A polishing apparatus and a polishing method

Abstract

This specification provides a polishing apparatus, comprising: a first rotating member configured to drive a workpiece to rotate; a housing defining a polishing chamber configured to contain a polishing medium; wherein the workpiece is located within the polishing chamber, immersed in the polishing medium, and driven to rotate relative to the polishing medium by the first rotating member.

Description

Technical Field

[0001] This specification relates to the field of surface polishing technology, and in particular to a polishing apparatus and polishing method. Background Technology

[0002] Polishing refers to a processing method that uses mechanical, chemical, or electrochemical processes to reduce the surface roughness of a workpiece, thereby obtaining a bright and smooth surface. When polishing optical lenses, contact polishing methods such as airbag polishing, sponge ball polishing, damping cloth polishing, or polyurethane polishing are commonly used. While these methods can reduce the surface roughness of the lens, it is difficult to maintain the lens's shape and contour, which is particularly important for optical lenses.

[0003] Therefore, it is desirable to propose a polishing device and polishing method that can maintain the surface shape and contour of optical lenses during the polishing process. Summary of the Invention

[0004] This specification provides a polishing apparatus according to one or more embodiments, the apparatus comprising: a first rotating member configured to drive a workpiece to rotate; a housing defining a polishing chamber configured to contain a polishing medium; wherein the workpiece is located within the polishing chamber, immersed in the polishing medium, and driven to rotate relative to the polishing medium by the first rotating member.

[0005] This specification provides one or more embodiments of a polishing method based on a polishing apparatus, the polishing apparatus comprising: a first rotating member configured to drive a workpiece to rotate; a housing and a cover, the cover being capable of being sealed to the housing, the cover and the housing together defining a polishing chamber configured to contain a polishing medium; a supply and discharge mechanism for supplying the polishing medium to the polishing chamber or discharging the polishing medium from the polishing chamber; and a pressurizing mechanism configured to increase the internal stress of the polishing medium within the polishing chamber; wherein the workpiece is located within the polishing chamber, immersed in the polishing medium, and driven to rotate relative to the polishing medium by the first rotating member; the method includes a first polishing process, wherein the first polishing process includes: mounting the workpiece on the first rotating member; controlling the cover to be sealed to the housing; controlling the supply and discharge mechanism to supply the first polishing medium to the polishing chamber, such that the workpiece is immersed in the polishing medium; controlling the pressurizing mechanism to increase the internal stress of the first polishing medium within the polishing chamber until the internal pressure of the pressurizing mechanism reaches a first preset threshold; and activating the first rotating member. Attached Figure Description

[0006] This specification will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0007] Figure 1 This is an exemplary frame diagram of a polishing apparatus according to some embodiments of this specification;

[0008] Figure 2 This is a first structural view of the polishing apparatus shown in some embodiments of this specification;

[0009] Figure 3 This is a second structural view of the polishing apparatus shown in some embodiments of this specification;

[0010] Figure 4 This is a communication connection diagram of a polishing apparatus according to some embodiments of this specification;

[0011] Figure 5 This is a flowchart illustrating a polishing method according to some embodiments of this specification;

[0012] Figure 6 This is a flowchart of the first polishing process shown in some embodiments of this specification;

[0013] Figure 7 This is a flowchart of the second polishing process shown in some embodiments of this specification;

[0014] Figure 8 This is a flowchart illustrating the cleaning process according to some embodiments of this specification. Detailed Implementation

[0015] To more clearly illustrate the technical solutions of the embodiments in this specification, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this specification. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0016] It should be understood that the terms "system," "unit," and / or "module" used herein are a method of distinguishing different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they may be replaced by other expressions.

[0017] The terms "first," "second," and similar terms used in this application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "an" or "a," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, and these steps and elements do not constitute an exclusive list; the method or apparatus may also include other steps or elements.

[0018] Flowcharts are used in this specification to illustrate the operations performed by the system according to embodiments of this specification. It should be understood that the preceding or following operations are not necessarily performed in exact order. Instead, the steps can be processed in reverse order or simultaneously. Furthermore, other operations can be added to these processes, or one or more steps can be removed from them.

[0019] This specification describes a polishing apparatus. In some embodiments, the polishing apparatus may include a first rotating member and a housing defining a polishing chamber configured to contain a polishing medium. A workpiece to be polished is located within the polishing chamber, in contact with the polishing medium, and is driven to rotate by the first rotating member. In some embodiments, the polishing medium may be a solid-liquid mixture. The workpiece to be polished can achieve uniform contact with the liquid polishing medium, and the rotation of the workpiece within the polishing medium can achieve uniform polishing of the workpiece surface without affecting the workpiece's shape and contour.

[0020] In some embodiments, the polishing apparatus may include a pressurizing mechanism configured to increase the internal stress of the polishing medium within the polishing chamber. The polishing chamber is a sealed chamber, and the pressurizing mechanism increases the pressure within the polishing chamber, for example, by increasing the air pressure and / or hydraulic pressure within the polishing chamber, thereby increasing the internal stress of the polishing medium within the polishing chamber, and thus increasing the contact force between the polishing medium and the workpiece, thereby improving polishing efficiency.

[0021] In some embodiments, the polishing apparatus can be used to polish workpieces (such as optical lenses) with high requirements for parameters such as surface roughness, face shape, and profile. Surface roughness refers to the unevenness of the machined surface, characterized by small gaps and minute peaks and valleys. The smaller the surface roughness, the smoother the surface. Face shape refers to the shape and curvature of the machined surface. Profile (or surface profile) refers to the degree of deviation between the microscopic shape of the machined surface and the ideal shape, and is a key indicator for describing the accuracy of surface shape. For example, for optical lenses, different surface roughness, face shape, and profile will have different effects on light propagation and focusing. After the optical lens is cut and processed, its face shape and profile are basically determined. Polishing is required to bring its surface roughness to the required level, but the polishing must not affect the face shape and profile of the optical lens. The embodiments in this specification use a polishing apparatus to polish optical lenses. The optical lens to be polished makes uniform contact with the liquid polishing medium, and the optical lens rotates in the polishing medium, resulting in uniform polishing of the optical lens surface without affecting the face shape and profile of the optical lens.

[0022] Figure 1 This is an exemplary frame diagram of a polishing apparatus according to some embodiments of this specification. Figure 1 As shown, the polishing device 100 includes a housing 110 and a first rotating member 120.

[0023] The housing 110 is configured to contain a polishing medium. In some embodiments, the housing 110 may define a polishing chamber configured to contain the polishing medium. In some embodiments, the housing 110 and the defined polishing chamber may be of any shape, including cylinders, prisms, cones, spheres, etc. For example, the housing 110 may be prism-shaped, and the defined polishing chamber may be cylindrical. In some embodiments, the polishing medium is a solid-liquid mixture comprising a liquid and one or more solid particles (e.g., alumina, cerium oxide, etc., and any combination thereof). In some embodiments, the workpiece to be polished is located within the polishing chamber and immersed in the polishing medium, meaning that the entire surface of the workpiece is in contact with the polishing medium, i.e., the entire workpiece is immersed in the polishing medium.

[0024] The first rotating member 120 is configured to drive the workpiece to rotate. In some embodiments, the workpiece to be polished is driven to rotate by the first rotating member 120. For example, the first rotating member 120 includes a first rotating end, the workpiece to be polished is fixedly mounted relative to the first rotating end, and the first rotating member 120 drives the first rotating end to rotate, thereby driving the workpiece to rotate. In some embodiments, the rotation direction of the workpiece is arbitrary. The rotating workpiece can agitate the solid particles contained in the polishing medium, causing the solid particles to be suspended in the liquid. The suspended solid particles achieve uniform contact with the rotating workpiece, and the rotating workpiece continuously impacts the suspended solid particles, achieving uniform polishing of the workpiece surface.

