Automatic equipment for defect detection of semiconductor chip

Abstract

The utility model relates to the technical field of chip detection, and discloses automatic equipment for defect detection of a semiconductor chip. The automatic equipment for semiconductor chip defect detection comprises a supporting plate, a limiting roller is installed at the rear end of the supporting plate in a penetrating mode, a driving roller is installed at the front end of the supporting plate in a penetrating mode, a conveying belt is installed on the outer sides of the driving roller and the limiting roller in an embedded mode, and a driving motor is installed at the left end of the driving roller in a penetrating mode; a connecting frame is fixedly installed on the outer side of the driving motor, a connecting rod is fixedly installed on the left side of the supporting plate, a baffle is fixedly installed on the left side of the connecting rod, and when the driving motor drives a conveying belt to rotate through a driving roller, the conveying belt can drive a chip to move from the front end to the rear end; the chip can move to the center of the conveying belt under the limitation of the baffle plate in the moving process, and the movement path of the chip can be kept in the center of the conveying belt in the mode, so that the chip passes through the position under the detection equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of chip detection, in particular to an automated device for detecting defects in semiconductor chips. Background Art

[0002] Semiconductor chips are semiconductor devices that can achieve certain functions by bonding and wiring on semiconductor sheets. Today, electronic component packaging is rapidly developing towards miniaturization, chip-based, and high-performance. Defect detection of component pins is a necessary prerequisite for correct packaging, and other appearance defect detection is the quality assurance of packaged components.

[0003] The existing referenceable Chinese utility model patent has a publication number of: , which discloses a semiconductor chip defect detection device, which includes a detection component, and the detection component includes a first detection component, a second detection component and a third detection component, covering a variety of detection items, and can perform a comprehensive detection of semiconductor chips. The semiconductor chips are detected at multiple angles through the first detection component, the second detection component and the third detection component, thereby meeting the defect and critical dimension detection in the semiconductor field, reducing detection errors, and improving the yield of semiconductor chips.

[0004] Existing semiconductor chip defect detection equipment generally uses a camera to detect the chip surface. Due to the influence of angle and light, this method may cause defects such as scratches and dents on the chip surface to not be captured by the camera, affecting the accuracy of the detection results. At the same time, existing detection equipment generally transports chips through a conveyor belt. This method cannot keep the chip's movement path directly below the detection equipment, affecting the detection of the detection equipment. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies in the prior art, the utility model provides an automated device for semiconductor chip defect detection, which has the advantages of improving the accuracy of the detection results and being able to keep the chip movement path directly below the detection device, thereby solving the above-mentioned technical problems.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an automated device for semiconductor chip defect detection, comprising: a support plate, a limit roller is inserted and installed at the rear end of the support plate, a driving roller is inserted and installed at the front end of the support plate, a conveyor belt is installed on the outer side of the driving roller and the limit roller, a driving motor is inserted and installed at the left end of the driving roller, a connecting frame is fixedly installed on the outer side of the driving motor, a connecting rod is fixedly installed on the left side of the support plate, a baffle is fixedly installed on the left side of the connecting rod, a bull's eye bearing is fixedly installed on the lower end of the connecting rod, a limit frame is fixedly installed on the upper side of the support plate, an ultrasonic flaw detector is fixedly installed on the upper side of the limit frame, a probe is fixedly installed on the lower end of the ultrasonic flaw detector, a fixing frame is fixedly installed on the outer side of the probe, an infrared imaging module is inserted and installed on the front side of the limit frame, a camera is inserted and installed at the center of the limit frame, and a fill light is fixedly installed at the bottom of the limit frame; the conveyor belt can drive the chip to move.

[0009] As the preferred technical solution of the utility model, the support plate is symmetrically installed on the left and right ends of the limiting roller with the center of the limiting roller as the reference, and a rotational connection is formed between the limiting roller, the driving roller and the support plate; the support plate can limit the relative position between the limiting roller and the driving roller.

[0010] As an optimal technical solution of the utility model, the driving motor is installed at the left and right ends of the driving roller in a mirror-symmetrical manner with the center of the driving roller as the reference, and the rotating shaft of the driving motor is fixedly connected to the driving roller by an interlaced manner; the driving motor can drive the driving roller to rotate.

[0011] As a preferred technical solution of the utility model, the right end of the connecting frame is fixedly connected to the support plate, the driving motor is fixedly connected between the connecting frame and the support plate, and the connecting rod is installed on the inner sides of the left and right support plates in a mirror-symmetrical manner with the center of the conveyor belt as the reference; the connecting frame can limit the position of the driving motor.

[0012] As an optimal technical solution of the utility model, the bottom end of the baffle does not contact the conveyor belt, the bull's eye bearing is fixedly installed below the rear end of the connecting rod, and the bottom end of the bull's eye bearing contacts the conveyor belt; the baffle can make the chip located in the center of the conveyor belt.

