Topological ring monolithic three-axis MEMS gyroscope chip

Abstract

This invention relates to a triaxial gyroscope, specifically a topological ring-shaped monolithic triaxial MEMS gyroscope chip, comprising a substrate, a resonator portion, and an electrode portion. The resonator portion includes a central anchor point bonded to the upper surface of the substrate. A resonant ring is sleeved on the outer side of the central anchor point. Four resonant squares and four U-shaped sensitive mass blocks are connected around the outer side of the resonant ring. A square sensitive mass block is connected to the inner side of each resonant square. A straight beam A and two rows of detection comb teeth A are connected to the outer side of each resonant square. Two rows of detection comb teeth B are connected to the outer side of each straight beam A. Four rows of detection comb teeth C are connected to the inner side of each U-shaped sensitive mass block. This invention effectively solves the problems of low sensitivity, poor working stability, low measurement accuracy, and large size of existing triaxial gyroscopes, and is suitable for aerospace, autonomous vehicles, intelligent robots, consumer electronics, and other fields.

Description

Technical Field

[0001] This invention relates to a three-axis gyroscope, specifically a topological ring monolithic three-axis MEMS gyroscope chip. Background Technology

[0002] A three-axis gyroscope is a core sensing device for angular velocity measurement, capable of simultaneously measuring angular velocity input along the x, y, and z axes. It is widely used in aerospace, autonomous vehicles, intelligent robots, and consumer electronics, demonstrating extremely broad application prospects. Existing three-axis gyroscopes are mainly divided into two categories: One type is the monolithic integrated three-axis gyroscope. This type suffers from two problems: firstly, due to the limitations of its resonator geometry, it exhibits poor response to weak angular velocities and poor common-mode interference immunity, resulting in low sensitivity and poor operational stability. Secondly, it cannot achieve complete decoupling of the detection directions, leading to large coupling errors between modes and thus low measurement accuracy. The other type is the assembled three-axis gyroscope (composed of three single-axis gyroscopes). This type suffers from both large size and low measurement accuracy due to limitations in assembly technology. Therefore, it is necessary to invent a topological ring monolithic three-axis MEMS gyroscope chip to solve the problems of low sensitivity, poor working stability, low measurement accuracy, and large size of existing three-axis gyroscopes. Summary of the Invention

[0003] To address the problems of low sensitivity, poor operational stability, low measurement accuracy, and large size of existing three-axis gyroscopes, this invention provides a topological ring monolithic three-axis MEMS gyroscope chip.

[0004] This invention is achieved using the following technical solution: A topological ring monolithic three-axis MEMS gyroscope chip, comprising a substrate, a resonator section, and an electrode section; The resonator includes a central anchor point bonded to the upper surface of the substrate; a resonant ring is sleeved on the outer side of the central anchor point; four resonant squares and four H-shaped sensitive mass blocks are connected around the outer side of the resonant ring, and the four resonant squares and four H-shaped sensitive mass blocks are staggered along the circumference; a square sensitive mass block is connected to the inner side of each resonant square; a straight cantilever beam A and two rows of detection comb teeth A are connected to the outer side of each resonant square; two rows of detection comb teeth B are connected to the outer side of each straight cantilever beam A; and four rows of detection comb teeth C are connected to the inner side of each H-shaped sensitive mass block. The electrode portion includes eight pairs of arc-shaped three-dimensional electrodes A, eight pairs of arc-shaped three-dimensional electrodes B, four rectangular planar electrodes, four pairs of strip-shaped planar electrodes, four pairs of single-sided comb-shaped three-dimensional electrodes A, four pairs of single-sided comb-shaped three-dimensional electrodes B, and eight pairs of single-sided comb-shaped three-dimensional electrodes C sputtered onto the upper surface of the substrate; the outer surfaces of the eight pairs of arc-shaped three-dimensional electrodes A and the inner surfaces of the resonant ring form eight pairs of parallel capacitors A; the inner surfaces of the eight pairs of arc-shaped three-dimensional electrodes B and the outer surfaces of the resonant ring form eight pairs of parallel capacitors B; the upper surfaces of the four rectangular planar electrodes and four… The lower surfaces of the square sensitive mass blocks correspond one-to-one to form four parallel capacitors C; the upper surfaces of the four pairs of strip planar electrodes correspond one-to-one with the lower surfaces of the four square sensitive mass blocks to form four pairs of parallel capacitors D; the four pairs of single-sided comb-shaped three-dimensional electrodes A and the eight rows of detection comb teeth A correspond one-to-one to form four pairs of comb-tooth capacitors A; the four pairs of single-sided comb-shaped three-dimensional electrodes B and the eight rows of detection comb teeth B correspond one-to-one to form four pairs of comb-tooth capacitors B; the eight pairs of single-sided comb-shaped three-dimensional electrodes C and the sixteen rows of detection comb teeth C correspond one-to-one to form eight pairs of comb-tooth capacitors C.

