Wafer position adjustment method and device, electronic equipment and storage medium

Abstract

Embodiments of the present application provide a wafer position adjustment method and device, electronic equipment and storage medium, and belong to the field of semiconductor manufacturing. The method comprises: obtaining a first rotation angle parameter of a wafer; calculating a rotation pulse of a worm gear mechanism according to a first relationship function and a first rotation angle sine value; driving the worm gear mechanism to perform first position adjustment on the wafer according to the rotation pulse; obtaining a second rotation angle parameter of the wafer after the first position adjustment; calculating a piezoelectric voltage of a piezoelectric driving mechanism according to a second relationship function and a second rotation angle sine value and a target rotation angle cosine value; and driving the piezoelectric driving mechanism to perform second position adjustment on the wafer according to the piezoelectric voltage, which can improve the wafer alignment accuracy.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and more particularly to a wafer positioning method, apparatus, electronic device, and storage medium. Background Technology

[0002] During wafer inspection, packaging, and dicing, after the robotic arm places the wafer on the stage, the stage needs to rotate by a specific angle to align the wafer's orientation with the X-motor's movement direction. Current stage rotation drives use a stepper motor with a lead screw drive structure, achieving a positioning accuracy of [insert accuracy here]. However, after the stage rotates, the positioning accuracy of the wafer edge dies must meet certain requirements. The existing driving precision cannot meet this requirement, resulting in low wafer alignment accuracy. Summary of the Invention

[0003] The main objective of this application is to provide a wafer positioning adjustment method, apparatus, electronic device, and storage medium, which aims to improve wafer alignment accuracy.

[0004] To achieve the above objectives, a first aspect of this application provides a wafer position adjustment method, the method comprising: Obtain the first rotation angle parameter of the wafer; wherein the wafer is placed on a wafer stage, the wafer stage is provided with a rotation mechanism, the rotation mechanism includes a worm gear mechanism and a piezoelectric drive mechanism, the worm gear mechanism and the piezoelectric drive mechanism are connected in series, and the first rotation angle parameter includes a first rotation angle sine value; According to the first relational function, the rotation pulse of the worm gear mechanism is calculated based on the first rotation angle sine value; wherein, the first relational function is used to indicate the relationship between the first rotation angle sine value and the rotation pulse; The worm gear mechanism is driven by the rotational pulse to perform a first position adjustment on the wafer; After the first position is adjusted, the second rotation angle parameter of the wafer is obtained; wherein, the second rotation angle parameter includes the sine value of the second rotation angle and the cosine value of the target rotation angle; According to the second relationship function, the piezoelectric voltage of the piezoelectric drive mechanism is calculated based on the sine value of the second rotation angle and the cosine value of the target rotation angle; wherein, the second relationship function is used to indicate the relationship between the sine value of the second rotation angle, the cosine value of the target rotation angle, and the piezoelectric voltage; The piezoelectric drive mechanism is driven by the piezoelectric voltage to perform a second position adjustment on the wafer.

[0005] In some embodiments, the first rotation angle parameter further includes an initial rotation angle cosine value, and obtaining the first rotation angle parameter of the wafer includes: Calculate the horizontal spacing between the first and second core particles in the horizontal direction and the vertical spacing in the vertical direction; wherein the first and second core particles are located in the same row of the wafer; The target distance between the first core and the second core is determined based on the horizontal spacing and the vertical spacing. Calculate the sine value of the first rotation angle based on the vertical spacing and the target distance; The cosine value of the initial rotation angle is calculated based on the horizontal spacing and the target distance.

[0006] In some embodiments, calculating the horizontal spacing between the first core and the second core in the horizontal direction and the vertical spacing in the vertical direction includes: Obtain the first center coordinates and the first pixel coordinates of the first core particle; Obtain the second center coordinates and the second pixel coordinates of the second core particle; The horizontal spacing is calculated based on the first center coordinates, the first pixel coordinates, the second center coordinates, and the second pixel coordinates; The vertical spacing is calculated based on the first center coordinates, the first pixel coordinates, the second center coordinates, and the second pixel coordinates.

[0007] In some embodiments, the first relational function is constructed according to the following steps: Determine the rotation coefficient, the sine value of the rotation angle, and the number of rotation pulses; The first relationship function is constructed based on the rotation coefficient, the sine value of the rotation angle, and the number of rotation pulses.

[0008] In some embodiments, determining the rotation coefficient, the sine of the rotation angle, and the number of rotation pulses includes: Obtain the initial pulse count of the worm gear mechanism when the calibration plate is in the initial position; The worm gear mechanism drives the calibration plate to rotate from the initial position to the target position, and the target pulse count of the calibration plate at the target position is obtained; Calculate the sine value of the rotation angle based on the initial position and the target position; The number of rotational pulses is calculated based on the initial number of pulses and the target number of pulses; Obtain the rotation coefficient.

[0009] In some embodiments, the second relational function is constructed according to the following steps: Determine the piezoelectric coefficient, the sine value of the rotation angle, the cosine value of the rotation angle, and the voltage value; The second relationship function is constructed based on the piezoelectric relationship coefficient, the sine value of the rotation angle, the cosine value of the rotation angle, and the voltage value.

[0010] In some embodiments, determining the piezoelectric coefficient, the sine of the rotation angle, the cosine of the rotation angle, and the voltage value includes: Under the driving voltage, the calibration plate is driven to rotate by an initial angle through the worm gear mechanism, and the piezoelectric coefficient is calculated based on the driving voltage and the initial angle. Obtain the first sine and first cosine values ​​of the initial angle; Determine the re-rotation angle, obtain the second sine value and the second cosine value of the re-rotation angle, and use the second sine value as the sine value of the rotation angle and the second cosine value as the cosine value of the rotation angle. Obtain the voltage value after the rotation angle.

