Chip pick-up device

Abstract

The application relates to a chip pickup device, which comprises a pickup assembly, a detection assembly and a base. The pickup assembly comprises a base, a linear driving part, a buffer block and a pickup part. The pickup part is arranged on the buffer block and is used for picking up a chip. The linear driving part can apply controllable linear pressure to the pickup part through the buffer block towards the chip. The buffer block is slidingly arranged on the base in a direction perpendicular to the base film. The detection assembly comprises a detection gas path and a blocking part. The blocking part is arranged on the buffer block and has an initial position for blocking the detection gas path. When the pickup part contacts the chip, the buffer block is driven by the reaction force of a needle assembly to move a preset distance away from the chip, so as to drive the blocking part to at least partially separate from the detection gas path. The chip pickup device can reduce the probability of damage of the chip when the chip is sucked by the pickup part, and improve the yield and processing efficiency of semiconductor packaging.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a chip pickup device. Background Technology

[0002] In high-precision semiconductor packaging equipment, chips are typically carried on wafer thin films for processing on semiconductor assembly equipment. In the flip-chip bonding process between flexible tape substrates and chips, the chips on the wafer thin films need to be picked up, flipped, and transferred to a hot press head. This picking, flipping, and transfer is usually accomplished by a pick-up mechanism.

[0003] In related technologies, the force exerted by the picking mechanism when contacting the chip on the wafer thin film is difficult to control, which can easily cause the chip to crack or even break due to excessive picking force, affecting the yield and processing efficiency of semiconductor packaging. Summary of the Invention

[0004] This application aims to at least solve one of the technical problems existing in the prior art. To this end, this application provides a chip pickup device that can reduce the probability of chip damage when picked up by the pickup device and improve the yield and processing efficiency of semiconductor packaging.

[0005] This application provides a pickup device for picking up chips on a base film, comprising:

[0006] A push pin assembly is located on the side of the base film opposite to the chip, and is used to adsorb and lift the base film;

[0007] A pickup assembly includes a base, a linear drive, a buffer block, and a pickup element. The pickup element is disposed on the buffer block and is used to pick up a chip. The linear drive can apply a controllable linear pressure toward the chip to the pickup element through the buffer block. The buffer block is slidably mounted on the base in a direction perpendicular to the base film.

[0008] The detection component includes a detection gas path and a blocking component. The blocking component is disposed on the buffer block and has an initial position for blocking the detection gas path. When the pickup component contacts the chip, the buffer block is driven by the reaction force of the ejector pin assembly to move a preset distance away from the chip, so as to cause the blocking component to at least partially disengage from the detection gas path.

[0009] A control component is electrically connected to the ejector assembly and the detection gas path. The control component is able to acquire the gas pressure value of the detection gas path and control the ejector assembly to lift the base film based on the gas pressure value of the detection gas path.

[0010] The chip pickup device according to this application has at least the following beneficial effects:

[0011] The chip pickup device of this application, through the coordinated arrangement of a pin assembly, a pickup assembly, a detection assembly, and a control assembly, allows the linear drive of the pickup assembly to be pre-set with an appropriate linear pressure according to the chip specifications. This ensures that the pickup maintains a constant pickup force when contacting and picking up the chip on the base film, thus ensuring smooth contact and chip pickup. This avoids damage to the chip due to excessive pickup force or unstable chip pickup due to insufficient pickup force. Simultaneously, by sliding a buffer block on the base, when the pickup contacts the chip with a constant pickup force, the buffer block can drive the pickup under the reaction force of the pin assembly. The slight retraction of the sealing component serves two purposes: firstly, it provides a mechanical buffer for the chip; secondly, it causes the sealing component to at least partially detach from the detection gas path, resulting in a change in the gas pressure value of the detection gas path. This allows the control component to accurately determine whether the pickup component has made contact with the chip based on the change in the gas pressure value of the detection gas path. Consequently, it accurately controls the ejector assembly to perform a lifting action on the side of the base film away from the chip. This ensures that the chip is picked up and peeled off by the pickup component in the appropriate lifting state, avoiding insufficient lifting that prevents the chip from being separated, or excessive lifting that causes the chip to deform or be damaged. This improves the yield and processing efficiency of semiconductor packaging.

[0012] In some embodiments, the detection gas path is disposed on the base, and the detection component further includes a gas hole opened in the base, the gas hole being connected to the detection gas path, the linear drive being able to drive the buffer block to move so as to move the sealing member to the initial position, and the buffer block causing the sealing member to at least partially disengage from the gas hole when the pickup member contacts the chip.

[0013] In some embodiments, the detection component further includes a limiting member disposed on the base, the air hole being formed on the outer wall of the limiting member, an air passage being formed inside the limiting member, the detection air path communicating with the air hole through the air passage, and the sealing member being blocked by the limiting member when sealing the air hole.

[0014] In some embodiments, the linear actuator outputs a constant linear pressure when the pickup contacts the chip.

[0015] In some embodiments, the control component is electrically connected to the linear actuator, and the control component is capable of controlling the linear actuator to output a corresponding linear pressure according to the specifications of the chip.

[0016] In some embodiments, the linear drive is configured as a voice coil motor, and the control component controls the linear pressure output by the linear drive by controlling the current value input to the linear drive.