[0005] Furthermore, four supporting cantilever beams A and four supporting cantilever beams B are connected between the central anchor point and the resonant ring, and the four supporting cantilever beams A and four supporting cantilever beams B are staggered along the circumference; each supporting cantilever beam A includes a straight beam segment A, a pair of U-shaped beam segments A, and a straight beam segment B connected in sequence from the inside to the outside along the radial direction; each supporting cantilever beam B includes a straight beam segment C, a pair of U-shaped beam segments B, a pair of U-shaped beam segments C, and a straight beam segment D connected in sequence from the inside to the outside along the radial direction.

[0006] Furthermore, a straight cantilever beam B connects each resonant square to the resonant ring.

[0007] Furthermore, a straight cantilever beam C is connected between each of the sun-shaped sensitive mass blocks and the resonant ring.

[0008] Furthermore, each resonant block is connected to a corresponding square sensitive mass block by four Z-shaped suspension beams.

[0009] Furthermore, each resonant block has two peripheral anchor points A and two peripheral anchor points B connected to its outer surface; each spherical sensitive mass block has two peripheral anchor points C and two peripheral anchor points D connected to its outer surface; each straight cantilever beam A has one peripheral anchor point E connected to its tail end; and all eight peripheral anchor points A, eight peripheral anchor points B, eight peripheral anchor points C, eight peripheral anchor points D, and four peripheral anchor points E are bonded to the upper surface of the substrate.

[0010] Furthermore, each resonant frame is connected to two corresponding outer anchor points A by two folded suspension beams A; each resonant frame is connected to two corresponding outer anchor points B by two folded suspension beams B; each H-shaped sensitive mass block is connected to two corresponding outer anchor points C by two folded suspension beams C; each H-shaped sensitive mass block is connected to two corresponding outer anchor points D by two pairs of folded suspension beams D; and each straight suspension beam A is connected to a pair of folded suspension beams E by a corresponding outer anchor point E.

[0011] Furthermore, the resonator portion is made of silicon.

[0012] Compared with existing triaxial gyroscopes, the topological ring monolithic triaxial MEMS gyroscope chip of this invention, through the adoption of a novel structure, achieves simultaneous measurement of angular velocity input in the x, y, and z axes, thus possessing the following advantages: First, compared with existing monolithic integrated triaxial gyroscopes, this invention has the following advantages: Firstly, the resonator of this invention adopts a topological ring structure, which effectively enhances the response capability to weak angular velocities and the anti-common-mode interference capability, thereby effectively improving sensitivity and operational stability. Secondly, this invention achieves complete decoupling of each detection direction, thereby effectively reducing coupling errors between modes and thus effectively improving measurement accuracy. Second, compared with existing assembled triaxial gyroscopes, this invention adopts a monolithic integrated structure, thus effectively reducing size and eliminating limitations imposed by assembly processes, thereby effectively improving measurement accuracy.

