A preform for a perovskite crystalline silicon tandem photovoltaic module and a method of making the same

Abstract

This disclosure relates to a preform suitable for perovskite-silicon tandem photovoltaic modules and its preparation method, as well as the perovskite-silicon tandem photovoltaic module. The preform includes: a first cover plate, a first sealing element disposed on one side of the first cover plate, a crystalline silicon cell disposed inside the first sealing element, and a second sealing element. The crystalline silicon cell is fixed to the first cover plate by the first sealing element, and the second sealing element is disposed on the side of the second sealing element opposite to the first cover plate. The first sealing element is made of thermosetting resin, and the second sealing element is made of thermoplastic resin. The melting temperature of the second sealing element is lower than the curing temperature of the first sealing element. Thus, after curing, the first sealing element can withstand the hot spot temperature of the crystalline silicon cell, reducing the risk of encapsulation material delamination due to high and low temperature cycling and improving the reliability of the photovoltaic module. Furthermore, the second sealing element being made of thermoplastic resin facilitates the hot pressing of the preform with the perovskite cell to prepare the perovskite-silicon tandem photovoltaic module.

Description

Technical Field

[0001] This disclosure relates to the field of solar cell technology, specifically to a preform suitable for perovskite-silicon tandem photovoltaic modules and its preparation method, as well as the perovskite-silicon tandem photovoltaic module. Background Technology

[0002] Perovskite-silicon tandem photovoltaic (PV) modules are power generation units formed by mechanically stacking perovskite thin-film solar cells with independent circuits and crystalline silicon solar cells. Perovskite-silicon tandem PV modules utilize the different spectral response characteristics of perovskite and crystalline silicon to improve the utilization efficiency of the solar spectrum and increase the power generation of the PV module.

[0003] In related technologies, perovskite modules and perovskite-silicon tandem modules typically employ thermoplastic encapsulation systems. Perovskite modules and perovskite-silicon tandem modules use TPO material for encapsulation. TPO material is relatively expensive. However, in perovskite-silicon tandem modules, crystalline silicon cells use a multi-series structure to match the high voltage characteristics of perovskite cells. When hot spots occur in crystalline silicon cells, the hot spot temperature is high, which can easily lead to localized high temperatures. This causes the TPO material to soften and solidify, thus posing a risk of failure to the encapsulation layer of the perovskite-silicon tandem module. Summary of the Invention

[0004] The purpose of this disclosure is to provide a preform suitable for perovskite-silicon tandem photovoltaic modules and a method for preparing the same, as well as the perovskite-silicon tandem photovoltaic module. The preform is suitable for perovskite-silicon tandem photovoltaic modules. By sealing the crystalline silicon cells with a first sealing element in the preform, softening can be prevented under hot spot conditions. At the same time, the second sealing element can be adapted to stack perovskite cells, so as to facilitate the encapsulation of crystalline silicon cells and perovskite cells into perovskite-silicon tandem photovoltaic modules, at least partially solving the above-mentioned technical problems.

[0005] To achieve the above objectives, in a first aspect, this disclosure provides a preform suitable for perovskite-silicon tandem photovoltaic modules, comprising:

[0006] First cover plate; The first sealing element is disposed on one side of the first cover plate; A crystalline silicon cell is disposed inside the first sealing element, and the crystalline silicon cell is fixed to the first cover plate by the first sealing element; and The second sealing element is disposed on the side of the first sealing element opposite to the first cover plate; The first sealing element is a thermosetting resin, the second sealing element is a thermoplastic resin, and the melting temperature of the second sealing element is lower than the curing temperature of the first sealing element.

[0007] Optionally, the first sealing element is POE, EVA, or a combination thereof, and the second sealing element is TPO.

[0008] Optionally, the light transmittance of the second sealing element is ≥88%; and / or The water vapor permeability of the second sealing element is ≤3g / m 2 / day; and / or The bonding strength of the second sealing element is ≥100 N / cm.

[0009] A second aspect of this disclosure provides a method for preparing a preform suitable for a perovskite crystalline silicon tandem photovoltaic module, comprising the following steps: sequentially stacking a first encapsulant layer, a crystalline silicon cell, and a composite encapsulant layer on one side of a first cover plate, wherein the composite encapsulant layer is an encapsulant layer pre-formed integrally with a second encapsulant layer and a third encapsulant layer; and the first encapsulant layer and the second encapsulant layer are thermosetting resins, the third encapsulant layer is a thermoplastic resin, and the melting temperature of the third encapsulant layer is lower than the curing temperature of the first encapsulant layer and the second encapsulant layer; Hot pressing causes the first adhesive film layer and the second adhesive film layer to crosslink and cure to form a first sealing element, and the third adhesive film layer forms a second sealing element to form the preform.