[0025] In some embodiments, the polishing apparatus 100 includes a pressure boosting mechanism 130. The pressure boosting mechanism 130 is configured to increase the internal stress of the polishing medium within the polishing chamber. In some embodiments, the polishing chamber is a sealed chamber with a fixed volume. The pressure boosting mechanism 130 increases the pressure within the polishing chamber to increase the internal stress of the polishing medium, thereby increasing the contact force between the polishing medium and the workpiece and improving polishing efficiency. For example, the pressure boosting mechanism 130 includes a hydraulic cylinder that pressurizes more polishing medium or other liquid into the polishing chamber, increasing the hydraulic pressure within the polishing chamber to increase the internal stress of the polishing medium. For example, the pressure boosting mechanism 130 includes a pneumatic cylinder that pressurizes more gas into the polishing chamber, increasing the pneumatic pressure within the polishing chamber to increase the internal stress of the polishing medium.

[0026] In some embodiments, to prevent the first rotating member 120 from failing to fully agitate the solid particles in the polishing chamber, causing some solid particles to sink to the bottom and affecting polishing efficiency, the polishing apparatus 100 may include a second rotating member 140, part of which is located within the polishing chamber. The second rotating member 140, through its rotation, agitates the solid particles in the polishing chamber together with the first rotating member 120, ensuring polishing efficiency. The rotation direction of the second rotating member 140 can be arbitrary. In some embodiments, to ensure that the agitation force exerted by the first rotating member 120 and the second rotating member 140 on the polishing medium covers the entire polishing medium within the polishing chamber, so that all solid particles in the polishing chamber are in a suspended state, the second rotating member 140 may be positioned relatively far from the first rotating member 120 within the polishing chamber. Since the first rotating member 120, when driving the workpiece to rotate, can cause the solid particles contained in the polishing medium to rotate almost in the same direction as the workpiece, the impact force of the solid particles relative to the workpiece is relatively weak, resulting in lower polishing efficiency. Therefore, in some embodiments, the second rotating member 140 can avoid or reduce the co-rotation of solid particles and the workpiece caused by the first rotating member 120, increasing the impact force of the solid particles relative to the workpiece, thereby improving polishing efficiency. In some embodiments, the position, rotation direction, rotation speed, or any combination thereof of the second rotating member 140 differs from that of the first rotating member 120, which can reduce the co-rotation of solid particles and the workpiece, thereby improving polishing efficiency. In some embodiments, the position of the second rotating member 140 within the polishing chamber is not limited. For example, the second rotating member 140 can be disposed opposite to the first rotating member 120, adjacent to the first rotating member 120, or distributed at a certain angle (the angle is greater than 0° and less than 180°) to the first rotating member 120. The first rotating member 120 has a first rotation axis, and the second rotating member 140 has a second rotation axis. The rotation axis refers to its central axis of rotation. The angle between the second rotating member 140 and the first rotating member 120 can be the angle between the first rotation axis and the second rotation axis. In some embodiments, when the first rotation axis is parallel or nearly parallel to the plane of the second rotation axis, the rotation direction of the first rotating member 120 is the same as or opposite to the rotation direction of the second rotating member 140. Wherein, when the rotation direction of the first rotating member 120 is different from the rotation direction of the second rotating member 140, the rotational speed of the first rotating member 120 is the same as or different from the rotational speed of the second rotating member 140; when the rotation direction of the first rotating member 120 is the same as the rotation direction of the second rotating member 140, the rotational speed of the first rotating member 120 is different from the rotational speed of the second rotating member 140. In some embodiments, when the first and second rotation axes are distributed at a certain angle (the angle is greater than 0° and less than 180°), the rotation direction or rotational speed of the second rotating member 140 is not limited.The rotation direction of the second rotating member 140 is the same as or opposite to the rotation direction of the first rotating member 120, and / or the rotational speed of the second rotating member 140 is the same as or different from the rotational speed of the first rotating member 120. For ease of explanation, this specification will subsequently describe an embodiment in which the first rotating axis and the second rotating axis are parallel or nearly parallel as an example. The parameters and settings involved can be applied or extended without hindrance to embodiments in which the first rotating axis and the second rotating axis are distributed at a certain angle, based on the understanding of those skilled in the art.

[0027] Further details regarding the housing 110, the first rotating member 120, the pressurizing mechanism 130, and the second rotating member 140 can be found below, for example... Figure 2 The relevant description is provided below. It should be noted that the following examples are for illustrative purposes only and do not constitute a limitation thereof.

[0028] Figure 2 This is a first structural view of a polishing apparatus according to some embodiments of this specification.

[0029] like Figure 2 As shown, the polishing apparatus 200 includes a housing 210, a first rotating member 220, a pressurizing mechanism 230, and a second rotating member 240. The housing 210 forms a polishing chamber 211, which holds the polishing medium. The first rotating member 220 includes a first rotating end 221, at which a workpiece 10 is mounted. The first rotating end 221 is located within the polishing chamber 211, and the workpiece 10 is entirely submerged in the polishing medium. The pressurizing mechanism 230 increases the pressure within the polishing chamber 211 by injecting more liquid (e.g., polishing medium) into the polishing chamber 211, thereby increasing the internal stress of the polishing medium within the chamber. The second rotating member 240 includes a second rotating end 241, which is located within the polishing chamber 211. The first rotating member 220 and the second rotating member 240 are arranged opposite to each other, so that the agitation force exerted by the first rotating member 220 and the second rotating member 240 on the polishing medium can cover the polishing medium in the polishing chamber. At the same time, by limiting the rotation direction and / or speed of the second rotating member 240 to be different from that of the first rotating member 220, the co-rotation of solid particles and workpiece caused by the first rotating member 220 can be avoided or reduced. It should be noted that... Figure 2 The positions of the components included in the polishing apparatus 200 shown are not intended to be limited, and the components included in the polishing apparatus 200 can be arranged in any suitable position according to actual needs.

[0030] In some embodiments, the housing 210 is cylindrical, and the defined polishing chamber 211 is also cylindrical. In some embodiments, the housing 210 has an opening on one side to facilitate the entry of the first rotating end 221 into the polishing chamber 211. The workpiece 10 is mounted on the first rotating end 221 and enters the polishing chamber 211 together with the first rotating end 221. In some embodiments, the first rotating component 220 drives the first rotating end 221 to rotate via its power unit (e.g., a motor). In some embodiments, in order not to damage the workpiece 10, the workpiece 10 can be fixedly mounted on the first rotating end 221 by means of negative pressure adsorption, clamping, etc.

[0031] In some embodiments, a polishing medium is contained in a polishing chamber 211. The polishing medium includes one or more mixed liquids, such as water, alcohol, or any combination thereof. In some embodiments, the polishing medium also includes one or more solid particles that are insoluble in the liquid contained in the polishing medium. In some embodiments, the liquid concentration of the polishing medium is 35% to 60%. Here, liquid concentration can be understood as the volume ratio of the solid particles to the liquid contained in the polishing medium. Polishing media with a liquid concentration greater than 35% contain more solid particles, resulting in a higher degree of polishing of the workpiece 10, and can be used for initial polishing or rough polishing of the workpiece 10. In some embodiments, to ensure a higher degree of polishing, the liquid concentration of the polishing medium is 40% to 60%. In some embodiments, to better ensure the surface shape and contour of the workpiece 10 and avoid excessive wear on the workpiece 10 caused by polishing media with higher liquid concentrations, the liquid concentration of the polishing medium is 40% to 50%. In some embodiments, the liquid concentration of the polishing medium is 5% to 20%. Polishing media with a liquid concentration less than 20% contain fewer solid particles, resulting in a lower degree of polishing of the workpiece 10, and can be used for polishing or fine polishing of the workpiece 10 after initial polishing. In some embodiments, to ensure a higher degree of polishing, the liquid concentration of the polishing medium is 10% to 20%. In some embodiments, to better ensure the surface shape and contour of the workpiece 10, the liquid concentration of the polishing medium is 10% to 15%.

