A cooling liquid circulation system of an electrostatic chuck and a semiconductor etching machine

Abstract

This invention discloses a coolant circulation system for an electrostatic chuck. When the electrostatic chuck is in operation, the control subsystem opens control valves S and Z, and closes control valves N and E, so that coolant output from the cooling device flows into the cooling device sequentially through control valve S, the electrostatic chuck, and control valve Z. When the electrostatic chuck is in cleaning mode, the control subsystem closes control valves S and Z, and opens control valves N and E, so that gas output from the gas supply unit flows sequentially through control valve N and the electrostatic chuck, purging the coolant in the electrostatic chuck into the coolant tank via control valve E. Compared with existing technologies, this system automates the cleaning of residual coolant from the electrostatic chuck, improving work efficiency and preventing health risks to operators. This invention also discloses a semiconductor etching machine using the above-described coolant circulation system.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and in particular to a coolant circulation system for an electrostatic chuck and a semiconductor etching machine. Background Technology

[0002] Electrostatic chucks (ESCs) are key components in semiconductor equipment, serving two main functions: firstly, they use electrostatic force to firmly hold the wafer to their surface; secondly, they regulate the wafer's temperature. To achieve wafer temperature control, ESCs require a heating layer and a cooling system. Therefore, they are internally designed with irregular coolant channels, through which coolant is supplied by a cooling device. Fluorinated liquids are typically used as coolants, as they possess a degree of toxicity and irritation. When replacing an ESC, any residual coolant must be thoroughly cleaned before operation.

[0003] Traditional coolant cleaning is mainly done manually. However, the evaporation of coolant produces a certain toxic and irritating odor. Apart from wearing protective masks, workers have no other protective measures. Therefore, the current method is not only labor-intensive and inefficient, but also poses certain health risks to the workers. Summary of the Invention

[0004] In view of this, the present invention provides a coolant circulation system for an electrostatic chuck, which can automatically clean residual coolant from the electrostatic chuck, improve work efficiency, and avoid affecting the health of operators.

[0005] The present invention also provides a semiconductor etching machine including the above-described coolant circulation system.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A coolant circulation system for an electrostatic chuck includes:

[0008] The coolant circulation subsystem includes an electrostatic chuck, a control valve S, a cooling device, and a control valve Z; the output end of the cooling device is connected to the input end of the electrostatic chuck through the control valve S, and the output end of the electrostatic chuck is connected to the input end of the cooling device through the control valve Z.

[0009] The coolant cleaning subsystem includes a control valve N, a gas supply unit, a coolant tank, and a control valve E; the gas supply unit is connected to the input end of the electrostatic chuck through the control valve N, and the coolant tank is connected to the output end of the electrostatic chuck through the control valve E.

[0010] A control subsystem is used to control the opening and closing of the control valve S, the control valve Z, the control valve N, and the control valve E;

[0011] When the electrostatic chuck is in operation, the control subsystem controls the opening of control valve S and control valve Z, and also controls the closing of control valve N and control valve E, so that the coolant output from the cooling device flows into the cooling device in sequence through control valve S, the electrostatic chuck and control valve Z.

[0012] When the electrostatic chuck is in the cleaning state, the control subsystem controls the control valve S and the control valve Z to close, and also controls the control valve N and the control valve E to open, so that the gas output from the gas supply unit passes through the control valve N and the electrostatic chuck in sequence, so as to purge the coolant in the electrostatic chuck into the coolant tank through the control valve E.

[0013] Preferably, the coolant cleaning subsystem further includes a gas-liquid separator connected to the top of the coolant tank.

[0014] Preferably, the coolant cleaning subsystem further includes: a pressure relief valve XO, which is connected to the coolant tank via the gas-liquid separator; the control subsystem is capable of controlling the opening and closing of the pressure relief valve XO to regulate the pressure inside the coolant tank.

[0015] Preferably, the coolant cleaning subsystem further includes: the control subsystem is capable of controlling the opening and closing of control valve NO and control valve C;

[0016] The gas supply unit is connected to the coolant tank via the control valve NO, and the bottom of the coolant tank is connected to the input end of the cooling device via the control valve C;

[0017] When the cooling device needs to be replenished with coolant, the control subsystem controls the opening of control valve NO and control valve C, so that the gas supply unit outputs gas through control valve NO and purges the coolant in the coolant tank into the cooling device through control valve C.

