Heat transfer device and method

Abstract

In one aspect, a heat transfer apparatus is provided, comprising a process fluid heat exchange loop having a mechanical cooler with a hot-side heat exchanger and a cold-side heat exchanger; and a mixing cooler for receiving process fluid from the hot-side heat exchanger and supplying cooled process fluid to the cold-side heat exchanger. The mixing cooler includes a direct heat exchanger and an indirect heat exchanger. The mixing cooler has a dry mode and a mixing mode. The heat transfer apparatus includes a controller configured to operate the process fluid heat exchange loop in one of a plurality of modes, at least in part, based on a determination of the heat load of the heat transfer apparatus.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefits of U.S. Provisional Application No. 63 / 600,452, filed November 17, 2023; U.S. Provisional Application No. 63 / 565,875, filed March 15, 2024; and U.S. Provisional Application No. 63 / 679,310, filed August 5, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to systems for removing heat from process fluids, and more specifically, to encapsulation cooling systems (e.g., cooling towers). Background Technology

[0004] Industrial cooling systems are used to remove heat from process fluids in various industrial processes, such as manufacturing processes, heating, ventilation, and air conditioning (HVAC) systems in buildings, and heat transfer systems in computer data centers. A common approach in some industrial cooling systems is to install heat exchangers (such as air handling units) within the building to transfer heat to a first process fluid (such as water or a water-glycol mixture), and to install chillers within the building to remove heat from the first process fluid. The chillers then transfer heat from the first process fluid to a second process fluid, which is then transported to a heat dissipation device, such as a cooling tower outside the building. The cooling tower removes heat from the second process fluid and returns the cooled second process fluid to the chillers. The chillers used in industrial cooling systems are typically quite large, with rated power generally ranging from 100 hp to 300 hp.

[0005] One problem with industrial cooling systems that operate year-round is that these systems are typically designed with a maximum capacity sufficient to provide the necessary cooling even on the hottest days of the year. In traditional cooling systems, providing sufficient maximum capacity for the hottest days involves using system components with a larger capacity than needed for the rest of the year, such as more powerful chillers, fan motors, pumps, etc. Larger capacity system components consume more energy and / or water than smaller capacity components, but are used to provide sufficient maximum capacity for the cooling system.

[0006] Ice storage systems are sometimes used in conjunction with industrial cooling systems to provide additional cooling capacity during peak energy usage periods, such as on a sunny, humid summer afternoon. An ice storage system has a storage tank that is charged (e.g., ice in the tank is frozen) and discharged as needed to supplement the chiller units and cooling towers of the cooling system. For example, when local electricity prices are low, the ice storage system can operate overnight to freeze the water in the tank. On a sunny, humid summer afternoon, the ice in the tank is discharged, for example, by process fluids flowing through the coils in the ice tank, providing additional cooling capacity to the cooling system.

[0007] One problem with some ice storage cooling systems is that they still rely on large chiller units (e.g., over 200 horsepower) within the building to cool the water supplied to heat exchangers. These large chiller units often consume significant amounts of energy, even when the required cooling capacity is smaller, while providing sufficient maximum capacity. Another issue with some ice storage systems is that one or more ice tanks may occupy an entire room or even a separate building to provide sufficient cooling capacity for a large industrial system. The size and complexity of large ice storage tanks may be impractical for some facilities. Furthermore, ice storage systems utilize ethylene glycol, which is more expensive than water, as the process fluid, increasing the pumping power required to circulate the process fluid and reducing heat transfer performance. Summary of the Invention

[0008] In one aspect of this disclosure, a heat transfer device is provided for an industrial process requiring a process fluid at a set process fluid temperature. The heat transfer device includes an inlet, an outlet, and a process fluid heat exchange circuit to receive process fluid from the industrial process at a temperature different from the set process fluid temperature, and to supply process fluid at the set process fluid temperature to the industrial process. The process fluid heat exchange circuit includes a heat exchanger, an airflow generator (operable to travel air from the inlet to the outlet and contact the heat exchanger), and a cold storage device.

[0009] The process fluid heat exchange loop has a first mode in which the process fluid bypasses the cold storage device, and a heat exchanger transfers heat between the process fluid and air. The process fluid can bypass the cold storage device, for example, by being directed to bypass it or, when the cold storage device has limited heat exchange capacity. As another example, when the process fluid is directed through the cold storage device but the phase change material has been discharged from it, the process fluid can bypass the cold storage device such that the temperature of the process fluid leaving the cold storage device is substantially the same as its temperature entering it. The process fluid heat exchange loop has a second mode in which the cold storage device transfers heat between the process fluid and the cold storage device, and a heat exchanger transfers heat between the process fluid and air. The heat transfer device also includes a controller operatively connected to the process fluid heat exchange loop.

[0010] The controller is configured to operate the process fluid heat exchange loop in a second mode, based at least in part on air parameters and determining that the process fluid heat exchange loop cannot provide process fluid at the process fluid set temperature in a first mode. In this way, the heat transfer unit can utilize a cold storage device to adjust or partially meet the heat transfer load required to provide process fluid at the process fluid set temperature. By selectively utilizing the cold storage device during peak heat transfer loads (e.g., on the hottest days of the year), the heat exchanger can be designed to have a smaller capacity than it would when meeting peak heat transfer loads on its own. This helps the heat exchanger use less water and / or energy during off-peak heat transfer load conditions.

[0011] This disclosure also provides a method of operating a heat transfer device associated with an industrial process requiring a process fluid at a process fluid set temperature. The heat transfer device includes a process fluid heat exchange loop for the process fluid, the process fluid heat exchange loop including a heat exchanger, a fan for moving air relative to the heat exchanger, and a cold storage device. The process fluid heat exchange loop has a first mode in which the process fluid bypasses the cold storage device, and the heat exchanger transfers heat between the process fluid and the air. The process fluid heat exchange loop has a second mode in which the cold storage device transfers heat between the process fluid and the cold storage device, and the heat exchanger transfers heat between the process fluid and the air. The method includes operating the process fluid heat exchange loop in a second mode, based at least in part on air parameters and determining that the process fluid heat exchange loop in the first mode cannot supply process fluid to the industrial process at the process fluid set temperature.

[0012] In one aspect of this disclosure, a heat transfer device is provided, comprising: a process fluid heat exchange loop including a heat exchanger; an airflow generator operable to contact air with the heat exchanger; a cold storage device; and a mechanical cooler. The process fluid heat exchange loop has multiple modes, including a first mode in which the heat exchanger is operable to transfer heat between a process fluid and air; and a second mode in which the heat exchanger is operable to transfer heat between the process fluid and air, and the mechanical cooler is operable to remove heat from the process fluid. The multiple modes also include a third mode in which the heat exchanger is operable to transfer heat between the process fluid and air, and the cold storage device is operable to remove heat from the process fluid; and a fourth mode in which the heat exchanger is operable to transfer heat between the process fluid and air, the mechanical cooler is operable to remove heat from the process fluid, and the cold storage device is operable to remove heat from the process fluid. The heat transfer device also includes a controller configured to operate the process fluid heat exchange loop in one of the multiple modes, at least in part based on a determination of the heat load of the heat transfer device. In this way, the controller can operate the process fluid heat exchange loop in various configurations based at least in part on the heat load, which provides the flexibility to adjust the heat transfer device to efficiently remove heat from the process fluid.

[0013] In another aspect of this disclosure, a heat transfer device is provided, comprising an air inlet, an air outlet, and a process fluid cooling system for cooling a process fluid. The process fluid cooling system includes: a fan assembly for guiding air from the air inlet to the air outlet; a dehumidifier having a dehumidification mode and a bypass mode, wherein in the dehumidification mode the dehumidifier removes water from the air, and in the bypass mode the dehumidifier removes less water from the air than when the dehumidifier is in dehumidification mode; and an adiabatic precooler having a precooling mode and a standby mode, wherein in the precooling mode the adiabatic precooler lowers the dry-bulb temperature of the air, and in the standby mode the adiabatic precooler lowers the dry-bulb temperature of the air less than when the adiabatic precooler is in precooler mode. The heat transfer device also includes a heat exchanger that receives the process fluid and is located downstream of the dehumidifier and the adiabatic precooler. The process fluid cooling system has a first mode in which the dehumidifier is in dehumidification mode and the adiabatic precooler is in precooling mode; a second mode in which the dehumidifier is in bypass mode and the adiabatic precooler is in precooling mode; and a third mode in which the dehumidifier is in bypass mode and the adiabatic precooler is in standby mode. In this way, the dehumidifier and the adiabatic precooler can be selectively operated to meet the operating criteria of the heat transfer device, such as providing process fluid at the process fluid set temperature, meeting the heat transfer load, minimizing energy consumption, and / or minimizing water consumption. Furthermore, the heat transfer device may include a water recovery system to recover water removed from the air by the dehumidifier. As an example, the recovered water can be used by the heat transfer device as makeup water for the adiabatic precooler.

[0014] This disclosure also provides a heat transfer device having a heat exchanger for cooling a process fluid, the heat exchanger including a liquid distribution system and a fan operable to move air relative to the heat exchanger. The heat exchanger has a wet mode and a dry mode, in which the liquid distribution system distributes liquid; in the dry mode, the liquid distribution system distributes less liquid than in the wet mode. The heat transfer device also includes a cold storage device having a heat transfer mode and a bypass mode, in which the cold storage device removes heat from the process fluid; in the bypass mode, the cold storage device removes less heat from the process fluid than when the cold storage device is in heat transfer mode. The heat transfer device also includes a controller configured to receive a request to minimize water consumption or a request to minimize energy consumption, and to determine the heat load of the heat transfer device from a plurality of heat loads including low heat load, medium heat load, and high heat load. In response to a request to minimize water consumption, the controller is configured to operate the heat exchanger in dry mode and the cold storage device in bypass mode, at least partially based on a low heat load; at least partially based on a medium heat load; and at least partially based on a high heat load, operate the heat exchanger in wet mode and the cold storage device in heat transfer mode. In response to a request to minimize energy consumption, the controller is configured to operate the heat exchanger in wet mode and the cold storage device in bypass mode, at least partially based on a low heat load; and at least partially based on a high heat load, operate the heat exchanger in wet mode and the cold storage device in heat transfer mode. Thus, the controller can operate the components of the heat transfer device in different modes according to the heat load and the request to minimize water or energy consumption, which allows the heat transfer device to operate accurately and efficiently, for example, to provide the required process fluid set temperature.

[0015] According to another aspect of this disclosure, a heat transfer device is provided for an industrial process requiring a process fluid at a process fluid set temperature. The heat transfer device includes a process fluid heat exchange loop for receiving a process fluid at a temperature different from the process fluid set temperature and providing process fluid at the process fluid set temperature. The process fluid heat exchange loop includes a mechanical cooler having a hot-side heat exchanger and a cold-side heat exchanger; and a mixing cooler for receiving process fluid from the hot-side heat exchanger of the mechanical cooler and providing cooled process fluid to the cold-side heat exchanger of the mechanical cooler. Because the mixing cooler can provide a colder process fluid to the cold-side heat exchanger of the mechanical cooler than a dry cooler or an adiabatic cooler, the cold-side heat exchanger of the mechanical cooler requires a lower workload to provide process fluid at the process fluid set temperature, enabling the use of a smaller capacity mechanical cooler and achieving related energy savings.

[0016] The hybrid cooler comprises a direct heat exchanger and an indirect heat exchanger. The hybrid cooler has a dry mode, in which the indirect heat exchanger transfers heat from the process fluid to the air; and a hybrid mode, in which both the indirect and direct heat exchangers transfer heat from the process fluid to the air. The process fluid heat exchange loop has several modes, including a first mode in which the process fluid bypasses the mechanical cooler and the hybrid cooler is in dry mode; a second mode in which the mechanical cooler removes heat from the process fluid and the hybrid cooler is in dry mode; a third mode in which the process fluid bypasses the mechanical cooler and the hybrid cooler is in hybrid mode; and a fourth mode in which the mechanical cooler removes heat from the process fluid and the hybrid cooler is in hybrid mode.

[0017] Process fluids can bypass one or more components of a heat transfer device (e.g., a mechanical cooler, a direct heat exchanger, an indirect heat exchanger) by being directed around the component, or by being directed to the component when its heat exchange capacity is limited. For example, a process fluid heat exchange loop can bypass a mechanical cooler by guiding the process fluid through the hot-side and cold-side heat exchangers of the mechanical cooler when it is not in operation, so that the process fluid leaves the mechanical cooler at substantially the same temperature as when it entered the mechanical cooler.

[0018] The heat transfer device also includes a controller operatively connected to the process fluid heat exchange loop, the controller being configured to operate the process fluid heat exchange loop in one of a variety of modes based at least in part on the determination of the heat load of the heat transfer device. The controller can operate the components of the heat transfer device in different modes according to the associated heat load, which allows the heat transfer device to operate accurately and efficiently, for example, to provide the required process fluid set temperature.

[0019] This disclosure also provides a heat transfer device for industrial processes requiring a process fluid at a set temperature. The heat transfer device includes a process fluid heat exchange loop comprising a mechanical cooler having a hot-side heat exchanger and a cold-side heat exchanger; and a fluid cooler for receiving process fluid from the hot-side heat exchanger and providing cooled process fluid to the cold-side heat exchanger. The fluid cooler has a wet mode, wherein the fluid cooler utilizes liquid to facilitate heat transfer from the process fluid to air; and a dry mode, wherein the fluid cooler utilizes less liquid than in the wet mode to facilitate heat transfer from the process fluid to air. The process fluid heat exchange loop is operable in multiple modes, including a first mode in which the process fluid bypasses the mechanical cooler and a fluid cooler in its dry mode removes heat from the process fluid; a second mode in which both the mechanical cooler and the fluid cooler in its dry mode remove heat from the process fluid; a third mode in which the process fluid bypasses the mechanical cooler and a fluid cooler in its wet mode removes heat from the process fluid; and a fourth mode in which both the mechanical cooler and the fluid cooler in its wet mode remove heat from the process fluid. The heat transfer device also includes a controller operatively connected to the process fluid heat exchange loop and configured to change the operating modes of the process fluid heat exchange loop, at least in part, based on determining whether the process fluid heat exchange loop is capable of supplying process fluid at a set process fluid temperature. In this way, the controller can operate one or more components of the heat transfer device to meet the set process fluid temperature while shutting off or reducing the energy consumption and / or water consumption of one or more other components.

[0020] In one implementation, the determination of whether the process fluid heat exchange loop can provide process fluid at the process fluid set temperature is based, at least in part, on the temperature of the process fluid supplied by the process fluid heat exchange loop, the process fluid set temperature, and control range parameters. The controller can thus make accurate decisions to change the operating mode, taking into account the cooling capacity of the process fluid heat exchange loop in the current operating mode and the hysteresis of the process fluid heat exchange loop.

[0021] Brief description of the attached figures

[0022] Figure 1 This is a schematic diagram of a heat transfer device based on the first method; Figure 2 yes Figure 1 A more detailed schematic diagram of the heat transfer device; Figure 3 Is as Figure 1 A schematic diagram of a heat transfer device, representing a first example of a heat exchanger; Figure 4A and Figure 4B It is shown Figure 3A graph showing the state of different components of a heat transfer device under different operating modes, while minimizing water consumption and releasing the phase change material. Figure 5A and Figure 5B It is shown Figure 3 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing energy consumption and releasing the phase change material. Figure 6A and Figure 6B It is shown Figure 3 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing water consumption and cooling the phase change material. Figure 7A and Figure 7B It is shown Figure 3 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing energy consumption and cooling the phase change material. Figure 8 yes Figure 1 A schematic diagram of a second example of a heat transfer device; Figure 9A and Figure 9B It is shown Figure 8 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing water consumption and releasing the phase change material. Figure 10A and Figure 10B It is shown Figure 8 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing energy consumption and releasing the phase change material. Figure 11A and Figure 11B It is shown Figure 8 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing water consumption and cooling the phase change material. Figure 12A and Figure 12B It is shown Figure 8 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing energy consumption and cooling the phase change material. Figure 13 yes Figure 1 A schematic diagram of a third example of a heat transfer device, which has an auxiliary closed-loop pump to facilitate the charging and cooling of the phase change material; Figures 14 to 19F yes Figure 13 Schematic diagram of a heat transfer device in different operating modes; Figure 20A and Figure 20B It is shown Figure 13A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing water consumption and releasing the phase change material. Figure 21A and Figure 21B It is shown Figure 13 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing energy consumption and releasing the phase change material. Figure 22A and Figure 22B It is shown Figure 13 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing energy consumption and cooling the phase change material. Figure 23A and Figure 23B It is shown Figure 13 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing energy consumption and cooling the phase change material. Figures 23C to 23F It is shown Figure 13 The components of the heat transfer device are based on Figure 85 , Figure 89 , Figure 92 , Figure 95 A state machine diagram showing the states under different operating modes; Figure 24 yes Figure 1 A fourth example of a heat transfer device having a direct heat exchanger and an indirect heat exchanger for removing heat from a process fluid. Figure 25 yes Figure 1 The fifth example of a heat transfer device has a direct heat exchanger to remove heat from the process fluid; Figure 26 This is a schematic diagram of a heat transfer device based on the second method; Figure 27 yes Figure 26 A more detailed schematic diagram of the heat transfer device; Figure 28 yes Figure 26 A schematic diagram of a first example of a heat transfer device; Figures 29 to 32 yes Figure 28 Schematic diagram of a heat transfer device in different operating modes; Figure 33 It is shown Figure 28 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing water consumption and releasing the phase change material. Figure 34 It is shown Figure 28A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing energy consumption and releasing the phase change material. Figure 35 It is shown Figure 28 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing water consumption and cooling the phase change material. Figure 36 It is shown Figure 28 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing energy consumption and cooling the phase change material. Figure 37 yes Figure 26 A schematic diagram of a second example of a heat transfer device; Figure 38 It is shown Figure 37 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing water consumption and releasing the phase change material. Figure 39 It is shown Figure 37 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing energy consumption and releasing the phase change material. Figure 40 It is shown Figure 37 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing water consumption and cooling the phase change material. Figure 41 It is shown Figure 37 A graph showing the state of the components of the heat transfer device in adiabatic cooling mode, while minimizing energy consumption and cooling the phase change material; Figure 42 yes Figure 26 A schematic diagram of a third example of a heat transfer device; Figure 43 yes Figure 26 A schematic diagram of the fourth example of a heat transfer device; Figure 44 This is a schematic diagram of a heat transfer device based on the third method; Figure 45 yes Figure 44 A schematic diagram of a first example of a heat transfer device; Figures 46 to 49 yes Figure 45 A schematic diagram of a portion of the heat transfer device, showing different operating modes; Figure 50 It is shown Figure 45 A graph showing the state of components of a heat transfer device under different operating modes, while minimizing energy consumption; Figure 51 It is shown Figure 45A diagram showing the status of the components of the heat transfer device, while minimizing the water consumption of the heat transfer device. Figure 52 It is shown Figure 45 A diagram showing the state of the components of the heat transfer device under different operating modes, while the heat transfer device produces water. Figure 53 yes Figure 44 A schematic diagram of a second example of a heat transfer device; Figure 54 It is shown Figure 53 A graph showing the state of the components of a heat transfer device under different operating modes, while minimizing the energy consumption of the heat transfer device. Figure 55 It is shown Figure 53 A graph showing the state of the components of the heat transfer device under different operating modes, while minimizing the water consumption of the heat transfer device. Figure 56 It is shown Figure 53 A diagram showing the state of the components of the heat transfer device under different operating modes, while the heat transfer device produces water. Figure 57 yes Figure 44 A schematic diagram of a third example of a heat transfer device; Figure 58 yes Figure 44 A schematic diagram of the fourth example of a heat transfer device; Figure 59 This is a schematic diagram of the heat transfer device in the chiller unit's start-up mode; Figure 60 yes Figure 59 A schematic diagram of the heat transfer device, showing the heat transfer device in the chiller unit shutdown mode; Figure 61 This is a schematic diagram of a heat transfer device for a chiller unit with a condenser coil located downstream of a finned coil, as air is guided through the heat transfer device. Figure 62 and Figure 63 This is a schematic diagram of a heat transfer device when the heat transfer device is in the chiller unit on mode and the chiller unit off mode. Figures 64 to 67 This is a schematic diagram of a heat transfer device, showing different modes of the heat transfer device; Figure 68 This is a schematic diagram of a heat transfer device, which includes an evaporator from a chiller unit in its external structure. Figure 69 yes Figure 68 A perspective view of the heat transfer device, showing that the heat transfer device has a cold storage device arranged alongside the evaporator; Figures 70 to 73 This is a schematic diagram of a heat transfer device in different operating modes; Figure 74 and Figure 75 This is a schematic diagram of a heat transfer device with phase change material. Under different operating modes of the heat transfer device, the storage temperature of the phase change material increases. Figure 76 This is a schematic diagram of a heat transfer device with a phase change material tank bypass; Figure 77 It is a perspective view of a heat transfer device with two stacked air / process fluid heat exchangers and a phase change material tank; Figure 78 This is a schematic diagram of a heat transfer device having a shell and a tank of phase change material inside the shell; Figure 79 This is a schematic diagram of a heat transfer device with a membrane mass exchanger, which dehumidifies the air before it reaches the heat exchanger of the heat transfer device. Figure 80 This is a schematic diagram of a heat transfer device with a membrane mass exchanger located upstream of the insulating cooling pad and the finned coil, used to dehumidify the air and improve the heat transfer efficiency between the finned coil and the airflow. Figure 81 This is a schematic diagram of a vacuum membrane mass exchanger with a sheet-like membrane placed between an air channel and a permeation channel; Figure 82 This is a schematic diagram of a heat transfer device with a dehumidifier that uses a liquid desiccant to dehumidify the air before it reaches the indirect heat exchanger of the heat transfer device. Figure 83 This is a schematic diagram of a heat transfer device with a shape memory alloy cooler; Figure 84 This is a graph showing the relationship between temperature and entropy of the shape memory alloy material in a shape memory alloy cooler; Figure 85 It is used for operation when a cooling load is present. Figure 13 A state machine diagram of a heat transfer device using a method to minimize water consumption; Figure 86 yes Figure 85 A block diagram of the parameters used in the method; Figure 87 It is shown Figure 85 The table used in the state machine diagram for the control logic that selects the initial operating mode of the heat transfer device; Figure 88A , Figure 88B , Figure 88C It is shown Figure 85 The table used in the state machine diagram for the control logic that changes the heat transfer device from the current operating mode to the subsequent operating mode; Figure 89 It is intended for operation when there is no cooling load. Figure 13 A state machine diagram of a heat transfer device using a method to minimize water consumption; Figure 90 It is shown Figure 89 The method used for selection Figure 13 A table showing the control logic for the initial operating mode of the heat transfer device; Figure 91 It is shown Figure 89 The table used in the method is the logic for changing the heat transfer device from the current operating mode to a subsequent operating mode. Figure 92 It is used for control when a cooling load is present. Figure 13 A state machine diagram of a heat transfer device using a method to minimize energy consumption; Figure 93 It is shown Figure 92 The table of control logic used in the method to select the initial operating mode of the heat transfer device; Figure 94A , Figure 94B , Figure 94C It is shown Figure 92 The table used in the state machine diagram for the control logic that changes the heat transfer device from the current operating mode to the subsequent operating mode; Figure 95 It is intended for operation when there is no cooling load. Figure 13 A state machine diagram of a heat transfer device using a method to minimize energy consumption; Figure 96 It is shown Figure 95 The table of control logic used in the method to select the initial operating mode of the heat transfer device; Figure 97 It is shown Figure 95 The table used in the method is a control logic table for changing the heat transfer device from the current operating mode to the subsequent operating mode; Figures 98A to 98H It is used for Figure 13 A flowchart of another method for selecting the operating mode of a heat transfer device; Figure 99 This is a schematic diagram of a heat transfer system for cooling process fluids from a building, which has rows of heat transfer devices connected to process fluid supply and return pipes. Figure 100 This is a schematic diagram of a heat transfer system, which has two rows of heat transfer devices connected to the process fluid supply and return pipes of the building. Figure 101 This is a schematic diagram of a heat transfer system for cooling process fluids from a building. The heat transfer system has heat transfer devices, each of which includes a fluid cooler and a structure containing a chiller and a pump. Figure 102 This is a schematic diagram of a heat transfer device with a chiller and a fluid cooler, the fluid cooler including an adiabatic precooler and a fluid cooling coil. Figure 103 yes Figure 102 A schematic diagram of a first example of a heat transfer device. Figure 103 A heat transfer device in a first operating mode is shown, wherein a fluid cooler cools process fluid from a cooling load; Figure 104 yes Figure 103 A schematic diagram of a heat transfer device is shown, illustrating the heat transfer device in a second operating mode, wherein a fluid cooler and a chiller unit operate to cool the process fluid from the cooling load. Figure 105 yes Figure 102 A schematic diagram of a second embodiment of the heat transfer device. Figure 105 A heat transfer device in a first operating mode is shown, wherein a fluid cooler cools process fluid from a cooling load; Figure 106 yes Figure 105 A schematic diagram of a heat transfer device is shown, illustrating the heat transfer device in a second operating mode, wherein a fluid cooler and a chiller unit provide cooling for the cooling load; Figure 107 yes Figure 102 A schematic diagram of the third embodiment of the heat transfer device. Figure 107 A heat transfer device in a first operating mode is shown, wherein a fluid cooler cools process fluid from a cooling load; Figure 108 yes Figure 106 A schematic diagram of a heat transfer device is shown, illustrating the heat transfer device in a second operating mode, wherein a fluid cooler and a chiller unit provide cooling for the cooling load; Figure 109 yes Figure 102 A schematic diagram of the fourth embodiment of the heat transfer device. Figure 109 A heat transfer device in a first operating mode is shown, wherein a fluid cooler cools process fluid from a cooling load; Figure 110 yes Figure 109 A schematic diagram of a heat transfer device is shown, illustrating the heat transfer device in a second operating mode, wherein a fluid cooler and a chiller unit provide cooling for the cooling load; Figure 111 It is a state machine diagram of a method for operating a heat transfer device to minimize water consumption; Figure 112 yes Figure 111 A block diagram of the parameters used in the method; Figure 113 It is shown Figure 111 The table of control logic used in the method to select the initial operating mode of the heat transfer device; Figure 114 It is shown Figure 111 The table used in the method is a control logic table for changing the heat transfer device from the current operating mode to the subsequent operating mode; Figure 115 This is a state machine diagram of the method of operating the heat transfer device to minimize water consumption; Figure 116 It is a state machine diagram of the method of operating a heat transfer device to minimize energy consumption; Figure 117 It is shown Figure 116 The table of control logic used in the method to select the initial operating mode of the heat transfer device; Figure 118 It is shown Figure 116 The table used in the method is a control logic table for changing the heat transfer device from the current operating mode to the subsequent operating mode; Figure 119 It is a state machine diagram of the method of operating a heat transfer device to minimize energy consumption; Figure 120 It is a state machine diagram of a method for operating a heat transfer device to minimize water consumption, in which the initial operating mode is determined; Figure 121 It is a state machine diagram of a method for operating a heat transfer device to minimize water consumption, where the initial operating mode is not determined. Figure 122 This is a schematic diagram of a heat transfer system used to cool process fluids from a building, which has different types of central chiller unit modules; Figure 123 This is a schematic diagram of a heat transfer device with a hybrid cooler and a chiller unit; Figure 124 This is a schematic diagram of a heat transfer device that includes a hybrid cooler, a chiller unit, and a cold storage device. Figure 125 yes Figure 123 A schematic diagram of the first embodiment of the heat transfer device. Figure 125 A heat transfer device in natural cooling mode is shown, in which dry cooling coils dissipate heat from the process fluid; Figure 126 yes Figure 125 A schematic diagram of a heat transfer device is shown, illustrating a heat transfer device in natural cooling mode, wherein heat exchangers and direct heat exchangers operate to remove heat from the process fluid. Figure 127 yes Figure 125A schematic diagram of a heat transfer device is shown, illustrating a heat transfer device in natural cooling mode, wherein dry cooling coils, heat exchangers, and direct heat exchangers operate to remove heat from the process fluid. Figure 128 yes Figure 125 A schematic diagram of a heat transfer device, showing the operation of the heat transfer device in which dry cooling coils and chillers are operated to remove heat from the process fluid; Figure 129 yes Figure 125 A schematic diagram of a heat transfer device, showing the mode in which a heat exchanger, a direct heat exchanger, and a chiller unit operate to remove heat from the process fluid. Figure 130 yes Figure 125 A schematic diagram of a heat transfer device shows dry cooling coils, heat exchangers, direct heat exchangers, and chillers operating to remove heat from the process fluid. Figure 131 yes Figure 123 A schematic diagram of the second embodiment of the heat transfer device in operation mode. Figure 131 The heat transfer device has a hybrid cooler with a heat exchanger and a direct heat exchanger system connected in parallel with the dry cooling coils; Figures 132 to 136 yes Figure 131 Schematic diagram of a heat transfer device in different operating modes; Figure 137 yes Figure 123 A schematic diagram of a third example of a heat transfer device. Figure 137 The heat transfer device has a hybrid cooler with an adiabatic precooler located upstream of the dry cooling coil. Figure 138 yes Figure 123 The fourth example of a heat transfer device, Figure 138 The heat transfer device has parallel direct heat exchangers and dry cooling coils, with adiabatic precooling used for the dry cooling coils. Figure 139 yes Figure 123 A schematic diagram of the fifth example of a heat transfer device. Figure 139 The heat transfer device has a hybrid cooler, which includes a dry cooling coil, an indirect heat exchanger, and a direct heat exchanger. Figure 140 , Figure 141 , Figure 142 yes Figure 139 A schematic diagram of a hybrid cooler, showing the hybrid cooler in energy-saving mode, adiabatic mode and water-saving mode; Figure 143 yes Figure 123 A schematic diagram of the sixth example of a heat transfer device. Figure 143 The heat transfer device has dry cooling coils and direct heat exchangers; Figure 144 yes Figure 123 A schematic diagram of the seventh example of a heat transfer device. Figure 144 The heat transfer device has a water loop, which includes a hybrid cooler with dry cooling coils and a direct heat exchanger; Figure 145 yes Figure 123 A schematic diagram of the eighth example of a heat transfer device. Figure 145 The heat transfer device has a water loop, which includes a hybrid cooler with direct heat exchangers and dry cooling coils connected in parallel. Figure 146 This is a schematic diagram of a heat transfer device that includes distributed components; Figure 147 This is a state machine diagram of the method of operating the heat transfer device to minimize water consumption; Figure 148 This is a state machine diagram of the method of operating the heat transfer device to minimize water consumption; Figure 149 It is a state machine diagram of the method of operating a heat transfer device to minimize energy consumption; Figure 150 It is a state machine diagram of the method of operating a heat transfer device to minimize energy consumption; Figure 151 , Figure 152 , Figure 153 , Figure 154 This is a schematic diagram of heat transfer devices, which have heat exchangers to separate the chilled water loop of the cooling load from the glycol loop of the heat transfer device; and Figures 155 to 159 This is a schematic diagram of heat transfer devices that have bypasses for fluid coolers, allowing for regulation of the process fluid flow rate to the fluid coolers. Detailed Implementation

