filter circuit 1113 of the ultrasonic segment is a low-pass filter circuit, and the present invention is based on a third-order 50-ohm impedance LC low-pass filter circuit design; R1 and R2 are 50-ohm matching resistors to ensure impedance matching with the LPF filter circuit, and the fz cutoff frequency is designed to be approximately 5.3KHz to ensure the demodulation quality of the ASK signal. The input signal MUL_ASK_F is provided by the pre-amplifier multiplier circuit 1112, and MUL_ASK_F1 is the final output signal of this module, which is output to the analog switch 2 circuit 119 of the ultrasonic receiver.

[0070] Specifically, in this embodiment, the ultrasonic wireless signal receiving link module 11 further includes an AGC feedback circuit 1114, an MGC signal conditioning circuit 1115, and an ultrasonic receiving analog switch 1 circuit 1116; the output terminals of the AGC feedback circuit 1114 and the MGC signal conditioning circuit 1115 are respectively connected to different input terminals of the ultrasonic receiving analog switch 1 circuit 1116, and the output terminal of the ultrasonic receiving analog switch 1 circuit 1116 is connected to the AGC / MGC gain control module 115.

[0071] Specifically, in this embodiment, the AGC feedback circuit 1114 is one of the core modules of the AGC automatic gain control. Its main function is to convert the output signal V_RMS of the RMS measurement circuit 118 into a suitable AGC gain control voltage signal (effective value range -0.5V to +0.5V), ensuring that the AGC automatic gain control voltage is within the linear gain control range. This circuit consists of a near unity-gain operational amplifier subtraction circuit. Its positive input terminal is connected to +5V and is composed of two voltage divider resistors R3 and R4. By properly setting the resistance values ​​of R3 and R4, the voltage at the positive input terminal pin is ensured. The voltage VREF≈1.6V, and the inverting input signal is V_RMS, provided by the pre-amplifier RMS measurement circuit 118. The effective value range of the V_RMS signal is 0V~3.2V. After processing by this subtraction circuit, the output signal voltage range is approximately 1.6V~-1.6V. By properly setting the values ​​of the output voltage divider resistors R5 and R6, the output voltage range of the V_AGC signal is ensured to be +0.5V~-0.5V, which meets the voltage linearity requirements of AGC automatic gain control. The V_AGC signal is the final effective output signal of this circuit, which is output to the analog switch 1 circuit 1116 of the ultrasonic receiver.

[0072] Specifically, in this embodiment, the analog switch 1 circuit 1116 of the ultrasonic receiver mainly functions to switch between two working modes, AGC automatic gain control and MGC manual gain control, through external IO control, in order to adapt to different wireless penetration application requirements. The AGC_MGC_MODE signal is the external IO control signal, which facilitates the user to switch between AGC and MGC working modes. The V_AGC input signal is provided by the output of the front-end AGC feedback circuit 1114, and the V_MGC input signal is provided by the external DAC1 (effective DAC1 output voltage: -0.5V~+0.5V). The V_GAIN signal is the final output signal of this module, which is output to the AGC / MGC gain control circuit to realize AGC gain control.

[0073] Specifically, in this embodiment, the analog switch 2 circuit 119 of the ultrasonic receiver mainly functions to demodulate and output the ASK digital baseband signal based on two technical solutions. The first solution of this module is to demodulate the ASK digital baseband signal based on the RMS effective value output by the RMS measurement module. The second solution is to demodulate and output the ASK digital baseband signal based on the LC low-pass filtering of the carrier signal. The V_RMS signal is provided by the output of the RMS measurement circuit 118, the MUL_ASK_F1 signal is provided by the LPF filtering circuit, and the ASK_DEMOD_FST signal is the output signal of this module, which is provided to the subsequent amplifier circuit 1110.

[0074] Specifically, in this embodiment, the main function of the amplifier circuit 1110 is to effectively amplify the output signal ASK_DEMOD_FST of the analog switch 2 circuit to meet the input requirements of the subsequent comparator circuit, thereby achieving high-quality ASK digital demodulation output. The amplifier circuit 1110 adopts a forward amplifier circuit 1110, the input signal ASK_DEMOD_FST is provided by the analog switch 2 circuit, and the output signal ASK_DEMOD_SEC is provided to the subsequent high-speed comparator circuit 111.