[0018] Preferably, the coolant circulation subsystem further includes a pressure relief valve X connected to the cooling device, and the control subsystem is capable of controlling the opening and closing of the pressure relief valve X to regulate the pressure inside the cooling device.

[0019] Preferably, the number of the coolant circulation subsystems is multiple;

[0020] The number of control valves N and E corresponds one-to-one with the number of coolant circulation subsystems;

[0021] The control valves N and E are arranged in parallel. The gas supply unit is connected to the input end of the electrostatic chuck in the corresponding coolant circulation subsystem through the corresponding control valve N, and the coolant tank is connected to the output end of the electrostatic chuck in the corresponding coolant circulation subsystem through the corresponding control valve E.

[0022] Preferably, the control valve S, control valve Z, control valve N and / or the control valve E are solenoid valves.

[0023] Preferably, the cooling device is a chiller or a refrigeration unit.

[0024] Preferably, the control subsystem includes: an instruction module and a microcontroller unit;

[0025] The microcontroller unit is communicatively connected to the instruction module and receives instructions from the instruction module. It controls the opening and closing of the control valve S, the control valve Z, the control valve N, and the control valve E according to the instructions.

[0026] Preferably, the instruction module includes: a host computer and / or a serial port screen.

[0027] Preferably, the microcontroller includes: a single-chip microcomputer;

[0028] The microcontroller is communicatively connected to the instruction module and receives instructions from the instruction module. It then controls the opening and closing of the control valves S, Z, N, and E according to the instructions.

[0029] A semiconductor etching machine includes the aforementioned coolant circulation system.

[0030] As can be seen from the above technical solution, the control subsystem provided by the present invention can adjust the opening and closing of each control valve so that the electrostatic chuck is in working or cleaning state. It can automatically clean the residual coolant in the coolant channel inside the electrostatic chuck, thereby completing the next step of electrostatic chuck disassembly. Compared with the existing technical solution, it can automatically clean the residual coolant in the electrostatic chuck, improve work efficiency, and avoid affecting the health of operators.

[0031] In this technical solution, multiple coolant cleaning subsystems are also set up, and each coolant cleaning subsystem can independently perform electrostatic chuck cooling, electrostatic chuck cleaning, and coolant tank cleaning, thereby improving work efficiency.

[0032] The present invention also provides a semiconductor etching machine, which has corresponding beneficial effects due to the adoption of the above-mentioned coolant circulation system, as can be referred to in the previous description, and will not be repeated here. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 A schematic diagram of the working principle of a coolant circulation system (single coolant circulation subsystem) provided in an embodiment of the present invention.

[0035] Figure 2 A schematic diagram of the working principle of a coolant circulation system (multiple coolant circulation subsystems) provided in an embodiment of the present invention.

[0036] Figure 3 A schematic diagram of the control subsystem of the coolant circulation system provided in an embodiment of the present invention.

[0037] The meanings of the various reference numerals in the figure are as follows:

[0038] 101 is an electrostatic chuck, 102 is control valve N, 103 is pressure relief valve XO, 104 is a gas-liquid separator, 105 is control valve NO, 106 is a gas supply unit, 107 is control valve S, 108 is pressure relief valve X, 109 is a cooling device, 110 is control valve Z, 111 is control valve C, 112 is control valve E, and 113 is a coolant tank.

[0039] 201 is the microcontroller unit, 202 is the host computer, and 203 is the serial port screen. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] The coolant circulation system of the electrostatic chuck provided in this embodiment of the invention, such as... Figures 1-3 As shown, it includes:

[0042] The coolant circulation subsystem includes an electrostatic chuck 101, a control valve S107, a cooling device 109, and a control valve Z110; the output end of the cooling device 109 is connected to the input end of the electrostatic chuck 101 through the control valve S107, and the output end of the electrostatic chuck 101 is connected to the input end of the cooling device 109 through the control valve Z110.