[0017] In some embodiments, the chip pickup device further includes an adapter, and the base is detachably connected to the adapter; the base is provided with a first position adjustment component, which is used to adjust the position of the base relative to the adapter so that the pickup surface of the pickup member is parallel to the chip.

[0018] In some embodiments, the first position adjustment component includes a first constraint plate, a first eccentric rod, a first limiting pin, a first elongated hole, and a second elongated hole. The first constraint plate is detachably connected to the base via a first locking member. Both the first elongated hole and the second elongated hole are formed in the first constraint plate. The first eccentric rod passes through the first elongated hole and is clearance-fitted with the base. The first limiting pin passes through the second elongated hole and is fixedly connected to the base. The first elongated hole extends in a direction perpendicular to the chip, and the second elongated hole is inclined relative to the first elongated hole.

[0019] In some embodiments, the adapter frame is provided with a second position adjustment assembly, which includes a second constraint plate, a second eccentric rod, a second limiting pin, a third elongated hole, and a fourth elongated hole. The second constraint plate is vertically connected to the first constraint plate, and the second constraint plate is detachably connected to the adapter frame via a second locking member. The third elongated hole and the fourth elongated hole are both formed in the second constraint plate. The second eccentric rod passes through the third elongated hole and is clearance-fitted with the adapter frame. The second limiting pin passes through the fourth elongated hole and is fixedly connected to the adapter frame. The third elongated hole and the fourth elongated hole are set at an angle.

[0020] In some embodiments, the chip pickup device further includes a rotary drive assembly, the output end of which is connected to the adapter to drive the adapter to rotate about the output axis of the rotary drive assembly, and the control assembly is electrically connected to the rotary drive assembly.

[0021] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0022] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0023] Figure 1This is a schematic diagram of the chip pickup device according to an embodiment of this application.

[0024] Figure 2 This is a schematic diagram of the chip pickup device according to an embodiment of this application from another perspective.

[0025] Figure 3 This is a partial structural diagram of the chip pickup device according to an embodiment of this application. Figure 1 .

[0026] Figure 4 This is a partial structural diagram of the chip pickup device according to an embodiment of this application. Figure 2 .

[0027] Figure 5 for Figure 4 A magnified view of a portion of point A in the middle.

[0028] Figure 6 for Figure 5 A partial structural diagram at BB.

[0029] Figure 7 This is a schematic diagram of the structure of the first eccentric rod in an embodiment of this application.

[0030] Explanation of reference numerals in the attached drawings: Pick-up component 200; Linear drive component 210; Buffer block 220; Pick-up component 230; Base 240; First locking component 241; Slider 250; Slide rail 260; Detection component 300; Detection air passage 310; Sealing component 320; Air hole 330; Limiting component 340; Air passage 341; Rotary drive component 400; Servo motor 410; Reducer 420; Adapter frame 500; Second locking component 510; First position adjustment component 600; First constraint plate 610; First eccentric rod 620; Cylindrical part 621; Eccentric part 622; First elongated hole 640; Second elongated hole 650; Second position adjustment component 700; Second constraint plate 710; Second eccentric rod 720; Second limiting pin 730; Third elongated hole 740; Fourth elongated hole 750. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0033] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0036] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0037] In high-precision semiconductor packaging equipment, chips are typically carried on wafer thin films for processing on semiconductor assembly equipment. In the flip-chip bonding process between flexible tape substrates and chips, the chips on the wafer thin films need to be picked up, flipped, and transferred to a hot press head. This picking, flipping, and transfer is usually accomplished by a pick-up mechanism.

[0038] In related technologies, it is difficult to control the force of the pick-up device when it contacts the chip on the wafer thin film. This can easily cause the chip to crack or even break due to excessive picking force, affecting the yield and processing efficiency of semiconductor packaging.

[0039] Based on this, one or more embodiments of this application provide a chip pickup device. Through the coordinated arrangement of a pin assembly, a pickup assembly, a detection assembly, and a control assembly, the linear drive of the pickup assembly can be pre-set with an appropriate linear pressure according to the chip specifications. This ensures that the pickup maintains a constant pickup force when contacting and picking up the chip on the base film, allowing for smooth contact and chip pickup. This avoids damage to the chip due to excessive pickup force or unstable chip pickup due to insufficient pickup force. Simultaneously, by sliding a buffer block onto the base, when the pickup contacts the chip with a constant pickup force, the buffer block can react against the pin assembly. Under its influence, the pickup and sealing components retract slightly, providing a mechanical buffer for the chip and causing the sealing component to partially detach from the detection gas path. This changes the gas pressure in the detection gas path, allowing the control component to accurately determine whether the pickup is in contact with the chip. Consequently, the ejector assembly accurately controls the ejector pin assembly to lift the side of the base film away from the chip. This ensures that the chip is picked up and peeled off by the pickup in the appropriate lifting state, preventing insufficient lifting that could prevent chip separation or excessive lifting that could cause chip deformation or damage. This improves the yield and processing efficiency of semiconductor packaging.

[0040] See Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 This application provides a chip pickup device for picking up chips on a base film. The chip pickup device includes a pin assembly, a pickup assembly 200, a detection assembly 300, and a control assembly.

[0041] The ejector pin assembly is located on the side of the base film away from the chip and is used to adsorb and lift the base film. The pickup assembly 200 includes a base 240, a linear drive 210, a buffer block 220, and a pickup member 230. The pickup member 230 is located on the buffer block 220 and is used to pick up the chip. The linear drive 210 can apply a controllable linear pressure toward the chip to the pickup member 230 through the buffer block 220. The buffer block 220 is slidably mounted on the base 240 in a direction perpendicular to the base film.

