An electronic device

Abstract

Embodiments of the present application provide an electronic device, comprising a display module, a frame, a back cover, a decoration assembly, a battery and a circuit board, the display module and the back cover are arranged on opposite sides of the frame, the back cover and the frame are integrally formed, the back cover comprises a first cover body and a second cover body, the first cover body and the second cover body are arranged side by side along a first direction, the decoration assembly is arranged in extension along a second direction and is arranged in layers along a third direction on a side of the first cover body away from the display module, the battery is arranged on a side of the first cover body adjacent to the display module, and the circuit board is arranged on a side of the second cover body adjacent to the display module. By integrally forming the back cover and the frame, the internal accommodation space of the electronic device can be effectively improved, and by arranging the battery and the circuit board side by side, the thickness of the electronic device can be effectively reduced.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] With the development of information technology, mobile electronic devices such as mobile phones and tablets are becoming more and more popular. With the support of various sensors with sensing characteristics, electronic devices are becoming more and more functional, and the space allocation problem of electronic devices is becoming more and more severe. It is necessary to meet the demand for thin and light electronic devices while satisfying the diversification of electronic device functions.

[0003] Currently, mobile phones and other electronic devices typically use a "sandwich" stacked architecture, consisting of a display module, a mid-frame, and a back cover. Because the mid-frame has a metal plate for fixing components such as batteries and circuit boards, and because the battery occupies internal space, the thickness of the electronic device cannot be further reduced. Therefore, adjusting the stacked architecture of electronic devices to reduce their thickness is one of the main research directions. Summary of the Invention

[0004] To address the aforementioned technical problems, embodiments of this application provide an electronic device that reduces its thickness by adjusting its internal stacking architecture, thereby achieving a thinner and lighter electronic device.

[0005] This application provides an electronic device including a display module, a frame, a back cover, a decorative component, a battery, and a circuit board. The display module and the back cover are disposed on opposite sides of the frame, and the back cover and the frame are integrally formed. The back cover includes a first cover body and a second cover body, which are arranged side by side along a first direction. The decorative component extends along a second direction and is stacked along a third direction on the side of the first cover body away from the display module. The battery is disposed on the side of the first cover body adjacent to the display module, and the circuit board is disposed on the side of the second cover body adjacent to the display module. The first direction is perpendicular to the second direction, and the plane containing the first direction and the second direction is parallel to the plane containing the display module. The third direction is perpendicular to the plane containing the display module.

[0006] By molding the back cover and the frame as a single piece, the internal space of the electronic device can be increased, thereby reducing the thickness of the electronic device. At the same time, placing the battery and the circuit board side by side can further save the space occupied by the battery while ensuring the battery volume, so that there is enough space in the area where the first cover and the circuit board are located to place other components.

[0007] Optionally, the distance between the first cover and the display module is a first distance, the distance between the second cover and the display module is a second distance, the first distance is less than the second distance, the first cover, the second cover and the frame are arranged to form a receiving groove on the side of the rear cover away from the display module, and the decorative component is disposed in the receiving groove.

[0008] Optionally, the decorative component includes a decorative surface and a decorative abutting surface disposed opposite to each other. The decorative abutting surface abuts against the first cover. The second cover includes a back shell surface and a cover surface disposed opposite to each other. The cover surface is the side of the second cover adjacent to the display module, and the back shell surface is the side of the second cover away from the display module. The decorative surface and the back shell surface are located on the same plane.

[0009] By setting the first cover to be closer to the display module than the second cover, the first cover, the second cover, and the frame together form a receiving groove. The decorative component is placed in the receiving groove, and the decorative surface of the decorative component is further controlled to be on the same plane as the back shell surface of the second cover. That is, the decorative component and the second cover are controlled to be flush with each other on the side away from the display module, so as to avoid the decorative component protruding relative to the second cover, thereby improving the smooth lines and overall aesthetics of the electronic device body.

[0010] Optionally, the circuit board is positioned upwards along the third direction and directly opposite the first cover. The circuit board is provided with a processing module for receiving instructions to control the display module to display. The battery is positioned upwards along the third direction and directly opposite the second cover. The battery is used to provide power to the circuit board.