[0011] To achieve the above objectives, a second aspect of this application provides a wafer positioning adjustment device, the device comprising: The first acquisition module is used to acquire the first rotation angle parameter of the wafer; wherein the wafer is placed on a wafer stage, the wafer stage is provided with a rotation mechanism, the rotation mechanism includes a worm gear mechanism and a piezoelectric drive mechanism, the worm gear mechanism and the piezoelectric drive mechanism are connected in series, and the rotation angle parameter includes a first rotation angle sine value; A first calculation module is used to calculate the rotation pulse of the worm gear mechanism according to a first relational function and based on the first sine value of the rotation angle; wherein, the first relational function is used to indicate the relationship between the first sine value of the rotation angle and the rotation pulse; The first adjustment module is used to drive the worm gear mechanism to adjust the first position of the wafer according to the rotation pulse; The second acquisition module is used to acquire the second rotation angle parameter of the wafer after the first position is adjusted; wherein, the second rotation angle parameter includes a second rotation angle sine value and a target rotation angle cosine value; The second calculation module is used to calculate the piezoelectric voltage of the piezoelectric drive mechanism according to the second relational function, based on the second sine value of the rotation angle and the cosine value of the target rotation angle; wherein, the second relational function is used to indicate the relationship between the second sine value of the rotation angle, the cosine value of the target rotation angle, and the piezoelectric voltage; The second adjustment module is used to drive the piezoelectric drive mechanism to perform a second position adjustment on the wafer according to the piezoelectric voltage.

[0012] To achieve the above objectives, a third aspect of this application provides an electronic device, which includes a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the method described in the first aspect.

[0013] To achieve the above objectives, a fourth aspect of the present application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method described in the first aspect.

[0014] The wafer position adjustment method, wafer position adjustment device, electronic device, and computer-readable storage medium proposed in this application adopt a combination of worm gear and piezoelectric structure to construct a relationship function between angle and displacement driven by rotary motor and piezoelectric drive, realizing a two-stage positioning method of worm gear drive initial positioning and piezoelectric drive fine positioning. The low-cost worm gear structure and high-precision piezoelectric structure solve the problem of insufficient accuracy of reciprocating motion of single structure, and achieve sub-micron rotational positioning accuracy. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of probe testing provided in an embodiment of this application; Figure 2 This is a flowchart of the wafer position adjustment method provided in the embodiments of this application; Figure 3 This is a 3D appearance schematic diagram of the stage mechanism provided in the embodiments of this application; Figure 4 This is a 3D schematic diagram of the wafer and the substrate hidden in an embodiment of this application; Figure 5 This is a schematic diagram of the standard circle of calibration plate 1 provided in the embodiments of this application; Figure 6 yes Figure 2 The flowchart of step S210 in the middle; Figure 7 This is a schematic diagram of wafer angle calculation provided in an embodiment of this application; Figure 8 yes Figure 6 The flowchart of step S610 in the text; Figure 9 This is a schematic diagram of the rotation theory provided in the embodiments of this application; Figure 10 This is a flowchart of the first relation function construction process provided in the embodiments of this application; Figure 11 yes Figure 10 The flowchart of step S1010 in the text; Figure 12 This is a schematic diagram illustrating the relationship between angle and rotation provided in an embodiment of this application; Figure 13 This is a flowchart of the second relation function construction process provided in the embodiments of this application; Figure 14 This is a schematic diagram illustrating the relationship between angle and piezoelectric displacement provided in an embodiment of this application; Figure 15 yes Figure 13 The flowchart of step S1310 in the middle; Figure 16 This is a schematic diagram of the wafer rotation angle provided in an embodiment of this application; Figure 17 This is a simplified structural diagram provided in the embodiments of this application; Figure 18 This is a schematic diagram of the wafer position adjustment device provided in the embodiments of this application; Figure 19 This is a schematic diagram of the hardware structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0017] It should be noted that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0019] During wafer testing, packaging, and dicing, wafers need to be placed on a wafer stage and rotated to align the wafer orientation with the X-motor's direction of motion. Related technologies employ a stepper motor in conjunction with a lead screw drive to rotate the wafer stage. This structure achieves a positioning accuracy within... However, the stage requires precise positioning of the wafer edge cores after rotation. This makes it difficult to ensure that the rotation meets the required range, which can lead to the motor rotating back and forth multiple times without meeting the requirements, making it difficult to improve machine efficiency and production capacity.

[0020] Based on this, embodiments of this application provide a wafer position adjustment method, a wafer position adjustment device, an electronic device, and a computer-readable storage medium, applicable to semiconductor equipment used in packaging, testing, and dicing fields, aiming to improve wafer alignment accuracy while increasing machine efficiency and production capacity.

[0021] The wafer position adjustment method, wafer position adjustment device, electronic device, and computer-readable storage medium provided in this application are specifically described through the following embodiments. First, the wafer position adjustment method in this application embodiment is described.

[0022] The wafer position adjustment method provided in this application relates to the field of semiconductor manufacturing. This wafer position adjustment method can be applied to a terminal, a server, or software running on either a terminal or a server. In some embodiments, the terminal can be a smartphone, tablet, laptop, desktop computer, etc.; the server can be configured as an independent physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, CDN, and big data and artificial intelligence platforms; the software can be an application implementing the wafer position adjustment method, but is not limited to the above forms.

[0023] This application can be used in a wide variety of general-purpose or special-purpose computer system environments or configurations. Examples include: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputers, mainframe computers, and distributed computing environments including any of the above systems or devices. This application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc., that perform specific tasks or implement specific abstract data types. This application can also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer storage media, including storage devices.

[0024] Please see Figure 1 , Figure 1This is a schematic diagram of a probe test provided in an embodiment of this application. The probe test system includes an optical inspection device and a probe test device for precise inspection of a wafer. The optical inspection device includes a camera, a coaxial light source, and a lens, which together form a vertically downward optical inspection path. The probe test device includes a probe stage, a probe holder, and probes. The probe stage includes a wafer carrier and an XY platform. The wafer carrier is placed on the XY platform and has vertical lifting in the Z-axis and horizontal movement in the XY-axis. It fixes the wafer by vacuum adsorption to prevent the wafer from moving during movement. It can be understood that the wafer carrier is mounted on the XY platform and can therefore move with the XY platform in the X and Y directions. The die on the wafer has multiple bonding pads, which can serve as contact interfaces for electrical testing. A probe holder is provided above the wafer carrier, which is a substrate for placing the probes. During the X, Y, and Z movement and rotation of the wafer, the probes are fixed on the probe holder and remain stationary during the test.