[0010] Optionally, the hot pressing temperature is greater than or equal to 140°C.

[0011] Optionally, the first and second adhesive film layers are POE, EVA, or a combination thereof, and the third adhesive film layer is TPO.

[0012] Optionally, the light transmittance of the third film layer is ≥88%; and / or The water vapor permeability of the third film layer is ≤3g / m³. 2 / day; and / or The bonding strength of the third adhesive film layer is ≥100 N / cm.

[0013] In a third aspect, this disclosure provides a preform suitable for perovskite-silicon tandem photovoltaic modules, prepared using the method described above.

[0014] In a fourth aspect, this disclosure provides a perovskite-silicon tandem photovoltaic module, comprising a perovskite cell module and a crystalline silicon cell module, wherein the perovskite-silicon tandem photovoltaic module is prepared by hot pressing of a perovskite cell preform and a crystalline silicon cell preform, wherein the crystalline silicon cell preform includes the aforementioned preform suitable for the perovskite-silicon tandem photovoltaic module.

[0015] Optionally, the perovskite-silicon tandem photovoltaic module further includes a functional film layer disposed between the perovskite cell module and the crystalline silicon cell module; wherein the functional film layer includes at least one of an insulating film layer, a light transfer film layer, and a cutoff film layer.

[0016] Through the above technical solution, the prefabricated component disclosed herein is applicable to perovskite-silicon tandem photovoltaic modules. The prefabricated component includes a first cover plate, on which the crystalline silicon cell is fixed by a first sealing element. A second sealing element is disposed on the side opposite to the first cover plate. The first sealing element is a thermosetting resin, and the second sealing element is a thermoplastic resin. The melting temperature of the second sealing element is lower than the curing temperature of the first sealing element. Thus, the prefabricated component can encapsulate the crystalline silicon cell through the first sealing element. The first sealing element is a thermosetting resin, which is a cross-linked resin. After curing, it can withstand the hot spot temperature of the crystalline silicon cell, reducing the risk of delamination of the encapsulation material due to high and low temperature cycling and improving the reliability of the perovskite-silicon tandem photovoltaic module. Furthermore, the second sealing element is made of thermoplastic resin, which facilitates the hot pressing of the preform with the perovskite cell to prepare a perovskite-silicon tandem photovoltaic module. The melting and curing of the thermoplastic resin material is reversible. When the preform is hot-pressed with the perovskite cell and the encapsulating film of the perovskite cell, since the melting temperature of the second sealing element is lower than the curing temperature of the first sealing element, the second sealing element melts and fuses with the encapsulating film of the perovskite cell, while the first sealing element remains in a cured state. After the second sealing element and the encapsulating film layer of the perovskite cell melt and cure, the perovskite cell is sealed, thereby producing a perovskite-silicon tandem photovoltaic module.

[0017] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the accompanying drawings...

[0019] Figure 1 This is a schematic diagram of a prefabricated component provided in an exemplary embodiment of this disclosure.

[0020] Figure 2 This is a schematic diagram of the preform forming process provided in an exemplary embodiment of this disclosure.

[0021] Figure 3 This is a flowchart of a method for preparing a preform provided in an exemplary embodiment of this disclosure.

[0022] Figure 4 This is a schematic diagram of a perovskite-silicon tandem photovoltaic module provided in an exemplary embodiment of this disclosure.

[0023] Figure 5 This is a schematic diagram of the molding process of a perovskite-silicon tandem photovoltaic module provided in an exemplary embodiment of this disclosure.

[0024] Figure 6 This is a schematic diagram of a perovskite solar cell preform provided in an exemplary embodiment of this disclosure.

[0025] Figure 7 This is a schematic diagram of the perovskite battery preform forming process provided in an exemplary embodiment of this disclosure.

[0026] Figure 8 This is a schematic diagram of the structure of a perovskite-silicon tandem photovoltaic module including edge sealing adhesive provided in an exemplary embodiment of this disclosure.