[0011] By controlling the circuit board to be positioned directly opposite the first cover and the battery to be positioned directly opposite the second cover, the thickness of the area containing the first cover and the circuit board is less than the thickness of the area containing the battery and the second cover. This allows for the provision of space for decorative components and other components without increasing the thickness of the electronic device.

[0012] Optionally, the electronic device includes a first region and a second region disposed adjacent to each other along the first direction, with the first cover located in the first region and the second cover located in the second region. The circuit board includes a main body extending along the second direction and an extension extending along the first direction, the main body and the extension being arranged in an "L" shape. The main body is located in the first region, and the extension is located in the second region and is arranged side-by-side with the battery along the second direction. By arranging the circuit board and battery side-by-side, sufficient continuous space is provided between the first and second regions for the circuit board, avoiding the need for interruptions or additional installations to accommodate the battery.

[0013] Optionally, the electronic device further includes a first antenna assembly, which includes a first antenna and a second antenna. The frame includes a first side frame and a second side frame arranged in parallel with each other. The first side frame is located in the first region, and the second side frame is located in the second region. The first antenna and the second antenna are arranged adjacent to the first side frame. The first antenna and the second antenna each include at least one radiator. The first side frame is a metal frame and is reused as the radiator of the first antenna and the second antenna.

[0014] By setting the first and second antennas on the first side frame and reusing the metal frame as the radiator of the first and second antennas, antenna space can be saved. At the same time, since the decorative component covers the first area, the decorative component can completely cover the antenna slot structure, improving the overall aesthetics of the electronic device.

[0015] Optionally, the frame further includes a top frame and a bottom frame arranged relatively parallel to each other, and the first antenna assembly further includes a third antenna, a fourth antenna, a fifth antenna, and a sixth antenna. The third antenna, the fourth antenna, and the fifth antenna are arranged adjacent to the top frame, and the sixth antenna is arranged adjacent to the bottom frame. The third antenna, the fourth antenna, the fifth antenna, and the sixth antenna each include at least one radiator. The top frame and the bottom frame are metal frames. The top frame is multiplexed as the radiator of the third antenna, the fourth antenna, and the fifth antenna, and the bottom frame is multiplexed as the radiator of the sixth antenna.

[0016] Optionally, the electronic device further includes a second antenna assembly, which is stacked between the decorative assembly and the first cover and is positioned opposite the circuit board.

[0017] Since the thickness of the first region is determined only by the first cover, the circuit board, and the back cover, and the thickness of the first region is less than that of the second region, other components can be set in the first region. For example, the second antenna component can be set between the decorative component and the first cover. This can increase the types of antennas for the electronic device and increase the functions of the electronic device without increasing the thickness of the electronic device.

[0018] Optionally, the second antenna assembly includes a near-field communication antenna, which is connected to the circuit board via a pre-set communication interface on the first cover. The near-field communication antenna is used to receive or transmit wireless signals.

[0019] Optionally, the second antenna assembly includes a satellite communication circuit and a satellite communication antenna, which are arranged side by side. The satellite communication circuit receives and transmits signals through the satellite communication antenna. The satellite communication circuit is electrically connected to the circuit board through a communication interface preset on the first cover. The satellite communication antenna is used to receive or transmit wireless signals.

[0020] Compared to the problems of existing technologies, the embodiments of this application can increase the internal storage space of electronic devices by integrally molding the back cover and the frame, thereby reducing the thickness of electronic devices. At the same time, the parallel arrangement of the battery and the circuit board can further save the space occupied by the battery while ensuring the battery volume, so that the first area can have extra space to set up the second antenna component and other components. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the disassembled structure of an electronic device provided for related technologies;

[0023] Figure 2 A schematic diagram of the disassembled structure of an electronic device provided in an embodiment of this application;

[0024] Figure 3 for Figure 2 Schematic diagram of the rear cover layout;

[0025] Figure 4 for Figure 2 Schematic diagram of the internal layout of electronic equipment in China;

[0026] Figure 5 for Figure 3 A schematic diagram of the cross-sectional structure of the electronic device along A-A';

[0027] Figure 6 for Figure 2 A schematic diagram of the layout of antenna components in Chinese electronic devices;

[0028] Figure 7 This is a schematic diagram of the first layout of the second antenna component;

[0029] Figure 8 This is a schematic diagram of the second layout for the second antenna component. Detailed Implementation

[0030] To facilitate a clear description of the technical solutions of this application, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that the terms "first" and "second" do not necessarily imply that they are different.

