A dynamic tool setting device and method for a diamond micro-milling cutter

Abstract

This application provides a dynamic tool setting device and method for diamond micro-end milling cutters, relating to the field of precision and ultra-precision machining technology. The method includes the following steps: acquiring a time-series pulse sequence of time-division multiplexing images; and performing tool setting detection on the diamond micro-end milling cutter based on the time-series pulses. This application utilizes the diffraction interference imaging principle of diamond micro-end milling cutters under coaxial laser illumination, employing object-side telecentric vision imaging to ensure a fixed holographic image magnification and microscopic imaging accuracy. By setting the camera trigger acquisition pulse through an external trigger controller via a host computer, the rotating image of the diamond micro-end milling cutter is sampled in a time-division multiplexing manner, achieving full-contour holographic imaging of the diamond micro-end milling cutter under rotating conditions. Simultaneously, by designing a downsampling holographic autofocus algorithm in holographic image processing, the computational load for image holographic reconstruction is reduced, accelerating the tool setting calculation efficiency and providing high-precision tool setting technology support for ultra-precision micro-milling.

Description

Technical Field

[0001] This application relates to the field of vibration measurement technology, and more specifically, to a dynamic tool setting device and method for diamond micro-milling cutters. Background Technology

[0002] Diamond micro-milling technology is widely used in the precision and ultra-precision manufacturing of tiny three-dimensional structural parts in fields such as microelectromechanical systems (MEMS) and optical precision instruments. In ultra-precision micro-milling, the high hardness, excellent wear resistance, and sharp cutting edges of diamond micro-milling cutters can achieve nanoscale surface quality and machining accuracy. Before machining with diamond micro-milling cutters, tool setting is a crucial step that determines the dimensional accuracy and surface morphology of subsequent machining processes.

[0003] Currently, diamond micro-end milling cutter tool setting methods mainly employ trial cutting, laser tool setting, and machine vision optical imaging tool setting. Trial cutting has problems such as long processing time and low tool setting efficiency, and may even lead to damage to the tool cutting edge. Laser tool setting uses a non-contact measurement method, but as the tool diameter decreases, the laser diffraction phenomenon gradually intensifies, severely reducing the tool setting accuracy, especially when the tool is rotating, the accuracy of tool contour measurement is limited. Machine vision optical imaging tool setting requires different magnification lenses when measuring micro-end milling cutters of different diameters. At the same time, after the light source shines on the tool, the diffraction phenomenon of the micro-tool will also cause the tool edge image to be blurred, making it impossible to accurately extract the tool contour for tool setting.

[0004] Therefore, a dynamic tool setting device and method for diamond micro-end milling cutters are proposed to solve one of the aforementioned technical problems. Summary of the Invention

[0005] The purpose of this application is to provide a dynamic tool setting device and method for diamond micro-end milling cutters, which can solve at least one of the technical problems mentioned above. The specific solution is as follows:

[0006] According to a specific embodiment of this application, this embodiment provides a dynamic tool setting method for diamond micro end mills, including the following steps:

[0007] Acquire the time-series pulse sequence of the time-division acquired images;

[0008] The diamond micro-end milling cutter is tested for tool setting based on the timing pulses.

[0009] In some embodiments, the time-series pulse sequence for acquiring the time-division acquired image includes:

[0010] The frequency of the trigger pulse is obtained based on the rotational speed of the diamond micro-end mill.

[0011] Based on the set number of images acquired when the diamond micro end mill rotates one revolution, the rotation angle of the diamond micro end mill in each image and the trigger pulse offset corresponding to the rotation angle are calculated.

[0012] The time-division acquisition image timing pulse sequence is obtained based on the frequency of the trigger pulse, the number of images when the diamond micro-end mill rotates one revolution, the trigger pulse offset, and the trigger pulse width.

