Component carrier and tuft to be embedded into the component carrier

Abstract

A cluster (100) is configured to be inserted and subsequently embedded into a recess (116) provided in a component carrier (104), the cluster comprising at least one component (102), and an uncured solid resin portion (106) encapsulating said component (102), said uncured solid resin portion (106), or at least one said component (102) and said uncured solid resin portion (106) forming an outer surface of said cluster (100).

Description

Technical Field

[0001] This invention relates to clusters, methods for manufacturing clusters, component carriers, and methods for manufacturing component carriers. Background Technology

[0002] With the increasing functionality of products equipped with component carriers containing one or more electronic components, the miniaturization of these components, and the growing number of electronic components to be mounted on component carriers such as printed circuit boards, there is a growing trend towards the use of increasingly robust array-like components or packages with multiple contacts or connections, with increasingly smaller spacing between these contacts. The removal of heat generated during operation by these electronic components and the component carriers themselves has become an increasingly important issue. Simultaneously, the mounting device must be mechanically robust to ensure operation even under harsh conditions.

[0003] Given these boundary conditions, embedding the component into the component carrier is challenging. Summary of the Invention

[0004] The object of this invention is to provide an architecture for a component carrier that allows one or more components to be embedded in a simple manner while ensuring high mechanical integrity.

[0005] To achieve the above objectives, a cluster according to the independent claims, a method for manufacturing the cluster, a component carrier, and a method for manufacturing the component carrier are provided.

[0006] According to an exemplary embodiment of the present invention, a cluster is provided, the cluster being configured to be inserted into and subsequently embedded in a recess provided in a component carrier, the cluster comprising at least one component and a resin portion of an uncured solid that at least partially encapsulates the component, the resin portion of the uncured solid, or at least one component and the resin portion of the uncured solid forming the outer surface of the cluster.

[0007] According to another exemplary embodiment of the present invention, a method for manufacturing a cluster is provided, the cluster being configured to be inserted into and subsequently embedded in a recess provided in a component carrier, wherein the method comprises: at least partially encapsulating at least one component with an uncured flowable resin portion, and subsequently converting the uncured flowable resin portion into an uncured reversibly hardened state to secure at least one of the components in the resin portion.

[0008] According to another exemplary embodiment of the present invention, a component carrier is provided, comprising: a stack, the stack including at least one electrically conductive layer structure and at least one electrically insulating layer structure; a recess formed in the stack; and at least one component embedded in the recess; wherein the recess is provided with a resin portion encapsulating the at least one component, the resin portion being fixed to the stack by another resin portion disposed in the recess; wherein the interface between the resin portion and the other resin portion extends along an irregular boundary surface.

[0009] According to another exemplary embodiment of the present invention, a method for manufacturing a component carrier is provided, wherein the method includes: forming a recess in a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; inserting a cluster having the above-described features into the recess; and subsequently converting an uncured solid resin portion into a flowable state such that the converted resin portion interacts with the stack through the flowing resin portion; and thereafter further converting the converted resin portion into a cured solid.

[0010] In the context of this application, the term "cluster" may specifically refer to an integral body or monolithic body that can be treated as a single piece. A cluster may be in a solid phase and may hold at least one component therein, which is at least partially surrounded by a solid, uncured resin portion.

[0011] In the context of this application, the term "recess" may specifically refer to a cavity, groove, or hole (particularly a blind hole or through hole) extending through and / or into the stack. Preferably, the lateral and / or bottom and / or top and / or all sides of the recess may be defined by the layered structure of the stack.

[0012] In the context of this application, the term "component carrier" may specifically refer to any support structure capable of accommodating one or more components on and / or within a component carrier to provide mechanical support and / or electrical connection. In other words, a component carrier can be configured as a mechanical and / or electronic carrier for a component. Specifically, a component carrier can be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. In particular, a component carrier can also be embodied as a flexible or semi-rigid substrate. A component carrier can also be a hybrid board combining different component carriers of the aforementioned different types.

[0013] In the context of this application, the term "component" may specifically refer to any block-shaped rather than layered block. A component can be an electronic component, such as an active (e.g., a semiconductor chip or semiconductor package) or passive (e.g., a capacitor or inductor) electronic component embedded or to be embedded within a component carrier. However, a component can also be a non-electronic component that does not have electronic functions. For example, a component can be a component with thermal functions, such as having heat removal and / or heat dissipation functions. For example, a component can be a block of metal (e.g., copper) and / or a block of ceramic.

[0014] In the context of this application, the term "resin portion" may specifically refer to a solid or liquid synthetic or natural organic polymer. An example of a resin portion is an epoxy resin. In another example, a resin portion may include polyimide and / or polytetrafluoroethylene and / or cyanate ester resins. For example, a resin portion may be a thermosetting resin.

[0015] In the context of this application, the term "uncured resin portion" may specifically refer to a resin material that is at least partially uncured, particularly polymerizable and / or crosslinkable materials (e.g., resin portions that may undergo crosslinking at elevated temperatures and / or pressures) and / or polymerizable resin materials. The definition of a "fully cured" polymer may specifically refer to a crosslinked polymer that is no longer capable of further chemical transformation via a curing reaction even when heated above its glass transition temperature (Tg). Furthermore, the term "uncured resin portion" may specifically refer to a glassy state of material in which, within the considered time frame and under storage or standard conditions, chemical processes are minimal, but the resin portion may undergo a change of state with increasing temperature and / or pressure, becoming viscous or liquid and acquiring flowable properties, while its crosslinking process eventually reaches a fully polymerized state. After the curing process is complete, the previously uncured resin portion may become a permanent solid. Therefore, an initially at least partially uncured resin portion may reach irreversible hardening upon release of the applied high pressure and / or high temperature. When the temporarily elevated temperature and / or pressure is released, the initially uncured material may already be in a cured state. Therefore, initially uncured materials may become cured when elevated temperatures and / or pressures are applied over a certain time span according to the material to be cured. Uncured polymeric materials can be cured by exceeding their glass transition temperature. In particular, at least partially uncured resin portions may comprise or consist of stage B materials and / or stage A materials. By setting a portion of the cluster as epoxy, prepreg, or any other stage B material, the cluster portion can transform during lamination (particularly regaining flowable viscous or liquid properties), allowing the resin to flow to interconnect various elements and / or to close gaps or voids, and thus can contribute to stable internal interconnection of components to be embedded in component carriers during manufacturing. For example, a curing agent can be added to a stage A liquid (e.g., epoxy) resin and cured until stage B conditions are reached. Stage B can be a solid or semi-solid thermoplastic stage. When additional heat and / or pressure is applied, stage B (e.g., epoxy) resin can flow and continue to cure to a crosslinked state or stage C. In the C stage, the resin can be fully cured and can remain permanently in the solid phase, such as in an irreversible cross-linked state.

[0016] In the context of this application, the term "uncured solid resin portion" may specifically refer to at least partially uncured resin portions situated in a solid or hardened phase. The resin portion in the solid phase may be hard and non-liquid. For example, the uncured solid resin portion may be in a supercooled glassy state and / or a gel state.

[0017] In the context of this application, the term "uncured, flowable resin portion" may specifically refer to at least partially uncured resin portions in a liquid or viscous phase, such that they are flowable. Flowable resin portions are resin portions not in a solid phase.

[0018] In the context of this application, the term "uncured reversibly hardened state" can specifically refer to the state of at least partially uncured resin portions in a solid phase, which can still be transformed into a flowable state (particularly by pressure and / or heat, e.g., resin portions with a degree of polymerization in the range of 30% to 70%) for curing, and when curing is complete, the resin portions in the previously uncured reversibly hardened state can be transformed into a permanently solid cured state. In the reversibly hardened state, at least partially uncured resin portions may still be capable of polymerization or crosslinking. In the reversibly hardened state, at least partially uncured resin portions may be in a glassy state, but can still become flowable due to the increased temperature and / or pressure provided causing it to become a viscous liquid. Upon complete curing (e.g., resin portions with a degree of polymerization greater than 70% or even greater than 95%), the ability to become flowable again, the ability to polymerize further, and / or the ability to crosslink further may be permanently lost. "Uncured reversibly hardened state" can also be referred to as "at least partially uncured solid state". For example, uncured solid resin portions can be in a supercooled glassy state and / or a gel state.

[0019] In the context of this application, the term "cured resin portion" may specifically refer to a resin portion that has undergone a curing process and is therefore no longer capable of being made into a flowable, repolymerizable, and / or recrosslinkable form. The cured resin portion may be in a cured, irreversible hardened state. For example, the cured resin portion may be in stage C.

[0020] For example, an uncured resin portion may have a viscosity value in the range of 100 Pas to 107 Pas at room temperature (stage A may be quite low (because the resin portion may be liquid), but stage B may be quite high). For example, an uncured resin portion may have a viscosity value in the range of 1 Pas to 105 Pas at 150°C (stages A and B). For example, a fully cured resin portion may have a viscosity value in the range of 10 Pas to 105 Pas at room temperature. 7 Pas to 10 9 Viscosity values ​​within the Pas range (in stage C). For example, a fully cured resin portion may have a viscosity value of 10 Pas at 150°C. 6 Pas to 10 9 Viscosity values ​​are within the Pas range. However, those skilled in the art will understand that it is difficult to give precise figures because at temperatures above 50°C, the material may begin to polymerize and thus change its viscosity.

[0021] In the context of this application, the term "stacked structure" may specifically refer to an arrangement of multiple planar layers mounted parallel to each other and vertically on top of each other.

[0022] In the context of this application, the term "layer structure" may specifically refer to a continuous layer, a patterned layer, or a plurality of discontinuous islands in a common plane.

[0023] In the context of this application, the term "irregular boundary surface" may specifically refer to the surface where a resin portion and another resin portion abut each other, defining a boundary surface between the resin portions that does not extend along a regular, defined, and / or repeatable shape. An irregular boundary surface may define a non-planar boundary surface (e.g., at a subsequent mating extension). "Irregular boundary surface" may also be referred to as a "profiled boundary surface" or a boundary surface having a surface profile or morphology.

[0024] In the context of this application, the term "main surface" for a body may specifically refer to one of the two largest opposing surfaces of the body. Main surfaces can be connected by circumferential sidewalls. The thickness of a body, such as a stacked component, may be defined by the distance between the two opposing main surfaces.

[0025] According to an exemplary embodiment, a cluster can be provided, specifically configured to be inserted as a single integral block and subsequently embedded and secured in a recess (e.g., cavity) of a component carrier (e.g., a printed circuit board). Such a cluster may include one or more components (e.g., semiconductor wafers) and a resin portion encapsulating at least a portion of the components in an uncured solid state. Advantageously, such a cluster can be manufactured by encapsulating the components with an uncured, flowable resin portion, which can then be transformed into an uncured, reversibly hardened resin portion for temporarily securing the components within the resin portion. This allows the cluster to be treated as a single piece, for example, inserted into the recess of the component carrier by picking up and placing the components. The uncured, solid resin portion holding or holding the components in the cluster together is then cured (e.g., by pressure and / or heat), and the resin portion can then be made flowable and subsequently permanently cured (to obtain a cured resin portion), thereby permanently securing the components in the recess of the component carrier, for example, thereby ensuring that all space between the components and the recess is filled by the cured resin portion.

[0026] Preferably, the resin portion of the cluster can be secured to the stack of the component carrier by another resin portion in the recess (the other resin portion is not initially part of the cluster). The interface between the resin portion and the other resin portion can be formed as an irregular boundary surface, which is the trace left by the curing of the resin portion of the cluster and the other resin portion (e.g., sheet resin) during component insertion. Alternatively, a portion of the interface between the resin portion and the other resin portion can be shaped according to a regular boundary surface. For example, a regular boundary surface can be two flat areas in direct contact with each other. In another example, the interface between the resin portion and the other resin portion can have a keyed shape relative to each other. It is highly advantageous to provide a cluster that can be processed as a single piece, having an uncured solid resin portion and a component held in the resin portion, allowing multiple components, especially multiple components with different heights, to be easily inserted into a single recess. All of this can be done for the purpose of inserting the cluster as a whole into the recess (e.g., cavity) of the component carrier and subsequently curing the uncured solid resin portion of the cluster. By taking this measure, processing a single cluster is sufficient, and it further ensures that, upon curing, the resin portion of the cluster reliably fills the bottom of the cavity, which might be difficult to achieve when only sheet-like resin portions are provided. This allows for easy embedding of components while ensuring high mechanical integrity.

[0027] Other exemplary embodiments of the clusters, component carriers, and methods will be described below.

[0028] Preferably, the uncured, flowable resin portion can be transformed into an incompletely cured (especially glassy) state.

[0029] Preferably, the uncured solid resin portion of the cluster is fully vitrified at least at the outer surface of the cluster. More preferably, the entire uncured solid resin portion constituting the cluster is vitrified. Furthermore, the uncured solid resin portion of the cluster is fully vitrified at least at the surface between the cluster and the component. Preferably, the uncured solid resin portion of the cluster has not yet reached any stage of gelation. This provides the advantage of having a highly fluid resin portion before the curing stage, thus filling all the space between the component and the seat (preferably a component carrier to which the cluster is fixed, more preferably a recess into which the cluster is embedded).

