Detection probes and methods of making the same

By plating nickel boride (NiB) onto the tip support of the test probe to form a thick tip, the tip wear problem is solved, the durability and longevity of the probe are improved, and the manufacturing cost is reduced.

CN122270690APending Publication Date: 2026-06-23LEENO IND INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
LEENO IND INC
Filing Date
2024-11-20
Publication Date
2026-06-23

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Abstract

Disclosed is a test probe. The test probe includes a barrel having a shape of a cylinder and a terminal including a terminal body portion partially inserted into a first end of the barrel, and a contact portion integrally extended from the terminal body portion to contact a protruding terminal of a test object. The contact portion includes a tip support portion including a support body provided on the terminal body portion and a tip base protruding in a horn shape from a first end of the support body, and a tip portion plated on an outer surface of the tip base and an upper surface of the support body surrounding a lower end of the tip base in a material having a higher hardness than the tip support portion, and the tip portion is formed thicker at an upper portion of the tip base than at a lower portion.
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Description

Technical Field

[0001] This disclosure relates to a test probe for testing the electrical properties of a test object (e.g., a semiconductor), and a method for manufacturing the probe. Background Technology

[0002] The test probe comprises a cylindrical tube, a terminal partially inserted into and fixed to a first end of the tube, a plunger sliding into a second end of the tube, and a spring between the terminal and the plunger inside the tube. The terminal contacts a raised terminal of the test object, and the plunger contacts a solder pad terminal of the test circuit board. In this configuration, the terminal has a sharp tip that pierces the hemispherical raised terminal during testing. The sharp tip needs to be plated with a hard metal because it will wear down after repeated tests. However, due to the high internal stress of hard metals, it is difficult to form a thick layer, while a thin plating has poor durability. Summary of the Invention

[0003] Technical issues

[0004] One aspect of this disclosure is to provide a test probe with excellent durability and a method for manufacturing the same.

[0005] Technical solution

[0006] According to one embodiment of this disclosure, a test probe is provided. The test probe includes: a tube having a cylindrical shape; and a terminal body including a first end partially inserted into the tube, and a contact portion integrally extending from the terminal body to contact a protruding terminal of a test object. The contact portion includes: a tip support including a support body disposed on the terminal body and a tip base projecting in a flared shape from the first end of the support body; and a tip portion coated with a material of higher hardness than the tip support portion on the outer surface of the tip base and the upper surface of the support body surrounding the lower end of the tip base, wherein the tip portion is thicker at the upper part of the tip base than at the lower part.

[0007] The tip can be made of nickel boride (NiB), and the tip support can be made of nickel (Ni). Therefore, the tip of hard NiB is plated on the tip support of Ni, thereby improving durability and adhesion to the tip support.

[0008] At least one uneven engagement portion may be formed at the interface between the tip support and the tip. Therefore, the resistance of the tip to peeling off from the tip support is improved.

[0009] According to one embodiment of this disclosure, a method for manufacturing a test probe is provided. The method includes: forming a first molding groove with a downwardly decreasing cross-sectional area on a sacrificial substrate; forming a second molding groove by stacking a dry film on the sacrificial substrate and patterning the dry film to expose an overflow surface on the sacrificial substrate surrounding the first molding groove; forming a tip portion thicker on the lower side than on the upper side within the first molding groove by plating a first material on the first molding groove and the overflow surface; and forming a tip support portion by plating a second material with a higher conductivity than the first material on the tip portion.

[0010] The tip can be formed using electroless plating. As a result, the hardness of the tip is improved.

[0011] The tip support can be formed by electroplating. Therefore, the tip support is electroplated quickly, thereby reducing manufacturing costs.

[0012] Beneficial effects

[0013] According to one embodiment of this disclosure, the durability of the test probe is improved by thickly coating the tip of the contact tip that contacts the other terminal with a hard metal film. Attached Figure Description

[0014] Figure 1 This is a perspective view of a test probe according to a first embodiment of the present disclosure.