[0025] The wafer is placed on a stage and rotated. The position and angle of the wafer are adjusted using an XY platform and camera to align the array orientation of the wafer's chips with the X-axis. The probe station can be moved via the XY platform to sequentially deliver the chips to the probes. When a chip reaches the probe, the stage moves upwards in the Z-axis, causing the chip to move upwards until its bonding pads contact the probe tips. The tester powers on the chip to perform photoelectric and other parameter tests. After testing, the stage moves downwards in the Z-axis, causing the chip to move downwards and disengage its bonding pads from the probe tips. The XY platform then moves the wafer to the next chip for testing.

[0026] Figure 2 This is an optional flowchart of the wafer position adjustment method provided in the embodiments of this application. Figure 2 The method may include, but is not limited to, steps S210 to S260.

[0027] Step S210: Obtain the first rotation angle parameter of the wafer; wherein, the wafer is placed on the wafer stage, the wafer stage is provided with a rotation mechanism, the rotation mechanism includes a worm gear mechanism and a piezoelectric drive mechanism, the worm gear mechanism and the piezoelectric drive mechanism are connected in series, and the first rotation angle parameter includes a first rotation angle sine value. Step S220: Calculate the rotation pulse of the worm gear mechanism according to the first relational function and the sine value of the first rotation angle; wherein, the first relational function is used to indicate the relationship between the sine value of the first rotation angle and the rotation pulse; Step S230: The wafer is adjusted to its first position according to the rotating pulse-driven worm gear mechanism; Step S240: After adjusting the first position, obtain the second rotation angle parameter of the wafer; wherein, the second rotation angle parameter includes the sine value of the second rotation angle and the cosine value of the target rotation angle; Step S250: Calculate the piezoelectric voltage of the piezoelectric drive mechanism according to the second relational function, based on the sine value of the second rotation angle and the cosine value of the target rotation angle; wherein, the second relational function is used to indicate the relationship between the sine value of the second rotation angle, the cosine value of the target rotation angle, and the piezoelectric voltage. Step S260: The piezoelectric drive mechanism is driven by the piezoelectric voltage to perform a second position adjustment on the wafer.

[0028] In step S210 of some embodiments, the wafer is placed on a stage, and a first rotation angle parameter of the wafer is calculated. The first rotation angle parameter includes a first rotation angle sine value and an initial rotation angle cosine value. The stage is equipped with a rotation mechanism to drive the stage to rotate, thereby driving the wafer to complete angle positioning and rotational movement. The rotation mechanism includes a worm gear mechanism and a piezoelectric drive mechanism. The piezoelectric drive mechanism is stacked on top of the worm gear mechanism to form a kinematically connected dual-drive architecture. The worm gear mechanism is responsible for coarse positioning, and the piezoelectric drive mechanism is responsible for fine positioning. Since the stage only needs to rotate by about + / -15 degrees, a sector-shaped worm gear structure can be used. The piezoelectric drive mechanism uses piezoelectric ceramic. Piezoelectric ceramic is a special ceramic that, after being treated with a high-voltage polarization process, possesses the inverse piezoelectric effect, that is, under the action of an external electric field, the ceramic produces linear elongation or compressive strain along the polarization direction. The deformation of the piezoelectric ceramic is linearly related to the given driving voltage. By adjusting the material size or using a multi-layer stacked structure, precise displacement output at the nanometer to tens of micrometer levels can be achieved. The piezoelectric ceramic uses spherical hinges at both ends, which ensures close contact between the two ends of the piezoelectric ceramic at different angles and avoids the piezoelectric ceramic from being subjected to bending moment.

[0029] The structure of the stage is as follows Figure 3 and Figure 4As shown. The stage movement includes Z-axis motion and rotational motion. Motor 1 drives a lead screw via a synchronous belt mechanism, which in turn pushes the stage body and the tray to move up and down in the Z-axis direction. The synchronous belt mechanism includes a Z-slider and a Z-guide rail. The Z-slider is fixed to the mounting base plate, and the Z-guide rail is rigidly connected to the stage body to form a moving component. A rotary motor 2 is mounted on the side of the stage body, which drives the tray to rotate via a sector worm gear. The piezoelectric ceramic and the rotary motor are connected in series in terms of motion; that is, the rotary motor can drive the tray to rotate, and the piezoelectric ceramic can also drive the tray to rotate. Therefore, the rotary motor is used first for initial rotational positioning, and then the piezoelectric ceramic is used for fine rotational positioning. During the movement, the sector worm gear and the piezoelectric ceramic have relative rotational motion, so a spring is used to ensure a tight contact connection between the piezoelectric ceramic and the worm gear mechanism, ensuring smooth relative movement without gaps. The worm and worm gear are paired to form a worm gear transmission pair. The sector worm gear defines the pulse origin position of the rotary motor via a rotation origin photoelectric switch, ensuring that the same origin position is identified every time the machine is powered on. For motion feedback, Z-axis displacement is measured and fed back using a Z-grating ruler. The wafer die position can be checked using images captured by a camera for rotation angle measurement. A coupling connects the motor shaft and the lead screw for torque transmission. The wafer stage also includes calibration plate 1 and calibration plate 2, with a photolithographically etched circular pattern of a standard diameter at their center. A schematic diagram of the standard circle on calibration plate 1 is shown below. Figure 5 As shown.

[0030] This embodiment adds a worm gear mechanism and a piezoelectric drive mechanism to the wafer stage. Initial positioning and fine positioning can be performed using the worm gear mechanism and piezoelectric drive mechanism respectively, achieving a two-stage positioning method based on the wafer stage mechanism. Initial positioning using the worm gear mechanism can meet the accuracy requirement of + / -10µm, while fine positioning using the piezoelectric drive mechanism meets the accuracy requirement within + / -1.5µm or even smaller. The worm gear mechanism is suitable for long-distance movement; the greater the distance, the more significant the cumulative error. During movement, the worm gear mechanism has an accuracy of 10µm. If the target positioning accuracy requirement is less than 1µm, the worm gear mechanism will repeatedly move back and forth, unable to stably enter the + / -1µm tolerance zone. The piezoelectric drive mechanism, on the other hand, can achieve a wide range of precise positioning from nanometers (nm) to tens of micrometers (µm).