[0013] As a preferred technical solution of the utility model, the infrared imaging module is installed on the left and right sides of the limit frame and the center of the front side of the limit frame in a mirror-symmetrical manner with the center of the limit frame as a reference, and the infrared imaging modules on the left and right sides of the limit frame point to the center of the conveyor belt; the infrared imaging module can perform infrared imaging on the detection chip, and by observing the thermal image of the chip, surface defects such as cracks, dents, and breakages can be easily discovered.

[0014] As the preferred technical solution of the utility model, the camera is installed on the left and right sides of the limit frame and the center of the limit frame in a mirror-symmetrical manner with the center of the limit frame as the reference, the cameras on the left and right sides of the limit frame point to the center of the conveyor belt, the fill light is a soft light, and the fill light is symmetrically installed on both sides of each camera with the center of the camera as the reference; the fill light can fill light for the chip to prevent the brightness from affecting the imaging clarity of the camera.

[0015] Compared with the prior art, the utility model provides an automated device for semiconductor chip defect detection, which has the following beneficial effects:

[0016] 1. The utility model sets a connecting rod, which is mirror-symmetrically installed on the inner sides of the left and right support plates with the center of the conveyor belt as the reference. The baffle is fixedly installed on the inner side of the connecting rod, and the bottom end of the baffle does not contact the conveyor belt. The bull's eye bearing is fixedly installed below the rear end of the connecting rod, and the bottom end of the bull's eye bearing contacts the conveyor belt. The bull's eye bearing can support the connecting rod and avoid wear on the connecting rod when the conveyor belt rotates. When the driving motor drives the conveyor belt to rotate through the driving roller, the conveyor belt will drive the chip to move from the front end to the rear end. During the movement of the chip, it will move to the center of the conveyor belt under the restriction of the baffle. This method can keep the movement path of the chip in the center of the conveyor belt, so that the chip passes directly under the detection equipment.

[0017] 2. The utility model sets a limit frame, an ultrasonic flaw detector is fixedly installed above the limit frame, a probe is fixedly installed below the ultrasonic flaw detector, the position of the probe is limited by a fixing frame, the infrared imaging module is mirror-symmetrically installed on the left and right sides of the limit frame and the center of the front side of the limit frame with the center of the limit frame as the reference, the infrared imaging modules on the left and right sides of the limit frame point to the center of the conveyor belt, the camera is mirror-symmetrically installed on the left and right sides of the limit frame and the center of the limit frame with the center of the limit frame as the reference, the cameras on the left and right sides of the limit frame point to the center of the conveyor belt, the fill light is a soft light, and the fill light is The camera is symmetrically installed on both sides of each camera with the center as the reference. Driven by the conveyor belt, the chip will pass under the infrared imaging module, camera and probe. The infrared imaging module can perform infrared imaging on the detection chip. By observing the thermal image of the chip, surface defects such as cracks, dents, and breakage can be easily found. The camera can facilitate users to detect the chip. The fill light can fill in the light of the chip to prevent the brightness from affecting the imaging clarity of the camera. The ultrasonic flaw detector can use ultrasonic waves to detect whether the chip has cracks. The chip can be inspected through a variety of detection methods to improve the accuracy of the test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the connection structure between the support plate and the conveyor belt of the utility model;

[0020] Figure 3 This is a schematic diagram of the connection structure between the limit frame and the support plate of the utility model;

[0021] Figure 4 This is a schematic diagram of the bottom surface structure of the limit frame of the utility model;

[0022] Among them: 1. Support plate; 11. Limit roller; 12. Drive roller; 13. Conveyor belt; 14. Drive motor; 15. Connecting frame; 16. Connecting rod; 17. Baffle; 18. Bull's eye bearing; 2. Limit frame; 21. Ultrasonic flaw detector; 22. Probe; 23. Fixing frame; 24. Infrared imaging module; 25. Camera; 26. Fill light. DETAILED DESCRIPTION

[0023] The following is a further detailed description of the implementation of the present utility model in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0024] In the description of the present invention, unless otherwise specified, "multiple" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] See also Figure 1-Figure 4In the present embodiment, an automated device for semiconductor chip defect detection includes: a support plate 1, a limiting roller 11 is inserted through the rear end of the support plate 1, a driving roller 12 is inserted through the front end of the support plate 1, a conveyor belt 13 is installed on the outer side of the driving roller 12 and the limiting roller 11, a driving motor 14 is inserted through the left end of the driving roller 12, a connecting frame 15 is fixedly installed on the outer side of the driving motor 14, a connecting rod 16 is fixedly installed on the left side of the support plate 1, a baffle 17 is fixedly installed on the left side of the connecting rod 16, and a bull's eye bearing 18 is fixedly installed on the lower end of the connecting rod 16.