[0013] This invention effectively solves the problems of low sensitivity, poor working stability, low measurement accuracy, and large size of existing three-axis gyroscopes, and is applicable to fields such as aerospace, unmanned vehicles, intelligent robots, and consumer electronics. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0015] Figure 2 This is a three-dimensional structural diagram of the substrate and electrode portion in this invention.

[0016] Figure 3 This is a three-dimensional structural diagram of the harmonic oscillator part in this invention.

[0017] Figure 4 This is a schematic diagram of the planar structure of the harmonic oscillator in this invention.

[0018] Figure 5 yes Figure 4 Partial structural diagram Figure 1 .

[0019] Figure 6 yes Figure 4 Partial structural diagram Figure 2 .

[0020] In the diagram: 1-Base, 201-Central Anchor Point, 202-Resonant Ring, 203-Resonant Square, 204-H-shaped Sensitive Mass Block, 205-Square Sensitive Mass Block, 206-Straight Cantilever Beam A, 207-Detection Comb Tooth A, 208-Detection Comb Tooth B, 209-Detection Comb Tooth C, 210-Straight Beam Segment A, 211-U-shaped Beam Segment A, 212-Straight Beam Segment B, 213-Straight Beam Segment C, 214-U-shaped Beam Segment B, 215-U-shaped Beam Segment C, 216-Straight Beam Segment D, 217-Straight Cantilever Beam B, 218-Straight Cantilever Beam C, 219-Z-shaped Cantilever Beam Beam, 220-Outer anchor point A, 221-Outer anchor point B, 222-Outer anchor point C, 223-Outer anchor point D, 224-Outer anchor point E, 225-Folded cantilever beam A, 226-Folded cantilever beam B, 227-Folded cantilever beam C, 228-Folded cantilever beam D, 229-Folded cantilever beam E, 301-Arc-shaped three-dimensional electrode A, 302-Arc-shaped three-dimensional electrode B, 303-Rectangular planar electrode, 304-Strip planar electrode, 305-Single-sided comb-shaped three-dimensional electrode A, 306-Single-sided comb-shaped three-dimensional electrode B, 307-Single-sided comb-shaped three-dimensional electrode C. Detailed Implementation

[0021] A topological ring monolithic triaxial MEMS gyroscope chip, comprising a substrate 1, a resonator section, and an electrode section; The resonator portion includes a central anchor point 201 bonded to the upper surface of the substrate 1; a resonant ring 202 is sleeved on the outer side of the central anchor point 201; four resonant square frames 203 and four H-shaped sensitive mass blocks 204 are connected around the outer side of the resonant ring 202, and the four resonant square frames 203 and four H-shaped sensitive mass blocks 204 are staggered along the circumferential direction; a square sensitive mass block 205 is connected to the inner side of each resonant square frame 203; a straight cantilever beam A206 and two rows of detection comb teeth A207 are connected to the outer side of each resonant square frame 203; two rows of detection comb teeth B208 are connected to the outer side of each straight cantilever beam A206; and four rows of detection comb teeth C209 are connected to the inner side of each H-shaped sensitive mass block 204. The electrode portion includes eight pairs of arc-shaped three-dimensional electrodes A301, eight pairs of arc-shaped three-dimensional electrodes B302, four rectangular planar electrodes 303, four pairs of strip-shaped planar electrodes 304, four pairs of single-sided comb-shaped three-dimensional electrodes A305, four pairs of single-sided comb-shaped three-dimensional electrodes B306, and eight pairs of single-sided comb-shaped three-dimensional electrodes C307 sputtered on the upper surface of the substrate 1; the outer surfaces of the eight pairs of arc-shaped three-dimensional electrodes A301 and the inner surfaces of the resonant ring 202 form eight pairs of parallel capacitors A; the inner surfaces of the eight pairs of arc-shaped three-dimensional electrodes B302 and the outer surfaces of the resonant ring 202 form eight pairs of parallel capacitors B; the upper surfaces of the four rectangular planar electrodes 303... The surface of each of the four square sensitive mass blocks 205 corresponds one-to-one with the lower surface of each of the four square sensitive mass blocks 205 to form four parallel capacitors C; the upper surface of each of the four pairs of strip planar electrodes 304 corresponds one-to-one with the lower surface of each of the four square sensitive mass blocks 205 to form four pairs of parallel capacitors D; the four pairs of single-sided comb-shaped three-dimensional electrodes A305 correspond one-to-one with the eight rows of detection combs A207 to form four pairs of comb-shaped capacitors A; the four pairs of single-sided comb-shaped three-dimensional electrodes B306 correspond one-to-one with the eight rows of detection combs B208 to form four pairs of comb-shaped capacitors B; the eight pairs of single-sided comb-shaped three-dimensional electrodes C307 correspond one-to-one with the sixteen rows of detection combs C209 to form eight pairs of comb-shaped capacitors C.