[0030] In this embodiment, the component does not contact any additional resin portion. At least one of the lateral extensions and / or one of the two main surfaces of the component may be completely covered by the resin portion. All main surfaces of the component may be at least partially covered by the resin portion. In particular, the resin portion may at least partially contact the sidewall of the recess. This provides the advantage of mechanically protecting the component in the cluster and / or component carrier during final state and / or manufacturing, thereby preventing additional resin portion from flowing into the component and potentially causing the component to deviate from its initial position.

[0031] In another embodiment, the component may come into contact with another resin portion (e.g., see...). Figure 3 However, at least one side of the component may not be in contact with other resin parts. It is also feasible for at least 50% or at least 70% of the surface area of ​​the component to be in contact with other resin parts.

[0032] In embodiments, the cluster comprises multiple components encapsulated within an uncured solid resin portion. Advantageously, the multiple components can be treated as a whole when fixed within the uncured solid resin portion of the cluster. During the final curing stage, the fixation and / or immobilization of the components can be enhanced by the fully liquefied resin portion that has not previously exceeded the glass transition stage. In the context of this application, the term "glass transition stage" can specifically refer to a physical state that depends on the temperature and / or pressure of the material, such as the resin, separating the material's physical behavior. On one side of the glass transition stage, the material may have reversible temperature and / or pressure-dependent viscosity behavior. On the other side of the glass transition stage, the material may have irreversible temperature and / or pressure-dependent viscosity behavior. Preferably, the glass transition stage can be the glass transition point. An adhesive (temporary or permanent) carrier can be attached to the cluster during its formation, thereby holding the components in the target position. The preferred combination of multiple components encapsulated within an uncured solid resin portion in the fully vitrified stage provides the advantages of a highly flowable material, thereby avoiding any mechanical forces on the components caused by the movement of the uncured flowable resin portion toward empty spaces during curing, thus ensuring reliable positional retention between the components and the component carrier. This positional retention can be further enhanced by the adhesive carrier, thereby improving component positioning.

[0033] In this implementation, different components among the multiple parts have different heights and / or different widths. Therefore, the cluster concept according to the exemplary implementation allows multiple parts to be treated as a whole, even when they have (simultaneously) different heights and / or widths. This can overcome the conventional disadvantages of inserting multiple parts into a common recess, such as a cavity.

[0034] In this embodiment, the uncured solid resin portion is in an uncured, reversibly hardened state, which may also be referred to as at least partially uncured solid. The uncured resin portion of the cluster can be fixed to one or more components by solidification, for example, but not necessarily by freezing. Additionally or alternatively, the uncured resin portion of the cluster can be fixed to one or more components by solidification, for example, by applying stress. This may be related to the shear thickening behavior of the uncured resin portion. Transforming the uncured resin portion from a flowable state to a solid state can be accomplished in different ways, for example, by thermal and / or chemical means. This can provide the advantage that the position of the components embedded in the cluster and / or component carrier has high precision because one or more components can be locally fixed.

[0035] In one embodiment, the uncured solid resin portion covers at least a portion of the sidewall of at least one component and / or at least a portion of the top wall of at least one component and / or at least a portion of the bottom wall of at least one component. In another embodiment, the uncured solid resin portion covers the entire surface of one or more components to provide hermetically tight coverage of the entire surface of one or more components. In yet another embodiment, the uncured solid resin portion covers only a portion of the surface of one or more components; for example, the bottom main surface (or a portion thereof) of the respective component may be exposed beyond the resin portion of the cluster. This simplifies establishing an electrical connection with the electrically conductive layer structure of the stack when one or more metal pads are located at the bottom main surface of the respective component.

[0036] In implementations, the clusters have a cubic or disc shape. A cluster can be embodied as a single block of any desired shape. This simplifies handling via pick-and-place devices.

[0037] In this embodiment, the cluster consists only of the uncured solid resin portion and at least one of the components. For example, the cluster may consist only or substantially of these two elements. This results in a simple cluster construction, thereby avoiding any additional barriers to the subsequent flow of the resin portion, particularly those caused by the curing process.

[0038] In embodiments, the method of producing clusters includes transforming an uncured, flowable resin portion into an uncured, reversibly hardened state by lowering the temperature and / or pressure, or by partially curing only the uncured, flowable resin portion. Preferably, the temperature reduction is triggered before the resin portion reaches a gel state. In particular, gelation can be a critical region where, as the reaction proceeds, the mixture becomes more viscous, and where, in the case of a typically exothermic chain growth reaction, the released heat can cause the reaction to become too vigorous and uncontrollable, rapidly progressing to an irreversible polymerization level unless effective cooling is used. For example, lowering the temperature can increase viscosity, for instance, by freezing the resin portion into a solid state, and in particular, may cause a phase transition. Partially curing only the uncured, flowable resin portion can be achieved, for instance, by transforming the flowable A-stage resin portion into a solid B-stage resin portion without fully curing it to the C-stage.

[0039] In one embodiment, the method includes inserting at least one component and an uncured, flowable resin portion into a receiver that defines at least a portion of the outline of a cluster, thereby encapsulating the at least one component via the uncured, flowable resin portion. For example, one or more components may be placed in the receiver and immersed in at least a portion of the liquid, uncured resin portion inserted into the receiver. This ensures, in a simple manner, that the resin portion covers a large portion of the component surface.

[0040] Preferably, the receiver is defined by an adhesive bottom wall and non-adhesive side walls. More preferably, the bottom wall of the receiver is formed of an adhesive sheet (e.g., adhesive tape). More preferably, the non-adhesive side walls of the receiver are formed of a non-adhesive coating (e.g., a PTFE (polytetrafluoroethylene) coating). The adhesive bottom wall ensures that one or more components are temporarily secured to the adhesive bottom wall during cluster fabrication. The non-adhesive side walls ensure that easily fabricated clusters can be easily removed from the receiver.

[0041] In one embodiment, a kit is provided comprising one or more clusters having the aforementioned features and a storage device for holding the at least one cluster. The storage device may be configured to isolate or decouple the clusters from the external environment (particularly from at least one influencing factor such as temperature, humidity, foreign matter, and / or light). The storage device may include units suitable for instructing temporary management of the clusters. The storage device may be configured to be integrated into subsequent process steps applied to and / or within a component carrier. Figure 23 belt and reel device and Figure 24 The tray device illustrates an example of this storage device.

[0042] In embodiments of the component carrier, at least one component is exposed beyond the resin portion at a side, particularly at the bottom side. At the same side, at least one component may also be exposed beyond another resin portion. In the surface area of ​​the respective component exposed relative to the resin portion, the embedded component can be electrically, optically, and / or thermally connected to the stack and / or other portions of the component carrier.

[0043] In one embodiment, at least one component partially contacts another resin portion at an extension of the irregular boundary surface. More specifically, the end of the shaped or irregular boundary surface at the interface between the resin portion of the cluster and the resin portion of the stack can be connected to the corresponding component, particularly to the sidewall of the component.

[0044] In this embodiment, the resin portion and the other resin portions are made of the same material. However, an interface may exist between the resin portion of the cluster and the resin portion of the stack, and may be visible, for example, in a cross-sectional view. This can result in uniform properties within the component carrier and thus suppress undesirable phenomena such as warping, delamination, CTE (coefficient of thermal expansion) mismatch, etc.

[0045] In another embodiment, the resin section and other resin sections are made of different materials. This allows for fine-tuning of the properties of the component carrier and its various components, even in a spatially discernible manner.

[0046] Furthermore, resin portions of clusters (i.e., resin portions of clusters that at least partially encapsulate one or more components) and resin portions of stacks (i.e., resin portions of stacks, such as those derived from initially at least partially uncured sheets laminated onto the stack) of different types, sizes, distributions, materials, quantities per unit volume, filler shapes, etc., can be used. Additionally, different resin portions or resin portions of the same type but with different properties (e.g., density, visual characteristics) can be used. Resin portions and / or additional resin portions can affect the cushioning between the resin portions, at least one component, and the stack. Furthermore, different properties can be provided between resin portions and additional resin portions relative to the electrical insulation layer structure of the stack.

[0047] In embodiments, the resin portion and / or additional resin portions include filler particles. The filler particles in the resin portion and additional resin portions may be the same or may differ in at least one property such as material and / or material distribution, size and / or size distribution, shape, hollow, solid, or porous characteristics, and / or the amount of the respective filler particles. For example, the filler particles may be added to the respective resin portion to provide at least one additional function, such as enhanced thermal conductivity, electrical shielding, enhanced electrical insulation, etc. The distribution of the filler particles can indicate the flow direction of the resin portion and / or additional resin portions, for example, during the curing process, by defining the flow direction of the resin portion during curing by different portions of the filler with different densities. This can be readily identified, for example, by cross-sectional and microscopic analysis of the component carrier.

[0048] In this implementation, the irregular boundary surface is a three-dimensional curved surface. In other words, the irregular boundary surface can have curvature in all three spatial dimensions. In this implementation, the boundary surface defined by the interface of the two resin portions can be edgeless. This can result in better adhesion between the resin portions of the cluster and / or component carrier and other resin portions. Regardless of the unpredictable direction of the resin flow and other resin flows, this can fill the open space, thereby enabling a complete and reliable bond between the cluster and its components and the component carrier.

[0049] In an embodiment, the irregular boundary surface includes a sidewall located in the recess that defines the resin portion and / or the additional resin portion, between it and one of the components in at least one component (e.g., see...). Figure 1 ) and / or located between adjacent components (e.g., see Figure 2 The recesses, for example, multiple recesses. Such recesses can be localized depressions or curved pits. In a cross-sectional view, the corresponding recesses may extend downwards. Configurations of multiple recesses, such as wavy or wavy irregular boundary surfaces, are also possible. This can provide the advantage of forming an anchoring structure between the sidewalls of the recesses and a corresponding component in at least one of the components. Such an anchoring structure can provide good physical and / or mechanical adhesion and can simultaneously ensure the reliable position of a corresponding component in the cluster and / or component carrier.

[0050] In an embodiment, the irregular boundary surface includes a sidewall located in the recess that defines the resin portion and / or the additional resin portion, between it and one of the components in at least one component (e.g., see...). Figure 3 And / or meniscus-shaped portions, such as multiple meniscus-shaped portions, located between adjacent components. Such meniscus-shaped portions can be defined by curved, irregular boundary surfaces corresponding to concave designs of resin portions and convex designs of additional resin portions. The meniscus-shaped portion can be crescent-shaped.

[0051] The exact appearance of an irregular boundary surface can depend on adjustable material and process parameters, such as the viscosity of the resin portion and the additional resin portion in a flowable state, as well as the amount and initial position of the resin portion and / or the additional resin portion before curing.

[0052] In this embodiment, the irregular boundary surface includes a mixed resin portion and another resin portion. Therefore, the resin portion and the other resin portion can be mixed around the irregular boundary surface. In such a mixing region, a region of mixed first resin portion-other resin portion can exist between a region of pure first resin portion and a region of pure other resin portion. Such a mixing region can lead to a smooth transition and tight connection between the resin portion and the other resin portion, and thus result in high integrity of the component carrier as a whole. The formation of the mixing region can be facilitated by appropriately selecting the materials of the resin portion and the other resin portion, particularly the viscosity of the resin portion and the other resin portion in a flowable state. In particular, grafting between the resin portion and the other resin portion may occur in the mixing region.

[0053] In this embodiment, the irregular boundary surface has chemical bonds between the resin portion and the other resin portion. Therefore, the first and second resin portions abutting each other at the irregular boundary surface can be chemically bonded to each other. Depending on the configuration of the resin portion and the other resin portion, these chemical bonds can include covalent bonds and / or ionic bonds. This also ensures a strong mechanical connection between the components of the component carrier, particularly the components around the irregular boundary surface.

[0054] In an embodiment, the irregular boundary surface has a cross-linking portion between the resin portion and another resin portion. The cross-linking portion can represent the process of forming covalent bonds or relatively short chemical bond sequences to connect the two polymer chains of the resin portion and the other resin portion together. Therefore, the carbon chains between the resin portions can be cross-linked at the irregular boundary surface. In an example, the cross-linking portion may include at least one of ester functional groups, ether functional groups, amine functional groups, amide functional groups, sulfide functional groups, and thioester functional groups. This can also enhance the mechanical integrity of the component carrier in the region surrounding the irregular boundary surface.

[0055] In this embodiment, at least a portion of the gap between at least one component and the stacked component in the recess is partially filled with a resin portion and partially filled with another resin portion. For example, the bottom portion of the gap may be filled with a resin portion, while the top portion of the gap may be filled with another resin portion. This provides the advantage of using the above method to manufacture clusters and / or component carriers in a simple and reliable manner.

