A feeding mechanism for microcrystalline tin ball processing

Abstract

The application discloses a feeding mechanism for microcrystalline tin ball processing and relates to the technical field of feeding equipment. The feeding mechanism comprises a base, a conveying mechanism is arranged on the base, the conveying mechanism comprises a transfer cylinder, the transfer cylinder is rotationally connected with the base, a plurality of through holes arranged in a ring shape and at equal intervals are formed in the transfer cylinder, a side plate is arranged on one side of the transfer cylinder, the side plate is in an arc shape and is fixedly connected with the base, the shortest distance between the upper end of the side plate and the transfer cylinder is equal to the radius of the outer opening end of the through hole, a plurality of felts arranged in an arc shape and at equal intervals are arranged on the side of the transfer cylinder close to the side plate, a plurality of metal springs are uniformly and fixedly arranged on the side of the felt away from the transfer cylinder, and the upper end of the metal spring is fixedly connected with the side plate. The feeding mechanism can screen and optimize tin balls during the feeding process, ensures that the output tin balls are high-quality tin balls with high size consistency, good surface cleanliness and strong internal structure integrity, effectively improves the feeding efficiency and the production efficiency, optimizes the screening step and ensures the yield of the tin balls.

Description

Technical Field

[0001] This invention relates to the field of feeding equipment technology, and in particular to a feeding mechanism for microcrystalline solder ball processing. Background Technology

[0002] Microcrystalline solder balls are key interconnect materials in advanced electronic packaging technologies such as ball grid arrays and chip-level packaging. Their size consistency, surface cleanliness, and internal structural integrity directly affect the electrical performance and long-term reliability of solder joints. Traditional microcrystalline solder ball manufacturing processes include melt drop molding, die casting, and extrusion molding. Among these, extrusion molding does not require refining and melting, avoiding the problem of impurities easily mixed in during the melting process. When metal powder is extruded into a spherical structure through such a process, granular burrs are easily left on the surface of the solder ball or long strip burrs are formed at the junction of the mold. Moreover, extrusion will cause internal stress to accumulate inside the solder ball, and even microcracks may be generated. After sintering and cooling the extruded solder balls, the above-mentioned defects are easily amplified. At the same time, under the influence of factors such as thermal expansion and contraction, raw material extrusion compaction, and environmental parameters, the sintered solder balls may also have inconsistent particle sizes.

[0003] In the process of conveying sintered solder balls, workers typically use filter plates to sieve the balls and remove those that exceed the specified tolerance range. However, the solder balls do not automatically sort themselves by size, and if larger balls are sent first, jamming is very likely to occur. Furthermore, if there are burrs on the surface of the solder balls, they are easily misjudged, which is detrimental to the accuracy of screening. Moreover, solder balls with internal defects are easily cracked or even shattered during transportation due to collisions. Therefore, it is necessary to clean up these solder ball fragments in a timely manner, otherwise it will greatly affect the conveying of solder balls and cause blockages. If the fragments are collected in the collection container, it will bring repetitive labor to the workers for re-screening, which is not conducive to improving the conveying efficiency and production efficiency. In view of this, we propose a feeding mechanism for microcrystalline solder ball processing. Summary of the Invention

[0004] The purpose of this invention is to solve the problem in the prior art that some defective solder balls cause ball jamming or blockage in the feeding equipment, affecting feeding efficiency and production efficiency, and to propose a feeding mechanism for microcrystalline solder ball processing.

[0005] To achieve the above objectives, the present invention employs the following technology: a feeding mechanism for microcrystalline solder ball processing includes a base, a conveying mechanism on the base, the conveying mechanism including a transfer cylinder, the transfer cylinder being rotatably connected to the base, the transfer cylinder having multiple through holes arranged in an annular, equally spaced structure, the through holes being used to insert solder balls; a side plate is provided on one side of the transfer cylinder, the side plate having an arc-shaped structure and being fixedly connected to the base, the shortest distance between the upper end of the side plate and the transfer cylinder being equal to the radius of the outer opening end of the through hole, multiple felts arranged in an arc-shaped, equally spaced structure on the side of the side plate near the transfer cylinder, the felts being in frictional contact with the outer wall of the solder ball, multiple metal springs being uniformly fixed on the side of the felt away from the transfer cylinder, the upper ends of the metal springs being fixedly connected to the side plate; a feeding mechanism is provided on the other side of the transfer cylinder.

