A device package structure and a device package method

Abstract

The application provides a device packaging structure and a device packaging method. The device packaging structure comprises a device, a carrier plate, and solder. The device comprises a bump. The carrier plate comprises a pad. The solder is arranged between the bump and the pad. The device is fixedly connected to the carrier plate through the solder. A limiting structure is arranged on the top surface of the pad. The projection of the bump on the carrier plate and the projection of the limiting structure on the carrier plate at least partially overlap.

Description

Technical Field

[0001] This application relates to the field of device packaging technology, and in particular to a device packaging structure and a device packaging method. Background Technology

[0002] This section is intended to provide background or context for the embodiments of this application as set forth in the claims. The description herein is not to be construed as prior art simply because it is included in this section.

[0003] Current flip-chip packaging for devices mostly employs ultrasonic flip-chip bonding. This structure lacks flexible solder connections and pad limiting structures, relying instead on hard contact bonding via ultrasonic vibration. This presents significant technical drawbacks: First, the process must be adapted to the ultrasonic vibration range, limiting the use of large-size pads, resulting in low package integration and hindering miniaturization. Second, hard bonding lacks deviation compensation capabilities, placing stringent requirements on the flatness of the device's gold balls, the flatness of the carrier board pads, and height differences, leading to low package fault tolerance and high defect rates. Third, this process cannot be adapted to parallel processes in surface mount technology (SMT), requiring multiple flip-chip bonding operations to be performed in stages, resulting in low mass production efficiency.

[0004] Therefore, there is an urgent need to propose a device packaging structure and device packaging method to solve the above-mentioned technical problems. Summary of the Invention

[0005] This application provides a device packaging structure and a device packaging method to solve at least one technical problem existing in the prior art.

[0006] In a first aspect, this application proposes a device packaging structure, the device packaging structure comprising:

[0007] The device includes bumps;

[0008] A carrier board, the carrier board including pads, wherein the projection of the bumps on the pads overlaps with the pads; pads;

[0009] Solder is provided between the bump and the pad, and the device is fixedly connected to the carrier plate by the solder.

[0010] The top surface of the pad is provided with a limiting structure, and the projection of the bump on the carrier plate at least partially overlaps with the projection of the limiting structure on the carrier plate.

[0011] Furthermore, the center point of the protrusion and the center point of the limiting structure are on the same straight line.

[0012] Furthermore, the carrier plate includes at least a first surface, a second surface, and a third surface, and the first surface and the second surface, the third surface and the second surface are respectively provided with height differences to form the limiting structure.

[0013] Furthermore, the included angle between the first surface and the third surface is less than or equal to 180°.

[0014] Furthermore, the depth of the limiting structure is less than or equal to the sum of the target solder layer thickness and the height of the bump; the target solder layer thickness includes the solder at the thickest layer position within the limiting structure.

[0015] Furthermore, the bump includes at least one of a gold ball and a copper ball.

[0016] Secondly, this application also proposes a device packaging method, the device packaging method comprising:

[0017] A device is provided, the device including bumps;

[0018] A carrier board is provided, the carrier board including pads, and a limiting structure is provided on the top of the pads;

[0019] Solder is provided at least on the limiting structure. After the device is placed on the solder, it is packaged onto the carrier board by a reflow soldering process. The projection of the bump on the carrier board and the projection of the limiting structure on the carrier board at least partially overlap.

[0020] Furthermore, the method further includes: flip-chip placing the device on the solder using a surface mount process, and then encapsulating the device onto the carrier board using a reflow soldering process.

[0021] Furthermore, the method also includes: applying solder to the limiting structure at least by means of stencil printing.

[0022] Thirdly, this application also proposes an electronic device comprising the device packaging structure described above, and / or, as described above, a device packaging structure prepared based on the device packaging method described above.

[0023] This application proposes a device packaging structure and a device packaging method. The device packaging structure includes: a device, the device including bumps; a carrier board, the carrier board including pads; solder, solder being disposed between the bumps and the pads, the device being fixedly connected to the carrier board by the solder; a limiting structure is provided on the top surface of the pads, and the projection of the bumps on the carrier board and the projection of the limiting structure on the carrier board at least partially overlap.

[0024] This invention proposes a device packaging structure that uses solder to bond and fix device bumps to carrier board pads. A limiting structure is set on the top surface of the pads, ensuring that the projections of the bumps and the limiting structure at least partially overlap. This effectively solves many defects of existing technologies and possesses significant technical advantages. This invention abandons the traditional ultrasonic hard contact bonding mode, eliminating the need for an ultrasonic vibration structure, reducing pad size, and achieving miniaturized packaging and high-density integration. Utilizing the melting and reshaping characteristics of solder, it can adaptively compensate for device flatness and height differences, reducing assembly accuracy requirements and improving packaging yield. Simultaneously, this invention can be adapted to parallel operation of multiple SMT devices, significantly improving packaging mass production efficiency. Furthermore, the newly added limiting structure provides soldering constraints to the devices, preventing device slippage and bump misalignment during reflow, effectively improving packaging alignment accuracy and structural stability. It balances packaging accuracy, yield, and production efficiency, demonstrating strong practicality and innovation. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0027] Figure 1 This is a process structure diagram (a) of a device packaging structure proposed in this application.