[0032] In some embodiments, the pressurizing mechanism 230 includes a pressurizing channel 231 connected to the housing 210, with a pressurizing port corresponding to the housing 210. The pressurizing channel 231 communicates with the polishing chamber 211 through the pressurizing port. More gas or liquid enters the polishing chamber 211 through the pressurizing channel 231 to increase the pressure inside the polishing chamber 211. In some embodiments, the pressurizing mechanism 230 includes a pressurizing end 232 that cooperates with the pressurizing channel 231. The pressurizing end 232 can be driven by its power unit (e.g., a motor, cylinder, hydraulic cylinder, etc.) to reciprocate along the pressurizing channel 231. When the pressurizing end 232 is driven closer to the housing 210, it squeezes the liquid filling the pressurizing channel 231, forcing more liquid into the polishing chamber 211, increasing the pressure inside the polishing chamber 211, thereby increasing the internal stress of the polishing medium inside the polishing chamber 211.

[0033] In some embodiments, since the pressure-bearing capacity of components such as the polishing chamber 211 and the pressurization channel 231 is limited, the pressurization of the pressurization mechanism 230 can be limited to avoid continuous pressurization of the polishing chamber 211 by the pressurization mechanism 230, which could damage the related structures of the polishing apparatus 200. In some embodiments, the pressurization mechanism 230 includes a first pressure detection unit that detects the output pressure of the pressurization mechanism 230. Due to the reciprocity of pressure action, the magnitude of the output pressure of the pressurization mechanism 230 can characterize the pressure within the polishing chamber 211. For example, the first pressure detection unit detects the pressure within the pressurization channel 231, and the pressure within the pressurization channel 231 can be considered equivalent to the output pressure of the pressurization mechanism 230. In some embodiments, when the output pressure of the boosting mechanism 231 detected by the first pressure detection unit reaches a first preset threshold, the boosting mechanism 230 is controlled to stop increasing the internal stress of the polishing medium in the polishing chamber, that is, the boosting end 232 is controlled to stop advancing into the housing 210, so that the pressure in the boosting channel 231 and the polishing chamber 211 is within a suitable range, which can improve the polishing efficiency and prevent the relevant structures of the polishing device 200 from being damaged by pressure. In some embodiments, the range of the first preset threshold is 0.3MPa to 0.8MPa. In some embodiments, to further protect the relevant structures of the polishing device 200, the range of the first preset threshold is 0.3MPa to 0.6MPa. In some embodiments, to further improve the polishing efficiency, the range of the first preset threshold is 0.5MPa to 0.8MPa.

[0034] In some embodiments, the housing 210 and the second rotating member 240 are mounted on the first frame 21. The first frame 21 supports the entire polishing apparatus 200. In some embodiments, the second rotating member 240 is disposed through the first frame 21, such that one end of the second rotating member 240 is located within the polishing chamber 211 defined by the housing 210. In some embodiments, the first frame 21 and the housing 210 are provided with through holes at corresponding positions, and the second rotating member 240 passes through the through holes, that is, the second rotating member 240 is disposed through the first frame 21 and the housing 210, and the second rotating end 241 extends into the housing 210 and is located within the polishing chamber 211. In some embodiments, the second rotating member 240 drives the second rotating end 241 to rotate via its power unit (e.g., a motor). In some embodiments, when the rotation direction of the first rotating member 220 is opposite to that of the second rotating member 240, the rotational speed of the first rotating member 220 may be the same as or different from that of the second rotating member 240; or, when the rotation direction of the first rotating member 220 is the same as that of the second rotating member 240, the rotational speed of the first rotating member 220 may be different from that of the second rotating member 240. This ensures that there is always a difference in rotational speed between the first rotating member 220 and the second rotating member 240. The difference in rotational speed between the first rotating member 220 and the second rotating member 240 determines the motion state of the solid particles within the polishing chamber 211. The workpiece 10 rotates with the first rotating member 220. The difference in rotational speed between the first rotating member 220 and the second rotating member 240 can increase the impact force between the solid particles and the workpiece 10, thereby improving polishing efficiency. In some embodiments, when the rotation direction of the first rotating member 220 is opposite to that of the second rotating member 240, the ratio of the rotational speed of the first rotating member 220 to that of the second rotating member 240 is in the range of 5:1. In some embodiments, when the rotation direction of the first rotating member 220 is the same as the rotation direction of the second rotating member 240, the ratio of the rotational speed of the first rotating member 220 to the rotational speed of the second rotating member 240 ranges from 0.2 to 0.8 or from 1.2 to 5. In some embodiments, when the rotation direction of the first rotating member 220 is the same as the rotation direction of the second rotating member 240, the ratio of the rotational speed of the first rotating member 220 to the rotational speed of the second rotating member 240 ranges from 0.5 to 0.8 or from 1.5 to 3.

[0035] In some embodiments, to ensure that the agitation force exerted by the first rotating member 220 and the second rotating member 240 on the polishing medium can cover the entire polishing medium within the polishing chamber, this can be achieved by increasing the contact area between the first rotating member 220 and / or the second rotating member 240 and the polishing medium, and / or by increasing the rotational speed between the first rotating member 220 and / or the second rotating member 240. Increasing the contact area between the first rotating member 220 and / or the second rotating member 240 and the polishing medium can also affect the movement state of solid particles within the polishing chamber 211. Driven by the same rotational speed difference between the first rotating member 220 and the second rotating member 240, increasing the contact area between the first rotating member 220 and / or the second rotating member 240 and the polishing medium can increase the movement amplitude of the solid particles, thereby further increasing the impact force between the solid particles and the workpiece 10 and improving polishing efficiency. In some embodiments, the first rotating end 221 and / or the second rotating end 241 includes rotating blades, which can increase the contact area between the first rotating end 221 and / or the second rotating end 241 and the polishing medium. In some embodiments, the ratio of the contact area between the first rotating member 220 and the polishing medium to the contact area between the second rotating member 240 and the polishing medium is in the range of 1.38:1.

[0036] In some embodiments, to ensure the sealing of the polishing chamber 211, the first rotating member 220 can achieve a sealed connection with the opening of the housing 210. For example, after the workpiece 10 is installed on the first rotating member 220, the workpiece 10 extends into the opening, and the periphery of the first rotating member 220 can press against the opening of the housing 210 to achieve a sealed connection. In some embodiments, to facilitate the loading and unloading of the workpiece 10 and to facilitate sealing, the polishing device 200 further includes a cover 250, which can achieve a sealed connection with the opening of the housing 210. By providing the cover 250, various sealing methods can be selected to ensure the sealing of the polishing chamber 211. For example, the cover 250 can be provided with a snap-fit ​​structure, and the cover 250 snaps against the opening through the snap-fit ​​structure to achieve a seal. In some embodiments, the cover 250 can cover the opening provided on one side of the housing 210. The cover 250 and the housing 210 together form the polishing chamber 211, and the cover 250 can achieve a sealed connection with the housing 210 to achieve the sealing of the polishing chamber 211. In some embodiments, such as Figure 2 As shown, the side of the housing 210 with an open opening is in close contact with the side of the cover 250 near the housing 210, achieving a sealed connection between the cover 250 and the housing 210. In some embodiments, a flange is provided extending towards the center of the opening in the housing 210, and the side of the cover 250 near the housing 210 is in close contact with the side of the flange in the opening near the cover 250, achieving a sealed connection between the cover 250 and the housing 210. The following will use... Figure 2 The following example illustrates the application of the cover 250 as being in close contact with the side of the housing 210 that has an opening.