[0006] As a further description of the above technical solution: a support pad is fixed on the side of the side plate near the transfer cylinder, the side of the support pad away from the transfer cylinder has a concave structure, multiple support springs are fixed between the inner wall of the support pad and the side plate, and the outer wall of the support pad is in contact with multiple metal spring sheets at the bottom.

[0007] As a further description of the above technical solution: a rubber strip is fixed on the side plate and presses against the end of the metal spring away from the transfer cylinder. Both the metal spring and the felt are set in an inclined structure, and the end of the metal spring away from the side plate presses against the outer wall of the adjacent felt.

[0008] As a further description of the above technical solution: the transfer cylinder and the side plate are both inclined structures, a connecting groove is provided on one side of the through opening, and a guide groove is provided between the ends of multiple connecting grooves on the same axis away from the through opening. A scraper is fixed on the side of the guide groove away from the connecting groove, and the scraper is in frictional contact with multiple felts.

[0009] As a further description of the above technical solution: a polishing disc is fixedly provided on the inner wall of the through-hole near the connecting groove. The polishing disc is in frictional contact with the outer wall of the solder ball. Multiple balls are uniformly connected to the inner wall of the through-hole away from the connecting groove. The balls are in rolling contact with the outer wall of the solder ball. A guide plate is provided inside the transfer cylinder. The front end of the guide plate extends to the front of the transfer cylinder and is connected and fixed to the base.

[0010] As a further description of the above technical solution: the feeding mechanism includes a funnel, which is connected and fixed to the base. A discharge hopper is provided below the funnel. Both the funnel and the discharge hopper are set with an inclined structure. A guide ring is fixed on the bottom surface of the funnel. The guide ring is slidably connected to the discharge hopper. Multiple guide rods are fixed on the side of the discharge hopper away from the transfer cylinder. A rod groove is opened on the funnel to slide with the guide rods. A return spring is fixed between the end of the guide rod and the inner wall of the rod groove.

[0011] As a further description of the above technical solution: multiple ball grooves are evenly opened on the discharge hopper, and the multiple ball grooves correspond one-to-one with multiple through holes located on the same axial direction. The bottom surface of the discharge hopper has an arc structure, and the lower edge of the bottom surface of the discharge hopper is in contact with the outer wall of the transfer cylinder, the bottom surface of the guide groove and the side wall of the scraper.

[0012] As a further description of the above technical solution: a sloping groove is provided on the base, a recycling chamber is provided inside the base, a waste box is slidably inserted into the rear wall of the recycling chamber, a filter plate is embedded on the side of the sloping groove away from the side plate, a storage box is fixed on the side wall of the base near the filter plate, a motor is fixed on the base, and the output end of the motor is coaxially and fixedly connected to the transfer cylinder.

[0013] In summary, the beneficial effects of this invention, which employs the aforementioned technology for a feeding mechanism in microcrystalline solder ball processing, are as follows: The invention features a through-hole, and by limiting the dimensions of the upper and lower openings of the through-hole, solder balls exceeding or falling short of specified tolerances can be discharged, ensuring that all solder balls transported in this device are dimensionally compliant finished products. Regardless of the order in which the solder balls are output, the feeding equipment will not experience jamming, ensuring continuous feeding. Furthermore, the device's side plate is also fixed with metal springs and felt. Through their cooperation, the solder balls in the through-hole on the outer wall of the transfer cylinder can be moved. The 30-degree angle between the felt and the outer wall of the transfer cylinder allows the frictional force of the felt to act on the solder balls at an oblique tangential angle. This thrust can more smoothly drive the solder balls to rotate, thereby smoothing out burrs or protruding defects on the solder balls via a grinding disc. When solder balls with excessively large internal defects appear, the force of the metal springs and felt can... The device easily crushes the solder balls, ensuring that excessively defective solder balls are not mixed into the finished product. The inclined design of the transfer cylinder and guide plates also discharges the debris, preventing defective solder balls from shattering on the conveyor line due to collisions and affecting conveying efficiency. Simultaneously, the rotating transfer cylinder uses guide grooves and scrapers to squeeze the discharge hopper, causing it to vibrate up and down and preventing solder balls from clogging at the hopper outlet, thus avoiding ball jamming at the source. Furthermore, the solder balls finally transported to the collection box are polished and cleaned by a polishing disc and felt, greatly ensuring the surface cleanliness of the finished product. Through the above process, this device can stably screen the sintered solder balls, ensuring that the products sent to the collection box are high-quality solder balls with high size consistency, good surface cleanliness, and strong internal structural integrity. This effectively improves feeding and production efficiency, optimizes the screening process, and guarantees a high yield rate of solder balls. Attached Figure Description