[0075] Specifically, in this embodiment, the high-speed comparator circuit 111 mainly functions to achieve the final ASK digital demodulation output. In the low-power high-speed comparator design, the DAC2 input signal is provided by the output of the external DAC2 as a reference comparison voltage, the ASK_DEMOD_SEC input signal is provided by the output of the preamplifier circuit 1110, and ASK_OUT is the final ASK digital baseband demodulation output signal for analysis by the user or external host device.

[0076] Specifically, in this embodiment, the ultrasonic wireless signal transmission link module 12 includes an IV conversion circuit 121 and I modulation links and Q modulation links connected in parallel. The I modulation links and Q modulation links have the same structure, each including an LPF differential filter circuit 122, a differential amplifier circuit 123, a balun conversion circuit 124, an ultrasonic transmission impedance matching 1 circuit 125, a drive amplifier circuit 126, an ultrasonic transmission impedance matching 2 circuit 127, a step-up transformer drive module 128, an ultrasonic transmission impedance matching 3 circuit 129, and an ultrasonic transmission sensor 1210 connected in series.

[0077] Specifically, in this embodiment, the main function of the IV conversion circuit is to convert the external IQ differential current modulation signal into an IQ differential voltage modulation signal. It consists of four high-precision, low-resistance resistors. The LPF differential filter circuit 122 mainly performs low-pass filtering on the IQ differential voltage signal of the IV conversion circuit 121 to reduce noise and interference and improve the signal-to-noise ratio. The two independent LPF differential filter circuits 122 correspond to the IQ filtering respectively. This filtering module is based on a 5th-order 50-ohm LC low-pass filter circuit design, and the fz cutoff frequency is designed to be approximately 23MHz. The input signals are the two IQ differential signal pairs I+, I-, Q+, and Q- of the front-stage IV conversion circuit 121, and the output signals are I+_OUT, I-_OUT, Q+_OUT, and Q-_OUT, which are output to the subsequent differential amplifier circuit 123. At the same time, it will also be output to the IQ quadrature modulation module 223 of the shortwave / ultra-shortwave wireless transmission link.

[0078] Specifically, in this embodiment, two independent differential amplifier circuits 123 amplify the output signal of the front-stage LPF differential filter circuit 122 by one stage to prepare for the high-voltage drive of the subsequent ultrasonic wireless transmission link; the input signal is the two pairs of differential signals I+_OUT, I-_OUT, Q+_OUT, and Q-_OUT output by the front-stage LPF differential filter circuit 122, and the output signal is used by the subsequent balun conversion circuit 124.

[0079] Specifically, in this embodiment, two independent balun converter circuits 124 isolate and convert the I and Q modulation signals into AC single-ended outputs, preparing for the subsequent drive amplifier circuit 126. The primary coil corresponds to the output signal of the differential amplifier circuit 123, and the secondary coil is the balun converter output signal, which is output to the subsequent drive amplifier circuit 126. R1, R2, and R3 are matching resistors, forming an impedance matching circuit, mainly to ensure impedance matching between the balun converter circuit 124 and the preceding and following stages.

[0080] Specifically, in this embodiment, the two independent drive amplifier circuits 126 primarily amplify the output signal of the pre-stage balun converter circuit 124, driving and amplifying the I and Q modulation signals respectively. The VIN+ input signal is provided by the pre-stage balun converter circuit 124, and the EN_CTR enable control signal is controlled by an external enable IO to control the switching on / off state of the drive amplifier circuit 126, saving power consumption. Resistor R3 is an impedance matching circuit 2, achieving impedance matching between the pre-stage and post-stage circuits to ensure signal link quality.