[0043] The coolant cleaning subsystem includes a control valve N102, a gas supply unit 106, a coolant tank 113, and a control valve E112; the gas supply unit 106 is connected to the input end of the electrostatic chuck 101 through the control valve N102, and the coolant tank 113 is connected to the output end of the electrostatic chuck 101 through the control valve E112.

[0044] The control subsystem is used to control the opening and closing of control valves S107, Z110, N102 and E112.

[0045] When the electrostatic chuck 101 is in working condition, the control subsystem controls the opening of control valve S107 and control valve Z110, and also controls the closing of control valve N102 and control valve E112, so that the coolant output from the cooling device 109 flows into the cooling device 109 in sequence through control valve S107, electrostatic chuck 101 and control valve Z110.

[0046] When the electrostatic chuck 101 is in the cleaning state, the control subsystem controls control valve S107 and control valve Z110 to close, and also controls control valve N102 and control valve E112 to open, so that the gas output from the gas supply unit 106 passes through control valve N102 and electrostatic chuck 101 in sequence, so as to purge the coolant in the electrostatic chuck 101 into the coolant tank 113 through control valve E112.

[0047] In this technical solution, when the electrostatic chuck 101 is working normally, the control subsystem controls control valves S107 and Z110 to be in the open state, while the other control valves are in the closed state. The coolant supplied by the cooling device 109 to the electrostatic chuck 101 returns to the cooling device 109 after passing through the coolant channel of the electrostatic chuck 101, forming a cooling circulation channel. When the electrostatic chuck 101 needs to be disassembled, before disassembly, the control subsystem controls control valves S107 and Z110 to be in the closed state, and controls control valves N102 and E112 to be in the open state. Gas enters the coolant channel of the electrostatic chuck 101, blowing the residual coolant into the coolant tank 113. After all the residual coolant in the coolant channel inside the electrostatic chuck 101 has been collected into the coolant tank 113, the control subsystem controls control valves N102 and E112 to be in the closed state, at which point the disassembly of the electrostatic chuck 101 can be performed.

[0048] In the above technical solution, the opening and closing of each control valve can be adjusted through the control subsystem to adjust the state of the electrostatic chuck 101 according to the requirements. This enables the automatic cleaning of residual coolant in the coolant channel inside the electrostatic chuck 101, facilitating the next step of disassembling the electrostatic chuck 101. Compared with the existing technical solutions, this method can automatically clean the residual coolant in the electrostatic chuck, improve work efficiency, and avoid affecting the health of operators (no direct contact with coolant is required).

[0049] In one implementation, due to the high gas purging speed, residual coolant may mix with gas to form a gas-liquid mixture, which splashes everywhere after entering the coolant tank 113. Therefore, the coolant cleaning subsystem also includes a gas-liquid separator 104 connected to the top of the coolant tank 113, such as... Figure 1 As shown, when the gas-liquid mixture passes through the gas-liquid separator 104, the liquid is blocked back into the coolant tank 113 to prevent the coolant from overflowing from the coolant tank 113 during the purging process and causing pollution to the machine or other areas.

[0050] In one implementation, to prevent excessive pressure in the coolant tank 113, the coolant cleaning subsystem further includes a pressure relief valve XO103. The pressure relief valve XO103 is connected to the coolant tank 113 through the gas-liquid separator 104. The control subsystem can control the opening and closing of the pressure relief valve XO103 to regulate the pressure in the coolant tank 113. Thus, the pressure in the coolant tank 113 is autonomously regulated through the pressure relief valve XO103.

[0051] In one implementation, in order to replenish the coolant in the cooling device 109, such as Figure 1 As shown, the coolant cleaning subsystem also includes: control valve NO105 and control valve C111, which are controllable by the control subsystem to control the opening and closing of the system;

[0052] Gas supply unit 106 is connected to coolant tank 113 via control valve NO105, and the bottom of coolant tank 113 is connected to the input end of cooling device 109 via control valve C111.

[0053] When the cooling device 109 needs to be replenished with coolant, the control subsystem controls the opening of control valve NO105 and control valve C111, so that the gas supply unit 106 outputs gas through control valve NO105 to purge the coolant in the coolant tank 113 into the cooling device 109 through control valve C111.