[0042] The detection assembly 300 includes a detection gas path 310 and a blocking member 320. The blocking member 320 is disposed on the buffer block 220 and has an initial position for blocking the detection gas path 310. When the pickup member 230 contacts the chip, the buffer block 220 is driven by the reaction force of the ejector pin assembly to move a preset distance away from the chip, so as to cause the blocking member 320 to at least partially disengage from the detection gas path 310.

[0043] The control component is electrically connected to the ejector assembly and the detection air path 310. The control component can obtain the air pressure value of the detection air path 310 and control the ejector assembly to lift the base film based on the air pressure value of the detection air path 310.

[0044] It should be noted that in this application, the ejector pin assembly (not shown in the figure) may include an ejector pin cap and a first driving component. The first driving component is connected to the ejector pin cap to drive the lifting cap to move in the direction perpendicular to the chip. The first driving component is communicatively connected to the control component. The first driving component may be a linear driving component such as a cylinder or a linear motor. The ejector pin cap is provided with multiple vacuum adsorption holes to stably adsorb the side of the base film away from the chip, so as to avoid the base film from shifting or wrinkling during the process of the pick-up component 230 picking up the chip and being lifted.

[0045] In the aforementioned ejector pin assembly, when the pickup member 230 makes stable contact with the chip, the first driving member drives the ejector pin cap to lift the part of the base film facing the chip, so as to generate a small separation force between the base film and the chip, thereby forming a gap between the base film and the chip, and thus assisting the pickup member 230 in picking up and peeling the chip off the base film.

[0046] In this application, for the pickup assembly 200, the base 240 refers to the components that provide a mounting reference and support platform for the linear drive 210, the buffer block 220, and the pickup 230. The linear drive 210 can output adapted linear pressure based on the chip specifications, which is transmitted to the pickup 230 through the buffer block 220, so that the pickup 230 contacts the chip on the base film with a preset pressure, avoiding damage to the chip due to excessive pressure or instability in chip pickup due to insufficient pressure. The linear drive 210 can be, but is not limited to, a voice coil motor, a miniature cylinder, a linear stepper motor, etc.

[0047] The buffer block 220 is slidably mounted on the slide rail 260 of the base 240 via the slider 250, allowing the buffer block 220 to slide along the base 240 in the direction perpendicular to the base film. This allows the buffer block 220 to undergo a slight retraction displacement due to the reaction force of the ejector pin assembly when the pickup 230 contacts the chip, thereby causing the sealing member 320 to at least partially disengage from the detection gas path 310. The base 240 restricts the buffer block 220 to only have the degree of freedom to move in the direction perpendicular to the base film, preventing the buffer block 220 from causing the pickup 230 and sealing member 320 on it to shift. The pickup 230 can be located at the end of the buffer block 220, ensuring that the buffer block 220 does not directly contact or interfere with the chip when the pickup 230 picks up the chip. The pickup 230 can be a vacuum nozzle, which forms surface or line contact with the chip when picking it up.

[0048] In this application, for the detection component 300, the detection gas path 310 can be fixed on the base 240 or the inner cavity of the base 240, so that the detection gas path 310 is in a static state and will not move with the buffer block 220. A pressure sensor can be installed in the detection gas path 310, and the control component is communicatively connected to the pressure sensor to monitor the gas pressure value of the detection gas path 310 in real time. The sealing component 320 is fixedly installed on the buffer block 220. When the sealing component 320 is in the initial position, the sealing component 320 completely blocks the detection gas path 310, so that the gas pressure value of the detection gas path 310 remains at a stable preset value. At this time, the pickup component 230 of the pickup component 200 has not yet contacted the chip on the base film. Along the direction perpendicular to the base film, there is a preset distance between the pickup component 230 and the chip on the base film.

[0049] It should be noted that in this application, the chip pickup device also includes a lifting mechanism (not shown in the figure). The output end of the lifting mechanism is directly or indirectly connected to the pickup component 200 to drive the pickup component 200 to move as a whole along the direction perpendicular to the base film, so that the pickup component 230 approaches or moves away from the chip on the base film. The output end of the lifting mechanism can be directly or indirectly connected to the base 240, and the lifting mechanism can be a lift.

[0050] When the pickup component 230 of the pickup assembly 200 moves and contacts the chip on the base film, because the ejector pin assembly is supported on the side of the base film away from the chip, and the linear drive 210 applies linear pressure toward the chip to the pickup component 230 through the buffer block 220, the pickup component 230 and the buffer block 220 will be moved a preset distance in the opposite direction by the reaction force of the ejector pin assembly. This causes the buffer block 220 to drive the sealing component 320 on it to move synchronously a preset distance away from the base film, so that the sealing component 320 is at least partially disengaged from the detection gas path 310, thereby breaking the pressure balance of the detection gas path 310 and causing a change in the gas pressure value of the detection gas path 310. The aforementioned preset distance can be understood as a small displacement, determined by the linear pressure set by the linear drive 210 based on the chip specifications.