[0014] Figure 1 An overall schematic diagram according to the present invention is shown;

[0015] Figure 2 A schematic diagram of the transfer cylinder according to the present invention is shown;

[0016] Figure 3The present invention is shown Figure 2 Enlarged view of point A in the middle;

[0017] Figure 4 A schematic diagram of the structure surrounding the transfer cylinder according to the present invention is shown;

[0018] Figure 5 A schematic diagram showing the positional relationship between the felt, metal spring, and support pad according to the present invention is provided.

[0019] Figure 6 A schematic diagram of the feeding mechanism according to the present invention is shown;

[0020] Figure 7 A top view schematic diagram of the feeding mechanism according to the present invention is shown;

[0021] Figure 8 A front sectional view of the base according to the present invention is shown;

[0022] Figure 9 A rear view schematic diagram according to the present invention is shown.

[0023] Legend:

[0024] 10. Base; 101. Inclined groove; 102. Recycling chamber; 11. Side plate; 12. Felt; 13. Metal spring; 14. Support pad; 141. Support spring; 15. Rubber strip; 16. Waste box; 17. Filter plate; 18. Storage box; 19. Motor;

[0025] 20. Conveying mechanism; 21. Transfer cylinder; 211. Through port; 212. Connecting groove; 213. Guide groove; 22. Scraper; 23. Grinding disc; 24. Ball bearing; 25. Guide plate.

[0026] 30. Feeding mechanism; 31. Funnel; 311. Guide ring; 312. Rod groove; 32. Discharge hopper; 321. Guide rod; 322. Return spring; 323. Ball groove. Detailed Implementation

[0027] The following will describe, with reference to the accompanying drawings of the embodiments of the present invention, a feeding mechanism for microcrystalline solder ball processing according to the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] like Figures 1-9As shown, the present invention provides a feeding mechanism for microcrystalline solder ball processing, including a base 10. The top surface of the base 10 has a sloping structure with a lower front and higher rear. A side plate 11 is fixed to one side of the top surface of the base 10. The side plate 11 has an arc-shaped structure. A sloping groove 101 is formed on the base 10. The transverse cross-section of the sloping groove 101 has a U-shaped structure. The front and rear edges are used to block the solder balls and prevent them from sliding forward out of the device. A recycling chamber 102 is formed inside the base 10. A waste box 16 is slidably inserted into the rear wall of the recycling chamber 102. A handle is fixed to the rear wall of the waste box 16, allowing workers to remove the waste box 16 by pulling the handle. A filter plate 17 is embedded on the side of the inclined groove 101 away from the side plate 11. The filter holes on the filter plate 17 connect the recycling chamber 102 and the inclined groove 101. Fragments and powders filtered by the filter plate 17 will fall from the filter plate 17 into the recycling chamber 102 and then be uniformly collected in the waste box 16. A storage box 18 is fixed to the side wall of the base 10 near the filter plate 17. Qualified solder balls will slide into the storage box 18 along the inclined groove 101.

[0029] The top surface of the filter plate 17 near the storage box 18 is lower than the bottom surface of the inclined groove 101. This height difference is much lower than the radius of the solder ball, so it will not affect the passage of the solder ball. However, this setting can prevent debris from sliding into the storage box 18, ensuring that the debris is concentrated at the filter plate 17 and collected into the recovery chamber 102.