[0027] Explanation of reference numerals in the attached figures 100 - Prefabricated component; 101 - First cover plate; 102 - First sealing element; 103 - Crystalline silicon cell; 104 - Second sealing element; 105 - First adhesive film layer; 106 - Composite adhesive film layer; 107 - Second adhesive film layer; 108 - Third adhesive film layer; 200 - Perovskite cell prefabricated component; 201 - Second cover plate; 202 - Perovskite cell; 203 - Third sealing element; 204 - Fourth adhesive film layer; 300 - Perovskite-crystalline silicon tandem photovoltaic module; 400 - Fourth sealing element; 500 - Edge sealing adhesive. Detailed Implementation

[0028] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0029] In this disclosure, unless otherwise stated, directional terms such as "inner" and "outer" refer to the inner and outer contours of the corresponding components; "far" and "near" refer to the corresponding structure or component being away from or near another structure or component. Furthermore, the terms "first," "second," etc., used in this disclosure are for distinguishing one element from another and do not have sequential or importance implications. Additionally, in the following description, when referring to the accompanying drawings, unless otherwise explained, the same reference numerals in different drawings denote the same or similar elements. The above definitions are for explanation and illustration only and should not be construed as limiting this disclosure.

[0030] Because perovskite materials are sensitive to moisture, photovoltaic modules containing perovskite cells place higher demands on the moisture permeability of the encapsulating film. Thermoplastic polyolefin (TPO) films are non-crosslinked encapsulating films with high light transmittance, low moisture permeability, and low-temperature lamination processes. They also do not release small molecules during long-term aging, making them suitable for encapsulating perovskite cells. The inventors discovered that existing methods using TPO films as a single material to encapsulate perovskite-silicon tandem photovoltaic modules have some problems. For example, single-junction perovskite modules are designed with low current and multiple parallel structures, resulting in low hot spot temperatures. TPO materials hardly soften during photovoltaic module power generation, hence they are currently the primary material used for single-junction perovskite modules. However, in perovskite-silicon tandem photovoltaic modules, the crystalline silicon ends use multiple series structures to match the high voltage characteristics of perovskite. When hot spots occur, the high temperature can easily lead to localized high temperatures, causing the TPO material to soften and significantly increasing the risk of decapsulation.

[0031] To achieve the above objectives, such as Figure 1 and Figure 2 As shown, in a first aspect, this disclosure provides a preform 100 suitable for a perovskite-silicon tandem photovoltaic module, comprising: a first cover plate 101, a first sealing element 102, a crystalline silicon cell 103, and a second sealing element 104. The first sealing element 102 is disposed on one side of the first cover plate 101; the crystalline silicon cell 103 is disposed inside the first sealing element 102 and fixed to the first cover plate 101 by the first sealing element 102; the second sealing element 104 is disposed on the side of the first sealing element 102 opposite to the first cover plate 101; the first sealing element 102 is a thermosetting resin, the second sealing element 104 is a thermoplastic resin, and the melting temperature of the second sealing element 104 is lower than the curing temperature of the first sealing element 102.

[0032] Through the above technical solution, the preform 100 disclosed herein is applicable to a perovskite-silicon tandem photovoltaic module 300. The preform 100 includes a first cover plate 101, and a crystalline silicon cell 103 is fixed to the first cover plate 101 by a first sealing element 102. A second sealing element 104 is disposed on the side opposite to the first cover plate 101. The first sealing element 102 is a thermosetting resin, and the second sealing element 104 is a thermoplastic resin. The melting temperature of the second sealing element 104 is lower than the curing temperature of the first sealing element 102. In this way, the preform 100 can encapsulate the crystalline silicon cell 103 through the first sealing element 102. The first sealing element 102 is a thermosetting resin, and the thermosetting resin material is a cross-linked resin. After curing, it can withstand the hot spot temperature of the crystalline silicon cell 103, reducing the risk of delamination of the encapsulation material due to high and low temperature cycling and improving the reliability of the perovskite-silicon tandem photovoltaic module 300. Furthermore, the second sealing element 104 is made of thermoplastic resin, which facilitates the hot pressing of the preform 100 with the perovskite cell 202 to prepare the perovskite-silicon tandem photovoltaic module 300. The melting and curing of the thermoplastic resin material is reversible. When the preform 100 is hot-pressed with the perovskite cell 202 and the encapsulating film of the perovskite cell 202, since the melting temperature of the second sealing element 104 is lower than the curing temperature of the first sealing element 102, the second sealing element 104 melts and fuses with the encapsulating film of the perovskite cell 202, while the first sealing element 102 remains in a cured state. After the second sealing element 104 and the encapsulating film layer of the perovskite cell 202 melt and cure, the perovskite cell 202 is sealed, thereby producing the perovskite-silicon tandem photovoltaic module 300.