[0023] refer to Figure 1A heat transfer device 10 according to the first method is provided. The heat transfer device 10 has an external structure (e.g., a housing 12), one or more air inlets 14, and one or more air outlets 16. The heat transfer device 10 has a heat exchanger 19 for transferring heat between a process fluid and air moving from the air inlets 14 to the air outlets 16. The heat exchanger 19 can utilize various air / process fluid flow configurations, such as cross-flow, counter-flow, co-flow, or combinations thereof. The heat transfer device 10 also includes a thermal energy storage (TES), such as a phase change material (PCM) tank 26, and a mechanical cooler, such as a heat pump or chiller unit 28, for providing additional heat transfer to the process fluid. The PCM in the PCM tank 26 can have a fixed or variable freezing temperature. The heat exchanger 19 includes an indirect heat exchanger (e.g., a fluid cooling coil 24) and an adiabatic precooler 20 with a precooling pad 22. The heat transfer device 10 includes an airflow generator, such as one or more fans 30, operable to draw air in from the inlet 14, through the precooling pad 22 and the fluid cooling coil 24, and out from the outlet 16. The one or more fans 30 can be constant-speed or variable-speed fans. The PCM tank 26 and chiller unit 28 provide trim cooling as needed to meet cooling load requirements, while allowing the fans 30, the adiabatic precooler 20, and the indirect heat exchanger 23 to be designed to be smaller than the peak cooling load, which reduces water and / or energy consumption during off-peak cooling loads. Thus, even on the hottest days of the year, the heat transfer device 10 can meet the peak cooling load or required process fluid set temperature for an industrial process in a specific geographic location. Furthermore, the heat transfer device 10 can be operated to minimize water or energy consumption while meeting cooling loads throughout the year.

[0024] about Figure 2 A more detailed schematic diagram of the heat transfer device 10 is provided. The heat transfer device 10 includes a process fluid inlet 34 to receive process fluids (e.g., water or a water / glycol mixture) from an industrial process (e.g., a computer data center). In one embodiment, multiple heat transfer devices 10 may be arranged in parallel such that the process fluid inlet 34 receives process fluid from an upstream heat transfer device 10. The process fluid received at the process fluid inlet 34 may be a liquid, a gas, or a liquid / gas mixture. The heat transfer device 10 has a process fluid outlet 36 for returning the process fluid to the industrial process or a downstream heat transfer device. Depending on the needs of a particular embodiment, the heat transfer device 10 may be operated to cool or heat the process fluid received at the process fluid inlet 34.

[0025] The heat transfer device 10 has a controller 40 with a memory 42, which is a non-transitory computer-readable medium for storing instructions for operating the heat transfer device 10. The controller 40 has a processor 44 for executing the instructions stored in the memory 42 and controlling the heat transfer device 10. The processor 44 may include, for example, one or more microprocessors and / or one or more application-specific integrated circuits (ASICs). The memory 42 may include, for example, magnetically readable storage media (e.g., magnetic hard disk drives), charge-based storage media (e.g., EEPROM, RAM), and / or solid-state storage media (e.g., flash drives). The controller 40 also includes communication circuitry 46 for communicating with remote devices (e.g., HVAC system controllers for buildings). Communication circuitry 46 may include, for example, a WiFi network interface, an Ethernet interface, and / or a cellular (e.g., 3G, 4G, 4G LTE, 5G) network interface. Communication circuitry 46 receives process fluid variables, such as temperature, pressure, and flow rate, that the remote device has requested from the heat transfer device 10. Processor 44 stores process fluid variables in memory 42 and operates heat transfer device 10 to provide process fluid at process fluid outlet 36 that satisfies the process fluid variables. Communication circuitry 46 can receive additional data from and transmit data to remote devices, such as air temperature and / or pressure; process fluid temperature, flow rate and / or pressure; and / or component status data. Controller 40 can control two or more heat transfer devices 10. As some examples, controller 40 may be mounted on heat transfer device 10, located remotely from the heat transfer device (e.g., an HVAC system controller for a building), or may be a cloud-based computing system that controls heat transfer device 10 via the Internet.

[0026] The adiabatic precooler 20 includes an evaporative liquid distribution system 50 configured to distribute evaporative liquid (e.g., water) onto a precooling pad 22. The evaporative liquid distribution system 50 includes a collection tank 52 for collecting evaporative liquid from the precooling pad 22, and a pump 54 for pumping the evaporative liquid from the collection tank 52 to a liquid distributor (e.g., a nozzle) of the evaporative liquid distribution system 50 to distribute the evaporative liquid onto the precooling pad 22. The evaporative liquid distribution system 50 also includes a replenishment valve 56 allowing water to be added to the collection tank 52 to compensate for evaporation of the evaporative liquid; a level sensor 58 for detecting the level of the evaporative liquid in the collection tank 52; a drain valve 60 for emptying the collection tank 52; and a conductivity sensor 62 for monitoring one or more variables of the evaporative liquid in the collection tank 52.

[0027] Chiller unit 28 can take different forms, such as refrigerant-based chillers, solid-state chillers (e.g., electrothermal, magnetothermal, thermoelastic), or gas-based chillers (reverse Brayton cycle), etc. Figure 2In the implementation scheme, the chiller unit 28 is a refrigerant-based chiller unit and includes a condenser 64, an evaporator 66, a compressor 68, and an expansion valve 70.

[0028] The heat transfer device 10 has a process fluid distribution system 80 for directing or guiding the flow of process fluids between the components of the heat transfer device 10. The process fluid distribution system 80 may include one or more bypass pumps 82, throttle valves 84, and bypass valves 86. Depending on the configuration of the heat transfer device 10, a given valve may be used as a bypass valve or a throttle valve, as discussed in more detail below.

[0029] PCM tank 26 includes a phase change material 90 (e.g., ice or another phase change material with a melting temperature above 32°F) and a heat exchanger 92 for exchanging heat between the phase change material 90 and the process fluid. As some examples, the phase change material 90 may include ice, paraffin wax, non-paraffin organic matter, hydrated salts, or metals. PCM tank 26 also includes: a drain valve 94 for emptying PCM tank 26; a flow valve 96 for filling PCM tank 26; a pressure sensor 98 for detecting pressure in PCM tank 26; an exhaust valve 100 for releasing pressure from PCM tank 26 when the pressure exceeds a predetermined threshold; and a PCM charge sensor 102. One example of the PCM charge sensor 102 is a level sensor for PCMs with different solid and liquid densities. Another example of the PCM charge sensor 102 is one or more temperature probes located at different positions on PCM tank 26. PCM tank 26 also includes a humidity control system 104 for detecting humidity within PCM tank 26. The humidity control system 104 may include a relative humidity sensor 106 and a humidity control device 108 (e.g., a dehumidifier).

[0030] PCM tank 26 has an air distribution system 101 for blowing air into the PCM tank 26 to agitate the liquid PCM and promote faster and more uniform melting and / or freezing of the PCM. The air distribution system 101 directs air to the PCM at the bottom of the PCM tank 26, and agitates the PCM as the air rises within the PCM tank 26. To provide this functionality, the air distribution system 101 may include an air pump, a check valve, a relative humidity sensor, and a humidity control device (e.g., such as...). Figure 2 (The ventilation opening shown).

[0031] The heat transfer device 10 in the first method can take various forms. (See reference) Figure 3A heat transfer device 110 is provided as a first example of a heat transfer device 10. The heat transfer device 110 includes a process fluid heat exchange loop 111 operable to receive process fluid from a cooling load 136, cool the process fluid to achieve a desired process fluid variable (e.g., a process fluid set temperature), and guide the cooled process fluid back to the cooling load 136. The heat transfer device 110 has a controller 113 for operating the components of the process fluid heat exchange loop 111.

[0032] The process fluid heat exchange loop 111 includes a heat exchanger 112 having an adiabatic precooler 114 and an indirect heat exchanger (e.g., a fluid cooling coil 116). The adiabatic precooler 114 has a precooling pad 118 and an evaporative liquid distribution system 120 for distributing evaporative liquid onto the precooling pad 118. The evaporative liquid distribution system 120 includes a collection tank 121 for collecting evaporative liquid from the precooling pad 118; and a collection tank pump 122 operable to pump evaporative liquid from the collection tank 121 to the precooling pad 118.

[0033] The heat transfer device 110 includes a fan 124 for generating airflow through a precooling pad 118 and a fluid cooling coil 116. An adiabatic precooler 114 reduces the dry-bulb temperature of the air before it reaches the fluid cooling coil 116, which improves the heat transfer efficiency between the air and the fluid cooling coil 116. The heat transfer device 110 also includes a chiller unit 130 having a condenser 132 and an evaporator 134 configured to transfer heat to or absorb heat from the process fluid from the cooling load 136. The heat transfer device 110 includes a cold storage device (e.g., a PCM tank 138) and a closed-loop pump 140 for recharging the PCM tank 138, as discussed in more detail below. The heat transfer device 110 is organized into a base module 142, which can be added in series or parallel to other base modules to provide the required cooling capacity for the cooling load 136. The components of the heat transfer device 110 can be located within a single external structure, or arranged in multiple external structures as required by a particular implementation scheme.

[0034] about Figure 4A and Figure 4BA method 150 for operating a heat transfer device 110 is provided. Method 150 is provided in graphical form, organized by heat load 152, which increases from a low (easy) heat load 154 to a high (hard) heat load 156. The heat load of the heat transfer device 110 can be determined by one or more variables, such as ambient air temperature (e.g., wet-bulb and / or dry-bulb), ambient air humidity, temperature and / or humidity of the air inside the heat transfer device 110, process fluid set temperature, process fluid pressure, process fluid flow rate, time of day, season, or a combination thereof. Method 150 has logic 158 that facilitates the change of the heat transfer device 110 between operating modes 160 when the heat load 152 changes. In one embodiment, in response to the heat transfer device 110 being unable to meet a process fluid set temperature, for example, requested by an HVAC system controller, while in a “lower” operating mode 160, the controller 113 switches from a “lower” operating mode 160 to a “higher” operating mode 160.

[0035] Method 150 also includes variables 162 for the components of the heat transfer device 110, which vary as the heat transfer device 110 changes between operating modes 160. In method 150, the controller 113 has received a request to minimize water consumption, causing method 150 to represent a water-saving sequence option. This request may be received from a remote device via communication circuit 46, or it may be determined by the controller 113 based on data available to the controller 113, such as ambient air variables, process fluid variables, variables indicating the state of the components of the heat transfer device 110, or combinations thereof. Furthermore, the PCM tank 138 is capable of releasing coolant in method 150.

[0036] More specifically, operating mode 160 includes dry cooling mode 164, which can be the default mode initiated by controller 113 in response to a request from heat transfer device 110 to provide process fluid at the process fluid set temperature to cooling load 136. In dry cooling mode 164, variables 162 include fan status 166, sump pump status 168, whether process fluid flows through fluid cooling coil 116 status 170, whether evaporator 134 and PCM tank 138 are bypassed status 172, chiller unit 130 status 174, closed-loop pump 140 status 176, and whether process fluid flows through condenser 132 of chiller unit 130 status 178. Variable 162 also includes whether process fluid flows through evaporator 134 of chiller unit 130 status 180, whether process fluid flows through PCM tank 138 status 182, PCM tank 138 charging status 184, and status 186 regarding the mode of PCM tank 138. Status 186 indicates whether PCM tank 138 can be cooled or charged in different operating modes 160 of method 150.

[0037] In dry cooling mode 164, fan 124 is on, sump pump 122 is off, process fluid flows through fluid cooling coil 116, and the evaporator 134 and PCM tank 138 of chiller unit 130 are completely bypassed. Furthermore, in dry cooling mode 164, chiller unit 130 is off, closed-loop pump 140 is off, process fluid bypasses condenser 132 of chiller unit 130, and process fluid cannot flow through evaporator 134 of chiller unit 130. Further still, in dry cooling mode 164, process fluid bypasses PCM tank 138, and the cooling charge of PCM tank 138 is greater than or equal to 0%.

[0038] As the heat load 152 becomes higher or the heat load increases, the controller 113 switches from the dry cooling mode 164 to another operating mode 160 based on a determination 188 that the cooling charge of the PCM tank 138 exceeds a predetermined minimum threshold (e.g., 10%, 5%, or 0%). In method 150, the predetermined minimum threshold is 0%.

[0039] If the cooling charge of PCM tank 138 exceeds a predetermined minimum threshold, controller 113 enters dry cooling and phase change material mode 190. In dry cooling and phase change material mode 190, a portion of the process fluid enters the evaporator 134 and PCM tank 138 of chiller unit 130, while a portion of the process fluid bypasses the evaporator 134 and PCM tank 138, as indicated by reference numerals 192 and 194 in method 150. Furthermore, in dry cooling and phase change material mode 190, PCM tank 138 is in a release cooling mode, as indicated by reference numeral 196.

[0040] However, if controller 113 determines that the PCM tank's charge level is not greater than a predetermined minimum threshold, controller 113 can skip dry cooling and PCM mode 190 and proceed to dry cooling and chiller mode 200. Dry cooling and chiller mode 200 allows for greater cooling capacity than dry cooling mode 164. In dry cooling and chiller mode 200, a portion of the process fluid flows through the condenser 132 and evaporator 134 of chiller 130, as shown by reference numerals 202 and 204, and chiller 130 is turned on, as shown by reference numeral 206. Since the PCM tank 138's charge level is 0%, process fluid does not flow through PCM tank 138, as shown by reference numeral 208.

[0041] If the heat load 152 continues to increase when the heat transfer device 110 is in dry cooling and chiller mode 200, the controller 113 determines whether the PCM tank's cooling charge is greater than 0%. If the PCM tank's cooling charge is greater than 0%, the controller 113 switches the heat transfer device 110 to dry cooling, chiller, and PCM mode 212 to accommodate the increased heat load 152. Figure 4A and Figure 4B As shown, controller 113 can switch from dry cooling and chiller mode 200 to dry cooling, chiller, and PCM mode 212 after the tank's charge is 0%. Alternatively, controller 113 can switch from dry cooling and PCM mode 190 to dry cooling, chiller, and PCM mode 212 if the PCM tank's charge is greater than zero. In dry cooling, chiller, and PCM mode 212, a portion of the process fluid flows through the chiller condenser 132 and chiller evaporator 134, as indicated by reference numerals 214 and 216, and chiller 130 is turned on, as indicated by reference numeral 218. Because the PCM tank's charge is greater than zero, the process fluid is directed through the PCM tank 138 (as indicated by reference numeral 220), thereby cooling the process fluid, and the PCM tank 138 is in a release cooling mode (as indicated by reference numeral 222).

[0042] When controller 113 determines that the PCM tank's charge cooling is greater than 0% and the heat load 152 continues to increase, controller 113 can change the operation of heat transfer device 110 from dry cooling, chiller, and PCM mode 212 to adiabatic cooling and PCM mode 224. In adiabatic cooling and PCM mode 224, the liquid collection tank pump 122 is turned on (as shown by reference numeral 228) to pump the evaporation liquid to the precooling pad 118. In adiabatic cooling and PCM mode 224, chiller 30 is turned off (as shown by reference numeral 230), and the process fluid does not flow through chiller condenser 132 or chiller evaporator 134 (as shown by reference numerals 232, 234). The process fluid flows through PCM tank 138, as shown by reference numeral 236, and PCM tank 138 is in release cooling mode 238 to remove heat from the process fluid.

[0043] Method 150 includes controller 113 changing the heat transfer unit 110 from adiabatic cooling and PCM mode 224 to adiabatic cooling and chiller mode 240 in response to controller 113 determining 242 that the PCM tank 138 is charged with more than 0% and the heat load 152 continues to increase. In adiabatic cooling and chiller mode 240, the sump pump 122 is turned on (as indicated by reference numeral 241) to wet the precooling pad 118 and reduce the dry-bulb temperature of the air in the heat transfer unit 110 before the air reaches the fluid cooling coil 116. The chiller 130 is turned on, and at least a portion of the process fluid flows through the chiller condenser 132 and the chiller evaporator 134, as indicated by reference numerals 244, 246, and 248. Since the PCM tank 138 is 0% charged in step 242, the process fluid will not flow through the PCM tank 138 in the adiabatic cooling and chiller unit mode 240, as shown by reference numeral 250.

[0044] If the PCM tank is 0% charged, the heat transfer device 110 can switch from the adiabatic cooling and PCM mode 224 to the adiabatic cooling and chiller mode 240. Alternatively, if the controller 113 determines in step 210 or 226 that the PCM tank 138 is 0% charged and the heat load 152 continues to increase, the heat transfer device 110 can switch from the dry cooling and chiller mode 200 or the dry cooling, chiller and PCM mode 212 to the adiabatic cooling and chiller mode 240.

[0045] In response to controller 113 determining 242 that the PCM tank 138's charge cooling is greater than 0% and the heat load 152 increases to a high level 156, controller 113 can reconfigure heat transfer device 110 from adiabatic cooling and PCM mode 224 to adiabatic cooling, chiller, and PCM mode 252. In adiabatic cooling, chiller, and PCM mode 252, sump pump 122 is turned on, as indicated by reference numeral 254; chiller 130 is turned on, as indicated by reference numeral 256; at least a portion of the process fluid flows through chiller condenser 132 and chiller evaporator 134, as indicated by reference numerals 258 and 260; and process fluid flows through PCM tank 130, as indicated by reference numeral 262. PCM tank 138 is in release cooling mode, as indicated by reference numeral 264, and removes heat from the process fluid.

[0046] As the heat load 152 increases or decreases, the controller 113 can proceed through operating mode 160 according to logic 158. Alternatively, the controller 113 can switch from one operating mode 160 to another operating mode (e.g., from mode 164 to mode 252 or vice versa) in response to a sudden change in the heat load 152 on the heat transfer device 110.

[0047] refer to Figure 5A and Figure 5B The controller 113 can respond to a request to minimize energy consumption and the PCM tank 138 can release coolant, utilizing method 270 to provide regulated cooling. Method 270 includes an operating mode 272, through which the controller 113 can proceed when the heat load 274 changes from an initial or low level 276 to a maximum or high level 278. Method 270 is similar to method 150 in many respects. One difference is that method 270 utilizes adiabatic cooling to limit energy consumption in modes 280, 282, 284, and 286.

[0048] refer to Figure 6A and Figure 6BIn response to a request from controller 113 to minimize water consumption and to enable PCM tank 138 to be charged with cooling, the controller may utilize method 300. Method 300 includes an operating mode 302, which the controller 113 progressively advances as the heat load 304 changes. Method 300 is similar in many respects to method 150 discussed above and includes a variable 306 that varies as the controller 113 progressively advances mode 302. One difference between methods 150 and 300 is that mode 302 includes a dry-cooled closed-loop chiller mode 310, in which the process fluid does not flow through the chiller evaporator 134 or PCM tank 138, as indicated by reference numerals 312 and 314. Instead, the secondary process fluid (which may be the same as or different from the process fluid flowing through the fluid cooling coil 116) is circulated by a closed-loop pump 140, as indicated by reference numeral 316. Closed-loop pump 140 pumps the secondary process fluid between the chiller evaporator 134 (which cools the secondary process fluid) to PCM tank 138 to cool the phase change material in PCM tank 138 and charge PCM tank 138. In operation mode 310, the process fluid flows through fluid cooling coil 116 to meet the heat load on heat transfer device 110.

[0049] Similarly, in the adiabatic cooling and closed-loop chiller configuration 316, the process fluid does not flow through the chiller evaporator 134 and PCM tank 138, as indicated by reference numerals 318 and 320. Instead, the secondary process fluid is circulated by the closed-loop pump 140 to allow the chiller evaporator 134 and the secondary process fluid to remove heat from the PCM tank 138 and charge the PCM tank 138. In the adiabatic cooling and closed-loop chiller configuration 316, the process fluid is cooled via the fluid cooling coil 116 and the adiabatic precooler 114, which precools the air upstream of the fluid cooling coil 116.