[0030] A conveying mechanism 20 is provided on the base 10. The conveying mechanism 20 includes a transfer cylinder 21. A motor 19 is fixedly mounted on the base 10. The motor 19 is also inclined. The output end of the motor 19 is coaxially and fixedly connected to the transfer cylinder 21. The motor 19 can drive the transfer cylinder 21 to rotate. During the transport of solder balls, the motor 19 needs to drive the transfer cylinder 21 to rotate slowly and uniformly to avoid centrifugal force throwing the solder balls out. The transfer cylinder 21 and the side plate 11 are both inclined with the front lower and the back higher. The transfer cylinder 21 is rotatably connected to the base 10. Arc-shaped limiting plates are fixed on the base 10 at the front and rear sides relative to the transfer cylinder 21. The arc-shaped limiting plates are also fixed to the side plate 11. The limiting plates are in the shape of a two-thirds circle. The transfer cylinder 21 is coaxially rotatably connected to the outer wall of the transfer cylinder 21. This structure enables the transfer cylinder 21 to be rotatably connected to the base 10. The transfer cylinder 21 has multiple through-holes 211 arranged in a ring with equal spacing. The through-holes 211 are used to insert solder balls. The diameter of the outer opening end of the through-hole 211 is equal to the maximum particle size value of the solder ball within the specified tolerance range, and the diameter of the inner opening end of the through-hole 211 is equal to the minimum particle size value of the solder ball within the specified tolerance range. This structure allows solder balls within the specified tolerance range to be inserted into the through-holes 211 without obstruction. Solder balls larger than the diameter of the outer opening end of the through-hole 211 will be stuck outside the transfer cylinder 21, while those smaller than the diameter of the inner opening end of the through-hole 211 will fall into the transfer cylinder 21.

[0031] The shortest distance between the upper end of the side plate 11 and the transfer cylinder 21 is equal to the radius of the outer opening end of the through-hole 211. Solder balls with a diameter larger than the outer opening end diameter of the through-hole 211 will be squeezed by the end of the side plate 11. A connecting groove 212 is provided on one side of the through-hole 211. When the side wall of the solder ball contacts the end of the side plate 11, the connecting groove 212 is located on the other side of the solder ball. Due to its diameter limitation, the solder ball cannot enter the through-hole 211. Therefore, the part of the solder ball inside the through-hole 211 is less than half. In addition, the position of the connecting groove 212 reduces the height of the through-hole 211 on the side of the connecting groove 212, reducing the restriction of the inner wall of the through-hole 211 on the solder ball. Thus, the compressed solder ball can be easily squeezed out of the through-hole 211. 1. The solder ball rolls along the connecting groove 212. A guide groove 213 is provided between the ends of the multiple connecting grooves 212 on the same axis away from the through opening 211. The solder ball will then roll into the guide groove 213. The guide groove 213 has an arc surface structure. After the solder ball rolls in, it will be guided to the front of the guide groove 213 by the inclined structure of the transfer cylinder 21. Finally, it will slide out from the front side of the guide groove 213 and get off the transfer cylinder 21. If there are burrs or protrusions on the outer wall of the solder ball, but the size is compliant, if the position of the burrs and protrusions is in contact with the side plate 11, the side plate 11 will push the burrs and protrusions to make the solder ball rotate a certain angle in the through opening 211, thereby making the position of the burrs and protrusions rotate to the side position, so that there will be no jamming problem.

[0032] A scraper 22 is fixedly provided on the side of the guide groove 213 away from the connecting groove 212. The scraper 22 is also set in an arc shape. It is used for buffering effect to prevent the solder ball from directly crossing the guide groove 213 under the action of inertia after entering the guide groove 213 from the connecting groove 212, so as to avoid affecting the subsequent solder balls. The transfer cylinder 21 is provided with a guide plate 25. The solder balls falling into the transfer cylinder 21 and the solder balls sliding out of the guide groove 213 will eventually fall on the guide plate 25 and slide forward out of the device under the guidance of the guide plate 25. The operator only needs to set a container on the front side of the device to collect these defective solder balls. The front end of the guide plate 25 extends to the front of the transfer cylinder 21 and is connected and fixed to the base 10.