[0033] In some possible implementations, for example, the first sealing element 102 can be a thermosetting resin material. The thermosetting resin material is a cross-linked resin, which, after curing, can withstand the hot spot temperature of the crystalline silicon cell 103, reducing the risk of encapsulation material delamination due to high and low temperature cycling and enhancing reliability. It is understood that the second sealing element 104 is a thermoplastic resin. The melting and curing of thermoplastic resin materials are reversible. The second sealing element 104 has a relatively low melting temperature, enabling hot lamination at low temperatures when the preform 100 is laminated with the perovskite cell 202, protecting the perovskite cell 202. The second sealing element 104, being a thermoplastic material, has high compatibility with the thermoplastic encapsulation material of the perovskite cell 202. When the preform 100 is laminated with the perovskite cell 202, the second sealing element 104 can melt and bond well with the encapsulation film layer corresponding to the perovskite cell 202, thereby forming a perovskite crystalline silicon tandem photovoltaic module 300.

[0034] In some possible implementations, the light transmittance of the second sealing element 104 is ≥88%. The light transmittance of the second sealing element 104 can be 88%, 89%, 90%, etc. By limiting the light transmittance of the second sealing element 104, more light can pass through the second sealing element 104 to be absorbed and generate electricity in the crystalline silicon cell 103.

[0035] In some possible implementations, the water vapor permeability of the second sealing element 104 is ≤3 g / m 2 / day, the water vapor permeability of the second sealing element 104 can be 3g / m 2 / day, 2.9g / m 2 / day, 2.8g / m 2 / day, 2.7g / m 2 / day, 2.6g / m 2 By limiting the water vapor permeability of the second sealing element 104, moisture can be effectively isolated, reducing the interference of moisture on the perovskite cell 202 during the lamination of the preform 100 and the perovskite cell 202.

[0036] In some possible implementations, the bonding strength of the second sealing element 104 is ≥100 N / cm. The bonding strength of the second sealing element 104 can be 100 N / cm, 101 N / cm, 105 N / cm, etc. By limiting the bonding strength of the second sealing element 104, the high bonding strength requirement can be met. When the preform 100 and the perovskite cell 202 are laminated, the bonding of the encapsulating film of the preform 100 and the perovskite cell 202 is guaranteed to be reliable, so that the structure of the perovskite crystalline silicon tandem photovoltaic module 300 is stable.

[0037] Of course, in some possible implementations, the light transmittance of the second sealing element 104 can be 88%, and the water vapor transmission rate can be 3 g / m³. 2 / day, bonding strength ≥100N / cm; the light transmittance of the second sealing element 104 can be 89%, and the water vapor transmission rate can be 2.8g / m 2 / day, bond strength ≥105N / cm.

[0038] It is understood that the values ​​of light transmittance, water vapor transmission rate, and adhesive strength of the second sealing element 104 described above are illustrative. In other embodiments, the light transmittance of the second sealing element 104 can be any other value with a light transmittance ≥ 88%, and the water vapor transmission rate can be ≤ 3 g / m³. 2 Other values ​​for / day, and the value for bond strength, can also be any other value among those with bond strength ≥ 100 N / cm.

[0039] In some possible implementations, the first sealing element 102 can be POE, EVA, or a combination thereof, and the second sealing element 104 can be TPO. For example, the first sealing element 102 can be POE. POE has strong weather resistance, outstanding resistance to ultraviolet aging and damp heat aging, and excellent water vapor barrier properties, which can effectively protect the crystalline silicon cell 103 from moisture corrosion, improve module life, and has good resistance to PID (potential-induced degradation), reducing the risk of module power degradation and making it suitable for high-voltage photovoltaic modules. In addition, by using POE for the first sealing element 102, the cured POE can withstand the hot spot temperature of the crystalline silicon cell 103, reducing the risk of encapsulation material delamination caused by high and low temperature cycling, and enhancing the reliability of the first preform 100 and the perovskite crystalline silicon tandem photovoltaic module 300.

[0040] Of course, the above-described implementation of the first sealing element 102 using POE is illustrative. In other implementations, the first sealing element 102 can also be EVA. EVA has lower cost, mature technology, strong adhesion, good compatibility with the first cover plate 101 and the crystalline silicon cell 103, stable structure after encapsulation, and high light transmittance, which can maximize the transmission of sunlight and reduce the impact on the cell conversion efficiency. Alternatively, the first sealing element 102 can be a mixture of POE and EVA, i.e., EPE. EPE combines the high adhesion of EVA and the weather resistance of POE, with balanced overall performance. Its anti-aging and anti-PID performance is better than that of ordinary EVA. Thus, the crystalline silicon cell 103 can be encapsulated by EPE, thereby making the cost of the first preform 100 lower than that of pure POE, balancing performance and economy.

