Power module for a vehicle comprising embedded capacitors and electric machine drive device comprising the module

Abstract

A power module for a vehicle is provided. The power module includes a first circuit board including a first insulating layer and a first metal layer disposed on the first insulating layer, a lead frame including a plurality of direct current (DC) electrodes disposed on one side of the first circuit board, a first switching unit electrically connected to the plurality of DC electrodes and disposed on the first circuit board, and an embedded capacitor electrically connected between the plurality of DC electrodes. The embedded capacitor is disposed to overlap at least one of the first insulating layer or the first metal layer in a direction in which the first insulating layer and the first metal layer face each other.

Description

[0001] Cross-application of related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0185635, filed on December 13, 2024, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to a power module for a vehicle including an embedded capacitor, and a motor drive device including the power module. Background Technology

[0004] Environmentally friendly vehicles can include hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), electric vehicles (EVs), and fuel cell electric vehicles (FCEVs). The power module of an environmentally friendly vehicle receives direct current from a high-voltage battery, converts it to alternating current (AC), and supplies it to the motor. The motor's torque and speed are controlled by adjusting the magnitude and phase of the AC current. Summary of the Invention

[0005] The circuitry of a vehicle power module can act as a parasitic inductor, which can lead to instability in current and / or voltage (e.g., fluctuations, surges, or ringing).

[0006] One aspect of this disclosure is to provide a vehicle power module including an embedded capacitor, and a motor drive device including the power module, which is capable of (e.g., effectively) reducing the effects of parasitic inductance of the vehicle power module (e.g., voltage / current fluctuations, surges, or ringing due to power conversion switching) and improving the power conversion (e.g., efficiency) or reducing (e.g., the required) specifications (e.g., withstand voltage characteristics) of the vehicle power module (e.g., switching unit).

[0007] According to one aspect of the present invention, a power module for a vehicle includes a first circuit board, the first circuit board including a first insulating layer and a first metal layer disposed on the first insulating layer. The power module further includes a lead frame, a first switching unit, and an embedded capacitor. The lead frame includes a plurality of direct current (DC) electrodes disposed on one side of the first circuit board. The first switching unit is electrically connected to the plurality of DC electrodes and disposed on the first circuit board. The embedded capacitor is electrically connected between the plurality of DC electrodes. The embedded capacitor is configured to overlap at least one of the first insulating layer and the first metal layer in a direction where the first insulating layer and the first metal layer face each other.

[0008] The power module may also include a fusible portion connected between the embedded capacitor and the first metal layer. The fusible portion may include a conductive material with a melting point lower than that of the first metal layer.

[0009] An embedded capacitor may include a capacitor body, a plurality of capacitor electrodes disposed within the capacitor body, and a capacitor bonding wire connected to one of the plurality of capacitor electrodes. Another capacitor electrode may be electrically connected to a first metal layer, and the capacitor bonding wire may connect one of the plurality of capacitor electrodes to the first metal layer.

[0010] The power module may also include a package portion disposed on the first circuit board and encapsulating the first switching unit and an embedded capacitor.

[0011] The power module may further include a second circuit board, which includes a second insulating layer and a second metal layer disposed on the second insulating layer. An embedded capacitor may be disposed between the first circuit board and the second circuit board.

[0012] An embedded capacitor may include a capacitor body and a plurality of capacitor electrodes disposed in the capacitor body, wherein one of the plurality of capacitor electrodes may be electrically connected to a first metal layer and another of the plurality of electrodes may be electrically connected to a second metal layer.

[0013] The power module may also include a through-hole spacer disposed between the first circuit board and the second circuit board to electrically connect the first metal layer to the second metal layer.

[0014] The power module may also include a switching unit spacer disposed between the first switching unit and the second circuit board to electrically connect the first switching unit to the second metal layer.

[0015] The power module may also include a capacitor spacer disposed between the first and second circuit boards to overlap with an embedded capacitor in an orientation in which the first and second circuit boards face each other. Another of the plurality of capacitor electrodes is electrically connected to a second metal layer via the capacitor spacer.

[0016] An embedded capacitor may include a capacitor body and a plurality of capacitor electrodes disposed within the capacitor body. The plurality of capacitor electrodes may be electrically connected to a plurality of separate patterns in a first metal layer, and the embedded capacitor may be disposed in a bridging structure spanning the plurality of separate patterns.

[0017] A portion of the lead frame may be configured to overlap with at least one of the first insulating layer and the first metal layer in a direction in which the first insulating layer and the first metal layer face each other, and the embedded capacitor may be configured not to overlap with the lead frame in a direction in which the first insulating layer and the first metal film face each other.

[0018] The lead frame may also include a plurality of AC electrodes electrically connected to the first switching unit, and the plurality of DC electrodes may be arranged adjacent to each other, without a plurality of AC electrodes between the plurality of DC electrodes.

[0019] The power module may also include signal leads that are electrically connected to the first switching unit and disposed on the first circuit board.

[0020] Multiple DC electrodes can be electrically connected to external DC link capacitors and batteries of the power module for the vehicle, and multiple AC electrodes can be electrically connected to external motors of the power module for the vehicle.