[0031] References to "one embodiment" or "some embodiments" as described in this application specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this application specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0032] This application provides an electronic device, including but not limited to mobile phones, tablets, laptops, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), dashcams, virtual reality devices, wireless USB flash drives, Bluetooth speakers / headphones, or in-vehicle pre-installed devices, etc., which are mobile or fixed terminals with back covers and mid-frames.

[0033] Furthermore, in the embodiments of this application, the electronic device can also be a terminal device in the Internet of Things (IoT) system. IoT is an important part of the future development of information technology. Its main technical feature is to connect objects to the network through communication technology, thereby realizing an intelligent network of human-machine interconnection and object-to-object interconnection.

[0034] The electronic devices in the embodiments of this application may also be referred to as: terminal devices, user equipment (UE), mobile station (MS), mobile terminal (MT), access terminal, user unit, user station, mobile station, mobile station, remote station, remote terminal, mobile device, user terminal, terminal, wireless communication device, user agent, or user equipment, etc.

[0035] Please see Figure 1 , Figure 1A schematic diagram of the disassembled structure of an electronic device 100 provided for related technologies.

[0036] like Figure 1 As shown, the electronic device 100 includes a display module 10, a mid-frame 2, a back cover 30, a battery 60, and a circuit board 50. The mid-frame 2, circuit board 50, and battery 60 are disposed between the display module 10 and the back cover 30. The circuit board 50 and battery 60 may be disposed on the mid-frame 2; for example, the circuit board 50 and battery 60 may be disposed on the side of the mid-frame 2 facing the back cover 30. In other embodiments, the circuit board 50 and battery 60 may also be disposed on the side of the mid-frame 2 facing the display module 10.

[0037] Battery 60 can be connected to other devices via a charge / discharge management chip (not shown). The charge / discharge management chip can receive electrical energy from battery 60 and power the processor, internal memory, external memory, display module 10, camera, and communication module in electronic device 100. The charge / discharge management chip can also be used to monitor parameters such as battery capacity, battery cycle count, and battery health status (leakage current, impedance). The charge / discharge management chip can also receive externally input electrical energy to charge battery 60. In some embodiments, the charge / discharge management chip can be integrated into circuit board 50.

[0038] The middle frame 2 may include a metal plate and a border. The border surrounds the outer edge of the metal plate. Generally, the border can be a rectangle. For example, the border may include a top border and a bottom border positioned opposite each other, and a left border and a right border positioned opposite each other between the top and bottom borders. The sides of the middle frame 2 are the surfaces enclosed by the top border, bottom border, left border, and right border. The metal middle frame 2 and the border can be connected by welding, snap-fitting, or integral molding, or the metal middle frame 2 and the border can be connected by injection molding of plastic parts.

[0039] Since the middle frame 2 is provided with a metal plate to fix the battery 60 and the circuit board 50, the overall thickness of the device cannot be further reduced. Based on this, this application embodiment provides an electronic device architecture to reduce the thickness of the electronic device.

[0040] Please refer to the following: Figures 2-5 , Figure 2 This is a schematic diagram of the disassembled structure of an electronic device provided in an embodiment of this application. Figure 3 for Figure 2 Schematic diagram of the rear cover layout. Figure 4 for Figure 2 Internal layout diagram of electronic equipment in China Figure 5 for Figure 3 A schematic diagram of the cross-sectional structure of the electronic device along A-A'.

[0041] like Figures 2-5As shown, the electronic device 100 includes a display module 10, a frame 20, a back cover 30, and a decorative component 40. The display module 10 and the back cover 30 are disposed on opposite sides of the frame 20. The display module 10, the frame 20, and the back cover 30 together form a receiving cavity (not shown). A circuit board 50 and a battery 60 may also be disposed in the receiving cavity.

[0042] Here, the frame 20 refers to the side frame surrounding the electronic device 100, which can be made of metal, alloy, or plastic. In this embodiment, the frame 20 can be made of a conductive material, such as stainless steel or other metal or alloy materials. The second side 20b of the frame 20 is fixedly assembled with the back cover 30, which serves as the back of the electronic device 100. The back cover 30 can generally be made of metal, alloy, plastic, or leather.