[0081] Specifically, in this embodiment, the step-up transformer drive module 128 can also be called the ultrasonic intermediate frequency transformer drive module. Its main function is to step up and transform the signal output by the pre-stage drive amplifier circuit 126 so as to finally drive the ultrasonic transmitting sensor 1210 probe and meet the application requirements of long-distance ultrasonic wireless signal transmission. The primary coil pins 4 and 6 are the input signals, which are provided by the output of the pre-stage drive amplifier circuit 126, and pins 1 and 3 are the output signals, which are used to drive the ultrasonic transmitting sensor 1210.

[0082] Specifically, in this embodiment, the shortwave / ultra-shortwave wireless signal receiving link module 21 includes a shortwave / ultra-shortwave receiving sensor 211, a digital gain attenuation circuit 212, a shortwave receiving LNA low-noise amplifier circuit 213, a shortwave band LPF filter circuit 214, a shortwave receiving mixer circuit 218-215, RF switch 1 & 2 circuits, and a local oscillator signal source circuit 217 connected in series. The two channels between RF switch 1 and RF switch 2 of the RF switch 1 & 2 circuits are respectively connected through a 120MHz~150MHz BPF filter circuit and an 80MHz~120MHz BPF filter circuit.

[0083] Specifically, in this embodiment, the local oscillator signal source circuit 217 is designed to output an internal 80MHz fixed frequency signal (other fixed output frequencies can also be selected according to the actual application scenario). It adopts a high-precision, low-temperature drift active crystal oscillator module to ensure high stability and high precision of the output frequency. The output signal type is LVDS differential signal. VCC is the working power input of the local oscillator signal source circuit 217 module. LO_RX+ / LO_RX- are the 80MHz fixed frequency LVDS differential output signals of this module, which are output to the subsequent mixer module to provide an effective RX local oscillator input signal.

[0084] Specifically, in this embodiment, the digital gain attenuation circuit 212 is the front-end processing module of the shortwave / ultra-shortwave wireless signal receiving link. Its main function is to flexibly control the gain of the receiving link through external IO, so as to avoid front-end signal saturation, which would affect the signal reception quality and cause distortion. The external IO control can flexibly achieve attenuation of 0.5dB to 31.5dB. S_RFIN is the signal received by the external antenna, and S_RFIN2 is the output signal after attenuation by this module circuit, which is output to the subsequent LNA low-noise amplifier circuit to ensure that the subsequent LNA low-noise amplifier circuit works in the linear amplification operating region.

[0085] Specifically, in this embodiment, the LNA low-noise amplifier circuit 213 for shortwave reception amplifies the weak shortwave / ultra-shortwave wireless signal received by the external antenna with low noise to ensure that the signal input requirements of the subsequent mixer circuit are met; S_RFIN2 is provided by the output of the preceding digital attenuation circuit, and LNA_RF_OUT is the low-noise amplification output signal, which is output to the subsequent LPF filter circuit for use.

[0086] Specifically, in this embodiment, the shortwave LPF filter circuit 214 performs low-pass filtering on the output signal of the pre-stage LNA low-noise amplifier circuit 213 to reduce signal noise and interference, improve the signal-to-noise ratio, and ensure a cleaner signal provided to the subsequent mixer circuit. The LNA_RF_OUT input signal is provided by the output of the pre-stage LNA low-noise amplifier circuit 213, and RFIN is the output signal of this circuit, which is output to the subsequent mixer circuit. The passband frequency of this circuit is designed to be DC~70MHz to ensure effective input of shortwave / ultra-shortwave wireless signals.