[0033] On the side of the side plate 11 near the transfer cylinder 21, there are multiple felts 12 arranged in an arc shape with equal spacing. The felts 12 are in frictional contact with the outer wall of the solder ball. During the rotation of the transfer cylinder 21, the solder ball can be rotated in the through-hole 211 by the movement of the felts 12. On the side of the felt 12 away from the transfer cylinder 21, there are multiple metal springs 13 evenly fixed. The metal springs 13 are made of metal with good toughness. They can quickly rebound after being bent by force. The flexible force applied by the metal springs 13 can improve the contact tightness between the felts 12 and the solder ball, ensuring that the felts 12 can smoothly drive the solder ball to rotate. The upper end of the metal springs 13 is connected and fixed to the side plate 11. A rubber strip 15 is fixed on the side plate 11 and is in pressure contact with the end of the metal springs 13 away from the transfer cylinder 21. The function of the rubber strip 15 is to prevent the bending position of the metal springs 13 from occurring at the root. Both the metal springs 13 and the felts 12 are set with an inclined structure.

[0034] The angle between the felt 12 and the outer wall of the transfer cylinder 21 is 30 degrees. This structure ensures that the metal spring 13 and the felt 12 on it can squeeze the solder ball from the oblique tangential position. The rotation of the transfer cylinder 21 can convert this pressure into the power to push the solder ball. The end of the metal spring 13 away from the side plate 11 is in contact with the outer wall of the adjacent felt 12. This structure allows multiple layers of metal spring 13 and felt 12 to support each other, which can not only improve the extrusion pressure but also further ensure the extrusion direction of the felt 12 on the solder ball. The outer wall of a qualified solder ball has excellent compressive strength and will not be damaged by pressure. However, the compressive strength of a solder ball with large internal defects is far less than that of a qualified solder ball. Moreover, the thrust of the felt 12 is applied by the metal spring 13. Furthermore, the movement trend of the solder ball after being compressed is towards the side wall with the grinding disc 23. In this way, the solder ball with large internal defects will be squeezed after sintering. The ball will be unable to maintain a stable structure under the reaction force of the metal spring 13 and will be crushed prematurely. Furthermore, there is a recess in the through-hole 211 near the ball 24. This recess, together with the protrusion of the ball 24, creates a gap between the inner wall of the through-hole 211 and the outer wall of the solder ball. This means that the defective solder ball does not have a complete support surface, so the inner wall of the through-hole 211 cannot restrict the solder ball from being crushed. Finally, the crushed solder ball fragments will slide out of the device from the opening end of the transfer cylinder 21. Small-volume debris falling into the inclined groove 101 will be collected from the filter plate 17 into the recovery chamber 102. This prevents solder balls with excessive internal defects from being collected into the storage box 18. The minimum distance between the lower part of the side plate 11 and the outer wall of the transfer cylinder 21 is slightly larger than the radius of the through-hole 211. This setting is to accommodate the thickness of the metal spring 13 and the felt 12 and avoid jamming the transfer cylinder 21.

[0035] It is worth mentioning that the felt 12 is arranged vertically in an arc-shaped structure. This structure allows the felt 12 of different heights to rub against different positions on the outer wall of the solder ball, thereby changing the direction of rotation of the solder ball and achieving the effect of thoroughly polishing burrs. In addition, the arc-shaped structure of the felt 12 is designed to adapt to contact with different positions on the solder ball, so that the squeezing force of the felt 12 on the solder ball always maintains a fixed angle with the outer wall of the solder ball. This ensures that the felt 12 can drive the solder ball to rotate from multiple angles. Moreover, this structure can also achieve the effect of fully detecting internal defects of the solder ball.