[0015] Figure 2 This is an exploded perspective view of a test probe according to the first embodiment of this disclosure.

[0016] Figure 3 For along Figure 1 A cross-sectional view of line AA in the middle.

[0017] Figure 4 for Figure 1 Detailed cross-sectional view of the middle terminal.

[0018] Figure 5 For display manufacturing Figure 4 A schematic view of the method for using the middle terminal.

[0019] Figure 6 For display manufacturing Figure 5 Detailed view of the method for the middle tip.

[0020] Figure 7 This is a detailed cross-sectional view of a terminal according to a second embodiment of this disclosure.

[0021] Figure 8 For display manufacturing Figure 7 A schematic view of the method for using the middle terminal.

[0022] Figure 9For display manufacturing Figure 8 Detailed view of the method for the middle tip.

[0023] Figure 10 This is a perspective view of a test probe according to a third embodiment of this disclosure.

[0024] Figure 11 This is a perspective view of a terminal according to the fourth embodiment of this disclosure. Detailed Implementation

[0025] The test probe 1 and its manufacturing method will be described in detail below with reference to the accompanying drawings.

[0026] Figure 1 To display a stereoscopic view of test probe 1, Figure 2 for Figure 1 Exploded stereoscopic view of test probe 1 in the middle. Figure 3 For along Figure 1 Cross-sectional view of line AA in the middle. Figure 4 for Figure 1 Detailed cross-sectional view of terminal 4.

[0027] Reference Figures 1 to 3 The test probe 1 includes a cylindrical tube 2, a plunger 3 partially inserted into the first end of the tube 2, a terminal 4 partially inserted into the second end of the tube 2, and a spring 5 inserted inside the tube 2 between the plunger 3 and the terminal 4. The plunger 3 can slide inside the tube 2 while compressing and restoring the spring 5, and the terminal 4 is fixed and supported on the first end of the tube 2.

[0028] Cylinder 2 is shaped into a tube and is made of a conductive metal such as brass.

[0029] The cylinder 2 includes a tubular body 21 and a skirt 22 separated by three slits 23, which are longitudinally cut from the first end of the body 21. The number of slits 23 is not limited to three; it can be two, four, or more.

[0030] The skirt 22 includes a skirt body 221 extending longitudinally along the main body 21; and a skirt diameter reduction portion 222 that bends from the tip region of the skirt body 221, which is diameter-reduced in the axial direction of the cylinder 2 and has a contact end 222a facing the surface of the plunger 3.

[0031] The skirt body 221 can be thicker or thinner than the cylinder body 21. In this way, the thickness of the skirt body 221 is adjusted to control the contact force with the plunger 3.

[0032] The skirt diameter reduction portion 222 is thicker than the skirt body 221 or the tube body 21. In this way, increasing the thickness of the skirt diameter reduction portion 222 improves durability, increases the contact area between the plunger 3 and the contact end 222a, and allows the tip of the contact end 222a to be chamfered. Due to the chamfered tip of the contact end 222a, damage to the plunger 3 is prevented from occurring during the sliding operation of the plunger 3.

[0033] The length of the contact end 222a in the axial direction is greater than the thickness of the skirt body 221. As a result, the contact area between the contact end 222a and the plunger 3 is increased, thereby improving the resistance characteristics during the test.

[0034] The plunger 3 includes a sliding portion 31 that is accommodated and slidable in the barrel body 21, and a terminal contact portion 32 that extends from the sliding portion 31, is exposed through the skirt 22, and is in elastic contact with the skirt 22.

[0035] The sliding part 31 has a diameter corresponding to the inner diameter of the cylindrical body 21. The sliding part 31 is formed to have a diameter less than or equal to that of the cylindrical body 21 so as to slide within the cylindrical body 21.

[0036] The diameter of the terminal contact portion 32 is smaller than the diameter of the sliding portion 31. The diameter of the terminal contact portion 32 is large enough to pass through the tip of the skirt portion 22 while simultaneously contacting it. The end of the terminal contact portion 32 contacts the terminal (not shown) of the object to be tested.