[0054] The above technical solution is optimized by using the control subsystem to increase the opening pressure of the pressure relief valve X0103 (i.e., to automatically open when a certain pressure value is reached). After the electrostatic chuck 101 is installed, the control subsystem controls the program to open the control valves N0105 and C111, using the pressure provided by the gas in the coolant tank 113 to pump the coolant in the coolant tank 113 into the tank of the cooling device 109. Of course, after the pressure relief valve X0103 automatically opens to relieve pressure, the control subsystem can also control the pressure relief valve X0103 to close.

[0055] In one implementation, to prevent excessive pressure in the cooling device 109 tank, such as Figure 1 As shown, the coolant circulation subsystem also includes a pressure relief valve X108 connected to the cooling device 109. The control subsystem can control the opening and closing of the pressure relief valve X108 to regulate the pressure inside the cooling device 109.

[0056] The above technical solution is optimized by using the control subsystem to increase the opening pressure of the pressure relief valve X108 (i.e., to reach the preset pressure value and open automatically). When the pressure in the cooling device 109 exceeds the preset pressure value, the pressure relief valve X108 automatically opens to release pressure. Of course, after the pressure relief valve X108 automatically opens to release pressure, the control subsystem can also control the pressure relief valve X108 to close.

[0057] In one implementation, such as Figure 2 As shown, there are multiple coolant circulation subsystems;

[0058] The number of control valves N102 and E112 corresponds one-to-one with the number of coolant circulation subsystems, and the number of coolant circulation subsystems can be set as needed.

[0059] In this design, control valves N102 and E112 are arranged in parallel. Gas supply unit 106 is connected to the input end of electrostatic chuck 101 in the corresponding coolant circulation subsystem via the corresponding control valve N102. Coolant tank 113 is connected to the output end of electrostatic chuck 101 in the corresponding coolant circulation subsystem via the corresponding control valve E112. In this technical solution, coolant supply and recovery can be achieved simultaneously during normal operation, disassembly, and installation of multiple coolant circulation subsystems. At the same time, the integrated design of multiple coolant circulation subsystems improves the space utilization of the entire equipment.

[0060] In the above technical solution, the electrostatic chucks 101 in each coolant circulation subsystem are independent of each other and do not interfere with each other when in working or cleaning state. One or more electrostatic chucks 101 in one or more coolant circulation subsystems can be in working state, and another one or more electrostatic chucks 101 in another coolant circulation subsystem can be in cleaning state. Of course, the above-mentioned coolant circulation subsystems can all be in the same state (working state or cleaning state). In addition, when multiple electrostatic chucks 101 are working or being disassembled at the same time, the control subsystem opens or closes the corresponding control valves as needed.

[0061] Optimize the above technical solutions, such as Figure 3 As shown, in one embodiment, all control valves in the system are initially closed by default. Only when the electrostatic chuck 101 is working normally (i.e., in the working state) will the host computer 202 or serial port screen 203 open control valves Z110 and S101, while the other control valves are closed. The cooling device 109 supplies coolant to the electrostatic chuck 101, which returns to the cooling device 109 after passing through the coolant channel of the electrostatic chuck 101, forming a closed loop.

[0062] In another embodiment, such as Figure 3 As shown, the coolant circulation system has multiple coolant circulation subsystems. When one of the electrostatic chucks 101 is working normally, and one of the electrostatic chucks 101 needs to be disassembled, the corresponding control valve is opened or closed by the control subsystem. After the residual coolant inside the electrostatic chuck 101 to be disassembled is cleaned, the electrostatic chuck 101 is disassembled.

[0063] In another embodiment, such as Figure 3 As shown, the coolant circulation system has multiple coolant circulation subsystems, and the number of control valves C111 corresponds one-to-one with the number of coolant circulation subsystems. The control valves C111 are arranged in parallel, and the coolant tank 113 is connected to the input terminal of the corresponding cooling device 109 through the corresponding control valve C111. When one of the coolant tanks 113 needs to be cleaned, the host computer 1 or serial port screen 2 opens the control valve NO105 and the corresponding control valve C111, increasing the opening pressure of the pressure relief valve XO103. The gas supply unit 106 introduces gas into the coolant tank 113 to pump the internal cooling fluid of the coolant tank 113 into the cooling device 109. After the coolant in the cooling device 109 has been increased, the control valve NO105 and the corresponding control valve C111 are closed, and the opening pressure of the pressure relief valve XO103 is restored.