[0041] To accommodate the perovskite cell 202 and the preform 100 and perovskite cell 202 laminated together to form a perovskite-silicon tandem photovoltaic module 300, the second sealing element 104 is TPO. TPO has the advantage of a low crosslinking temperature, thus adapting to the low-temperature lamination process of the perovskite cell 202. The perovskite cell 202 is usually encapsulated with TPO film. When the preform 100 and perovskite cell 202 are laminated together to prepare the perovskite-silicon tandem photovoltaic module 300, the second sealing element 104 is TPO, and the encapsulation film layer of the perovskite cell 202 is also TPO. Thus, the second sealing element 104 in the preform 100 and the encapsulation film layer of the perovskite cell 202 are fused together to form a sealed perovskite cell 202, thereby producing the perovskite-silicon tandem photovoltaic module 300.

[0042] like Figure 3 As shown, in a second aspect, this disclosure provides a method for preparing a preform suitable for a perovskite-silicon tandem photovoltaic module, comprising the following steps: S10. The first adhesive film layer 105, the crystalline silicon cell 103 and the composite adhesive film layer 106 are stacked sequentially on one side of the first cover plate 101.

[0043] The composite adhesive film layer 106 is a pre-formed adhesive film layer consisting of the second adhesive film layer 107 and the third adhesive film layer 108; and the first adhesive film layer 105 and the second adhesive film layer 107 are thermosetting resins, the third adhesive film layer 108 is a thermoplastic resin, and the melting temperature of the third adhesive film layer 108 is lower than the curing temperature of the first adhesive film layer 105 and the second adhesive film layer 107.

[0044] S20. Hot pressing causes the first adhesive film layer 105 and the second adhesive film layer 107 to crosslink and cure to form the first sealing element 102, and the third adhesive film layer 108 to form the second sealing element 104, thereby forming the preform 100.

[0045] Through the above technical solution, in the preparation method of this disclosure, the first cover plate 101, the first adhesive film layer 105, the crystalline silicon cell 103 and the composite adhesive film layer 106 are hot-pressed to form a preform 100 containing the crystalline silicon cell 103. Since the first adhesive film layer 105 and the second adhesive film layer 107 are thermosetting resins, after heating, the first adhesive film layer 105 and the second adhesive film layer 107 are fused together to cover the crystalline silicon cell 103. After curing, a first sealing element 102 is formed to encapsulate the crystalline silicon cell 103. Thus, the first sealing element 102 can improve the encapsulation stability of the preform 100. Especially when the crystalline silicon cell 103 experiences a hot spot effect, it reduces the risk of delamination of the encapsulation material caused by high and low temperature cycling and improves the reliability of the perovskite crystalline silicon tandem photovoltaic module 300. In addition, after the third film layer 108 is cured, a second sealing element 104 is formed. The second sealing element 104 is made of thermoplastic resin, which facilitates the cross-linking and fusion of the preform 100 and the encapsulation film layer of the perovskite cell 202, and hot-presses it into a perovskite crystalline silicon tandem photovoltaic module 300.

[0046] In some possible implementations, the hot-pressing temperature of the preform 100 is greater than or equal to 140°C. For example, the hot-pressing temperature of the preform 100 can be 140°C, 141°C, 145°C, 150°C, etc. By limiting the hot-pressing temperature of the preform 100 to greater than or equal to 140°C, the first adhesive film layer 105 and the second adhesive film layer 107 can melt and flow, filling the gaps between the crystalline silicon cells 103 and completing cross-linking and curing. The first adhesive film layer 105 and the second adhesive film layer 107 are cured to form a first sealing element 102, which encapsulates the crystalline silicon cells 103, thus forming a reliable preform 100. Of course, to ensure cross-linking quality, component reliability, and production efficiency, the hot-pressing temperature of the preform 100 can be, for example, less than or equal to 160°C.

[0047] In some possible implementations, the first adhesive layer 105 and the second adhesive layer 107 are POE, EVA, or a combination thereof, and the third adhesive layer 108 is TPO. For example, when the first adhesive layer 105 and the second adhesive layer 107 are POE and the third adhesive layer 108 is TPO, during hot pressing to form the preform 100, the first adhesive layer 105 and the second adhesive layer 107 melt and flow, filling the gaps between the crystalline silicon cells 103 and completing cross-linking and curing. The first adhesive layer 105 and the second adhesive layer 107 are cured to form a first sealing element 102 made of POE. The third adhesive film layer 108 is then cured into the second sealing element 104. When the preform 100 and the perovskite cell 202 are hot-pressed to form a perovskite crystalline silicon tandem photovoltaic module 300, since the encapsulation film layer of the perovskite cell 202 is TPO, the third adhesive film layer 108 can melt with the encapsulation film layer of the perovskite cell 202 during hot pressing and complete cross-linking and curing, thereby forming the perovskite crystalline silicon tandem photovoltaic module 300.