[0087] Specifically, in this embodiment, the mixer circuit 218215 for shortwave reception is one of the core modules of the shortwave / ultra-shortwave wireless signal receiving link. Based on an up-conversion operating mode design, unlike the principle of IQ modulation and demodulation technology, this patent uses a traditional superheterodyne architecture design in this wireless receiving link. The mixer output signal is then input to a matching external zero-IF architecture wireless receiving link, thereby switching to IQ demodulation operating mode. This effectively integrates the traditional superheterodyne architecture and IQ demodulation reception, saving costs and simplifying system architecture design. The RFIN input signal is provided by the output of the pre-stage LPF filter circuit, with an effective input frequency of 5MHz~70MHz. z, LO_RX is the local oscillator input signal of the mixer circuit. This signal is provided by the analog switch 1 circuit in the shortwave / ultra-shortwave wireless signal transmission link. The input frequency range is 75MHz~150MHz. RF_MIX_OUT is the up-conversion output signal of the mixer circuit, which is output to the RF switch 1 circuit in the subsequent stage of this link. This signal is provided by the front-end local oscillator signal source circuit 217 module. The input frequency range is 75MHz~150MHz. It can also be provided by an external local oscillator signal output depending on the actual application scenario. RF_MIX_OUT is the up-conversion output signal of the mixer circuit module, which is output to the RF switch 1 circuit module in the subsequent stage of this link.

[0088] Specifically, in this embodiment, the main function of the RF switch 1&2 circuit is to select an appropriate channel based on the output signal of the pre-amplifier circuit through the external IO control signal, and perform targeted bandpass filtering to ensure that the input signal to the host device with the matching external zero intermediate frequency architecture is purer, reduce noise and interference, and improve the signal-to-noise ratio.

[0089] Specifically, in this embodiment, the input signal of RF switch 1 is provided by the output of the pre-amplifier circuit. RF switch 1 and RF switch 2 form a switch array. The two middle channels correspond to BPF filter 1 circuit and BPF filter 2 circuit, respectively, serving as the output of RF switch 1 and the input of RF switch 2. BPF filter 1 is a 50-ohm impedance LC bandpass filter design with a bandpass frequency of 120MHz~150MHz, and BPF filter 2 is also a 50-ohm impedance LC bandpass filter design with a bandpass frequency of 80MHz~120MHz. The output signal of RF switch 2 is RF_MIX_OUT2, which is output to the RX receiving link of the matching external zero-IF architecture host device. Leveraging the superior and flexible performance of the external host zero-IF architecture receiving link, the traditional superheterodyne receiver and the IQ zero-IF demodulation RX receiving architecture design are effectively integrated, thereby achieving the goal of sharing existing internal functional modules.

[0090] Specifically, in this embodiment, the shortwave / ultra-shortwave wireless signal transmission link module 22 includes a DIV digital adjustable frequency divider 221, an LPF low-pass filter matrix circuit 222, an IQ quadrature modulation module 223, a shortwave / ultra-shortwave drive amplifier circuit 224, and a shortwave / ultra-shortwave transmission sensor 225 connected in series.

[0091] Specifically, in this embodiment, the main function of the DIV digital adjustable frequency divider 221 is to digitally divide the externally input LO local oscillator signal. It is one of the core modules of the shortwave / ultra-shortwave wireless signal transmission link, ensuring the effective input of shortwave / ultra-shortwave signals to the subsequent IQ quadrature modulation module 223. The frequency division coefficient can be flexibly controlled by external IO, and can achieve a digitally adjustable frequency division coefficient of 2 to 32. The LO_TX local oscillator signal is provided by the front-stage analog switch 1 circuit, and the frequency division coefficient is controlled by the external IO control signal. LO_TX_DIV is the output signal of this circuit, which is output to the subsequent LPF low-pass filter matrix circuit 222. When the frequency of the externally input LO local oscillator signal is less than or equal to 70MHz, this module can be omitted, and the external LO local oscillator signal can be directly input to the subsequent circuit of this module.