[0021] The power module may further include a second switching unit disposed on the first circuit board and a third switching unit disposed on the first circuit board. The first switching unit includes a plurality of first semiconductor chips, the second switching unit includes a plurality of second semiconductor chips, and the third switching unit includes a third semiconductor chip.

[0022] The first switching unit can be located in the central part of the first circuit board, the second switching unit can be located outside the first switching unit on the first circuit board, and the third switching unit can be located outside the first switching unit on the first circuit board.

[0023] According to another aspect of the invention, a motor drive device includes a power module for a vehicle (e.g., as described above). A first switching unit includes a 1-1 switching element and a 1-2 switching element, and corresponds to a bridge arm of a first inverter; a second switching unit includes a 2-1 switching element and a 2-2 switching element, and corresponds to a bridge arm of a second inverter; one end of a third switching unit is connected between a first node between the 1-1 switching element and the 1-2 switching element and a second node between the 2-1 switching element and the 2-2 switching element, and constitutes part of a transfer switch. Attached Figure Description

[0024] The above and other aspects and features of this disclosure can be understood from the following detailed description taken in conjunction with the accompanying drawings.

[0025] Figure 1A This is a circuit diagram illustrating an embedded capacitor in a power module for a vehicle to cancel parasitic inductance according to an embodiment of the present disclosure.

[0026] Figure 1B This is a circuit diagram illustrating a power supply module for a vehicle and a motor drive device including the power supply module according to an embodiment of the present disclosure.

[0027] Figure 2 This is a plan view showing a power module for a vehicle according to an embodiment of the present disclosure.

[0028] Figure 3A , 3B 3C and 3D are side views illustrating a power module for a vehicle according to an embodiment of the present disclosure. Detailed Implementation

[0029] While this disclosure may be modified in various ways and may take various alternative forms, its specific implementation is shown in the accompanying drawings and described in detail below. However, this disclosure is not limited to the specific forms disclosed; rather, it covers modifications, equivalents, and alternatives that fall within the spirit and scope of this disclosure.

[0030] It is understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements are not limited by these terms. These terms are used to distinguish one element from another. For example, without departing from the scope of this disclosure, a first element may be referred to as a second element, and a second element may similarly be referred to as a first element. As used herein, the term “and / or” includes a combination of one or more of the related listed items.

[0031] The terminology used herein to describe embodiments of this disclosure is not intended to limit the scope of this disclosure. The articles “a” and “an” are in the singular form because they have a single referent, but their use herein should not preclude the existence of multiple referents. In other words, unless the context otherwise indicates, an element expressed in the singular form in this disclosure may be one or more. It is also understood that the terms “comprising,” “including,” “having,” and / or “containing,” as used herein, specify the presence of the stated features, numbers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, and / or groups thereof.

[0032] Unless otherwise provided, the terminology used herein, including technical and scientific terms, has the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains. Such terms, provided in commonly used dictionaries, should be interpreted as having the same meaning as in the context of the relevant art, and should not be construed as having, for example, ideal or excessive forms of meaning unless provided in this application.

[0033] In this specification, "vehicle" refers to any vehicle used to move objects (such as people, animals, or goods) from a starting point to a destination. These vehicles are not limited to those that travel on roads or tracks.

[0034] In the following description, embodiments of the present disclosure are illustrated with reference to the accompanying drawings.

[0035] refer to Figure 1A A power module for a vehicle according to embodiments of the present disclosure may include a first inverter 10, which can operate via multiple DC electrodes (e.g., Figure 2410, 420) are electrically connected to the DC link capacitor C-link and battery BAT external to the power module used in the vehicle, and can be connected via the AC electrode (e.g., Figure 2 (430) is electrically connected to motor 2 external to the power module used in the vehicle. See reference... Figure 1B According to the implementation (e.g., design), the power module for the vehicle may also include a second inverter 20 and a transfer switch 30.

[0036] Reference Figure 1A and Figure 1B The first inverter 10 may include a first switching unit 200, which may include three first switching units 200A, 200B, and 200C corresponding to the three phases, respectively. These three first switching units 200A, 200B, and 200C may each include three 1-1 switching elements 210A, 210B, and 210C and three 1-2 switching elements 220A, 220B, and 220C, and may correspond to one arm of the first inverter 10.

[0037] The second inverter 20 may include a second switching unit 300, which may include three second switching units 300A, 300B, and 300C corresponding to the three phases, respectively. These three second switching units 300A, 300B, and 300C may each include three 2-1 switching elements 310A, 310B, and 310C and three 2-2 switching elements 320A, 320B, and 320C, and may correspond to one arm of the second inverter 20.

[0038] The changeover switch 30 may include a third switching unit 700, which may include three third switching units 700A, 700B, and 700C corresponding to the three phases, respectively. One end of each of the third switching units 700A, 700B, and 700C is connected between a first node between the 1-1 switching elements 210A, 210B, and 210C and the 1-2 switching elements 220A, 220B, and 220C, and a second node between the 2-1 switching elements 310A, 310B, and 310C and the 2-2 switching elements 320A, 320B, and 320C, and may constitute part of the changeover switch 30.

[0039] When the direct current (DC) from the battery BAT in the electric vehicle is input to the motor drive device 1 for the vehicle, the motor drive device 1 can convert the input DC current into alternating current (AC) and output it to the motor 2 to operate the motor 2. The first inverter 10 and the second inverter 20 can convert the DC current into AC current.