[0048] Of course, in some possible implementations, for example, the first film layer 105 and the second film layer 107 can be EVA, and the third film layer 108 can be TPO; the first film layer 105 and the second film layer 107 can be EPE, which is made by a three-layer co-extrusion process of EVA, POE and EVA, and the third film layer 108 can be TPO.

[0049] In some possible implementations, the light transmittance of the third film layer 108 is ≥88%. By limiting the light transmittance of the third film layer 108, more light can pass through the third film layer 108 and be absorbed and generated in the crystalline silicon cell 103.

[0050] In some possible implementations, the water vapor permeability of the third film layer 108 is ≤3 g / m³. 2 / day, by limiting the water vapor permeability of the third film layer 108, moisture can be effectively isolated, reducing the interference of moisture on the perovskite cell 202 during the lamination of the preform 100 and the perovskite cell 202.

[0051] In some possible implementations, the adhesive strength of the third encapsulant layer 108 is ≥100 N / cm. By limiting the adhesive strength of the third encapsulant layer 108, the high adhesive strength requirement can be met, ensuring a reliable bond between the encapsulant layer of the preform 100 and the perovskite cell 202 when the preform 100 and the perovskite cell 202 are laminated, thus stabilizing the structure of the perovskite crystalline silicon tandem photovoltaic module 300.

[0052] The third aspect of this disclosure provides a preform suitable for perovskite-silicon tandem photovoltaic modules, which is prepared using the above-described method.

[0053] like Figure 4 and Figure 5 As shown, the fourth aspect of this disclosure provides a perovskite-silicon tandem photovoltaic module, including a perovskite cell module and a crystalline silicon cell module. The perovskite-silicon tandem photovoltaic module is fabricated by hot pressing a perovskite cell preform 200 and a crystalline silicon cell preform 100, wherein the crystalline silicon cell preform 100 includes the aforementioned preform 100 suitable for the perovskite-silicon tandem photovoltaic module. It is understood that the aforementioned perovskite-silicon tandem photovoltaic module includes all the beneficial effects of the aforementioned preform.

[0054] It should be noted that the crystalline silicon cell preform 100 mentioned above is an intermediate transitional part during the hot pressing of the crystalline silicon cell module, and the perovskite cell preform 200 is an intermediate transitional part during the hot pressing of the perovskite cell module. The crystalline silicon cell preform 100 and the perovskite cell preform 200 are hot-pressed to form a perovskite crystalline silicon tandem photovoltaic module 300.

[0055] In some possible implementations, such as Figure 6 and Figure 7 As shown, the perovskite cell preform 200 includes a second cover plate 201, a perovskite cell 202 disposed on one side of the second cover plate 201, and a third sealing element 203 covering the perovskite cell 202.

[0056] In some feasible embodiments, the perovskite-silicon tandem photovoltaic module 300 further includes a functional film layer disposed between the perovskite cell module and the crystalline silicon cell module; wherein the functional film layer includes at least one of an insulating film layer, a light transfer film layer, and a cut-off film layer. For example, when the perovskite-silicon tandem photovoltaic module 300 is fabricated by hot pressing, an insulating film layer can be provided between the crystalline silicon cell preform 100 and the perovskite cell preform 200 to provide insulation, thereby preventing short circuits between the perovskite cell 202 and the crystalline silicon cell 103. Of course, a light transfer film layer can also be provided between the crystalline silicon cell 103 and the perovskite cell 202. By providing the light transfer film layer, the wavelength of light transmitted through the perovskite cell 202 is changed, increasing the light absorption rate of the crystalline silicon cell 103. In addition, a cut-off film layer can also be provided between the crystalline silicon cell 103 and the perovskite cell 202 to reduce the amount of light reaching the crystalline silicon cell 103 that may affect its reliability.

[0057] It should be noted that the insulating film layer, light transfer film layer and cut-off film layer in the above-mentioned functional film layers can be a combination of one or more, and this disclosure does not make specific limitations.

[0058] Furthermore, this disclosure also provides a method for preparing a perovskite-silicon tandem photovoltaic module 300, comprising: The first cover plate 101, the first adhesive film layer 105, the crystalline silicon cell 103 and the composite adhesive film layer 106 are stacked and thermally laminated at a second preset temperature T2 to prepare the crystalline silicon cell preform 100.

[0059] The composite adhesive film layer 106 includes a second adhesive film layer 107 and a third adhesive film layer 108.

[0060] The second cover plate 201, the perovskite cell 202 and the fourth adhesive film layer 204 are stacked and hot-laminated at a third preset temperature T3 to prepare the perovskite cell preform 200.