[0092] Specifically, in this embodiment, the LPF low-pass filter matrix circuit 222 is one of the core modules of the shortwave / ultra-shortwave wireless signal transmission link. Based on the LC low-pass filter circuit design, its main function is to effectively filter the output signal of the preceding DIV digital adjustable frequency divider 221 circuit, ensuring the input quality of the local oscillator signal of the subsequent IQ quadrature modulation module 223, reducing noise and interference, and improving the signal-to-noise ratio. The LPF low-pass filter matrix circuit 222 internally consists of a set of four RF switches and four corresponding LPF low-pass filter circuits. RF switch channel 1 corresponds to LPF filter 1 circuit, with a passband cutoff frequency fz1 designed to be 10MHz; RF switch channel 2 corresponds to LPF filter 2 circuit, with a passband cutoff frequency fz2 designed to be 16MHz; RF switch channel 3 corresponds to LPF filter 3 circuit, with a passband cutoff frequency fz3 designed to be 30MHz; and RF switch channel 4 corresponds to LPF filter 4 circuit, with a passband cutoff frequency fz4 designed to be 65MHz. The four filter circuits specifically filter the LO_TX_DIV input signal. The LO_TX_DIV signal is provided by the output of the front-stage DIV digital adjustable frequency divider 221 circuit. LO_TX_DIV_OUT is the output signal of this module, which is output to the subsequent IQ quadrature modulation module 223 as its internal local oscillator signal input. The external IO matrix switch control signal is controlled by the external supporting host device, and its main function is to control the switching of filter channels.

[0093] Specifically, in this embodiment, the IQ quadrature modulation module 223 is one of the core modules of the shortwave / ultra-shortwave wireless signal transmission link. Unlike the traditional superheterodyne modulation transmission mechanism, the IQ quadrature modulation-based transmission signal has better and purer quality, and is easier to use for diverse baseband modulation. The two differential IQ signal inputs, I+_OUT, I-_OUT, Q+_OUT, and Q-_OUT, are provided by the LPF differential filter circuit 122 in the ultrasonic wireless signal transmission link. That is, the IQ quadrature modulation module 223 of the shortwave / ultra-shortwave wireless signal transmission link shares the IV conversion circuit 121 and the LPF differential circuit in the ultrasonic wireless signal transmission link. The LO_TX_DIV_OUT input signal is the local oscillator input signal of the IQ quadrature modulation module 223, which is provided by the output of the front-stage LPF filter circuit. S_RF_OUT is the shortwave / ultra-shortwave RF output signal of the IQ quadrature modulation module 223, which is output to the subsequent shortwave / ultra-shortwave drive amplifier circuit 224. The LO_TX_DIV_OUT function is internally divided into two paths: one with a 90-degree phase shift and the other with a 0-degree phase shift. These paths are mixed with the I and Q differential signals respectively, and then added together for output, thereby achieving the function of IQ modulation transmission.

[0094] Specifically, in this embodiment, the shortwave / ultra-shortwave drive amplifier circuit 224 is the output at the end of the shortwave / ultra-shortwave wireless signal transmission link. It mainly amplifies the shortwave / ultra-shortwave radio frequency signal output from the front-end IQ quadrature modulation module 223. C1, L1, and C2 are impedance matching circuits to ensure signal input quality. C3 and R1 are amplification feedback circuits. C4 is an output coupling capacitor. The input signal S_RF_OUT is provided by the output of the front-end IQ quadrature modulation module 223. The output signal S_RF_OUT_AMP is the radio frequency output signal of the drive amplifier circuit 126 of this module, which can be connected to an external antenna or output to a third-party power amplifier device.

[0095] Specifically, in this embodiment, the rated input voltage of the power module is +12V / DC, and its output voltage includes: +15V, -15V, +8V, +6V, +5V, -5V, +3.3V, +1.5V, and -1.5V. The power module is the centralized power management module of the device, responsible for powering all link unit modules within the device. Its rated input voltage is +12V / DC, and it offers nine output voltages: +15V, -15V, +8V, +6V, +5V, -5V, +3.3V, +1.5V, and -1.5V. The following power modules are used for the following wireless signal transmission links: 1. The ultrasonic wireless signal transmission link is powered by +15V, -15V, +5V, and +3.3V; 2. The ultrasonic wireless signal reception link is powered by +5V, -5V, +3.3V, +1.5V, and -1.5V; 3. The shortwave / ultra-shortwave wireless signal transmission link is powered by +6V, +5V, and +8V; 4. The shortwave / ultra-shortwave wireless signal reception link is powered by +6V, +5V, and -5V.