[0028] Figure 2 This is a process structure diagram (II) of a device packaging structure proposed in this application.

[0029] Figure 3 This is a schematic diagram of a device packaging structure proposed in this application;

[0030] Figure 4 This is a top view of the pads with the limit structure described in this application;

[0031] Figure 5 This is a schematic flowchart of a device packaging method proposed in this application;

[0032] The same or similar reference numerals in the accompanying drawings represent the same or similar parts.

[0033] 10. Component; 11. Bump; 20. Carrier board; 21. Pad; 22. Limiting structure; 30. Solder. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0035] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0036] Example 1

[0037] like Figure 3 As shown, this embodiment provides a device packaging structure, which includes:

[0038] Device 10, the device 10 including bump 11;

[0039] Carrier board 20, the carrier board 20 including pads 21;

[0040] Solder 30 is provided between the bump 11 and the pad 21, and the device 10 is fixedly connected to the carrier plate 20 by solder 30.

[0041] The top surface of the pad 21 is provided with a limiting structure 22, and the projection of the bump 11 on the carrier plate 20 and the projection of the limiting structure 22 on the carrier plate 20 at least partially overlap.

[0042] In one embodiment, the center point of the protrusion 11 is on the same straight line as the center point of the limiting structure 22.

[0043] Specifically, in practical applications, the shape of the protrusion 11 can be spherical or cubic. This application does not limit this, and those skilled in the art can make a reasonable choice based on the actual situation. When the shape of the protrusion 11 is spherical, the center point of the protrusion 11 is the center of the sphere. Similarly, in practical applications, the shape of the limiting structure 22 can also be various shapes. This application does not impose any special limitations on this, but only needs to ensure that the limiting structure 22 can limit the position of the protrusion 11.

[0044] Preferably, such as Figure 4The diagram shows the positional relationship and structural schematic of the limiting structure 22 and the pad 21. Specifically, the limiting structure 22 defines the cubic cavity, ensuring that the center point of the bump 11 and the center point of the limiting structure 22 are on the same straight line. This ensures the relative symmetry of the contact point between the bump 11 and the limiting structure 22, thereby ensuring the stability of the bump 11. This structural design is particularly effective in ensuring the stability of the bump 11 when the bump 11 cannot be completely located within the limiting structure 22.

[0045] In one embodiment, the projection of the bump 11 onto the pad 21 overlaps with the pad 21; since there is no need to reserve an ultrasonic vibration range, the projection of the bump 11 onto the pad 21 can completely overlap with the pad 21; that is, the size of the side of the pad 21 near the bump 11 can be exactly equal to the size of the projection of the bump 11 onto the pad 21.

[0046] In one embodiment, the carrier plate 20 includes at least a first surface, a second surface, and a third surface, wherein the first surface and the second surface, the third surface and the second surface are respectively provided with height differences to form the limiting structure 22.

[0047] Specifically, the limiting structure 22 includes a recessed structure formed on the pad 21. Designing the limiting structure 22 as a recessed structure reduces the manufacturing difficulty of the limiting structure 22. On the other hand, the bump 11 is set in the groove, which can achieve more accurate positioning and is less prone to displacement. Furthermore, the limiting structure 22 can also limit the flow direction of the solder 30 in the reflow process.

[0048] In one embodiment, the included angle between the first surface and the third surface is less than or equal to 180°.

[0049] Specifically, in general application scenarios, the first and third surfaces are usually set as horizontal planes, that is, the first and third surfaces are parallel to each other or located on the same horizontal plane. However, this application sets the first and third surfaces to have an angle of less than or equal to 180 degrees, which can effectively limit the flow direction of the fluid solder 30 in the reflow process; that is, when the solder 30 flows, it is prioritized to ensure that the solder 30 flows into the limiting structure 22, further improving the stability of the connection between the bump 11 and the pad 21.

[0050] Preferably, the included angle between the first and third surfaces is within 175 to 180 degrees.

[0051] In one embodiment, the depth of the limiting structure 22 is less than or equal to the sum of the target solder 30 layer thickness and the height of the bump 11; the target solder 30 layer thickness includes the solder 30 located at the thickest layer thickness position within the limiting structure 22.

[0052] Specifically, in order to ensure the stability of the connection between the bump 11 and the pad 21, as well as the stability of the electrical connection between the bump 11 and the device 10, the sum of the thickness of the solder 30 disposed in the limiting structure 22 and the height of the bump 11 is at least equal to the depth of the limiting structure 22; preferably, the sum of the thickness of the solder 30 disposed in the limiting structure 22 and the height of the bump 11 is greater than the depth of the limiting structure 22.

[0053] In practical applications, setting the target solder does not guarantee that the thickness of the solder 30 at any position is the same. Therefore, it is preferable that the sum of the height of the solder 30 at the thickest position within the limiting structure 22 and the height of the bump 11 is greater than or equal to the depth of the limiting structure 22.