[0037] In some embodiments, the cover 250 is provided with a mounting hole, and the first rotating member 220 passes through the mounting hole. The first rotating end 221 is located on the side of the cover 250 closer to the housing 210. When the cover 250 and the housing 210 together form a polishing chamber 211, the first rotating end 221 is located inside the polishing chamber 211, and the workpiece 10 mounted on the first rotating end 221 is also located inside the polishing chamber 211. In some embodiments, other parts of the first rotating member 220, such as the power unit, are located on the side of the cover 250 away from the housing 210, that is, outside the polishing chamber 211, which helps to protect other parts of the first rotating member 220 from contact with the polishing medium.

[0038] In some embodiments, a power mechanism is provided to press the cover 250 against the housing 210 so that the side of the cover 250 near the housing 210 is in close contact with the side of the housing 210 with the open side. In some embodiments, the direction of the force applied by the power mechanism to the cover 250 is perpendicular or nearly perpendicular to the plane in which the cover 250 and the housing 210 are in contact, making the contact between the cover 250 and the housing 210 even tighter. When the side of the cover 250 near the housing 210 is in contact with the side of the housing 210 with the open side, the plane in which the cover 250 and the housing 210 are in contact is either the side of the cover 250 near the housing 210 or the side of the housing 210 with the open side.

[0039] In some embodiments, the polishing apparatus 200 includes a lifting mechanism 260, which can bring the cover 250 closer to the housing 210 and press the cover 250 against the housing 210 to ensure a sealed connection between the cover 250 and the housing 210. In some embodiments, the lifting mechanism 260 can not only bring the cover 250 closer to the housing 210, but also move the cover 250 away from the housing 210, thereby opening the polishing chamber 211 to facilitate the removal and installation of the workpiece 10. In some embodiments, the lifting mechanism 260 is connected to the cover 250, and when the lifting mechanism 260 is in operation, it can move the cover 250 closer to or further away from the housing 210. Specifically, the lifting mechanism 260 is connected to the side of the cover 250 away from the housing 210. In some embodiments, the lifting mechanism 260 includes a length-adjustable mechanism such as a telescopic cylinder or a telescopic hydraulic cylinder. For example, the lifting mechanism 260 includes a telescopic cylinder. One end of the telescopic cylinder is connected to the side of the cover 250 away from the housing 210, and the other end of the telescopic cylinder away from the cover 250 is relatively fixed. When the telescopic cylinder is in operation, since the length of the telescopic cylinder itself is adjustable, it can move the cover 250 closer to or further away from the housing 210. In some embodiments, the lifting mechanism 260 is along the lifting direction (see...) Figure 2 The lifting structure 260 is extended in a direction that is perpendicular or nearly perpendicular to the plane in which the cover 250 and the housing 210 fit together. The length of the lifting structure 260 in the lifting direction is adjustable.

[0040] In some embodiments, one end of the lifting mechanism 260 away from the cover 250 is fixed to the second frame 22. The second frame 22 supports the lifting mechanism 260. The second frame 22 is connected to the side of the first frame 21 having the housing 210. In some embodiments, the lifting mechanism 260 includes a lifting end 261, one end of the lifting mechanism 260 away from the lifting end 261 is mounted on the second frame 22, and the second frame 22 has a corresponding hole, through which the lifting end 261 passes. The lifting end 261 is driven by the power unit of the lifting mechanism 260 to extend and retract along the lifting direction, and the lifting end 261 is directly or indirectly connected to the cover 250. In some embodiments, to ensure that the cover 250 remains stable as it approaches or moves away from the housing 210, the lifting mechanism 260 includes a guide member, which limits the movement of the cover 250 along the lifting direction as it is driven by the lifting mechanism 260. In some embodiments, the guide member includes a guide sleeve 262 and a guide post 263. The guide sleeve 262 is fixed to the second frame 22 and has a guide channel extending along the lifting direction. A guide post 263 passes through the guide channel of the guide sleeve 262 and can move freely along the guide channel. The end of the guide post 263 near the cover 250 is directly or indirectly connected to the cover 250. As the cover 250 is moved closer to or away from the housing 210 by the lifting mechanism 260, the guide post 263 moves along the lifting direction in the guide channel of the guide sleeve 262, helping the cover 250 to move stably in the lifting direction and ensuring that the cover 250 can smoothly fit against the housing 210. In some embodiments, to further ensure the stability of the cover 250 as it moves closer to or away from the housing 210, the lifting mechanism 260 includes multiple guide members, and the ends of the multiple guide posts 263 near the cover 250 are all directly or indirectly connected to the cover 250. In some embodiments, since a first rotating member 220 is mounted on the cover 250, in order to leave space for the first rotating member 220, the lifting end 261 is connected to the cover 250 via a connecting rod 264, which is arranged around the first rotating member 220. In some embodiments, the end of the guide post 263 near the cover 250 and the lifting end 261 are both connected to the cover 250 via the connecting rod 264.

[0041] In some embodiments, the lifting mechanism 260 pushes the cover 250 to press against the housing 210, achieving a sealed connection between the cover 250 and the housing 210. Since the pressure-bearing capacity of components such as the cover 250 and the housing 210 is limited, to prevent the lifting mechanism 260 from applying excessive pressure to the housing 210 through the cover 250, which could damage the relevant structures of the polishing device 200, the pressure applied by the lifting mechanism 260 can be limited. In some embodiments, the lifting mechanism 260 includes a second pressure detection unit that detects the output pressure of the lifting mechanism 260. Due to the reciprocity of pressure action, the magnitude of the output pressure of the lifting mechanism 260 can characterize the pressure exerted by the cover 250 on the housing 210. For example, when the lifting mechanism 260 is a cylinder or a hydraulic cylinder, the second pressure detection unit detects the pressure inside the cylinder. In some embodiments, when the output pressure of the lifting mechanism 260 detected by the second pressure detection unit reaches a second preset threshold, the lifting mechanism 260 is controlled to stop operating, that is, the cover 250 is controlled to stop advancing into the housing 210, so that the pressure of the cover 250 on the housing 210 is within a suitable range, which can both ensure the sealed connection between the cover 250 and the housing 210 and prevent the related structures of the polishing device 200 from being damaged by pressure. In some embodiments, the range of the second preset threshold is 7.5MPa to 12.5MPa. In some embodiments, in order to further protect the related structures of the polishing device 200, the range of the second preset threshold is 7.5MPa to 10MPa. In some embodiments, in order to further ensure the sealing between the cover 250 and the housing 210, the range of the second preset threshold is 8.5MPa to 10MPa.

[0042] In some embodiments, the polishing apparatus 200 includes a supply and discharge mechanism 270, which is used to supply polishing media to the polishing chamber 211 or discharge polishing media from the polishing chamber 211, thereby enabling the polishing apparatus 200 to perform automated polishing. In some embodiments, the supply and discharge mechanism 270 includes a power pump, a supply pipeline, and a discharge pipeline. The supply pipeline and the discharge pipeline are connected to the polishing chamber 211. The power pump is used to provide power to supply polishing media into the polishing chamber 211 through the supply pipeline, and the polishing media in the polishing chamber 211 is discharged through the discharge pipeline.