[0013] In some embodiments, performing tool setting detection on the diamond micro-end milling cutter based on the timing pulse includes:

[0014] Collect a background image without the diamond micro end mill and a hologram of the diamond micro end mill rotating one revolution, and subtract the background image from each hologram to obtain the tool background-free image;

[0015] The background-removed hologram of the cutting tool is processed by a holographic autofocus algorithm to obtain the optimal reconstruction distance. Based on the optimal reconstruction distance, the background-removed hologram of the cutting tool is reconstructed using the angular spectrum method to obtain a reconstructed hologram.

[0016] Holographic filtering and contour extraction are performed on the reconstructed hologram to obtain an edge contour map; the edge contour maps are superimposed and synthesized to obtain the maximum circumferential diameter contour map of the full envelope of the diamond micro end mill; the maximum circumferential diameter contour map is scanned from bottom to top to obtain the bottom contour line of the diamond micro end mill; the difference between the bottom contour line positions of the diamond micro end mill before and after use is calculated to obtain the elongation of the diamond micro end mill;

[0017] The distance range between rows scanned upwards from the bottom contour baseline is set. Based on the horizontal contour of each scanned row, the pixel spacing between the left and right edges of the contour is calculated. The maximum value of the horizontal contour of all scanned rows is selected as the dynamic maximum diameter of the diamond micro end mill, thereby realizing the tool setting detection of the diamond micro end mill.

[0018] In some embodiments, the diamond micro-end mill is compensated based on the elongation of the diamond micro-end mill and the dynamic maximum diameter.

[0019] In some embodiments, performing holographic autofocus algorithm processing on the background-removed image of the cutting tool to obtain the optimal reconstruction distance includes:

[0020] Set the maximum reconstruction distance, minimum reconstruction distance, and reconstruction distance interval of the tool background removal image to obtain a reconstruction distance sequence;

[0021] The background-removed image of the cutting tool is downsampled by average pooling to obtain a downsampled image; the downsampled image is then expanded by image boundary extension to obtain an expanded hologram; the expanded hologram is then reconstructed by angular spectral method according to the reconstruction distance sequence to obtain a holographic reconstruction image of each hologram at all reconstruction distances;

[0022] Set the number of wavelet decomposition layers, perform two-dimensional discrete wavelet decomposition on the holographic reconstruction map to obtain the wavelet decomposition map, calculate the maximum value of the wavelet high-frequency coefficients of each layer of the wavelet decomposition map to obtain multiple maximum values ​​of wavelet high-frequency coefficients, and sum the maximum values ​​of the wavelet high-frequency coefficients of multiple layers as the holographic reconstruction map sharpness evaluation value.

[0023] Compare the holographic sharpness values ​​of all reconstruction distance sequences for each hologram, and take the reconstruction distance corresponding to the maximum holographic sharpness value as the optimal reconstruction distance of the hologram.

[0024] According to a specific embodiment of this application, another dynamic tool setting device for diamond micro-end milling cutters is disclosed, the device comprising:

[0025] Diamond micro end mills;

[0026] The laser fiber transmission shaping module collimates the transmitted laser, adjusts the intensity of the laser, expands the beam, and finally irradiates the diamond micro-milling cutter with the shaped laser.

[0027] A holographic imaging module is used to image the diamond micro-milling cutter.

[0028] The control module controls the laser fiber transmission shaping module to emit laser light and controls the holographic imaging module to acquire images of the diamond micro-milling cutter according to the timing pulses.

[0029] In some embodiments, the control module includes: a host computer, a camera external trigger controller, and a laser controller; the host computer controls the laser fiber transmission shaping module to start working mode through the laser controller, and at the same time, the host computer sets and configures the trigger acquisition pulse of the holographic imaging module through the camera external trigger controller to perform time-division sampling of the rotating image of the diamond micro milling cutter.

[0030] In some embodiments, the holographic imaging module includes: an object-side telecentric lens and a CMOS camera; the laser transmission carrying diamond micro-milling cutter information passes through the object-side telecentric lens and enters the CMOS camera for holographic coaxial interference imaging.