[0050] The operating mode 302 of method 300 includes a dry cooling and chiller unit mode 309, in which the chiller unit 130 operates and the process fluid flows through the chiller unit evaporator 134 to be cooled, as shown by reference numeral 311. Furthermore, in the dry cooling and chiller unit mode 309, a portion of the cooled process fluid flows through the PCM tank 138 to charge the PCM tank 138, as shown by reference numeral 313.

[0051] Operating mode 302 includes an adiabatic cooling mode 317, in which the chiller unit 130 is shut down. However, in adiabatic cooling mode 317, process fluid cooled by the fluid cooling coil 116 flows to the PCM tank 138 to charge the PCM tank 138, as indicated by reference numeral 319. Operating mode 302 also includes an adiabatic cooling and chiller unit mode 321, in which process fluid cooled by the fluid cooling coil 116 and the chiller unit evaporator 134 is directed to the PCM tank 138 to charge the PCM tank 138, as indicated by reference numeral 323.

[0052] refer to Figure 7A and Figure 7B The controller 113 can utilize method 330 in response to receiving a request to minimize energy consumption and to allow the PCM tank 138 to be refrigerated. Method 330 includes an operating mode 332, which the controller 113 progressively advances in response to an increase in the heat load 334 of the heat transfer device 110.

[0053] Reference Figure 8 A heat transfer device 350 is provided as a second example of the heat transfer device 10 described above. The heat transfer device 350 has a process fluid heat exchange loop 351 that receives and cools a high-temperature process fluid from a cooling load 353, such that the process fluid heat exchange loop 351 can return the cooled process fluid to the cooling load 353 at, for example, a process fluid set temperature. The heat transfer device 350 is similar to the heat transfer device 110 in many respects, except that the heat transfer device 350 lacks a closed-loop pump and associated valving for circulating secondary process fluid in a closed loop to recharge and cool the PCM tank 368. The heat transfer device 350 includes an adiabatic precooler 352 having an evaporative liquid distribution system 354 for distributing evaporative liquid to a precooling pad 356, and a pump 358 for a collection tank 360 for pumping the collected evaporative liquid to the precooling pad 356. The heat transfer device 350 also includes a fluid cooling coil 362, a fan 364, a chiller unit 366, and a PCM tank 368.

[0054] about Figure 9A and Figure 9B A method 380 is provided, in which the controller 370 of the heat transfer device 350 can use method 380 in response to receiving a request to minimize water consumption and to allow the PCM tank 368 to be cooled. Method 380 includes a mode 382, ​​which the controller 370 progressively advances according to logic 384 as the heat load 386 varies between an initial or low level 388 and a maximum or high level 390. Method 380 includes a variable 392 indicating the state of the components of the heat transfer device 350 as they vary under different modes 382.

[0055] about Figure 10A and Figure 10B A method 400 is provided, which the controller 370 can implement in response to receiving a request to minimize energy consumption and the PCM tank 368 being able to release coolant. Method 400 includes a mode 402, which the controller 370 progressively advances according to logic 404 as the heat load 406 of the heat transfer device 350 changes. Method 400 includes variables 403 for the components of the heat transfer device 350, which vary according to different operating modes 402.

[0056] Refer to Figure 11 and Figure 11B A method 410 is provided, which the controller 370 can utilize in response to receiving a request to minimize water consumption and to enable the PCM tank 368 to be charged and cooled. Method 410 has a mode 412, which the controller 370 progressively advances as the heat load 406 of the heat transfer unit 350 changes. Method 410 has variables 415 for the components of the heat transfer unit 350, which vary according to different operating modes 412. One difference between methods 300 and 410 is that method 410 uses process fluid received from cooling load 353 to charge and cool the PCM tank 368, instead of utilizing a closed-loop circulation of secondary process fluid. In this way, the cooling provided by the fluid cooling coil 362 and / or chiller unit 366 can be used both to cool the process fluid and to charge and cool the PCM tank 368. The operational difference is due to the absence of a closed-loop pump in the heat transfer unit 350.

[0057] about Figure 12A and Figure 12B A method 420 is provided, in which controller 370 can implement the method in response to receiving a request to minimize energy consumption and to enable the PCM tank 368 to be charged and cooled. Method 420 includes an operating mode 422, which controller 370 switches between when the heat load 424 of the heat transfer device 350 changes. Method 420 includes variables 426 of the components of the heat transfer device 350, which vary according to the different modes 422. In method 420, the PCM tank 368 is charged and cooled using a process fluid in communication with the cooling load 353, instead of a closed-loop charging and cooling operation as described in method 330 above.

[0058] Reference Figure 13A heat transfer device 430 is provided as a third example of the heat transfer device 10 described above. The heat transfer device 430 is similar to the heat transfer device 110 described above in many respects. The heat transfer device 430 has a process fluid heat exchange loop 431, which can operate in different modes to, for example, cool process fluid from a cooling load 433 and supply process fluid to the cooling load 433 at a desired process fluid set temperature. The cooling load 433 may be, for example, a computer data center or other industrial process.

[0059] The heat transfer device 430 includes a secondary closed-loop pump 432 and valves 434, 436 to facilitate the charging and cooling of the PCM tank 438, as discussed in more detail below. The heat transfer device 430 includes an adiabatic precooler 440 having a precooling pad 442, a collection pool 444, and a pump 446 for pumping collected evaporation liquid to the precooling pad 442. The heat transfer device 430 also includes a fluid cooling coil 448, a fan 450, and a cooler 452 (with a condenser 454 and an evaporator 456). The fan 450 is operable to draw air 458 through the precooling pad 442 and the fluid cooling coil 448. The heat transfer device 430 includes a main closed-loop pump 460 and valves 462, 464. The heat transfer device 430 has a controller 466 for operating the components of the heat transfer device 430 in different modes.

[0060] For example, controller 466 can operate heat transfer device 430 in mode 1, such as... Figure 14 As shown. Figure 14 The adiabatic precooler 440 and fan 450 are not shown to provide a less obstructed view. In Mode 1, controller 466 operates valves 470, 472, 474, and 476 of the process fluid heat exchange loop 431 to bypass chiller 452 and PCM tank 438. In Mode 1, the process fluid from cooling load 433 is cooled solely through heat exchange between the airflow blown by fan 450 across fluid cooling coil 448. In Mode 1, the adiabatic precooler 440 can be operated as needed to provide adiabatic cooling by reducing the dry-bulb temperature of the air upstream of fluid cooling coil 448.

[0061] The heat transfer device 430 has mode 2, such as Figure 15As shown. In mode 2, valve 470 receives process fluid at inlet 470A and regulates the flow of process fluid through valve 470 such that a portion of the process fluid is directed to the condenser 454 of chiller unit 452, while the remainder bypasses the condenser 454. Valve 472 receives heated process fluid from condenser 454 at inlet 472A and process fluid from cooling load 433 at inlet 472B. Valve 472 merges the process fluid flows at outlet 472C, which supplies the mixed process fluid to fluid cooling coil 448. Valve 470 can be adjusted to direct more or less process fluid to condenser 454 as needed to promote adequate cooling of evaporator 456 of chiller unit 452.

[0062] The adiabatic precooler 440 can be operated as needed to reduce the dry-bulb temperature of the air upstream of the fluid cooling coil 448. The fluid cooling coil 448 exchanges heat between the process fluid and the airflow to provide the cooled process fluid to valve 474. Valve 474 regulates the flow of process fluid between outlets 474B and 474C. Outlet 474C directs the cooled process fluid to the evaporator 456 of the chiller unit 452, where the evaporator 456 further cools the process fluid. The process fluid from outlet 474B bypasses the evaporator 456 and the PCM tank 438 before reaching valve 476. Valve 476 merges the process fluid flows received at inlets 476A and 476B into a single flow that travels from outlet 476C of valve 476 to the cooling load 433. In this way, a portion of the cooling load is handled by the fluid cooling coil 448 (and the adiabatic precooler 440 as needed), while a portion is handled by the chiller unit 452. Mode 2 can be used under high load or high ambient air temperature conditions, and / or when the PCM tank 438 is fully cooled, as a way to meet the cooling load required by the heat transfer unit 430. Mode 2 can also be used to save water by reducing the cooling load required by the adiabatic precooler 440 and the fluid cooling coil 448 by providing cooling capacity through the chiller unit 452. More specifically, Mode 2 allows for a reduction in the speed of the fan 450, thereby reducing the water evaporation rate of the pads or other insulation media in the adiabatic precooler 440.

[0063] about Figure 16The controller 466 can operate the heat transfer unit 430 in mode 3, where valves 470 and 480 bypass the process fluid flow around the chiller unit 452. Valve 474 directs a portion of the process fluid from the fluid cooling coil 448 to the PCM tank 438, while the remaining process fluid bypasses the PCM tank 438. In this way, in mode 3, a portion of the cooling load 433 is handled as needed by the fluid cooling coil 448 and the adiabatic precooler 440, while another portion of the cooling load 433 is handled by the release of heat from the PCM tank 438. Mode 3 can be used under extremely high cooling load conditions, high ambient air temperatures, and / or can be used to save energy and / or water by reducing the load on the fluid cooling coil 448, fan 450, and adiabatic precooler 440.

[0064] about Figure 17 The controller 466 can operate in mode 4, where valve 470 directs at least a portion of the process fluid from cooling load 433 to the condenser 454 of chiller 452. Valve 474 regulates the flow of the process fluid such that a portion flows to the evaporator 456 of chiller 452, while the remaining process fluid bypasses chiller 452 and PCM tank 438. Furthermore, valves 482 and 483 direct process fluid from evaporator 456 to PCM tank 438, while valve 484 combines the cooled process fluid from PCM tank 438 with the process fluid from fluid cooling coil 448. In mode 4, a portion of the cooling load is handled by fluid cooling coil 448 and optional adiabatic precooler 440, a portion by chiller 452, and a portion by PCM tank 438. Mode 4 can be used under high cooling load conditions and high ambient air temperature conditions as a way to meet cooling load requirements, and / or can be used to save water by reducing the load on the fluid cooling coil 448 and the adiabatic precooler 440, or to save energy by reducing the load on the fan 450.

[0065] about Figure 18The controller 466 can operate the heat transfer device 430 in mode 5, wherein there is a first loop 490 of process fluid traveling between the cooling load 433 and the fluid cooling coil 448, and a second loop 492 of closed-loop process fluid circulating between the evaporator 456 of the chiller unit 452 and the PCM tank 438 via the main closed-loop pump 460. Valve 470 directs a portion of the process fluid from the cooling load 433 through the condenser 454, allowing this portion of the process fluid to absorb heat from the condenser 454 before reaching the fluid cooling coil 448. The fluid cooling coil 448 is used to absorb heat from the cooling load 433 and the recharge cooling process of the PCM tank 438. The adiabatic precooler 440 can be activated in mode 5 to increase the cooling capacity of the fluid cooling coil 448 as needed. Mode 5 can be used to recharge a fully or partially depleted PCM tank 438 while continuing to remove heat from the cooling load 433.

[0066] about Figure 19A The controller 466 can operate the heat transfer device 430 in mode 6, wherein the process fluid heat exchange loop 431 has a similar Figure 18 The closed loop 492 includes a primary closed loop 510 and a secondary closed loop 511. More specifically, valves 434 and 436 are closed to the cooling load 433, and the secondary closed loop pump 432 circulates the secondary closed loop process fluid 500 between the condenser 454 and the fluid cooling coil 448 of the chiller unit 452, so that the fluid cooling coil 448 removes the heat added to the secondary closed loop process fluid 500 by the condenser 454.

[0067] In Mode 6, the main closed-loop pump 460 circulates the secondary process fluid 512 between the evaporator 450 and the PCM tank 438 throughout the main closed loop 510. In this way, the evaporator 450 removes heat from the main closed-loop process fluid and then uses it to charge the PCM tank 438. When the heat transfer unit 430 is not required to meet the cooling load 433 (e.g., at night), Mode 6 can be used to recharge a fully or partially depleted PCM tank 438. The adiabatic precooler 440 can be operated as needed to provide increased cooling capacity.

[0068] about Figure 19BThe controller 466 can operate the heat transfer unit 430 in mode 7, wherein valve 474 regulates the flow of process fluid from the fluid cooling coil 448 to the bypass line 475 and to valve 485. Valve 485 further regulates the flow of process fluid to the PCM tank 438 and the evaporator 456 of the chiller unit 452. The cooled process fluids from the evaporator 456 and PCM tank 438 are combined at valve 487 and directed to valve 484. Valve 484 mixes the process fluid flow from valve 487 with the process fluid flow from the bypass line 475 and directs the mixed process fluids to the cooling load 433. The mixing of process fluids 484 raises the temperature of the process fluids to a temperature acceptable to the cooling load 433.

[0069] exist Figure 19B In Mode 7, the evaporator 456 and the PCM tank 438 are connected in parallel. In Mode 4, the evaporator 456 and the PCM tank 438 are connected in series. Mode 4 can be used when there is a high temperature difference (e.g., greater than 20°F) between the process fluid return temperature (the temperature of the process fluid received from the cooling load 433) and the process fluid supply temperature (the temperature of the process fluid supplied by the heat transfer device 430 to the cooling load 433). In contrast, Mode 7 can be used when there is a low temperature difference (e.g., equal to or less than 10°F). When the temperature difference is in the range of 11°F to 19°F, the controller 466 can select either Mode 4 or Mode 7 based at least in part on the desired process fluid supply temperature, the PCM melting temperature, and the flow ratio between the different components of the process fluid heat exchange loop 431.

[0070] For example, in 19B, there is a 9°F temperature difference between the process fluid return temperature of 93°F and the process fluid supply temperature of 84°F. Therefore, controller 466 can decide to operate heat transfer device 430 in mode 7 instead of mode 4. Mode 7 may work better for smaller temperature differences between the process fluid return and supply temperatures because the temperature difference across evaporator 456 and PCM tank 438 is greater than the temperature difference when evaporator 456 and PCM tank 438 are connected in series. More specifically, when there is a small temperature difference (e.g., less than 5 degrees) between the process fluid temperatures entering and leaving evaporator 456, the efficiency of evaporator 456 may be low. Similarly, when there is a small temperature difference (e.g., less than 5 degrees) between the process fluid temperatures entering and leaving PCM tank 438, the efficiency of PCM tank 438 may be low. Operating in mode 7 thereby increases the temperature difference across evaporator 456 and PCM tank 438, which improves efficiency when there is a small temperature difference between the return and supply process fluid temperatures.

[0071] about Figure 19CWhen the ambient air temperature is low, controller 466 can operate heat transfer unit 430 in mode 8. More specifically, fluid cooling coil 448 receives 90°F process fluid and provides 50°F cooling process fluid. The 50°F process fluid may be too cold for cooling load 433. Valve 484 mixes 58°F process fluid from PCM tank 438 with the 50°F process fluid from fluid cooling coil 448. Valve 436 mixes 90°F process fluid from valve 434 with the cooler process fluid from valve 484 to deliver 80°F process fluid to cooling load 433. The heated process fluid bypass provided by valves 434 and 436 raises the temperature of the process fluid to meet the minimum temperature requirements of cooling load 433 while allowing PCM tank 438 to be charged and cooled.

[0072] about Figure 19D When there is no cooling load 433, controller 466 can operate heat transfer unit 430 in mode 9. Since cooling load 433 requires no cooling, valves 434 and 436 are configured to stop or restrict the flow of process fluid to / from cooling load 433. In mode 9, valves 470 and 485 are configured to allow process fluid to bypass condenser 454 and evaporator 456. Furthermore, in mode 9, valves 487 and 489 facilitate the circulation of process fluid between secondary closed-loop pump 432 and fluid cooling coil 448 and PCM tank 438. In this way, fluid cooling coil 448 can operate to charge PCM tank 438 in the absence of cooling load 433. Process fluid heat exchange loop 431 includes bypass line 491 to allow process fluid to be used when secondary closed-loop pump 432 is not in use (e.g., mode 8, see...). Figure 19C The flow bypasses the secondary closed-loop pump 432.

[0073] like Figure 19E As shown, when the cooling capacity of fan 450, adiabatic cooler 440, and / or chiller unit 452 is limited or nonexistent (e.g., when heat transfer device 430 is operated to save energy, or when heat transfer device 430 malfunctions), controller 466 can operate heat transfer device 430 in mode 10. Figure 19E As shown, in mode 10, the process fluid heat exchange circuit 431 includes valves 495 and 497 to allow the process fluid to bypass the fluid cooling coil 448. Additionally, in mode 10, valves 470 and 485 allow the process fluid to bypass the chiller unit 452. Therefore, in mode 10, the PCM tank 438 is releasing coolant to cool the process fluid according to the cooling load 433. The process fluid heat exchange circuit 431 has a bypass line 499 for allowing the process fluid to bypass the fluid cooling coil 448 in mode 10.

[0074] like Figure 19FAs shown, controller 466 can operate heat transfer device 430 in mode 11. Mode 11 is similar to... Figure 18 Mode 5. Mode 11 provides more efficient operation when the heat transfer device 430 supplies process fluid to the cooling load 433 at a lower supply temperature (e.g., below 84°F), while Mode 5 provides more efficient operation when the heat transfer device 430 supplies process fluid to the cooling load 433 at a higher supply temperature (e.g., equal to or above 84°F). Therefore, the controller 466 can select between Mode 5 and Mode 11 based on the supply temperature setpoint of the heat transfer device 430.

[0075] In mode 11, valve 482 directs a portion of the cooled process fluid from evaporator 456 to PCM tank 438 for recharging. Valve 482 also directs the remaining cooled process fluid from evaporator 456 to valves 487 and 484. Valve 484 mixes the process fluid from evaporator 456 with the process fluid from fluid cooling coil 448, and valve 474 allows the process fluid from fluid cooling coil 448 to bypass chiller 452 and PCM tank 438. In this way, mode 11 allows evaporator 456 and PCM tank 438 to supplement the cooling provided by fluid cooling coil 448, enabling heat transfer unit 430 to supply process fluid to cooling load 433 at a lower supply temperature setpoint (e.g., 72°F).

[0076] refer to Figures 23C to 23F The controller 466 may operate the heat transfer device 430 according to method 457, wherein the controller 466 operates according to the following description... Figures 85 to 97 The discussed method 1900A, 1900B, 2100A, 2100B changes the heat transfer device 430 between operating modes 557. Alternatively, the controller 466 can be configured according to the following description... Figures 98A to 98D Method 2500 is discussed, which involves changing the heat transfer device 430 between operating modes 557.

[0077] For each of the operating modes 557, method 557 includes variables 559 for the components of heat transfer device 430. Variable 559 includes variable 559A indicating whether secondary process fluid pump 432 is operating. Additionally, variable 559 includes variable 559B indicating that all process fluids are flowing through fluid cooling coil 448.

[0078] refer to Figure 20A and Figure 20BThe controller 466 can utilize method 520 in response to receiving a request to minimize water consumption and to allow the PCM tank 438 to release coolant. Method 520 includes an operating mode 522 and logic 524, with the controller 466 advancing through operating mode 522 in response to changes in the heat load 526 of the heat transfer device 430 determined by the controller 466. Method 520 has variables 528 for the components of the heat transfer device 430, which vary as the heat transfer device 430 changes between modes 522.

[0079] about Figure 21A and Figure 21B The controller 466 can respond to a request to minimize energy consumption and for the PCM tank 438 to release coolness using method 530. Method 530 includes an operating mode 532 and logic 534, with the controller 466 using logic 534 to advance through operating mode 532 as the heat load 536 of the heat transfer device 430 changes.

[0080] about Figure 22A and Figure 22B The controller 466 can utilize method 540 in response to receiving a request to minimize water consumption and to enable the PCM tank 438 to be cooled. Method 540 includes an operating mode 542 through which the controller 466 can proceed as the heat load 544 of the heat transfer device 430 changes. Method 540 has variables 545 of the components of the heat transfer device 530 that vary as the heat transfer device 530 changes between modes 542. Mode 542 includes a closed-loop dry cooling mode 546 according to mode 6 of FIG. 19, in which the adiabatic precooler 440 is not operating. In one embodiment, the heat transfer device 430 includes an actuator to move the adiabatic precooler 440 from an operating position to a bypass position, in which the pad of the adiabatic precooler 440 is located in the airflow path through the heat transfer device 430, and in the bypass position, the pad is not in the airflow path. When the pad is in the bypass position, the energy consumption of the fan 450 can be reduced. Operating mode 542 also includes a closed-loop adiabatic cooling mode 548 corresponding to mode 6 in Figure 19, in which the adiabatic precooler 440 is in operation. In either mode 546 or 548, the heat transfer device 430 is isolated from the cooling load 433 and can charge the PCM tank 438.

[0081] about Figure 23A and Figure 23BThe controller 466 can utilize method 550 in response to receiving a request to minimize energy and to enable the PCM tank 438 to be charged and cooled. Method 550 includes an operating mode 552 through which the controller 466 can proceed when the heat load 554 of the heat transfer device 430 changes. Method 550 includes variables 556 of the components of the heat transfer device 430, which vary as the heat transfer device 430 is reconfigured between operating modes 552. Operating mode 552 includes a closed-loop adiabatic cooling mode 558, which generally corresponds to mode 6 in FIG. 19, and an adiabatic precooler is operated to improve the efficiency of the fluid cooling coil 448.

[0082] about Figure 24 The heat transfer device 560 is Figure 1 The fourth example of the heat transfer device 10. The heat transfer device 560 is structurally and operationally similar to the heat transfer device 350 discussed above. One difference is that the heat transfer device 560 has a heat exchanger 562, which includes a direct heat exchanger 564 having an evaporative liquid distribution system 566 for distributing evaporative liquid to packing material 568, a collection tank 570 for collecting the evaporative liquid, and a pump 572 for pumping the collected evaporative liquid back to the packing material 568. The heat transfer device 560 has a fan 574 that generates an airflow 576 relative to the direct heat exchanger 554, such that the evaporative liquid is cooled as it travels along the packing material 568 and comes into contact with the airflow 576. The pump 572 transports the cooled evaporative liquid from the collection tank 570 to an indirect heat exchanger 580 of the heat exchanger 562. Indirect heat exchanger 580 transfers heat between the liquid for evaporation and the process fluid 582 received from the cooling load 584.

[0083] about Figure 25 A heat transfer device 590 is provided as a fifth example of the heat transfer device 10 described above. The heat transfer device 590 is similar to the heat transfer device 560 discussed above. One difference between the heat transfer devices 560 and 590 is that the heat transfer device 590 has a direct heat exchanger 592 that directly transfers heat from the process fluid 594 received from the cooling load 596 to the airflow 598 generated by the fan 600. The direct heat exchanger 592 may include, for example, packing sheets and / or packing blocks. Drip packing, splash packing, or no-packing methods may be used.

[0084] about Figure 26A heat transfer device 610 according to the second method is provided. The heat transfer device 610 includes a heat exchanger 612 having an adiabatic precooler 614 with an insulating pad 616 and an indirect heat exchanger (e.g., a fluid cooling coil 618). The heat transfer assembly 610 also includes a cold storage device (e.g., a PCM tank 620) to provide regulated cooling to the heat transfer device 610 as needed to meet the heat load on the heat transfer device 610. The heat transfer device 610 has one or more air inlets 622, one or more air outlets 624, and a fan 626 operable to move air from the air inlet 622 through the precooling pad 616 and the fluid cooling coil 618 to the air outlet 624.

[0085] about Figure 27 A more detailed schematic diagram of the heat transfer device 610 is provided. The heat transfer device 610 is similar in many respects to the heat transfer device 10 discussed above, except that the heat transfer device 610 lacks the chiller unit 28. The heat transfer device 610 includes an external structure, such as a housing 630, which contains a heat exchanger 612, a process fluid distribution system 632, a controller 634, and a PCM tank 620. The PCM tank 620 contains a phase change material with a melting temperature, for example, greater than 65°F. The heat transfer device 610 has a process fluid inlet 636 for receiving heated process fluid from a cooling load; and a process fluid outlet 638 for returning cooled process fluid to the cooling load.

[0086] about Figure 28 The heat transfer device 640 is Figure 26 A first example of a heat transfer device 610. The heat transfer device 640 has a process fluid heat exchange loop 641 for receiving heated process fluid from a cooling load 654 and returning cooled process fluid to the cooling load 654. The process fluid heat exchange loop 641 includes an adiabatic precooler 642, a fluid cooling coil 644, a closed-loop pump 646, a PCM tank 648, and a controller 650. Because the heat transfer device 640 lacks features such as... Figure 13 The chiller unit 452 is a chiller unit, so the heat transfer device 640 uses the adiabatic precooler 642 and the fluid cooling coil 644 to provide cooling for the process fluid from the cooling load 654 and to recharge the PCM tank 648.

[0087] about Figure 29 The heat transfer device 640 has a mode 1, in which the controller 650 operates the heat transfer device 640 such that heated process fluid from the cooling load 654 travels to the fluid cooling coil 644 and is returned to the cooling load 654, bypassing the PCM tank 648. When the controller 650 is in mode 1, the adiabatic precooler 642 can be operated to reduce the dry-bulb temperature of the air in contact with the fluid cooling coil 644, thereby providing enhanced cooling capacity to the heat transfer device 640.