[0051] In this application, the control component refers to a microcomputer electrically connected to the ejector assembly and the detection gas path 310, which has functions such as signal acquisition, logic control, data processing, and command output. The control component can acquire the pressure value of the detection gas path 310 in real time and determine whether the pickup element 230 has formed a stable contact with the chip on the base film based on the pressure change signal of the detection gas path 310. Based on the determination result, a command is sent to the ejector assembly to lift the base film, so that the base film and the chip are separated, ensuring that the chip is picked up and peeled off by the pickup element 230 in a proper lifting state, avoiding insufficient lifting that prevents the chip from being separated, or excessive lifting that causes the chip to deform or be damaged.

[0052] Based on the above description, it is easy to understand that the chip pickup device of this application, through the coordinated arrangement of the ejector assembly, pickup assembly 200, detection assembly 300, and control assembly, allows the linear drive 210 of the pickup assembly 200 to be pre-set with an appropriate linear pressure according to the chip specifications. This ensures that the pickup 230 maintains a constant pickup force when contacting and picking up the chip on the base film, thus ensuring smooth contact and chip pickup. This avoids damage to the chip due to excessive pickup force or instability in chip pickup due to insufficient pickup force. Simultaneously, by sliding the buffer block 220 onto the base 240, when the pickup 230 contacts the chip with a constant pickup force, the buffer block 220 can provide a counter-force to the ejector assembly. Under the action of the action, the pickup component 230 and the sealing component 320 are driven to retract slightly. On the one hand, this provides a mechanical buffer for the chip, and on the other hand, it causes the sealing component 320 to be at least partially disengaged from the detection gas path 310, causing a change in the gas pressure value of the detection gas path 310. This allows the control component to accurately determine whether the pickup component 230 has made contact with the chip based on the change in the gas pressure value of the detection gas path 310. In this way, the ejector assembly can accurately control the ejector pin assembly to perform a lifting action on the side of the base film away from the chip. This ensures that the chip is picked up and peeled off by the pickup component 230 in the appropriate lifting state, avoiding the chip being unable to be separated due to insufficient lifting or the chip being deformed or damaged due to excessive lifting. This improves the yield and processing efficiency of semiconductor packaging.

[0053] In some embodiments of this application, see Figure 4 , Figure 5 and Figure 6 The detection gas path 310 is located on the base 240. The detection component 300 also includes a gas hole 330 opened on the base 240. The gas hole 330 is connected to the detection gas path 310. The linear drive 210 can drive the buffer block 220 to move, so as to move the sealing component 320 to the initial position. When the pick-up component 230 contacts the chip, the buffer block 220 drives the sealing component 320 to at least partially disengage from the gas hole 330.

[0054] Specifically, along the direction perpendicular to the base membrane, the buffer block 220 is located between the linear drive 210 and the pickup 230. The detection air path 310 can be a tube filled with pressurized gas, which passes through a blind hole channel inside the base 240. An air hole 330 communicating with one end of the air tube is formed on the wall of the base 240, and the sealing member 320 is constructed as an axial structure capable of sealing the air hole 330.

[0055] Understandably, when the sealing component 320 is in the initial position, the sealing component 320 completely seals the vent 330, so that there is no gas leakage in the detection gas path 310, so that the gas pressure value of the detection gas path 310 remains at a stable preset value. At this time, the pickup component 230 of the pickup assembly 200 has not yet contacted the chip on the base film. Along the direction perpendicular to the base film, there is a preset distance between the pickup component 230 and the chip on the base film.

[0056] As the pickup assembly 200 moves closer to the base film under the drive of the lifting mechanism, the sealing member 320 and the base 240 are in a relatively stationary state, and the air pressure in the detection air path 310 remains stable. When the pickup member 230 moves and contacts the chip on the base film, because the ejector pin assembly is supported on the side of the base film away from the chip, and the linear drive member 210 applies linear pressure toward the chip to the pickup member 230 through the buffer block 220, the pickup member 230 will be subjected to the reaction force of the ejector pin assembly. Since the buffer block 220 is fixedly connected to the pickup member 230 and slidably connected to the base 240, the buffer block 220 will drive the pickup member 230 and the sealing member 320 on it to move synchronously and retract slightly in the direction away from the base film under the reaction force of the ejector pin assembly, so that the sealing member 320 is at least partially disengaged from the vent 330, causing some gas in the detection air path 310 to leak at the vent 330, causing the air pressure value of the detection air path 310 to change. Thus, the control component determines that the pickup 230 has formed a stable contact with the chip on the base film based on the gas pressure change signal of the detection gas path 310, and then controls the ejector pin assembly to lift the base film, so that the base film and the chip form a gap, ensuring that the chip is picked up and peeled off by the pickup 230 in a proper lifting state, avoiding the chip being unable to be separated due to insufficient lifting, or the chip being deformed or damaged due to excessive lifting.

[0057] It should be noted that during the above process, when the pickup component 230 moves to contact the chip on the base film, when the buffer block 220 moves back slightly, and when the ejector assembly lifts the base film, the linear drive component 210 applies a constant linear pressure toward the chip to the pickup component 230 through the buffer block 220. This pressure is set based on the chip specifications before the chip pickup device operates, so it will not damage the chip and ensures that the pickup component 230 can smoothly pick up and peel the chip off the base film.