[0040] The first inverter 10 can operate continuously (e.g., all the time), and the second inverter 20 can operate together with the first inverter 10 when the motor 2 requires higher output. Therefore, the motor drive unit 1 for the vehicle can improve overall efficiency over a wider output range of the motor 2. The transfer switch 30 can connect the first inverter 10 to the second inverter 20, and can be turned on (e.g., only) when the first inverter 10 is running to provide a Y-connection between each phase winding of the motor 2, and can be turned off (OFF) when the second inverter 20 is also running.

[0041] Reference Figure 2 The first switching unit 200 may include at least one of a plurality of first semiconductor chips 201, the second switching unit 300 may include at least one of a plurality of second semiconductor chips 301, and the third switching unit 700 may include a third semiconductor chip.

[0042] For example, the first switching unit 200 and the third switching unit 700 can be implemented as silicon carbide (SiC) chips, and the second switching unit 300 can be implemented as a silicon chip. The second switching unit 300 can be selectively turned off, thus it can be implemented as a (e.g., relatively) lower-performance silicon chip. Compared to the second switching unit 300, the first switching unit 200 and the third switching unit 700 can be used at (e.g., relatively) higher frequencies, thus they can be implemented as (e.g., relatively) higher-performance SiC chips. The semiconductor type of each of the above switching elements is an example according to this disclosure and is not limited thereto; various types of semiconductors can be applied.

[0043] The first switching unit 200 can be used more frequently than the second switching unit 300, and the number of switching elements in the first switching unit 200 can be greater than the number of switching elements in the third switching unit 700. Therefore, compared with the second switching unit 300 and the third switching unit 700, the first switching unit 200 can have a greater impact on the overall energy efficiency of the vehicle power module.

[0044] For example, the first switching unit 200 can be arranged in the central portion of the first circuit board 100, the second switching unit 300 can be arranged outside the first switching unit 200 in the first circuit board 100, and the third switching unit 700 can be arranged outside the first switching unit 200 in the first circuit board 100. Therefore, due to the simplification of the circuit between the lead frame 400 and the first switching unit 200, the electrical distance between the lead frame 400 and the first switching unit 200 can be shortened, and the parasitic impedance can also be reduced. The shortening of the electrical distance can refer to an improvement in energy efficiency, and the improvement in the energy efficiency of the first switching unit 200 can refer to an improvement in the overall energy efficiency of the vehicle power module. Furthermore, this structure can be used to minimize the insulation distance of the signal leads 500, and can also reduce the overall size of the vehicle power module.

[0045] For example, the 1-2 switching elements 220A, 220B, and 220C of the first switching unit 200 and the 2-2 switching elements 320A, 320B, and 320C of the second switching unit 300 can be configured to have the same potential difference. By arranging the 1-2 switching elements 220A, 220B, and 220C of the first switching unit 200 and the 2-2 switching elements 320A, 320B, and 320C of the second switching unit 300 adjacent to each other, the insulation distance beyond the (e.g., required) insulation distance of the signal lead 500 can be eliminated, thereby reducing the size of the first circuit board 100.

[0046] The third switching unit 700 may be arranged adjacent to the 2-1 switching elements 310A, 310B, and 310C of the second switching unit 300. The third switching unit 700 may be configured to have the same potential difference as the 2-1 switching elements 310A, 310B, and 310C of the second switching unit 300, and since the third switching unit 700 and the 2-1 switching elements 310A, 310B, and 310C are arranged adjacent to each other, the insulation distance beyond the (e.g., required) insulation distance of the signal lead 500 can be eliminated, thereby reducing the size of the first circuit board 100.

[0047] By arranging the signal lead 500 adjacent to the 1-2 switching elements 220A, 220B and 220C of the first switching unit 200, the insulation distance beyond the (e.g., required) insulation distance of the signal lead 500 can be eliminated, thereby reducing the size of the first circuit board 100.

[0048] One end of the third switching unit 700 can be connected between the motor 2 and the second switching unit 300, and the other end can be connected to the lead frame 400, so that when they are connected to each other outside the vehicle power module to be turned on, they can provide a Y-connection for each winding of the motor 2.

[0049] refer to Figure 1A , Figure 1B and Figure 2 Each of the following components—three 1-1 switching elements 210A, 210B, and 210C; three 1-2 switching elements 220A, 220B, and 220C; three 2-1 switching elements 310A, 310B, and 310C; three 2-2 switching elements 320A, 320B, and 320C; and three third switching units 700A, 700B, and 700C (e.g., a total of 15)—may include a structure comprising a combination of transistors and diodes, and may be connected via a lead frame (e.g., Figure 2 (400 in the text) provides switching operations between the ON and OFF states of the transistor based on a control signal input from the external power supply of the vehicle power module. For example, the transistor can be implemented as an insulated gate bipolar transistor (IGBT) or a metal-oxide-semiconductor field-effect transistor (MOSFET), but is not limited to these.

[0050] The switching operation between the ON and OFF states of each switching element may cause rapid changes in the current flowing between the drain and source terminals of the switching element (e.g., recovery current of the switching element, etc.). The capacitance of the DC link capacitor C-link can stabilize (e.g., balance the instantaneous power difference between the battery and the first inverter) the instabilities in the total DC current and total DC voltage of the first inverter 10 due to rapid changes in current (e.g., fluctuations, surges, or ringing).