[0088] about Figure 30 The heat transfer device 640 has a mode 2, in which both the fluid cooling coil 644 and the PCM tank 648 handle the cooling load 654. The process fluid heat exchange loop 641 includes a valve 660 that regulates the process fluid flow from the fluid cooling coil 644, causing a portion of the process fluid to travel to the PCM tank 648 and be cooled upon release from the PCM tank 648. In this way, the PCM tank 648 can be released during peak heat loads to supplement the cooling provided by the fluid cooling coil 644. When the controller 650 is in mode 2, the adiabatic precooler 642 can be operated to reduce the dry-bulb temperature of the air in contact with the fluid cooling coil 644, thereby providing enhanced cooling capacity to the heat transfer device 640.

[0089] about Figure 31 The heat transfer device 640 has a mode 3, in which valve 662 regulates the flow of process fluid from cooling load 654, such that a portion 664 of the process fluid from cooling load 654 is directed to valve 666 for mixing with process fluid from fluid cooling coil 644 and PCM tank 648. In mode 3, an adiabatic precooler 642 can be used to lower the temperature of the process fluid leaving fluid cooling coil 644. Because the process fluid from fluid cooling coil 644 is at a lower temperature, PCM tank 648 can be precooled. The process fluid leaving fluid cooling coil 644 and PCM tank 648 is merged with the circulating process fluid 664 via valve 666, so that the process fluid returning to cooling load 654 still has the same return temperature as in mode 2. Mode 3 can be used when environmental and load conditions allow fluid cooling coil 644 to significantly cool the process fluid. The process fluid recirculation section 664 is used to raise the temperature of the process fluid from the fluid cooling coil 664 and the PCM tank 648, and to ensure that the process fluid is returned to the cooling load 654 at the requested process fluid set temperature.

[0090] about Figure 32 The heat transfer device 640 has a mode 4, in which valves 670 and 672 are closed to the cooling load 654, and the closed-loop pump 646 is operated to circulate the closed-loop fluid 674 between the fluid cooling coil 644 and the PCM tank 648 for recharging the PCM tank 648. The adiabatic precooler 642 can be operated or not operated as needed for specific situations. By not operating the adiabatic precooler 642, the controller 650 reduces the water consumption of the heat transfer device 640. By operating the adiabatic precooler 642 in mode 4, the controller 650 can minimize the energy consumption of the heat transfer device 640.

[0091] about Figure 33The controller 650 can utilize method 690 in response to receiving a request to minimize water consumption and for the PCM tank 648 to release coolant. As the heat load 696 of the heat transfer device 640 changes, the controller 650 uses logic 694 to switch between operating modes 692. Method 690 includes variables 698 for the components of the heat transfer device 640, which change as the controller 650 switches between different modes 692.

[0092] about Figure 34 The controller 650 can utilize method 700 in response to receiving a request to minimize energy consumption and to allow the PCM tank 648 to release coolness. Method 700 includes an operating mode 702 and logic 704, with the controller 650 using logic 704 to change between modes 702 as the heat load 706 of the heat transfer device 640 changes. Method 700 includes a variable 708 for the heat transfer device 640, which changes as the controller 650 changes between modes 702.

[0093] about Figure 35 The controller 650 can respond to a request to minimize water consumption and enable the PCM tank 648 to store cold using method 710. Method 710 includes mode 712, which the controller 650 can switch between as the heat load 714 of the heat transfer device 640 changes. Mode 712 includes... Figure 32 The closed-loop dry cooling mode 716, similar to mode 4 shown, involves a closed-loop pump 646 operating and closed-loop fluid circulating between the fluid cooling coil 644 and the PCM tank 648 to recharge the PCM tank 648. In closed-loop dry cooling mode 716, the adiabatic precooler 742 is off. In contrast, operating mode 712 includes... Figure 32 Mode 4 is similar to closed-loop adiabatic cooling mode 718, in which adiabatic precooler 642 is in operation.

[0094] about Figure 36 The controller 650 can utilize method 720 in response to receiving a request to minimize energy consumption and to enable the PCM tank 648 to be refrigerated. Method 720 includes an operating mode 722, which the controller 650 can switch between in response to changes in the heat load 724 of the heat transfer device 640. Method 720 includes a variable 726 for the heat transfer device 640, which varies as the heat transfer device 640 switches between modes 722.

[0095] about Figure 37A heat transfer device 730 is provided as a second example of the heat transfer device 610 described above. The heat transfer device 730 is similar to the heat transfer device 640 in many respects, except that the heat transfer device 730 lacks the closed-loop pump 646. The heat transfer device 730 includes a process fluid heat exchange loop 731, which includes an adiabatic precooler 732, a fluid cooling coil 734, a fan 736, and a PCM tank 741. The heat transfer device 730 has a controller 738 that operates the process fluid heat exchange loop 731 to return the process fluid to the cooling load 740 with specific process fluid variables (e.g., temperature, flow rate, pressure, or combinations thereof). When the PCM tank 741 is operated to meet maximum heat load conditions, the PCM tank 741 removes heat from the process fluid to appropriately reduce water consumption or energy consumption.

[0096] about Figure 38 The processor 738 can respond to a request to minimize water consumption and to allow the PCM tank 740 to be cooled using method 750. Method 750 includes mode 752 and logic 754, with the controller 738 using logic 754 to switch between modes 752 as the heat load 756 of the heat transfer device 730 changes. Method 750 includes variables 760 for the components of the heat transfer device 730, which change as the heat transfer device 730 switches between modes 752.

[0097] about Figure 39 The controller 738 can utilize method 770 in response to receiving a request to minimize energy consumption and to allow the PCM tank 741 to release coolness. Method 770 includes an operating mode 772 and logic 774 for the heat transfer device 730, with the controller 738 using logic 774 to switch between operating modes 772 as the heat load 776 of the heat transfer device 730 changes. Method 770 includes variables 778 for the components of the heat transfer device 730, which change as the controller 738 switches between modes 772.

[0098] about Figure 40 The controller 738 can utilize method 780 in response to receiving a request to minimize water consumption and to enable the PCM tank 741 to be refrigerated. Method 780 includes an operating mode 782, which the controller 738 switches between as the heat load 784 of the heat transfer device 730 changes. Method 780 includes variables 786 for the components of the heat transfer device 730, which vary as the heat transfer device 730 switches between modes 782.

[0099] about Figure 41The controller 738 can respond to a request to minimize energy consumption and the PCM tank 748 can be charged and cooled using method 790. Method 790 includes a controller 738 with an adiabatic cooling mode 792, wherein the adiabatic precooler 732 has a collection tank pump 794 (see...). Figure 37 The valve 796 is opened, and at least a portion of the cooler process fluid is directed to the PCM tank 741 to charge the PCM tank 741.

[0100] about Figure 42 The heat transfer device 800 is a third example of the heat transfer device 610 described above. The heat transfer device 800 is similar to the heat transfer device 640 described above, except that the heat transfer device 800 has a direct heat exchanger 802 for transferring heat between the airflow 804 generated by the fan 806 and the evaporation liquid. The evaporation liquid is collected and guided through an indirect heat exchanger 808 to transfer heat between the process fluid received from the cooling load 810 and the evaporation fluid of the direct heat exchanger 802.

[0101] about Figure 43 The heat transfer device 810 is a fourth example of the heat transfer device 610 described above. The heat transfer device 810 is similar to the heat transfer device 640, except that the heat transfer device 810 has a direct heat exchanger 812 for transferring heat between the airflow 814 generated by the fan 816 and the process fluid received from the cooling load 818.

[0102] about Figure 44 A heat transfer device 850 is provided according to a third method of this disclosure. The heat transfer device 850 includes a housing 851 having one or more air inlets 854, one or more air outlets 857, and one or more fans 859 for generating an airflow 859 from the air inlets 854 to the air outlets 856. The air inlets 854 include primary louvers 856 and secondary louvers 858, which are selectively closed to restrict the airflow path through the heat transfer device 850. For example, the primary louvers 856 can be closed, while the secondary louvers 858 can be opened to allow air to bypass the membrane vacuum dehumidification system 860.

[0103] The heat transfer device 850 includes one or more dehumidifiers, such as a membrane vacuum dehumidification system 860, for removing water from the airflow in region 862 upstream of an adiabatic precooler 864 with a precooling pad 866. The heat transfer device 850 includes a heat exchanger, such as a fluid cooling coil 868 downstream of the precooling pad 866. The membrane vacuum dehumidification system 860 removes water from the air and lowers the wet-bulb temperature. The precooling pad 866 cools the air upstream of the fluid cooling coil 868 and lowers the dry-bulb temperature to very close to the wet-bulb temperature. The dry, cooled air in contact with the fluid cooling coil 868 provides more efficient heat transfer between the airflow 859 and the fluid cooling coil 868.

[0104] about Figure 45 The heat transfer device 880 is Figure 44 A first example of a heat transfer device 850. The heat transfer device 880 includes a main louver 882, a secondary louver 884, and a process fluid cooling system 881. The process fluid cooling system 881 includes a membrane vacuum dehumidification system 886, an adiabatic precooler 888, a fluid cooling coil 890, and a fan 892. The heat transfer device 880 also includes a vacuum pump 894 for the membrane vacuum dehumidification system 886 and a controller 896 for controlling the operation of the heat transfer device 880. The adiabatic precooler 888 includes a precooling pad 900, an evaporative liquid distribution system 902, a collection tank 904, and a collection tank pump 906. The heat transfer device 880 includes a water collection system 910 with a condensate pump 912 that guides water collected and condensed from the membrane vacuum dehumidification system 886 to the collection tank 904. In this way, the heat transfer device 880 can utilize at least a portion of the water collected from the membrane vacuum dehumidification system 886 as makeup water for the collection tank 904, which reduces the water consumption of the heat transfer device 880. The fluid cooling coil 890 receives hot process fluid from the cooling load 916 and returns cooled process fluid to the cooling load 916. When the main louver 882 is open and the secondary louver 884 is closed, the fan 892 is operable to guide air along a first path 920. When the main louver 882 is closed and the secondary louver 884 is open, operating the fan 892 causes air to enter the secondary louver 884 along a second path 922. The membrane vacuum dehumidification system 886 and the adiabatic precooler 888 can be selectively operated to increase the heat transfer efficiency between the fluid cooling coil 890 and the airflow through the heat transfer device 880.

[0105] about Figures 46 to 50 The diagram illustrates the heat transfer device 880 in different modes to demonstrate its varying cooling capabilities. (About...) Figure 46 The heat transfer device 880 is in mode 1, in which the main louver 882 is open, the secondary louver 920 is closed, the membrane vacuum dehumidification system 886 is in operation, the adiabatic precooler 888 is in operation, and the fluid cooling coil 890 transfers heat between the airflow and the process fluid from the cooling load 916.

[0106] about Figure 47 In mode 2, the heat transfer device 880 is in mode 2, with the main louvers 882 closed and the secondary louvers 884 open, allowing airflow to bypass the membrane vacuum dehumidification system 886. The air travels along the second flow path 922 through the precooling pad 900 and reaches the fluid cooling coil 890. In mode 2, the adiabatic precooler 888 operates, causing the precooling pad 900 to lower the dry-bulb temperature of the airflow upstream of the fluid cooling coil 890.

[0107] about Figure 48 In mode 3, the heat transfer device 880 is in operation with the main louvers 882 closed, the secondary louvers 884 open, and air entering the heat transfer device 880 via the second flow path 922 and bypassing the membrane vacuum dehumidification system 886. In mode 3, the liquid collection pump 906 is shut off, preventing the evaporative liquid distribution system 902 from directing liquid onto the precooling pad 900. In this way, the air in the upstream region 930 of the fluid cooling coil 890 has the same wet-bulb and dry-bulb temperatures as ambient air. Mode 3 can be used when the cooling load on the heat transfer device 880 is low, or when the heat transfer device 880 is operated to minimize energy consumption.

[0108] about Figure 49 In mode 4, the heat transfer device 880 is in operation with the main louver 882 open and the secondary louver 884 closed. A fan 892 draws air into the heat transfer device 880 along a first flow path 920. A membrane vacuum dehumidification system 886 operates to reduce the humidity of the air upstream of the precooling pad 900. The adiabatic precooler 888 is closed, ensuring that the airflow has similar wet-bulb and dry-bulb temperatures before and after the precooling pad 900. Therefore, in mode 4, the heat transfer device 880 utilizes the membrane vacuum dehumidification system 886 to dry the air upstream of the fluid cooling coil 890. Mode 4 can be used when the heat transfer device 880 is operated to minimize water consumption.

[0109] about Figure 50 The controller 896 can utilize method 940 in response to receiving a request to minimize energy consumption. As the required heat load 944 of the heat transfer device 880 changes, the heat transfer device 880 can switch between operating modes 942. Method 940 has variables 946 for the components of the heat transfer device 880, which change as the controller 896 switches between operating modes 942. Variable 946 may include a variable 947 indicating the operation of the condensate pump 912. In operating mode 942, the condensate pump 912 is shut off to save energy.

[0110] about Figure 51 The controller 896 can execute method 950 in response to receiving a request to minimize water consumption. As the heat load 954 of the heat transfer device 880 changes, the heat transfer device 880 switches between operating modes 952. Method 950 includes a variable 956 that varies as the heat transfer device 880 changes between operating modes 952.

[0111] In method 950, when the heat transfer device 880 is in dry cooling mode 958, the liquid collection tank pump 906 is shut off to conserve water. However, when the heat load increases and the controller 896 changes to adiabatic cooling and membrane vacuum dehumidification mode 960, the liquid collection tank pump 906 operates to provide additional adiabatic cooling to the air and increase the cooling capacity of the heat transfer device 880.

[0112] about Figure 52 The controller 896 can execute method 960 in response to receiving a request to generate water via the membrane vacuum dehumidification system 886. Method 960 includes modes 962, which the controller 896 switches between as the heat load 964 of the heat transfer device 880 changes. Method 960 includes variables 966 representing the state of the components of the heat transfer device 880, which change as the heat transfer device 880 switches between operating modes 962. Variable 966 includes a variable 968 indicating whether the condensate pump 912 is operating. Since the controller 896 has received a request to generate water, the condensate pump 912 operates in both operating modes 962.

[0113] about Figure 53 The heat transfer device 980 is a second example of the heat transfer device 850 described above. The heat transfer device 980 includes a main louver 982, a secondary louver 984, and a tertiary louver 986, which are selectively operable as needed to bypass the membrane vacuum dehumidification system 988, the adiabatic precooler 990, or both, to select an operating mode. The membrane vacuum dehumidification system 988 includes a vacuum pump 992 for promoting air dehumidification and a condensate pump 994 for pumping condensed and collected water from the membrane vacuum dehumidification system 988 to the collection tank 996 of the adiabatic precooler 990. The adiabatic precooler 990 includes a liquid distribution system 998, a precooling pad 1000, and a collection tank pump 1002. The heat transfer device 980 also includes a controller 1004, a fan 1006, and a fluid cooling coil 1008 for receiving process fluid from the cooling load 1010.

[0114] about Figure 54 The controller 1004 can execute method 1020 in response to receiving a request to minimize energy consumption. Method 1020 includes an operating mode 1022, which the heat transfer device 980 can switch between as the heat load 1024 of the heat transfer device 980 changes. Method 1020 includes variables 1026 indicating the state of the components of the heat transfer device 980, which change as the heat transfer device 980 changes between modes 1022. Variable 1026 includes a variable 1028 indicating whether the three-stage louvers 986 are open or closed. In method 1020, when the controller 1004 is in either operating mode 1022, the three-stage louvers 986 are closed.

[0115] about Figure 55The controller 1004 can execute method 1030 in response to receiving a request to minimize water consumption. Method 1030 includes an operating mode 1032, which the heat transfer device 980 can switch between as the heat load 1034 changes. Method 1030 includes a variable 1034 for the heat transfer device 980, which changes as the controller 1004 switches between operating modes 1032. Operating mode 1032 includes a dry cooling operating mode 1036, in which the primary louvers 982 and secondary louvers 984 are closed, while the tertiary louvers 986 are open, as indicated by variables 1038, 1040, and 1042. By closing the primary louvers 982 and secondary louvers 984, air can bypass the membrane vacuum dehumidification system 988 and the adiabatic precooler 990, and instead contact the fluid cooling coil 1008 to remove heat from the process fluid from the cooling load 1010.

[0116] about Figure 56 The controller 1004 can execute method 1050 in response to receiving a request to generate water from the membrane vacuum dehumidification system 988. Method 1050 includes operating modes 1052 and 1054 with a variable 1056, which varies as the controller 1004 switches between operating modes 1052 and 1054. As indicated by variable 1058, the condensate pump 994 operates in either operating mode 1052 or 1054.

[0117] about Figure 57 The heat transfer device 1070 is a third example of the heat transfer device 850 described above. The heat transfer device 1070 is similar in many respects to the heat transfer devices 880 and 980 described above. The heat transfer device 1070 includes a main louver 1072 and a secondary louver 1074, as well as a fan 1076 that generates airflow within the heat transfer device 1070. The heat transfer device 1070 also includes a membrane vacuum dehumidification system 1078, an indirect heat exchanger 1080 (for transferring heat from the process fluid received from the cooling load 1082), and a direct heat exchanger 1084. The direct heat exchanger 1084 includes packing material 1086, a collection tank 1088, a liquid distribution system 1090, and a collection tank pump 1092. The collection tank pump 1092 circulates secondary liquid to the indirect heat exchanger 1080 to receive heat from the process fluid of the cooling load 1082. Liquid distribution system 1090 distributes (e.g., sprays) heated secondary liquid onto packing material 1086. As the secondary liquid travels along direct heat exchanger 1084, it is cooled by the airflow. The cooled secondary liquid is then pumped again from collection tank 1088 to indirect heat exchanger 1080.

[0118] about Figure 58The heat transfer device 1100 is a fourth example of the heat transfer device 850 described above. The heat transfer device 1100 is similar to the heat transfer device 1070 described above in many respects. One difference is that the heat transfer device 1100 includes a direct heat exchanger 1102, which receives process fluid from the cooling load 1104. The direct heat exchanger 1102 includes a process fluid distribution system 1108, which distributes (e.g., sprays) the process fluid onto the packing material 1110. The process fluid is cooled by the airflow through the direct heat exchanger 1102 and collected in a collection tank 1106. The direct heat exchanger 1102 has a collection tank pump 1108 to guide the cooled process fluid back to the cooling load 1104. The heat transfer device 1100 includes a fan 1120 operable to draw air through a main louver 1122 and a secondary louver 1124, which can be selectively closed to control the flow of air through the heat transfer device 1100.

[0119] refer to Figure 59 and Figure 60 A heat transfer device 1150 is provided, which has a process fluid heat exchange loop 1152 that receives process fluid from a cooling load 1154 and cools the process fluid to a desired temperature. The process fluid heat exchange loop includes a chiller 1154 and a heat exchanger 1156. The heat exchanger exchanges heat between the process fluid and ambient air. The heat exchanger 1156 may include an adiabatic precooler and an indirect heat exchanger. Figure 59 As shown, the heat transfer device 1150 has a chiller unit on-line mode, wherein valve 1158 of the process fluid heat exchange loop 1152 directs heat from the heat exchanger 1156 to the chiller unit 1154. The heat transfer device 1150 also includes, as shown... Figure 60 The chiller unit is shown in shutdown mode. In chiller unit shutdown mode, valve 1158 allows process fluid to bypass cooler 1154. This can be used when the heat load on heat transfer unit 1150 is low. Figure 60 The chiller unit is in shutdown mode.

[0120] refer to Figure 61The heat transfer device 1170 includes a housing 1172 having an air inlet 1174, an air outlet 1176, and one or more fans 1178 for generating airflow therebetween. The heat transfer device 1170 includes an adiabatic precooler 1180 with a precooling pad 1182, a finned coil 1184, and a condenser coil 1186 of a chiller unit 1188. The condenser coil 1186 and evaporator 1190 of the chiller unit 1188 are located within the housing 1192, and in one embodiment, the condenser coil 1186 is situated in the path of the air traveling between the air inlet 1174 and the air outlet 1176. In some embodiments, the condenser coil 1186 can eliminate plumes by heating humid air. Furthermore, since the condenser coil 1186 and evaporator 1190 are located within the housing 1192, the heat transfer device 1170 can have a compact construction. The finned coil 1184 receives hot process fluid from the return line 1194 and directs cooled process fluid to valve 1196. Valve 1196 regulates the flow of cooled process fluid from the finned coil 1184 to the evaporator 1190. The evaporator 1190 further cools the process fluid and directs the cooled process fluid along conduit 1198 to a cooled process fluid source 1200. Valve 1196 can regulate the flow of cooled process fluid from the finned coil 1184, allowing some, all, or no cooled process fluid from the finned coil 1184 to travel to the evaporator 1190. The chiller unit 1188 has an expansion valve 1202 and a compressor 1204, and uses refrigerant to remove heat from the process fluid in the evaporator 1190, and transfers the heat to the airflow via the condenser coil 1186. The heat transfer device 1170 lacks a cold storage device.

[0121] about Figure 62 and Figure 63 A heat transfer device 1220 is provided, comprising a chiller 1224 and a heat exchanger 1226, which operates to cool process fluid from a cooling load 1228. The chiller 1224 includes an evaporator 1230, a condenser 1240, a compressor 1242, and an expansion valve 1244. The heat transfer device 1220 has a pump 1250 that circulates the process fluid from the cooling load 1228 to the condenser 1240, the heat exchanger 1226, the evaporator 1230, and back to the cooling load 1228. The heat transfer device 1220 has, as shown in... Figure 62 The chiller unit is shown in an operating mode where compressor 1242 circulates refrigerant between evaporator 1230 and condenser 1240, facilitating heat transfer from the process fluid to the refrigerant at evaporator 1230. In this way, chiller unit 1224 further reduces the temperature of the process fluid from heat exchanger 1226. Heat transfer device 1220 also includes... Figure 63The chiller unit is shown in a shutdown mode, where compressor 1242 does not circulate refrigerant between evaporator and condenser 1240. However, pump 1250 is still operable to direct process fluid from cooling load 1228 to heat exchanger 1226, where the process fluid travels through condenser 1240 and evaporator 1230.

[0122] refer to Figures 64 to 67 A heat transfer device 1300 is provided, which has a process fluid heat exchange loop 1302, the process fluid heat exchange loop 1302 including an ethylene glycol chiller 1304, a pump 1306, a cold storage device (e.g., an ice tank 1308), a heat exchanger 1310 (e.g., an ethylene glycol / water heat exchanger), and a heat exchanger 1312 (e.g., an air / water heat exchanger). The heat exchanger 1310 is part of a water loop 1305 that receives heated water from a cooling load 1314. The heat exchanger 1310 transfers heat from the water loop 1305 to the ethylene glycol loop 1303.

[0123] exist Figure 64 In the diagram, heat transfer device 1300 is shown in a cooling load with an ice-melting mode, wherein valve 1320 directs ethylene glycol from ethylene glycol chiller 1304 through ice tank 1308, and valve 1322 directs ethylene glycol from ice tank 1308 to ethylene glycol / water heat exchanger 1310. Ethylene glycol chiller 1304 and ice tank 1308 remove heat from ethylene glycol circulating in ethylene glycol loop 1303, which absorbs heat from water in water loop 1305 via heat exchanger 1310.

[0124] about Figure 65 The heat transfer device 1300 is shown under a cooling load with an icing mode. More specifically, valve 1322 prevents ethylene glycol from flowing from ice tank 1308 to heat exchanger 1310, causing ethylene glycol chiller 1304 to remove heat from the ethylene glycol loop 1303 and return the cooled ethylene glycol to ice tank 1308 at a temperature lower than its storage temperature (e.g., 32℉), where it freezes. Conversely, water loop 1305 includes pump 1330, which allows water from cooling load 1314 to flow to heat exchanger 1312 and be cooled. When the heat load on heat transfer device 1300 decreases (e.g., overnight), it can be used... Figure 65 Cooling loads with icing mode.

[0125] about Figure 66 The heat transfer device 1300 is shown in a cooling load with a chiller and ice tank bypass mode. Valves 1320 and 1322 prevent ethylene glycol from flowing through the ethylene glycol loop 1303. Pump 1330 circulates water between the cooling load 1314 and the heat exchanger 1312 to allow the heat exchanger 1312 to cool the water. Figure 66The cooling load with chiller and ice tank bypass mode can be used for energy saving or when the heat load on the heat transfer device 1300 is low.

[0126] about Figure 67 The heat transfer device 1300 is shown in a cooling load with an ice tank bypass mode. More specifically, valve 1320 prevents ethylene glycol from flowing to ice tank 1308. Instead, ethylene glycol is circulated from ethylene glycol chiller 1304 to heat exchanger 1310 via pump 1306. Thus, the cooling provided by ethylene glycol chiller 1304 can be used to cool water in cooling water loop 1305 as water travels through heat exchanger 1310.

[0127] about Figure 68 and Figure 69 A heat transfer device 1350 similar to heat transfer device 1170 is provided. Heat transfer device 1350 includes a housing 1352, an adiabatic precooler 1353 including a precooling pad 1354, finned coils 1356 and condenser coils 1358, and an evaporator 1360 of a chiller unit 1362. (Regarding...) Figure 69 The heat transfer device 1350 is provided in a perspective view to show that the heat transfer device 1350 includes a cold storage device, such as an ice tank 1370, located alongside the evaporator 1360 of the chiller unit 1362.