[0031] Prior to step S210, each component of the wafer test is calibrated based on calibration board 1. The calibration operation includes image calibration and XY calibration. Since subsequent calculations do not involve the Z-axis, the Z-axis calibration will not be described.

[0032] The image calibration process is as follows: Calibration plate 1 is moved below the camera using the XY platform. After focusing and camera calibration, the acquired image is analyzed to extract the circle pixel width, which is then compared to the diameter of a standard circle. Subsequently, camera parameters are adjusted to ensure consistency between the image pixel coordinate system and the motor motion coordinate system. Once camera calibration is complete, subsequent calibration work for other axes can be performed based on the camera image. The pixel unit is uniformly expressed as μm (micrometer).

[0033] The XY calibration process is as follows: After completing image calibration, X-axis and Y-axis calibrations are performed by observing the standard circle on the calibration board using the camera above. X-axis calibration: The theoretical number of pulses required to move along the X-axis by one standard circle diameter is used. The actual pixel displacement is measured using the camera and converted to a micrometer value, which is then compared with the standard circle diameter to calibrate the X-axis pulse equivalent. Y-axis calibration: The above process is repeated along the Y-axis to calibrate the Y-axis pulse equivalent. The pulse unit is standardized to μm.

[0034] The above steps can be expressed using the following calibration formula, which can be automated through programming. The calibration coefficients need to be measured beforehand for subsequent measurements and calculations. The calibration formula is expressed as: , in, The calibration coefficients are X, Y, and image calibration coefficients, which can be expressed as follows: , and .

[0035] Please see Figure 6 In some embodiments, step S210 may include, but is not limited to, steps S610 to S640: Step S610: Calculate the horizontal spacing between the first core and the second core in the horizontal direction and the vertical spacing in the vertical direction; wherein the first core and the second core are located in the same row of the wafer; Step S620: Determine the target distance between the first core and the second core based on the horizontal and vertical spacing. Step S630: Calculate the sine value of the first rotation angle based on the vertical spacing and the target distance; Step S640: Calculate the cosine value of the initial rotation angle based on the horizontal spacing and the target distance.

[0036] In step S610 of some embodiments, during the wafer loading process, the wafer is first transported by a loading / unloading mechanism, and then placed smoothly onto the wafer stage by a robotic arm. The loading / unloading mechanism performs a pre-alignment operation to initially adjust the placement orientation of the wafer, making it as consistent as possible with the XY reference direction. However, in actual working conditions, after the wafer is placed, the arrangement direction of its internal chips will still have a certain angular deviation from the XY direction, so the wafer needs to be aligned and adjusted.

[0037] like Figure 7 As shown, after placing the wafer, move the XY platform to select a die D0 within the camera's field of view as the first die. Move within the same row, first moving X, then moving Y when the row exceeds the camera's field of view, ensuring a certain distance (as far as possible) within the same row before selecting another die D1 as the second die. Both the first and second dies are located in the same row of the wafer. Calculate the horizontal distance between the first and second dies to obtain the horizontal spacing, with the horizontal direction being the X direction. Calculate the vertical distance between the first and second dies to obtain the vertical spacing, with the vertical direction being the Y direction.

[0038] In step S620 of some embodiments, the target distance between the two core particles can be determined using the Euclidean distance formula in a Cartesian coordinate system, based on the horizontal and vertical spacing between the first and second core particles. If the horizontal spacing is denoted as dx and the vertical spacing as dy, then the target distance is expressed as: .

[0039] In step S630 of some embodiments, the ratio between the vertical spacing and the target distance is calculated to obtain a first rotation angle sine value. The first rotation angle sine value is the angle between the row where the two core particles are located and the X direction. The sine value.

[0040] In step S640 of some embodiments, the ratio between the horizontal spacing and the target distance is calculated to obtain the initial rotation angle cosine value. The initial rotation angle cosine value is the angle between the row where the two core particles are located and the X direction. The cosine value.

[0041] Through steps S610 to S640, the sine and cosine values ​​of the rotation angle can be obtained, and wafer alignment adjustments can be performed based on these values, thereby improving alignment accuracy. Furthermore, using sine and cosine values ​​instead of angles in calculations simplifies the complexity of angle calculations.

[0042] Please see Figure 8 In some embodiments, step S610 may include, but is not limited to, steps S810 to S840: Step S810: Obtain the first center coordinates and the first pixel coordinates of the first core particle; Step S820: Obtain the second center coordinates and the second pixel coordinates of the second core particle; Step S830: Calculate the horizontal spacing based on the first center coordinates, the first pixel coordinates, the second center coordinates, and the second pixel coordinates; Step S840: Calculate the vertical spacing based on the first center coordinates, the first pixel coordinates, the second center coordinates, and the second pixel coordinates.

[0043] In step S810 of some embodiments, the center coordinates of the first core particle are obtained to obtain the first center coordinates, and the pixel coordinates of the first core particle are obtained to obtain the first pixel coordinates.

[0044] In step S820 of some embodiments, the center coordinates of the second core particle are obtained to obtain the second center coordinates, and the pixel coordinates of the second core particle are obtained to obtain the second pixel coordinates.

[0045] In step S830 of some embodiments, the first center coordinates are represented as The coordinates of the first pixel are represented as The second center coordinates are represented as The coordinates of the second pixel are represented as The horizontal spacing is calculated based on the x-coordinates of the first center coordinate, the second center coordinate, the first pixel coordinate, and the second pixel coordinate. The horizontal spacing is expressed as: .

[0046] In step S840 of some embodiments, the vertical spacing is calculated based on the ordinate of the first center coordinate, the ordinate of the second center coordinate, the ordinate of the first pixel coordinate, and the ordinate of the second pixel coordinate. The vertical spacing is expressed as: .

[0047] The angle between the line and the X direction is calculated using the center coordinates of the two core particles. The sine and cosine of the rotation angle are expressed as: , The cosine value of the rotation angle is expressed as: .

[0048] Horizontal spacing and vertical spacing Take the absolute value.

[0049] Through the above steps S810 to S840, the horizontal spacing and vertical spacing can be calculated quickly.