[0031] In some embodiments, the laser fiber transmission shaping module includes: a semiconductor laser, a fiber transmission component, a fiber collimating lens, a polarizing filter, and a laser beam expander; the semiconductor laser emits laser light, which is transmitted through the fiber transmission component, collimated by the fiber collimating lens, its intensity is adjusted by the polarizing filter, and then expanded by the laser beam expander before irradiating the diamond micro-milling cutter.

[0032] In some embodiments, the diamond micro-end mill is a single-edged diamond micro-end mill with a diameter of 20~500μm.

[0033] Compared with the prior art, the above-described solutions of this application have at least the following beneficial effects:

[0034] This application utilizes the diffraction interference imaging principle of diamond micro-end milling cutters under coaxial laser illumination, employing object-side telecentric vision imaging to ensure a fixed holographic image magnification and microscopic imaging accuracy. By setting the camera trigger acquisition pulse through an external trigger controller controlled by a host computer, the rotating image of the diamond micro-end milling cutter is sampled in a time-division manner, achieving full-contour holographic imaging of the diamond micro-end milling cutter under rotating conditions. Simultaneously, in holographic processing, a downsampling holographic autofocus algorithm is designed to reduce the computational load of image holographic reconstruction and accelerate tool setting efficiency. Compared with traditional machine vision optical imaging tool setting methods and laser tool setting methods, this approach is easier to deploy on ultra-precision micro-milling machines and more easily adapted to tool setting of micro-diameter diamond micro-end milling cutters. Furthermore, the coaxial holographic imaging framework further enhances measurement stability, providing high-precision tool setting technology support for ultra-precision micro-milling machining. Attached Figure Description

[0035] Figure 1 This is a holographic time-division sampling schematic diagram of a dynamic tool setting method for diamond micro-end milling cutters according to the present invention.

[0036] Figure 2 The images show a hologram and a reconstruction of a micro diamond tool used in a dynamic tool setting method for micro diamond milling cutters according to the present invention.

[0037] Figure 3 This is a schematic diagram illustrating the measurement of the maximum dynamic diameter and elongation of a diamond micro-end milling cutter according to the present invention.

[0038] Figure 4 This is a flowchart of the holographic automatic focusing detection process for a dynamic tool setting method for diamond micro-end milling cutters according to the present invention.

[0039] Figure 5 This is a schematic diagram of the structure of a dynamic tool setting device for diamond micro-end milling cutters according to the present invention.

[0040] The markings in the diagram are as follows: 1. Host computer; 2. Laser controller; 3. Semiconductor laser; 4. Fiber optic transmission assembly; 5. Fiber optic input port; 6. Fiber optic collimator; 7. Polarizing filter; 8. First prism; 9. Laser beam expander; 10. Second prism; 11. First protective window; 12. Second protective window; 13. Third prism; 14. Object-side telecentric lens; 15. CMOS camera; 16. External trigger controller for camera; 17. Image acquisition card; 18. Mounting base; 19. Diamond micro-milling cutter; 20. Holographic imaging optical path. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0042] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or device. Without further limitation, an element defined by the phrase "comprising one" does not exclude the presence of other identical elements in the article or device that includes said element.

[0043] This application proposes a dynamic tool setting device and method for diamond micro-end milling cutters. The device performs holographic interference imaging on the diamond micro-end milling cutter under rotating conditions, sets the camera trigger acquisition pulse through the external trigger controller of the host computer, performs time-division sampling on the rotating image of the diamond micro-end milling cutter, reconstructs the contour of the diamond micro-end milling cutter using a holographic image processing algorithm, and calculates the diameter and elongation of the diamond micro-end milling cutter.

[0044] This application achieves online tool setting monitoring of diamond micro-end mills by recording and reconstructing the complete wavefront of the diamond micro-end mill, which far exceeds the depth of field range of traditional microscopes. This has significant engineering implications and practical value for improving the clamping accuracy of diamond micro-end mills and the machining quality of parts.