[0128] about Figures 70 to 73 A heat transfer device 1390 is provided, which includes a chiller unit 1392, a cold storage device (e.g., a PCM tank 1394), and a heat exchanger 1396 for cooling process fluids from a cooling load 1398. The PCM tank 1394 contains a phase change material with a storage temperature above 50°F (e.g., 65°F), allowing the same process fluid to be used in the first fluid loop 1411 and the second fluid loop 1413 of the heat transfer device 1390 (see [link to documentation]). Figure 71 Storage temperature can refer to the melting or freezing temperature of the phase change material. Depending on the phase change material, the melting and freezing temperatures can be the same or different. Examples of usable phase change materials include PureTemp 18 from PureTemp LLC and BioPCM®-Q18 from Phase Change Solutions, Inc.

[0129] about Figure 70The heat transfer device 1390 is shown in a cooling load with a PCM release mode, wherein valve 1400 directs process fluid from chiller 1392 through PCM tank 1394, and valve 1402 directs cooled process fluid from PCM tank 1394 to cooling load 1398. Valve 1404 directs process fluid from heat exchanger 1396 to chiller 1392. In this way, chiller 1392 and PCM tank 1394 cool the process fluid to a temperature below that of the process fluid exiting heat exchanger 1396.

[0130] about Figure 71 The heat transfer device 1390 is shown in a cooling load with a PCM charging mode. In this mode, valves 1402 and 1404 allow pump 1410 to circulate secondary process fluid between chiller 1392 and PCM tank 1394 in the first fluid loop 1411. Chiller 1392 outputs secondary process fluid at a temperature lower than the freezing temperature of the PCM in PCM tank 1394 to recharge PCM tank 1394. Furthermore, in Figure 71 In a cooling load with PCM charging mode, the heat transfer device 1390 can circulate the main process fluid between the heat exchanger 1396 in the second fluid circuit 1413 and the cooling load 1398 via the pump 1414, thereby providing cooling capacity for the cooling load 1398.

[0131] about Figure 72 The heat transfer device 1390 is shown in a cooling load with a PCM bypass tank configuration. More specifically, valve 1400 allows process fluid received from chiller 1392 to bypass PCM tank 1394 and directs the process fluid to cooling load 1398. Furthermore, valve 1404 allows process fluid from heat exchanger 1396 to travel to chiller 1392.

[0132] about Figure 73 The heat transfer device 1390 is shown in a cooling load with a chiller and PCM tank bypass mode. More specifically, in Figure 73 In this mode, valves 1402 and 1404 are closed to allow process fluid to bypass chiller 1392 and PCM tank 1394.

[0133] about Figures 74 to 76A heat transfer device 1430 is provided that is similar in many respects to the heat transfer device 1150 described above. One difference between heat transfer device 1150 and heat transfer device 1430 is that heat transfer device 1430 has a valve 1432 between heat exchanger 1434 and cooling load 1436, and a valve 1438 between heat exchanger 1434 and PCM tank 1440. Another difference between heat transfer device 1150 and heat transfer device 1430 is that heat transfer device 1150 uses a regulated chiller unit 1154 to provide regulated cooling, while heat transfer device 1430 uses a PCM tank 1440 to provide regulated cooling.

[0134] The heat transfer device 1430 includes: having, for example Figure 74 The cooling load of the PCM cooling release mode shown has the following characteristics: Figure 75 The cooling load of the PCM charging cooling mode shown and the cooling load with the following characteristics are as follows: Figure 76 The cooling load of the PCM tank bypass mode is shown. Figure 75 In this mode, valve 1432 can regulate the flow of process fluid from cooling load 1436 to direct some of the process fluid back to cooling load 1436 and mix it with cooled process fluid from PCM tank 1440. PCM tank 1440 has a storage temperature above 70°F, for example, 78°F. Figure 75 The mode uses the recirculation of process fluid to increase the temperature of the process fluid, and then the process fluid is returned to the cooling load 1436.

[0135] The heat transfer devices discussed herein can take on various shapes. In some embodiments, the components of the heat transfer device are encapsulated in a single housing. In other embodiments, the components can be operatively connected, independent structures. For example, Figure 77 The heat transfer device 1450 is provided, which includes two stacked air / process fluid heat exchangers 1452 and 1454 and a separate cold storage device 1456.

[0136] about Figure 78A heat transfer device 1460 is provided, comprising a housing 1462 having an inlet 1464, an outlet 1466, and one or more fans 1468 operable to generate airflow between the inlet 1464 and the outlet 1466. The heat transfer device 1460 includes an adiabatic precooler 1470 with a precooling pad 1472 and an indirect heat exchanger (e.g., a finned coil 1474). The finned coil 1474 receives hot process fluid via a return pipe 1476. The heat transfer device 1460 includes a valve 1480 that regulates the flow of cooling process fluid from the finned coil 1474 to a cold storage device (e.g., a PCM tank 1482). Process fluid can travel from valve 1480 to the PCM tank 1482 and then be returned to a cooling process fluid source 1484 downstream of valve 1480. The PCM canister 1482 is located inside the housing 1462, which may be advantageous in some embodiments to allow airflow generated by one or more fans 1468 to cool the PCM canister 1482.

[0137] about Figure 79 A heat transfer device 1500 is provided, which has a process fluid heat exchange loop 1502, which includes a dehumidifier (e.g., a membrane mass exchanger 1504), a heat exchanger 1506 (e.g., an air / process fluid heat exchanger), and a pump 1508. The membrane mass heat exchanger 1504 receives air 1510 and reduces the wet-bulb temperature of the air before it reaches the heat exchanger 1506. The heat exchanger 1506 receives process fluid from a cooling load 1512. By dehumidifying the air upstream of the heat exchanger 1506, the operating efficiency of the heat exchanger 1506 can be improved.

[0138] about Figure 80A heat transfer device 1530 is provided, comprising a housing 1532, a main air inlet 1534 with a main louver 1536, a secondary air inlet 1538 with a secondary louver 1540, and an air outlet 1542. The heat transfer device 1530 also includes a membrane mass exchanger 1550, an adiabatic precooler 1552 with a precooling pad 1554, and an indirect heat exchanger (e.g., a finned coil 1556). The membrane mass exchanger 1550 may include a tubular or sheet-like membrane that allows water vapor to pass through in order to collect and remove water vapor from the airflow, thereby dehumidifying the air upstream of the precooling pad 1554. In a first mode, the secondary louver 1540 can be closed while the main louver 1536 can be opened, allowing air to flow through the membrane mass exchanger 1550 to the precooling pad 1554 and the finned coil 1556. In addition, the heat transfer device 1530 has a second mode in which the main louver 1536 is closed and the secondary louver 1538 is opened, allowing air to travel through the secondary air inlet 1538 around the membrane mass exchanger 1550 to the precooling pad 1554. The finned coil 1556 receives hot process fluid from the return pipe 1570 and directs cooled process fluid to the source 1572, which then directs the process fluid back to the cooling load.

[0139] about Figure 81 A membrane mass exchanger 1660 is provided as an example of the membrane mass exchanger 1550 described above. The membrane mass exchanger 1660 includes an array of air channels 1662, sheet membranes 1664, and permeation channels 1666. Air travels in direction 1670 into an inlet 1669, travels along the air channel 1662 while contacting the sheet membranes 1664, and exits the air channel 1662 via an outlet 1672. The membrane mass exchanger 1660 includes a compressor or vacuum pump 1682, which operates to generate a vacuum in the permeation channels 1666. A vacuum exists in the permeation channels 1666 on the side of the sheet membranes 1664 opposite to the air channels 1662, thereby drawing water vapor in the airflow through the sheet membranes 1664 and into the permeation channels 1666. The water vapor collected in the permeation channels 1666 travels through a conduit 1680 to the vacuum pump 1682 and to the outlet 1684. The outlet 1684 may include, for example, an air and water separator, and a condenser for condensing the collected water vapor into liquid water for pumping to the adiabatic precooler 1552 or another process. The condenser may include, for example, a cooled metal surface.

[0140] refer to Figure 82A heat transfer device 1700 is provided, which includes an air inlet 1702, a dehumidifier 1704 (e.g., a membrane mass exchanger 1706), an adiabatic precooler 1708 (including a precooling pad 1710), an indirect heat exchanger (e.g., a tube-fin heat exchanger 1712), a direct heat exchanger (e.g., a packing 1714), a plenum 1716, and an air outlet 1718 with a fan 1720. The fan 1720 generates an airflow from the air inlet 1702 to the air outlet 1718. The dehumidifier 1704 includes a liquid desiccant supply source 1730 with a pump 1732, which pumps liquid desiccant collected from a collection tank 1734 to the membrane mass exchanger 1706. Ambient air enters the air inlet 1702, causing the liquid desiccant in the membrane mass exchanger 1706 to remove water vapor from the air. This lowers the wet-bulb temperature of the air in region B.

[0141] Next, air travels through precooling pad 1710, which is wetted by water from liquid supply source 1750, which has a pump 1754 that pumps water from collection tank 1752. The water on precooling pad 1710 lowers the dry bulb temperature of region C.

[0142] The dehumidified dry air then travels through the tube-fin heat exchanger 1712 and transfers heat to the process fluid, which enters the tube-fin heat exchanger 1712 at an elevated temperature at the inlet 1760 and exits the tube-fin heat exchanger at a decreased temperature at the outlet 1762.

[0143] Liquid desiccant supply source 1730 includes a liquid desiccant pool 1770 with an electric heater that heats the liquid desiccant to quench the liquid desiccant that has already collected water vapor at membrane mass exchanger 1706. Alternatively or additionally, liquid desiccant pool 1770 may utilize waste heat (e.g., from manufacturing operations) to heat the liquid desiccant. Liquid desiccant supply source 1730 also includes a pump 1780 for directing the liquid desiccant to a sprayer 1788 and onto packing material 1714. Air travels from zone D to zone E and absorbs heat from the liquid desiccant. The cooled liquid desiccant is then returned to membrane mass exchanger 1706 by pump 1732.

[0144] refer to Figure 83The diagram illustrates a heat transfer device 1800 having a process fluid heat exchange loop 1802, which includes an indirect heat exchanger (e.g., a fluid cooling coil 1804), a thermoelastic chiller (e.g., a shape memory alloy (SMA) cooler 1806), and a cold storage device (e.g., a PCM tank 1808), which operate to supply process fluid to a cooling load 1810 at a requested temperature, pressure, flow rate, or a combination thereof. The SMA cooler 1806 has a condenser side 1812 and an evaporator side 1814. The storage temperature of the PCM tank 1808 is 65°F. The SMA cooler 1806 generates heat when deformed due to compression and absorbs heat when the compression is released and the SMA returns to its original shape, such as... Figure 84 As shown in phase diagram 1820, the SMA cooler 1806 may have a first set of multiple SMA alloy boxes compressed to generate heat on the condenser side 1812, and a second set of multiple SMA alloy boxes expanded on the evaporator side 1814 to absorb heat. The SMA cooler 1806 has a valve assembly that operably exchanges the first set of multiple SMA alloy boxes between the first set on the condenser side 1812 and the second set on the evaporator side 1814 once the SMA alloy of the first set of boxes has been fully compressed and the SMA alloy of the second set of boxes has been fully expanded. In this way, the SMA cooler 1806 can operate as a chiller unit to further reduce the temperature of the process fluid from the fluid cooling coil 1804 before the process fluid is directed to the PCM tank 1804. It should be understood that the SMA cooler 1806 can be used in conjunction with other embodiments discussed herein to replace or supplement the refrigerant-based chiller units discussed herein. The SMA chiller 1806 and other chillers discussed herein can have their own embedded controller that communicates with the main controller of the heat transfer unit.

[0145] about Figure 13 and Figure 85 The controller 466 of the heat transfer device 430 can be used by... Figure 85 The state machine diagram is used to represent method 1900A to operate the heat transfer device 430. The controller 466 is configured (e.g., by a user or by another system controller) to operate the heat transfer device 430 to achieve target optimization criteria, such as minimizing energy consumption, minimizing water consumption, or minimizing cost. When the target optimization criterion is minimizing water consumption, the controller 466 can use method 1900A or method 1900B (see method 1900B). Figure 89 The heat transfer device 430 is operated by [method 2100A]. Conversely, when the objective optimization criterion is to minimize energy consumption, the controller 466 can use method 2100A (see [method 2100A]). Figure 92 ) or method 2100B (see Figure 95 ).

[0146] about Figure 85 and Figure 89 When cooling load 433 requires cooling from heat transfer device 430, controller 466 utilizes method 1900A; and when cooling load 433 requires minimal cooling from heat transfer device 430 or no cooling at all, controller 466 utilizes method 1900B. Methods 1900A and 1900B include operating heat transfer device 430 in operating modes 1902, 1904, 1906, 1908, 1910, 1912, 1914, 1916, 1918, 1920, 1922, 1924, 1926, 1928, 1930, and 1932. Operating modes 1902 to 1932 correspond to the above-mentioned... Figures 14 to 19F Discussion patterns 1 to 11. Figure 85 and Figure 89 The "wet" or "dry" indication indicates whether the precooling pad 442 is wetted for the associated operating modes 1902 to 1932. For example, Figure 85 Operating mode 1910 corresponds to Figure 16 In mode 3, pump 406 is not running to wet the pre-cooling pad 432. In contrast, operating mode 1912 represents... Figure 16 In Mode 3, pump 446 is running to pump liquid onto precooling pad 442, so that air traveling through precooling pad 442 is adiabatically cooled before reaching fluid cooling coil 448. When the target optimization criterion is to minimize water consumption, heat transfer device 430 operates in dry mode for as long as possible until it can no longer meet cooling load 433. In energy-saving mode, heat transfer device 430 operates in wet mode for as long as possible until the ambient temperature drops to a certain point, such as 35°F.

[0147] about Figure 86 Methods 1900A, 1900B, 2100A, and 2100B utilize set parameters 1950, measured parameters 1952, calculated coil EDB parameters 1954, and one or more historical parameters 1956 to select initial operating modes 1902 to 1932 for the heat transfer device 430, and select different operating modes for the heat transfer device 430 as the heat load of the heat transfer device 430 changes. Methods 1900A, 1900B, 2100A, and 2100B can utilize currently detected parameters as input and / or predicted future parameters (e.g., predicted future environmental conditions and / or cooling load requirements) as input.

[0148] Regarding setting parameter 1950, setting parameter 1950 may include a supply temperature setpoint, which represents the temperature of the process fluid leaving the heat transfer device 430 and being supplied to the cooling load 433. For example, cooling load 433 may be a computer data center, which requires the process fluid to return to cooling load 433 at a specific temperature.

[0149] Setting parameter 1950 also includes a control range parameter. The control range parameter is used to compensate for minor temperature changes and hysteresis during the operation of the heat transfer device 430 when determining whether to change the operating mode of the heat transfer device 430. The control range parameter can be, for example, within a range of 1°F to 10°F. Methods 1900A and 1900B can utilize the first control range parameter for water-saving operation, while methods 2100A and 2100B can utilize the second control range parameter for energy-saving operation.

[0150] The control range parameter is also used by controller 466 to determine whether to change the operating mode 557 of heat transfer device 430 (see [link]). Figure 23C and Figure 23E When fan 450 is at its maximum fan speed, if the process fluid supply temperature (the temperature of the process fluid supplied by heat transfer device 430 to cooling load 443) becomes higher than the supply temperature setpoint by a temperature difference equal to the control range parameter, controller 466 changes the operating mode of heat transfer device 430. Conversely, when fan 450 is at its minimum fan speed, if the process fluid supply temperature becomes lower than the supply temperature setpoint by a temperature difference equal to the control range parameter, controller 466 changes the operating mode of heat transfer device 430.

[0151] Setting parameter 1950 also includes the PCM charging temperature, for example, 50°F. If PCM tank 438 receives process fluid at or below the PCM charging temperature, PCM tank 438 can be recharged. For example, in operating mode 1920 (which corresponds to...) Figure 18 Mode 5 or Figure 19F In Mode 11), the PCM charging temperature will be used as the required leaving fluid temperature for the evaporator 456 of the chiller unit 452, so that the process fluid leaving the evaporator 456 causes the PCM tank 438 to be recharged. As another example, in Mode 1922, the PCM charging temperature will be used as the required leaving fluid temperature for the fluid cooling coil 448.

[0152] Setting parameter 1950 includes a PCM storage charge threshold, such as 90% charge, which the controller 466 will always attempt to maintain. The PCM storage release threshold is used to determine whether the operating mode with PCM release should be skipped, for example when the PCM tank 438 is 10% charge.

[0153] Setting parameter 1950 includes the dry switching point of the heat transfer device 430. The dry switching point is the lowest temperature at which the heat transfer device 430 can operate in wet mode, for example, 35°F.

[0154] Measurement parameter 1952 includes the dry-bulb temperature and relative humidity of the ambient air. The heat transfer device 430 includes sensors for measuring the dry-bulb temperature and relative humidity of the ambient air. Measurement parameter 1952 also includes the process fluid return temperature, which is the temperature of the fluid received by the heat transfer device 430 from the cooling load 433. Measurement parameter 1952 includes the total process fluid flow rate, which is the flow rate of the process fluid received by the heat transfer device 430 from the cooling load 433. Measurement parameter 1952 also includes the PCM storage level, which is the current storage level or charge level of the PCM tank 438.

[0155] The calculated coil EDB parameter 1954 includes the CoilEDB parameter, which is the air temperature after the precooling pad 442 but before the fluid cooling coil 448. The CoilEDB parameter 1954 can be determined using the ambient air inlet dry-bulb temperature (EDB), the ambient air inlet wet-bulb temperature (EWB), and the saturation efficiency. In one method, the CoilEDB is calculated using the following formula: [Formula 1] CoilEDB = EDB – Saturation Efficiency (EDB - EWB) The EWB value in Formula 1 is calculated using the following formula: [Formula 2]

[0156] Here, EWB represents the wet-bulb temperature of the ambient air in °C; EDB represents the dry-bulb temperature of the ambient air in °C; and Rh represents the relative humidity of the ambient air in % (%).

[0157] The saturation efficiency value in Formula 1 is the efficiency of the precooling pad 442, for example, 97%. The saturation efficiency value in Formula 1 indicates that the precooling pad 442 can cool the air to a degree close to the wet-bulb temperature.

[0158] Historical parameter 1956 includes the maximum value of coil EDB detected within a previous period (e.g., the past 24, 48, or 72 hours), referred to as CoilEDB_Max. CoilEDB_Max provides a rough guide to the highest temperature that may be encountered during the operation of heat transfer unit 430, based on the highest temperature encountered within a previous period (e.g., the past 48 hours). Generally, methods 1900A, 1900B, 2100A, and 2100B consider whether operating modes 1902 to 1932 can handle CoilEDB_Max before deciding to operate heat transfer unit 430 in operating modes 1902 to 1932.

[0159] Controller 466 also uses CoilEDB_Max to determine whether the operating mode requiring PCM cooling should be skipped 557 (see [link]). Figure 23C and Figure 23E To save PCM storage. For example, refer to Figure 85 The controller 466 can operate the heat transfer unit 430 in mode 1902 (mode 1, dry) on the morning of the first day. In this example, CoilEDB_Max is the maximum CoilEDB temperature calculated between 2 PM and 6 PM on the previous day. CoilEDB_Max is high enough that the controller 466 will need to operate the heat transfer unit 430 in at least mode 1914 (mode 4, dry), where the PCM tank 438 is releasing coolant to meet the supply process fluid temperature setpoint. As the ambient temperature rises and the heat load on the heat transfer unit 430 increases during the first day, the controller 466 evaluates logic operations 2023, 2024, 2025, and 2026 and determines whether one of logic operations 2023, 2024, 2025, and 2026 is true.

[0160] like Figure 88B As shown in a portion of Table 1970, condition 1972D of logic operation 2026 includes a first condition: 1) if the current PCM storage is less than the PCM storage cooling threshold; or if the maximum CoilEDB (also known as CoilEDB_Max) is greater than CoilEDB_SP_3D. Condition 1972D includes a second condition: whether the supply temperature (process fluid supplied by heat transfer device 430) is greater than the sum of the process fluid setpoint and the control range. If both conditions of condition 1972D are true, the controller 466 will change the operation of heat transfer device 430 from operation condition 2026 (mode 1, dry) to operation condition 1906 (mode 2, dry).

[0161] In this example, CoilEDB_Max is greater than the current CoilEDB setpoint for Mode 3 (dry) (referred to as "CoilEDB_SP_3D"), and the expected return temperature of the process fluid from heat transfer unit 430 between 2 PM and 6 PM on the first day will be higher than the sum of the supply temperature setpoint and control range for operating mode 1910 (Mode 3, dry). Controller 466 determines that logic condition 2026 is true and reconfigures heat transfer unit 430 from operating condition 1902 (Mode 1, dry) to operating condition 1906 (Mode 2, dry), skipping operating condition 1910 (Mode 3, dry), as... Figure 85 As shown. By skipping operating condition 1910, controller 466 avoids releasing the refrigeration of PCM tank 438, which saves the refrigeration of PCM tank 438 for use later on the first day (i.e., from 2 p.m. to 6 p.m. when CoilEDB_Max is expected to occur).

[0162] Between 2 PM and 6 PM on the first day, if the conditions of logic operation 2031 are true, i.e., if: 1) the PCM storage is not less than the PCM storage release threshold of set parameter 1950; 2) the CoilEDB_Max in the past 48 hours is not greater than CoilEDB_SP_4D; and 3) the calculated process fluid supply temperature (the temperature of the process fluid leaving the heat transfer device 430) is greater than the sum of the supply process fluid temperature setpoint and the control range of set parameter 1950, then the controller 466 can change the operation of the heat transfer device 430 from mode 1906 (mode 2, dry) to mode 1914 (mode 4, dry). When the controller 466 operates the heat transfer device 430 in operating mode 1914, the controller 466 periodically (e.g., every ten seconds) evaluates logic operations 2033 and 2034 to determine whether to change the heat transfer device 430 to operating mode 1904 (mode 1, wet) or mode 1906 (mode 2, dry).

[0163] If the PCM tank level drops below the PCM cooling release threshold between 2 PM and 6 PM on the first day, heat transfer unit 430 will be unable to continue operating in mode 1914 (mode 4, dry). Controller 466 calculates the temperature of the process fluid that heat transfer unit 430 will supply to cooling load 433. Using this calculated supply temperature, controller 466 evaluates logic operations 2034, 2033 to determine whether to change heat transfer unit 430 to mode 1906 (mode 2, dry) or mode 1904 (mode 1, wet). About Figure 88BIn a portion of Table 1970, logic operation 2034 states that if: 1) the calculated supply temperature is greater than the sum of the supply temperature setpoint and the control range; and 2) the calculated CoilEDB is not less than the dry switching point of the set parameter 1950, then the controller 466 will change the heat transfer device 430 from operation mode 1914 to mode 1904.

[0164] refer to Figure 85 When the heat transfer device 430 is powered on, the controller 466 determines which of the modes 1902 to 1924 to begin with by using time, dry-bulb temperature, relative humidity, process fluid return temperature, total process fluid flow rate, PCM reserves for parameters 1950, 1952, 1954, and 1956, and CoilEDB_Max evaluation logic operations 2001 to 2012, thereby initiating method 1900A at step 1901A. Step 1901A involves calculating the current CoilEDB, which is compared with the CoilEDB setpoint for the different operating modes 1902 to 1924.

[0165] For example, the current CoilEDB calculated at step 1901A will be compared with CoilEDB_SP_1D, which represents the CoilEDB parameter associated with operating mode 1902. Operating mode 1902 corresponds to dry operation in mode 1 (see...). Figure 14 As another example, the current CoilEDB calculated at step 1901A is compared with CoilEDB_SP_2W, which is the CoilEDB parameter for operating mode 1908. Operating mode 1908 represents wet operation in mode 2 (see...). Figure 15 The numbers "1" and "2" in CoilEDB_SP_1D and CoilEDB_SP_2W correspond to the first and second modes, respectively. Other uses of CoilEDB_SP_XY in this disclosure use "X" to identify... Figures 14 to 19F It is one of modes 1 to 11, and uses the “Y” value to indicate whether the precooling pad 442 is wet operation (“W”) or dry operation (“D”).

[0166] The CoilEDB_SP parameters for operating modes 1902 to 1932 are determined at least in part based on the supply temperature setpoint of setting parameter 1950, the process fluid return temperature of measurement parameter 1952, and the total process fluid flow rate of measurement parameter 1952. A given CoilEDB_SP for operating modes 1902 to 1932 is the maximum CoilEDB that the operating mode can handle, assuming fan 450 is operating at 100% fan speed and PCM tank 438 is fully cooled, when heat transfer unit 430 supplies process fluid at a temperature equal to or below the supply temperature setpoint. For example, CoilEDB_SP_4D is the maximum CoilEDB (dry bulb temperature of the air before cooling coil 448 but after pad 442) when operating mode 1914 (mode 4, dry) while heat transfer unit 430 supplies process fluid at a temperature equal to or below the supply temperature setpoint. If the current CoilEDB calculated by the controller 466 is higher than the CoilEDB_SP of the current operating mode, the heat transfer device 430 will not be able to provide sufficient cooling capacity even if the PCM tank 438 is fully charged and the fan 450 is at 100% fan speed.