[0050] The calibration plate's standard circle is moved within the camera's field of view using the XY platform, allowing the camera to observe the standard circle of calibration plate 1. To minimize the impact of errors on each axis, only the rotary motor is moved, while the other axes remain stationary. Figure 9 As shown, the rotation of the rotating motor drives the plate holder to rotate, causing the calibration plate 1 to move within the camera's field of view. This allows the standard circle of calibration plate 1 to be obtained at different positions within the camera's field of view. The coordinates of the rotation center and the rotation radius of the plate holder are then calculated using the positions of the standard circle. The center pixel coordinates of the standard circle of calibration plate 1 at each position are obtained. The pixel coordinates have been converted to um units. The center point represented by the center pixel coordinates will form a circle with center coordinates of... , radius is The circular arc curve is used for calculation, and three points are taken from the curve. These three points are: , and . , and The coordinates are respectively represented as , and . , As far away as possible Try to keep it in the middle. Using the circle formula, we can obtain three equations: , , , , The coordinates of the rotation center can be calculated based on the above formula. and radius of rotation .

[0051] , , .

[0052] Although the rotation radius and center position can be calculated in pixel coordinates, the angles of the worm gear structure or the piezoelectric coordinate relationship cannot be derived. This application's embodiments construct a relationship function between the worm gear mechanism angles and the rotation pulses, obtaining a first relationship function. Please refer to... Figure 10 In some embodiments, the process of constructing the first relational function may include, but is not limited to, steps S1010 to S1020: Step S1010: Determine the rotation coefficient, the sine value of the rotation angle, and the number of rotation pulses; Step S1020: Construct the first relational function based on the rotation coefficient, the sine value of the rotation angle, and the number of rotation pulses.

[0053] In step S1010 of some embodiments, the rotation of the worm gear mechanism drives the plate stage to rotate, and the angle of the worm gear mechanism is calculated by observing the standard circle center. and motor pulse The relationship functions are used to construct the first relationship function.

[0054] In step S1020 of some embodiments, for the worm gear mechanism, the tangential displacement (or linear velocity) is the same, and calculating the displacement is equivalent to calculating the arc length. Therefore, it can be understood that the pulse and angle are proportional. This can be expressed by the following formula: , in, The rotation angle can be expressed in radians or degrees, but the scaling factors for the two are different; For rotation The number of pulses required, i.e., the number of rotation pulses; is the rotation factor.

[0055] Within the camera's field of view, As At the point, the worm gear mechanism rotates, obtaining... Different standard circle positions are obtained and The correspondence between them. , Substituting into the above equation and rearranging, we obtain the first relational function: , in, This represents the sine value of the rotation angle; The rotation factor; For rotation The number of rotation pulses required.

[0056] Based on the first relational function, given the rotation angle and rotation coefficient, the number of pulses required for rotation can be easily calculated.

[0057] Through the above steps S1010 to S1020, the relationship function between the angle and the motor pulse can be constructed.

[0058] Please see Figure 11 In some embodiments, step S1010 may include, but is not limited to, steps S1110 to S1150: Step S1110: Obtain the initial pulse count of the worm gear mechanism when the calibration plate is in the initial position; Step S1120: Drive the calibration plate from the initial position to the target position through the worm gear mechanism, and obtain the target pulse number when the calibration plate is at the target position; Step S1130: Calculate the sine value of the rotation angle based on the initial position and the target position; Step S1140: Calculate the number of rotation pulses based on the initial number of pulses and the target number of pulses; Step S1150: Obtain the rotation coefficient.

[0059] In step S1110 of some embodiments, such as Figure 12 As shown, the calibration plate is located in the initial position. The initial pulse number is obtained by analyzing the motor pulses corresponding to the worm gear mechanism. .

[0060] In step S1120 of some embodiments, the calibration plate is driven from the initial position by a worm gear mechanism. Rotate to target position And obtain the location of the calibration board at the target position. Target pulse number .

[0061] In step S1130 of some embodiments, according to the initial position ordinate Target location ordinate and radius of rotation Calculate the sine of the rotation angle.

[0062] In step S1140 of some embodiments, the target pulse number is... With the initial pulse number Subtracting the two gives the number of rotation pulses.

[0063] In step S1150 of some embodiments, the rotation coefficient is obtained. When the standard center of the calibration plate and the center of rotation are on the same line, the result is obtained. The rotation coefficient is calculated according to the following formula to construct the angle-pulse relationship function. That is: , .

[0064] Through the above steps S1110 to S1150, the basic parameters used to construct the first relational function can be obtained.

[0065] Construct a function relating angle and piezoelectric voltage to obtain a second relationship function. (See also...) Figure 13In some embodiments, the construction process of the second relation function may include, but is not limited to, steps S1310 to S1320: Step S1310: Determine the piezoelectric relationship coefficient, the sine value of the rotation angle, the cosine value of the rotation angle, and the voltage value; Step S1320: Construct a second relationship function based on the piezoelectric relationship coefficient, the sine value of the rotation angle, the cosine value of the rotation angle, and the voltage value.

[0066] In step S1310 of some embodiments, when a worm gear structure is used for driving, the piezoelectric driving mechanism and the wafer support disk rotate together. If the wafer alignment still cannot meet the accuracy requirements after the worm gear mechanism rotates, the piezoelectric driving mechanism begins to drive the wafer support disk to rotate slightly again to meet the accuracy requirements. Figure 14 As shown, the piezoelectric drive mechanism and the bearing plate are relatively fixed in position. One end of the piezoelectric drive mechanism is fixed with screws during assembly, and the other end is tangent to the outer circle of the bearing. The line connecting the bearing and the rotation center is perpendicular to the piezoelectric stretching direction. Thus, the stretching direction of the piezoelectric drive structure is perpendicular to the line connecting the bearing and the rotation center, effectively simplifying calculations using sine and cosine formulas. When the piezoelectric drive mechanism stretches, the sliding tangent point of the bearing changes, but the stretching direction of the piezoelectric drive mechanism does not change with different angles, making the piezoelectric stretching amount proportional to the sine value of the rotation angle. Since the angle-pulse relationship function is calculated using an acute triangle, sinA and cosA are both positive; therefore, the calculation of the angle-piezoelectric voltage relationship function also uses positive values. The piezoelectric relationship coefficients, the sine value of the rotation angle, the cosine value of the rotation angle, and the voltage value are obtained.