[0056] In this embodiment, at least two components are embedded in recesses encapsulated within the resin portion. This configuration, due to the highly fluid resin portion formed during the vitrification stage of the previously uncured solid resin portion, avoids any mechanical forces on the components caused by the movement of the uncured, flowable resin portion toward empty spaces during curing, thereby allowing for precise positioning of multiple encapsulated components.

[0057] In this embodiment, at least two components are secured in the recess by being partially formed by a resin portion and partially by another resin portion, the resin portions having a common continuous interface defined by irregular boundary surfaces for the at least two components. The resin portions and the other resin portions may interconnect with each other through mixing, chemically bond with each other, and / or crosslink or polymerize with each other at the irregular boundary surfaces having surface profiles. Because the resin portions and the other resin portions are formed in the recess by the above method, reliable positioning of the at least two components within the cluster and / or component carrier is ensured.

[0058] In an embodiment, the method includes: filling a portion of the recess in the gap between at least one component and the stack with the cured resin portion, and filling at least another portion of the gap with an additional resin portion. During the curing process, the resin portion of the cluster can become flowable and thus can flow into the small area of ​​the gap. The same applies to the additional resin portion, which can be provided in the form of a liquid adhesive inserted into the gap and / or by attaching a sheet having an uncured additional resin portion to the stack and the cluster. When the additional resin portion is cured, it can also flow into the small area of ​​the gap. Preferably, the resin portion and the additional resin portion can completely fill the gap, thereby avoiding or at least substantially avoiding undesirable voids inside the component carrier. During curing, the resin portion and the additional resin portion can have different viscosities and / or degrees of polymerization. Therefore, one resin portion or the additional resin portion may be more flowable than the corresponding other resin portion or the additional resin portion, resulting in an irregular boundary surface at the interface between the resin portion and the additional resin portion.

[0059] In one embodiment, the additional resin portion interacts with the resin portion to form an interface between the resin portions, the interface extending along an irregular boundary surface. This interaction may, for example, include the formation of chemical bonds and / or cross-linking between the resin portions and the additional resin portions. This can result in reliable interconnections between the resin portions and the additional resin portions, particularly at interfaces with irregular boundary surfaces.

[0060] In one embodiment, the method includes simultaneously curing the resin portion and the additional resin portion. Therefore, the curing of the resin portion and the additional resin portion can occur in the same process step. This simplifies the manufacturing process. Furthermore, this promotes tight bonding between the resin portion and the additional resin portion at irregular boundary surfaces.

[0061] In one embodiment, the method includes curing the resin portion and the additional resin portion by applying mechanical pressure and / or heat. By supplying only heat and / or mechanical pressure, curing of both resin portions can be triggered simultaneously, thus initiating curing of both resin portions with low workload and ensuring that the two resin portions are in a flowable state at least during the overlapping time period.

[0062] In one embodiment, the method includes: configuring an additional resin portion as part of an initial uncured sheet attached to the upper main surface of the stack and inserted into the upper main surface of the cluster in a recess; and subsequently curing the additional resin portion, for example, simultaneously curing the additional resin portion with the existing resin portion. More precisely, the cluster may be inserted into the recess of the stack. Thereafter, an uncured resin sheet (e.g., made of pure uncured resin portion, uncured resin portion and filler particles, uncured resin portion with reinforcing fibers, etc.) may be attached to the cluster and the stack. The resin sheet and the resin portion of the cluster may be simultaneously cured by pressure and / or heat.

[0063] In one embodiment, the irregular boundary surface includes a portion protruding from the recess. The resin portion can form a protruding portion from the surface due to surface tension caused by volume shrinkage during the applied curing process.

[0064] In this embodiment, an irregular boundary surface protrudes from the recess along the thickness direction of the stack, and more specifically, the irregular boundary surface protrudes from the recess along both the thickness direction and the plane direction of the stack. This provides the advantage of providing a structured portion of the resin material that interacts reliably with other resin portions, thus ensuring full integration between the resin material and the other resin portions of the stack.

[0065] In an embodiment, the irregular boundary surface protruding from the recess overlaps with the surface of at least one layer structure defining the recess of the stack, particularly the outermost electrically insulating layer structure and / or the outermost electrically conductive layer structure of the stack. This can provide the advantage of ensuring the stable integrity of the resin material within the stack, because the resin material interacts with at least one sidewall of the outermost electrically conductive layer structure and / or at least one (main) surface of the outermost electrically conductive layer structure and / or at least one sidewall of the outermost electrically insulating layer structure and / or at least one (main) surface of the outermost electrically insulating layer structure. In a preferred example, the resin material may interact with at least two, particularly at least three, and more particularly at least four of the aforementioned surfaces, and thus good integrity of the resin material within the stack can be ensured.

[0066] In an embodiment, the amount of resin portion is such that the resulting irregular boundary surface includes recesses, such as multiple recesses, between a sidewall defining the resin portion and / or the other resin portion and one of the at least one components and / or between adjacent components. Applying elevated temperatures, such as above 80°C and / or elevated pressures, such as above 1.5 bar, can form an irregular boundary surface including recesses. Additionally or alternatively, the surface tension between the resin portion material and another resin portion material can produce an irregular boundary surface including recesses, which enhances the integrity between the two adjacent materials.

[0067] In this embodiment, the amount of resin is such that the resulting irregular boundary surface includes a portion protruding from the recess. This process can form the protruding portion of the irregular boundary surface in a simple and reliable manner, which can serve as an anchoring structure and thus ensure stable mechanical interaction between the resin material and other resin materials.

[0068] In the context of this application, the terms "thickness direction of stack" or "thickness direction" or "stack direction" may specifically refer to the direction perpendicular to the planar extension of at least one layer structure of the stack.

[0069] In an embodiment, the component carrier includes a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a laminate of the aforementioned electrically insulating and electrically conductive layer structures, specifically formed by applying mechanical pressure and / or heat. The aforementioned stack may provide a plate-like component carrier, which can provide a large mounting surface for other components while remaining very thin and compact.

[0070] In this implementation, the component carrier is shaped as a plate. This contributes to a compact design, where the component carrier still provides a large base for mounting components. Furthermore, bare wafers, particularly examples of embedded electronic components, can be easily embedded into thin plates such as printed circuit boards due to their relatively small thickness.

[0071] In this embodiment, the component carrier is configured as one of a printed circuit board, a substrate (particularly an IC substrate), and an interposer.

[0072] In the context of this application, the term "printed circuit board" (PCB) can specifically refer to a plate-shaped component carrier formed, for example, by laminating several electrically conductive layer structures with several electrically insulating layer structures under pressure and / or by supplying heat. As preferred materials for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures may include resin and / or glass fiber, so-called prepreg, or FR4 material. The electrically conductive layer structures can be connected to each other in a desired manner by forming holes through the laminate, for example by means of laser drilling or mechanical drilling, and by partially or completely filling these holes with an electrically conductive material (particularly copper) to form vias or any other through-hole connections. The filled holes connect the entire stack (through-hole connections extending through multiple layers or the entire stack), or the filled holes connect at least two electrically conductive layers; these filled holes are called vias. Similarly, optical interconnects can be formed through the various layers of the stack to receive electro-optical circuit boards (EOCBs). In addition to being able to embed one or more components into a printed circuit board, a printed circuit board is typically configured to house one or more components on one or both opposite surfaces of the board-shaped printed circuit board. The one or more components can be soldered to their respective main surfaces. The dielectric portions of the PCB may include resin with reinforcing fibers (e.g., glass fiber).

[0073] In the context of this application, the term "substrate" can specifically refer to a smaller component carrier. Relative to a PCB, a substrate can be a relatively small component carrier on which one or more components can be mounted, and can serve as a connection medium between one or more chips and another PCB. For example, a substrate can have approximately the same size as the components (particularly electronic components) to be mounted on the substrate (e.g., in the case of chip-scale packages (CSPs)). More specifically, a substrate can be understood as a carrier for electrical connections or electrical networks and a component carrier with a comparable but much higher density of lateral and / or vertically arranged connections to a printed circuit board (PCB). Lateral connections are, for example, conductive paths, while vertical connections can be, for example, drilled holes. These lateral and / or vertical connections are arranged within the substrate and can be used to provide electrical, thermal, and / or mechanical connections between the housed or unhoused components (such as bare wafers)—particularly IC chips—and the printed circuit board or intermediate printed circuit board. Therefore, the term "substrate" also includes "IC substrate." The dielectric portion of the substrate can include a resin with reinforcing particles (e.g., reinforcing spheres, particularly glass spheres).

[0074] The substrate or interlayer may include or consist of at least one layer of glass, silicon (Si), and / or photo-imageable or dry-etchable organic material such as epoxy-based laminated material (e.g., epoxy-based laminated film), or polymeric composite (which may or may not include photosensitive and / or thermosensitive molecules) such as polyimide or polybenzoxazole.

[0075] In embodiments, at least one electrically insulating layer structure comprises at least one of the following: resins or polymers, such as epoxy resins, cyanate ester resins, benzocyclobutene resins, bismaleimide-triazine resins, polystyrene derivatives (e.g., based on polyphenylene ether, PPE), polyimide (PI), polyamide (PA), liquid crystal polymers (LCP), polytetrafluoroethylene (PTFE), and / or combinations thereof. Reinforcing structures, such as meshes, fibers, spheres, or other types of filler particles, made of glass (multilayer glass), may also be used to form the composite. The semi-cured resin combined with the reinforcing agent, such as fibers impregnated with the aforementioned resins, is called a prepreg. These prepregs are typically named according to their properties, such as FR4 or FR5, which describe their flame-retardant properties. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based laminates (e.g., laminated films) or photoemissive dielectric materials, may also be used. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and / or cyanate ester resins may be preferred. In addition to these polymers, low-temperature co-fired ceramics (LTCC) or other low, very low or ultra-low DK materials can be applied as electrical insulation layer structures in component carriers.

[0076] In embodiments, at least one electrically conductive layer structure comprises at least one of copper, aluminum, nickel, silver, gold, palladium, tungsten, and magnesium. Although copper is generally preferred, other materials or other types of coatings thereof, particularly coatings with superconducting materials or conductive polymers, such as graphene or poly(3,4-ethylenedioxythiophene) (PEDOT), are also possible.

[0077] At least one component may be selected from: non-conductive inlays, conductive inlays (e.g., metallic inlays, preferably including copper or aluminum), heat transfer units (e.g., heat pipes), light guiding elements (e.g., optical waveguides or optical conductor connectors), electronic components, or combinations thereof. The inlay may be, for example, a metal block (IMS-inlay) with or without an insulating material coating, and may be embedded or surface-mounted to facilitate heat dissipation. Suitable materials are defined by their thermal conductivity, which should be at least 2 W / mK. Such materials are typically based on, but not limited to, metals, metal oxides, and / or ceramics, such as copper, alumina (Al₂O₃), or aluminum nitride (AlN). Other geometries with increased surface area are also frequently used to increase heat exchange capacity. In addition, components can be active electronic components (implementing at least one pn junction), passive electronic components (such as resistors, inductors, or capacitors), electronic chips, storage devices (such as DRAM or other data memories), filters, integrated circuits (such as field-programmable gate arrays (FPGAs), programmable array logic (PALs), general-purpose array logic (GALs), and complex programmable logic devices (CPLDs)), signal processing components, power management components (such as field-effect transistors (FETs), metal-oxide-semiconductor field-effect transistors (MOSFETs), complementary metal-oxide-semiconductor (CMOS) transistors, junction field-effect transistors (JFETs), or insulators. Gate field-effect transistors (IGFETs), and all the aforementioned power management components are based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs), and / or any other suitable inorganic compound; optoelectronic interface elements; light-emitting diodes; optocouplers; voltage converters (e.g., DC / DC converters or AC / DC converters); cryptographic components; transmitters and / or receivers; electromechanical transducers; sensors; actuators; microelectromechanical systems (MEMS); microprocessors; capacitors; resistors; inductors; batteries; switches; cameras; antennas; logic chips; and energy harvesting units. However, other components can also be embedded in component carriers. For example, magnetic elements can be used as components. Such magnetic elements can be permanent magnetic elements (e.g., ferromagnetic elements, antiferromagnetic elements, multiferroic elements, or ferrimagnetic elements, such as ferrite cores) or paramagnetic elements. However, the component can also be an IC substrate, an interposer, or other component carriers, such as those in a board-in-board configuration. The component can be surface-mounted on a component carrier and / or embedded within the component carrier. Furthermore, other components can be used as components, particularly those that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagating from the environment.

[0078] In one embodiment, the component carrier is a laminated component carrier. In this embodiment, the component carrier is a multilayer composite structure that is stacked and connected together by applying pressure and / or heat.

[0079] After the internal layer structure of the component carrier is processed, one or more additional electrically insulating and / or electrically conductive layer structures can be used to symmetrically or asymmetrically cover one or both opposing main surfaces of the processed layer structure (particularly by lamination). In other words, layers can be continuously stacked until the desired number of layers is obtained.

[0080] After the stacked structure of the electrical insulation layer and the electrical conductivity layer is formed, the surface of the obtained layer structure or component carrier can be treated.