[0022] During operation, the central anchor point 201, eight pairs of arc-shaped three-dimensional electrodes A301, eight pairs of arc-shaped three-dimensional electrodes B302, four rectangular planar electrodes 303, four pairs of strip-shaped planar electrodes 304, four pairs of single-sided comb-shaped three-dimensional electrodes A305, four pairs of single-sided comb-shaped three-dimensional electrodes B306, and eight pairs of single-sided comb-shaped three-dimensional electrodes C307 are all connected to the control system via metal wires.

[0023] The first pair of parallel capacitors B (i.e.) Figure 1 The pair of parallel capacitors B located on the right rear side) and the fifth pair of parallel capacitors B (i.e. Figure 1 The first pair of parallel capacitors B located in the front left corner are connected together, and the third pair of parallel capacitors B (i.e. Figure 1 The pair of parallel capacitors B located in the front right of the middle) and the seventh pair of parallel capacitors B (i.e. Figure 1 The first pair of parallel capacitors A (located at the left rear) are connected together, forming a differential capacitor pair, which serves as the driving mode excitation capacitor. Each pair of comb-tooth capacitors A also forms a differential capacitor pair, serving as the driving mode detection capacitor A. Each pair of comb-tooth capacitors B also forms a differential capacitor pair, serving as the driving mode detection capacitor B. Figure 1 The pair of parallel capacitors A located at the right rear) and the fifth pair of parallel capacitors A (i.e. Figure 1 The first pair of parallel capacitors A in the middle (located on the left front) are connected together, and the third pair of parallel capacitors A (i.e. Figure 1 The first pair of parallel capacitors A on the right front) and the seventh pair of parallel capacitors A (i.e. Figure 1A pair of parallel capacitors A) located at the left rear are connected together, forming a pair of differential capacitors, which serve as driving mode frequency modulation capacitors.

[0024] The first square sensitive mass block 205 (i.e. Figure 1 The third square sensitive mass block 205 (located in the middle right rear) Figure 1 The square sensitive mass block 205 located in the front left corner is used as the x-axis detection mass block. The first parallel capacitor C (i.e. Figure 1 The third parallel capacitor C (located in the middle right rear position) is... Figure 1 The parallel capacitor C located in the front left corner forms a differential capacitor pair, serving as the x-axis detection response capacitor. The first pair of parallel capacitors D (i.e., Figure 1 The pair of parallel capacitors D located at the right rear are connected together, and the third pair of parallel capacitors D (i.e. Figure 1 The two parallel capacitors D located in the front left are connected together, forming a pair of differential capacitors, which serve as the x-axis feedback capacitors.

[0025] The second square sensitive mass block 205 (i.e. Figure 1 The square sensitive mass block 205 located in the front right corner), the fourth square sensitive mass block 205 (i.e. Figure 1 The square sensitive mass block 205 located at the left rear is used as the y-axis detection mass block. The second parallel capacitor C (i.e. Figure 1 The fourth parallel capacitor C (located in the middle right front) is the fourth parallel capacitor C (i.e. Figure 1 The parallel capacitor C located at the left rear forms a differential capacitor pair, serving as the y-axis detection response capacitor. The second pair of parallel capacitors D (i.e. Figure 1 The first pair of parallel capacitors D in the middle, located on the right front, are connected together. The fourth pair of parallel capacitors D (i.e. Figure 1 A pair of parallel capacitors (D) located at the left rear are connected together, forming a pair of differential capacitors, which serve as the y-axis feedback capacitors.