[0167] As an example, the flow rate or flow ratio of condenser 454 and evaporator 456, the outlet fluid temperature of evaporator 456 during PCM release, the flow rate or flow ratio of PCM tank 438, and the outlet fluid temperature of PCM tank 438 during PCM tank 438 release can be used. Figure 17 The CoilEDB_SP_4D is determined using the following equation (with a mid-range temperature of 72°F). Alternatively, the CoilEDB_SP_4D can be solved using the following equation: [Formula 3] CoilEDB_SP = function(Fluid Cooler EFT, Fluid Cooler LFT, Total Flow Rate) Wherein, the fluid cooler EFT is the temperature of the process fluid entering the fluid cooling coil 448, the fluid cooler LFT is the temperature of the process fluid leaving the fluid cooling coil 448 (which must meet the supply temperature setpoint), and the total flow rate is the total flow rate of the process fluid entering (or leaving) the heat transfer device 430. The fluid cooler LFT and fluid cooler EFT can be calculated using the following functions: [Formula 4] Fluid cooler LFT = function (supply temperature SP, total flow rate, evaporator LFT during cooling release, evaporator flow rate, PCM tank LFT during cooling release, PCM tank flow rate) [Formula 5] Fluid cooler EFT = function(return temperature, total flow rate, fluid cooler LFT, evaporator LFT during cool-release, condenser flow rate, evaporator flow rate) A fluid cooler (LFT) is a process fluid temperature required to meet the supply temperature (SP) (setpoint) requirement. The fluid cooler LFT is based on heat balance calculations, assuming that the evaporator flow rate or flow ratio, the evaporator LFT during coolant release, the PCM tank flow rate or flow ratio, and the PCM tank LFT during coolant release are preset.

[0168] The fluid cooler EFT is based on heat balance calculations, assuming that the condenser flow rate or flow ratio, the evaporator flow rate or flow ratio, and the evaporator LFT during coolant release are preset. The calculations use the fluid cooler LFT, the return temperature of the process fluid received by the fluid cooling coil 448, and the total flow rate of the heat transfer device 430.

[0169] As the heat load applied to the heat transfer device 430 changes, the controller 466 sequentially executes the control logic of methods 1900A, 1900B, 2100A, and 2100B to select a sequence of operating modes that achieve the target optimization criteria while satisfying the cooling load 433. Methods 1900A, 1900B, 2100A, and 2100B allow the heat transfer device 430 to start up quickly because optimal initial operating modes 1902 to 1932 are selected at steps 1901A, 1901B, 2101A, and 2101B, rather than sequentially going through a fixed sequence of operating modes. Furthermore, operating modes including PCM cooling release (e.g., mode 1912) in methods 1900A, 1900B, 1900C, and 1900D can be skipped to conserve PCM reserves for later use. As described above, CoilEDB_Max is used to determine whether operating modes involving PCM cooling release should be skipped. It should be understood that PID loops or other methods can be used to determine the fan speed, chiller condenser / evaporator flow rate, evaporator outlet fluid temperature setpoint, and PCM tank flow rate for various operating modes of methods 1900A, 1900B, 2100A, and 2100B.

[0170] about Figure 87 Table 1960 is provided, which has columns 1961 for logic operations 2001 to 2012 of method 1900A, column 1962 for conditions of logic operations 2001 to 2012, and column 1964 for the initial operating mode that the controller 466 can select using logic operations 2001 to 2012. For example, at step 1901A, if the parameter of the current PCM storage is less than the PCM storage cooling threshold, and the CoilEDB calculated at step 1901A is not greater than the CoilEDB setpoint for dry operation in mode 8 as indicated by condition 1962A, then the controller 466 configures the heat transfer device 430 to operate in mode 8 dry operation (see...). Figure 19CThe device operates in the corresponding mode 1922, as shown by reference numeral 1964A in Table 1960. In other words, the controller 466 selects the true condition from the conditions in column 1962 using parameters 1950, 1952, 1954, and 1956. The controller follows the logic operations 2001 to 2012 corresponding to the true condition to select the initial operating mode for the heat transfer device 430.

[0171] about Figures 88A to 88C Table 1970 is provided, which has columns 1971 for logical operations 2013 to 2044 of method 1900A. Table 1970 has columns 1976 for the current operating mode associated with logical operations 2013 to 2044, columns 1972 for identifying the conditions of each logical operation 2013 to 2044, and columns 1974 for the next operating mode to be selected if the condition in column 1972 is true. For example, referring to logical operation 2023 in Table 1970, heat transfer device 430 is currently operating according to operating mode 1902, which corresponds to Figure 14 Mode 1: Dry operation. (Regarding...) Figure 85 Logical operation 2023 determines whether method 1900A will switch from operation mode 1902 to operation mode 1920. Operation mode 1920 corresponds to... Figure 18 Mode 5 wet operation or Figure 19F The wet operation of mode 11. More specifically, at logic operation 2023, controller 466 evaluates condition 1972A (see... Figure 88B Condition 1972A requires: 1) the current PCM storage is less than the PCM storage cooling threshold; 2) the process fluid supply temperature is lower than a parameter equal to the supply temperature setpoint minus the control range; and 3) the dry-bulb temperature of the ambient air entering the heat transfer unit 430 is not less than the dry switching point. If condition 1972A is true, the controller 466 changes the heat transfer unit 430 from operating mode 1902 to operating mode 1920, in response to Figure 18 Mode 5 wet operation or Figure 19F The controller 466 selects between mode 5 and mode 11 using the supply temperature setpoint. For example, if the supply temperature setpoint is below a threshold temperature (e.g., 84°F), the controller 466 selects mode 11. If the supply temperature is equal to or above the threshold temperature, the controller 466 selects mode 5.

[0172] If condition 1972A is not true, then controller 466 evaluates conditions 1972B, 1972C, and 1972D of logic operations 2024, 2025, and 2026 (see [link to relevant documentation]). Figure 85 and Figure 88BThe controller 466 determines whether to change the heat exchange device 430 to operating mode 1918, 1910, or 1906. If conditions 1972A, 1972B, 1972C, and 1972D are all false, the controller 466 will continue to operate the heat exchange device 430 in operating mode 1902. The controller 466 may evaluate conditions 1972A to 1972D after a predetermined period of time (e.g., every 10 seconds) or after an event (e.g., component failure or parameter rise exceeding a threshold, such as a sudden increase in heat load on the heat exchange device 430).

[0173] about Figure 89 When the objective optimization criterion is to minimize water consumption and the cooling load 433 does not require cooling from the heat transfer device 430, the controller 466 can utilize method 1900B. Upon startup of the heat transfer device 430, the controller 466 executes step 1901B, which is similar to step 1901A discussed above. Regarding... Figure 90 Table 1980 is provided, which includes columns 1981 for logic operations 2045 to 2048 of method 1900B, column 1982 for conditions of logic operations 2045 to 2048, and column 1984 for the initial operating mode of heat transfer device 430. For example, if the current PCM storage is less than the PCM storage cooling threshold, and the CoilEDB calculated at step 1901B is not greater than the CoilEDB setpoint for dry operation in mode 9 as indicated by condition 1982A in Table 1980, then controller 466 will select operating mode 1930 as the initial operating mode of heat transfer device 430, which corresponds to... Figure 19D Mode 9 dry.

[0174] about Figure 91 Table 1990 is shown, which includes columns 1991 for logic operations 2049 to 2058 of method 1900B, column 1992 for the current operating mode of heat transfer device 430, column 1994 for the conditions of logic operations 2049 to 2058, and column 1996 for the next operating mode of heat transfer device 430. Since there is no cooling load 433 requiring cooling from heat transfer device 430 in method 1900B, controller 466 can stop method 1900B in response to PCM storage reaching 100%. For example, when heat transfer device 430 is in mode 1930 (corresponding to...) Figure 19DIn Mode 9 (dry operation), controller 466 considers conditions 1994A and 1994B associated with logic operations 2049 and 2050 to determine whether one of conditions 1994A and 1994B is true. If condition 1994B is true, controller 466 will stop method 1900B and wait for cooling load 433 to request cooling from heat transfer device 430 or another trigger condition, such as the expiration of a time period or a command from system controller to restart one of methods 1900A, 1900B, 2100A, and 2100B.

[0175] about Figure 92 The controller 466 may implement method 2100A in response to the operation of the heat transfer device 430 to minimize energy consumption and the cooling load 433 requiring cooling from the heat transfer device 430. Method 2100A is similar in many respects to method 1900A discussed above and is used to select an initial operating mode and a subsequent operating mode for the heat transfer device 430 from operating modes 1902 to 1924. Method 2100A begins at step 2101A, which is similar to step 1901A discussed above.

[0176] Method 2100A begins at step 2101A, which is similar to step 1901A discussed above. Regarding Figure 93 Table 2070 is provided, which includes columns 2072 for logical operations 2101 to 2112 evaluated at step 2101A of method 2100A, columns 2074 for conditions associated with logical operations 2101 to 2112, and columns 2076 for an initial operating mode that can be selected by controller 466 in response to logical operations 2101 to 2112 being true. For example, when condition 2074A is met, controller 466 will select mode 1918 as the initial mode via logical operation 2102, which requires: 1) the current PCM reserve is less than the PCM reserve cooling threshold; and 2) the CoilEDB calculated at operation 2101A is greater than mode 8 dry operation (see Table 2074). Figure 19C The CoilEDB setpoint, but not greater than Mode 5 dry operation (see...). Figure 18 ) the CoilEDB setpoint; and 3) the dry bulb temperature of the air is less than the dry switching point.

[0177] Once the controller 466 selects the initial operating mode at step 2101A of method 2100A, the controller 466 can evaluate whether to change the heat transfer device 430 to a different operating mode by evaluating the logic operations 2113 to 2142 of method 2100A. Regarding Figures 94A to 94CA table 2080 is provided, which includes columns 2082 for logical operations 2113 to 2142, column 2084 for the current operating mode, column 2086 for the conditions associated with logical operations 2113 to 2142, and column 2088 indicating the next operating mode to be implemented by the heat transfer device 430 when the associated conditions of logical operations 2113 to 2142 are met. As some examples, the controller 466 may evaluate whether to change the mode of the heat transfer device 430 every 10 seconds, every 5 minutes, or every 15 minutes.

[0178] As an example and reference Figure 94A In the logic operations 2120 and 2121, the controller 466 can operate the heat transfer device 430 in operation mode 1910, which represents Figure 16 Mode 3 dry operation. About Figure 92 The controller 466 will evaluate logic operations 2120 and 2121 to determine whether condition 2086A or 2086B is true. If condition 2086A (see [link to logic operation 2120]) is true, the controller will evaluate logic operations 2120. Figure 94A If the condition is true, the controller 466 will change the heat transfer device 430 from operating mode 1910 (mode 3, dry) to operating mode 1902 (mode 1, dry).

[0179] about Figure 95 When the heat transfer device 430 is operated to minimize energy consumption and the cooling load 433 does not require or requires limited cooling from the heat transfer device 430, the controller 466 can utilize method 2100B. The controller 466 uses method 2100B to select the initial and subsequent operating modes of the heat transfer device 430 from operating modes 1926, 1928, 1930, and 1932. The initial operating mode is first selected by analyzing real-time and recorded data at step 2101B, which is similar to step 1901A discussed above.

[0180] about Figure 96 Table 2180 is provided, which includes columns 2182 listing logical operations 2143 to 2146 of method 2100B. Table 2180 includes columns 2184 for the conditions of logical operations 2143 to 2146. Table 2180 also includes columns 2186 indicating the initial mode to be used when the conditions of logical operations 2143 to 2146 are met.

[0181] about Figure 97Table 2190 is provided, which can be used by method 2100B to determine the next operating mode when heat transfer device 430 is operated to minimize energy consumption and cooling load 433 does not require or requires limited cooling from heat transfer device 430. Table 2190 includes columns 2192 for logical operations 2147-2156 of method 2100B, column 2194 for the current operating mode of heat transfer device 430, column 2198 for the next operating mode of heat transfer device 430, and column 2196 for conditions of logical operations 2147 to 2156 for selecting one of the next operating modes in column 2198. Table 2190 is similar to Table 1990 discussed above and includes stopping the operation of method 2100B in response to the current PCM storage reaching 100% (e.g., under condition 2196A).

[0182] about Figures 98A to 98H Provides a way to use Figures 14 to 19F mode operation Figure 13 Method 2500 for heat transfer device 430. Controller 466 may use method 2500 instead of methods 1900A, 1900B, 2100A, and 2100B. Controller 466 executes method 2500 sequentially upon startup of heat transfer device 430 and subsequently (e.g., according to a predetermined schedule (e.g., every 10 seconds)) and / or in response to events (e.g., receiving a command from the system controller, component failure of heat transfer device 430, and / or a significant change in detected parameters (e.g., cooling required for cooling load 433)).

[0183] The controller 466 sequentially executes method 2500 to identify an operating mode of the heat transfer device 430 that meets capacity requirements and has the lowest water consumption rate if the heat transfer device 430 is operated to minimize water consumption. Alternatively, the controller 466 sequentially executes method 2500 to identify an operating mode that meets capacity requirements and has the lowest energy consumption rate if the heat transfer device 430 is operated to minimize energy consumption. If the identified operating mode is the same as the current operating mode, the controller 466 will keep the heat transfer device 430 operating in the current operating mode. If the identified operating mode is different from the current operating mode, the controller 466 will change the heat transfer device 430 to the identified operating mode. Method 2500 thus allows the controller 466 to jump to the optimal operating mode, rather than looping through intermediate modes to reach the optimal operating mode, which improves the operating efficiency of the heat transfer device 430.

[0184] For operating modes 1914 and 1916, when there is a large temperature difference between the process fluid supply temperature and the return temperature (as mentioned above)... Figure 19B(As discussed), controller 466 selects mode 4. When there is a small temperature difference between the process fluid supply temperature and the return temperature, controller 466 selects mode 7 in operating modes 1914 and 1916.

[0185] Method 2500 includes an analysis step 2502 similar to step 1901A discussed above. Method 2500 utilizes predefined parameters, including the supply temperature setpoint, control range (e.g., 1°F to 10°F), chiller setpoint during PCM charging (e.g., 50°F), and CoilEDB_Max over the past 48 hours. Step 2502 includes using predefined values ​​of CoilEDB_SP_3D, CoilEDB_SP_4D, and CoilEDB_SP_3W, based on the supply temperature setpoint and the total flow rate of the process fluid.

[0186] Method 2500 includes step 2504 of checking the PCM reserve or charging. The PCM reserve is maintained within a certain range so that the PCM can be used as needed, especially in... Figure 19E In mode 10.

[0187] Method 2500 includes step 2506, in which controller 466 determines SupplyTemp_cal based on input 2508, which is a calculated value of the temperature of the fluid supplied from heat transfer device 430 to cooling load 433. Input 2508 provided at step 2506 corresponds to... Figure 18 The operating conditions for Mode 5 dry operation. Specifically, step 2506 involves using input to determine SupplyTemp_cal from a lookup table, which indicates that the precooling pad 442 is dry, the fan 450 is running at 100% speed, and the evaporator 456 of the chiller unit 452 is operating to cool the process fluid traveling in the second loop 492, thereby charging the PCM tank 438. In another approach, SupplyTemp_cal is determined using one or more formulas.

[0188] At step 2510, controller 466 checks whether the calculated SupplyTemp_cal is less than the supply temperature setpoint minus the control range. In other words, controller 466 checks at step 2510 whether the temperature of the process fluid supplied from heat transfer unit 430 during dry operation in mode 5 is lower than the setpoint required to supply process fluid to cooling load 433 after subtracting the control range. The control range is a value used to compensate for temporary temperature changes and hysteresis in heat transfer unit 430. If the condition in step 2510 is true, controller 466 proceeds to step 2512, in which controller 466... Figure 18 In mode 5, the heat transfer device 430 is operated in a dry manner.

[0189] If the condition in step 2510 is false, then controller 466 proceeds to step 2514, in which controller 466 uses input 2516 to determine SupplyTemp_cal, which corresponds to Figure 18 In mode 5, pump 446 operates to wet the precooling pad 442 upstream of the fluid cooling coil 448. If at step 2518 it is determined that SupplyTemp_cal is sufficiently below the temperature required by the cooling load 433, controller 466 proceeds to step 2520 and operates the heat transfer device 430 in mode 5 wet operation.

[0190] If both dry mode 5 and wet mode 5 are deemed unacceptable at steps 2510 and 2518, controller 466 proceeds to step 2522 and subsequent steps to identify an operating mode in which heat transfer device 430 supplies process fluid to cooling load 433 at a temperature lower than the supply temperature setpoint minus the control range value.

[0191] At step 2524, the controller determines whether CoilEDB_Max from the past 48 hours is less than CoilEDB_SP_3D. If not, method 2500 proceeds to step 2526 and skips consideration of implementing mode 3 (dry) to save the capacity of PCM tank 438 for potentially high heat loads that may soon occur. Similarly, method 2500 includes step 2528, where controller 466 may skip determining whether to utilize mode 4 or 7 (dry) to save the cooling capacity of PCM tank 438 for potentially higher heat loads that may soon occur. Furthermore, at step 2530, controller 466 may skip determining 2532: Figure 16 Whether the wet operation of Mode 3 can meet the supply temperature setpoint and control range to save on the cooling of the PCM tank for higher heat loads that may occur during the day.

[0192] For the operating mode of Method 2500, a proportional-integral-derivative (PID) loop or other methods can be used to determine the fan speed, chiller evaporator and condenser flow rates, outlet fluid temperature setpoint, and / or PCM tank flow rate for a particular implementation.

[0193] Methods 1900A, 1900B, 2100A, 2100B, and 2500 have been described with respect to heat transfer device 430. It should be understood that methods 1900A, 1900B, 2100A, 2100B, and 2500 can be used with other heat transfer devices disclosed herein. Furthermore, these methods may have steps that can be added or removed depending on the specific application requirements of methods 1900A, 1900B, 2100A, 2100B, and 2500.

[0194] about Figure 99A heat transfer system 2600 is provided, comprising heat transfer devices 2602A to N that receive heated process fluid from a structure (e.g., building 2608) via a process fluid supply line 2604 and supply cooled process fluid to a process fluid return line 2606. The process fluid supply line 2604 and the process fluid return line 2606 may include piping (e.g., pipes) and other process fluid handling devices (e.g., pumps and valves) to control the flow of process fluid between the heat transfer devices 2602A to N and the industrial process within building 2608.

[0195] Building 2608 houses industrial processes, such as manufacturing processes or computer data centers. Heat transfer units 2602A to 2602N include their respective chiller units. For example, heat transfer units 2602A to 2602N may be, for example... Figure 1 Heat transfer device 10 Figure 69 Heat transfer device 1350, or Figure 102 The heat transfer device 2700.

[0196] For reference only Figure 102 The heat transfer device 2700 includes a fluid cooler 2702, which includes a fluid cooling coil 2704, an adiabatic cooler 2706 upstream of the fluid cooling coil 2704, an air inlet 2709, an air outlet 2710, and a fan 2708. The fan 2708 is operable to generate an airflow from the air inlet 2709, through the adiabatic precooler 2706, across the fluid cooling coil 2704, and outward from the air outlet 2710. The heat transfer device 2700 includes a chiller unit 2712 within an external structure 2714 of the heat transfer device 2700.

[0197] about Figure 100 A heat transfer system 2800 is provided, comprising a heat transfer device 2802 that receives heated process fluid from an industrial process in a building 2814 via a process fluid supply line 2804 and returns cooled process fluid to the building 2814 via a process fluid return line 2806. Each heat transfer device 2802 has a process fluid inlet 2810 connected to the process fluid supply line 2804 and a process fluid outlet 2812 connected to the process fluid return line 2806. The heat transfer system 2800 removes heat from the process fluid received from the building 2814.

[0198] about Figure 101A heat transfer system 2900 is provided, comprising heat transfer devices 2902A to 2902N, each having a fluid cooler 2904 and a separate chiller unit and pump subsystem 2906. The chiller unit and pump system 2906 can be housed in a room of building 2914 or in a separate structure. As some examples, the heat transfer devices 2902A to 2902N can be, for example... Figure 59 Heat transfer device 1150, Figure 62 Heat transfer device 1220, Figure 64 The heat transfer device 1302, and Figure 70 The heat transfer devices 1390, each of heat transfer devices 2902A to 2902N, receive heated process fluid via process fluid supply line 2910 and supply cooled process fluid to building 2914 via process fluid return line 2912. Heat transfer devices 2902A to 2902N have piping 2916 connecting fluid cooler 2904 to chiller unit and pump subsystem 2906.

[0199] about Figure 103 It provides a heat transfer device 3000, which is Figure 102 An example of a heat transfer device 2700. The heat transfer device 3000 includes a fluid cooler 3002 with an adiabatic precooler 3004, the precooler 3004 having a precooling pad 3006, a collection tank 3008, and a pump 3010 for supplying liquid from the collection tank 3008 to the precooling pad 3006. The fluid cooler 3002 also includes a fluid cooling coil 3012 that receives process fluid from a valve 3014 and directs cooled fluid to a valve 3016. The heat transfer device 3000 includes a chiller unit 3020 with a condenser 3022 and an evaporator 3024. Valves 3014 and 3016 are operable to direct process fluid to or around the condenser 3022 and the evaporator 3024. Valves 3014 and 3016 can also regulate the percentage of process fluid bypassing and flowing in parallel to condenser 3022 and evaporator 3024, for example, 0% to 100% of the process fluid from cooling load 3030. Cooling load 3030 may be, for example, a computer data center.

[0200] refer to Figure 103 The heat transfer device 3000 has a first operating mode in which valve 3014 allows the process fluid to bypass condenser 3022, and valve 3016 bypasses evaporator 3024 by directing the process fluid to bypass conduit 3032. In the first operating mode, the heat transfer device 3000 utilizes natural cooling to cool the process fluid from cooling load 3030. In other words, as an example, fluid cooler 3002 removes heat from the process fluid to cool it from 105°F to 84°F.

[0201] about Figure 104 The heat transfer device 3000 is shown in a second operating mode, wherein valve 3014 directs a portion of the process fluid from cooling load 3030 to condenser 3022, causing the process fluid to absorb heat from condenser 3022. The heat transfer device 3000 has a connection 3040 at which process fluid at 115°F from condenser 3022 mixes with process fluid at 105°F from cooling load 3030. Fluid cooling coil 3012 receives the mixed process fluid at 108°F, which is hotter than the 105°F process fluid received by fluid cooling coil 3012 in the first operating mode (see [link to relevant documentation]). Figure 103 By supplying a higher temperature process fluid to the fluid cooling coil 3012, the temperature difference between the process fluid in the fluid cooling coil 3012 and the ambient air temperature becomes larger, which increases the heat transfer efficiency from the fluid cooling coil 3012 to the air flowing across the fluid cooling coil 3012.

[0202] exist Figure 104 In the second operating mode, valve 3016 regulates or directs a portion of the process fluid from fluid cooling coil 3012 to evaporator 3024. Heat transfer device 3000 has a connection 3042 that mixes the process fluid from evaporator 3024 and the process fluid from fluid cooling coil 3012. This mixing at connection 3042 allows the process fluid to be returned to cooling load 3030 at a temperature of 84°F. In this way, heat transfer device 3000 can utilize natural cooling in the first operating mode when cooling demand is low or ambient temperature is low, and can utilize both natural and mechanical cooling in the second operating mode when cooling demand is high or ambient temperature is high.

[0203] about Figure 105 A heat transfer device 3100 is provided, which includes a fluid cooler 3102 having a first fluid circuit 3106. The first fluid circuit 3106 includes a direct heat exchanger 3104 and a portion of a heat exchanger 3108. The direct heat exchanger 3104 may be, for example, an open evaporative heat exchanger that distributes liquid onto packing after the liquid has absorbed heat from the heat exchanger 3108. The direct heat exchanger 3104 has a collection tank 3110 for collecting liquid and a pump 3112 for guiding the collected liquid back to the heat exchanger 3108. The liquid may be, for example, water or a mixture of water and propylene glycol. The heat transfer device 3100 has a second fluid circuit 3130 that receives process fluid from a cooling load 3132. The process fluid may be, for example, water or a mixture of water and propylene glycol. The second fluid circuit 3130 includes a portion of the heat exchanger 3108 and a chiller unit 3120 having a condenser 3122 and an evaporator 3124.

[0204] The heat transfer device 3100 includes valves 3134, 3136 for directing process fluid to or around the condenser 3122 and evaporator 3124. The heat transfer device 3100 has a first configuration (see...). Figure 105 Valves 3134 and 3136 allow the process fluid to bypass the condenser 3122 and evaporator 3124, causing the fluid cooler 3102 to cool the process fluid from the cooling load 3132. The heat transfer device 3100 has a second mode (see...). Figure 106 Valve 3134 directs at least a portion of the process fluid from cooling load 3132 to condenser 3122, and valve 3136 directs at least a portion of the process fluid from heat exchanger 3108 to evaporator 3124.

[0205] about Figure 107 A heat transfer device 3200 is provided, which includes a fluid cooler 3202 (e.g., a direct heat exchanger 3204) and a chiller unit 3206. The direct heat exchanger 3204 may include, for example, an open evaporative heat exchanger that distributes process fluid onto packing material so that the process fluid can contact the airflow 3207.

[0206] The heat transfer device 3200 has a first operating mode (see...) Figure 107 Valves 3210 and 3212 allow process fluids to bypass chiller 3206. In the first operating mode, direct heat exchanger 3204 provides cooling for cooling load 3220. Heat transfer unit 3200 has a second operating mode (see...). Figure 108 Valve 3210 directs at least a portion of the process fluid from cooling load 3220 to condenser 3230 of chiller 3206, and valve 3212 directs at least a portion of the process fluid from direct heat exchanger 3204 to evaporator 3232 of chiller 3206. Therefore, in Figure 108 In the second operating mode, the heat transfer device 3200 uses both the direct heat exchanger 3204 and the chiller unit 3206 to provide cooling for the cooling load 3220.