[0045] The following is in conjunction with the appendix Figure 1-5 Detailed description of optional embodiments of the present invention.

[0046] According to a specific embodiment of the present invention, this application provides a dynamic tool setting method based on a diamond micro-end milling cutter, comprising:

[0047] S1: Acquire the time-series pulse sequence of the time-division acquisition image;

[0048] S2: Perform tool setting detection on the diamond micro-end mill 19 according to the timing pulse.

[0049] In some embodiments, the time-series pulse sequence for acquiring the time-division acquired image includes:

[0050] S11: Obtain the frequency of the trigger pulse, i.e., the fixed interval T1 of the trigger pulse, based on the rotational speed N of the diamond micro-end mill 19. For example, the rotational speed N of the diamond micro-end mill 19 is 2000 rpm, and the fixed interval of the trigger pulse is 0.03 s.

[0051] ;

[0052] S12: As Figure 1 As shown, based on the set number K of images K acquired when the diamond micro-end mill 19 rotates one revolution, the rotation angle θ corresponding to the diamond micro-end mill 19 in each image and the trigger pulse offset corresponding to the rotation angle are calculated. t; The time interval for the CMOS camera to acquire images is T. 1i = (i-1)T1+(i-1) t, where i=1:K; for example, the number of images acquired when the diamond micro-end mill 19 rotates one revolution is set to 400, and the rotation angle θ of the diamond micro-end mill 19 in each image is 0.75 degrees.

[0053] ,

[0054] The trigger pulse offset corresponding to the rotation angle is: t=75μs,

[0055] ;

[0056] S13: Based on the frequency T1 of the trigger pulse, the number K of images when the diamond micro-end mill 19 rotates one revolution, and the offset of the trigger pulse... The timing pulse sequence of the time-division acquisition image is obtained by using t and the trigger pulse width w. By triggering the acquisition with time-division pulses, the timing of image acquisition can be precisely controlled during the rotation of the diamond micro end mill 19, ensuring that the acquired image corresponds to the specific rotation angle of the tool. This avoids image blurring or information overlap caused by continuous exposure, providing a reliable timing reference for subsequent high-precision tool setting detection. It also ensures that the trigger pulse is precisely synchronized with the actual rotation state of the tool, ensuring that each frame of the image can accurately correspond to the specific position of the tool in the rotation cycle, improving the synchronization accuracy and repeatability of image acquisition, and laying the data foundation for full envelope contour reconstruction.

[0057] In some embodiments, performing tool setting detection on the diamond micro-end milling cutter 19 based on the timing pulse includes:

[0058] S21: Collect one background image BK excluding the diamond micro-end mill 19 and 400 holograms of the diamond micro-end mill 19 after one revolution {P}. k}, k=1:400, and subtract each of the holograms from the background image to obtain the tool background-removed image {Q}. k}, k=1:400; such as Figure 2 As shown,

[0059] Q temp =P k -X s* BK, ,

[0060] Where min and max are the operations for obtaining the minimum and maximum values, respectively, X s The value of is 1 in this embodiment, and k is the sequence number of the holographic image sequence. The background subtraction method effectively eliminates ambient light interference and background noise, highlights the contour information of the tool itself, significantly improves the image signal-to-noise ratio, and makes subsequent edge extraction more accurate and reliable.