[0036] A support pad 14 is fixedly provided on the side plate 11 near the transfer cylinder 21. The support pad 14 is made of rubber. The side of the support pad 14 away from the transfer cylinder 21 has a concave structure. Multiple support springs 141 are fixed between the inner wall of the support pad 14 and the side plate 11. The outer wall of the support pad 14 is in contact with the multiple metal springs 13 at the bottom. The support pad 14 is used to support the multiple metal springs 13 at the bottom, so as to prevent the multiple metal springs 13 at the bottom from not being supported and thus failing to squeeze the solder ball. It also provides support for the multilayer felt 12 and the metal springs 13.

[0037] A polishing disc 23 is fixedly installed on the inner wall of the through-hole 211 near the connecting groove 212. When the solder ball, agitated by the felt 12, rotates in the through-hole 211, the polishing disc 23 rubs against the outer wall of the solder ball, thus smoothing out the protrusions and burrs on the outer wall of the solder ball and ensuring the surface cleanliness of the solder ball output by this device. Multiple balls 24 are evenly connected to the inner wall of the through-hole 211 away from the connecting groove 212. The balls 24 can roll in all directions and roll against the outer wall of the solder ball, reducing the friction between the solder ball and the inner wall of the through-hole 211. Compared to a design where the balls are completely flush with the outer wall of the solder ball, the arrangement of the balls 24 converts the static friction between one side of the inner wall of the through-hole 211 and the solder ball into rolling friction, making it easier for the felt 12 to rotate the solder ball. A certain recess is provided on the inner wall of the through-hole 211 near the balls 24. This recess is mainly used to accommodate the protrusion of the balls 24 through the through-hole. The height of the inner wall of the through-hole 211 ensures that the path of the through-hole 211 gradually narrows from the outside to the inside is not affected by the ball 24. The scraper 22 rubs against multiple felts 12. When the felts 12 rotate the solder ball to receive the polishing disc 23 for polishing, the protrusions and burrs on the surface of the solder ball are polished into debris or powder and fall off. The felts 12 are used to clean the surface of the solder ball during rolling. Through their own static electricity, the debris and powder adhering to the surface of the solder ball are concentrated on them, further ensuring the cleanliness of the solder ball. When the scraper 22 passes over the felts 12, these debris and powder are scraped off. These scraped-off impurities fall from the gaps in the felts 12 onto the side plate 11. At this time, the support pad 14 plays the role of blocking the powder and debris, so that the scraped-off powder and debris are blocked by the support pad 14 on the side away from the inclined groove 101, preventing the debris and powder from mixing into the storage box 18.

[0038] On the other side of the transfer cylinder 21, there is a feeding mechanism 30. The feeding mechanism 30 dispenses solder balls into multiple through-holes 211. The feeding mechanism 30 includes a funnel 31, into which workers can place the sintered solder balls. The funnel 31 is connected and fixed to the base 10. A support plate for lifting the funnel 31 is fixed on the side of the limiting plate for rotating the transfer cylinder 21 near the funnel 31. Below the funnel 31, there is a discharge hopper 32, which slides in contact with the side plate. Both the funnel 31 and the discharge hopper 32 are inclined. In addition to being inclined at the front and back like the transfer cylinder 21, the ends of both are also set lower near the transfer cylinder 21. Under the action of gravity, the solder balls in the funnel 31 and the discharge hopper 32 will move towards the funnel 31 and the discharge hopper 32. The transfer cylinder 21 rolls in the same direction. Multiple ball grooves 323 are evenly distributed on the discharge hopper 32. The ball grooves 323 are arranged in a funnel shape with a relatively large diameter. This ensures that the size of the solder balls does not affect their entry and exit. The multiple ball grooves 323 correspond one-to-one with multiple through-holes 211 located on the same axis. The bottom surface of the discharge hopper 32 is arc-shaped. The minimum distance between the higher side of the bottom surface of the discharge hopper 32 and the outer wall of the transfer cylinder 21 is slightly larger than the maximum radius value of the specified tolerance of the solder balls. This ensures that even solder balls exceeding the tolerance can slide out of the discharge hopper 32. In this way, the solder balls that fall onto the transfer cylinder 21 can only rotate with the transfer cylinder 21 after entering the through-hole 211. Otherwise, they will only roll along the outer wall of the transfer cylinder 21.