[0081] Specifically, in terms of surface treatment, an electrically insulating solder resist can be applied to one or both opposing main surfaces of the laminate or component carrier. For example, the solder resist can be formed over the entire main surface and the layer of solder resist can then be patterned to expose one or more electrically conductive surface portions, which will be used to electrically couple the component carrier to electronic peripherals. The solder resist-covered surface portions of the component carrier, particularly those containing copper, can be effectively protected from oxidation or corrosion.

[0082] In terms of surface treatment, the surface treatment can be selectively applied to the exposed electrically conductive surface portions of the component carrier. This surface treatment can be an electrically conductive covering material on the exposed electrically conductive layer structure (e.g., pads, conductive traces, etc., particularly including or made of copper) on the surface of the component carrier. If this exposed electrically conductive layer structure is not protected, the exposed electrically conductive component carrier material (especially copper) will oxidize, making the component carrier less reliable.

[0083] The surface-treated section can be formed as a joint between, for example, a surface-mount component and a component carrier. The surface-treated section functions to protect exposed conductive layer structures (especially copper circuits), and the surface-treated section can be joined to one or more components, for example, by soldering. Examples of suitable materials for the surface-treated section are organic solderable corrosion inhibitors (OSP), non-electro-optical nickel immersion gold (ENIG), non-electro-optical nickel immersion palladium immersion gold (ENIPIG), gold (especially hard gold), electroless tin, nickel-gold, nickel-palladium, etc.

[0084] The aspects defined above and other aspects of the invention will be apparent from the examples of embodiments described below, and will be illustrated with reference to these examples of embodiments. Attached Figure Description

[0085] Figure 1 A cross-sectional view of a component carrier according to an exemplary embodiment of the present invention is shown.

[0086] Figure 2 A cross-sectional view of a component carrier according to another exemplary embodiment of the present invention is shown.

[0087] Figure 3 A cross-sectional view of a component carrier according to another exemplary embodiment of the present invention is shown.

[0088] Figure 4 A plan view of a prefabricated component carrier according to another exemplary embodiment of the present invention is shown.

[0089] Figure 5 It shows Figure 4 A cross-sectional view of the precast component.

[0090] Figure 6 A cross-sectional view of a prefabricated component carrier according to another exemplary embodiment of the present invention is shown.

[0091] Figures 7 to 11 A cross-sectional view of the structure obtained during the manufacture of the component carrier according to an exemplary embodiment of the present invention is shown.

[0092] Figure 12 A cross-sectional view of a component carrier according to another exemplary embodiment of the present invention is shown.

[0093] Figures 13 to 19 A cross-sectional view of the structure obtained during the fabrication of a cluster according to an exemplary embodiment of the present invention is shown.

[0094] Figure 20 and Figure 21 A plan view of a cluster according to an exemplary embodiment of the present invention is shown.

[0095] Figure 22 A plan view of a prefabricated component carrier according to another exemplary embodiment of the present invention is shown.

[0096] Figure 23 A plan view of a storage device for storing and processing clusters according to an exemplary embodiment of the present invention is shown.

[0097] Figure 24 A plan view of a storage device for storing and processing clusters according to another exemplary embodiment of the present invention is shown.

[0098] Figures 25 to 29 A plan view of the structure obtained during the manufacture of a cluster for a component carrier according to an exemplary embodiment of the present invention is shown.

[0099] Figure 30 Phase diagrams and timing diagrams are shown in relation to a method of manufacturing clusters according to an exemplary embodiment of the present invention.

[0100] Figure 31 A cross-sectional view of a component carrier according to an exemplary embodiment of the present invention is shown.

[0101] The illustrations in the accompanying drawings are schematic. Similar or identical elements are given the same reference numerals in different drawings. Detailed Implementation

[0102] Before describing exemplary embodiments in more detail with reference to the accompanying drawings, some basic considerations on which exemplary embodiments of the present invention were developed will be summarized.

[0103] Component embedding into a component carrier is typically addressed during the construction of the component carrier (e.g., a substrate). For example, a component carrier can be used to support complex semiconductor components to be used in, for example, a computing module. It may be desirable to embed multiple components to increase the functionality provided by the component carrier and improve the overall performance of the module.

[0104] Conventional approaches to embedding components into substrates encounter limitations imposed by the component's typology, size, and structural characteristics, as well as limitations related to supply chain availability (e.g., providing components with the same dimensions and height).

[0105] The need to further integrate components into substrates is growing. These new directions have led to the research and development of processes for integrating multiple components into the same recessed space (with limitations in the horizontal plane). Due to the nature of embedding or lamination processes, embedding multiple components of different heights into the same core recess becomes quite difficult, and sometimes even impossible. A key requirement is that the thickness of the substrate core used for construction is the same as the thickness of the components to be embedded. Embedding becomes even more difficult when components have different heights. The greater the height difference between components, the less likely it is to achieve successful coexistence embedding, even if the components are placed in different cavities of the stack, for example, when the design does not intend for a portion of the cavity volume to be left unfilled by the resin portion.

[0106] According to embodiments of the invention, a cluster is provided, configured as a single body for insertion and fixation into a recess in a component carrier (e.g., a PCB or IC substrate). Advantageously, the cluster can be formed with any desired number of components (i.e., one or more) fixed within an uncured solid resin portion of the cluster to simplify subsequent processing. The cluster can be conveniently formed by inserting the one or more components into an uncured flowable (e.g., liquid or viscous) resin portion. The uncured flowable (e.g., liquid or viscous) resin portion can be transformed into a hardened state that is still at least partially uncured, such that the components are fixed in place within the solid resin portion, which remains curable. The cluster can then be picked up and placed into a recess (e.g., a cavity) in the component carrier. Subsequently, the resin portion of the cluster can be cured, for example, by pressure and / or heat and / or UV (ultraviolet) light, which can trigger processes such as polymerization and / or crosslinking. Thus, the resin portion of the previously solid, uncured cluster can become flowable, can be fully cured, and can thereby be transformed into a permanent solid state. This allows the component to be glued into place within the recess of the component carrier.

[0107] Specifically, the cluster resin portion (i.e., the resin portion of the cluster) can be connected to another resin portion (e.g., a sheet resin portion, i.e., the resin portion of an initially at least partially uncured sheet), which is provided separately from the cluster into the recess. Alternatively, the other resin portion can be provided simultaneously with the cluster into the recess. When both the cluster resin portion and the other resin portion cure and interact in the recess, a shaped or irregular boundary surface can be formed between the cluster resin portion and the other resin portion. Alternatively, a regular boundary surface, such as a flat surface, can be formed in a partial region between the cluster resin portion and the other (or sheet-like) resin portion. Embedding one or more components into the uncured solid resin portion of the cluster provides a semi-finished product for the component carrier manufacturing process, enabling the embedding process to be performed in a simple manner by treating the cluster as a single piece during embedding. In addition to manufacturing simplicity, this manufacturing architecture ensures a reliable mechanical connection between the stacked components and the parts.

[0108] In a preferred embodiment, a cluster of one or more components with uncured solid resin portions embedded is created in a manner compatible with processes for embedding components into a stack (e.g., comprising one or more printed circuit board cores). Specifically, such a cluster may comprise resin interconnect components of varying heights and / or similar, particularly identical, heights, and may be embedded as a single unit into a recess in the component carrier stack. Such a cluster may be shaped and sized to fit into a recess having a normalized height defined by the resin portions. Therefore, a smaller volume of additional resin portions may be sufficient to fill the remainder of the recess (e.g., cavity). This allows for advantageously seamless immersion embedding of one or more components into the substrate with very low assembly stress. Furthermore, such a manufacturing architecture allows for the simultaneous complete immersion embedding of multiple components and can replace multiple pick-and-place steps with a single placement step in the substrate. Additionally, the described concept simplifies the use of additional resin portions (i.e., prepreg) to fill the normalized empty spaces in the recesses of the stack. In view of the above, the exemplary embodiments can provide a significant improvement in productivity and yield, and can enable the manufacture of component carrier architectures that would otherwise be considered too difficult to produce. Other disadvantages of conventional substrate manufacturing, such as alignment problems and sub-component problems, can be overcome through the exemplary embodiments.

[0109] One embodiment provides a configuration for placing clusters of components into recesses in a substrate, where the cluster of components acts as a single body instead of multiple individual components. Electrical interconnections belonging to the cluster can be provided using laser vias and / or other methods, such as using sintered paste or by diffusion bonding. The possibility of embedding multiple components of different types into recesses of component carriers represents a powerful opportunity to address major functional deficiencies in the semiconductor and systems field. Implementing methods capable of overcoming many current drawbacks regarding embedding could allow for the seamless embedding of different types of components from different sources and of different physical dimensions into organic substrates.

[0110] In particular, exemplary embodiments of the present invention enable the embedding of active devices with other types of components, such as different kinds of capacitors, resistors, or inductors, which have very specific thicknesses and considerably greater variations in their dimensional values ​​and wide tolerances compared to bare semiconductor devices.

[0111] According to exemplary embodiments, embedding components into a substrate can be performed within design and / or construction rules that provide recesses for each component. Clusters of components with interconnecting resin portions can be adapted to any integration condition. The creation and assembly of these clusters can allow active and passive components to be assembled together because it allows components with very different sizes to be placed together. One conventional drawback that exemplary embodiments of the invention can overcome is component tilting, a limitation in the present art. Components that were previously placed in the same recess may deviate from their initial position and / or orientation during pressing or lamination steps, and this deviation and / or orientation can have a significant impact on device performance or even lead to irreversible failures due to the nature of the embedding process.

[0112] In short, the manufacturing process according to the exemplary embodiment can be as follows: First, one or more components can be embedded in a liquid resin portion to form a preform of a cluster. Thereafter, the cluster is solidified, but the resin portion is not completely cured (thus remaining at least partially uncured). The solidified cluster can then be inserted as a single piece into a cavity of a component carrier stack. Through lamination, the resin portion of the cluster can be fully cured, causing one or more components to be fixed in place within a recess of the stack.

[0113] Furthermore, creating clusters according to exemplary embodiments of the present invention enables the implementation of various component and density factors, such as the number of cavities per package and the number of components in each recess (e.g., cavity), without cumulatively increasing the level of embedding process challenges.

[0114] In particular, exemplary embodiments of the present invention provide the possibility of embedding clusters of components into the core structure of a component carrier, regardless of the thickness of the components. Furthermore, exemplary embodiments can reduce or even minimize the process cycle of the component carrier panel manufacturing process, thereby reducing the number of components to be placed in the cavity, for example, replacing multiple components with a single component. In addition, exemplary embodiments can employ process flows compatible with the correct positioning of different components, significantly reducing the risk of component misalignment. Furthermore, exemplary embodiments provide opportunities to manage the supply chain for these embedded components, thereby reducing time through the production line. Advantageously, the manufacturing architecture according to exemplary embodiments can be compatible with existing components for embedding processes in the core of the component carrier. Advantageously, component clusters can be pre-formed outside of the panel process. Clusters according to exemplary embodiments can be freely designed; for example, these clusters can have different sizes and different components, but from the perspective of the substrate process, each cluster may only involve a single placement in the recess. Additionally, the same process can be applied to clusters of different sizes that carry customized component groups, limited groups of components to be embedded, and scenarios where different components (or components of different sizes) that need to be embedded in a substrate in a specific configuration are compatible with other components.

[0115] In short, exemplary embodiments construct clusters of components such that the clusters of components can be placed as a single body into a component carrier recess (e.g., a substrate cavity), rather than placing multiple individual components. Interconnections of the components belonging to the cluster can be formed using laser via technology. Forming a cluster having at least one component at least partially surrounded by a resin portion can be achieved, for example, by immersing at least one component in an uncured, flowable resin portion and subsequently curing that resin portion. In this context, a molding process can also be performed, wherein it should be noted that the resin portion is not fully cured at the end of the cluster formation process, but remains at least partially uncured in a solid state.

[0116] Figure 1 A cross-sectional view of a component carrier 104 according to an exemplary embodiment of the present invention is illustrated. In the illustrated embodiment, the component carrier 104 is embodied as a printed circuit board (PCB). However, the component carrier 104 may also be an integrated circuit (IC) substrate, etc.

[0117] according to Figure 1 The component carrier 104 includes a laminated stack 110, which includes a plurality of electrically conductive layer structures 112 and a plurality of electrically insulating layer structures 114, see detail 150.

[0118] Detail 150 illustrates the stack of layers and vias 110 in a stacked construction. However, one or more clusters 100 may also be used (see, for example, see...). Figures 4 to 6It is embedded in one or more cores. In particular, the stack 110 is configured to have cores in a stack. In addition, the cluster 100 can be disposed in a stacked layer.