[0026] Four H-shaped sensitive mass blocks 204 are used as z-axis detection mass blocks. Each pair of comb-tooth capacitors C forms a differential capacitor, serving as the z-axis detection response capacitor. The second pair of parallel capacitors B (i.e. Figure 1 The pair of parallel capacitors B on the right side of the middle) and the sixth pair of parallel capacitors B (i.e. Figure 1 The first pair of parallel capacitors B on the left are connected together, and the fourth pair of parallel capacitors B (i.e. Figure 1 The first pair of parallel capacitors B) and the eighth pair of parallel capacitors B (i.e. Figure 1 The pair of parallel capacitors B located at the rear are connected together, forming a differential capacitor pair, which serves as the z-axis feedback capacitor. The second pair of parallel capacitors A (i.e. Figure 1The pair of parallel capacitors A on the right and the sixth pair of parallel capacitors A (i.e. Figure 1 The first pair of parallel capacitors A on the left are connected together, and the fourth pair of parallel capacitors A (i.e. Figure 1 The first pair of parallel capacitors A) and the eighth pair of parallel capacitors A (i.e. Figure 1 A pair of parallel capacitors A) located at the rear are connected together, forming a pair of differential capacitors, which serve as z-axis frequency tuning capacitors.

[0027] The specific work process is as follows: First, the control system generates a DC bias voltage signal and two sinusoidal voltage signals with the same amplitude, frequency, and opposite phase. The DC bias voltage signal is applied to the central anchor point 201. Simultaneously, the first sinusoidal voltage signal is applied to two pairs of driving mode excitation capacitors (the first pair of parallel capacitors B and the fifth pair of parallel capacitors B), and the second sinusoidal voltage signal is applied to the other two pairs of driving mode excitation capacitors (the third pair of parallel capacitors B and the seventh pair of parallel capacitors B). This causes the resonant ring 202 to undergo in-plane four-antinode bending vibration under the action of electrostatic force. Driven by the resonant ring 202, the four resonant blocks 203, two x-axis detection mass blocks, two y-axis detection mass blocks, and four straight cantilever beams A206 together perform in-plane radial reciprocating motion. During this process, the control system measures the displacement of the four resonant blocks 203 and the four straight cantilever beams A206 in real time through four pairs of driving mode detection capacitors A and four pairs of driving mode detection capacitors B. Based on the measurement results, the frequency and amplitude of the two sinusoidal voltage signals are adjusted in real time. This ensures that the displacement amplitude of the four resonant blocks 203 and the four straight cantilever beams A206 remains constant, and that the four resonant blocks 203 and the four straight cantilever beams A206 move at their natural frequencies.

[0028] When there is no angular velocity input, the resonant ring 202 undergoes in-plane four-antinode bending vibration in the driving mode. At this time, the four resonant blocks 203, two x-axis detection mass blocks, two y-axis detection mass blocks, and four straight cantilever beams A206 together perform in-plane radial reciprocating motion in the driving mode. This keeps the plate spacing of the two x-axis detection response capacitors and the two y-axis detection response capacitors constant, thus keeping their capacitances constant. Simultaneously, the four z-axis detection mass blocks remain stationary because they are located at the nodes of the in-plane four-antinode bending vibration, thus keeping the facing area of ​​the eight pairs of z-axis detection response capacitors constant, thereby keeping their capacitances constant. At this time, the output of this invention is zero.