[0051] The circuit between the switching element and the DC link capacitor C-link can act as a parasitic inductance L-para. In circuit theory, the product of the parasitic inductance L-para and the rate of change of current due to the switching operation of the switching element corresponds to the voltage generated in the parasitic inductance L-para. Therefore, as the parasitic inductance L-para increases, the rapid change of current due to the switching operation of the switching element increases voltage instability (e.g., fluctuations, surges, or ringing). In this way, the instability of DC current and the instability of DC voltage can complement each other. Therefore, as the parasitic inductance L-para decreases, the DC current and DC voltage can be further stabilized overall.

[0052] A power module for a vehicle according to embodiments of this disclosure may include an embedded capacitor C-com. Current variations generated by the switching elements are affected by the output reactance of the switching elements, and the output reactance is reduced due to the offset between a portion of the series parasitic inductance L-para (e.g., the portion corresponding to the embedded capacitor C-com and the DC link capacitor C-link) and the parallel capacitance of the embedded capacitor C-com. As the embedded capacitor C-com is connected closer to the 1-1 switching elements 210A, 210B, and 210C and the 1-2 switching elements 220A, 220B, and 220C, a portion of the series parasitic inductance L-para may occupy (e.g., the entire) proportion of the parasitic inductance L-para.

[0053] According to embodiments of this disclosure, a power module for a vehicle may include a structure in which an embedded capacitor C-com is embedded within the power module, such that the embedded capacitor C-com is connected close to switching elements 210A, 210B, and 210C (1-1) and switching elements 220A, 220B, and 220C (1-2), thereby effectively canceling out parasitic inductance L-para. Therefore, the effects of parasitic inductance in the vehicle power module (e.g., voltage / current fluctuations / surges / ringing due to power conversion switching) can be effectively reduced. Furthermore, by reducing parasitic inductance L-para, the power module for the vehicle may further improve power conversion efficiency (e.g., switching timing consistency among multiple switching elements) or reduce the required specifications (e.g., withstand voltage characteristics) of the power module for the vehicle.

[0054] Reference Figures 2 to 3D A power module for a vehicle according to embodiments of the present disclosure may include a first circuit board 100, a lead frame 400, a first switching unit 200, and embedded capacitors C-com, C-com1, C-com2, C-com3, and C-com4. Depending on the embodiment (e.g., design), the power module for a vehicle may also include at least one of a second circuit board 150 and a second switching unit 300. The first switching unit 200 may include at least one first semiconductor chip 201, and the second switching unit 300 may include at least one second semiconductor chip 301.

[0055] The first circuit board 100 may include a first insulating layer 110 and a first metal layer 120 disposed on the first insulating layer 110. The second circuit board 150 may include a second insulating layer 160 and a second metal layer 170 disposed on the second insulating layer 160. For example, each of the first circuit board 100 and the second circuit board 150 may be implemented as an active metal brazing (AMB) substrate or a direct copper bonding (DBC) substrate, each of the first insulating layer 110 and the second insulating layer 160 may be implemented as a ceramic layer, and each of the first metal layer 120 and the second metal layer 170 may be implemented as a copper layer, but is not limited thereto.

[0056] A portion of each of the first insulating layer 110 and the second insulating layer 160 may overlap with each of the first metal layer 120 and the second metal layer 170 in the vertical direction (e.g., the Z direction), while another portion of each of the first insulating layer 110 and the second insulating layer 160 may not overlap with each of the first metal layer 120 and the second metal layer 170 in the vertical direction (e.g., the Z direction). For example, before patterning, each of the first metal layer and the second metal layer may be formed to overlap (e.g., the entire) area of ​​each of the first insulating layer 110 and the second insulating layer 160. A portion of each of the first metal layer and the second metal layer before patterning may be removed by a patterning process (e.g., photolithography). After patterning, each of the first metal layer 120 and the second metal layer 170 may include a plurality of patterns 122, 123, 124, 125 and 128 that are separate from each other. The plurality of patterns 122, 123, 124, 125 and 128 may provide a plurality of electrical connection paths for the first semiconductor chip 201 and the second semiconductor chip 301 of the first switching unit 200 and the second switching unit 300.

[0057] For example, the first circuit board 100 may further include a third metal layer 130, and the second circuit board 150 may further include a fourth metal layer 180. For example, the third metal layer 130 and the fourth metal layer 180 can dissipate heat generated by the first semiconductor chip 201 and the second semiconductor chip 301, as well as the first metal layer 120 and the second metal layer 170, to the outside of the vehicle power module, and can be electrically isolated from the first metal layer 120 and the second metal layer 170 through the first insulating layer 110 and the second insulating layer 160. Alternatively, the third metal layer 130 and the fourth metal layer 180 can provide grounding for the first switching unit 200 and the second switching unit 300, and can be electrically connected to some patterns of the first metal layer 120 and the second metal layer 170 through conductive vias in the first insulating layer 110 and the second insulating layer 160. Although not shown, cooling channels for cooling the vehicle power module may contact the lower surface of the third metal layer 130 and the upper surface of the fourth metal layer 180.