[0037] Reference Figure 4 Terminal 4 includes a terminal body portion 41 at the second end of the insertion tube 2, and a contact portion 42 stacked on the terminal body portion 41 to contact the terminal 110 of the test object 100.

[0038] The terminal body portion 41 includes a tube insertion portion 41a and a tube support portion 41b. The tube insertion portion 41a is inserted into the tube 2 and has a diameter corresponding to the inner diameter of the tube 2. The tube support portion 41b is recessed from the outside of the terminal body portion 41 in the circumferential direction to fix the terminal body portion 41 to the tube 2.

[0039] The cylinder insertion part 41a is cylindrical, contacts the cylinder 2, and has a diameter corresponding to the inner diameter of the cylinder 2. The diameter of the cylinder insertion part 41a gradually decreases in the downward direction, thus creating a diameter difference dt between its upper and lower ends.

[0040] The cylinder support portion 41b is recessed on the outer peripheral surface of the cylinder insertion portion 41a in the circumferential direction to accommodate the protrusion formed by pressing inward and deforming the cylinder 2 through indentation.

[0041] The contact portion 42 includes a tip support portion 421 and a tip portion 422 disposed at a first end of the tip support portion 421. There may be multiple tips portion 422.

[0042] The tip support 421 includes a flange 421a disposed on the terminal body 41 and having a larger diameter than the terminal body 41, a support body 421b disposed on the flange 421a and having a predetermined height, and a tip base 421c disposed on the support body 421b and protruding in a trumpet shape. The tip support 421 may be made of, for example, nickel (Ni).

[0043] The diameter of flange 421a is larger than the diameter of cylinder 2. Therefore, when terminal body 41 is inserted into cylinder 2, the end of cylinder 2 blocks and restricts the insertion of terminal body 41.

[0044] The support body 421b is, for example, in the shape of a square prism or a cylinder, and has a height that takes into account the height of the tip 422 according to the test conditions.

[0045] The tip 422 may be made of a material with a higher hardness than the tip support 421, such as nickel boride (NiB). The tip 422 may be formed as a plated coating on the outer surface of the tip base 421c.

[0046] Terminal 4 may further include a spring support portion disposed at the lower end of terminal body 41 and protruding with a smaller diameter than the sleeve insertion portion 41a. The spring support portion is inserted... Figure 2 The first side of the middle spring 5 supports the spring 5.

[0047] Reference Figure 4 The tip 422 is formed on the outer surface of the tip base 421c by electroplating or electroless plating of a hard metal, such as nickel boride (NiB). In this case, the tip 422 is formed such that its upper portion Ht (above the tip base 421c) is thicker than its lower portion Lt (near the support body 421b). The upper portion Ht, including the apex of the tip 422, refers to the portion that typically inserts into the protruding terminal and is thickly reinforced with a hard metal, such as nickel boride (NiB), to improve wear resistance. The tip 422 can be firmly coupled to the tip base 421c through uneven engagement. Furthermore, the outer surface of the tip base 421c is not only unpolished but also rough and wavy, which allows the tip 422 to be more firmly coupled to the tip base 421c and thus resist peeling. In addition, the tip 422, made of a hard metal, namely nickel boride (NiB), exhibits excellent adhesion properties to the tip support 421, which is made of the same type, namely nickel (Ni).

[0048] Figure 5 To demonstrate manufacturing Figure 4 A schematic diagram of the method for terminal 4. Figure 6 To demonstrate manufacturing Figure 5A detailed view of the method for fabricating the tip 422. Although multiple terminals 4 are simultaneously fabricated on a sacrificial substrate 61 using a microelectromechanical system (MEMS) process, for the sake of description, Figure 5 Only one terminal 4 is shown in the image.

[0049] In operation S1, a first molding groove 61 is formed on one surface of the sacrificial substrate 60, for example, in a square pyramid shape. The first molding groove 61 with a square pyramid shape corresponds to Figure 4 The outline of the tip 422 is shown.