[0064] In one implementation, such as Figure 3 As shown, the control subsystem includes an instruction module and a microcontroller unit 201. This control subsystem integrates remote communication, monitoring, and control.

[0065] The microcontroller unit 201 is connected to the instruction module and receives instructions from the instruction module. It controls the opening and closing of control valves S107, Z110, N102 and E112 according to the instructions.

[0066] In one implementation, the control valve S107, control valve Z110, control valve N102 and / or the control valve E112 are solenoid valves; preferably, the pressure relief valve XO103, control valve NO105, pressure relief valve X108 and control valve C111 are all solenoid valves.

[0067] In one implementation, the cooling device 109 is a chiller or a refrigeration unit.

[0068] In the above technical solution, the opening and closing of each control valve can be automatically controlled by the instruction module and the microcontroller 201, so as to realize the switching between the working state and the cleaning state of the electrostatic chuck 101, and the cleaning state of the coolant tank 113.

[0069] The above technical solution is optimized so that the instruction module includes a host computer 202 and / or a serial port screen 203. The host computer 202 can be configured to enable remote control, and the serial port screen 203 can be configured to enable local control. In addition, the simultaneous configuration of the host computer 202 and the serial port screen 203 can enable both remote and local control at the same time, further improving work efficiency and operational safety.

[0070] Optimize the above technical solutions, such as Figure 3 As shown, the microcontroller unit 201 includes: a single-chip microcomputer;

[0071] The microcontroller communicates with the instruction module, receives instructions from the instruction module, and controls the opening and closing of control valves S107, Z110, N102, and E112 according to the instructions. The microcontroller is an industrial product, inexpensive, and durable. In addition, it can be connected to the MCU (i.e., the microcontroller unit 201) via EtherCAT, Bluetooth, or WiFi. It should be noted that an STM32 (i.e., an embedded microcontroller) or a microcontroller with equivalent or higher performance can be used.

[0072] In one implementation, there are many ways to generate exhaust commands, such as by touching a button, pressing a button, or operating in an application. These buttons are formed on the host computer 202 or the serial port screen 203.

[0073] This invention also provides a semiconductor etching machine, including a coolant circulation system as described above. Since this solution employs the aforementioned coolant circulation system, it possesses corresponding beneficial effects, as detailed in the preceding description, which will not be repeated here.

[0074] The following is a further description of this solution with reference to specific embodiments:

[0075] This coolant circulation system solves the problems of complex and cumbersome residual coolant recovery and coolant leakage during the disassembly of electrostatic chucks. It can quickly, conveniently, effectively, cleanly, and safely clean the residual coolant inside the electrostatic chuck, solving the problems of cumbersome manual operation in the current collection of residual coolant from electrostatic chucks. It should be noted that the control valves and pressure relief valves mentioned above are all solenoid valves. It should also be noted that all the above components are connected by 1 / 4 rigid rubber tubing, and the joints are fastened with matching clamps. The entire coolant circulation system piping is guaranteed to be sealed and leak-free. The solenoid valves are arranged on the rigid rubber tubing.