[0119] The conductive layer structure 112 may include a patterned copper layer, which may form horizontal pads and / or horizontal wiring structures. Additionally, the conductive layer structure 112 may include vertical through-connectors, such as copper pillars and / or copper-filled laser vias. Alternatively or additionally, mechanically plated through-holes (PTHs) may also be used as vertical through-connectors. Furthermore, the stack 110 of the component carrier 104 may include one or more electrically insulating layer structures 114 (e.g., one or more prepreg sheets, resin sheets, or cores made of FR4). Ajinomoto deposited film® (ABF) material may also be used for at least a portion of the electrically insulating layer structure 114, particularly when the component carrier 104 is embodied as an IC substrate. Surface treatments (e.g., ENIG or ENEPIG, solder resist, etc.) may also be optionally applied to the top and / or bottom sides of the stack 110 (not shown).

[0120] For example Figure 1 As shown, a recess 116 is formed in the stack 110. For example, the recess 116 can be a cavity. Here, it is embodied as an electronic component 102 of a semiconductor wafer being embedded in the recess 116. However, the electronic component 102 can also be a passive component, such as a capacitor component. Furthermore, the electronic component 102 can be replaced or supplemented by non-electronic components, such as a copper or ceramic block for heat dissipation purposes.

[0121] In the gaps between the sidewall 152 of the recess 116 in the electronic component 102 and the bottom wall of the recess 116 in the stack 110, the recess 116 is partially filled by the resin portion 106 and partially by another resin portion 108. As shown, the resin portion 106 completely encapsulates the electronic component 102 and helps to secure the electronic component 102 in place within the recess 116. Furthermore, the resin portion 106 is also secured to the stack 110 by another resin portion 108 disposed on the upper portion of the recess 116 and on the top of the stack 110.

[0122] As also shown in the figure, the interface between resin portion 106 and the other resin portion 108 extends along an irregular boundary surface 118. The irregular boundary surface 118 is a three-dimensionally curved and recessed surface formed between the sidewall 152 of the stack 110 defining the recess 116 and the sidewall 154 of the electronic component 102. As shown, the gap between the opposing sidewalls 152, 154 of the component 102 and the stack 110 in the recess 116 is partially filled with resin portion 106 and partially with the other resin portion 108. Similarly from... Figure 1 As can be seen, the electronic component 102 can be exposed beyond the resin portion 106 at the bottom side. This ensures that one or more metal pads 156 of the electronic component 102 can be electrically connected to the metal pads 158 of the electrically conductive layer structure 112 of the stack 110. Additionally or alternatively, the metal pads 156 of the electronic component 102 can be located on the opposite side of the component 102 (i.e., on the top side) and can be connected to the electrically conductive layer structure 112, for example, via laser vias.

[0123] Optionally, resin portion 106 and the other resin portion 108 can be made of the same material or different materials. Using the same resin portions 106 and 108 ensures a homogeneous surrounding of the embedded electronic component 102. Using different resin portions 106 and 108 allows for individual fine-tuning of the resin properties in different regions surrounding the embedded electronic component 102. Figure 1 As shown in details 160 and 162, resin portion 106 and the other resin portion 108 may include filler particles 120 and 121, which may be different or the same. Through the filler particles 120 and 121, additional functions, such as enhanced thermal conductivity or electromagnetic shielding, can be added to the respective resin portion 106 or 108.

[0124] Depending on the material properties of resin parts 106 and 108 and the process conditions during manufacturing, different configurations of the irregular boundary surface 118 are feasible: In one configuration, the mixed resin portion 106 and the additional resin portion 108 may be present at the irregular boundary surface 118. Descriptively, a mixture of the mixed resin portion 106 and the additional resin portion 108 may be present at the irregular boundary surface 118. On one side of the mixing region, a pure resin portion 106 with filler particles 120 may be present, while on the opposite side of the mixing region, an additional resin portion 108 with filler particles 121 may be present. Such a mixing region can lead to a smooth transition between the properties of the resin portion 106 and the additional resin portion 108, and thus can suppress heat load, for example, in cases where the coefficient of thermal expansion (CTE) of the resin portion 106 and the additional resin portion 108 are different.

[0125] In another configuration, the irregular boundary surface 118 has chemical bonds between resin portion 106 and other resin portions 108. Therefore, resin portions 106 and 108 can be configured to form chemical bonds between resin portions 106 and 108, such as covalent and / or ionic bonds. For example, resin portions 106 and 108 can be configured to form chemical bonds between resin portions 106 and 108 during curing. Additionally or alternatively, the irregular boundary surface 118 can have physical bonds between resin portions 106 and other resin portions 108, formed by, for example, van der Waals forces and / or hydrogen bonds. This can enhance the overall mechanical integrity of the component carrier 104.

[0126] In another configuration, the irregular boundary surface 118 has cross-linking portions between resin portion 106 and another resin portion 108. During polymerization, resin portions 106, 108 may form interconnections at their carbon chains. In one example, the cross-linking portions may include one or more of ester functional groups, ether functional groups, amine functional groups, amide functional groups, sulfide functional groups, and thioester functional groups. This cross-linking between resin portions 106, 108 can suppress delamination and other undesirable artifacts. Furthermore, cross-linking between resin portion 106 and / or another resin portion 108 and the electrically insulating layer structure 114 of the stack 110 may occur or may be triggered.

[0127] Figure 1 The component carrier 104 can use a cluster 100 according to an exemplary embodiment (e.g., see...). Figures 4 to 6The cluster 100 is manufactured by means of a component 102 partially surrounded by solid, uncured resin portions 106. Such a cluster 100 can be inserted integrally into a recess 116 of a stack 110. Subsequently, an initial uncured resin sheet 126, including additional uncured resin portions 108, can be attached to the upper main surface of the stack 110 and the upper main surface of the cluster 100. The uncured resin portions 106, 108 can then be simultaneously cured by applying heat and / or pressure to obtain... Figure 1 The component carrier 104. The cavity or recess 106 may be defined by at least one vertical sidewall. Additionally or alternatively, the sidewall defining the cavity or recess 106 may be inclined.

[0128] Figure 2 A cross-sectional view of a component carrier 104 according to another exemplary embodiment of the present invention is shown.

[0129] according to Figure 2 Implementation methods and basis Figure 1 The difference in the implementation method is particularly that, according to Figure 2 Three components 102 are embedded in the same recess 116 and encapsulated within a resin portion 106. Also as shown, the three components 102 are partially secured in the recess 116 by the resin portion 106 and partially by another resin portion 108, wherein the resin portions 106 and 108 have the same continuous interface. This interface is defined by an irregular boundary surface 118 common to all three components 102. The irregular boundary surface 118 includes a recess located between the outermost lateral component 102 and the facing sidewalls 152, 154 of the stack 110, and a recess between the outermost lateral component 102 and the central component of the components 102. As shown, the three components 102 have different heights h1, h2, h3 and different widths w1, w2, w3. Alternatively, two of the three components 102 may have different heights h1, h2 or h1, h3 or h2, h3 and different widths w1, w2 or w1, w3 or w2, w3, or the three components 102 may have similar, in particular, the same height h1=h2=h3 and similar, in particular, the same width w1=w2=w3.

[0130] Advantageously, Figure 2 The component carrier 104 can be manufactured using a stack 110 having a single cavity recess 116 into which a cluster 100 according to another exemplary embodiment of the invention is inserted. (See reference...) Figure 1The curing of resin portions 106 and 108 can be initiated simultaneously. According to this embodiment, the single-body cluster 100 includes three components 102 partially surrounded by solid, uncured resin portions 106. This allows for the processing of a single cluster 100 having three different components 102 interconnected by curable solid resin portions 106, even though heterogeneous components 102 with different heights h1, h2, h3 and different widths w1, w2, w3 are arranged in the recess 116.

[0131] In the illustrated embodiment, the bottom of the cavity or recess 116 is flat. Alternatively, the bottom of the cavity or recess 116 may have a stepped portion. Such a stepped portion may vertically or obliquely connect two flat portions of the bottom of the recess 116 arranged at two different vertical levels. This can provide the advantage of easily and reliably accommodating multiple components 102 with different spatial positions. It is also possible that at least one of the components 102 has a stepped bottom. The stepped bottom of such a component 102 may correspond to the stepped bottom of the recess 116. This can also allow the corresponding component 102 to be assembled in the recess 116 with high spatial accuracy.

[0132] Figure 3 A cross-sectional view of a component carrier 104 according to another exemplary embodiment of the present invention is shown.

[0133] according to Figure 3 Implementation methods and basis Figure 1 The difference in the implementation method is particularly that, according to Figure 3 The irregular boundary surface 118 includes two meniscus, each meniscus located between a corresponding sidewall 152 of the recess 116 that defines the resin portion 106 and the other resin portion 108, and a corresponding sidewall 154 of the component 102. According to... Figure 3 The resin portion 106 covers the lower portion of the sidewall 154 of the component 102, while the resin portion 108 covers the upper portion of the sidewall 154 and the upper main surface of the component 102. Figure 3 In this process, component 102 partially contacts resin portion 106 and another resin portion 108 at the extension of the irregular boundary surface 118. More precisely, according to Figure 3 The irregular boundary surface 118 contacts the sidewall 154 of component 102 (see contact point 103).

[0134] Figure 3 The component carrier 104 can be similar to the one mentioned above. Figure 1The cluster 100 described is used for manufacturing. The type and amount of resin portion 106 may influence the design of the irregular boundary surface 118 compared to the type and amount of the additional resin portion 108. Furthermore, a portion of the top side of component 102 may be in direct contact with resin portion 106, while another portion of the top side of component 102 may be in direct contact with the additional resin portion 108. Further, the additional resin portion 108 may be in direct contact with a portion of the bottom side of the cavity or recess 116.

[0135] Figure 4 A plan view of a prefabricated component carrier 104 according to another exemplary embodiment of the present invention is shown. Figure 5 It shows Figure 4 A cross-sectional view of the precast component. More specifically, Figure 4 and Figure 5 Each illustration depicts a stack 110 having a cavity-shaped recess 116 into which a cluster 100 according to an exemplary embodiment of the invention has been inserted via a pick-and-place assembly. The recess 116 in the stack 110 is formed as a through-hole, allowing a temporary support 174 (e.g., adhesive tape) to be attached to the bottom main surface of the stack 110 prior to assembling the cluster 100 to seal the through-hole. Lateral clearance between the cluster 100 and the stack 110 is indicated by reference numeral 199.

[0136] The cluster 100 has been inserted and can subsequently be embedded into a recess 116 provided in a component carrier 104 being manufactured. The cluster 100 includes multiple components 102 with different heights h1, h2, h3 and different widths w1, w2, w3. An uncured solid resin portion 106, such as a B-stage epoxy resin, encapsulates the components 102 and holds them together within the cluster 100. Additionally or alternatively, the uncured solid resin portion 106 may include cyanate ester resins, benzocyclobutene resins, bismaleimide-triazine resins, polyphenylene derivatives (e.g., polyphenylene ether-based, PPE), polyimide (PI), polyamide (PA), liquid crystal polymers (LCP), polytetrafluoroethylene (PTFE), and / or combinations thereof. Thus, the cluster 100 can be processed as a single piece and provided with a solid resin portion 106 that can become flowable and subsequently cured into a permanent solid by the action of elevated temperature and / or pressure and / or UV radiation. The component 102 and the uncured solid resin portion 106 together form the outer surface of the cluster 100. More specifically, the uncured solid resin portion 106 forms the entire lateral sidewall of the cluster 100, while the upper and lower main surfaces of the cluster 100 are partially formed by the resin portion 106 and the component 102. As already mentioned, the uncured solid resin portion 106 is in an uncured reversibly hardened state, i.e., solid, allowing the cluster 100 to be treated as a single piece. The uncured solid resin portion 106 covers the sidewalls of the corresponding component 102 and a portion of the top wall. As shown, the cluster 100 has a cubic shape. Alternatively, the cluster 100 can have a circular shape, such as a cylindrical shape. Figure 4 and Figure 5 Cluster 100 comprises only the uncured solid resin portion 106 and the component 102, thus cluster 100 has a very simple construction. For example, component 102 may be an active component (e.g., manufactured using Si, SiC, GaN, GaAs, SiGe technology) and / or may be a passive component (e.g., a capacitor, inductor, or ohmic resistor).

[0137] therefore, Figure 4 and Figure 5 Clusters 100 of components 102 with varying heights are shown. These clusters 100 can be embedded as individual units, equivalent to fitting uncured resin portions 106 holding the components 102 together into recesses 116 at a normalized height. Advantageously, a smaller volume of prepreg resin is required (see...). Figures 1 to 3 Reference numeral 126 in the figure is used to fill the remaining portion of recess 116 that was not filled by component 102 and resin portion 106.

[0138] also, Figure 4 and Figure 5The smallest component 102 is shown to overlap in area with the largest component 102 behind it. However, the areas of the smallest left and right components 102 do not completely overlap with the area of ​​the largest component 102.

[0139] Figure 6 A cross-sectional view of a prefabricated component carrier 104 according to another exemplary embodiment of the present invention is shown.

[0140] according to Figure 6 Implementation methods and basis Figure 4 and Figure 5 The difference in the implementation method is particularly that, according to Figure 6 The stacked component 110 includes a plurality of cavity recesses 116, each recess being filled with a corresponding cluster 100. Figure 6 The different clusters 100 have different types. As shown in the figure, components 102 with different heights and widths are arranged in multiple cavities. In short, Figure 6 The different volumes to be filled into a single recess 116 were anticipated.