[0061] S22: Remove the background image {Q} of the cutting tool. k} Perform holographic autofocus algorithm processing to obtain the optimal reconstruction distance D best ,

[0062] D best =AutoFocus({Q k}),

[0063] AutoFocus() is the operation for finding the optimal reproduction distance, based on the optimal reproduction distance D. best The angular spectral method was used to process 400 background-removed holograms of the aforementioned tool {Q k Reconstruction is performed to obtain a reconstructed hologram. ,

[0064] ,

[0065] Where F{} represents the Fourier transform of the background-removed hologram of the tool, F -1 {} is used to perform an inverse Fourier transform on the background-removed hologram of the cutting tool, f x and f y z represents the frequency domain coordinates; z is the obtained optimal reproduction distance D. bestFor example, λ is the laser wavelength of 635nm; it automatically finds the optimal reconstruction distance, achieves optimal focusing of the hologram without manual intervention, ensures optimal clarity of the reconstructed image, avoids contour distortion caused by defocusing, and improves the automation and accuracy of knife detection;

[0066] S23: As Figure 3 As shown, a hologram is generated from the reconstructed hologram. Filtering and contour extraction are performed to obtain the edge contour map {C} k}; The edge contour map {C k The maximum circumferential diameter profile of the full envelope of the diamond micro-end milling cutter 19 was obtained by superimposing and synthesizing the data. max， ，

[0067] like Figure 3 As shown, the bottom contour of the diamond micro-end mill 19 is obtained by scanning the maximum circumferential diameter profile from bottom to top; the elongation of the diamond micro-end mill 19 is obtained by subtracting the positions of the bottom contour before and after use; by synthesizing the full envelope profile from multiple frames, the maximum circumcircle information of the rotating tool can be completely obtained, overcoming the limitation that a single frame image can only capture the profile of a certain angle of the tool, and realizing the accurate characterization of the dynamic envelope of the tool; the axial wear elongation of the tool during use is accurately detected, providing a quantitative basis for tool wear condition assessment and machining accuracy compensation, and avoiding machining depth errors caused by tool elongation;

[0068] S24: Set the distance range between rows scanned from the bottom contour line upwards. Calculate the pixel spacing between the left and right edges of the contour based on each scanned horizontal contour. Filter the maximum value of the horizontal contour of all scanned rows as the dynamic maximum diameter of the diamond micro-end mill 19. This enables diamond micro-end mill tool setting detection. Filter the maximum horizontal diameter within a specific height range to effectively eliminate interference from the tool shank or clamping part, accurately obtain the dynamic maximum diameter of the effective cutting part of the tool, and achieve high-precision detection of the key dimensions of the tool.

[0069] In some embodiments, the diamond micro-end mill 19 is compensated based on the elongation of the diamond micro-end mill 19 and the dynamic maximum diameter; adaptive compensation is performed based on real-time detected changes in tool geometry parameters, automatically correcting the machining path or parameters, reducing machining errors caused by tool wear, and improving the dimensional accuracy and consistency of micro-machining.

[0070] In some embodiments, the background-removed image of the cutting tool is processed using a holographic autofocus algorithm to obtain the optimal reconstruction distance D. best include:

[0071] S221: As Figure 4 As shown, the background image of the cutting tool is set to {Q}. k Maximum reconstruction distance d max Minimum reconstruction distance d min and reconstruction distance interval d, obtain the reconstructed distance sequence d p d p For {d min， d min + d, d min +2 d, ....d max}, where s is the reconstructed distance sequence d p The number of elements in the middle, for example, the reconstructed distance interval. d is typically 0.01 mm.

[0072]

[0073] in () is the floor function;

[0074] S222: Remove the background image {Q} of the cutting tool. k Perform average pooling downsampling to obtain the downsampling map {O}. k};

[0075] ,

[0076] Where w is the downsampling scale, for example, w is set to 2; u and v are the pixel row and column coordinates of the downsampled image Om, respectively, and i and j are the Q... k The pixel row and column coordinates of the image;

[0077] For the downsampling map {O k} Perform image boundary extension to obtain the extended hologram {E} k},

[0078] in To extend the width of the row, To extend the width of a column, for example, Set to 200. Set to 200, N is 0 k The number of rows, M is O k The column numbers, i and j, are the image E. k The position of the pixel rows and columns;