[0058] The first switching unit 200 and the second switching unit 300 may be electrically connected to a plurality of DC electrodes 410, 420 and arranged on the first circuit board 100 and the second circuit board 150 (e.g., arranged between the first circuit board 100 and the second circuit board 150). For example, the first semiconductor chip 201 of the first switching unit 200 and the second semiconductor chip 301 of the second switching unit 300 may be implemented as at least one of an integrated circuit, a chip, and a die. The switching of the first switching unit 200 and the second switching unit 300 may refer to the switching between the ON state and the OFF state of the semiconductor device.

[0059] The first switching unit 200 and the second switching unit 300 can receive control signals from outside the power module via signal leads 500, and can switch the ON / OFF state of the semiconductor devices according to the control signals. Based on the switching of the first switching unit 200 and the second switching unit 300, the first switching unit 200 and the second switching unit 300 can invert the DC current input through the lead frame 400 into AC current.

[0060] For example, the first switching unit 200 and the second switching unit 300 can be mounted on the upper surface of the first circuit board 100 via the first connecting portion 215 and the second connecting portion 315, respectively. For example, the first connecting portion 215 and the second connecting portion 315 can be implemented as structures that also provide electrical connection paths, such as bumps or solder balls, or they can be implemented as adhesive layers that provide adhesion when there are no electrical connection paths.

[0061] The lead frame 400 may include a plurality of DC electrodes 410, 420 disposed on one side (e.g., in the -Y direction) of the first circuit board 100 and the second circuit board 150, and may also include an AC electrode 430. The plurality of DC electrodes 410, 420 may include N-type electrodes and P-type electrodes. The plurality of DC electrodes 410, 420 may be electrically connected to a battery (e.g., ...). Figure 1A The BAT in the middle) allows them to be drawn from the battery (e.g., Figure 1A The BAT in the first metal layer 120 receives DC current and transmits it through at least two of the multiple patterns 122, 123, 124, 125, and 128 of the first metal layer 120 to the first semiconductor chip 201 and the second semiconductor chip 301. The AC electrode 430 can be electrically connected to a motor (e.g., Figure 1A In step 2), the AC electrode 430 can receive the AC current output from the first semiconductor chip 201 and the second semiconductor chip 301 through the first metal layer 120, and output it to the motor (e.g., Figure 1A 2).

[0062] Embedded capacitors C-com, C-com1, C-com2, C-com3, and C-com4 can be electrically connected between multiple DC electrodes 410 and 420, and can be arranged (e.g., between the first circuit board 100 and the second circuit board 150) to overlap at least one of the first insulating layer 110 and the first metal film 120 in a direction (e.g., the Z direction) in which the first insulating layer 110 and the first metal film 120 face each other.

[0063] Since the first switching unit 200 and the second switching unit 300 can be arranged on the first circuit board 100 and the second circuit board 150, the embedded capacitors C-com, C-com1, C-com2, C-com3, and C-com4 arranged to overlap with the first circuit board 100 and the second circuit board 150 can be connected close to the first semiconductor chip 201 and the second semiconductor chip 301 of the first switching unit 200 and the second switching unit 300. Therefore, parasitic inductance (e.g., Figure 1A The L-para in the first semiconductor chip 201 and the second semiconductor chip 301 can be (e.g., effectively) canceled out, and the voltage / current fluctuations / surges / ringing caused by the switching of the first semiconductor chip 201 and the second semiconductor chip 301 can be (e.g., effectively) reduced.

[0064] For example, a portion of the lead frame 400 may be configured to overlap with at least one of the first insulating layer 110 and the first metal layer 120 in a direction (e.g., the Z direction) in which the first insulating layer 110 and the first metal layer 120 face each other, and embedded capacitors C-com, C-com1, C-com2, C-com3, and C-com4 may be arranged so that they do not overlap with the lead frame 400 in the direction (e.g., the Z direction) in which the first insulating layer 110 and the first metal layer 120 face each other. That is, embedded capacitors C-com, C-com1, C-com2, C-com3, and C-com4 may be arranged closer to the first semiconductor chip 201 and the second semiconductor chip 301 than to the lead frame 400. Therefore, embedded capacitors C-com, C-com1, C-com2, C-com3, and C-com4 may also cancel out the parasitic inductance of the lead frame 400.

[0065] For example, the AC electrode 430 of the lead frame 400 may also include multiple AC electrodes 430 electrically connected to the first switching unit 200 and / or the second switching unit 300, and the multiple DC electrodes 410, 420 may be arranged (e.g., adjacently) such that there are no multiple AC electrodes 430 between them. Therefore, the electrical distance between the multiple DC electrodes 410, 420 and the first switching unit 200 can be shortened, and energy transmission efficiency can be improved. Compared to the energy efficiency of AC current transmission, the energy consumption of DC current transmission can have a greater impact on the overall energy efficiency of the vehicle power module.

[0066] As the electrical distance between the multiple DC electrodes 410, 420 and the first switching unit 200 becomes shorter, the parasitic inductance corresponding to the electrical distance can also be reduced, and the (e.g., required) capacitance of the embedded capacitors C-com, C-com1, C-com2, C-com3 and C-com4 used to cancel the parasitic inductance can also be reduced.