[0141] As shown, multiple cavities can be filled with mixed components 102, which are fixed in place by solid, uncured resin portions 106 located within the integral block forming the cluster 100.

[0142] Figures 7 to 11 A cross-sectional view of the structure obtained during the manufacture of component carrier 104 according to an exemplary embodiment of the present invention is shown.

[0143] refer to Figure 7 It shows that according to Figure 5 The arrangement structure of the stacked components 110, the clusters 100 inserted into the recesses 116, and the attached temporary support components 174. Figure 7A single recess 116 is shown having multiple components 102, which are secured within a monolithic block in the form of clusters 100 by uncured solid resin portions 106. Above this arrangement, a double layer is arranged comprising a metal foil 176 and partially uncured resin sheets 126 (which may be pure resin sheets or prepreg sheets). Clusters 100 are the source of resin portions 106, while resin sheets 126 are the source of additional resin portions 108. Thus, additional resin portions 108 are provided as part of the initial uncured sheet 126, which is attached to the upper main surface of the stack 110 and the upper main surface of the clusters 100 inserted into the recess 116. Resin sheets 126 may comprise B-stage resin, and component clusters 100 may comprise resin portions 106 in B-stage. Alternatively, the additional resin portion 126 may be in stage A (which may be a liquid stage) and / or may be applied via a printing process such as screen printing or 3D printing. As shown, heterogeneous components 102 may be included in the same cluster 100.

[0144] refer to Figure 8 , Figure 7 The double layers are attached to the arrangement structure by lamination, i.e., by applying pressure and / or heat. As a result, the uncured solid resin portion 106 is transformed into a flowable (liquid or viscous) state, such that the transformed resin portion 106 interacts with the stack 110 through the flow of the resin portion 106. Simultaneously, another resin portion 108 of the resin sheet 126 is transformed into a flowable (liquid or viscous) state, such that the transformed other resin portion 108 also interacts with the stack 110 through the flow of the other resin portion 108. For example, temperature and / or pressure can be applied to at least partially liquefy the resin portion 106 and the other resin portion 108, or to make the resin portion 106 and the other resin portion 108 flowable (particularly simultaneously). In particular, polymerization and / or crosslinking of the resin portion 106 and the other resin portion 108 can be initiated, thereby transforming both the resin portion 106 and the other resin portion 108 into a cured solid state. As a result, the gap in the recess 116 located between the component 102 and the stacked component 110 is filled by the cured resin portion 106 and the cured additional resin portion 108. Figure 8 As schematically shown, the additional resin portion 108 interacts with the resin portion 106 to form an interface between the resin portion 106 and the additional resin portion 108, the interface extending along an irregular boundary surface 118 (e.g., having recesses and / or menisci, or other three-dimensional curvatures, see, for example). Figures 1 to 3 , Figure 8(Not shown in the image). Through the described process, the resin portion 106 and the additional resin portion 108 are simultaneously cured, i.e., simultaneously cured by a common lamination process. The resin portions 106 and 108 are cured in the recess 116, thereby securing the component 102 of the previous cluster 100 in place.

[0145] The integral cluster 100 can be accessed via a tray (e.g., see...) Figure 24 ), belts and reels (e.g., see Figure 23 The feeder is supplied to the automated pick-and-place device by means of other methods. Within the applicable design rules, the resin portion 106 of the integral cluster 100 comprising one or more components 102 can be a major contributor to filling the recess 116, wherein the remaining portion of the resin content of the laminated prepreg can fill a small fraction (or even the smallest fraction) of the remaining volume space of the recess 116. During lamination, the thermosetting B-stage resin portion 106 can still flow, thereby at least partially filling the gap between the block cluster 100 and the walls of the stack 110 that define the recess 116. The more the volume of the recess 116 is filled by the resin portion 106 of the cluster 100, the less resin flow from additional resin portions 108 based on the prepreg is required to fill the remaining space of the recess 116. Alternatively, the resin portion 106 and / or the additional resin portion 108 may include gas-filled voids.

[0146] The filling level of the recess 116 may depend primarily on the properties of the resin portion 106 in the cluster 100. Preferably, it has a controlled height to achieve the required volume ratio between the dimensions of the component 102, the recess 116, and the volumes of the resin portions 106 and 108.

[0147] The concept of using a monolithic block in the form of a cluster 100 makes it possible to align the core thickness with the component thickness even when the core thickness needs to be substantially thicker than the thickness of the component 102 to be embedded.

[0148] refer to Figure 9 According to Figure 8 The structure was flipped upside down, and the temporary support 174 was removed.

[0149] refer to Figure 10 An additional double layer, including an additional metal foil 176 and an additional portion of uncured resin sheet 126, is arranged in... Figure 9 On top of the structure. Alternatively, other techniques can be applied. For example, the uncured resin portion 108 can be applied by a printing process, followed by a curing process, and then metal can be applied by a metal deposition process, such as plating or physical vapor deposition.

[0150] refer to Figure 11The additional double layers are joined to the stack 110, component 102, and cured resin portion 106 by lamination, i.e., by applying heat and / or pressure. Subsequently, access holes can be formed in the additional double layers, for example by laser drilling or mechanical drilling. A vertical through-connector 178 (e.g., a laser-cut via filled with copper) can be formed by subsequently filling the access holes with metal, for example by plating, to contact the metal pad of the embedded component 102 through the additional resin sheet 126.

[0151] Figure 12 A cross-sectional view of a component carrier 104 according to another exemplary embodiment of the present invention is shown. More specifically, Figure 12 It shows the basis Figure 6 Prefabricated components are manufactured by performing corresponding procedures. Figure 7 and Figure 8 The component carrier 100 is obtained through a process. Although not shown, the resulting structure can subsequently withstand according to... Figures 9 to 11 Further processing is required.

[0152] Figures 13 to 19 A cross-sectional view of the structure obtained during the manufacture of cluster 100 according to an exemplary embodiment of the invention is shown. Cluster 100 can be configured to be inserted into and subsequently embedded in a recess 116 provided in a preform of component carrier 104. The construction of cluster 100 comprising one or more components 102 can begin by defining the cluster size, which is defined by the type of components 102 included therein and the required positioning and function of the components 102 relative to the module.

[0153] refer to Figure 13 A base body 180 is provided. For example, the base body 180 may be a metal sheet or may be made of other materials (such as PCB cores).

[0154] refer to Figure 14 The receiving hole 182 can be formed in the base body 180.

[0155] When the cluster design is defined, a metal frame can be fabricated based on the base body 180 by forming holes 182 (e.g., having rectangular, circular, elliptical, regular, or irregular shapes), preferably with the holes distributed according to a specific pattern on the base body 180. This can be accomplished using various techniques; for controlled dimensions and tolerances, electro-etching is preferred, but other methods (e.g., milling, laser cutting, etching, routing, etc.) can also be used. After completion, the metal frame can be coated with, for example, a weakly adhesive or non-adhesive coating made of PTFE to enhance the separation of the finally fabricated cluster 100. This simplifies the removal of the epoxy resin component cluster 100.

[0156] In addition, it is now also referenced Figure 15 The adhesive sheet 184 can be attached (e.g., by lamination) to the bottom main surface of the base plate 180, thereby closing the receiving hole 182 to form a receiver 128 with a closed bottom.

[0157] refer to Figure 16 The support plate 186 can be attached to the bottom side of the adhesive sheet 184. For example, the support plate 186 can be a rigid plate, such as a metal sheet. The support plate 186 can support clamping by a clamping tool (not shown). Afterward, the component 102 can be placed in the receiver 128. The result of this process is shown in... Figure 17 middle.

[0158] refer to Figure 18 The resin portion 106 is dispensed into the receiver 128 (optionally using a vacuum chamber) to fill the space between the components 102 of the receiver 128 up to a predetermined height. Thus, the components 102 are encapsulated within the uncured, flowable resin portion 106. Therefore, by inserting the components 102 and the uncured, flowable resin portion 106 into the receiver 128 that defines a portion of the contour of the cluster 100—particularly the sidewalls—the components 102 are surrounded by the uncured, flowable resin portion 106. During this process, the components 102 are held in place by an adhesive sheet 184.

[0159] The distributed resin portion 106 can be partially cured into a pre-gelled B stage. In a preferred embodiment, the filling of the receiver 128 in the frame-like base body 180 is accomplished using the liquid thermosetting resin portion 106. More generally, this can be performed by screen printing, lamination, or other techniques.

[0160] The frame-like base body 180 can then be placed in an oven and kept at a specific temperature for a specific time and / or exposed to UV light but not to the gelation initiation point of the resin part 106, so that the polymerization cycle remains within the B phase of the polymer matrix.

[0161] refer to Figure 19 The upper portion allows for component cooling, and once at or below room temperature, the clusters 100 are extracted from the metal matrix of the frame-like base body 180 (see...). Figure 19 (The bottom part).

[0162] By transforming the uncured, flowable resin portion 106 into an uncured, reversibly hardened state, the component 102 can be fixed within the still partially cured solid resin portion 106. Transforming the uncured, flowable resin portion 106 into an uncured, reversibly hardened state can be accomplished by lowering the temperature.

[0163] The clusters 100 can then be placed in a medium (e.g., a storage device) suitable for subsequent assembly operations into the substrate panel. For this purpose, trays, belts, reels, or other techniques can be used. It may be advantageous to store these clusters 100 in a manner compatible with slowing the polymerization cycle of the resin section 106, such as by storing prepreg.

[0164] Since the integral block cluster 100 with component 102 is not firmly adhered to the metal frame (due to the PTFE coating), the cluster 100 can be easily extracted from the frame after gelation, and the thermosetting compound can prevent damage to component 102 during subsequent processing of the integral part, i.e., cluster 100.

[0165] The support plate 186 and adhesive sheet 184 can be removed before the individual clusters 100 are extracted from the receiver 128 of the base body 180.

[0166] Figure 20 and Figure 21 A plan view of a cluster 100 according to an exemplary embodiment of the present invention is shown. More precisely, Figure 20 It shows according to Figures 13 to 19 A top view of the manufactured cluster 100. Figure 21 A bottom view of the cluster 100 is shown. A metal pad 156 for electrical contact with the corresponding electronic component 102 is also illustrated.

[0167] Figure 22 A plan view of a prefabricated component carrier 104 according to another exemplary embodiment of the present invention is shown. Figure 22 Implementation methods and Figure 4 The difference in the implementation method is particularly that, according to Figure 22 A plurality of recesses 116 are formed in the stacked member 110, and a reference is inserted into each of the recesses 116. Figure 4 and Figure 5 The corresponding cluster 100 describes the properties.

[0168] Figure 23 A plan view of a storage device 188 for storing and processing cluster 100 according to an exemplary embodiment of the present invention is shown.

[0169] As shown, multiple clusters 100 can be transferred from the tape and reel type storage device 188 to the recess 116 of the stack 110, for example, to the substrate cavity.

[0170] Figure 24 A plan view of a storage device 188 for storing and processing cluster 100 according to another exemplary embodiment of the present invention is shown.

[0171] As shown in the figure, multiple clusters 100 can be transferred from the tray-type storage device 188 to the recess 116 of the stack 110, for example, to the substrate cavity.

[0172] Figures 25 to 29 A plan view of the structure obtained during the manufacture of a cluster 100 for a component carrier 104 according to an exemplary embodiment of the present invention is shown.

[0173] refer to Figure 25 The diagram shows multiple pre-manufactured clusters 100 of the aforementioned type, arranged in a matrix pattern. These can be manufactured as follows: refer to Figure 26 The diagram illustrates a base body 180 including multiple receiving holes 182. The base body 180 may be embodied as a cavitary metal frame for later receiving of the component 102 and the resin portion 106. The receiving holes 108 may be coated with a non-adhesive coating 190, such as a PTFE coating, with a thickness ranging from 40 µm to 60 µm. Advantageously, the non-adhesive coating 190 simplifies the removal of the cluster 100 from the base body 180 at the end of its manufacturing process.

[0174] refer to Figure 27 The bottom of each receiving hole 182 can be closed by an adhesive sheet 184 attached to the bottom side of the base body 180. For example, the adhesive sheet 184 can be an adhesive film laminated to the base body 180. The adhesive sheet 184 can be used to temporarily secure the component 102 after it has been inserted into the receiver 128.

[0175] refer to Figure 28 The component 102 is inserted into the receiver 128 and temporarily fixed to the adhesive sheet 184.

[0176] refer to Figure 29 The gaps in the cavity are filled with a flowable, uncured epoxy resin portion 106, which can then be cured without complete curing. Afterward, the manufactured cluster 100 can be removed from the receiver 128.

[0177] Figure 30 A phase diagram 200 and a timing diagram 210 are shown in relation to a method of manufacturing cluster 100 according to an exemplary embodiment of the present invention. The phase diagram 200 and the timing diagram 210 may be referred to as time-temperature-transition (TTT) diagrams.