[0079] Based on the reconstructed distance sequence d p For the extended hologram {E k} Perform angular spectral reconstruction to obtain each hologram at all reconstruction distances. Holographic reconstruction image {J k},

[0080] ,

[0081] Where s q To reconstruct the distance sequence d p The label in the text, z is d p Chinese q The corresponding reproduction distance; reducing computational load and improving processing speed through downsampling; ensuring the integrity of the reconstructed image at the boundary during angular spectrum reconstruction, balancing computational efficiency and reconstruction quality;

[0082] S223: Set the wavelet decomposition level L, and obtain the holographic reconstruction image at the optimal reconstruction distance. Two-dimensional discrete wavelet decomposition is performed to obtain the wavelet decomposition graph. The wavelet basis functions are chosen as Haar wavelet basis functions.

[0083]

[0084] in {} represents the two-dimensional discrete wavelet decomposition of the image, where l=1:L. This is a wavelet decomposition diagram of layer L;

[0085] Calculate the L-layer wavelet decomposition graph The high-frequency coefficient values ​​of each wavelet layer are calculated, and the maximum value of the high-frequency coefficients of each layer is obtained. The maximum values ​​of the high-frequency coefficients of multiple layers are summed to form the holographic reconstruction image. For example, the wavelet high-frequency coefficients for sharpness evaluation are the horizontal high-frequency coefficient, the vertical high-frequency coefficient, and the focus high-frequency coefficient. By utilizing the sensitivity of wavelet transform to high-frequency details of the image, the image sharpness at different reconstruction distances can be accurately quantified. Compared with traditional sharpness evaluation methods, it is more targeted to the hologram reconstruction quality and ensures that the determination of the optimal reproduction distance is accurate and reliable.

[0086] S224: Compare each holographic reconstruction image J k Among all reconstruction distance sequences, the reconstruction distance corresponding to the maximum value of the holographic sharpness is taken as the optimal reconstruction distance of the hologram.

[0087] According to a specific embodiment of this application, another dynamic tool setting device for diamond micro-end milling cutters is provided, such as... Figure 5 As shown, the device includes:

[0088] A diamond micro end mill 19 is mounted on the spindle of an ultra-precision milling machine via a tool holder. A first protective light window 11 and a second protective light window 12 are provided on both sides of the spindle. Both the first protective light window 11 and the second protective light window 12 are made of high-transparency quartz glass and are arranged on the same optical axis.

[0089] The laser fiber transmission shaping module collimates the transmitted laser, adjusts the intensity of the laser and expands the beam, and finally irradiates the diamond micro-milling cutter 19 with the shaped laser.

[0090] Holographic imaging module, which images the diamond micro-milling cutter 19;

[0091] The control module controls the laser fiber transmission shaping module to emit laser light and controls the holographic imaging module to acquire images of the diamond micro-milling cutter 19 according to the timing pulse.

[0092] In some embodiments, the control module includes: a host computer 1, a laser controller 2, and a camera external trigger controller 16. The host computer 1 controls the laser fiber transmission shaping module to enter working mode via the laser controller 2. Simultaneously, the host computer 1 sets and configures the trigger acquisition pulse of the holographic imaging module via the camera external trigger controller 16 to perform time-division sampling of the rotating image of the diamond micro-milling cutter 19. Through precise timing synchronization control of laser emission and image acquisition, it ensures strict matching between time-division sampling and tool rotation, improving the system's automation level and acquisition reliability, and reducing human error.