[0043] In this embodiment, both the frame 20 and the back cover 30 are made of metal alloy and are integrally formed, so that the frame 20 and the back cover 30 form an all-metal unibody.

[0044] Electronic device 100 includes a first region A1 disposed adjacent to each other along a first direction F1. Figure 3 ) and the second area A2 ( Figure 3 The decorative component 40 is a long strip structure that extends along the second direction F2 and is positioned with the outer surface of the back cover 30 facing the first region A1.

[0045] The rear cover 30 includes a first cover 31 and a second cover 32. The first cover 31 is located in a first region A1, and the second cover 32 is located in a second region A2. The first cover 31 and the second cover 32 are arranged in a stepped manner in cross-section along a first direction F1. Figure 5 The distance between the first cover 31 and the display module 10 is a first distance s1, and the distance between the second cover 32 and the display module 10 is a second distance s2. The first distance s1 is less than the second distance s2, meaning the first cover 31 is closer to the display module 10 than the second cover 32, or in other words, the first cover 31 and the second cover 32 are not flush. The first cover 31, the second cover 32, and the frame 20 form a receiving groove C, and the decorative component 40 is disposed in the receiving groove C.

[0046] The decorative component 40 includes a decorative surface 41 and a decorative abutting surface 42 disposed opposite to each other. The decorative abutting surface 42 abuts against the first cover 31. The second cover 32 includes a cover surface 321 and a back shell surface 322 disposed opposite to each other. The cover surface 321 is the side of the second cover 32 adjacent to the display module 10, and the back shell surface 322 is the side away from the display module 10. The decorative surface 41 and the back shell surface 322 are located on the same plane, that is, the decorative component 40 and the second cover 32 are flush.

[0047] Circuit board 50 and battery 60 are arranged side-by-side along a first direction F1 between display module 10 and back cover 30. Circuit board 50 is positioned directly opposite the first cover 31 along a third direction F3, and battery 60 is positioned directly opposite the second cover 32 along a third direction F3. Circuit board 50 includes a main body extending along a second direction F2 and an extension extending along the first direction F1. The main body and the extension are arranged in an "L" shape. The main body is located in a first region A1, and the extension is located in a second region A2 and is arranged side-by-side with battery 60 along the second direction F2.

[0048] Circuit board 50 is a crucial component of the terminal device and serves as an essential carrier for software implementation. Circuit board 50 includes: a substrate, functional devices mounted on the substrate, and other components mounted on the substrate. Functional devices include, but are not limited to: a processing module for receiving instructions to control the display module, a voltage conversion circuit for voltage conversion, a power amplifier (PA) circuit for signal amplification, a camera for taking pictures or videos, or devices for controlling other functions (such as charging functions, image processing functions, etc.). This application embodiment does not limit the specific functions of the functional devices. Other components include, but are not limited to, resistors, capacitors, inductors, memory cards, sensors, or shielding plates. Circuit board 50 may also include accessories such as nuts and bolts for fixing. Components can be mounted on the substrate via solder joints.

[0049] This embodiment of the application integrates the frame 20 and the back cover 30 into one piece, which saves the installation of a metal plate while ensuring the strength of the electronic device body, thereby reducing the thickness of the electronic device 100. Furthermore, by arranging the battery 60 and the circuit board 50 side by side, this embodiment can increase the space of the first area A where the circuit board 50 is located while ensuring the space of the battery 60, thereby providing a space for the decorative component 40. This allows the decorative component 40 to be flush with the back cover 30, avoiding an increase in the thickness of the electronic device 100.

[0050] It is understood that the electronic device 100 may also include a camera module 71, an earpiece 72, a speaker 73, and a charging interface 74, etc. The camera module 71 may include a rear camera 711 and a front camera 712. The rear camera 711 may be located in the first area A1, and the front camera 712 may be located in the second area A2. The camera module is used to capture still images or videos. An object is projected onto a photosensitive element by generating an optical image through the lens. The photosensitive element may be a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The photosensitive element converts the light signal into an electrical signal, which is then transmitted to an ISP for conversion into a digital image signal. Finally, the ISP outputs the digital image signal to a DSP for processing. The DSP converts the digital image signal into standard RGB, YUV, or other image signal formats.