[0076] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0077] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cooling liquid circulation system of an electrostatic chuck, characterized by, include: The coolant circulation subsystem includes an electrostatic chuck (101), a control valve S (107), a cooling device (109), and a control valve Z (110); the output end of the cooling device (109) is connected to the input end of the electrostatic chuck (101) through the control valve S (107), and the output end of the electrostatic chuck (101) is connected to the input end of the cooling device (109) through the control valve Z (110); The coolant cleaning subsystem includes a control valve N (102), a gas supply unit (106), a coolant tank (113), and a control valve E (112); the gas supply unit (106) is connected to the input end of the electrostatic chuck (101) through the control valve N (102), and the coolant tank (113) is connected to the output end of the electrostatic chuck (101) through the control valve E (112); A control subsystem is used to control the opening and closing of the control valve S (107), the control valve Z (110), the control valve N (102) and the control valve E (112); When the electrostatic chuck (101) is in operation, the control subsystem controls the control valve S (107) and the control valve Z (110) to open, and also controls the control valve N (102) and the control valve E (112) to close, so that the coolant output from the cooling device (109) flows into the cooling device (109) after passing through the control valve S (107), the electrostatic chuck (101) and the control valve Z (110) in sequence; When the electrostatic chuck (101) is in the cleaning state, the control subsystem controls the control valve S (107) and the control valve Z (110) to close, and also controls the control valve N (102) and the control valve E (112) to open, so that the gas output from the gas supply unit (106) passes through the control valve N (102) and the electrostatic chuck (101) in sequence, so as to purge the coolant in the electrostatic chuck (101) into the coolant tank (113) through the control valve E (112).

2. The coolant circulation system according to claim 1, characterized by, The coolant cleaning subsystem also includes a gas-liquid separator (104) connected to the top of the coolant tank (113).

3. The cooling liquid circulating system according to claim 2, characterized by The coolant cleaning subsystem further includes a pressure relief valve XO (103), which is connected to the coolant tank (113) via the gas-liquid separator (104). The control subsystem can control the opening and closing of the pressure relief valve XO (103) to regulate the pressure inside the coolant tank (113).

4. The coolant circulation system according to claim 1, characterized by The coolant cleaning subsystem also includes: the control subsystem is capable of controlling the opening and closing of control valve NO (105) and control valve C (111). The gas supply unit (106) is connected to the coolant tank (113) via the control valve NO (105), and the bottom of the coolant tank (113) is connected to the input end of the cooling device (109) via the control valve C (111). When the cooling device (109) needs to be replenished with coolant, the control subsystem controls the opening of the control valve NO (105) and the control valve C (111) so that the gas supply unit (106) outputs gas through the control valve NO (105) to purge the coolant in the coolant tank (113) into the cooling device (109) through the control valve C (111).

5. The coolant circulation system according to claim 1, characterized by The coolant circulation subsystem further includes a pressure relief valve X (108) connected to the cooling device (109). The control subsystem is able to control the opening and closing of the pressure relief valve X (108) to regulate the pressure inside the cooling device (109).

6. The coolant circulation system according to any one of claims 1-5, characterized in that, There are multiple coolant circulation subsystems; The number of control valves N (102) and E (112) corresponds one-to-one with the number of coolant circulation subsystems; The control valves N (102) are arranged in parallel, and the control valves E (112) are arranged in parallel. The gas supply unit (106) is connected to the input end of the electrostatic chuck (101) in the corresponding coolant circulation subsystem through the corresponding control valve N (102), and the coolant tank (113) is connected to the output end of the electrostatic chuck (101) in the corresponding coolant circulation subsystem through the corresponding control valve E (112).

7. The coolant circulation system according to claim 1, characterized in that, The control valve S (107), control valve Z (110), control valve N (102) and / or the control valve E (112) are solenoid valves.

8. The cooling fluid circulation system of claim 1, wherein, The cooling device (109) is a chiller or a refrigeration unit.

9. The cooling fluid circulation system of claim 1, wherein, The control subsystem includes: an instruction module and a microcontroller unit (201). The microcontroller unit (201) is communicatively connected to the instruction module and receives instructions from the instruction module. It controls the opening and closing of the control valve S (107), the control valve Z (110), the control valve N (102), and the control valve E (112) according to the instructions.

10. The cooling fluid circulation system of claim 9, wherein, The instruction module includes: a host computer (202) and / or a serial port screen (203).

11. The cooling fluid circulation system of claim 9, wherein, The microcontroller unit (201) includes: a single-chip microcomputer; The microcontroller is communicatively connected to the instruction module and receives instructions from the instruction module. It controls the opening and closing of the control valve S (107), the control valve Z (110), the control valve N (102), and the control valve E (112) according to the instructions.

12. A semiconductor etching machine characterized by comprising: Includes the coolant circulation system as described in any one of claims 1-11.

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