[0067] In step S1320 of some embodiments, it is worth noting that, Figure 14 This is for ease of calculation and understanding, while the actual rotation and Figure 14 They are different. After the worm gear mechanism rotates, the bearing and piezoelectric ceramic rotate as well, while the bearing end remains fixed. At this time, the piezoelectric ceramic is not vertical due to rotation, but the relative positions of the piezoelectric ceramic, bearing, and center of rotation are still the same. Figure 14 Consistent. Figure 14 middle, This refers to the expansion and contraction of the piezoelectric ceramic. Let be the radius of rotation at the bearing position. The piezoelectric displacement is for a standard circle. Angle A (from initial position to angle A) and piezoelectric expansion / contraction are constructed to obtain these values. and standard circle center displacement The relationship function. The piezoelectric driving voltage is V, and the piezoelectric driving voltage V and The relationship coefficient is The voltage and elongation have a linear relationship, expressed as: , , The above two equations can be rearranged as follows: , sinA can be calculated using the standard circle center. Given a voltage V and the sine of the rotation angle sinA, a constant can be calculated. This constant is the piezoelectric coefficient, i.e.: , make , , , For structural property constants, These are constants that can be calculated. For example, output voltage. Obtain the sine value of the rotation angle. .

[0068] Calculation at driving voltage If we rotate it by another angle dA, the required voltage difference dV is the voltage value, which is expressed as: , , , Given the current piezoelectric position The results are as follows: , , in, This represents the sine value of the rotation angle; This represents the cosine value of the rotation angle; Indicates the piezoelectric coefficient; Indicates the driving voltage; This indicates the voltage value.

[0069] Based on the above formula, it is possible to achieve the following: The voltage difference dV required for the position and rotation dA can be calculated.

[0070] Through the above steps S1310 to S1320, the relationship function between angle and piezoelectric voltage can be constructed.

[0071] Please see Figure 15 In some embodiments, step S1310 may include, but is not limited to, steps S1510 to S1540: Step S1510: Under the driving voltage, the calibration plate is driven to rotate by an initial angle through the worm gear mechanism, and the piezoelectric relationship coefficient is calculated based on the driving voltage and the initial angle. Step S1520: Obtain the first sine and first cosine values ​​of the initial angle; Step S1530: Determine the re-rotation angle, obtain the second sine value and the second cosine value of the re-rotation angle, use the second sine value as the sine value of the rotation angle, and use the second cosine value as the cosine value of the rotation angle. Step S1540: Obtain the voltage value of the re-rotation angle.

[0072] In step S1510 of some embodiments, given a driving voltage V, the calibration plate is driven to rotate an initial angle A by a worm gear mechanism, the sine value of the initial angle A is calculated, and the ratio between the driving voltage V and the sine value is used as the piezoelectric relationship coefficient.

[0073] In step S1520 of some embodiments, the sine value of the initial angle A is calculated to obtain the first sine value, and the cosine value of the initial angle A is calculated to obtain the first cosine value.

[0074] In step S1530 of some embodiments, the re-rotation angle dA is determined, the sine value of the re-rotation angle dA is calculated to obtain a second sine value, and the cosine value of the re-rotation angle dA is calculated to obtain a second cosine value. The second sine value is used as the sine value of the rotation angle, and the second cosine value is used as the cosine value of the rotation angle.

[0075] In step S1540 of some embodiments, the voltage value dV required for the rerotation angle dA is obtained.

[0076] Through the above steps S1510 to S1540, the basic parameters required to construct the relationship function between angle and piezoelectric voltage can be obtained.

[0077] In the calculation, , If positive, substitute into The rotation direction is unknown after obtaining the calculation formula, so it is necessary to define the rotation direction. To facilitate calculation, we first unify the coordinate system, and the direction is as follows: Figure 16 As shown. Define the XY coordinate system and the rotating coordinate system; it is obvious... The calculation is related to the direction of rotation. Figure 16 Calculated in a Since it is positive, it needs to rotate in the negative direction. Figure 16 Calculated in b Since the value is negative, it needs to be rotated in the positive direction.

[0078] In step S220 of some embodiments, if the absolute value of the sine of the first rotation angle is greater than the angle threshold, it indicates that the wafer chip arrangement direction does not meet the requirements. Then, the sine of the first rotation angle is substituted into the first relational function to calculate the rotation pulse of the worm gear mechanism for large-angle rotation. The first relational function indicates the relationship between the sine of the first rotation angle and the rotation pulse. Let... This is the angle threshold, such as 0.0001. If the substrate tray radius is 150mm and the edge core particle deviation is + / -50um, then: .

[0079] In step S230 of some embodiments, the wafer support disk is rotated by a corresponding angle according to the rotation pulse-driven worm gear mechanism to perform a first position adjustment on the wafer. During rotation, the rotation direction needs to be determined. When, rotate in the negative direction; when When, rotate in the positive direction; when When there is no rotation, a negative sign is needed in both the pulse-angle and voltage-angle relationships. The first and second relationship functions can be integrated as follows: , Using the above formula, automatic rotational precision positioning can be easily achieved through programming. A low-cost initial positioning followed by high-precision fine positioning approach is employed. For initial positioning, a low-cost worm gear mechanism is used, while piezoelectric drive is employed for high-precision positioning. Through initial and fine positioning, positioning efficiency and accuracy are improved, thus achieving rapid and accurate positioning.

[0080] In step S240 of some embodiments, after the first position adjustment, the wafer's current rotation angle parameter is calculated with reference to step S210 to obtain the second rotation angle parameter. The second rotation angle parameter includes a second rotation angle sine value and a target rotation angle cosine value. The second rotation angle sine value is the sine value of the wafer's current rotation angle, and the target rotation angle cosine value is the cosine value of the wafer's current rotation angle.

[0081] If the absolute value of the first rotation angle sine is less than or equal to the angle threshold, the first rotation angle sine and the initial rotation angle cosine are substituted into the second relational function to calculate the piezoelectric voltage of the piezoelectric drive mechanism, so as to drive the wafer disk to rotate at a small angle according to the piezoelectric voltage, thereby realizing the position adjustment of the wafer.