[0043] In some embodiments, the polishing medium includes two polishing media, namely a first polishing medium and a second polishing medium, wherein the liquid concentration of the first polishing medium is higher than that of the second polishing medium. In some embodiments, since the liquid concentrations of the first polishing medium and the second polishing medium are different, they can be used separately for different stages of polishing. Specifically, the first polishing medium has a higher liquid concentration and can be used for the initial polishing or rough polishing of the workpiece 10. The second polishing medium has a lower liquid concentration and can be used for polishing or fine polishing of the workpiece 10 after the initial polishing. In some embodiments, the liquid concentration of the first polishing medium is 35% to 60%. In some embodiments, the liquid concentration of the second polishing medium is 5% to 20%. In some embodiments, the first polishing medium and the second polishing medium, which are used separately for different stages of polishing, are supplied separately to the polishing chamber 211 by the supply and discharge mechanism 270. Further description of the supply and discharge mechanism 270 can be found below, for example... Figure 3 Related descriptions.

[0044] Figure 3 This is a second structural view of the supply and discharge mechanism shown in some embodiments of this specification.

[0045] like Figure 3 As shown, the supply and discharge mechanism 270 includes a first supply and discharge unit 271 and a second supply and discharge unit 272. The first supply and discharge unit 271 is used to supply or discharge a first polishing medium. The second supply and discharge unit 272 is used to supply or discharge a second polishing medium.

[0046] In some embodiments, the first supply and discharge unit 271 includes a first power pump 2711 and a first housing 2712. The first housing 2712 is used to contain a first polishing medium, and the first power pump 2711 is used to pump the first polishing medium from the first housing 2712. The first power pump 2711 is connected to the polishing chamber 211 through a first supply pipeline. The first power pump 2711 pumps the first polishing medium from the first housing 2712 into the polishing chamber 211 through the first supply pipeline. In some embodiments, the first supply pipeline is provided with a first supply valve 2713. When the first supply valve 2713 is in an open state, the first power pump 2711 can pump the first polishing medium into the polishing chamber 211 through the first supply pipeline. In some embodiments, the first supply and discharge unit 271 includes a first discharge valve 2714, which is connected to the polishing chamber 211 through a first discharge pipeline. When the first discharge valve 2714 is in an open state, the first polishing medium in the polishing chamber 211 is discharged through the first discharge pipeline. In some embodiments, the first discharge pipe is connected to the first housing 2712, so that the first polishing medium discharged from the polishing chamber 211 can be reused.

[0047] In some embodiments, the second supply and discharge unit 272 includes a second power pump 2721 and a second housing 2722. The second housing 2722 is used to contain a second polishing medium, and the second power pump 2721 is used to pump the second polishing medium from the second housing 2722. The second power pump 2721 is connected to the polishing chamber 211 through a second supply pipeline. The second power pump 2721 pumps the second polishing medium from the second housing 2722 into the polishing chamber 211 through the second supply pipeline. In some embodiments, the second supply pipeline is provided with a second supply valve 2723. When the second supply valve 2723 is in an open state, the second power pump 2721 can pump the second polishing medium into the polishing chamber 211 through the second supply pipeline. In some embodiments, the second supply and discharge unit 272 includes a second discharge valve 2724, which is connected to the polishing chamber 211 through a second discharge pipeline. When the second discharge valve 2724 is in an open state, the second polishing medium in the polishing chamber 211 is discharged through the second discharge pipeline. In some embodiments, the second discharge line is connected to the second housing 2722, so that the second polishing medium discharged from the polishing chamber 211 can be reused.

[0048] In some embodiments, to ensure the complete discharge of the polishing medium (first polishing medium or second polishing medium) within the polishing chamber 211, air can be supplied to the polishing chamber 211 to increase the air pressure within it, causing the polishing medium to be completely discharged from the discharge pipe under pressure. In some embodiments, an air supply pipe is connected to the polishing chamber 211. When it is necessary to discharge the polishing medium, the discharge valve (first discharge valve and second discharge valve) on the corresponding discharge pipe (first discharge pipe or second discharge pipe) is opened, and air is supplied to the polishing chamber 211 through the air supply pipe to force out the polishing medium within the polishing chamber 211. In some embodiments, an air supply valve 273 is provided on the air supply pipe, which is used to open or close the air supply pipe.

[0049] In some embodiments, to prevent residual substances in the polishing chamber 211 from affecting the polishing effect, a cleaning medium (e.g., clean water) can be introduced into the polishing chamber 211 to clean it. In some embodiments, the supply and discharge mechanism 270 includes a third supply and discharge unit 274. The third supply and discharge unit 274 is used to supply or discharge the cleaning medium into the polishing chamber 211. In some embodiments, the third supply and discharge unit 274 includes a third power pump 2741 and a third housing 2742. The third housing 2742 is used to contain the cleaning medium, and the third power pump 2741 is used to pump the cleaning medium from the third housing 2742. The third power pump 2741 is connected to the polishing chamber 211 through a third supply pipeline. The third power pump 2741 pumps the cleaning medium from the third housing 2742 into the polishing chamber 211 through the third supply pipeline. In some embodiments, the third supply pipeline is provided with a third supply valve 2743. When the third supply valve 2743 is open, the third power pump 2741 can pump cleaning medium to the polishing chamber 211 through the third supply pipeline. In some embodiments, the third supply and discharge unit 274 includes a third discharge valve 2744, which is connected to the polishing chamber 211 through a third discharge pipeline. When the third discharge valve 2744 is open, the cleaning medium in the polishing chamber 211 is discharged through the third discharge pipeline. In some embodiments, the third discharge pipeline is connected to the third housing 2742, allowing the cleaning medium discharged from the polishing chamber 211 to be reused.

[0050] In some embodiments, the supply and discharge mechanism 270 supplies polishing medium into the polishing chamber 211. The liquid level of the polishing medium in the polishing chamber 211 needs to submerge the workpiece 10 mounted on the first rotating end 221 to achieve polishing of the workpiece 10. To facilitate control of the liquid level of the polishing medium in the polishing chamber 211, the liquid level in the polishing chamber 211 needs to be detected during the supply of polishing medium. When the liquid level in the polishing chamber 211 submerges the workpiece 10, the supply and discharge mechanism 270 can stop supplying polishing medium. In some embodiments, a liquid level sensor 280 is provided on the side of the cover 250 near the housing 210. The liquid level sensor 280 is configured to detect the liquid level of the polishing medium in the polishing chamber 211.

[0051] In some embodiments, when the liquid level sensor 280 detects that the liquid level of the polishing medium in the polishing chamber 211 has reached a first preset height, the supply and discharge mechanism 270 stops supplying the polishing medium. The first preset height is approximately the height of the cover 250. In some embodiments, when the liquid level sensor 280 detects that the liquid level of the polishing medium in the polishing chamber 211 has reached a second preset height, the supply and discharge mechanism 270 stops discharging the polishing medium from the polishing chamber 211, facilitating monitoring of whether the liquid in the polishing chamber 211 has been completely discharged. The second preset height is approximately the height of the side of the housing 210 furthest from the cover 250.