[0061] The crystalline silicon cell preform 100 and the perovskite cell preform 200 are stacked and thermally laminated at a first preset temperature T1 to form a perovskite-crystalline silicon tandem photovoltaic module 300.

[0062] Wherein, the first preset temperature T1 and the third preset temperature T3 are both lower than the second preset temperature T2, the first adhesive layer 105 and the second adhesive layer 107 are thermosetting resin materials, and the third adhesive layer 108 and the fourth adhesive layer 204 are thermoplastic resin materials.

[0063] In some possible implementations, such as Figure 6 and Figure 7 As shown, the method for preparing the perovskite solar cell preform 200 includes: sequentially stacking a perovskite solar cell 202 and a fourth encapsulant layer 204 on one side of a second cover plate 201; heating and laminating at a third preset temperature T3 to form the perovskite solar cell preform 200; and forming a third sealing element 203 with the fourth encapsulant layer 204, wherein the third preset temperature T3 is lower than the second preset temperature T2. The perovskite solar cell 202 and the fourth encapsulant layer 204 are supported by the second cover plate 201, and the perovskite solar cell 202 is encapsulated by the fourth encapsulant layer 204 to form the perovskite solar cell preform 200. The perovskite solar cell preform 200 is stacked with a crystalline silicon solar cell preform 100. During heating and lamination at a first preset temperature T1, the third encapsulant layer 108 in the crystalline silicon solar cell preform 100 and the fourth encapsulant layer 204 in the perovskite solar cell preform 200 melt to form a perovskite-crystalline silicon tandem photovoltaic module 300. Furthermore, perovskite materials are inherently sensitive to high temperatures, which can cause power degradation in perovskite solar cells. To meet the lamination temperature requirements of perovskite solar cell 202, the third preset temperature T3 is lower than the second preset temperature T2. Here, the third preset temperature T3 can be referenced to the first preset temperature T1; for example, the third preset temperature T3 can also be less than or equal to 120°C.

[0064] In some possible implementations, the perovskite-silicon tandem photovoltaic module 300 is formed by heating and laminating at a first preset temperature T1, and further includes the following step: applying edge-sealing adhesive 500 to the circumferential edge of the laminated part after heating and lamination to form the perovskite-silicon tandem photovoltaic module 300. For example... Figure 8 As shown, the perovskite-silicon tandem photovoltaic module 300 prevents moisture and oxygen from intruding through the edges by applying an edge sealant 500, thus avoiding hydrolysis and oxidative degradation of the perovskite cells 202. Furthermore, it forms a double seal with the first sealing element 102 and the fourth sealing element 400, combining internal bonding and edge sealing, thereby improving the reliability of the perovskite-silicon tandem photovoltaic module 300. It is understood that the edge sealant 500 can be one or more combinations of butyl rubber, silicone sealant, and polyurethane adhesive.

[0065] This disclosure specifically provides a method for fabricating a perovskite-silicon tandem photovoltaic module, providing a crystalline silicon cell preform 100. The crystalline silicon cell preform 100 includes a first cover plate 101, a POE encapsulant layer (first encapsulant layer 105) located in front of the first cover plate 101, a crystalline silicon cell 103 located in front of the POE encapsulant layer (first encapsulant layer 105), and a composite encapsulant layer 106 located in front of the crystalline silicon cell 103. The composite encapsulant layer 106 includes a POE encapsulant layer facing the crystalline silicon cell 103. The first POE film layer (second film layer 107) and the second POE film layer (third film layer 108) facing away from the crystalline silicon cell 103 are hot-pressed at a second preset temperature T2 (T2 is above 140°C) to form a crystalline silicon cell preform 100. At this time, the first POE film layer (first film layer 105) and the second POE film layer (second film layer 107) are cured to form a first sealing element 102 that seals the crystalline silicon cell 103, and the third POE film layer (third film layer 108) is cured to form a second sealing element 104. A perovskite cell preform 200 is provided, comprising a second cover plate 201, a perovskite cell 202 formed on the surface of the second cover plate 201, and a TPO film layer (fourth film layer 204) covering the surface of the perovskite cell 202. The perovskite cell preform 200 is formed by hot pressing at a third preset temperature T3 (T3 can be below 120°C), and the TPO film layer (fourth film layer 204) forms a third sealing element 203 to seal the perovskite cell 202. Perovskite cell preform 200 and preform 100 are stacked, with crystalline silicon cell 103 and perovskite cell 202 located between first cover plate 101 and second cover plate 201. They are heated and laminated at a first preset temperature T1 (T1 can be below 120°C) to form a perovskite crystalline silicon tandem photovoltaic module 300. At this time, the second sealing element 104 and the third sealing element 203 cross-link and fuse with each other at the first preset temperature T1 to form a fourth sealing element 400, thereby forming the perovskite crystalline silicon tandem photovoltaic module 300.