[0029] When an angular velocity is input along the x-axis, the two x-axis sensing masses move out of plane in opposite directions with the same displacement under the influence of Coriolis force. This causes a change in the distance between the plates of the two x-axis sensing response capacitors, thus changing their capacitance. The control system can then calculate the angular velocity input along the x-axis by detecting the capacitance of these capacitors. During this process, the two x-axis sensing response capacitors form a differential capacitor pair, effectively enhancing the response to weak angular velocities along the x-axis and improving common-mode interference immunity, thereby increasing sensitivity and operational stability. Simultaneously, the control system applies electrostatic feedback force through the two pairs of x-axis feedback capacitors, achieving closed-loop detection of the angular velocity along the x-axis. Furthermore, it applies a DC voltage through these capacitors, generating electrostatic negative stiffness along the x-axis.

[0030] When an angular velocity is input along the y-axis, the two y-axis sensing masses move out-of-plane in opposite directions with the same displacement under the influence of Coriolis force. This causes a change in the distance between the plates of the two y-axis sensing response capacitors, thus changing their capacitance. The control system can then calculate the angular velocity input along the y-axis by detecting the capacitance of these capacitors. During this process, the two y-axis sensing response capacitors form a differential capacitor pair, effectively enhancing the response to weak angular velocities along the y-axis and improving common-mode interference immunity, thereby increasing sensitivity and operational stability. Simultaneously, the control system applies electrostatic feedback force through the two pairs of y-axis feedback capacitors, achieving closed-loop detection of the y-axis angular velocity, and applies a DC voltage to these capacitors, generating electrostatic negative stiffness along the y-axis.

[0031] When an angular velocity is input along the z-axis, the resonant ring 202, under the action of Coriolis force, undergoes in-plane four-antinode bending vibration in the detection mode. The four z-axis detection mass blocks are located at the antinodes of this in-plane four-antinode bending vibration. Driven by the resonant ring 202, the four z-axis detection mass blocks perform in-plane radial reciprocating motion, causing a change in the facing area of ​​the plates of the eight pairs of z-axis detection response capacitors, thus changing the capacitance of the eight pairs of z-axis detection response capacitors. At this time, the control system can calculate the angular velocity input along the z-axis by detecting the capacitance of the eight pairs of z-axis detection response capacitors. In this process, since each pair of z-axis detection response capacitors constitutes a differential capacitor, it effectively enhances the response capability to weak angular velocities along the z-axis and effectively enhances the anti-common-mode interference capability, thereby effectively improving sensitivity and operational stability. Simultaneously, the control system applies electrostatic feedback force through the four pairs of z-axis feedback capacitors, thereby achieving closed-loop detection of the angular velocity along the z-axis; and applies DC voltage through the four pairs of z-axis frequency-tuning capacitors, thereby generating electrostatic negative stiffness along the z-axis.

[0032] Four supporting cantilever beams A and four supporting cantilever beams B are connected between the central anchor point 201 and the resonant ring 202, and the four supporting cantilever beams A and four supporting cantilever beams B are staggered along the circumference; each supporting cantilever beam A includes a straight beam segment A210, a pair of U-shaped beam segments A211, and a straight beam segment B212 connected in sequence from the inside to the outside along the radial direction; each supporting cantilever beam B includes a straight beam segment C213, a pair of U-shaped beam segments B214, a pair of U-shaped beam segments C215, and a straight beam segment D216 connected in sequence from the inside to the outside along the radial direction.

[0033] A straight cantilever beam B217 connects each resonant block 203 to the resonant ring 202.

[0034] Each of the sun-shaped sensitive mass blocks 204 and the resonant ring 202 is connected by a straight cantilever beam C218.

[0035] Each resonant block 203 is connected to a corresponding square sensitive mass block 205 by four Z-shaped suspension beams 219.

[0036] Each resonant block 203 has two peripheral anchor points A220 and two peripheral anchor points B221 connected to its outer surface; each H-shaped sensitive mass block 204 has two peripheral anchor points C222 and two peripheral anchor points D223 connected to its outer surface; each straight cantilever beam A206 has one peripheral anchor point E224 connected to its tail end; all eight peripheral anchor points A220, B221, C222, D223, and E224 are bonded to the upper surface of the substrate 1. During operation, all eight peripheral anchor points A220, B221, C222, D223, and E224 are connected to the control system via metal wires. The control system applies a DC bias voltage signal to eight peripheral anchor points A220, eight peripheral anchor points B221, eight peripheral anchor points C222, eight peripheral anchor points D223, and four peripheral anchor points E224.