[0051] The earpiece 72 is located in the second area A2 near the front-facing camera 712, and the speaker 73 can be located in the second area A2 near the battery 60 on the side away from the speaker 73. The earpiece 72 is a device that converts audio electrical signals into sound signals without sound leakage, and is generally used for answering phone calls or listening to voice messages. When the earpiece 72 is used to play sound, generally only the user can hear the sound; this can also be called the terminal device being in earpiece mode. The speaker 73 is a transducer that converts electrical signals into sound signals, and can propagate sound over long distances. It is generally used for hands-free calling, playing music, and playing audio from videos. When the speaker 73 is used to play sound, the sound can be propagated over long distances and can be heard by others; this can also be called the terminal device being in speakerphone mode. The speaker 73 is generally located at the bottom of the electronic device 100. The earpiece 72 and the speaker 73 have similar structures; both use the force of a voice coil and a magnet to generate vibration, which in turn causes the diaphragm to vibrate and produce sound.

[0052] The charging port 74 is located adjacent to the speaker 73, that is, at the bottom of the electronic device 100. The charging port 74 is used to charge the electronic device 100 by connecting a charger, to transfer data between the electronic device 100 and external devices, to connect headphones for audio playback, and to connect other electronic devices, such as AR devices. The charging port 74 is a USB standard compliant interface, specifically a Mini USB interface, a Micro USB interface, or a USB Type-C interface.

[0053] Of course, the electronic device 100 in the embodiments of this application may also include various sensors, power management modules and motors, etc. The specific implementation and working principle of the above modules can be understood by those skilled in the art by referring to the relevant technologies, and this application will not elaborate on them further.

[0054] Please see Figure 6 , Figure 6 for Figure 2 A schematic diagram of the layout of antenna components in electronic devices.

[0055] like Figure 6 As shown, the electronic device 100 also includes a first antenna assembly 80A, which includes multiple radiators. The radiators are made of conductive materials, including but not limited to conductive materials such as metals and alloys. The specific shapes of the radiators include but are not limited to strips, sheets, rods, coatings, and films.

[0056] In this embodiment, all radiators are strip-shaped. Radiators can extend in a straight line, or extend along a curve or bend. This application does not limit the extension trajectory of the radiators. The radiators can be lines of uniform width along their extension trajectory, or strips of varying widths, such as those with gradually changing widths or widened areas. The radiator can be a metal frame on one side of the frame 20, that is, the frame 20 can be reused as the radiator for the first antenna assembly 80A. Of course, in other embodiments, if the frame 20 is made of plastic, a metal frame embedded within the frame 20 can also be used as the radiator. In this embodiment, a metal frame 20 is used as the radiator.

[0057] The following section explains the communication frequency bands supported by electronic devices.

[0058] LB band: also known as low frequency band, with a frequency range of 700MHz-960MHz. It mainly includes B5, B8, B12, B17, B20, and B28 of LTE (Long Term Evolution); GSM850 and GSM900 of GSM (Global System for Mobile Communications); CDMA0, WCDMA5, and WDMA8 of CDMA (Code Division Multiple Access); and N28 of 5G (5th Generation Mobile Communications Technology).

[0059] MHB band: also known as the mid-to-high frequency band, with a frequency range of 1710MHz-2690MHz. It mainly includes the B1, B3, B4, B7, B34, B38, B39, B40, and B41 bands for LTE; GSM1800 and GSM1900 bands for GSM; WCDMA1, WDMA2, WCDMA3, and WDMA4 bands for CDMA; and N1, N3, N7, N38, and N41 bands for 5G.

[0060] HB band: also known as high frequency band, mainly includes the N77 band (frequency range 3.3GHz-4.2GHz) and N78 band (frequency range 3.3GHz-3.8GHz) of 5G standard.

[0061] GPS frequency bands: GPS includes L1 and L5 frequency bands. The center operating frequency of the L1 band is 1.575 GHz, and the center operating frequency of the L5 band is 1.176 GHz. Single-frequency GPS only needs to support the L1 band, while dual-frequency GPS needs to support both L1 and L5 bands.

[0062] WiFi frequency bands: WiFi includes 2.4GHz and 5GHz bands. The 2.4GHz band has a frequency range of 2.402GHz to 2.48GHz, and the 5GHz band has a frequency range of 5.15GHz to 5.85GHz. Single-band WiFi only supports the 2.4GHz band, while dual-band WiFi needs to support both the 2.4GHz and 5GHz bands.