[0096] The above are merely preferred embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A wireless security penetration device integrating ultrasonic waves and shortwave low-frequency bands, characterized in that, include: Ultrasonic wireless signal transceiver link module, shortwave / ultra-shortwave wireless signal transceiver link module, and power supply module; The power module establishes a circuit connection with the ultrasonic wireless signal transceiver link module and the shortwave / ultra-shortwave wireless signal transceiver link module respectively. The ultrasonic wireless signal transceiver link module includes an ultrasonic wireless signal receiving link module and an ultrasonic wireless signal transmitting link module. The shortwave / ultra-shortwave wireless signal transceiver link module includes a shortwave / ultra-shortwave wireless signal receiving link module and a shortwave / ultra-shortwave wireless signal transmitting link module.

2. The ultrasonic and shortwave low-frequency radio security penetration device according to claim 1, characterized in that, The ultrasonic wireless signal receiving link module includes, in series, an ultrasonic receiving sensor, an ultrasonic receiving impedance matching circuit 1, a limiting circuit, a pre-coupled amplifier circuit, an AGC / MGC gain control module, a filter buffer circuit, an ultrasonic receiving impedance matching circuit 2, an RMS measurement circuit, an ultrasonic receiving analog switch circuit 2, an amplifier circuit, and a high-speed comparison circuit.

3. The ultrasonic and shortwave low-frequency radio security penetration device according to claim 2, characterized in that, The output of the filter buffer circuit is also connected to an external signal transmission line. From the external signal transmission line, a branch consisting of a multiplier and an LPF filter circuit for the ultrasonic segment is also connected. The branch is connected to the other input of the analog switch 2 circuit for ultrasonic reception.

4. The ultrasonic and shortwave low-frequency radio security penetration device according to claim 2, characterized in that, The ultrasonic wireless signal receiving link module also includes an AGC feedback circuit, an MGC signal conditioning circuit, and an analog switch 1 circuit for ultrasonic reception; the output terminals of the AGC feedback circuit and the MGC signal conditioning circuit are respectively connected to different input terminals of the analog switch 1 circuit for ultrasonic reception, and the output terminal of the analog switch 1 circuit for ultrasonic reception is connected to the AGC / MGC gain control module.

5. A device for integrating ultrasonic and shortwave low-frequency radio security penetration according to any one of claims 1-4, characterized in that, The ultrasonic wireless signal transmission link module includes an IV conversion circuit and I modulation links and Q modulation links that are parallel to each other.

6. The ultrasonic and shortwave low-frequency radio security penetration device according to claim 5, characterized in that, The I-modulation link and Q-modulation link have the same structure, both including an LPF differential filter circuit, a differential amplifier circuit, a balun conversion circuit, an ultrasonic emission impedance matching 1 circuit, a drive amplifier circuit, an ultrasonic emission impedance matching 2 circuit, a step-up transformer drive module, an ultrasonic emission impedance matching 3 circuit, and an ultrasonic emission sensor connected in series.

7. A device for integrating ultrasonic waves and shortwave low-frequency radio security penetration according to any one of claims 1-4, characterized in that, The shortwave / ultra-shortwave wireless signal receiving link module includes a shortwave / ultra-shortwave receiving sensor, a digital gain attenuation circuit, a shortwave receiving LNA low-noise amplifier circuit, a shortwave band LPF filter circuit, a shortwave receiving mixer circuit, RF switch 1 & 2 circuits, and a local oscillator signal source circuit connected in series.

8. A wireless security penetration device integrating ultrasonic waves and shortwave low-frequency bands according to claim 7, characterized in that, The two channels between RF switch 1 and RF switch 2 in the RF switch 1 & 2 circuit are connected by a 120MHz~150MHz BPF filter circuit and an 80MHz~120MHz BPF filter circuit, respectively.

9. A wireless security penetration device integrating ultrasonic waves and shortwave low-frequency bands according to claim 7, characterized in that, The shortwave / ultra-shortwave wireless signal transmission link module includes a DIV digitally adjustable frequency divider, an LPF low-pass filter matrix circuit, an IQ quadrature modulation module, a shortwave / ultra-shortwave drive amplifier circuit, and a shortwave / ultra-shortwave transmission sensor connected in series.

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