[0067] For example, the number of DC electrodes 410 and 420 can be three, and the number of AC electrodes 430 can be three, but is not limited to these. For example, among the multiple DC electrodes 410 and 420, the two DC electrodes 420 on both sides can be N-type electrodes (or P-type electrodes), and among the multiple DC electrodes 410 and 420, the middle DC electrode 410 can be a P-type electrode (or N-type electrode). This structure can be configured as an NPN bus structure (or a PNP bus structure).

[0068] Reference Figure 2 and Figure 3A The power module for a vehicle according to embodiments of the present disclosure may further include a fused portion 75 connected between embedded capacitors C-com1 and C-com2 and the first metal layer 120, comprising a conductive material with a melting point lower than that of the first metal layer 120. For example, the fused portion 75 may be implemented with solder or sintering material and may be formed by a reflow process or a thermo-pressed bonding (TCB) process for a structure in which embedded capacitors C-com1 and C-com2 are disposed on the first metal layer 120.

[0069] Since the embedded capacitors C-com1 and C-com2 (e.g., previously manufactured separately from the power module for the vehicle) can be connected to the power module for the vehicle via the fuse portion 75, the embedded capacitors C-com1 and C-com2 can be implemented as capacitor assemblies designed for (e.g., effectively) forming capacitance. For example, the capacitor assembly can be implemented as one of, but is not limited to, multilayer ceramic capacitors (MLCCs), solid electrolytic (or tantalum) capacitors, film capacitors, and silicon wafer-based capacitors.

[0070] For example, embedded capacitors C-com1 and C-com2 may include a capacitor body 60 and a plurality of capacitor electrodes 70, 80 disposed in the capacitor body 60. The capacitor body 60 may have (e.g., effectively) a structure for forming a capacitor (e.g., a structure in which a metal-dielectric-metal structure is effectively compressed). The plurality of capacitor electrodes 70, 80 may provide an electrical path for transferring the capacitance of the capacitor body 60 to the outside of the embedded capacitors C-com1 and C-com2, and may be electrically connected to each of a plurality of separate patterns of the first metal layer 120 (e.g., two of 122, 123, 124, 125, and 128).

[0071] For example, the embedded capacitor C-com1 can be arranged in a bridging structure spanning multiple patterns (two of 122, 123, 124, 125, and 128). Therefore, the space between the multiple patterns (two of 122, 123, 124, 125, and 128) can be utilized (e.g., to ensure space for capacitor formation (e.g., as required)) and the overall design freedom of the electrical connection paths provided by the first metal layer 120 can be further increased.

[0072] For example, the embedded capacitor C-com2 may also include a capacitor bonding wire 90 connected to one of a plurality of capacitor electrodes 70, 80. One of the plurality of capacitor electrodes 70, 80 may be electrically connected via the capacitor bonding wire 90 to one of a plurality of patterns (e.g., two of 122, 123, 124, 125, and 128) of the first metal layer 120, and another of the plurality of capacitor electrodes 70, 80 may be electrically connected to another of the plurality of patterns (e.g., two of 122, 123, 124, 125, and 128) of the first metal layer 120. Therefore, the shape and arrangement freedom of the embedded capacitor C-com2 can be increased. For example, the capacitor bonding wire 90 may include, but is not limited to, a material with high conductivity, ductility, and malleability, such as gold (Au).

[0073] refer to Figure 2 , Figure 3B and Figure 3C One of the multiple capacitor electrodes 70, 80 of the embedded capacitors C-com3 and C-com4 can be electrically connected to the first metal layer 120, and another of the multiple capacitor electrodes 70, 80 can be electrically connected to the second metal layer 170. Therefore, the space between the first circuit board 100 and the second circuit board 150 can be utilized (e.g., effectively), and the overall design freedom of the electrical connection paths provided by the first metal layer 120 and the second metal layer 170 can be further increased.

[0074] refer to Figure 2 and Figure 3B The power module for a vehicle according to embodiments of the present disclosure may further include a capacitor spacer 630 disposed between a first circuit board 100 and a second circuit board 150, overlapping an embedded capacitor C-com3 in a direction in which the first circuit board 100 and the second circuit board 150 face each other (e.g., the Z direction). One of the plurality of capacitor electrodes 70, 80 of the embedded capacitor C-com3 may be electrically connected to a first metal layer 120, and another of the plurality of capacitor electrodes 70, 80 may be electrically connected to a second metal layer 170 through the capacitor spacer 630.

[0075] For example, the capacitor spacer 630 can be implemented as a block formed of conductive material, or as a structure in which a conductive post and an insulating block surrounding the conductive post are combined, but is not limited thereto. For example, the capacitor spacer 630 can be connected and bonded to the embedded capacitor C-com3 and the second metal layer 170 via the spacer connection portion 635.

[0076] According to embodiments of this disclosure (e.g., designs), a portion of the lead frame 400 may be connected to the first circuit board 100, the remainder of the lead frame 400 may be connected to the second circuit board 150, and embedded capacitors C-com3 and C-com4 may be electrically connected between one (e.g., connected to the first circuit board) and the other (e.g., connected to the second circuit board) in the lead frame 400.

[0077] According to embodiments of this disclosure (e.g., designs), the capacitor spacer 630 may not provide an electrical connection path to the embedded capacitor C-com3. The thickness of the capacitor spacer 630 may correspond to the difference between the gap between the first circuit board 100 and the second circuit board 150 and the thickness of the embedded capacitor C-com3, such that the arrangement of the embedded capacitor C-com3 can be stabilized by supporting it downwards.