[0037] Each resonant block 203 is connected to two corresponding outer anchor points A220 by two folded cantilever beams A225; each resonant block 203 is connected to two corresponding outer anchor points B221 by two folded cantilever beams B226; each H-shaped sensitive mass block 204 is connected to two corresponding outer anchor points C222 by two folded cantilever beams C227; each H-shaped sensitive mass block 204 is connected to two corresponding outer anchor points D223 by two pairs of folded cantilever beams D228; each straight cantilever beam A206 is connected to a pair of folded cantilever beams E229 with its corresponding outer anchor point E224.

[0038] The resonator is made of silicon.

[0039] In specific implementation, the base 1 is a square base; the central anchor point 201 is a circular anchor point; the four peripheral anchor points E224 are all triangular anchor points; the resonator part and the electrode part are both circumferentially symmetrical structures; the radial length of each rectangular planar electrode 303 is greater than the radial length of the corresponding square sensitive mass block 205; the radial length of each pair of strip planar electrodes 304 is greater than the radial length of the corresponding square sensitive mass block 205.

[0040] While specific embodiments of the present invention have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but all such changes and modifications fall within the scope of protection of the present invention.

Claims

1. A topological ring monolithic three-axis MEMS gyroscope chip, characterized in that: Includes a substrate (1), a harmonic oscillator, and an electrode. The resonator includes a central anchor point (201) bonded to the upper surface of the substrate (1); a resonant ring (202) is sleeved on the outer side of the central anchor point (201); four resonant squares (203) and four H-shaped sensitive mass blocks (204) are connected around the outer side of the resonant ring (202), and the four resonant squares (203) and four H-shaped sensitive mass blocks (204) are staggered along the circumference; a square sensitive mass block (205) is connected to the inner side of each resonant square (203); a straight cantilever beam A (206) and two rows of detection comb teeth A (207) are connected to the outer side of each resonant square (203); two rows of detection comb teeth B (208) are connected to the outer side of each straight cantilever beam A (206); and four rows of detection comb teeth C (209) are connected to the inner side of each H-shaped sensitive mass block (204). The electrode portion includes eight pairs of arc-shaped three-dimensional electrodes A (301), eight pairs of arc-shaped three-dimensional electrodes B (302), four rectangular planar electrodes (303), four pairs of strip planar electrodes (304), four pairs of single-sided comb-shaped three-dimensional electrodes A (305), four pairs of single-sided comb-shaped three-dimensional electrodes B (306), and eight pairs of single-sided comb-shaped three-dimensional electrodes C (307) sputtered on the upper surface of the substrate (1); the outer surfaces of the eight pairs of arc-shaped three-dimensional electrodes A (301) and the inner surfaces of the resonant ring (202) form eight pairs of parallel capacitors A; the inner surfaces of the eight pairs of arc-shaped three-dimensional electrodes B (302) and the outer surfaces of the resonant ring (202) form eight pairs of parallel capacitors B; the four rectangular planar electrodes A (301) and B (302) sputtered on the upper surface of the substrate (1) form eight pairs of parallel capacitors B; the four pairs of rectangular planar electrodes A (301) and B (302) sputtered on the upper surface of the substrate (1) form eight pairs of parallel capacitors B; the four pairs of arc-shaped three-dimensional electrodes B (303) sputtered on the upper surface of the substrate (1) form eight pairs of parallel capacitors B; the four pairs of arc-shaped three-dimensional electrodes B (304) sputtered on the upper surface of the substrate (1) form eight pairs of parallel capacitors B; the four pairs of arc-shaped three-dimensional electrodes B (305) sputtered on the upper surface of the substrate (1) form eight pairs of parallel capacitors B; the four pairs of arc-shaped three-dimensional electrodes B (306) sputtered on the upper surface of the substrate (1) form eight pairs of parallel capacitors B; the four pairs of arc-shaped three-dimensional electrodes B (304) sputtered on the upper surface of the substrate (1) form eight pairs of parallel capacitors B; the four pairs of arc-shaped three-dimensional electrodes B ( 3) The upper surface of the electrode and the lower surface of the four square sensitive mass blocks (205) correspond one-to-one to form four parallel capacitors C; the upper surface of the four pairs of strip planar electrodes (304) and the lower surface of the four square sensitive mass blocks (205) correspond one-to-one to form four pairs of parallel capacitors D; the four pairs of single-sided comb-shaped three-dimensional electrodes A (305) and the eight rows of detection comb teeth A (207) correspond one-to-one to form four pairs of comb-tooth capacitors A; the four pairs of single-sided comb-shaped three-dimensional electrodes B (306) and the eight rows of detection comb teeth B (208) correspond one-to-one to form four pairs of comb-tooth capacitors B; the eight pairs of single-sided comb-shaped three-dimensional electrodes C (307) and the sixteen rows of detection comb teeth C (209) correspond one-to-one to form eight pairs of comb-tooth capacitors C.