[0093] In some embodiments, the holographic imaging module includes: a third prism 13, an object-side telecentric lens 14, and a CMOS camera 15; the laser transmission carrying information about the diamond micro-end mill 16 has its propagation direction changed by the third prism 13, passes through the object-side telecentric lens 14, and enters the CMOS camera 15 for holographic coaxial interference imaging; for example, the object-side telecentric lens 14 is an object-side telecentric lens with a magnification of 6X and a working distance of 105mm; the CMOS camera 15 is a black-and-white area array CMOS with a global exposure mode, a pixel size of 3.45μm, a frame rate of 125 frames, a pixel resolution of 2048×1536, and an exposure time of 3μs; the object-side telecentric optical path effectively eliminates the magnification change caused by the change in the axial position of the tool, ensuring the consistency of tool contour size measurement at different depth positions; the CMOS camera 15, in conjunction with coaxial interference, achieves high-resolution holographic imaging, capturing sub-micron-level features of the micro-tool.

[0094] In some embodiments, the laser fiber transmission shaping module includes: a semiconductor laser 3, a fiber transmission assembly 4, a fiber collimator 6, a polarizing filter 7, a first prism 8, a laser beam expander 9, and a second prism 10. The semiconductor laser 3 emits laser light, which is transmitted through the fiber transmission assembly 4, enters the fiber collimator 6 at the fiber input port 5, is collimated by the fiber collimator 6, has its intensity adjusted by the polarizing filter 7, and is reflected by the first prism 8 to the laser beam expander 9. After being expanded by the laser beam expander 9, it is reflected by the second prism 10 to the diamond micro-milling cutter 19. For example, the semiconductor laser 3 has a wavelength of 635nm and a power of 5mW, the fiber collimator 6 outputs a beam of 2mm, and the laser beam expander 9 is a 2X beam expander; the laser beam is shaped into a high-quality illumination source suitable for holographic imaging, ensuring uniform light intensity and beam parallelism, providing stable and controllable illumination conditions for holographic coaxial interference imaging, and improving imaging quality; fiber optic transmission enables flexible arrangement of the laser source and optical path isolation, the polarization dimmer 7 enables light intensity adjustment to avoid overexposure, and the laser beam expander 9 expands the illumination field of view. The overall module structure is compact and easy to adjust, providing uniform and stable coherent illumination for micro-tools.

[0095] In some embodiments, the diamond micro end mill is a single-flute diamond micro end mill with a diameter of 20~500μm; the design is optimized for the special structure of the single-flute micro tool to meet the ultra-precision tool setting requirements in the diameter range of 20~500μm, filling the technical gap of traditional tool setting methods in the detection of micro-diameter single-flute tools and expanding the application range of micro-machining.

[0096] Finally, it should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the systems or apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple, and relevant parts can be referred to the method section.

[0097] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A dynamic tool setting method for diamond micro-end milling cutters, characterized in that, The method includes the following steps: Acquire the time-series pulse sequence of the time-division acquired images; The diamond micro-end milling cutter is tested for tool setting based on the timing pulses.

2. The method according to claim 1, characterized in that, The time-series pulse sequence for acquiring the time-division acquired image includes: The frequency of the trigger pulse is obtained based on the rotational speed of the diamond micro-end mill. Based on the set number of images acquired when the diamond micro end mill rotates one revolution, the rotation angle of the diamond micro end mill in each image and the trigger pulse offset corresponding to the rotation angle are calculated. The time-division acquisition image timing pulse sequence is obtained based on the frequency of the trigger pulse, the number of images when the diamond micro-end mill rotates one revolution, the trigger pulse offset, and the trigger pulse width.

3. The method according to claim 2, characterized in that, The tool setting detection of the diamond micro end mill based on the timing pulse includes: Collect a background image without the diamond micro end mill and a hologram of the diamond micro end mill rotating one revolution, and subtract the background image from each hologram to obtain the tool background-free image; The background-removed hologram of the cutting tool is processed by a holographic autofocus algorithm to obtain the optimal reconstruction distance. Based on the optimal reconstruction distance, the background-removed hologram of the cutting tool is reconstructed using the angular spectrum method to obtain a reconstructed hologram. Holographic filtering and contour extraction are performed on the reconstructed hologram to obtain an edge contour map; the edge contour maps are superimposed and synthesized to obtain the maximum circumferential diameter contour map of the full envelope of the diamond micro end mill; the maximum circumferential diameter contour map is scanned from bottom to top to obtain the bottom contour line of the diamond micro end mill; the difference between the bottom contour line positions of the diamond micro end mill before and after use is calculated to obtain the elongation of the diamond micro end mill; The distance range between rows scanned upwards from the bottom contour baseline is set. Based on the horizontal contour of each scanned row, the pixel spacing between the left and right edges of the contour is calculated. The maximum value of the horizontal contour of all scanned rows is selected as the dynamic maximum diameter of the diamond micro end mill, thereby realizing the tool setting detection of the diamond micro end mill.