[0078] refer to Figure 2 , Figure 3B and Figure 3C According to embodiments of the present disclosure, a power module for a vehicle may include a switching unit spacer 610 and / or a through-hole spacer 620. The switching unit spacer 610 and the through-hole spacer 620 may each provide an electrical connection path to the second circuit board 150, such that the capacitor electrodes 80 of the embedded capacitors C-com3 and C-com4 can be electrically connected to the first semiconductor chip 201 and the second semiconductor chip 301 or multiple DC electrodes 410, 420.

[0079] The switching unit spacer 610 can be disposed between the first semiconductor chip 201 and the second circuit board 150 of the first switching unit 200 to electrically connect the first switching unit 200 and the second metal layer 170. The through-hole spacer 620 can be disposed between the first circuit board 100 and the second circuit board 150 to electrically connect the first metal layer 120 and the second metal layer 170.

[0080] The spacer connection portions 615 and 625 can connect the switching unit spacer 610 and / or the through-hole spacer 620 to the second metal layer 170, connect the switching unit spacer 610 to the first semiconductor chip 201 of the first switching unit 200, and connect the through-hole spacer 620 to the first metal layer 120. For example, the spacer connection portions 615 and 625 can be implemented as blocks formed of conductive material, or as a structure in which a conductive post and an insulating block surrounding the conductive post are combined, but are not limited thereto.

[0081] The switching unit spacer 610 can stabilize the arrangement of the first semiconductor chip 201 by supporting the first semiconductor chip 201 of the first switching unit 200 downwards, and can also provide a path for dissipating heat generated by the first semiconductor chip 201 upwards.

[0082] refer to Figures 2 to 3D The power module for a vehicle according to embodiments of this disclosure may further include a package 650 and a current sensor (e.g., Figure 2 At least one of the following: 800, bonding wire 900, and signal lead 500.

[0083] The encapsulation portion 650 can be disposed on the first circuit board 100, or between the first circuit board 100 and the second circuit board 150, and can encapsulate the first switching unit 200, the second switching unit 300, and the third switching unit 700, as well as the embedded capacitors C-com, C-com1, C-com2, C-com3, and C-com4. The encapsulation portion 650 can protect the first switching unit 200, the second switching unit 300, and the third switching unit 700 from external influences of the vehicle power module, and can also protect the embedded capacitors C-com, C-com1, C-com2, C-com3, and C-com4. For example, the encapsulation portion 650 may include molding materials such as epoxy molding compound (EMC) or silicone gel, but is not limited thereto.

[0084] Current sensor (e.g., Figure 2 The 800 in the middle can sense the current flowing through the first metal layer 120 and can be disposed between the first circuit board 100 and the second circuit board 150. For example, a current sensor (e.g., Figure 2The 800 in the figure can be implemented as a current and / or voltage sensing resistor shunt connected to the first metal layer 120, or it can be implemented as a Hall sensor, but is not limited thereto.

[0085] One end of the bonding wire 900 can be connected to the first switching unit 200, the second switching unit 300, and the third switching unit 700, as well as a current sensor (e.g., Figure 2 In the case of 800), the other end of the bonding wire 900 can be connected to the first metal layer 120 or the signal lead 500. For example, the bonding wire 900 may include, but is not limited to, a material with high conductivity, ductility and malleability, such as gold (Au).

[0086] Signal lead 500 can be electrically connected to the first switching unit 200, the second switching unit 300, and the third switching unit 700, and can be located on the opposite side of the first circuit board 100 and the second circuit board 150 (e.g., in the +Y direction). Signal lead 500 can be configured to offset from the center of the first circuit board 100 and the second circuit board 150 in the +Y direction. Signal lead 500 can receive control signals from an external source (e.g., a controller) of the power module for the vehicle and transmit these control signals to the first switching unit 200, the second switching unit 300, and the third switching unit 700. Furthermore, signal lead 500 can be connected to a current sensor (e.g., Figure 2 The current value sensed by the 800) is transmitted to the outside of the vehicle power module (e.g., the controller).

[0087] At the same time, refer to Figure 3D According to embodiments of this disclosure, a power module for a vehicle may omit the second circuit board (e.g., Figure 3A 150 in the middle), switching unit spacer (e.g., Figure 3A 610 in the middle) and through-hole spacers (e.g., Figure 3A The structure of 620).

[0088] According to embodiments of this disclosure, a power module for a vehicle including an embedded capacitor and a motor drive device including the module can (e.g., effectively) reduce the effects of parasitic inductance of the vehicle power module (e.g., voltage / current fluctuations / surges / ringing due to power conversion switching) and can improve the power conversion efficiency of the vehicle power module (e.g., switching unit) or reduce (e.g., the required) specifications (e.g., withstand voltage characteristics).

[0089] While embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A power module for a vehicle, the power module comprising: A first circuit board, the first circuit board including a first insulating layer and a first metal layer disposed on the first insulating layer; A lead frame, the lead frame including a plurality of DC electrodes disposed on the first circuit board; A first switching unit is electrically connected to the plurality of DC electrodes and is disposed on the first circuit board; as well as An embedded capacitor, which is electrically connected between the plurality of DC electrodes, The embedded capacitor is configured to overlap at least one of the first insulating layer and the first metal layer in a direction in which the first insulating layer and the first metal layer face each other.