[0039] A guide ring 311 is fixedly provided on the bottom surface of the funnel 31. The guide ring 311 is slidably connected to the discharge hopper 32. The guide ring 311 is used to guide the solder balls to move towards the ball groove 323 on the discharge hopper 32. Multiple guide rods 321 are fixedly provided on the side of the discharge hopper 32 away from the transfer cylinder 21. The funnel 31 has a rod groove 312 that slides with the guide rods 321. A return spring 322 is fixed between the end of the guide rod 321 and the inner wall of the rod groove 312. The lower edge of the bottom surface of the discharge hopper 32 is in contact with the outer wall of the transfer cylinder 21, the bottom surface of the guide groove 213, and the side wall of the scraper 22. During the rotation of the transfer cylinder 21, its outer wall will always support the discharge hopper 32, keeping the guide rods 321 in a state that extends out of the rod groove 312. When the discharge is complete... When the hopper 32 corresponds to the scraper 22, the discharge hopper 32 will be lifted upwards. When the bottom surface of the discharge hopper 32 corresponds to the guide groove 213, it will move downwards under the pressure of the return spring 322. This structure causes the discharge hopper 32 to continuously bounce up and down during the rotation of the transfer cylinder 21, which can prevent the ball from getting stuck between the upper openings of multiple ball grooves 323. It can also cause the transfer cylinder 21 to vibrate through friction and the collision generated during the up and down movement, thereby helping the transfer cylinder 21 to shake off the debris and powder on it and slide out from the front. The height of the scraper 22 and the depth of the guide groove 213 are both set much smaller than the diameter of the outer opening of the through-hole 211 to avoid the problem of the solder ball sliding out prematurely due to excessive bumping.

[0040] Working principle: The staff can place the sintered solder balls into funnel 31. Since the solder ball blanks before the sintering process are brittle, it is impossible to polish the burrs and flash on the solder balls in the blank state. They can only be polished after sintering.

[0041] Subsequent staff only need to use the motor 19 to drive the transfer cylinder 21 to rotate to start the device. The feeding mechanism 30 feeds the solder balls into the through-hole 211 of the transfer cylinder 21 in an orderly manner through vibration. During the rotation of the transfer cylinder 21, the solder balls that are too small fall into the interior and are collected by the guide plate 25. The solder balls that are too large are squeezed out by the side plate 11 and discharged through the connecting groove 212 and the guide groove 213. The solder balls that are of the correct size continue to rotate with the transfer cylinder 21.

[0042] When the solder ball passes through the felt 12, it is rotated by the felt 12 in the through-hole 211, and the burr grinding of the grinding disc 23 and the radial pressure detection of the metal spring 13 are completed simultaneously. The grinding debris is absorbed by the felt 12 and then removed by the scraper 22. Solder balls with serious internal defects are crushed under pressure. The fragments are guided to slide to the front of the device by the inclined structure of the transfer cylinder 21. The debris that is not absorbed by the felt 12 and the slag that falls into the inclined groove 101 will fall into the waste box 16 through the filter plate 17 of the inclined groove 101 to avoid mixing with the finished product. Solder balls with smooth surface and qualified structure finally slide into the storage box 18.

[0043] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technology of the present invention, to a feeding mechanism for microcrystalline solder ball processing and its inventive concept, should be covered within the scope of protection of the present invention.

Claims

1. A feeding mechanism for microcrystalline solder ball processing, comprising a base (10), characterized in that, The base (10) is provided with a conveying mechanism (20), the conveying mechanism (20) includes a transfer cylinder (21), the transfer cylinder (21) is rotatably connected to the base (10), and the transfer cylinder (21) is provided with a plurality of through holes (211) arranged in a ring-shaped and equally spaced structure, the through holes (211) are used to insert solder balls; The transfer cylinder (21) has a side plate (11) on one side. The side plate (11) has an arc-shaped structure and is connected and fixed to the base (10). The shortest distance between the upper end of the side plate (11) and the transfer cylinder (21) is equal to the radius of the outer opening end of the through-hole (211). The side plate (11) near the transfer cylinder (21) has a plurality of felts (12) arranged in an arc-shaped and equally spaced structure. The felts (12) are in frictional contact with the outer wall of the tin ball. The side of the felts (12) away from the transfer cylinder (21) has a plurality of metal springs (13) evenly fixed. The upper end of the metal springs (13) is connected and fixed to the side plate (11). The other side of the transfer cylinder (21) is provided with a feeding mechanism (30).