[0054] In one embodiment, the bump 11 includes at least one of gold balls and copper balls; it should be understood that this application does not limit the material of the bump 11, and those skilled in the art can make a reasonable selection according to the actual application scenario and needs, as long as it can ensure that the device and the pad are bonded to achieve electrical conduction.

[0055] Specifically, in practical applications, gold balls are bonded using a gold wire bonding process, where the gold balls are melted and bonded through ultrasonic hot pressing. This process is mature, yields stable results, and has a low bonding temperature, minimizing damage to the chip. Copper balls are bonded using copper electroplating or reflow bonding processes. Copper balls require a surface anti-oxidation coating before high-temperature reflow soldering, necessitating strict control over oxidation and cold solder joints. Gold and copper balls are suitable for different application scenarios. This application does not limit the specific selection of bump 11; those skilled in the art can make a reasonable choice based on the actual application scenario.

[0056] Preferably, the bump 11 in this application is a gold ball.

[0057] Example 2

[0058] like Figure 5 As shown, this embodiment proposes a device packaging method, which includes at least the following steps:

[0059] Step S101: Provide a device 10, the device 10 including bumps 11;

[0060] Specifically, such as Figure 1 The diagram shown is a schematic diagram of the structure corresponding to device 10.

[0061] Step S102: Provide a carrier board 20, the carrier board 20 including pads 21, and a limiting structure 22 is provided on the top of the pads 21;

[0062] Specifically, such as Figure 2 The diagram shown is a schematic diagram of the structure corresponding to the carrier plate 20.

[0063] Step S103: At least solder 30 is placed on the limiting structure 22, and after the device 10 is placed on the solder 30, the device 10 is packaged to the carrier plate 20 by reflow soldering process. The projection of the bump 11 on the carrier plate 20 and the projection of the limiting structure 22 on the carrier plate 20 at least partially overlap.

[0064] Specifically, such as Figure 3 The diagram shown is a schematic diagram of the structure of the packaged device 10.

[0065] In one embodiment, the method further includes: flip-mounting the device 10 onto the solder 30 using a surface mount process, and then encapsulating the device 10 onto the carrier board 20 using a reflow soldering process.

[0066] In one embodiment, the method further includes: applying solder 30 to the limiting structure 22 by means of stencil printing.

[0067] Example 3

[0068] This embodiment also provides an electronic device, which includes the device packaging structure as described in Embodiment 1.

[0069] Example 4

[0070] This embodiment also provides an electronic device, which includes a device packaging structure prepared based on the device packaging method described in Embodiment 2, and / or a device packaging structure based on the device packaging structure described in Embodiment 1.

[0071] The above provides a detailed description of a device packaging structure and a device packaging method provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

[0072] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.

[0073] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that elements inherent to a process, method, article, or apparatus that comprises a list of elements, or elements inherent to such processes, methods, articles, or apparatus, are also included. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0074] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A device packaging structure, characterized in that, The device packaging structure includes: The device includes bumps; Carrier board, the carrier board including solder pads; Solder is provided between the bump and the pad, and the device is fixedly connected to the carrier plate by the solder. The top surface of the pad is provided with a limiting structure, and the projection of the bump on the carrier plate at least partially overlaps with the projection of the limiting structure on the carrier plate.

2. The device packaging structure according to claim 1, characterized in that, The center point of the protrusion is on the same straight line as the center point of the limiting structure.

3. The device packaging structure according to claim 2, characterized in that, The carrier plate includes at least a first surface, a second surface, and a third surface, and the first surface and the second surface, as well as the third surface and the second surface, are respectively provided with height differences to form the limiting structure.

4. The device packaging structure according to claim 3, characterized in that, The included angle between the first surface and the third surface is less than or equal to 180°.

5. The device packaging structure according to claim 1, characterized in that, The depth of the limiting structure is less than or equal to the sum of the thickness of the target solder layer and the height of the bump; The target solder layer thickness includes the solder at the thickest layer position within the limiting structure.

6. The device packaging structure according to claim 1, characterized in that, The bump includes at least one of a gold ball and a copper ball.

7. A device packaging method, characterized in that, The device packaging method is used to prepare the device packaging structure according to any one of claims 1 to 6, wherein the device packaging method comprises: A device is provided, the device including bumps; A carrier board is provided, the carrier board including pads, and a limiting structure is provided on the top of the pads; Solder is provided at least on the limiting structure. After the device is placed on the solder, it is packaged onto the carrier board by a reflow soldering process. The projection of the bump on the carrier board and the projection of the limiting structure on the carrier board at least partially overlap.

8. The device packaging method according to claim 7, characterized in that, The method further includes: flip-mounting the device onto the solder using a surface mount process, and then encapsulating the device onto the carrier board using a reflow soldering process.

9. The device packaging method according to claim 8, characterized in that, The method further includes: applying solder to the limiting structure at least by means of stencil printing.

10. An electronic device, characterized in that, The electronic device includes the device packaging structure as described in any one of claims 1 to 6, and / or the device packaging structure prepared based on the device packaging method of any one of claims 7 to 9.

Images