[0082] In step S250 of some embodiments, if the absolute value of the second rotation angle sine value is greater than the angle threshold, then referring to step S220, the second rotation angle sine value is substituted into the first relational function to calculate the rotation pulse of the worm gear mechanism for large-angle rotation. If the absolute value of the second rotation angle sine value is less than or equal to the angle threshold, then the second rotation angle sine value and the target rotation angle cosine value are substituted into the second relational function to calculate the piezoelectric voltage of the piezoelectric drive mechanism. The second relational function indicates the relationship between the second rotation angle sine value, the target rotation angle cosine value, and the piezoelectric voltage.

[0083] In step S260 of some embodiments, the piezoelectric drive mechanism is driven according to the piezoelectric voltage to make the wafer disk rotate at a small angle, thereby realizing the second position adjustment of the wafer.

[0084] The wafer position adjustment method in this application includes: (1) Calculation of rotation center coordinates and rotation radius. The worm gear mechanism moves; by observing the center of a standard circle with a camera, the rotation center and radius are calculated. The rotation center is represented as... The radius is expressed as The calculation formula is expressed as follows: , , .

[0085] (2) Construct a function relating angle and piezoelectric voltage, given a voltage Measure the sine of the rotation angle of the standard circle center of the calibration plate. The piezoelectric voltage and angle relationship coefficients were obtained. Construct a function relating angle and voltage. This function is expressed as: , , The angle correction is the opposite, so a negative sign is added to the relational function, and the integrated correction formula is: , in, The angle cosine threshold.

[0086] (3) Normal production then commences. Wafer loading: The robotic arm picks up the wafer, pre-aligns it, and places it on the wafer tray. Using XY and a camera, two dies in the same row with a certain distance are observed. The angle between the die centerline and the horizontal plane is measured as the sine and cosine; this angle is the angle that needs correction. The sine and cosine of the angle are expressed as: , , The angle is corrected according to the correction formula, and then... or The system makes a judgment: for cases where the value is greater than a threshold, a worm gear correction (i.e., initial positioning) is used; for cases where the value is less than a threshold, a piezoelectric drive correction (i.e., fine positioning) is used. Thus, by combining initial positioning with fine positioning, rapid and accurate positioning of rotation is achieved, solving the problem of the current method of requiring multiple rotations to achieve positioning.

[0087] To provide a detailed understanding of the dual-bearing and piezoelectric drive structure of the wafer stage, this application provides a simplified structural diagram for ease of comprehension. The simplified structural diagram is as follows: Figure 17 As shown, the Z-axis motor drives the Z-axis lead screw to rotate via a synchronous belt, causing the Z-axis lead screw nut and bearing plate to move vertically up and down. The bearing plate is supported and guided by bearings 1 and 2 to ensure motion accuracy. The rotary motor drives the worm gear to mesh with the sector worm wheel, causing the bearing plate to rotate around the axis. Piezoelectric ceramics and small bearings are arranged between the sector worm wheel and the bearing plate to achieve micro-displacement compensation or precise positioning, improving the control accuracy of the rotation angle.

[0088] Please see Figure 18 This application also provides a wafer position adjustment device that can implement the above-described wafer position adjustment method. The wafer position adjustment device includes: The first acquisition module 1810 is used to acquire the first rotation angle parameter of the wafer; wherein, the wafer is placed on the wafer stage, the wafer stage is provided with a rotation mechanism, the rotation mechanism includes a worm gear mechanism and a piezoelectric drive mechanism, the worm gear mechanism and the piezoelectric drive mechanism are connected in series, and the rotation angle parameter includes the first rotation angle sine value. The first calculation module 1820 is used to calculate the rotation pulse of the worm gear mechanism according to the first relational function and the first rotation angle sine value; wherein, the first relational function is used to indicate the relationship between the first rotation angle sine value and the rotation pulse; The first adjustment module 1830 is used to perform a first position adjustment on the wafer according to the rotation pulse-driven worm gear mechanism; The second acquisition module 1840 is used to acquire the second rotation angle parameter of the wafer after the first position is adjusted; wherein, the second rotation angle parameter includes the sine value of the second rotation angle and the cosine value of the target rotation angle; The second calculation module 1850 is used to calculate the piezoelectric voltage of the piezoelectric drive mechanism according to the second relational function, based on the sine value of the second rotation angle and the cosine value of the target rotation angle; wherein, the second relational function is used to indicate the relationship between the sine value of the second rotation angle, the cosine value of the target rotation angle, and the piezoelectric voltage; The second adjustment module 1860 is used to adjust the wafer's second position according to the piezoelectric drive mechanism driven by the piezoelectric voltage.

[0089] The specific implementation of this wafer position adjustment device is basically the same as the specific embodiment of the wafer position adjustment method described above, and will not be repeated here.

[0090] This application also provides an electronic device, which includes a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the above-described wafer position adjustment method. This electronic device can be any smart terminal, including tablet computers, in-vehicle computers, etc.

[0091] Please see Figure 19 , Figure 19 The hardware structure of an electronic device according to another embodiment is illustrated. The electronic device includes: The processor 1910 can be implemented using a general-purpose central processing unit (CPU), microprocessor, application specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application. The memory 1920 can be implemented as a read-only memory (ROM), static storage device, dynamic storage device, or random access memory (RAM). The memory 1920 can store the operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 1920 and is called and executed by the processor 1910 to execute the wafer position adjustment method of the embodiments of this application. The input / output interface 1930 is used to implement information input and output. The communication interface 1940 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.). Bus 1950 transmits information between various components of the device (e.g., processor 1910, memory 1920, input / output interface 1930, and communication interface 1940); The processor 1910, memory 1920, input / output interface 1930 and communication interface 1940 are connected to each other within the device via bus 1950.

[0092] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described wafer position adjustment method.

[0093] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0094] The embodiments described in this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. As those skilled in the art will know, with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems.

[0095] Those skilled in the art will understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of this application, and may include more or fewer steps than shown, or combine certain steps, or different steps.