2. The feeding mechanism for microcrystalline solder ball processing according to claim 1, characterized in that, A support pad (14) is fixedly provided on the side plate (11) near the transfer cylinder (21). The side of the support pad (14) away from the transfer cylinder (21) has a concave structure. Multiple support springs (141) are fixed between the inner wall of the support pad (14) and the side plate (11). The outer wall of the support pad (14) is pressed into contact with multiple metal springs (13) at the bottom.

3. The feeding mechanism for microcrystalline solder ball processing according to claim 2, characterized in that, Multiple rubber strips (15) are fixed on the side plate (11). The multiple rubber strips (15) are pressed and contacted with the bottom surface of multiple metal springs (13) near the side plate (11). The metal springs (13) and the felt (12) are both arranged in an inclined structure. The felt (12) is arranged in an arc shape. The end of the metal spring (13) away from the side plate (11) is pressed and contacted with the outer wall of the adjacent felt (12).

4. The feeding mechanism for microcrystalline solder ball processing according to claim 3, characterized in that, The transfer cylinder (21) and the side plate (11) are both arranged in an inclined structure with the front lower and the back higher. A connecting groove (212) is provided on one side of the through port (211). A guide groove (213) is provided between the ends of the multiple connecting grooves (212) on the same axis away from the through port (211). A scraper (22) is fixed on the side of the guide groove (213) away from the connecting groove (212). The scraper (22) is in frictional contact with multiple felts (12).

5. The feeding mechanism for microcrystalline solder ball processing according to claim 4, characterized in that, A polishing disc (23) is fixedly provided on the inner wall of the through opening (211) near the connecting groove (212). The polishing disc (23) rubs against the outer wall of the solder ball. Multiple balls (24) are evenly rotated and connected on the inner wall of the through opening (211) away from the connecting groove (212). The balls (24) roll against the outer wall of the solder ball. A guide plate (25) is provided inside the transfer cylinder (21). The end of the guide plate (25) away from the transfer cylinder (21) is connected and fixed to the base (10).

6. The feeding mechanism for microcrystalline solder ball processing according to claim 5, characterized in that, The feeding mechanism (30) includes a funnel (31), which is connected and fixed to the base (10). A discharge hopper (32) is provided below the funnel (31). Both the funnel (31) and the discharge hopper (32) are inclined. A guide ring (311) is fixed on the bottom surface of the funnel (31). The guide ring (311) is slidably connected to the discharge hopper (32). Multiple guide rods (321) are fixed on the side of the discharge hopper (32) away from the transfer cylinder (21). A rod groove (312) is opened on the funnel (31) to slide with the guide rod (321). A return spring (322) is fixed between the end of the guide rod (321) and the inner wall of the rod groove (312).

7. The feeding mechanism for microcrystalline solder ball processing according to claim 6, characterized in that, The discharge hopper (32) is evenly provided with multiple ball grooves (323), and the multiple ball grooves (323) correspond one-to-one with the multiple through holes (211) located on the same axial direction. The bottom surface of the discharge hopper (32) has an arc structure, and the lower end of the bottom surface of the discharge hopper (32) is in contact with the outer wall of the transfer cylinder (21), the bottom surface of the guide groove (213), and the side wall of the scraper (22).

8. The feeding mechanism for microcrystalline solder ball processing according to claim 7, characterized in that, The base (10) has an inclined groove (101) and a recycling chamber (102) inside. A waste box (16) is slidably inserted in the recycling chamber (102). A filter plate (17) is embedded on the bottom surface of the inclined groove (101) away from the side plate (11). A storage box (18) is fixed on the side wall of the base (10) near the filter plate (17). A motor (19) is fixed on the base (10). The output end of the motor (19) is coaxially fixedly connected to the transfer cylinder (21).

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