[0058] After the pick-up component 200 peels the picked-up chip from the base film and mounts it onto the corresponding flexible tape substrate, the linear drive 210 can drive the buffer block 220 to move and reset, so that the sealing component 320 on the buffer block 220 moves and resets to the initial position of the sealing vent 330, in preparation for the next pick-up of the chip on the base film and mounting the chip onto the flexible tape substrate.

[0059] It is understandable that, in the above structure, by placing the detection air path 310 on the base 240, the detection air path 310 and the air hole 330 on the base 240 do not move with the buffer block 220 during the slight retraction of the pick-up member 230 relative to the base film under the drive of the buffer block 220, but remain stationary. This causes the sealing member 320 on the buffer block 220 to form a relative displacement with the air hole 330, releasing the complete blockage of the air hole 330. This causes the air pressure of the detection air path 310 to change when the buffer block 220 retracts slightly, thereby enabling the control component to accurately determine that the pick-up member 230 has formed a stable contact with the chip on the base film. The control pin assembly lifts the part of the base film corresponding to the chip, and the pick-up member 230 is subjected to continuous and stable linear pressure from the linear drive member 210. This ensures that the chip is picked up and peeled off by the pick-up member 230 in the appropriate lifting state, avoiding insufficient lifting that prevents chip separation or excessive lifting that causes chip deformation and damage. This improves the yield and processing efficiency of semiconductor packaging.

[0060] Furthermore, see also Figure 4 , Figure 5 and Figure 6 The detection component 300 also includes a limiting member 340, which is located on the base 240. An air hole 330 is opened on the outer wall of the limiting member 340, and an air passage 341 is formed inside the limiting member 340. The detection air passage 310 is connected to the air hole 330 through the air passage 341. When the sealing member 320 seals the air hole 330, it is also stopped by the limiting member 340.

[0061] Specifically, the limiting member 340 can be integrally formed with the base 240, or the limiting member 340 can be fixed to the base 240 by a detachable structure such as screws or buckles. The limiting member 340 has an axial structure and is parallel to the base film. The air hole 330 is opened on the side of the limiting member 340 close to the base film. The detection air path 310, the air channel 341 and the air hole 330 are connected in sequence.

[0062] In the above structure, after the sealing member 320 on the buffer block 220 moves and resets to completely seal the air hole 330 under the linear pressure of the linear drive member 210, the sealing member 320 is mechanically stopped by the limiting member 340 and cannot continue to move. The sealing member 320 provides corresponding positioning and limiting functions for sealing the air hole 330, ensuring that the sealing member 320 moves and resets accurately to the initial position of sealing the air hole 330.

[0063] Furthermore, the linear drive 210 outputs a constant linear pressure when the pickup 230 contacts the chip.

[0064] Specifically, the control component is electrically connected to the linear drive 210, and the control component can control the linear drive 210 to output the corresponding linear pressure according to the chip specifications.

[0065] It should be noted that different chip specifications require different pickup forces to avoid damage to the chip from excessive pickup force by the pickup element 230 or instability in chip pickup due to insufficient pickup force. Before the chip pickup device operates, its control component stores the chip specification information and sets the corresponding linear pressure output by the linear drive element 210 based on the chip specification information. This linear pressure corresponds to the pickup force of the pickup element 230 when picking up the chip. This linear pressure can be a pressure range value or a single pressure setpoint, and there are no specific restrictions.

[0066] The above structure, through the linear drive 210, outputs a constant linear pressure when the pickup 230 contacts the chip. From the moment the pickup 230 moves to contact the chip on the base film to the moment it stably picks up and peels the chip, the pickup force of the pickup 230 on the chip remains unchanged. This will not damage the chip, and the pickup 230 can smoothly pick up and peel the chip from the base film under this constant pickup force.

[0067] Furthermore, see also Figure 4 , Figure 5 and Figure 6 The linear drive 210 is configured as a voice coil motor, and the control component controls the linear pressure output by the linear drive 210 by controlling the current value input to the linear drive 210.

[0068] It should be noted that when the linear drive 210 is a voice coil motor, the linear pressure output by the linear drive 210 is only related to the current value input to the linear drive 210, and the linear pressure is proportional to the input current value.

[0069] With the above structure, the control component only needs to set the corresponding current value to be input to the linear drive 210 according to the specifications of the chip on the base film, so that the linear drive 210 outputs a constant linear pressure when the pickup 230 contacts the chip, so as to avoid damaging the chip and also allow the pickup 230 to smoothly pick up and peel the chip from the base film under the constant linear pressure.

[0070] In some embodiments of this application, see Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5The chip pickup device also includes an adapter 500 and a rotary drive assembly 400. The base 240 is detachably connected to the adapter 500. The output end of the rotary drive assembly 400 is connected to the adapter 500 to drive the adapter 500 to rotate around the output shaft of the rotary drive assembly 400. The control assembly is electrically connected to the rotary drive assembly 400.

[0071] Specifically, the rotary drive assembly 400 includes a servo motor 410 and a reducer 420. The output end of the servo motor 410 is connected to the reducer 420, and the output end of the reducer 420 is connected to an adapter frame 500. The base 240 is fixed to the adapter frame 500 by screws, latches, or other detachable structures. The output shaft of the reducer 420 corresponds to the rotary drive assembly 400. The adapter frame 500 provides a mounting reference and support for the servo motor 410 and the reducer 420. Furthermore, the chip pickup device also includes a lifting mechanism. The output end of the lifting mechanism is connected to the adapter frame 500. By driving the adapter frame 500 to rise and fall, the adapter frame 500 drives the pickup assembly 200 and the rotary drive assembly 400 to rise and fall as a whole. The lifting mechanism can be an elevator.