2. The power module according to claim 1 further includes a fusible portion connected between the embedded capacitor and the first metal layer, and the fusible portion comprises a conductive material with a melting point lower than that of the first metal layer.

3. The power module according to claim 1, wherein... The embedded capacitor includes a capacitor body, a plurality of capacitor electrodes disposed in the capacitor body, and capacitor bonding wires, wherein the capacitor bonding wires are configured to connect at least one of the plurality of capacitor electrodes to the first metal layer.

4. The power module according to claim 1 further includes a packaging part, the packaging part being disposed on the first circuit board and encapsulating the first switching unit and the embedded capacitor.

5. The power module according to claim 1, further comprising: The second circuit board includes a second insulating layer and a second metal layer disposed on the second insulating layer. The embedded capacitor is disposed between the first circuit board and the second circuit board.

6. The power module according to claim 5, wherein The embedded capacitor includes a capacitor body and a plurality of capacitor electrodes disposed within the capacitor body, and At least one of the plurality of capacitor electrodes is electrically connected to the first metal layer, and at least one of the plurality of capacitor electrodes is electrically connected to the second metal layer.

7. The power module according to claim 6 further includes a through-hole spacer disposed between the first circuit board and the second circuit board to electrically connect the first metal layer to the second metal layer.

8. The power module according to claim 6 further includes a switching unit spacer, the switching unit spacer being disposed between the first switching unit and the second circuit board to electrically connect the first switching unit to the second metal layer.

9. The power module according to claim 6, further comprising: A capacitor spacer is disposed between the first circuit board and the second circuit board to overlap with the embedded capacitor in a direction in which the first circuit board and the second circuit board face each other. At least one of the plurality of capacitor electrodes is electrically connected to the second metal layer through the capacitor spacer.

10. The power module of claim 5 further includes a capacitor spacer disposed between the first circuit board and the second circuit board to overlap with the embedded capacitor in a direction in which the first circuit board and the second circuit board face each other.

11. The power module according to claim 1, wherein The embedded capacitor includes a capacitor body and a plurality of capacitor electrodes disposed in the capacitor body. The plurality of capacitor electrodes are electrically connected to a plurality of separate patterns in the first metal layer, and The embedded capacitor is disposed in a bridging structure spanning the plurality of separate patterns.

12. The power module according to claim 1, wherein, A portion of the lead frame is configured to overlap at least one of the first insulating layer and the first metal layer in a direction in which the first insulating layer and the first metal layer face each other, and The embedded capacitor is configured not to overlap with the lead frame in the direction in which the first insulating layer and the first metal layer face each other.

13. The power module according to claim 1, wherein The lead frame also includes multiple AC electrodes, which are electrically connected to the first switching unit.

14. The power module according to claim 13, wherein, The plurality of DC electrodes are arranged adjacent to each other, while there are no plurality of AC electrodes between the plurality of DC electrodes.

15. The power module according to claim 14 further includes a signal lead electrically connected to the first switching unit and disposed on the first circuit board.

16. The power module according to claim 14, wherein, The plurality of DC electrodes are electrically connected to external DC link capacitors and batteries of the power module used in the vehicle.

17. The power module according to claim 13, wherein, The plurality of AC electrodes are electrically connected to an external motor of the power module used in the vehicle.

18. The power module according to claim 1, further comprising: A second switching unit is disposed on the first circuit board; and A third switching unit is disposed on the first circuit board. The first switching unit includes a plurality of first semiconductor chips, the second switching unit includes a plurality of second semiconductor chips, and the third switching unit includes a third semiconductor chip.

19. The power module according to claim 18, wherein, The first switching unit is located in the central part of the first circuit board. The second switching unit is disposed outside the first switching unit on the first circuit board, and The third switching unit is disposed outside the first switching unit on the first circuit board.

20. A motor drive device, comprising: Power module, the power module comprising: A first circuit board, the first circuit board including a first insulating layer and a first metal layer disposed on the first insulating layer; A lead frame, the lead frame including a plurality of DC electrodes disposed on the first circuit board; An embedded capacitor electrically connected between the plurality of DC electrodes, wherein the embedded capacitor is configured to overlap at least one of the first insulating layer and the first metal layer in a direction in which the first insulating layer and the first metal layer face each other; A first switching unit is electrically connected to the plurality of DC electrodes and is disposed on the first circuit board; A second switching unit, wherein the second switching unit is disposed on the first circuit board; and A third switching unit is disposed on the first circuit board. The first switching unit includes multiple first semiconductor chips, the second switching unit includes multiple second semiconductor chips, and the third switching unit includes a third semiconductor chip. The first switching unit includes a 1-1 switching element and a 1-2 switching element, corresponding to the bridge arm of the first inverter. The second switching unit includes a 2-1 switching element and a 2-2 switching element, and corresponds to the bridge arm of the second inverter. At least one end of the third switching unit is connected between the first node between the 1-1 switching element and the 1-2 switching element and the second node between the 2-1 switching element and the 2-2 switching element, and constitutes part of the changeover switch.

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