[0063] The frame 20 includes a first side frame 21 and a second side frame 22 arranged in parallel with each other, as well as a top frame 23 and a bottom frame 24 arranged in parallel with each other. The first side frame 21 is the side where the decorative component 40 and the circuit board 50 are arranged, the second side frame 22 is the side where the battery 60 is arranged, the top frame 23 is the side where the camera module 71 is arranged, and the bottom frame 24 is the side where the speaker 73 is arranged.

[0064] The first antenna assembly 80A may include a first antenna 81 and a second antenna 82, wherein the first antenna 81 and the second antenna 82 are sequentially disposed on the first side frame 21. The operating frequency band of the first antenna 81 may include the MHB band, the N78 band and the Wifi 2.4G band, and the operating frequency band of the second antenna 82 may include the LB band, such as LB-MAIN, LB-DIV, etc.

[0065] The first antenna assembly 80A further includes a third antenna 83, a fourth antenna 84, a fifth antenna 85, and a sixth antenna 86. The third antenna 83, fourth antenna 84, and fifth antenna 85 are sequentially disposed on the top frame 23. The operating frequency band of the third antenna 83 may include the MHB band, the N78 band, and the Wi-Fi 5G band; the operating frequency band of the fourth antenna 84 may include the Wi-Fi band and the L1 satellite positioning band; and the operating frequency band of the fifth antenna 85 may include the MHB band, the N78 band, and the Wi-Fi 2.4G band. The sixth antenna 86 is disposed on the bottom frame 24, and the operating frequency band of the sixth antenna 86 can be the MHB band.

[0066] Of course, in other embodiments, the operating frequency bands corresponding to each antenna can be adjusted according to specific needs, and this application does not impose any restrictions on this.

[0067] It should be noted that in the above embodiments, the first antenna assembly 80A also includes other electrical structures, such as radio frequency circuits, tuning switches, etc. Those skilled in the art can understand and fully implement these by referring to relevant technologies, and this application will not elaborate further on them.

[0068] By placing the antenna on the first side frame 21 and leaving the second side frame 22 completely without an antenna, the second side frame 22 can be made more streamlined, improving the aesthetics of the frame. Furthermore, the antenna portion on the first side frame 21 extends to the adhesive platform at the bottom of the decorative component 40, meaning that the decorative component 40 can cover the gap, thereby preventing the antenna gap from being exposed and improving the visual appeal.

[0069] Please refer to the following: Figure 7 and Figure 8 , Figure 7 This is a schematic diagram of the first layout for the second antenna component. Figure 8 This is a schematic diagram of the second layout for the second antenna component.

[0070] like Figure 7 As shown, the electronic device 100 may further include a second antenna assembly 80B, which is disposed between the decorative assembly 40 and the first cover 31, wherein the second antenna assembly 80B communicates via a communication interface CI disposed on the first cover 31. Figure 5The second antenna component 80B is connected to the circuit board 50. The second antenna component 80B may include a Near Field Communication (NFC) antenna, which communicates with the circuit board 50 via a communication interface CI. Since the thickness of the first region A1 is mainly composed of the decorative component 40, the first cover 31, the circuit board 50, and the display module 10, and there is no space occupied by the battery 60, the first region A1 has sufficient space for the second antenna component 80B. Compared to traditional NFC antenna installation schemes, this embodiment can effectively reduce the thickness of the electronic device 100.

[0071] In other implementations, the second antenna assembly 80B may include a satellite communication antenna b1 and a satellite communication circuit b2. Figure 8 The satellite communication circuit b2 is electrically connected to the circuit board 50 via the communication interface CI. The satellite communication antenna b1 is used to enhance the satellite communication function of the electronic device. Alternatively, the second antenna assembly 80B may include a signal enhancement antenna and a radio frequency circuit. The radio frequency circuit is electrically connected to the circuit board 50 via the communication interface CI. Its specific settings are consistent with those of the satellite communication antenna b1 and the satellite communication circuit b2. The signal enhancement antenna may be an N28 enhancement antenna or a B58 enhancement antenna.

[0072] The electronic device architecture provided in this application increases the space utilization of the electronic device without affecting the size of the battery, thereby improving the antenna layout space and enhancing the wireless communication signal performance and strength of the electronic device.