[0050] In operation S2, a conductive film 62, such as a gold (Au) film, is formed on one surface of the sacrificial substrate 60 by sputtering.

[0051] In operation S3, the first dry film 63 is stacked on the conductive film 62 of the sacrificial substrate 60, and a second molding groove 64 in the shape of a cylinder is formed by pattern exposure and development to expose the first molding groove 61.

[0052] In operation S4, the first layer 65 (corresponding to...) Figure 4 The tip portion 422 is formed by electroless plating or electroplating of the material that forms the tip support portion, namely a metal harder than nickel (Ni) (e.g., nickel boride (NiB)), onto the inner surface of the first forming groove 61.

[0053] exist Figure 6 As shown in operation S4-1, at the start of plating, the initial tip 65-1 is plated to an almost constant thickness on the first forming tank 61.

[0054] Then, after the plating process continues for a predetermined period of time, in Figure 6 In operation S4-2, the first forming tank 61 is filled starting from the lower part, which has a narrow area, resulting in a thicker plating layer at the bottom than at the top. As plating continues, the plating solution in the first forming tank 61 and the second forming tank 64 lacks plating metal components, thus requiring repeated stirring of the plating solution. Furthermore, the plating solution supplied through stirring is pushed into the lower part of the first forming tank 61, thereby increasing the deposition amount in the lower part of the first forming tank 61.

[0055] In operation S5, the first dry film 63 on the sacrificial substrate 60 is removed.

[0056] In operation S6, a second dry film 66 is formed on the sacrificial substrate 60, and a third molding groove 67 is formed by additional pattern exposure and development. This third molding groove 67 has a cylindrical shape and its cross-sectional area is larger than that of the first molding groove 61.

[0057] In operation S7, a metal with excellent adhesion, high conductivity, and relatively low hardness, such as nickel (Ni), is applied to the recess 68 by electroplating or electroless plating to form nickel boride (NiB). Figure 4 The position of the tip base 421c) and the third forming groove 67, and the metal portion protruding from the top surface of the second dry film 66 is ground to form the second layer 69 (corresponding to the ... Figure 4 The supporting body 421b and the tip base 421c of the tip support 421.

[0058] In operation S8, a third dry film 70 is stacked on the second dry film 66, and a cylindrical fourth forming groove 71 with a diameter smaller than the third forming groove 67 is formed by pattern exposure and development. Metal, such as nickel (Ni), is then filled into the fourth forming groove 71 by electroplating or electroless plating. The metal portion protruding from the top surface of the third dry film 70 is then ground to form the third layer 72 (corresponding to…). Figure 4 Flange 421a).

[0059] In operation S9, a fourth dry film 73 is stacked on the third dry film 70, a cylindrical fifth forming groove 74 with a diameter smaller than the fourth forming groove 71 is formed by pattern exposure and development, and metal, such as nickel (Ni), is filled into the fifth forming groove 74 by electroplating. Then, the metal portion protruding from the top surface of the fourth dry film 73 is ground to form the fourth layer 75 (corresponding to...). Figure 4 (Part of the tube insertion portion 41a).

[0060] In operation S10, a fifth dry film 76 is stacked on the fourth dry film 73, and a cylindrical sixth forming groove 77 with a diameter smaller than the fifth forming groove 74 is formed by pattern exposure and development. Metal, such as nickel (Ni), is filled into the sixth forming groove 77 by electroplating or electroless plating. Then, the metal portion protruding from the top surface of the fifth dry film 76 is ground to form the fifth layer 78 (corresponding to…). Figure 4 (Cylinder support part 41b).

[0061] In operation S11, a sixth dry film 79 is stacked on the fifth dry film 76, and a cylindrical seventh forming tank 80 with a diameter larger than the sixth forming tank 77 is formed by pattern exposure and development. Metal, such as nickel (Ni), is filled into the seventh forming tank 80 by electroplating or electroless plating. Then, the metal portion protruding from the top surface of the sixth dry film 79 is ground to form the sixth layer 81 (corresponding to…). Figure 4 The remaining portion of the middle cylinder insertion part 41a).