[0072] See Figure 3 , Figure 4 and Figure 5 In this application, the pickup component 230 can be a suction nozzle.

[0073] When the sealing member 320 is in the initial position, the limiting member 340 is located directly above the sealing member 320. The sealing member 320 on the buffer block 220 completely blocks the air hole 330 and is mechanically stopped by the limiting member 340. The buffer block 220 cannot move upward relative to the base 240, but can only move downward relative to the base 240.

[0074] Then, the rotary drive assembly 400 drives the adapter 500 to rotate 180°, causing the limiting member 340 to rotate directly below the sealing member 320, releasing the upward stop on the limiting member 340, and causing the picking surface of the picking member 230 to face the base film downward.

[0075] Then, the lifting mechanism drives the adapter 500 to move downwards towards the base film, causing the pickup assembly 200 to move downwards as a whole, so that the pickup 230 approaches and contacts the chip on the base film. During this process, the linear drive 210 maintains a linear pressure output, so that the pickup 230 maintains a constant pickup force on the chip when it contacts the chip. When the pickup 230 contacts the chip with a constant pickup force, the pickup 230 will be subjected to the reaction force of the ejector pin assembly. Under the reaction force of the ejector pin assembly, the buffer block 220 will drive the pickup 230 and the sealing member 320 on it to move synchronously upwards and backwards slightly in the direction away from the base film, so that the sealing member 320 is at least partially disengaged from the vent 330. When the control component determines that the pickup 230 has contacted the chip based on the gas pressure change signal of the detection gas path 310, it will control the ejector pin assembly to lift the part of the base film corresponding to the chip. In conjunction with the pickup 230 being subjected to continuous and stable linear pressure from the linear drive 210, the chip is ensured to be picked up and peeled off by the pickup 230 in a suitable lifting state.

[0076] It should be noted that when the ejector assembly lifts the base film to the chip location, the ejector assembly overcomes the linear pressure of the linear drive 210. At the same time, the buffer block 220 drives the pickup 230 and the sealing 320 to continue to retract upward relative to the base 240. With the adsorption effect of the pickup 230 on the chip, a gap is formed between the base film and the chip, so that the pickup 230 can stably and smoothly pick up and peel the chip from the base film during the process of being lifted and retracted by the ejector assembly.

[0077] After the pick-up component 230 picks up and peels the chip from the base film, the rotary drive assembly 400 drives the adapter 500 to rotate 180°. The limiting component 340 rotates and resets to directly above the sealing component 320. The linear pressure of the linear drive component 210 is upward, causing the buffer block 220 to drive the pick-up component 230 and the sealing component 320 to move upward relative to the base 240 for a certain distance until the sealing component 320 is stopped by the upper limiting component 340, thereby moving and resetting the sealing component 320 to the initial position of the sealing vent 330.

[0078] It should also be noted that the flexible tape substrate to be mounted can be positioned directly above the base film. After the pickup component 230 of the pickup assembly 200 picks up and peels the chip from the base film, the pickup component 230 and the chip on it face the flexible tape substrate. The lifting mechanism drives the adapter 500 to move upward, causing the adapter 500 to move the pickup assembly 200 and the rotation drive assembly 400 upward as a whole, so that the pickup component 230 mounts the chip on it onto the flexible tape substrate. During this chip mounting process, the linear drive component 210 can maintain a constant linear pressure output, which can help the chip be firmly mounted on the flexible tape substrate.

[0079] In some embodiments of this application, see Figure 2 , Figure 3 and Figure 4 The chip pickup device also includes an adapter 500, and a base 240 is detachably connected to the adapter 500. A first position adjustment component 600 is provided on the base 240, which is used to adjust the position of the base 240 relative to the adapter 500 so that the pickup surface of the pickup member 230 is parallel to the chip.

[0080] Specifically, the first position adjustment component 600 can be a manual swing component or an automatic swing component. When the operator finds that the pickup surface of the pickup component 230 is tilted relative to the chip, the first position adjustment component 600 drives the base 240 to swing slightly relative to the adapter 500, so that the pickup surface of the pickup component 230 swings to a state parallel to the chip on the base film, so that the pickup component 230 contacts and picks up the chip horizontally. This ensures that the chip is subjected to uniform force when picked up by the pickup component 230, reduces the probability of cracks and damage to the chip due to uneven pickup force, and further improves the yield and processing efficiency of semiconductor packaging.

[0081] Further, see Figure 2 , Figure 3 and Figure 4 The first position adjustment component 600 includes a first constraint plate 610, a first eccentric rod 620, a first limiting pin (not shown in the figure), a first elongated hole 640, and a second elongated hole 650. The first constraint plate 610 is detachably connected to the base 240 via a first locking member 241. The first elongated hole 640 and the second elongated hole 650 are both formed in the first constraint plate 610. The first eccentric rod 620 passes through the first elongated hole 640 and is clearance-fitted with the base 240. The first limiting pin passes through the second elongated hole 650 and is fixedly connected to the base 240. The first elongated hole 640 extends in a direction perpendicular to the chip, and the second elongated hole 650 is inclined relative to the first elongated hole 640.