[0178] Phase diagram 200 has an abscissa 202, along which time t (logarithmic time) is plotted. Temperature T is plotted along the ordinate 204 of phase diagram 200. Time series diagram 210 has an abscissa 212, along which time t is plotted. Temperature T is plotted along the ordinate 214 of time series diagram 210.

[0179] Phase diagram 200 illustrates different regions corresponding to different phases of the resin section, with lines between these regions indicating phase transitions. More precisely, reference numeral 220 indicates the ungelled glass phase, reference numeral 222 indicates the liquid phase, reference numeral 224 indicates the gelled glass phase, reference numeral 226 indicates the sol / gel rubber phase, and reference numeral 228 indicates the carbonized phase. The gel point or glass transition point is indicated by reference numeral 230. The gel curve is indicated by reference numeral 232, and the glass transition curve is indicated by reference numeral 234. Region 236 indicates a process window, such as a preferred operating range according to an exemplary embodiment.

[0180] based on Figure 30 The present invention will describe how exemplary embodiments of the present invention utilize the curing kinetics of thermosetting materials.

[0181] Thermosetting resins (particularly resin portion 106 and / or resin portion 108) can form a three-dimensional irreversible network during the transformation from liquid to solid. The dimensions of the resin portion can be fixed at the point where the liquid transforms into a gel, and continued curing typically transforms the rubbery gel into a glassy material. The resulting solid exhibits good mechanical properties at the Tg temperature (glass transition temperature), where the glass transition is a gradual and reversible transformation in amorphous materials (or amorphous regions within semi-crystalline materials) from a hard and relatively brittle glassy state to a viscous or rubbery state with increasing temperature. Thermosetting materials can undergo three distinct stages during their curing. In particular, fully uncured thermosetting materials (when the thermosetting material is soluble and fusible) are in the so-called A stage, which can also be in liquid form. When the thermosetting material is cured, for example by heat, as a result, the monomers of the thermosetting material can polymerize and / or crosslink into oligomers, and then into polymers (the viscosity of the thermosetting material increases, possibly after an initial decrease in viscosity). Thermosetting materials that solidify below their gel point (when they are almost insoluble, usually vitrified but still thermoplastic) are in what is known as stage B.

[0182] Fully cured thermosetting materials (when the thermosetting material is insoluble and no longer thermoplastic) are in the so-called C stage.

[0183] In embodiments of the present invention, the curing of the thermosetting material (i.e., the resin portion 106 for embedding the component 102 into the cluster 100 to form an integral structure) can be stopped at stage B before the thermosetting material reaches its gel point or region.

[0184] In this way, the embedded material feels hard and quite rigid to the touch, allowing it to be handled through standard manufacturing operations. As a result, embedded structures with three-dimensional configurations (such as component 102) can be manufactured as monolithic structures with less labor (through some additional manufacturing steps), making the embedded structures suitable for mass production in high-volume embedded applications.

[0185] Phase diagram 200 illustrates an isothermal transformation diagram of an exemplary thermosetting material that can be used to implement a solution according to an embodiment of the invention. Referring to phase diagram 200, also known as a time-temperature-transition (TTT) diagram, the time t (arbitrary units on a logarithmic scale on the x-axis 202) required to achieve any transformation of the thermosetting material is plotted relative to its temperature T (arbitrary units on the y-axis 204). Therefore, each point in phase diagram 200 indicates the conditions under which the thermosetting material is held at the corresponding temperature for a corresponding time.

[0186] Phase diagram 200 includes: a gelation curve (see reference numeral 232), which identifies the point at which a thermosetting material becomes a gel (after a corresponding gelation time at the corresponding gel transition temperature); a glass transition curve (see reference numeral 234), which identifies the point at which a thermosetting material becomes glassy (after a corresponding glass transition time at the corresponding glass transition temperature); and a carbonization curve 238, which identifies the point at which a thermosetting material decomposes into powder and / or gas (after a corresponding carbonization time at the corresponding carbonization transition temperature).

[0187] The transitions to gel (i.e., gelation) and to powder (i.e., decomposition) are irreversible, while the transition to glass (i.e., vitrification) is reversible. The gelation curve (see figure 232) and the vitrification curve (see figure 234) intersect at a point (see figure 230), where gelation and vitrification coincide.

[0188] The portion of phase diagram 200 before reaching both the gelation curve and the glass transition curve defines a liquid region in which the thermosetting material is viscoelastic or liquid.

[0189] The portion of phase diagram 200 that is after reaching the gelation curve and before reaching the glass transition curve or carbonization curve defines a gel region in which the thermosetting material is a gelled rubber.

[0190] The portion of phase diagram 200 after reaching the glass transition curve defines a glass region in which the thermosetting material is glass. Specifically, the portion of phase diagram 200 after reaching the glass transition curve from the liquid region defines a non-gelled glass region in which the thermosetting material is non-gelled glass, while the portion of phase diagram 200 after reaching the glass transition curve from the gelled region defines a gelled glass region in which the thermosetting material is gelled glass.

[0191] The portion of phase diagram 200 after reaching the carbonization curve defines the carbonization region in which the thermosetting material decomposes into powder and / or gas.

[0192] Three critical glass transition temperatures can be identified on phase diagram 200, at which thermosetting materials become glass. Specifically, the uncured glass transition temperature Tg0 defines the highest temperature at which thermosetting materials (when fully uncured) always become glass (essentially above ambient temperature). Below Tg0, curing over time is essentially negligible, thus allowing thermosetting materials to be stored at temperatures far below this (e.g., 20°C to 50°C). The gel glass transition temperature Tggel defines the temperature at which gelation and glass transition coincide, as defined by point 230 in phase diagram 200. Between Tg0 and Tggel, thermosetting materials vitrify before gelation. The cured glass transition temperature Tg∞ defines the highest temperature at which thermosetting materials (when fully cured) become glass. Between Tggel and Tg∞, thermosetting materials gel before glass transition.

[0193] The timing diagram 210 (which may also be called a curing diagram) shows an example of a curing cycle that can be used to realize the curing cycle of the thermosetting material of cluster 100 according to an embodiment of the present invention, particularly a specially selected cycle according to an exemplary embodiment of the present invention.

[0194] Timing diagram 210 plots temperature T (arbitrary units on the ordinate 214) relative to time t (arbitrary units on the abscissa 212). The curing curve defines the curing process or cycle of the thermosetting material (part 106) by the change of its curing temperature with curing time.

[0195] Typically, the point in each curing process where a thermosetting material transforms into a gel and undergoes an irreversible transformation (defined by time and temperature) is called the gel point. From a molecular perspective, at the gel point, the first covalent bond is formed on the thermosetting material. The thermosetting material at the gel point has a constant degree of curing (defined by its chemical transformation), which is independent of temperature (e.g., on the order of approximately 50% to 80%), meaning that gelation is an isotransformation phenomenon.

[0196] On a macroscopic level, this involves a sudden increase in viscosity and the development of elastic properties, with the first appearance of an equilibrium, i.e., time-independent, shear modulus. If the chemical properties of the thermoset material are known, the gel point can be calculated, or it can be determined using dynamic mechanical rheological testing (DMRT) techniques at the point where the tangent to the mechanical damping (tanδ) temporarily becomes frequency-independent (e.g., by simultaneously performing dynamic oscillation measurements at different frequencies using a rheometer equipped with multiple wave modes).

[0197] Furthermore, the point (time and temperature) at which a thermosetting material transforms into glass and undergoes a reversible transition is called the glass transition point. From a molecular perspective, glass is an irregular amorphous solid. At the glass transition point, the degree of solidification of thermosetting materials experiences a significant decrease (e.g., 2-3 orders of magnitude) and falls below the chemical reaction rate (because the reaction becomes diffusion-controlled by the reactants).

[0198] On a macroscopic scale, thermoset materials suddenly increase in rigidity and become relatively brittle. The glass transition point can be determined using modulated temperature differential scanning calorimetry (MTDSC) at the point where the heat capacity exhibits a step increase.

[0199] Referring now to curing curve A, indicated by reference numeral 240, which illustrates a complete curing cycle of an exemplary thermosetting resin, during which the temperature is increased by heating the thermosetting material at a suitable thermal rate that provides regular and uniform curing of the thermosetting material until the thermosetting material is fully cured (Tcure).

[0200] Specifically, the thermosetting material is initially heated to a minimum temperature Tmin (e.g., 40°C to 60°C over 30 to 60 minutes) to achieve its minimum viscosity. The temperature is then maintained at this value (e.g., 20 to 40 minutes) to extend the period during which the thermosetting material has its minimum viscosity.

[0201] Next, the thermosetting material is reheated to its gel temperature Tgel (e.g., 100°C to 120°C over 10 to 20 minutes) to reach its gel point. During this stage, working at low atmospheric pressure before reaching the gel point can be useful to control degassing. The temperature can be kept constant at this value (e.g., 10 to 20 minutes) to reduce surface porosity. The thermosetting material is then reheated to its finish temperature Tcure (e.g., 150°C to 200°C over 30 to 60 minutes) and then maintained at this value (e.g., 60 to 120 minutes) to complete the curing of the thermosetting material. At this point, the thermosetting material is cooled to ambient temperature.

[0202] The curing cycle of the resin portion 106 used to create the cluster 100 will be described below. Such a cluster 100 can be an integral structure that can be placed in the recess of the stack 110 of the component carrier 104 to be manufactured.

[0203] In embodiments of the invention, the B-stage conditions of the resin material can function at two different stages and times. Specifically, the properties of the thermosetting material as it transforms back into a viscous fluid in the B-stage are adapted to the new shape (part carrier stack 110, in particular, the recess 116) while maintaining the integrity of the thermosetting material properties. Furthermore, the A-stage (i.e., liquid form) thermosetting material can substantially fill any spaces that may exist within the array of placed parts. This ability to fill recessed spaces and gaps prevents shear stress from being applied to the placed parts 102 held in place by the adhesive strength of the adhesive tape 184. Therefore, the thermosetting material does not transmit strain (shear) to the parts 102, which is beneficial for holding the thermosetting material and parts 102 in the intended position for subsequent final processes involving laser-connected vias.

[0204] Referring to the combination of curves in timing diagram 210, namely curve A and curve B (see reference numeral 242), the curing process for forming an integral component block (i.e., cluster 100) according to an exemplary embodiment will be described below. The curing of the thermosetting material (i.e., resin portion 106) according to curve B stops at a predetermined percentage of the activation energy required to reach its gel point. As mentioned above, gelation is an isotransformation phenomenon, therefore the gel time relative to the gel temperature can be used to measure its activation energy. For example, the curing of the thermosetting material can be stopped at a stopping temperature T. stop Stop at the point, stop temperature T stop Equal to, for example, gel temperature T gel 78% to 82% (more generally 68% to 92%), for example, at the stop temperature T stop Equal to gel temperature T gel 80%.

[0205] As a further improvement, as shown in the TTT diagram (i.e., phase diagram 200) and the curing cycle diagram (i.e., time sequence diagram 210), the stopping temperature T stop Equal to or below the glass transition temperature Tg gel At this temperature, gelation and glass transition coincide (hereinafter referred to as the gel-glass transition temperature Tg). gel For example, the stopping temperature T stop Equal to, for example, the gel-glass transition temperature Tg gel83% to 87% (more generally 73% to 97%), for example, the stopping temperature Tstop is equal to the gel-glass transition temperature Tg. gel 85%. In this way, the corresponding (with respect to time and temperature) identified process window 236 can be used to form an integral cluster 100 using the thermosetting resin portion 106 before reaching the gel point.

[0206] The above-mentioned stop temperature T stop The choice of thermosetting material that holds the components 102 together provides a suitable balance between compatibility with automated processing as a monolithic block and the opposite requirement that it can be embedded as individual clusters 100 in subsequent substrate manufacturing lamination cycles to accommodate recessed spaces.

[0207] In the implementation, as shown in the curing cycle diagram (i.e., sequence diagram 210), particularly in curve B, the thermosetting material progresses from T... stop Rapidly cool to storage temperature T storage (For example, within 5 to 10 minutes), where the curing of the thermosetting material is inhibited to obtain ungelled glass.

[0208] For example, storage temperature T storage The temperature range is 20°C to 50°C below the glass transition temperature Tg0, making the curing of thermosetting materials negligible over time, thus allowing them to be stored.

[0209] Then, cluster 100 is inserted into recess 116 of stack 110, and during lamination cycle, thermosetting resin portion 106 is reheated to temperature T. embed This is to allow the thermosetting resin portion 106 to return to a viscoelastic liquid state, but this time it may be constrained to accommodate the dimensions of the substrate recess. Molding temperature T embed Corresponding to the stopping temperature T stop For example, forming temperature T embed Equal to, for example, the stopping temperature T stop 95% to 110% (more generally 85% to 120%), for example, at molding temperature T. embed Equal to the stopping temperature T stop At 110% of the temperature, cluster 100 can be stopped during the construction temperature cycle. The curing process in the substrate lamination step then continues, but does reactivate the polymerization cycle of the bulk resin portion 106, which mixes with the substrate resin portion 108 to lock the component 102 in the monolithic cluster 100 within the stack 110, becoming a unit fully embedded in the substrate when the thermosetting material cures (once it reaches its gel point).