[0207] about Figure 109A heat transfer device 3300 is provided, which includes a fluid cooler 3302 and a chiller unit 3304. The fluid cooler 3302 includes an adiabatic precooler 3303 and a fluid cooling coil 3306. The chiller unit 3304 has a hot-side heat exchanger 3310 and a cold-side heat exchanger 3312. The chiller unit 3304 may be, for example, an elastothermal (e.g., shape memory alloy) heat pump, a magnetothermal heat pump, or a vapor compression-based chiller. The heat transfer device 3300 has valves 3320 and 3322, which are operable to control the flow of process fluid from a cooling load 3330 in the heat transfer device 3300. More specifically, the heat transfer device 3300 has a first operating mode in which the valves 3320 and 3322 allow the process fluid to bypass the chiller unit 3304, such that the fluid cooler 3302 provides cooling for the cooling load 3330. The heat transfer device 3300 also has a second operating mode (see Figure 110 Valve 3320 directs at least a portion of the process fluid from cooling load 3330 to hot-side heat exchanger 3310, and valve 3322 directs at least a portion of the process fluid from fluid cooling coil 3306 to cold-side heat exchanger 3312.

[0208] Heat transfer devices 3000, 3100, 3200, and 3300 are in... Figures 103 to 110 The components are shown integrated within external structures 3003, 3101, 3201, and 3301. In other embodiments, the heat transfer devices 3000, 3100, 3200, and 3300 can be arranged in a similar manner to... Figure 101 The heat transfer devices 2902A to 2902N utilize the chiller units 3003, 3101, 3201, and 3301 as external structures.

[0209] refer to Figure 111 , 115 References 116 and 119 provide methods 3500, 3600, 3700, and 3800 for operating heat transfer devices 3000, 3100, 3200, and 3300. Methods 3500, 3600, 3700, and 3800 are similar in many respects to the methods discussed above. Methods 3500, 3600, 3700, and 3800 will be discussed with respect to heat transfer device 3000, but it should be understood that methods 3500, 3600, 3700, and 3800 can be used for heat transfer devices 3100, 3200, and 3300, as well as other heat transfer devices discussed above.

[0210] about Figure 111 When the heat transfer device 3000 is powered on, the controller 3001 of the heat transfer device 3000 starts method 3500. At step 3502, the controller 3001 uses parameters 3580, 3582, and 3584 (see...) Figure 112The initial operating mode of the heat transfer device 3000 is determined by evaluating logic operations 3504, 3506, 3508, and 3510 to select one of operating modes 3501, 3503, 3505, and 3507. Step 3502 involves calculating the current CoilEDB and comparing it with the CoilEDB setpoints for the different operating modes 3501, 3503, 3505, and 3507.

[0211] Once the controller 3001 determines the initial operating mode of the heat transfer device 3000 at step 3502, the controller 3001 configures the heat transfer device 3000 to that operating mode, namely operating mode 3501, 3503, 3505, or 3507. During the operation of the heat transfer device 3000, the controller periodically or in response to events (such as user input, fan or pump failure, or a sudden increase in cooling load) evaluates logic operations 3512 to 3522 to determine whether to reconfigure the heat transfer device 3000 to a different operating mode.

[0212] refer to Figure 113 Table 3550 is provided, which has columns 3552 for logical operations 3504 to 3510 of method 3500, column 3554 for condition 3556 of logical operations 3504 to 3510, and column 3558 for initial operation modes 3501 to 3507 selected if the associated condition 3556 is true.

[0213] refer to Figure 114 Table 3570 is provided, which has columns 3572 for logical operations 3512 to 3522, columns 3574 for the current operating modes 3501 to 3507 of the heat transfer device 3000, columns 3576 for the conditions 3577 of logical operations 3512 to 3522, and columns 3578 for the operating modes 3501 to 3507 selected if the associated condition 3577 is true.

[0214] about Figure 115 A method 3600 is provided, which is similar to method 3500 in many respects and can be used by controller 3001 to operate heat transfer device 3000. One difference between method 3500 and 3600 is that method 3600 begins at step 3602 and advances 3604 to operate heat transfer device 3000 in operation mode 3501 whenever heat transfer device 3000 starts running. In this way, controller 3001 always operates heat transfer device 3000 in operation mode 3501 when heat transfer device 3000 is started, which may be desirable in some embodiments.

[0215] After the heat transfer device 3000 has started operating in operation mode 3501, the controller 3001 evaluates logic operation 3512 to determine whether the controller 3001 should reconfigure the heat transfer device 3000 to operation mode 3505. The controller 3001 evaluates logic operation 3512 in response to, for example, the elapsed time period, changes in operating conditions, or user input. The controller 3001 uses logic operations 3512 to 3522 to sequentially switch between operation modes 3501 to 3507 in a manner similar to other methods discussed herein.

[0216] about Figure 116 The controller 3001 can utilize method 3700 to select initial operating modes 3701, 3703, 3705, and 3707 when the heat transfer device 3000 is started, and to reconfigure the heat transfer device 3000 in operating modes 3701 to 3707 in response to changing conditions. Method 3700 includes determining the initial operating mode of the heat transfer device 3000 at step 3702. Step 3702 includes using... Figure 112 The parameters 3580, 3582, 3584 and the CoilEDB setpoints of operation modes 3701 to 3707 are used to evaluate logic operations 3704, 3706, 3708, and 3710.

[0217] about Figure 117 Table 3750 is provided, which includes columns 3752 for logical operations 3704 to 3710, column 3754 for condition 3756 of logical operations 3704 to 3710, and column 3758 for operation mode 3760 that can be selected when condition 3756 of logical operations 3704 to 3710 is true.

[0218] Once the controller 3001 selects an initial operating mode 3701 to 3707, the controller 3001 continuously or periodically uses the logic operations 3712 to 3724 of method 3700 and one or more parameters 3582, 3584 to evaluate whether to reconfigure the heat transfer device 3000 to a different one of the operating modes 3701 to 3707.

[0219] refer to Figure 118 Table 3770 is provided, which includes column 3772 of reference numerals for logic operations 3712 to 3724, column 3774 of the current operating mode, column 3776 of condition 3778 for logic operations 3712 to 3724, and column 3780 of operating modes 3701-3707 selected when condition 3778 of logic operations 3712 to 3724 is true. In this way, as operating conditions change, controller 3001 can progressively reconfigure heat transfer device 3000 to various operating modes 3701 to 3707.

[0220] about Figure 119 A method 3800 is provided, which is similar in many respects to method 3700 discussed above. Method 3800 can be used by controller 3001 to reconfigure heat transfer device 3000 between operating modes 3701 and 3707. One difference between method 3700 and 3800 is that method 3800 begins at step 3802 and utilizes logic operations 3804 and 3806 to determine whether to start heat transfer device 3000 in operating mode 3701 or operating mode 3703. Logic operation 3804 checks whether the dry-bulb temperature is below the dry-type switching point. If so, controller 3001 configures heat transfer device 3000 to operate in operating mode 3701. If the dry-bulb temperature is not below the dry-type switching point, logic operation 3806 causes controller 3001 to reconfigure heat transfer device 3000 to operate in operating mode 3703.

[0221] Figure 120 This is a state machine diagram of method 4000, which can be used by a controller of one of the heat transfer devices disclosed herein to control the heat transfer device. Method 4000 is similar to method 3500 discussed above and includes operating modes 4002, 4004, and 4006. Method 4000 includes a logic operation 4008 for determining an initial operating mode at step 4010 and switching between operating modes 4002, 4004, and 4006 during operation of the heat transfer device. The controller evaluates the logic operation 4008 using associated parameters such as dry-bulb temperature, relative humidity, process fluid return temperature, and process fluid flow rate.

[0222] One difference between methods 3500 and 4000 is that method 4000 does not include a mode in which the fluid cooler of the heat transfer device operates in wet mode and the chiller unit of the heat transfer device is shut down. Instead, the chiller unit of the heat transfer device is used for regulated cooling in modes 4004 and 4006. The chiller unit of the heat transfer device can operate at a higher capacity in mode 4006 because the fluid cooler operates in wet mode, whereas the fluid cooler operates in dry mode in mode 4004.

[0223] about Figure 121A method 4100 is provided, which is similar to method 4000 in many respects. Method 4100 includes operating modes 4102, 4104, and 4106, and logic operation 4108 for changing the heat transfer device between different operating modes 4102, 4104, and 4106. When the heat transfer device is started, it operates in mode 4102. The controller then evaluates logic operation 4108 to sequentially switch between modes 4102, 4104, and 4106. For example, if the heat transfer device is operating in mode 4102, the controller evaluates logic operation 4108A to determine whether to reconfigure the heat transfer device to mode 4104.

[0224] about Figure 122 A heat transfer system 4200 is provided for cooling process fluids from industrial processes within a building 4202, such as computer racks. System 4200 includes different types of central chiller modules 4204 and 4206, which can be operated differently to provide different cooling capacities of system 4200 to handle the cooling load of building 4202 as needed. Central chiller module 4204 includes a fluid cooler 4210 that provides cooling for one or more chiller units within a machine room 4212. Machine room 4212 may include, for example, chiller units, heat exchangers, and / or pumps. Central chiller module 4206 includes an open cooling tower 4214 that provides cooling for one or more chiller units in a machine room 4216.

[0225] about Figure 123 A heat transfer device 4300 is provided, comprising a hybrid cooler 4302 and a chiller unit 4304, to remove heat from the process fluid from the cooling load 4305. The hybrid cooler 4302 can operate in dry or wet mode. In one embodiment, the hybrid cooler 4302 can operate in dry, wet, or adiabatic mode. The heat transfer device 4300 is shown as an integrated unit, wherein the hybrid cooler 4302 and the chiller unit 4304 are disposed within the housing 4306 of module 4308. In other embodiments, for example... Figure 146 The heat transfer device 4300 can have a distributed configuration, in which the hybrid cooler 4302 and the chiller unit 4304 are independent units.

[0226] about Figure 124A heat transfer device 4400 is provided, which includes a mixing cooler 4402, a chiller unit 4404, and a cold storage device 4406. The heat transfer device 4400 can operate the mixing cooler 4402 in dry, wet, or adiabatic modes. The cold storage device 4406 can be used to provide adjusted or additional heat transfer in conjunction with, or in lieu of, the heat transfer provided by the chiller unit 4404. The cold storage device 4406 may include a phase change material tank. An example of a cold storage device is an ice storage system.

[0227] about Figure 125 A heat transfer device 4500 is provided as a first example of a heat transfer device 4300. The heat transfer device 4500 includes a chiller unit 4502 and a mixing cooler 4504 to remove heat from a cooling load 4514. The mixing cooler 4504 has a dry cooling coil 4506, a direct heat exchanger 4508, and a heat exchanger 4510. The heat exchanger 4510 transfers heat between ethylene glycol in the ethylene glycol loop 4512 associated with the cooling load 4514 and water in the water loop 4516 of the mixing cooler 4504.

[0228] The direct heat exchanger 4508 includes a heat transfer medium (e.g., packing plates) and an evaporative liquid distribution system 4521 for supplying water to the heat transfer medium via a water loop 4516. The liquid distribution system 4521 may include nozzles for spraying water onto the packing plates, a collection basin 4520 for collecting water from the packing plates, and a pump 4522 for pumping fluid from the collection basin 4520 to the nozzles.

[0229] The mixing cooler 4504 includes a fan 4507 (e.g., one or more fans) to generate airflow relative to the packing plates of the dry cooling coil 4506 and the direct heat exchanger 4508. The air traveling through the direct heat exchanger 4508 cools the water distributed to the packing plates by the evaporative liquid distribution system 4521. The dry cooling coil 4506 and the direct heat exchanger 4508 have, for example... Figure 125 The parallel airflow path is shown. In another embodiment, the dry cooling coil 4506 and the direct heat exchanger 4508 are arranged in series, wherein the same airflow sequentially cools the direct heat exchanger 4508 and the dry cooling coil 4506.

[0230] The hybrid cooler 4504 can utilize a dry cooling coil 4506, a direct heat exchanger 4508, or both. The heat transfer device 4500 operates the dry cooling coil 4506 when the hybrid cooler 4504 is operating in dry mode, operates the direct heat exchanger 4508 when the hybrid cooler 4504 is operating in wet mode, and operates both the dry cooling coil 4506 and the direct heat exchanger 4508 when the hybrid cooler 4504 is operating in hybrid mode. The hybrid cooler 4504 has valves 4530 and 4532 to selectively allow process fluid to bypass the dry cooling coil 4506 and / or the heat exchanger 4510 according to the mode of the hybrid cooler 4504 set by the controller 4529 of the heat transfer device 4500.

[0231] exist Figure 125 In the diagram, heat transfer device 4500 is shown in a first water-saving mode, where the mixing cooler 4504 is in dry mode, and heat transfer device 4500 utilizes natural cooling. More specifically, valves 4540 and 4542 allow process fluid from cooling load 4514 to bypass chiller unit 4502, valve 4530 directs process fluid through dry cooling coil 4506, and valve 4532 allows process fluid to bypass heat exchanger 4510. Dry cooling coil 4506 transfers heat to the airflow generated by fan 4507. In this way, dry cooling coil 4506 provides cooling for the process fluid from cooling load 4514.

[0232] about Figure 126 The heat transfer device 4500 is shown in a second energy-saving mode, in which the hybrid cooler 4504 operates in wet mode and the chiller unit 4502 is shut down. In the second mode, the heat transfer device 4500 utilizes natural cooling to remove heat from the process fluid received from the cooling load 4514.

[0233] In the second mode, valves 4540 and 4542 allow the process fluid to bypass the chiller 4502, and valve 4530 allows the process fluid to bypass the dry cooling coil 4506. Valve 4532 directs the fluid through heat exchanger 4510, and pump 4522 is operated to circulate water in water loop 4516. Additionally, fan 4507 directs airflow through the packing of direct heat exchanger 4508. Water in water loop 4516 absorbs heat from glycol loop 4512 at heat exchanger 4510, is sprayed onto the packing of direct heat exchanger 4508, dissipates heat to the airflow directed through the packing, and is collected in collection tank 4520 before being pumped to heat exchanger 4510.

[0234] about Figure 127The heat transfer device 4500 is shown in a third mixed cooling mode, in which the mixed cooler 4504 operates in mixed mode and utilizes natural cooling to remove heat from the cooling load 4514. More specifically, in the third mode, valves 4540 and 4542 allow process fluid to bypass the chiller unit 4502, valves 4530 and 4532 guide the process fluid through the dry cooling coil 4506 and the heat exchanger 4510, and pump 4522 circulates water in the water loop 4516. Furthermore, fan 4507 guides airflow through the packing of the direct heat exchanger 4508 and the dry cooling coil 4506.

[0235] about Figure 128 The heat transfer device 4500 is shown in a fourth-stage water-adjustable cooling mode, which utilizes dry cooling and a chiller unit 4502. More specifically, in the fourth mode, valves 4540 and 4542 direct at least a portion of the process fluid through the chiller unit 4502, valve 4530 directs the process fluid through the dry cooling coil 4506, and valve 4532 allows the process fluid to bypass the heat exchanger 4510. The chiller unit 4502 has a condenser 4550 that transfers heat to the process fluid directed to the condenser 4550 by valve 4540. The chiller unit 4502 has an evaporator 4552 that removes heat from the process fluid directed to the evaporator 4552 by valve 4542.

[0236] about Figure 129 The heat transfer device 4500 is shown in a fifth energy-efficient cooling mode, utilizing wet cooling and a chiller unit 4502. More specifically, valves 4540 and 4542 direct at least a portion of the process fluid through the chiller unit 4502, valve 4530 allows the process fluid to bypass the dry cooling coil 4506, and valve 4532 directs the process fluid to the heat exchanger 4510. Pump 4522 directs water from a collection tank 4520 to the heat exchanger 4510 to absorb heat from the process fluid and directs the water to the packing of the direct heat exchanger 4508. The water sprayed onto the packing of the direct heat exchanger 4508 is cooled by the airflow through the heat exchanger 4508 and collected in the collection tank 4520. Valve 4542 directs at least a portion of the cooled process fluid from the heat exchanger 4510 to the evaporator 4552 of the chiller unit 4502.

[0237] about Figure 130 The heat transfer device 4500 is shown in the sixth maximum cooling mode, in which the dry cooling coil 4506, the direct heat exchanger 4508, the heat exchanger 4510 and the chiller 4502 are all used to cool the process fluid from the cooling load 4514.

[0238] refer to Figure 131A heat transfer device 4600 is provided, which is a second example of the heat transfer device 4300 described above. The heat transfer device 4600 includes a chiller unit 4602 and a mixing cooler 4604. The heat transfer device 4600 is similar to the heat transfer device 4500 described above in many respects.

[0239] One difference between heat transfer devices 4500 and 4600 is that the mixing cooler 4604 of heat transfer device 4600 has a valve 4608 that can direct process fluid to heat exchanger 4610, dry cooling coil 4612, or both. The mixing cooler 4604 also includes a direct heat exchanger 4614, which may include packing, a collection tank 4616, and a pump 4618. The direct heat exchanger 4614 utilizes a water loop 4620 to remove heat from the glycol loop 4622 of heat transfer device 4600 via heat exchanger 4610.

[0240] exist Figure 131 In the diagram, device 4600 is shown in a first water-saving mode, where only the dry cooling coil 4612 removes heat from the process fluid from the cooling load 4630. Figure 132 In the diagram, device 4600 is shown in a second energy-saving mode, wherein direct heat exchangers 4614 and 4610 remove heat from the process fluid of cooling load 4630. Figure 133 In the diagram, heat transfer device 4600 is shown in a third mixing mode, where valve 4608 directs process fluid to both heat exchanger 4610 and dry cooling coil 4612. In the third mixing mode, valves 4640 and 4642 direct process fluid around chiller 4602.

[0241] about Figure 134 The heat transfer device 4600 is shown in the fourth water-adjusted cooling mode, wherein valves 4640 and 4642 direct at least a portion of the process fluid through the chiller unit 4602, and valve 4608 directs the process fluid to the dry cooling coil 4612.

[0242] about Figure 135 The heat transfer device 4600 is shown in a fifth energy-saving supplemental adjustment mode, wherein the chiller 4602, heat exchanger 4610, and direct heat exchanger 4614 are operated to remove heat from the process fluid. Valves 4640 and 4642 direct at least a portion of the process fluid to the chiller 4602, and valve 4608 directs the process fluid to the heat exchanger 4610. The heat exchanger 4610 transfers heat from the process fluid to the water loop 4620.

[0243] about Figure 136The heat transfer device 4600 is shown in the sixth maximum cooling mode, wherein the chiller 4602, heat exchanger 4610, direct heat exchanger 4614, and dry cooling coil 4612 operate to remove heat from the process fluid of the cooling load 4630. More specifically, valves 4640 and 4642 direct at least a portion of the process fluid to the chiller 4602, and valve 4608 directs the process fluid to both the heat exchanger 4610 and the dry cooling coil 4612. In this way, in addition to the mechanical cooling provided by the chiller 4602, the airflow across the direct heat exchanger 4614 and the dry cooling coil 4612 also removes heat from the heat transfer device 4600.

[0244] about Figure 137 A heat transfer device 4700 is provided, which is similar in many respects to the heat transfer devices 4500 and 4600 discussed above. One difference is that the heat transfer device 4700 includes a mixing cooler 4702 with an adiabatic cooler 4704 located upstream of the dry cooling coil 4706 in the airflow path. The adiabatic cooler 4704 includes one or more precooling media, such as one or more precooling pads 4708, a pump 4710 for pumping water onto the precooling pads 4708, and a collection tank 4712 for collecting water from the precooling pads 4708. The adiabatic cooler 4704 includes a water loop 4713 that recirculates water between the collection tank 4712 and the precooling pads 4708. In another embodiment, the adiabatic cooler 4704 is an once-through system in which water is not recirculated in the water loop 4713. In a direct-flow system, a collection tank 4712 is not used. A direct-flow adiabatic cooler 4704 can be used, for example, in implementations utilizing stacked adiabatic coolers.

[0245] The mixing cooler 4702 also includes a direct heat exchanger 4714, a collection tank 4716, a pump 4718, and a heat exchanger 4720. The direct heat exchanger has a water loop 4715, which is different from water loop 4713. In another embodiment, water loops 4713 and 4715 can be connected and share water.

[0246] The mixing cooler 4702 also includes valves 4722 and 4724 for selectively directing process fluid to the dry cooling coil 4706, the heat exchanger 4720, or both. The heat transfer device 4700 also includes a chiller unit 4730, which can replace or work with the mixing cooler 4702 to remove heat from the process fluid.

[0247] exist Figure 137In this configuration, heat transfer device 4700 is shown in one mode where dry cooling coil 4706, precooling pad 4708, heat exchanger 4720, direct heat exchanger 4714, and chiller 4730 are operated to remove heat from the process fluid of cooling load 4750. In another mode, pump 4710 is shut off, and the air upstream of dry cooling coil 4706 is not adiabatically precooled, but dry cooling coil 4706, heat exchanger 4720, direct heat exchanger 4714, and chiller 4730 are operated to remove heat from the process fluid of cooling load 4750.

[0248] about Figure 138 A heat transfer device 4800 is provided, which is similar to the heat transfer device 4700 discussed above and includes a mixing cooler 4802. One difference is that the mixing cooler 4802 has a heat exchanger 4804 and a dry cooling coil 4806 connected in parallel. The mixing cooler 4802 has a valve 4810 for directing process fluid to the heat exchanger 4804, the dry cooling coil 4806, or both.

[0249] about Figure 139 A heat transfer device 4900 is provided, which is a fifth example of the heat transfer device 4300 discussed above. The heat transfer device 4900 has a mixing cooler 4902, which includes a dry cooling coil 4904, an indirect heat exchanger 4906, a direct heat exchanger 4908, and an evaporative liquid distribution system 4910 with a water loop 4911. The dry cooling coil 4904 may include one or more tubes and fins connected to the one or more tubes. The mixing cooler 4902 has valves 4912, 4914, 4915, and 4917 operable to direct process fluid of cooling load 4916 to chiller unit 4918, dry cooling coil 4904, indirect heat exchanger 4906, or a combination thereof.

[0250] about Figures 140 to 142 The mixing cooler 4902 of the heat transfer device 4900 can operate in energy-saving mode, adiabatic mode, and water-saving mode. More specifically, in energy-saving mode, the mixing cooler 4902 has a fan 4930 that guides air through the direct heat exchanger 4908, the indirect heat exchanger 4906, and the dry cooling coil 4904. The evaporative liquid distribution system 4910 distributes evaporative liquid (e.g., water) to the indirect heat exchanger 4906 to absorb heat from it. The water falls onto the direct heat exchanger 4908, is cooled by the airflow passing through it, and is collected in the collection pool 4932 of the evaporative liquid distribution system 4910.

[0251] refer to Figure 141In adiabatic mode, the evaporative liquid distribution system 4910 sprays water onto the indirect heat exchanger 4906, which is not currently receiving process fluid. The water then flows from the indirect heat exchanger 4906 onto the direct heat exchanger 4908. The water on the direct heat exchanger 4908 adiabatically cools the air traveling through it before it reaches the dry cooling coil 4904, thus improving the heat transfer efficiency of the dry cooling coil 4904.

[0252] about Figure 142 In water-saving mode, the indirect heat exchanger 4906 and the dry cooling coil 4904 receive process fluid and transfer heat from the process fluid to the airflow generated by the fan 4930. Furthermore, the evaporative liquid distribution system 4910 does not spray liquid onto the indirect heat exchanger 4906 to limit water consumption.

[0253] about Figure 143 A heat transfer device 5000 is provided, which is similar in many respects to the heat transfer device 4900 discussed above. The heat transfer device 5000 has a mixing cooler 5002, which includes a dry cooling coil 5004, a direct heat exchanger 5006, and an evaporative liquid distribution system 5008 for distributing water to the dry cooling coil 5004. The water distributed to the dry cooling coil 5004 absorbs heat from the dry cooling coil 5004 and proceeds to the direct heat exchanger 5006, which exchanges heat from the water to the air traveling through the direct heat exchanger 5006. The mixing cooler 5002 has a valve 5010 configured to direct process fluid toward or bypass the dry cooling coil 5004. In addition, the heat transfer device 5000 includes valves 5020 and 5022, which are configured to direct process fluid to or bypass the chiller unit 5012. Figure 143 In the diagram, the heat transfer device 5000 is shown in a mode in which the chiller 5012 and the dry cooling coil 5004 remove heat from the process fluid of the cooling load 5014, while the direct heat exchanger 5006 removes heat from the water distributed to the dry cooling coil 5004.

[0254] about Figure 144A heat transfer device 5100 is provided, which is another example of the heat transfer device 4300 discussed above. The heat transfer device 5100 has a mixing cooler 5102, which includes a dry cooling coil 5104 and a direct heat exchanger 5106. The heat transfer device 5100 has an ethylene glycol loop 5107 that receives water as a process fluid from a cooling load 5112. The mixing cooler 5102 has valves 5108 and 5110, which are operable to selectively direct water through one, both, or neither of the dry cooling coil 5104 and the direct heat exchanger 5106, depending on the operating mode of the heat transfer device 5100. The heat transfer device 5100 also includes valves 5120 and 5122, which are operable to selectively guide some water, all water, or no water through the chiller unit 5114 of the heat transfer device 5100, depending on the operating mode of the heat transfer device 5100.