[0082] Specifically, the first constraint plate 610 is perpendicular to the horizontal plane, and the base 240 is block-shaped. The first constraint plate 610 and the base 240 are surface-to-surface and connected and fixed by the first locking member 241. The first locking member 241 may be, but is not limited to, fastening screws, fastening bolts, etc. The first constraint plate 610 is fixedly connected to the adapter frame 500.

[0083] A first elongated hole 640 is vertically formed in the first constraint plate 610. A second elongated hole 650 is located to the side of the first elongated hole 640, not connected to the first elongated hole 640, and is inclined at a certain angle relative to the first elongated hole 640. See also Figure 7The first eccentric rod 620 includes an integrally connected cylindrical part 621 and an eccentric part 622. The cylindrical part 621 is clearance-fitted with a hole on the base 240. The eccentric part 622 is located at the edge of the cylindrical part 621 and passes through the first elongated hole 640. The eccentric part 622 is in the shape of a shaft, and its axis is parallel to and does not coincide with the axis of the cylindrical part 621.

[0084] The first limiting pin passes through the second elongated hole 650 and is fixedly connected to the base 240. The connection method can be threaded connection, welding, etc.

[0085] Define the axial direction of the eccentric portion 622 of the first eccentric rod 620 as the front-back direction. Before the pickup assembly 200 picks up the chip on the base film, the position of the pickup member 230 relative to the adapter 500 needs to be adjusted so that the pickup surface of the pickup member 230 is parallel to the chip on the base film. At this time, the operator can first turn the first locking member 241 to release the locking connection between the first constraint plate 610 and the base 240. Then, using a tool, rotate the first eccentric rod 620. Under the limiting constraints of the second elongated hole 650 and the first limiting pin, as well as the eccentric rotation constraint of the first eccentric rod 620, the base 240 will swing a small angle relative to the base 240 around the straight line in the front-back direction. During this process, the first limiting pin moves along the second elongated hole 650, limiting the swing angle of the base 240. In this way, the base 240 drives the pickup member 230 on it to swing to a position where the pickup surface is parallel to the chip on the base film.

[0086] After adjustment, the first locking member 241 locks the connection between the first constraint plate 610 and the base 240 again, fixing the position of the base 240 and the pickup member 230 on it. This ensures that the pickup surface of the pickup member 230 remains parallel to the chip on the base film when picking up the chip, guaranteeing that the chip is subjected to uniform force when picked up by the pickup member 230. This reduces the probability of cracks or damage to the chip due to uneven pickup force, further improving the yield and processing efficiency of semiconductor packaging.

[0087] Further, see Figure 2 , Figure 3 and Figure 4The adapter frame 500 is provided with a second position adjustment assembly 700, which includes a second constraint plate 710, a second eccentric rod 720, a second limit pin 730, a third elongated hole 740, and a fourth elongated hole 750. The second constraint plate 710 is vertically connected to the first constraint plate 610, and the second constraint plate 710 is detachably connected to the adapter frame 500 through a second locking member 510. The third elongated hole 740 and the fourth elongated hole 750 are both opened in the second constraint plate 710. The second eccentric rod 720 passes through the third elongated hole 740 and is clearance-fitted with the adapter frame 500. The second limit pin 730 passes through the fourth elongated hole 750 and is fixedly connected to the adapter frame 500. The third elongated hole 740 and the fourth elongated hole 750 are set at an angle.

[0088] Specifically, the second constraint plate 710 is integrally and vertically connected to the first constraint plate 610. The second constraint plate 710 is detachably connected to the adapter frame 500 via a second locking member 510, which can be a screw, bolt, etc. The first constraint plate 610 is not connected to the adapter frame 500.

[0089] See Figure 7 The second eccentric rod 720 has the same structure as the first eccentric rod 620. The second eccentric rod 720 also includes a cylindrical part and an eccentric part. The cylindrical part of the second eccentric rod 720 is clearance-fitted with the hole on the adapter 500. The eccentric part of the second eccentric rod 720 is located at the edge of the cylindrical part 621 of the second eccentric rod 720 and passes through the third elongated hole 740.

[0090] The second limiting pin 730 passes through the fourth elongated hole 750 and is fixedly connected to the adapter 500. The connection method can be threaded connection, welding, etc.

[0091] Define the axial direction of the eccentric portion of the second eccentric rod 720 as the left-right direction. Before the pickup assembly 200 picks up the chip on the base film, the position of the pickup member 230 relative to the adapter frame 500 needs to be adjusted so that the pickup surface of the pickup member 230 is parallel to the chip on the base film. At this time, the operator can first turn the second locking member 510 to release the locking connection between the second constraint plate 710 and the adapter frame 500. Then, by using a tool to rotate the second eccentric rod 720, the second constraint plate 710, under the limiting constraint of the fourth elongated hole 750 and the second limiting pin 730, as well as the eccentric rotation constraint of the second eccentric rod 720, will swing a small angle relative to the adapter 500 around the straight line in the left and right direction. During this process, the second limiting pin 730 moves along the fourth elongated hole 750, limiting the swing angle of the second constraint plate 710. In this way, the second constraint plate 710 drives the first constraint plate 610, the base 240, and the pickup member 230 of the base 240 to swing a small angle around the straight line in the left and right direction, so that the pickup surface of the pickup member 230 is parallel to the chip on the base film.