[0210] refer to Figure 31 It shows something similar to Figure 1The component carrier 104. However, with Figure 1 compared to, Figure 31 An irregular boundary surface 118 is shown, including a portion 118' protruding from a recess 116. Additionally, the irregular boundary surface 118 may include multiple portions 118' and / or continuous portions and / or arcuate portions protruding from the recess 116. In one example, the distance between a first portion 118' protruding from the irregular boundary surface 118 and the distance between a second portion 118' protruding from the (same) irregular boundary surface 118 may be different or the same. In another example, the portion 118' protruding from the irregular boundary surface 118 may include an irregular shape. Alternatively, the portion 118' protruding from the irregular boundary surface 118 may include a regular shape. In yet another example, the portion 118' protruding from the irregular boundary surface 118 may be positioned such that it extends outside the planar extension of component 102 in a direction perpendicular to the thickness direction of the stacked components. Alternatively, the portion 118' protruding from the irregular boundary surface 118 may be positioned such that it is included within the planar extension of component 102 in a direction perpendicular to the thickness direction of the stacked components. Due to the manufacturing method employed, the resin portion 106, and preferably the process parameters, can result in an irregular boundary surface 118 comprising a recessed portion, such as a plurality of recesses, between a sidewall defining the resin portion 106 and / or the other resin portion 108 and one of at least one component 102 and / or between adjacent components 102. Volume shrinkage of the resin portion 106 and / or the surface energy of the resin portion 106 may cause portions 118' to protrude from the recess 116, and this can therefore facilitate the manufacture of a component carrier 104 that provides reliable mechanical interaction between at least adjacent layers of the stack 110, particularly between the resin portion 106 and the other resin portion 108.

[0211] Preferably, the irregular boundary surface 118 can protrude from the recess 116 along the thickness direction of the stacked parts. In particular, the irregular boundary surface 118 can protrude from the recess 116 along both the thickness direction and the plane direction of the stacked parts. Additionally or alternatively, the irregular boundary surface 118 can protrude from the recess 116 in a direction other than the thickness direction and / or the plane direction of the stacked parts.

[0212] In a preferred embodiment, the irregular boundary surface 118 protruding from the recess 116 may overlap with the surface of at least one layer structure 112'', 114'' of the stack 110 that defines the recess 116, particularly the outermost electrically insulating layer structure 114' and / or the outermost electrically conductive layer structure 112' of the stack 110. In one example, the irregular boundary surface 118 protruding from the recess 116, particularly the recess, may overlap with the main surface 112'' and the lateral surface 112'' of the outermost electrically conductive layer structure 112''. Additionally, the irregular boundary surface 118 protruding from the recess 116 may overlap with the main surface 114'' and the lateral surface 114'' of the outermost electrically insulating layer structure 114''. In another example, the irregular boundary surface 118 protruding from the recess 116 may overlap with the main surface 114'' and lateral surface 114'' of the outermost electrically insulating layer structure 114' and the lateral surface 112'' of the outermost electrically conductive layer structure 112'. In yet another example, the main surface 112'' of the outermost electrically conductive layer structure 112' may be without the resin portion 106 and / or the irregular boundary surface 118 protruding from the recess 116.

[0213] It should be noted that the term "comprising" does not exclude other elements or steps, and the articles "a" or "an" do not exclude multiple. Elements described in combination with different embodiments may also be combined.

[0214] It should also be noted that the reference numerals in the claims should not be interpreted as limiting the scope of the claims.

[0215] The implementation of this invention is not limited to the preferred embodiments shown in the figures and described above. On the contrary, even in fundamentally different embodiments, it is possible to use the illustrated solutions and various variations according to the principles of the invention.

Claims

1. A cluster (100) configured to be inserted into and subsequently embedded in a recess (116) provided in a component carrier (104), the cluster (100) comprising: At least one component (102); as well as An uncured solid resin portion (106) encapsulates the component (102); The uncured solid resin portion (106) forms the outer surface of the cluster (100); or, at least one of the components (102) and the uncured solid resin portion (106) form the outer surface of the cluster (100).

2. The cluster (100) according to claim 1, wherein, The cluster (100) includes a plurality of the components (102) encapsulated in the resin portion (106) of an uncured solid.

3. The cluster (100) according to claim 2, wherein, Different components among the multiple components (102) have different heights (h1, h2, h3) and / or different widths (w1, w2, w3).

4. The cluster (100) according to any one of claims 1 to 3, wherein, The uncured solid resin portion (106) is in a reversible hardened state.

5. The cluster (100) according to any one of claims 1 to 4, wherein, The uncured solid resin portion (106) covers at least a portion of the sidewall (154) of at least one of the components (102) and / or at least a portion of the top wall of at least one of the components (102) and / or at least a portion of the bottom wall of at least one of the components (102).

6. The cluster (100) according to any one of claims 1 to 5, wherein the cluster (100) comprises at least one of the following features: The cluster (100) has a cubic or disc-shaped shape; The cluster (100) consists only of the uncured solid resin portion (106) and at least one of the components (102).

7. A method of manufacturing a cluster (100), the cluster being configured to be inserted into and subsequently embedded in a recess (116) provided in a component carrier (104), wherein, The method includes: Encapsulating at least one component (102) with an uncured, flowable resin portion (106); and Subsequently, the uncured, flowable resin portion (106) is transformed into an uncured, reversibly hardened state for fixing at least one of the components (102) in the resin portion (106).

8. The method according to claim 7, wherein, The method includes: transforming the uncured flowable resin portion (106) into the uncured reversible hardened state by lowering the temperature or by partially curing the uncured flowable resin portion (106).

9. The method according to claim 7 or 8, wherein, The method includes encapsulating at least one of the components (102) via the uncured, flowable resin portion (106) by inserting at least one of the components (102) and the uncured, flowable resin portion (106) into a receiver (128) that defines at least a portion of the outline of the cluster (100).

10. A component carrier (104), wherein, The component carrier (104) includes: The stack (110) includes at least one electrically conductive layer structure (112) and at least one electrically insulating layer structure (114). A recess (116) is formed in the stacked member (110); and At least one component (102) is embedded in the recess (116); The recess (116) is provided with a resin portion (106) for encapsulating at least one of the components (102), and the resin portion (106) is fixed to the stacked member (110) by another resin portion (108) provided in the recess (116). The interface between the resin portion (106) and the other resin portion (108) extends along the irregular boundary surface (118).

11. The component carrier (104) according to claim 10, wherein, At least one of the components (102) is exposed at a side portion beyond the resin portion (106) and the other resin portion (108), and in particular, the at least one component (102) is exposed at a bottom side portion beyond the resin portion (106) and the other resin portion (108).

12. The component carrier (104) according to claim 10 or 11, wherein, At least one of the components (102) partially contacts the other resin portion (108) at an extension of the irregular boundary surface (118).

13. The component carrier (104) according to any one of claims 10 to 12, wherein, The resin portion (106) and / or the additional resin portion (108) include filler particles (120, 121).

14. The component carrier (104) according to any one of claims 10 to 13, wherein, The irregular boundary surface (118) is a three-dimensional curved surface.

15. The component carrier (104) according to any one of claims 10 to 14, wherein, The irregular boundary surface (118) includes a recess located between a sidewall (152) of the recess (116) defining the resin portion (106) and / or the other resin portion (108) and at least one of the components (102), for example, the irregular boundary surface (118) includes a plurality of recesses located between a sidewall (152) of the recess (116) defining the resin portion (106) and / or the other resin portion (108) and at least one of the components (102); and / or, the irregular boundary surface (118) includes recesses located between adjacent components (102), for example, the irregular boundary surface (118) includes a plurality of recesses located between adjacent components (102).

16. The component carrier (104) according to any one of claims 10 to 15, wherein, The irregular boundary surface (118) includes a meniscus located between the sidewall (152) of the recess (116) that defines the resin portion (106) and / or the other resin portion (108) and one of the components (102), for example, the irregular boundary surface (118) includes a plurality of meniscus located between the sidewall (152) of the recess (116) that defines the resin portion (106) and / or the other resin portion (108) and one of the components (102); and / or, the irregular boundary surface (118) includes meniscus located between adjacent components, for example, the irregular boundary surface (118) includes a plurality of meniscus located between adjacent components.

17. The component carrier (104) according to any one of claims 10 to 16, wherein, The irregular boundary surface (118) includes a portion (118') protruding from the recess (116).

18. The component carrier (104) according to claim 17, wherein, The irregular boundary surface (118) protrudes from the recess (116) along the thickness direction of the stack, and in particular, the irregular boundary surface (118) protrudes from the recess (116) along the thickness direction of the stack and along the plane direction of the stack.

19. The component carrier (104) according to claim 17 or 18, wherein, The irregular boundary surface (118) protruding from the recess (116) overlaps with the surface of at least one layer structure (112'', 114'') of the stack (110) that defines the recess (116). In particular, the irregular boundary surface (118) protruding from the recess (116) overlaps with the outermost electrically insulating layer structure (114') and / or the outermost electrically conductive layer structure (112') of the stack (110).

20. The component carrier (104) according to any one of claims 10 to 19, wherein, The irregular boundary surface (118) includes a mixed resin portion (106) and a separate resin portion (108).

21. The component carrier (104) according to any one of claims 10 to 20, wherein, The irregular boundary surface (118) has chemical bonds between the resin portion (106) and the other resin portion (108).

22. The component carrier (104) according to any one of claims 10 to 21, wherein, The irregular boundary surface (118) has a cross-linking portion between the resin portion (106) and the other resin portion (108).

23. The component carrier (104) according to any one of claims 10 to 22, wherein, At least a portion of the recess (116) located between at least one of the components (102) and the stack (110) is partially filled by the resin portion (106) and partially filled by the additional resin portion (108).

24. The component carrier (104) according to any one of claims 10 to 23, wherein, At least two components (102) are embedded in the recess (116) encapsulated in the resin portion (106).

25. The component carrier (104) according to claim 24, wherein, At least two of the components (102) are fixed in the recess (116) partially through the resin portion (106) and partially through the additional resin portion (108), wherein the resin portion (106) and the additional resin portion (108) have a common continuous interface defined by the irregular boundary surface (118) for the at least two components (102).

26. The component carrier (104) according to claim 24 or 25, wherein, At least two of the components (102) have different heights (h1, h2, h3) and / or different widths (w1, w2, w3).

27. A method for manufacturing a component carrier (104), wherein, The method includes: A recess (116) is formed in the stack (110), the stack (110) including at least one electrically conductive layer structure (112) and at least one electrically insulating layer structure (114). Insert the cluster (100) according to any one of claims 1 to 6 into the recess (116); and Subsequently, the uncured solid resin portion (106) is transformed into a flowable state such that: the transformed resin portion (106) interacts with the stacked member (102) through the flowing resin portion (106); and Subsequently, the transformed resin portion (106) is further transformed into a cured solid.

28. The method according to claim 27, wherein, The method includes: filling a portion of the recess (116) between at least one of the components (102) and the stack (110) with the cured resin portion (106), and filling at least another portion of the gap with another resin portion (108).

29. The method according to claim 28, wherein the additional resin portion (108) interacts with the resin portion (106) to form an interface between the resin portion (106) and the additional resin portion (108), the interface extending along an irregular boundary surface (118).

30. The method according to any one of claims 27 to 29, wherein, The amount of the resin portion (106) is such that: the resulting irregular boundary surface (118) includes a recess located between a sidewall (152) of the recess (116) that defines the resin portion (106) and / or the other resin portion (108) and a component of at least one of the components (102), for example, the resulting irregular boundary surface (118) includes a plurality of recesses located between a sidewall (152) of the recess (116) that defines the resin portion (106) and / or the other resin portion (108) and a component of at least one of the components (102); and / or, the resulting irregular boundary surface (118) includes recesses located between adjacent components (102), for example, the resulting irregular boundary surface (118) includes a plurality of recesses located between adjacent components (102).

31. The method according to any one of claims 27 to 30, wherein, The amount of the resin portion (106) is such that the resulting irregular boundary surface (118) includes a portion (118') protruding from the recess (116).

32. The method according to claim 27 or 31, wherein, The method includes simultaneously curing the resin portion (106) and the additional resin portion (108).

33. The method according to any one of claims 27 to 32, wherein, The method includes curing the resin portion (106) and the additional resin portion (108) by applying mechanical pressure and / or heat.

34. The method according to any one of claims 27 to 33, wherein, The method includes: The additional resin portion (108) is configured as part of the initial uncured sheet (126) of the cluster (100) attached to the upper main surface of the stack (110) and inserted into the recess (116); and Subsequently, the additional resin portion (108) is cured; for example, the additional resin portion (108) and the resin portion (106) are cured simultaneously.

Images