[0073] The above-disclosed embodiments are merely some of the embodiments of this application, and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments, and equivalent changes made in accordance with the claims of this application, still fall within the scope of this application.

Claims

1. An electronic device, characterized in that, The device includes a display module, a frame, a back cover, decorative components, a battery, and a circuit board. The display module and the back cover are disposed on opposite sides of the frame, and the back cover and the frame are integrally formed. The back cover includes a first cover body and a second cover body, which are arranged side by side along a first direction. The decorative components extend along a second direction and are stacked along a third direction on the side of the first cover body away from the display module. The battery is disposed on the side of the first cover body adjacent to the display module, and the circuit board is disposed on the side of the second cover body adjacent to the display module. The first direction is perpendicular to the second direction, and the plane containing the first direction and the second direction is parallel to the plane containing the display module. The third direction is perpendicular to the plane containing the display module.

2. The electronic device as claimed in claim 1, characterized in that, The distance between the first cover and the display module is a first distance, and the distance between the second cover and the display module is a second distance. The first distance is less than the second distance. The first cover, the second cover, and the frame are arranged to form a receiving groove on the side of the back cover away from the display module, and the decorative component is disposed in the receiving groove.

3. The electronic device as described in claim 2, characterized in that, The decorative component includes a decorative surface and a decorative abutting surface disposed opposite to each other. The decorative abutting surface abuts against the first cover. The second cover includes a back shell surface and a cover surface disposed opposite to each other. The cover surface is the side of the second cover adjacent to the display module, and the back shell surface is the side of the second cover away from the display module. The decorative surface and the back shell surface are located on the same plane.

4. The electronic device as claimed in claim 3, characterized in that, The circuit board is positioned upwards along the third direction and directly opposite the first cover. The circuit board is equipped with a processing module for receiving instructions to control the display module to display. The battery is positioned upwards along the third direction and directly opposite the second cover. The battery provides power to the circuit board.

5. The electronic device as claimed in claim 4, characterized in that, The electronic device includes a first region and a second region arranged adjacent to each other along the first direction. The first cover is located in the first region, and the second cover is located in the second region. The circuit board includes a main body extending along the second direction and an extension extending along the first direction. The main body and the extension are arranged in an "L" shape. The main body is located in the first region, and the extension is located in the second region and is arranged side by side with the battery in the second direction.

6. The electronic device as claimed in claim 5, characterized in that, The electronic device further includes a first antenna assembly, which includes a first antenna and a second antenna. The frame includes a first side frame and a second side frame arranged in parallel with each other. The first side frame is located in the first region, and the second side frame is located in the second region. The first antenna and the second antenna are arranged adjacent to the first side frame. The first antenna and the second antenna each include at least one radiator. The first side frame is a metal frame and is reused as the radiator of the first antenna and the second antenna.

7. The electronic device as claimed in claim 6, characterized in that, The frame also includes a top frame and a bottom frame arranged relatively parallel to each other. The first antenna assembly also includes a third antenna, a fourth antenna, a fifth antenna, and a sixth antenna. The third antenna, the fourth antenna, and the fifth antenna are arranged adjacent to the top frame, and the sixth antenna is arranged adjacent to the bottom frame. Each of the third antenna, the fourth antenna, the fifth antenna, and the sixth antenna includes at least one radiator. The top frame and the bottom frame are metal frames. The top frame is multiplexed as the radiator of the third antenna, the fourth antenna, and the fifth antenna, and the bottom frame is multiplexed as the radiator of the sixth antenna.

8. The electronic device as claimed in claim 7, characterized in that, The electronic device further includes a second antenna assembly, which is stacked between the decorative assembly and the first cover and is positioned opposite the circuit board.

9. The electronic device as claimed in claim 8, characterized in that, The second antenna assembly includes a near-field communication antenna, which is connected to the circuit board via a pre-set communication interface on the first cover. The near-field communication antenna is used to receive or transmit wireless signals.

10. The electronic device as claimed in claim 8, characterized in that, The second antenna assembly includes a satellite communication circuit and a satellite communication antenna, which are arranged side by side. The satellite communication circuit receives and transmits signals through the satellite communication antenna. The satellite communication circuit is electrically connected to the circuit board through a communication interface preset on the first cover. The satellite communication antenna is used to receive or transmit wireless signals.

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