[0092] After adjustment, the second locking member 510 locks the connection between the second constraint plate 710 and the adapter 500 again, fixing the positions of the second constraint plate 710, the first constraint plate 610, the base 240, and the pickup member 230 of the base 240. This ensures that the pickup surface of the pickup member 230 remains parallel to the chip on the base film when picking up the chip, guaranteeing uniform force on the chip when it is picked up by the pickup member 230. This reduces the probability of cracks or damage to the chip due to uneven pickup force, further improving the yield and processing efficiency of semiconductor packaging.

[0093] It is understandable that in the above structure, the vertically connected first constraint plate 610 and second constraint plate 710, the first eccentric rod 620 passing through the first constraint plate 610 and the second eccentric rod 720 passing through the second constraint plate 710 together define the horizontal plane, and also indirectly define the two vertical swing axes of the pickup 230. This allows the operator to selectively rotate the first eccentric rod 620 and / or the second eccentric rod 720 according to the position angle between the pickup 230 and the chip on the base film, so that the pickup 230 swings to a position angle where its pickup surface is parallel to the chip on the base film. This ensures that the pickup surface of the pickup 230 remains parallel to the chip on the base film when picking up the chip, ensuring that the chip is subjected to uniform force when picked up by the pickup 230, reducing the probability of cracks or damage to the chip due to uneven pickup force, and further improving the yield and processing efficiency of semiconductor packaging.

[0094] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0095] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A chip pickup device for picking up chips on a base film, characterized in that, include: A push pin assembly is located on the side of the base film opposite to the chip, and is used to adsorb and lift the base film; A pickup assembly includes a base, a linear drive, a buffer block, and a pickup element. The pickup element is disposed on the buffer block and is used to pick up a chip. The linear drive can apply a controllable linear pressure toward the chip to the pickup element through the buffer block. The buffer block is slidably mounted on the base in a direction perpendicular to the base film. The detection component includes a detection gas path and a blocking component. The blocking component is disposed on the buffer block and has an initial position for blocking the detection gas path. When the pickup component contacts the chip, the buffer block is driven by the reaction force of the ejector pin assembly to move a preset distance away from the chip, so as to cause the blocking component to at least partially disengage from the detection gas path. A control component is electrically connected to the ejector assembly and the detection gas path. The control component is able to acquire the gas pressure value of the detection gas path and control the ejector assembly to lift the base film based on the gas pressure value of the detection gas path.

2. The chip pickup device according to claim 1, characterized in that, The detection gas path is located on the base, and the detection component also includes a gas hole opened on the base. The gas hole is connected to the detection gas path. The linear drive can drive the buffer block to move so as to move the sealing member to the initial position. When the pickup member contacts the chip, the buffer block drives the sealing member to at least partially disengage from the gas hole.

3. The chip pickup device according to claim 2, characterized in that, The detection component also includes a limiting member disposed on the base. The air hole is opened on the outer wall of the limiting member, and an air passage is formed inside the limiting member. The detection air path communicates with the air hole through the air passage. When the sealing member blocks the air hole, it is also stopped by the limiting member.

4. The chip pickup device according to claim 1, characterized in that, The linear actuator outputs a constant linear pressure when the pickup contacts the chip.

5. The chip pickup device according to claim 1, characterized in that, The control component is electrically connected to the linear drive, and the control component can control the linear drive to output a corresponding linear pressure according to the specifications of the chip.

6. The chip pickup device according to claim 5, characterized in that, The linear drive is configured as a voice coil motor, and the control component controls the linear pressure output by the linear drive by controlling the current value input to the linear drive.

7. The chip pickup device according to claim 1, characterized in that, The chip pickup device further includes an adapter frame, and the base is detachably connected to the adapter frame; the base is provided with a first position adjustment component, which is used to adjust the position of the base relative to the adapter frame so that the pickup surface of the pickup element is parallel to the chip.

8. The chip pickup device according to claim 7, characterized in that, The first position adjustment assembly includes a first constraint plate, a first eccentric rod, a first limiting pin, a first elongated hole, and a second elongated hole. The first constraint plate is detachably connected to the base via a first locking member. Both the first elongated hole and the second elongated hole are formed in the first constraint plate. The first eccentric rod passes through the first elongated hole and is clearance-fitted with the base. The first limiting pin passes through the second elongated hole and is fixedly connected to the base. The first elongated hole extends in a direction perpendicular to the chip, and the second elongated hole is inclined relative to the first elongated hole.

9. The chip pickup device according to claim 8, characterized in that, The adapter frame is provided with a second position adjustment assembly, which includes a second constraint plate, a second eccentric rod, a second limiting pin, a third elongated hole, and a fourth elongated hole. The second constraint plate is vertically connected to the first constraint plate, and the second constraint plate is detachably connected to the adapter frame through a second locking member. The third elongated hole and the fourth elongated hole are both formed in the second constraint plate. The second eccentric rod passes through the third elongated hole and is clearance-fitted with the adapter frame. The second limiting pin passes through the fourth elongated hole and is fixedly connected to the adapter frame. The third elongated hole and the fourth elongated hole are set at an angle.

10. The chip pickup device according to claim 7, characterized in that, The chip pickup device further includes a rotary drive assembly, the output end of which is connected to the adapter frame to drive the adapter frame to rotate around the output axis of the rotary drive assembly, and the control assembly is electrically connected to the rotary drive assembly.

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