[0062] Alternatively, a seventh dry film can be stacked on the sixth dry film 79, and a cylindrical eighth forming tank with a diameter smaller than the seventh forming tank 80 can be formed by pattern exposure and development. Metal, such as nickel (Ni), can be filled into the eighth forming tank 80 by electroplating or electroless plating. Then, the metal portion protruding from the top surface of the seventh dry film 79 can be ground to form a seventh layer (corresponding to the spring support portion).

[0063] In operation S12, the sacrificial substrate 60 and the second to sixth dry films 66, 70, 73, 76 and 79 are removed to complete terminal 4.

[0064] Finally, terminal 4 may be externally plated with a highly conductive metal, such as gold (Au).

[0065] In this way, by increasing the thickness of the tip portion 422 surrounding the vertex plated on the tip base 421c, the durability of the test probe 1 according to the first embodiment of this disclosure is improved.

[0066] The method described above for manufacturing the test probe 1 according to the first embodiment of this disclosure can be performed by electroplating or electroless plating alone. Alternatively, the first layer 65 corresponding to the tip portion 422 can be plated by electroless plating, while the other second to fifth layers 68, 71, 74 and 77 can be plated by electroplating, which is inexpensive and has a fast deposition rate.

[0067] Figure 7 This is a detailed cross-sectional view of terminal 8 according to the second embodiment of this disclosure. Details will be omitted below. Figure 4 A repeated description of the test probe 4 of the first embodiment shown.

[0068] Reference Figure 7 The tip 822 is formed of hard metal (NiB) by electroplating or electroless plating on the top surface of the tip base 821c and the top surface of the support body 821b (corresponding to...). Figure 8On the overflow surface 94a). In this case, the upper Ht of the tip 822, which is formed above the tip base 821c, is thicker than the lower Lt near the first end of the support body 821b. The upper Ht, including the tip of the tip 822, refers to the portion that typically inserts into the protruding terminal and is thickly reinforced with hard metal (NiB) to improve wear resistance. The tip 822 can be firmly coupled to the tip base 821c through uneven engagement and engagement between the end surface of the support body 821c and the overflow portion 822b of the tip 822. Furthermore, the end surface of the support body 821c and the outer surface of the tip base 821c are not only unpolished but also rough and wavy, so the tip 822 can be more firmly coupled through uneven engagement. Therefore, the tip 822 is firmly coupled to the tip base 821c, thus having anti-peeling properties. Furthermore, the tip 822, made of a hard metal, namely nickel boride (NiB), and the tip support 821, made of the same type, namely nickel (Ni), have excellent adhesive properties.

[0069] Figure 8 It is a display manufacturing Figure 7 A schematic diagram of the method for terminal 8, Figure 9 It is a display manufacturing Figure 8 A detailed view of the method for fabricating the tip 822. Although multiple terminals 8 are simultaneously fabricated on a sacrificial substrate 80 using microelectromechanical systems (MEMS) processes, for ease of description, Figure 8 Only one terminal 8 is shown in the image.

[0070] In operation S21, a first molding groove 91, for example a square pyramid shape, is formed on one surface of the sacrificial substrate 90. The first molding groove 91 having a square pyramid shape corresponds to... Figure 7 The outline of the tip 822 is shown.

[0071] In operation S22, a conductive film 92, such as a gold (Au) film, is formed on one surface of the sacrificial substrate 90 by sputtering.

[0072] In operation S23, the first dry film 93 is stacked on the conductive film 92 of the sacrificial substrate 90, and a cylindrical second molding groove 94 is formed by pattern exposure and development to expose the first molding groove 91 on the sacrificial substrate 90 and the overflow surface 94a surrounding the first molding groove 91.