[0027] The support plate 1 is symmetrically installed at the left and right ends of the limiting roller 11 with the center of the limiting roller 11 as a reference, and the limiting roller 11, the driving roller 12 and the support plate 1 are rotatably connected.

[0028] The driving motor 14 is installed at the left and right ends of the driving roller 12 in a mirror-symmetrical manner with the center of the driving roller 12 as a reference, and the rotating shaft of the driving motor 14 is fixedly connected to the driving roller 12 in an interlaced manner.

[0029] The right end of the connecting frame 15 is fixedly connected to the support plate 1, and the driving motor 14 is fixedly connected to the support plate 1 through the connecting frame 15. The connecting rod 16 is installed on the inner side of the left and right support plates 1 in a mirror-symmetrical manner with the center of the conveyor belt 13 as the reference.

[0030] The bottom end of the baffle 17 does not contact the conveyor belt 13 , and the bull's eye bearing 18 is fixedly installed below the rear end of the connecting rod 16 , and the bottom end of the bull's eye bearing 18 contacts the conveyor belt 13 .

[0031] Specifically, the support plate 1 can limit the relative position between the limiting roller 11 and the driving roller 12, the limiting roller 11 can limit the position of the rear end of the conveyor belt 13, the driving roller 12 can drive the conveyor belt 13 to rotate, the conveyor belt 13 can drive the chip to move, the driving motor 14 can drive the driving roller 12 to rotate, the connecting frame 15 can limit the position of the driving motor 14, the connecting rod 16 can limit the position of the baffle 17, the baffle 17 can make the chip located in the center of the conveyor belt 13, and the bull's eye bearing 18 can support the end of the connecting rod 16.

[0032] A limit frame 2 is fixedly installed above the support plate 1, an ultrasonic flaw detector 21 is fixedly installed above the limit frame 2, a probe 22 is fixedly installed at the lower end of the ultrasonic flaw detector 21, a fixing frame 23 is fixedly installed on the outer side of the probe 22, an infrared imaging module 24 is inserted into the front side of the limit frame 2, a camera 25 is inserted into the center of the limit frame 2, and a fill light 26 is fixedly installed at the bottom of the limit frame 2.

[0033] The infrared imaging modules 24 are installed on the left and right sides of the limiting frame 2 and the center of the front side of the limiting frame 2 in a mirror-symmetrical manner with the center of the limiting frame 2 as the reference. The infrared imaging modules 24 on the left and right sides of the limiting frame 2 point to the center of the conveyor belt 13.

[0034] The cameras 25 are installed on the left and right sides of the limit frame 2 and the center of the limit frame 2 in a mirror-symmetrical manner with the center of the limit frame 2 as the reference. The cameras 25 on the left and right sides of the limit frame 2 point to the center of the conveyor belt 13. The fill light 26 is a soft light, and the fill light 26 is installed symmetrically on both sides of each camera 25 with the center of the camera 25 as the reference.

[0035] Specifically, the limit frame 2 can limit the position of the ultrasonic flaw detector 21, the ultrasonic flaw detector 21 can detect whether cracks appear on the chip, the infrared imaging module 24 can perform infrared imaging on the detection chip, and by observing the thermal image of the chip, surface defects such as cracks, dents, and breakages can be easily found. The camera 25 can facilitate the user to detect the chip, and the fill light 26 can fill in the light for the chip to prevent the brightness from affecting the imaging clarity of the camera 25.