[0052] In some embodiments, to enable automated polishing, the polishing apparatus 200 includes a control device. The control device can acquire and analyze pressure information, liquid level information, etc., from the polishing apparatus 200. The control device can also control the start / stop status of various components of the polishing apparatus 200, thereby automating the polishing apparatus 200. In some embodiments, the control device can control the start / stop status of various components of the polishing apparatus 200 based on information acquired from the polishing apparatus 200, thereby achieving intelligent operation of the polishing apparatus 200. In some embodiments, the control device is communicatively connected to the polishing apparatus 200 to acquire information and control status. The communication connection between the control device and the polishing apparatus 200 can be found in [reference needed]. Figure 4 As shown.

[0053] Figure 4 This is a communication connection diagram of a polishing apparatus according to some embodiments of this specification.

[0054] In some embodiments, the control device 290 can process data and / or information obtained from the polishing apparatus 200. In some embodiments, the control device 290 can obtain and analyze first pressure information detected by the first pressure detection unit from the pressurizing mechanism 230. In some embodiments, the control device 290 can obtain and analyze second pressure information detected by the second pressure detection unit from the lifting mechanism 260. In some embodiments, the control device 290 can obtain and analyze liquid level information from the liquid level sensor 280. In some embodiments, the control device 290 can send instruction information (e.g., start instruction, stop instruction, etc.) to the first rotating member 220, the pressurizing mechanism 230, the second rotating member 240, the lifting mechanism 260, and the supply and discharge mechanism 270. In some embodiments, the control device 290 can send instruction information to the pressurizing mechanism 230 based on the first pressure information. In some embodiments, the control device 290 can send instruction information to the lifting mechanism 260 based on the second pressure information. In some embodiments, the control device 290 can send instruction information to the supply and discharge mechanism 270 based on the liquid level information.

[0055] In some embodiments, the control device 290 may be a single server or a group of servers, and the server group may be centralized or distributed. In some embodiments, the control device 290 may be local or remote. In some embodiments, the control device 290 may be implemented on a cloud platform. For example, the cloud platform may include private cloud, public cloud, hybrid cloud, community cloud, distributed cloud, inter-cloud cloud, multi-cloud, etc., or any combination thereof. In some embodiments, the control device 290 may include one or more processors (e.g., a single-chip processor or a multi-chip processor). In some embodiments, the control device 290 may be a standalone device. In some embodiments, the control device 290 may be part of the polishing apparatus 200. For example, the control device 290 may be integrated into the polishing apparatus 200.

[0056] Network 30 can connect control device 290, first rotating member 220, pressurizing mechanism 230, second rotating member 240, lifting mechanism 260, and supply and discharge mechanism 270. In some embodiments, control device 290, first rotating member 220, pressurizing mechanism 230, second rotating member 240, lifting mechanism 260, and supply and discharge mechanism 270 can exchange information and / or data through network 30. In some embodiments, control device 290 sends instruction information to first rotating member 220, pressurizing mechanism 230, second rotating member 240, lifting mechanism 260, and supply and discharge mechanism 270 through network 30. In some embodiments, network 30 may include at least one network access point. For example, network 30 may include wired and / or wireless network access points, such as base stations and / or internet switching points, and control device 290, first rotating member 220, pressurizing mechanism 230, second rotating member 240, lifting mechanism 260, and supply and discharge mechanism 270 can connect to network 30 through the access point to exchange data and / or information.

[0057] It should be noted that the communication connection of the polishing apparatus is provided for illustrative purposes only and is not intended to limit the scope of this application. Those skilled in the art can make various modifications or variations based on the description in this specification. For example, the communication connection of the polishing apparatus may not have a network, and the control device 290 may be connected to the first rotating member 220, the pressurizing mechanism 230, the second rotating member 240, the lifting mechanism 260, and the supply and discharge mechanism 270 via cables. However, these variations and modifications will not depart from the scope of this application.

[0058] Figure 5 This is a flowchart illustrating a polishing method according to some embodiments of this specification.

[0059] like Figure 5As shown, the polishing method 500 includes a first polishing process 510, a cleaning process 520, and a second polishing process 530. The polishing method 500 can be implemented based on the polishing apparatus described in any of the above embodiments. In some embodiments, the polishing method 500 can be executed by the control device 290 described above.

[0060] The first polishing process 510 can be used for rough polishing or initial polishing of the workpiece 10. The first polishing process 510 can quickly achieve a roughly smooth surface on the workpiece 10, requiring high polishing efficiency. In some embodiments, the polishing medium used in the first polishing process 510 is a first polishing medium. In some embodiments, there is a large difference in rotational speed between the first rotating member 220 and the second rotating member 240 in the first polishing process 510. In some embodiments, the pressurization mechanism 230 in the first polishing process 510 is set with a large first preset threshold to significantly increase the pressure within the polishing chamber 211.

[0061] The cleaning process 520 can be used to clean the polishing chamber 211. In some embodiments, the cleaning process 520 cleans the polishing chamber 211 by introducing a cleaning medium into the polishing chamber 211 and then discharging the cleaning medium, thereby preventing the polishing medium remaining in the polishing chamber 211 from affecting the subsequent polishing effect.

[0062] The second polishing process 530 can be used to finely polish the workpiece 10. The second polishing process 530 can achieve a higher surface finish on the workpiece 10, requiring a lower polishing efficiency than the first polishing process 510. In some embodiments, the second polishing process 530 is performed after the first polishing process 510. In some embodiments, the polishing medium used in the second polishing process 530 is a second polishing medium. In some embodiments, the rotational speed difference between the first rotating member 220 and the second rotating member 240 in the second polishing process 530 can be less than the rotational speed difference in the first polishing process 510. In some embodiments, the first preset threshold set by the pressure boosting mechanism 230 in the second polishing process 530 can be less than the first preset threshold set in the first polishing process 510.

[0063] It should be noted that, Figure 5The first polishing process 510, cleaning process 520, and second polishing process 530 shown are not limited in their application or order. Those skilled in the art can make various modifications or variations based on the description in this specification. For example, the first polishing process 510, cleaning process 520, or second polishing process 530 can be applied alone. Alternatively, any two of the first polishing process 510, cleaning process 520, and second polishing process 530 can be combined. Furthermore, the application order of the first polishing process 510, cleaning process 520, and second polishing process 530 can be arbitrarily adjusted. However, these variations and modifications will not depart from the scope of this application.

[0064] Figure 6 This is a flowchart of a first polishing process according to some embodiments of this specification.

[0065] like Figure 6 As shown, the first polishing process 510 includes the following steps.

[0066] 511. Install the workpiece onto the first rotating component. This step can be performed manually or by external equipment (e.g., a robotic arm).

[0067] In some embodiments, the lifting mechanism is activated to move the cover away from the housing and mount the workpiece on the first rotating end of the first rotating member.

[0068] 512, Control the sealing connection between the cover and the housing. This step can be performed by the control device.

[0069] In some embodiments, the lifting mechanism is controlled to operate, bringing the cover closer to the housing and pressing the cover against the housing. In some embodiments, the lifting mechanism includes a second pressure detection unit that detects the output pressure of the lifting mechanism, which can characterize the pressure between the cover and the housing. In some embodiments, the control device receives second pressure information (i.e., the output pressure of the lifting mechanism) detected by the second pressure detection unit. A second preset threshold is pre-stored in the control device. When the second pressure reaches the second preset threshold, the control device controls the lifting mechanism to stop operating, at which point the cover and the housing achieve a sealed connection.

[0070] 513. Control the supply and discharge mechanism to supply the first polishing medium to the polishing chamber, so that the workpiece comes into contact with the first polishing medium. This step can be performed by the control equipment.