[0096] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0097] Those skilled in the art will understand that all or some of the steps in the methods disclosed above, as well as the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, or suitable combinations thereof.

[0098] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0099] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0100] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of the units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0101] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0102] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0103] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing programs, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0104] The preferred embodiments of the present application have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present application. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and substance of the embodiments of the present application shall be within the scope of the claims of the present application.

Claims

1. A wafer positioning adjustment method, characterized in that, The method includes: Obtain the first rotation angle parameter of the wafer; wherein the wafer is placed on a wafer stage, the wafer stage is provided with a rotation mechanism, the rotation mechanism includes a worm gear mechanism and a piezoelectric drive mechanism, the worm gear mechanism and the piezoelectric drive mechanism are connected in series, and the first rotation angle parameter includes a first rotation angle sine value; According to the first relational function, the rotation pulse of the worm gear mechanism is calculated based on the first rotation angle sine value; wherein, the first relational function is used to indicate the relationship between the first rotation angle sine value and the rotation pulse; The worm gear mechanism is driven by the rotational pulse to perform a first position adjustment on the wafer; After the first position is adjusted, the second rotation angle parameter of the wafer is obtained; wherein, the second rotation angle parameter includes the sine value of the second rotation angle and the cosine value of the target rotation angle; According to the second relationship function, the piezoelectric voltage of the piezoelectric drive mechanism is calculated based on the sine value of the second rotation angle and the cosine value of the target rotation angle; wherein, the second relationship function is used to indicate the relationship between the sine value of the second rotation angle, the cosine value of the target rotation angle, and the piezoelectric voltage; The piezoelectric drive mechanism is driven by the piezoelectric voltage to perform a second position adjustment on the wafer.

2. The method according to claim 1, characterized in that, The first rotation angle parameter also includes an initial rotation angle cosine value, and obtaining the first rotation angle parameter of the wafer includes: Calculate the horizontal spacing between the first and second core particles in the horizontal direction and the vertical spacing in the vertical direction; wherein the first and second core particles are located in the same row of the wafer; The target distance between the first core and the second core is determined based on the horizontal spacing and the vertical spacing. Calculate the sine value of the first rotation angle based on the vertical spacing and the target distance; The cosine value of the initial rotation angle is calculated based on the horizontal spacing and the target distance.

3. The method according to claim 2, characterized in that, The calculation of the horizontal spacing between the first core and the second core in the horizontal direction and the vertical spacing in the vertical direction includes: Obtain the first center coordinates and the first pixel coordinates of the first core particle; Obtain the second center coordinates and the second pixel coordinates of the second core particle; The horizontal spacing is calculated based on the first center coordinates, the first pixel coordinates, the second center coordinates, and the second pixel coordinates; The vertical spacing is calculated based on the first center coordinates, the first pixel coordinates, the second center coordinates, and the second pixel coordinates.

4. The method according to any one of claims 1 to 3, characterized in that, The first relational function is constructed according to the following steps: Determine the rotation coefficient, the sine value of the rotation angle, and the number of rotation pulses; The first relationship function is constructed based on the rotation coefficient, the sine value of the rotation angle, and the number of rotation pulses.

5. The method according to claim 4, characterized in that, The determination of the rotation coefficient, the sine value of the rotation angle, and the number of rotation pulses includes: Obtain the initial pulse count of the worm gear mechanism when the calibration plate is in the initial position; The worm gear mechanism drives the calibration plate to rotate from the initial position to the target position, and the target pulse count of the calibration plate at the target position is obtained; Calculate the sine value of the rotation angle based on the initial position and the target position; The number of rotational pulses is calculated based on the initial number of pulses and the target number of pulses; Obtain the rotation coefficient.

6. The method according to any one of claims 1 to 3, characterized in that, The second relational function is constructed according to the following steps: Determine the piezoelectric coefficient, the sine value of the rotation angle, the cosine value of the rotation angle, and the voltage value; The second relationship function is constructed based on the piezoelectric relationship coefficient, the sine value of the rotation angle, the cosine value of the rotation angle, and the voltage value.

7. The method according to claim 6, characterized in that, The determination of the piezoelectric relationship coefficient, the sine of the rotation angle, the cosine of the rotation angle, and the voltage value includes: Under the driving voltage, the calibration plate is driven to rotate by an initial angle through the worm gear mechanism, and the piezoelectric coefficient is calculated based on the driving voltage and the initial angle. Obtain the first sine and first cosine values ​​of the initial angle; Determine the re-rotation angle, obtain the second sine value and the second cosine value of the re-rotation angle, and use the second sine value as the sine value of the rotation angle and the second cosine value as the cosine value of the rotation angle. Obtain the voltage value after the rotation angle.

8. A wafer position adjustment device, characterized in that, The device includes: The first acquisition module is used to acquire the first rotation angle parameter of the wafer; wherein the wafer is placed on a wafer stage, the wafer stage is provided with a rotation mechanism, the rotation mechanism includes a worm gear mechanism and a piezoelectric drive mechanism, the worm gear mechanism and the piezoelectric drive mechanism are connected in series, and the rotation angle parameter includes a first rotation angle sine value; A first calculation module is used to calculate the rotation pulse of the worm gear mechanism according to a first relational function and based on the first sine value of the rotation angle; wherein, the first relational function is used to indicate the relationship between the first sine value of the rotation angle and the rotation pulse; The first adjustment module is used to drive the worm gear mechanism to adjust the first position of the wafer according to the rotation pulse; The second acquisition module is used to acquire the second rotation angle parameter of the wafer after the first position is adjusted; wherein, the second rotation angle parameter includes a second rotation angle sine value and a target rotation angle cosine value; The second calculation module is used to calculate the piezoelectric voltage of the piezoelectric drive mechanism according to the second relational function, based on the second sine value of the rotation angle and the cosine value of the target rotation angle; wherein, the second relational function is used to indicate the relationship between the second sine value of the rotation angle, the cosine value of the target rotation angle, and the piezoelectric voltage; The second adjustment module is used to drive the piezoelectric drive mechanism to perform a second position adjustment on the wafer according to the piezoelectric voltage.

9. An electronic device, characterized in that, The electronic device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the method according to any one of claims 1 to 7.

10. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the method described in any one of claims 1 to 7.

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