2. The topological ring monolithic three-axis MEMS gyroscope chip according to claim 1, characterized in that: Four supporting beams A and four supporting beams B are connected between the central anchor point (201) and the resonant ring (202), and the four supporting beams A and four supporting beams B are staggered along the circumference; each supporting beam A includes a straight beam segment A (210), a pair of U-shaped beam segments A (211), and a straight beam segment B (212) connected in sequence from the inside to the outside along the radial direction; each supporting beam B includes a straight beam segment C (213), a pair of U-shaped beam segments B (214), a pair of U-shaped beam segments C (215), and a straight beam segment D (216) connected in sequence from the inside to the outside along the radial direction.

3. The topological ring monolithic three-axis MEMS gyroscope chip according to claim 1, characterized in that: A straight cantilever beam B (217) is connected between each resonant block (203) and the resonant ring (202).

4. The topological ring monolithic three-axis MEMS gyroscope chip according to claim 1, characterized in that: Each of the S-shaped sensitive mass blocks (204) is connected to a straight cantilever beam C (218) between it and the resonant ring (202).

5. The topological ring monolithic three-axis MEMS gyroscope chip according to claim 1, characterized in that: Each resonant block (203) is connected to a corresponding square sensitive mass block (205) by four Z-shaped cantilever beams (219).

6. The topological ring monolithic three-axis MEMS gyroscope chip according to claim 1, characterized in that: Each resonant block (203) has two peripheral anchor points A (220) and two peripheral anchor points B (221) on its outer side; each spherical sensitive mass block (204) has two peripheral anchor points C (222) and two peripheral anchor points D (223) on its outer side; each straight cantilever beam A (206) has one peripheral anchor point E (224) at its tail end; the eight peripheral anchor points A (220), eight peripheral anchor points B (221), eight peripheral anchor points C (222), eight peripheral anchor points D (223), and four peripheral anchor points E (224) are all bonded to the upper surface of the substrate (1).

7. The topological ring monolithic three-axis MEMS gyroscope chip according to claim 1, characterized in that: Each resonant block (203) is connected to two corresponding outer anchor points A (220) by two folded cantilever beams A (225); each resonant block (203) is connected to two corresponding outer anchor points B (221) by two folded cantilever beams B (226); each scalloped sensitive mass block (204) is connected to two corresponding outer anchor points C (222) by two folded cantilever beams C (227); each scalloped sensitive mass block (204) is connected to two corresponding outer anchor points D (223) by two pairs of folded cantilever beams D (228); each straight cantilever beam A (206) is connected to a pair of folded cantilever beams E (229) between its corresponding outer anchor point E (224).

8. The topological ring monolithic three-axis MEMS gyroscope chip according to claim 1, characterized in that: The resonator is made of silicon.

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