[0073] In operation S24, a first layer 95 is formed by plating a hard metal (e.g., nickel boride (NiB)) onto the inner surface of the first forming tank 91 and the overflow surface 94a of the second forming tank 94 without electroplating or by electroplating. Figure 7 The tip portion 822). The first layer 95 includes a downwardly recessed portion 95a (i.e. forming the tip portion 822). Figure 7 (Part of the tip base 821).

[0074] exist Figure 9 As shown in operation S24-1, at the start of plating, the first layer 95 is plated with an almost constant thickness on the inner surface 91a of the first forming tank 91 and the overflow surface 94a of the second forming tank 94.

[0075] Then, after the plating process continues for a predetermined period of time, in Figure 9 In operation S24-2, the first forming tank 91 is filled starting from the lower part, which has a narrow area, so the lower part is plated thicker than the upper part. As plating continues, the plating solution in the first forming tank 91 and the second forming tank 94 lacks plating metal components, so the plating solution needs to be stirred repeatedly. In addition, the plating solution supplied by stirring is pushed into the lower part of the first forming tank 91, so that the deposition amount in the lower part of the first forming tank 91 can be increased.

[0076] In operation S25, the second layer 96 (corresponding to) is formed by filling the recess 95a of the first layer 95 and the second forming groove 94 of the first dry film 93 with a metal (e.g., nickel (Ni)) that has excellent adhesion to nickel boride (NiB), high conductivity, and relatively low hardness, by electroplating or electroless plating, and grinding the metal portion protruding from the top surface of the first dry film 63. Figure 7 The supporting body 821b and the tip base 821c.

[0077] In operation S26, by stacking a second dry film 97 on the first dry film 93, a cylindrical third forming groove 98 with a diameter larger than the second forming groove 94 is formed by pattern exposure and development. Metal (e.g., nickel (Ni)) is then filled into the third forming groove 98 by electroplating or electroless plating, and the metal portion protruding from the top surface of the second dry film 97 is ground to form a third layer 99 (corresponding to…). Figure 7 (Flange 821a).

[0078] In operation S27, by stacking a third dry film 100 on the second dry film 97, a cylindrical fourth forming groove 101 with a diameter smaller than the third forming groove 98 is formed by pattern exposure and development. Metal (e.g., nickel (Ni)) is then filled into the fourth forming groove 101 by electroplating, and the metal portion protruding from the top surface of the third dry film 100 is ground to form a fourth layer 102 (corresponding to…). Figure 7 (Part of the tube insertion part 81a).

[0079] In operation S28, a fourth dry film 103 is stacked on the third dry film 100, and a cylindrical fifth forming groove 104 with a diameter smaller than the fourth forming groove 101 is formed by pattern exposure and development. Metal (e.g., nickel (Ni)) is filled into the fifth forming groove 104 by electroplating or electroless plating, and the metal portion protruding from the top surface of the fourth dry film 103 is ground to form a fifth layer 105 (corresponding to...). Figure 7(Cylinder support part 81b).

[0080] In operation S29, by stacking a fifth dry film 106 on the fourth dry film 103, a cylindrical sixth forming groove 107 with a diameter larger than the fifth forming groove 104 is formed by pattern exposure and development. Metal (e.g., nickel (Ni)) is filled into the sixth forming groove 107 by electroplating or electroless plating, and the metal portion protruding from the top surface of the fifth dry film 106 is ground to form a sixth layer 108 (corresponding to...). Figure 7 The remaining portion of the middle tube insertion part 81a).

[0081] In operation S30, the sacrificial substrate 90 and the first to fifth dry films 93, 97, 100, 103 and 106 are removed to complete terminal 8.

[0082] Alternatively, a seventh layer (corresponding to the spring support portion) can be formed by stacking a sixth dry film on the fifth dry film 106, forming a cylindrical seventh forming tank with a diameter smaller than the sixth forming tank 107 by pattern exposure and development, filling the seventh forming tank with metal (e.g., nickel (Ni)) by electroplating or electroless plating, and grinding the metal portion protruding from the top surface of the sixth dry film.