[0066] Furthermore, it is understood that the second cover plate 201 can be transparent glass, allowing light to pass through during photovoltaic module operation, enter the perovskite cell 202, and be partially absorbed, while long-wavelength light passing through the perovskite cell 202 enters the crystalline silicon cell 103 and is absorbed. The first cover plate 101 can be glass, providing mechanical protection and blocking moisture.

[0067] It is understood that the above-described method for preparing a perovskite-silicon tandem photovoltaic module, which uses crystalline silicon cell preform 100 and perovskite cell preform 200 to stack and hot-press to form a perovskite-silicon tandem photovoltaic module 300, is illustrative. In other embodiments, the crystalline silicon cell preform 100 can be directly hot-pressed with the perovskite cell 202, the fourth encapsulant layer 204, and the second cover plate 201.

[0068] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0069] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0070] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A prefabricated component suitable for perovskite-silicon tandem photovoltaic modules, characterized in that, include: First cover plate; The first sealing element is disposed on one side of the first cover plate; A crystalline silicon cell is disposed inside the first sealing element, and the crystalline silicon cell is fixed to the first cover plate by the first sealing element; and The second sealing element is disposed on the side of the first sealing element opposite to the first cover plate; The first sealing element is a thermosetting resin, the second sealing element is a thermoplastic resin, and the melting temperature of the second sealing element is lower than the curing temperature of the first sealing element.

2. The prefabricated component suitable for perovskite-silicon tandem photovoltaic modules according to claim 1, characterized in that, The first sealing element is POE, EVA, or a combination thereof, and the second sealing element is TPO.

3. The prefabricated component suitable for perovskite-silicon tandem photovoltaic modules according to claim 1, characterized in that, The light transmittance of the second sealing element is ≥88%; and / or The water vapor permeability of the second sealing element is ≤3g / m 2 / day; and / or The bonding strength of the second sealing element is ≥100 N / cm.

4. A method for preparing preforms suitable for perovskite-silicon tandem photovoltaic modules, characterized in that, Includes the following steps: A first adhesive film layer, a crystalline silicon cell, and a composite adhesive film layer are stacked sequentially on one side of the first cover plate. The composite adhesive film layer is a pre-formed adhesive film layer consisting of a second adhesive film layer and a third adhesive film layer. The first adhesive film layer and the second adhesive film layer are thermosetting resins, and the third adhesive film layer is a thermoplastic resin. The melting temperature of the third adhesive film layer is lower than the curing temperature of the first adhesive film layer and the second adhesive film layer. Hot pressing causes the first adhesive film layer and the second adhesive film layer to crosslink and cure to form a first sealing element, and the third adhesive film layer forms a second sealing element to form the preform.

5. The method for preparing a preform suitable for a perovskite-silicon tandem photovoltaic module according to claim 4, characterized in that, The hot pressing temperature is greater than or equal to 140℃.

6. The method for preparing a preform suitable for a perovskite-silicon tandem photovoltaic module according to claim 4, characterized in that, The first and second adhesive film layers are POE, EVA, or a combination thereof, and the third adhesive film layer is TPO.

7. The method for preparing a preform suitable for a perovskite-silicon tandem photovoltaic module according to claim 4, characterized in that, The light transmittance of the third adhesive film layer is ≥88%; and / or The water vapor permeability of the third film layer is ≤3g / m³. 2 / day; and / or The bonding strength of the third adhesive film layer is ≥100 N / cm.

8. A prefabricated component suitable for perovskite-silicon tandem photovoltaic modules, characterized in that, Prepared by the method described in any one of claims 4-7.

9. A perovskite-silicon tandem photovoltaic module, comprising a perovskite cell module and a crystalline silicon cell module, characterized in that, The perovskite-silicon tandem photovoltaic module is fabricated by hot pressing a perovskite cell preform and a crystalline silicon cell preform, wherein the crystalline silicon cell preform includes any one of claims 1-3 or the preform suitable for perovskite-silicon tandem photovoltaic modules as described in claim 8.

10. The perovskite-silicon tandem photovoltaic module according to claim 9, characterized in that, The perovskite-silicon tandem photovoltaic module further includes a functional film layer disposed between the perovskite cell module and the crystalline silicon cell module; wherein the functional film layer includes at least one of an insulating film layer, a light transfer film layer, and a cut-off film layer.

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