4. The method according to claim 3, characterized in that, The diamond micro-end mill is compensated based on its elongation and its dynamic maximum diameter.

5. The method according to claim 3, characterized in that, The background-removed image of the cutting tool is processed using a holographic autofocus algorithm to obtain the optimal reconstruction distance, including: Set the maximum reconstruction distance, minimum reconstruction distance, and reconstruction distance interval of the tool background removal image to obtain a reconstruction distance sequence; The background-removed image of the cutting tool is downsampled by average pooling to obtain a downsampled image; the downsampled image is then expanded by image boundary extension to obtain an expanded hologram; the expanded hologram is then reconstructed by angular spectral method according to the reconstruction distance sequence to obtain a holographic reconstruction image of each hologram at all reconstruction distances; Set the number of wavelet decomposition layers, perform two-dimensional discrete wavelet decomposition on the holographic reconstruction image to obtain the wavelet decomposition image, calculate the wavelet high-frequency coefficient value of each layer of the wavelet decomposition image to obtain the maximum value of the multi-layer wavelet high-frequency coefficient, and sum the maximum values ​​of the multi-layer wavelet high-frequency coefficients as the sharpness evaluation value of the holographic reconstruction image. Compare the holographic sharpness values ​​of all reconstruction distance sequences for each hologram, and take the reconstruction distance corresponding to the maximum holographic sharpness value as the optimal reconstruction distance of the hologram.

6. A dynamic tool setting device for diamond micro-end milling cutters, used to implement the dynamic tool setting method for diamond micro-end milling cutters as described in any one of claims 1-5, characterized in that, The device includes: Diamond micro end mills; The laser fiber transmission shaping module collimates the transmitted laser, adjusts the intensity of the laser, expands the beam, and finally irradiates the diamond micro-milling cutter with the shaped laser. A holographic imaging module is used to image the diamond micro-milling cutter. The control module controls the laser fiber transmission shaping module to emit laser light and controls the holographic imaging module to acquire images of the diamond micro-milling cutter according to the timing pulses.

7. The apparatus according to claim 6, characterized in that, The control module includes: a host computer, a camera external trigger controller, and a laser controller; the host computer controls the laser fiber transmission shaping module to start working mode through the laser controller, and at the same time, the host computer sets and configures the trigger acquisition pulse of the holographic imaging module through the camera external trigger controller to perform time-division sampling of the rotating image of the diamond micro milling cutter.

8. The apparatus according to claim 6, characterized in that, The holographic imaging module includes: an object-side telecentric lens and a CMOS camera; the laser transmission carrying information about the diamond micro-milling cutter passes through the object-side telecentric lens and enters the CMOS camera for holographic coaxial interference imaging.

9. The apparatus according to claim 6, characterized in that, The laser fiber transmission shaping module includes: a semiconductor laser, a fiber transmission component, a fiber collimating lens, a polarizing filter, and a laser beam expander; the semiconductor laser emits laser light, which is transmitted through the fiber transmission component, collimated by the fiber collimating lens, its intensity is adjusted by the polarizing filter, and then expanded by the laser beam expander before irradiating the diamond micro-milling cutter.

10. The apparatus according to claim 6, characterized in that, The diamond micro end mill is a single-edged diamond micro end mill with a diameter of 20~500μm.

Images