[0083] Finally, terminal 8 can be externally plated with a highly conductive metal, such as gold (Au).

[0084] In this way, the test probe 1 according to the second embodiment of this disclosure improves durability by increasing the thickness of the apex around the tip 422 plated on the tip base 421c.

[0085] The method described above for manufacturing the test probe 1 according to the second embodiment of this disclosure can be performed by electroplating or electroless plating alone. Alternatively, the first layer 95 corresponding to the tip portion 822 can be plated by electroless plating, while the other second to fifth layers 96, 99, 102, 105 and 108 can be plated by electroplating, which is inexpensive and has a fast deposition rate.

[0086] Figure 10 This is a perspective view of the test probe 1 according to the third embodiment of this disclosure. Details will be omitted below. Figures 1 to 3 The test probe 1 is shown as a repeat description.

[0087] Reference Figure 10 The test probe 1 includes a cylinder 2, a plunger 3 partially inserted into the first end of the cylinder 2, and a terminal assembly 110 partially inserted into the second end of the cylinder 2.

[0088] Terminal assembly 110 includes a tubular terminal support tube 111 and a terminal 112 coupled to the terminal support tube 111. Terminal 112 has a similar shape to... Figures 1 to 3The structure of terminal 4 shown allows it to be partially inserted into and fixed to terminal support tube 111, rather than into cylinder 2.

[0089] Figure 11 This is a perspective view of terminal 12 according to the fourth embodiment of this disclosure.

[0090] Terminal 12 includes a terminal body portion 121 at the second end of the insertion tube 2, and a contact portion 122 stacked on the terminal body portion 121 to contact the terminal of the object to be tested.

[0091] The contact portion 122 includes a flange 122a, a support body 122b disposed on the flange 122 and in the shape of a quadrangular prism or a cylinder, and a pointed portion 122c disposed on the support body 122b and in the shape of a quadrangular pyramid, a cone, or a polygonal pyramid other than a quadrangular pyramid. There may be 2, 3, 5 or more pointed portions 122c.

[0092] While several embodiments of this disclosure have been described and illustrated, this disclosure is not limited to the specific embodiments described above. Those skilled in the art can make various modifications to the embodiments without departing from the scope of this disclosure as claimed in the claims, and these modifications should not be understood separately from the technical spirit or vision of this disclosure.

Claims

1. A test probe, comprising: A cylinder, having the shape of a cylinder; as well as A terminal includes a terminal body and a contact portion, wherein the terminal body portion is inserted into a first end of the cylinder, and the contact portion extends integrally from the terminal body portion to contact a protruding terminal of the object to be tested. The contact portion includes: A tip support includes a support body and a tip base, wherein the support body is disposed on the terminal body and the tip base protrudes from a first end of the support body in a trumpet shape. as well as The tip portion is coated with a material with a higher hardness than the tip support portion on the outer surface of the tip base and the upper surface of the support body surrounding the lower end of the tip base, and the tip portion is formed to be thicker in the upper part of the tip base than in the lower part.

2. The test probe according to claim 1, wherein The tip is made of nickel boride (NiB), and The tip support is made of nickel (Ni).

3. The test probe according to claim 1 further includes at least one uneven engagement portion formed on the interface between the tip support portion and the tip portion.

4. A method for manufacturing a test probe, comprising: A first molding groove is formed on the sacrificial substrate, the cross-sectional area of ​​which decreases downwards; A second molding groove is formed by stacking a dry film on the sacrificial substrate and patterning the dry film to expose the overflow surface surrounding the first molding groove on the sacrificial substrate. A tip is formed in the first molding groove by plating with a first material on the first molding groove, the lower side of which is thicker than the upper side. as well as A tip support is formed by plating the tip with a second material that has higher conductivity than the first material.

5. The method of claim 4, wherein the tip is formed by electroless plating.

6. The method of claim 5, wherein the tip support is formed by electroplating.