System and method for dynamically adjusting thin film deposition parameters

By using machine learning-trained analytical models and dynamically adjusting thin film deposition process parameters, the problem of thin films not meeting target parameters in thin film deposition technology has been solved, thereby improving the yield and output of semiconductor wafers.

CN122344719APending Publication Date: 2026-07-07TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2021-04-06
Publication Date
2026-07-07

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Abstract

A thin film deposition system deposits thin films on semiconductor wafers. The thin film deposition system includes a machine learning based analysis model. The analysis model dynamically selects process conditions for a next deposition process by receiving static process condition and target thin film data. The analysis model can identify dynamic process condition data that, together with the static process condition data, can generate predicted thin film data that matches the target thin film data. The deposition system then uses the static and dynamic process condition data for the next thin film deposition process.
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