A method, apparatus, and workpiece for microvia processing

Abstract

This application relates to the field of micro-hole processing technology, and in particular to a micro-hole processing method, apparatus, and workpiece. The micro-hole processing method includes: providing a worktable and a workpiece to be processed; fixing the workpiece to be processed on the worktable; heating a first processing area on the upper surface of the workpiece to a temperature higher than the workpiece's ambient temperature; and applying an ultrasonic processing component to the heated first processing area to perform micro-hole processing on the workpiece. By heating the first processing area on the upper surface of the workpiece, the technical effect of improving the quality of micro-hole processing is achieved.

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