[0036] When in use, the connecting rod 16 is installed on the inner sides of the left and right support plates 1 in a mirror-symmetrical manner with the center of the conveyor belt 13 as the reference. The baffle 17 is fixedly installed on the inner side of the connecting rod 16, and the bottom end of the baffle 17 does not contact the conveyor belt 13. The bull's eye bearing 18 is fixedly installed below the rear end of the connecting rod 16, and the bottom end of the bull's eye bearing 18 contacts the conveyor belt 13. The bull's eye bearing 18 can support the connecting rod 16 and prevent the conveyor belt 13 from causing wear to the connecting rod 16 when the conveyor belt 13 rotates. The driving motor 14 drives the conveyor belt 13 through the driving roller 12. When the conveyor belt 13 rotates, the conveyor belt 13 will drive the chip to move from the front end to the rear end. During the movement of the chip, it will move to the center of the conveyor belt 13 under the restriction of the baffle 17. This method can keep the movement path of the chip in the center of the conveyor belt 13, so that the chip passes directly under the detection equipment. An ultrasonic flaw detector 21 is fixedly installed above the limit frame 2, and a probe 22 is fixedly installed below the ultrasonic flaw detector 21. The position of the probe 22 is limited by the fixing frame 23. The infrared imaging module 24 takes the center of the limit frame 2 as a reference. The left and right mirror images are symmetrically installed on the left and right sides of the limit frame 2 and the center of the front side of the limit frame 2. The infrared imaging modules 24 on the left and right sides of the limit frame 2 point to the center of the conveyor belt 13. The camera 25 is symmetrically installed on the left and right sides of the limit frame 2 and the center of the limit frame 2 with the center of the limit frame 2 as the reference. The cameras 25 on the left and right sides of the limit frame 2 point to the center of the conveyor belt 13. The fill light 26 is a soft light, and the fill light 26 is symmetrically installed on both sides of each camera 25 with the center of the camera 25 as the reference. The chip will pass through the conveyor belt 13 under the drive of the conveyor belt 13. Below the infrared imaging module 24, the camera 25 and the probe 22, the infrared imaging module 24 can perform infrared imaging on the detection chip. By observing the thermal image of the chip, surface defects such as cracks, dents, and breakage can be easily discovered. The camera 25 can facilitate the user to detect the chip. The fill light 26 can fill in the light for the chip to prevent the brightness from affecting the imaging clarity of the camera 25. The ultrasonic flaw detector 21 can detect whether the chip has cracks through ultrasonic waves. The chip can be detected through a variety of detection methods to improve the accuracy of the detection results.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automated device for semiconductor chip defect detection, characterized in that: include: A support plate (1), a limiting roller (11) is inserted and installed at the rear end of the support plate (1), a driving roller (12) is inserted and installed at the front end of the support plate (1), a conveyor belt (13) is installed on the outer side of the driving roller (12) and the limiting roller (11), a driving motor (14) is inserted and installed at the left end of the driving roller (12), a connecting frame (15) is fixedly installed on the outer side of the driving motor (14), a connecting rod (16) is fixedly installed on the left side of the support plate (1), a baffle (17) is fixedly installed on the left side of the connecting rod (16), and the connecting rod ( A bull's eye bearing (18) is fixedly installed at the lower end of the support plate (16); a limit frame (2) is fixedly installed above the support plate (1); an ultrasonic flaw detector (21) is fixedly installed above the limit frame (2); a probe (22) is fixedly installed at the lower end of the ultrasonic flaw detector (21); a fixing frame (23) is fixedly installed on the outer side of the probe (22); an infrared imaging module (24) is inserted and installed on the front side of the limit frame (2); a camera (25) is inserted and installed in the center of the limit frame (2); and a fill light (26) is fixedly installed at the bottom of the limit frame (2).

2. The automated device for semiconductor chip defect detection according to claim 1, characterized in that: The support plate (1) is symmetrically mounted on the left and right ends of the limiting roller (11) with the center of the limiting roller (11) as a reference, and the limiting roller (11), the driving roller (12) and the support plate (1) are rotatably connected.

3. The automated device for semiconductor chip defect detection according to claim 1, characterized in that: The driving motor (14) is installed at the left and right ends of the driving roller (12) in a mirror-symmetrical manner with the center of the driving roller (12) as a reference, and the rotating shaft of the driving motor (14) is fixedly connected to the driving roller (12) in an interlaced manner.

4. The automated device for semiconductor chip defect detection according to claim 1, characterized in that: The right end of the connecting frame (15) is fixedly connected to the support plate (1), the driving motor (14) is fixedly connected to the support plate (1) through the connecting frame (15), and the connecting rod (16) is installed on the inner sides of the left and right support plates (1) in a mirror-symmetrical manner with the center of the conveyor belt (13) as a reference.

5. The automated device for semiconductor chip defect detection according to claim 1, characterized in that: The bottom end of the baffle (17) does not contact the conveyor belt (13), the bull's eye bearing (18) is fixedly installed below the rear end of the connecting rod (16), and the bottom end of the bull's eye bearing (18) contacts the conveyor belt (13).

6. The automated device for semiconductor chip defect detection according to claim 1, characterized in that: The infrared imaging module (24) is installed on the left and right sides of the limit frame (2) and the center of the front side of the limit frame (2) in a mirror-symmetrical manner with the center of the limit frame (2) as a reference, and the infrared imaging modules (24) on the left and right sides of the limit frame (2) point to the center of the conveyor belt (13).

7. The automated device for semiconductor chip defect detection according to claim 1, characterized in that: The cameras (25) are installed on the left and right sides of the limit frame (2) and the center of the limit frame (2) in a mirror-symmetrical manner with the center of the limit frame (2) as a reference, the cameras (25) on the left and right sides of the limit frame (2) point to the center of the conveyor belt (13), the fill light (26) is a soft light, and the fill light (26) is installed on both sides of each camera (25) in a mirror-symmetrical manner with the center of the camera (25) as a reference.

Images