[0255] about Figure 145 A heat transfer device 5200 is provided, which is similar to the heat transfer device 5100 and has a water loop 5201 with a mixing cooler 5202 and a chiller unit 5210. The mixing cooler 5202 has a direct heat exchanger 5204, a dry cooling coil 5206, and a valve 5208 operable to direct water to one or more of the direct heat exchanger 5204 and the dry cooling coil 5206. In this way, depending on the operating mode of the heat transfer device 5200, the direct heat exchanger 5204 and / or the dry cooling coil 5206 can be used in conjunction with the chiller unit 5210 of the heat transfer device 5200.

[0256] refer to Figure 146 A heat transfer device 5300 is provided, which is another example of a heat transfer device 4300. Instead of integrating all its components into a single unit, the heat transfer device 5300 has a distributed arrangement of a hybrid cooler 5302, which includes a dry cooler 5304, a direct heat exchanger 5306, a heat exchanger 5308, and valves 5310, 5311 for selectively directing process fluids to the dry cooler 5304 and / or the heat exchanger 5308. The heat transfer device 5300 also includes a chiller unit 5312 and a heat exchanger 5314.

[0257] Heat exchanger 5314 separates the glycol loop 5316 of heat transfer unit 5300 from the water loop 5320 of cooling load 5318. In some embodiments, it may be desirable to use water inside the building containing cooling load 5318 because water may be easier to clean up if it overflows or leaks in water loop 5320. Direct heat exchanger 5306 is an open cooling tower and has an open tower water loop 5322.

[0258] about Figure 147 A controller for a heat transfer device having a hybrid cooler as disclosed herein can control the heat transfer device using method 5400. The controller uses parameter 5410 to evaluate logic operation 5408 to select an initial operating load and to change the heat transfer device between operating modes 5402, 5404, and 5406 during operation.

[0259] about Figure 148 A controller for a heat transfer device having a hybrid cooler as disclosed herein can control the operation of the heat transfer device using method 5500. Method 5500 includes starting the heat transfer device in mode 5502 upon startup. In mode 5502, the heat transfer device is naturally cooled using only the dry cooling coils of the hybrid cooler. The controller then evaluates logic operation 5504 to switch the heat transfer device between modes 5502, 5505, and 5506 during operation.

[0260] about Figure 149 The controller of the heat transfer device with a mixing cooler can use method 5600 to switch the operation of the heat transfer device between operating modes 5602, 5604, 5606, 5608, 5610, and 5612. The controller uses parameter 5622 to evaluate logic operation 5620 to select an initial operating mode and to change the heat transfer device between operating modes 5602, 5604, 5606, 5608, 5610, and 5612 during operation.

[0261] about Figure 150 A controller for a heat transfer device with a mixing cooler can control the operation of the heat transfer device using method 5700. The controller evaluates logic operation 5702 to select an initial operating mode among operating modes 5704 and 5706. Logic operation 5702 includes determining whether the dry-bulb air temperature is below the dry-operation switching point. The controller then evaluates logic operation 5708 to cause the heat transfer device to change between operating modes 5710, 5712, 5714, and 5716.

[0262] about Figure 151 , Figure 152 , Figure 153 , Figure 154 Heat transfer devices 5800, 5820, 5840, and 5860 are provided, which are similar to the heat transfer devices discussed above. Heat transfer devices 5800, 5820, 5840, and 5860 have heat exchangers 5802, 5822, 5844, and 5864, which separate chilled water loops 5804, 5824, 5846, and 5866 from ethylene glycol loops 5808, 5828, 5848, and 5868.

[0263] about Figures 155 to 159The system provides heat transfer devices 5900, 5920, 5940, 5960, and 5980, which are similar in many respects to the heat transfer devices discussed above. One difference is that each of the heat transfer devices 5900, 5920, 5940, 5960, and 5980 has a bypass device, such as valves 5902, 5922, 5942, 5962, and 5982, which are operable to selectively direct process fluid to fluid coolers 5904, 5924, 5944, 5964, and 5984, or to direct it around these fluid coolers. Valves 5902, 5922, 5942, 5962, and 5982 are operable to partially, wholly, or not direct process fluid to the corresponding fluid coolers 5904, 5924, 5944, 5964, and 5984, depending on the operating mode of the heat transfer devices 5900, 5920, 5940, 5960, and 5980. For example, when the ambient temperature is low, fluid coolers 5904, 5924, 5944, 5964, and 5984 can be bypassed, and process fluid below a threshold temperature can be returned to the associated cooling load.

[0264] Unless otherwise indicated herein or in obvious contradiction of context, singular terms such as “a” and “an” are intended to encompass both the singular and plural. The terms “comprising,” “having,” “including,” and “containing” should be understood as open-ended terms. The phrase “at least one” as used herein is intended to be interpreted in a separate sense. For example, the phrase “at least one of A and B” is intended to encompass A and B, or both A and B.

[0265] While specific embodiments of the invention have been described and illustrated, it should be understood that many variations and modifications will occur to those skilled in the art, and the invention is intended to cover all such variations and modifications that fall within the scope of the appended claims.

Claims

1. A heat transfer device for an industrial process requiring a process fluid at a set temperature, the heat transfer device comprising: A process fluid heat exchange circuit for receiving process fluid at a temperature different from the set temperature of the process fluid, and for supplying process fluid at the set temperature of the process fluid, the process fluid heat exchange circuit comprising: A mechanical cooler having a hot-side heat exchanger and a cold-side heat exchanger; A hybrid cooler for receiving process fluid from the hot-side heat exchanger of the mechanical cooler and supplying cooled process fluid to the cold-side heat exchanger of the mechanical cooler; An airflow generator, operable to bring air into contact with the mixing cooler; The hybrid cooler includes a direct heat exchanger and an indirect heat exchanger, the hybrid cooler having a dry mode, wherein the indirect heat exchanger transfers heat from the process fluid to the air, and a hybrid mode, wherein the indirect heat exchanger and the direct heat exchanger transfer heat from the process fluid to the air; The process fluid heat exchange loop has multiple modes, including: In the first mode, the process fluid bypasses the mechanical cooler, and the mixing cooler is in the dry mode; The second mode, wherein the mechanical cooler removes heat from the process fluid, and the hybrid cooler is in the dry mode; A third mode, wherein the process fluid bypasses the mechanical cooler, and the hybrid cooler is in the hybrid mode; and A fourth mode, wherein the mechanical cooler removes heat from the process fluid, and the hybrid cooler is in the hybrid mode; and A controller operably connected to the process fluid heat exchange loop, the controller being configured to operate the process fluid heat exchange loop in one of the plurality of modes, at least in part based on the determination of the heat load of the heat transfer device.

2. The heat transfer device according to claim 1, wherein, When the process fluid heat exchange loop is in the first mode and the second mode, the process fluid bypasses the direct heat exchanger.

3. The heat transfer device according to claim 1, wherein, The hybrid cooler has a wet mode, wherein the direct heat exchanger transfers heat from the process fluid to the air; The various modes of the process fluid heat exchange loop include: The fifth mode, wherein the process fluid bypasses the mechanical cooler, and the hybrid cooler is in the wet mode; and The sixth mode, wherein the mechanical cooler removes heat from the process fluid, and the hybrid cooler is in the wet mode.

4. The heat transfer device according to claim 3, wherein, When the process fluid heat exchange loop is in the fifth and sixth modes, the process fluid bypasses the indirect heat exchanger.

5. The heat transfer device according to claim 1, wherein, The direct heat exchanger includes: A heat exchanger is used to transfer heat between the process fluid and the liquid; Heat transfer medium; and A liquid distribution system operable to distribute the liquid onto the heat transfer medium.

6. The heat transfer device according to claim 5, wherein, The heat transfer medium includes packing sheets and / or packing blocks.

7. The heat transfer device according to claim 1, wherein, The hybrid cooler also includes an adiabatic cooler operable to cool the air upstream of the indirect heat exchanger.

8. The heat transfer device according to claim 1, wherein, The hybrid cooler has a wet mode, wherein the direct heat exchanger transfers heat from the process fluid to the air; The various modes of the process fluid heat exchange loop include: The fifth mode, wherein the process fluid bypasses the mechanical cooler, and the hybrid cooler is in the wet mode; and The sixth mode, wherein the mechanical cooler removes heat from the process fluid, and the hybrid cooler is in the wet mode; The hybrid cooler includes: Secondary indirect heat exchanger; The heat transfer medium, which is located below the secondary indirect heat exchanger; and A liquid distribution system operable to distribute liquid to the secondary indirect heat exchanger and the heat transfer medium below it when the mixing cooler is in the wet mode or the mixing mode. Wherein, when the process fluid heat exchange circuit is in the first mode and the second mode, the mixing cooler is in the dry mode, and the secondary indirect heat exchanger transfers heat between the process fluid and the air; Wherein, when the process fluid heat exchange circuit is in the fifth and sixth modes, the mixing cooler is in the wet mode, and the liquid distribution system distributes the liquid to the secondary indirect heat exchanger and the heat exchange medium; and In the case where the process fluid heat exchange circuit is in the third mode and the fourth mode, the mixing cooler is in the mixing mode, and the liquid distribution system distributes liquid to the secondary indirect heat exchanger and the heat exchange medium.

9. The heat transfer device according to claim 1, wherein, The direct heat exchanger includes a heat transfer medium located below the indirect heat exchanger and a liquid distribution system operable to distribute liquid onto the indirect heat exchanger, such that the liquid travels from the indirect heat exchanger toward the direct heat exchanger. and Wherein, when the process fluid heat exchange loop is in the third mode, the liquid distribution system distributes liquid to the indirect heat exchanger; and In the case where the process fluid heat exchange circuit is in the first mode, the liquid distributed by the liquid distribution system to the indirect heat exchanger is less than the liquid in the third mode.

10. The heat transfer device according to claim 1, wherein, The process fluid heat exchange circuit also includes a heat exchanger operably connected to the cooling load. The process fluids mentioned above include a first process fluid and a second process fluid; The process fluid heat exchange loop includes a first process fluid loop, which includes the mechanical cooler, the mixing cooler, and a first portion of the heat exchanger. and The second process fluid loop includes the cooling load and a second portion of the heat exchanger, which is configured to transfer heat between the first process fluid and the second process fluid.

11. The heat transfer device according to claim 1, wherein, The process fluid heat exchange circuit does not include a cold storage device.

12. The heat transfer device according to claim 1, wherein, Determining the heat load of the heat transfer device includes determining whether the process fluid heat exchange circuit can provide the process fluid at the set temperature of the process fluid.

13. The heat transfer device according to claim 1, wherein, The heat load of the heat transfer device is determined at least in part based on the temperature of the process fluid supplied by the process fluid heat exchange loop, the set temperature of the process fluid, and control range parameters.

14. The heat transfer device according to claim 1, wherein, The controller is configured to operate the process fluid heat exchange loop in one of the operating modes, at least in part, based on the dry-bulb temperature and a dry-bulb temperature setpoint associated with the operating mode, when the heat transfer device is started.

15. The heat transfer device according to claim 1, further comprising an external structure; and The mechanical cooler, the direct heat exchanger, and the indirect heat exchanger are located within the external structure.

16. The heat transfer device according to claim 1, wherein, The mechanical cooler includes a water chiller unit; The heat exchanger on the hot side includes a condenser; and The cold-side heat exchanger mentioned above includes an evaporator.

17. The heat transfer device according to claim 1, wherein, The process fluid heat exchange loop in the first mode and the third mode is configured to allow the process fluid to bypass the mechanical cooler in the following manner: The process fluid is directed to bypass the mechanical cooler; or The mechanical cooler is not operated while the process fluid flows through it.

18. A heat transfer device for an industrial process requiring a process fluid at a set temperature, the heat transfer device comprising: A process fluid heat exchange circuit for receiving a process fluid at a temperature different from a set temperature of the process fluid, the process fluid heat exchange circuit comprising: A mechanical cooler having a hot-side heat exchanger and a cold-side heat exchanger; A fluid cooler for receiving the process fluid from the hot-side heat exchanger and providing cooled process fluid to the cold-side heat exchanger; An airflow generator, operable to bring air into contact with the fluid cooler; The fluid cooler has a wet mode, wherein the fluid cooler uses liquid to facilitate heat transfer from the process fluid to the air; and a dry mode, wherein the fluid cooler uses less liquid than in the wet mode to facilitate heat transfer from the process fluid to the air. The process fluid heat exchange loop can operate in multiple modes, including: In the first mode, the process fluid bypasses the mechanical cooler, and the fluid cooler in its dry mode removes heat from the process fluid. The second mode, wherein the mechanical cooler and the fluid cooler in its dry mode remove heat from the process fluid; A third mode, wherein the process fluid bypasses the mechanical cooler, and the fluid cooler in its wet mode removes heat from the process fluid; and A fourth mode, wherein the mechanical cooler and the fluid cooler in its wet mode remove heat from the process fluid; and A controller operably connected to the process fluid heat exchange circuit, the controller being configured to cause the process fluid heat exchange circuit to change between the operating modes, based at least in part on a determination of whether the process fluid heat exchange circuit is capable of providing the process fluid at the process fluid set temperature.

19. The heat transfer device according to claim 18, wherein, The determination of whether the process fluid heat exchange circuit can provide the process fluid at the process fluid set temperature is based at least in part on the temperature of the process fluid supplied by the process fluid heat exchange circuit, the process fluid set temperature, and the control range parameters.

20. The heat transfer device according to claim 19, wherein, When the process fluid heat exchange circuit is in the first mode, the controller is configured to change the process fluid heat exchange circuit to the second mode, at least in part, based on the fact that the temperature of the process fluid supplied by the process fluid heat exchange circuit is greater than the sum of the process fluid set temperature and the control range parameter.

21. The heat transfer device according to claim 19, wherein, The controller has an energy-saving mode, wherein when the process fluid heat exchange circuit is in the second mode, the controller is configured to change the process fluid heat exchange circuit to the third mode, at least in part, based on the dry bulb temperature meeting the dry switching point condition.

22. The heat transfer device according to claim 19, wherein, When the process fluid heat exchange circuit is in the second mode, the controller is configured to change the process fluid heat exchange circuit to the third mode, at least in part, based on the fact that the temperature of the process fluid supplied by the process fluid heat exchange circuit is greater than the sum of the process fluid set temperature and the control range parameter.

23. The heat transfer device according to claim 19, wherein, When the process fluid heat exchange circuit is in the third mode, the controller is configured to change the process fluid heat exchange circuit to the fourth mode, at least in part, based on the fact that the temperature of the process fluid supplied by the process fluid heat exchange circuit is greater than the sum of the process fluid set temperature and the control range parameter.

24. The heat transfer device according to claim 19, wherein, The controller is configured to change the process fluid heat exchange circuit from the fourth mode to the third mode, from the third mode to the second mode, or from the second mode to the first mode, at least in part based on the fact that the temperature of the process fluid supplied by the process fluid heat exchange circuit is less than the difference between the process fluid supply temperature and the control range parameter.

25. The heat transfer device according to claim 19, wherein, The controller has an energy-saving mode and a water-saving mode; and The control range parameters include a first control range parameter for the energy-saving mode and different second control range parameters for the water-saving mode.

26. The heat transfer device according to claim 18, wherein, The controller is configured to operate the process fluid heat exchange loop in the first mode, second mode, third mode, or fourth mode, based at least in part on the dry-bulb temperature and a dry-bulb temperature setpoint associated with the first mode, second mode, third mode, and fourth mode.

27. The heat transfer device according to claim 26, wherein, The fluid cooler includes an indirect heat exchanger and an adiabatic cooler, the adiabatic cooler being operable to cool the air upstream of the indirect heat exchanger; and The dry-bulb temperature mentioned therein includes the dry-bulb temperature of the air after the adiabatic cooler and before the indirect heat exchanger.

28. The heat transfer device according to claim 18, wherein, The controller is configured to select one of the operating modes for the initial operation of the process fluid heat exchange loop based at least in part on the temperature of the air, the relative humidity of the air, the return temperature of the process fluid, and the flow rate of the process fluid.

29. The heat transfer device according to claim 18, wherein, The determination of whether the process fluid heat exchange loop can provide the process fluid at the set temperature is based at least in part on: Dry bulb temperature; and The threshold dry-bulb temperature used to operate the fluid cooler in the wet mode.

30. The heat transfer device according to claim 18, wherein, The fluid cooler includes an indirect heat exchanger and an adiabatic cooler, the adiabatic cooler being operable to cool the air upstream of the indirect heat exchanger.

31. The heat transfer device according to claim 18, wherein, The fluid cooler includes a hybrid cooler with a direct heat exchanger and an indirect heat exchanger; In the case where the fluid cooler is in the wet mode, the process fluid bypasses the indirect heat exchanger, and the direct heat exchanger removes heat from the process fluid. In the case where the fluid cooler is in the dry mode, the process fluid bypasses the direct heat exchanger, and the indirect heat exchanger removes heat from the process fluid. The fluid cooler has a mixing mode, wherein the direct heat exchanger and the indirect heat exchanger remove heat from the process fluid.

32. The heat transfer device according to claim 18, further comprising an external structure; and The mechanical cooler and fluid cooler are located within the external structure.

33. The heat transfer device according to claim 18, wherein, The mechanical cooler includes a water chiller unit; The heat exchanger on the hot side includes a condenser; and The cold-side heat exchanger mentioned above includes an evaporator.

34. The heat transfer device according to claim 18, wherein, The process fluid heat exchange circuit also includes a heat exchanger operably connected to the cooling load. The process fluids mentioned above include a first process fluid and a second process fluid; The process fluid heat exchange loop includes a first process fluid loop, which includes the mechanical cooler, the fluid cooler, and a first part of the heat exchanger. and The second process fluid loop includes the cooling load and a second portion of the heat exchanger, which is configured to transfer heat between the first process fluid and the second process fluid.

35. The heat transfer device according to claim 18, wherein, The fluid cooler includes a hybrid cooler with a direct heat exchanger and an indirect heat exchanger; In the case where the fluid cooler is in the dry mode, the process fluid bypasses the direct heat exchanger, and the indirect heat exchanger removes heat from the process fluid. In the case where the fluid cooler is in the wet mode, the process fluid bypasses the indirect heat exchanger, and the direct heat exchanger removes heat from the process fluid. The fluid cooler has a mixing mode, wherein the direct heat exchanger and the indirect heat exchanger remove heat from the process fluid; The process fluid heat exchange loop has a fifth mode, wherein the process fluid bypasses the mechanical cooler, and the fluid cooler is in the mixed mode; and The process fluid heat exchange loop has a sixth mode, wherein the mechanical cooler and the fluid cooler in its mixed mode remove heat from the process fluid.

36. A heat transfer device for an industrial process requiring a process fluid at a set temperature, the heat transfer device comprising: A process fluid heat exchange circuit for receiving a process fluid at a temperature different from a set temperature of the process fluid, the process fluid heat exchange circuit comprising: A mechanical cooler having a hot-side heat exchanger and a cold-side heat exchanger; A fluid cooler operable to receive the process fluid from the hot-side heat exchanger and provide cooled process fluid to the cold-side heat exchanger; An airflow generator, operable to bring air into contact with the fluid cooler; The fluid cooler has a wet mode, wherein the fluid cooler uses liquid to facilitate heat transfer from the process fluid to the air; and a dry mode, wherein the fluid cooler uses less liquid than in the wet mode to facilitate heat transfer from the process fluid to the air. The process fluid heat exchange loop can operate in multiple modes, including: In the first mode, the process fluid bypasses the mechanical cooler, and the fluid cooler in its dry mode removes heat from the process fluid. The second mode, wherein the mechanical cooler and the fluid cooler in its dry mode remove heat from the process fluid; A third mode, wherein the process fluid bypasses the mechanical cooler, and the fluid cooler in its wet mode removes heat from the process fluid; and A fourth mode, wherein the mechanical cooler and the fluid cooler in its wet mode remove heat from the process fluid; and A controller, operably connected to the process fluid heat exchange loop, is configured to, at least in part, cause the process fluid heat exchange loop to change between the operating modes based on a determination of whether the process fluid heat exchange loop can provide the process fluid at a set temperature; and The determination of whether the process fluid heat exchange circuit can provide the process fluid at the process fluid set temperature is based at least in part on the temperature of the process fluid supplied by the process fluid heat exchange circuit, the process fluid set temperature, and the control range parameters.

37. The heat transfer device according to claim 36, wherein, When the process fluid heat exchange circuit is in the first mode, the controller is configured to change the process fluid heat exchange circuit to the second mode, at least in part, based on the fact that the temperature of the process fluid supplied by the process fluid heat exchange circuit is greater than the sum of the process fluid set temperature and the control range parameter.

38. The heat transfer device according to claim 36, wherein, The controller has an energy-saving mode, wherein when the process fluid heat exchange circuit is in the second mode, the controller is configured to change the process fluid heat exchange circuit to the third mode, at least in part, based on the dry bulb temperature meeting the dry switching point condition.

39. The heat transfer device according to claim 36, wherein, When the process fluid heat exchange circuit is in the second mode, the controller is configured to change the process fluid heat exchange circuit to the third mode, at least in part, based on the fact that the temperature of the process fluid supplied by the process fluid heat exchange circuit is greater than the sum of the process fluid set temperature and the control range parameter.

40. The heat transfer device according to claim 36, wherein, When the process fluid heat exchange circuit is in the third mode, the controller is configured to change the process fluid heat exchange circuit to the fourth mode, at least in part, based on the fact that the temperature of the process fluid supplied by the process fluid heat exchange circuit is greater than the sum of the process fluid set temperature and the control range parameter.

41. The heat transfer device according to claim 36, wherein, The controller is configured to change the process fluid heat exchange circuit from the fourth mode to the third mode, from the third mode to the second mode, or switch the process fluid heat exchange circuit from the second mode to the first mode, at least in part based on the fact that the temperature of the process fluid supplied by the process fluid heat exchange circuit is less than the difference between the process fluid supply temperature and the control range parameter.

42. The heat transfer device according to claim 36, wherein, The controller has an energy-saving mode and a water-saving mode; and The control range parameters include a first control range parameter for the energy-saving mode and different second control range parameters for the water-saving mode.

43. The heat transfer device according to claim 36, wherein, The controller is configured to operate the process fluid heat exchange loop in the first mode, second mode, third mode, or fourth mode, based at least in part on the dry-bulb temperature and a dry-bulb temperature setpoint associated with the first mode, second mode, third mode, and fourth mode.

44. The heat transfer device according to claim 43, wherein, The fluid cooler includes an indirect heat exchanger and an adiabatic cooler, the adiabatic cooler being operable to cool the air upstream of the indirect heat exchanger; and The dry-bulb temperature mentioned therein includes the dry-bulb temperature of the air after the adiabatic cooler and before the indirect heat exchanger.

45. The heat transfer device according to claim 36, wherein, The controller is configured to select one of the operating modes for the initial operation of the process fluid heat exchange loop based at least in part on the temperature of the air, the relative humidity of the air, the return temperature of the process fluid, and the flow rate of the process fluid.

46. ​​The heat transfer device according to claim 36, wherein, The determination of whether the process fluid heat exchange loop can provide the process fluid at the set temperature is based at least in part on: Dry bulb temperature; and The threshold dry-bulb temperature used to operate the fluid cooler in the wet mode.

47. The heat transfer device according to claim 36, wherein, The fluid cooler includes an indirect heat exchanger and an adiabatic cooler, the adiabatic cooler being operable to cool the air upstream of the indirect heat exchanger.

48. The heat transfer device according to claim 36, wherein, The fluid cooler includes a hybrid cooler with a direct heat exchanger and an indirect heat exchanger; In the case where the fluid cooler is in the wet mode, the process fluid bypasses the indirect heat exchanger, and the direct heat exchanger removes heat from the process fluid. In the dry mode, when the fluid cooler is in operation, the process fluid bypasses the direct heat exchanger, and the indirect heat exchanger removes heat from the process fluid. The fluid cooler has a mixing mode, wherein the direct heat exchanger and the indirect heat exchanger remove heat from the process fluid.

49. The heat transfer device according to claim 36, further comprising an external structure; and The mechanical cooler and fluid cooler are located within the external structure.

50. The heat transfer device according to claim 36, wherein, The mechanical cooler includes a water chiller unit; The heat exchanger on the hot side includes a condenser; and The cold-side heat exchanger mentioned above includes an evaporator.

51. The heat transfer device according to claim 36, wherein, The process fluid heat exchange circuit also includes a heat exchanger operably connected to the cooling load. The process fluids mentioned above include a first process fluid and a second process fluid; The process fluid heat exchange loop includes a first process fluid loop, which includes the mechanical cooler, the fluid cooler, and a first part of the heat exchanger. and The second process fluid loop includes the cooling load and a second portion of the heat exchanger, which is configured to transfer heat between the first process fluid and the second process fluid.

52. The heat transfer device according to claim 36, wherein, The fluid cooler includes a hybrid cooler with a direct heat exchanger and an indirect heat exchanger; In the case where the fluid cooler is in the dry mode, the process fluid bypasses the direct heat exchanger, and the indirect heat exchanger removes heat from the process fluid. In the case where the fluid cooler is in the wet mode, the process fluid bypasses the indirect heat exchanger, and the direct heat exchanger removes heat from the process fluid. The fluid cooler has a mixing mode, wherein the direct heat exchanger and the indirect heat exchanger remove heat from the process fluid; The process fluid heat exchange loop has a fifth mode, wherein the process fluid bypasses the mechanical cooler, and the fluid cooler is in the mixed mode; and The process fluid heat exchange loop has a sixth mode, wherein the mechanical cooler and the fluid cooler in its mixed mode remove heat from the process fluid.

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