[0071] In some embodiments, the first supply valve is opened, the first power pump is operated, and the first polishing medium enters the polishing chamber through the first supply pipeline. In some embodiments, a liquid level sensor is installed in the polishing chamber to detect the liquid level height of the polishing medium. In some embodiments, the control device receives the liquid level height information detected by the liquid level sensor. A first preset height is pre-stored in the control device. When the liquid level height reaches the first preset height, the first power pump is stopped, and the first supply valve is closed. At this time, the workpiece is completely immersed in the first polishing medium.

[0072] 514. Control the pressurization mechanism to increase the internal stress of the first polishing medium in the polishing chamber until the output pressure of the pressurization mechanism reaches the first preset threshold. This step can be implemented by the control equipment.

[0073] In some embodiments, the pressurizing mechanism is controlled to operate, and the pressurizing end moves towards the housing within the pressurizing channel. During this movement, the pressurizing end continuously increases the pressure within the polishing chamber. In some embodiments, the pressurizing mechanism includes a first pressure detection unit that detects the output pressure of the pressurizing mechanism. The output pressure of the pressurizing mechanism can characterize the pressure within the polishing chamber. In some embodiments, the control device receives first pressure information (i.e., the output pressure of the pressurizing mechanism) detected by the first pressure detection unit. A first preset threshold is pre-stored in the control device. When the first pressure reaches the first preset threshold, the control device controls the pressurizing mechanism to stop operating. At this point, a suitable pressure is achieved within the polishing chamber, which is beneficial for improving polishing efficiency.

[0074] 515, Start the first and second rotating parts. This step can be performed by the control equipment.

[0075] In some embodiments, the control device can control a first rotating component to rotate at a preset speed and in a preset direction, allowing the workpiece to rotate relative to the polishing medium for polishing. In some embodiments, the control device can control the activation of both the first and second rotating components. The second rotating component can reduce the co-rotation of solid particles and the workpiece, improving polishing efficiency. In some embodiments, the control device can control the first and second rotating components to rotate at preset speeds and in preset directions, respectively. In some embodiments, the control device controls the first and second rotating components to rotate in opposite directions; for example, controlling the first rotating component to rotate clockwise and the second rotating component to rotate counterclockwise. In some embodiments, the control device controls the ratio of the rotational speeds of the first and second rotating components to be within a range of 5:1. In some embodiments, after the first and second rotating components are activated, the control device controls the pressure boosting end to remain stable to maintain the internal stress of the first polishing medium within the polishing chamber.

[0076] Figure 7This is a flowchart illustrating the cleaning process according to some embodiments of this specification.

[0077] like Figure 7 As shown, the cleaning process 520 includes the following steps.

[0078] 521. Control the supply and discharge mechanism to supply cleaning medium to the polishing chamber. This step can be performed by the control equipment.

[0079] In some embodiments, the pressurization mechanism is stopped. In some embodiments, the supply and discharge mechanism is controlled to discharge the first polishing medium from the polishing chamber. Specifically, the first discharge valve is controlled to open, the air supply valve is controlled to open, air is introduced into the polishing chamber, and the first polishing medium is discharged through the first discharge pipeline. In some embodiments, a liquid level sensor detects the liquid level in the polishing chamber, and a second preset height is pre-stored in the control device. When the liquid level reaches the second preset height, the control device controls the first discharge valve and the air supply valve to close. At this time, the first polishing medium in the polishing chamber is discharged. In some embodiments, after the first polishing medium in the polishing chamber is discharged, the third supply valve is controlled to open, the third power pump is controlled to run, and the cleaning medium enters the polishing chamber through the third supply pipeline. In some embodiments, when the liquid level reaches the first preset height, the third power pump is controlled to stop running, and the third supply valve is controlled to close. In some embodiments, the control device controls the first rotating component and / or the second rotating component to start or be in the start state, so that the cleaning medium in the polishing chamber oscillates to achieve a better cleaning effect.

[0080] 522, Control the supply and discharge mechanism to discharge the cleaning medium from the polishing chamber. This step can be performed by the control equipment.

[0081] In some embodiments, after a period of time (e.g., 5 minutes) following the control of the third power pump to stop operating or the third supply valve to close, the control of the third discharge valve to open and the control of the air supply valve to open, allowing air to enter the polishing chamber, and the cleaning medium to be discharged through the third discharge pipeline.

[0082] Figure 8 This is a flowchart of a second polishing process according to some embodiments of this specification.

[0083] like Figure 8 As shown, the second polishing process 530 includes the following steps.

[0084] 531. Stop the operation of the first rotating component, the second rotating component, and the pressurizing mechanism. This step can be performed by the control equipment.

[0085] 532, Control the supply and discharge mechanism to discharge the first polishing medium from the polishing chamber. This step can be performed by control equipment.

[0086] In some embodiments, this step may be performed in cleaning process 520. If cleaning process 520 is not present, it is performed in the second polishing process 530. For a description of controlling the supply and discharge mechanism to discharge the first polishing medium from the polishing chamber, please refer to the relevant content of step 521 in cleaning process 520.

[0087] 533, Control the supply and discharge mechanism to supply the second polishing medium to the polishing chamber, so that the workpiece comes into contact with the second polishing medium. This step can be performed by the control equipment.

[0088] In some embodiments, the second supply valve is opened, the second power pump is operated, and the second polishing medium enters the polishing chamber through the second supply pipeline. In some embodiments, when the liquid level reaches a first preset height, the second power pump is stopped, and the second supply valve is closed. At this time, the workpiece is completely immersed in the second polishing medium.

[0089] 534. Control the pressurization mechanism to increase the internal stress of the second polishing medium in the polishing chamber until the output pressure of the pressurization mechanism reaches the third preset threshold. This step can be implemented by the control equipment.

[0090] Since the liquid concentration of the second polishing medium is lower than that of the first polishing medium, to achieve the same polishing efficiency when using the second polishing medium as when using the first polishing medium, the pressure inside the polishing chamber can be higher when using the second polishing medium than when using the first polishing medium. However, the polishing efficiency required in the second polishing process can differ from that required in the first polishing process. Therefore, the third preset threshold can be the same as or different from the first preset threshold. For an explanation of controlling the pressurization mechanism to increase its output pressure to reach the third preset threshold, please refer to the relevant content in step 514 of the first polishing process 510.

[0091] 535. Start the first and second rotating parts. This step can be performed by a control device. For instructions on starting the first and second rotating parts, please refer to the relevant content of step 515 in the first polishing process 510.

[0092] It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects may be any one or a combination of the above, or any other possible beneficial effects.

[0093] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0094] Furthermore, this application uses specific terms to describe its embodiments. For example, "one embodiment" and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of this application. Therefore, it should be emphasized and noted that "one embodiment" or "an alternative embodiment" mentioned twice or more in different locations in this application do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application can be appropriately combined.

[0095] Furthermore, unless expressly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or other names described in this application are not intended to limit the order of the processes and methods of this application. Although the foregoing disclosure has discussed some currently considered useful embodiments of the invention through various examples, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments; rather, the claims are intended to cover all modifications and equivalent combinations that conform to the substance and scope of the embodiments of this application. For example, while the system components described above can be implemented using hardware devices, they can also be implemented solely through software solutions, such as installing the described system on existing servers or mobile devices.

[0096] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0097] Finally, it should be understood that the embodiments described in this application are merely illustrative of the principles of the embodiments of this application. Other modifications may also fall within the scope of this application. Therefore, alternative configurations of the embodiments of this application are considered as examples and not limitations, and are regarded as consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly described and illustrated in this application.

Claims

1. A polishing apparatus, characterized in that, The device includes: The first rotating component is configured to drive the workpiece to rotate; A housing defining a polishing chamber configured to contain polishing media; wherein... The workpiece is located in the polishing chamber, immersed in the polishing medium, and is driven to rotate relative to the polishing medium by the first rotating component.

2. The polishing apparatus according to claim 1, characterized in that, The polishing medium comprises one or more mixed liquids, wherein the liquid concentration of the polishing medium is 35%–60% or 5%–20%.

3. The polishing apparatus according to claim 2, characterized in that, The device includes a pressure boosting mechanism configured to increase the internal stress of the polishing medium within the polishing chamber.

4. The polishing apparatus according to claim 3, characterized in that, When the output pressure of the boosting mechanism reaches the first preset threshold, the boosting mechanism stops increasing the internal stress of the polishing medium in the polishing chamber.

5. The polishing apparatus according to claim 4, characterized in that, The range of the first preset threshold is 0.3MPa to 0.8MPa.

6. The polishing apparatus according to claim 3, characterized in that, The pressurization mechanism is connected to the housing via a pressurization channel, and the pressurization channel communicates with the polishing chamber via a pressurization port provided on the housing. The pressurizing mechanism includes a pressurizing end that can move along the pressurizing channel. When the pressurizing end approaches the housing, it increases the internal stress of the polishing medium inside the polishing chamber.

7. The polishing apparatus according to claim 1, characterized in that, The device includes a second rotating member, a portion of which is located within the polishing chamber and is disposed opposite to the first rotating member.

8. The polishing apparatus according to claim 7, characterized in that, The rotation direction of the second rotating component is opposite to that of the first rotating component.

9. The polishing apparatus according to claim 8, characterized in that, The ratio of the rotational speed of the first rotating component to the rotational speed of the second rotating component is in the range of 5:

1.

10. The polishing apparatus according to claim 8, characterized in that, The ratio of the contact area between the first rotating component and the polishing medium to the contact area between the second rotating component and the polishing medium is in the range of 1.38:

1.

11. The polishing apparatus according to claim 1, characterized in that, The device includes the cover, which is capable of being sealed to the housing, and the cover and the housing together define the polishing chamber.

12. The polishing apparatus according to claim 11, characterized in that, The first rotating component extends through the cover, and the workpiece is disposed on the first rotating component. When the cover is sealed to the housing, the workpiece is located in the polishing chamber.

13. The polishing apparatus according to claim 11, characterized in that, The device includes a lifting mechanism connected to the cover, which, when in operation, allows the cover to move closer to or further away from the housing.

14. The polishing apparatus according to claim 13, characterized in that, When the lifting mechanism brings the cover closer to the housing, and the closing pressure between the cover and the housing reaches a second preset threshold, the lifting mechanism stops operating.

15. The polishing apparatus according to claim 11, characterized in that, The device includes a supply and discharge mechanism for supplying the polishing medium into the polishing chamber or discharging the polishing medium from the polishing chamber.

16. The polishing apparatus according to claim 15, characterized in that, A liquid level sensor is provided on the side of the cover near the housing, and the liquid level sensor is configured to detect the liquid level height of the polishing medium in the polishing chamber; The supply and discharge mechanism is communicatively connected to the liquid level sensor. When the liquid level sensor detects that the liquid level of the polishing medium in the polishing chamber meets a certain value, the supply and discharge mechanism stops supplying the polishing medium.

17. The polishing apparatus according to claim 15, characterized in that, The polishing medium includes a first polishing medium and a second polishing medium. The first polishing medium and the second polishing medium are used separately for different stages of polishing. The concentration of the first polishing medium is higher than that of the second polishing medium. The first polishing medium and the second polishing medium are supplied separately by the supply and discharge mechanism.

18. A polishing method, characterized in that, The method is implemented using a polishing device, which includes: The first rotating component is configured to drive the workpiece to rotate; A housing and a cover, the cover being capable of being sealed to the housing, the cover and the housing together defining the polishing chamber, the polishing chamber being configured to contain polishing media; A supply and discharge mechanism is used to supply the polishing medium into the polishing chamber or to discharge the polishing medium from the polishing chamber. A pressure boosting mechanism configured to increase the internal stress of the polishing medium within the polishing chamber; The workpiece is located in the polishing chamber, immersed in the polishing medium, and is driven to rotate relative to the polishing medium by the first rotating component; The method includes a first polishing process, wherein the first polishing process includes: The workpiece is mounted on the first rotating component; Control the sealing connection between the cover and the housing; The supply and discharge mechanism is controlled to supply the first polishing medium to the polishing chamber, so that the workpiece is immersed in the polishing medium; The pressurization mechanism is controlled to increase the internal stress of the first polishing medium in the polishing chamber until the internal pressure of the pressurization mechanism reaches a first preset threshold. Start the first rotating component.

19. The polishing method according to claim 18, characterized in that, The polishing device includes a lifting mechanism connected to the cover; controlling the sealing connection between the cover and the housing includes: Control the lifting mechanism to bring the cover closer to the housing. When the closing pressure between the cover and the housing reaches the second preset threshold, the cover and the housing are sealed together, and the lifting mechanism is stopped.

20. The polishing method according to claim 18, characterized in that, The control of the supply and discharge mechanism to supply the first polishing medium to the polishing chamber includes: When the liquid level sensor detects that the liquid level of the polishing medium in the polishing chamber has reached a first preset height, it controls the supply and discharge mechanism to stop supplying the first polishing medium to the polishing chamber.

21. The polishing method according to claim 18, characterized in that, The step of controlling the pressurization mechanism to increase the internal stress of the first polishing medium in the polishing chamber until the output pressure of the pressurization mechanism reaches the first preset threshold includes: The pressurizing end is controlled to move closer to the housing within the pressurizing channel. When the output pressure of the pressurizing mechanism reaches the first preset threshold, the pressurizing end is controlled to stop moving.

22. The polishing method according to claim 21, characterized in that, After the first rotating component is started, the pressure boosting end is controlled to maintain a stable state in order to maintain the internal stress of the first polishing medium in the polishing chamber.

23. The polishing method according to claim 18, characterized in that, The method includes a second polishing process, which is performed after the first polishing process, wherein the second polishing process includes: Stop the operation of the first rotating component and the pressurizing mechanism; The supply and discharge mechanism is controlled to discharge the first polishing medium from the polishing chamber; The supply and discharge mechanism is controlled to supply the second polishing medium to the polishing chamber, so that the workpiece comes into contact with the second polishing medium; The pressurization mechanism is controlled to increase the internal stress of the second polishing medium in the polishing chamber until the output pressure of the pressurization mechanism reaches the third preset threshold. Start the first rotating component.

24. The polishing method according to claim 23, characterized in that, The control of the supply and discharge mechanism to discharge the first polishing medium from the polishing chamber includes: When the liquid level sensor detects that the liquid level in the polishing chamber has reached a second preset height, it controls the supply and discharge mechanism to stop discharging the first polishing medium from the polishing chamber.

25. The polishing method according to claim 23, characterized in that, The control mechanism supplies the second polishing medium to the polishing chamber: When the liquid level sensor detects that the liquid level in the polishing chamber has reached a first preset height, it controls the supply and discharge mechanism to stop supplying the second polishing medium to the polishing chamber.

26. The polishing method according to any one of claims 18-25, characterized in that, The polishing device further includes a second rotating component, a portion of which is located within the polishing chamber and is disposed opposite to the first rotating component. The method further includes: When the first rotating component is activated, the second rotating component is activated; The first rotating component and the second rotating component are controlled to rotate in opposite directions.

27. The polishing method according to claim 24, characterized in that, The liquid concentration range of the first polishing medium is 35% to 60%, and the liquid concentration range of the second polishing medium is 5% to 20%.

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