Processor heat dissipation system

Abstract

The utility model discloses a processor heat radiation system, comprising a heat conduction plate, the bottom surface of which is used for abutting against a processor in a heat conduction manner; the first radiator comprises a first heat conduction pipe and a plurality of first radiating fins, the plurality of first radiating fins are connected to the first heat conduction pipe, and the first heat conduction pipe is in heat conduction connection with the heat conduction plate; the semiconductor refrigeration sheet is provided with a refrigeration surface and a heat dissipation surface which are arranged back to back, and the refrigeration surface abuts against the top surface of the heat conduction plate; the second radiator comprises a second heat conduction pipe and a plurality of second radiating fins, the plurality of second radiating fins are connected to the second heat conduction pipe, and the second heat conduction pipe is in butt joint with the radiating surface in a heat conduction manner; and the cooling fan is used for driving airflow to flow through the first cooling fins and the second cooling fins. According to the processor heat dissipation system, the heat dissipation effect on the processor can be improved, and the overall structure of the processor heat dissipation system is simpler and more compact.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation systems, and particularly relates to a processor heat dissipation system. Background Art

[0002] In modern computers, the central processing unit (CPU), as a core component, undertakes a large number of data processing tasks. With the continuous improvement of processor performance, its power consumption and heat generation are also increasing significantly. Currently, CPU heat dissipation technologies mainly include air cooling, liquid cooling, and phase change cooling, etc. Air cooling usually uses a radiator and a fan to dissipate heat, but with the increase in CPU power density, the effect of air cooling is gradually limited. Related technologies use a thermoelectric cooler to dissipate heat from the central processing unit, but the refrigeration effect of the thermoelectric cooler is limited, resulting in a poor heat dissipation effect on the central processing unit. Content of the Utility Model

[0003] The main object of the utility model is to propose a processor heat dissipation system, aiming to solve the technical problem of how to improve the heat dissipation effect of the processor heat dissipation system.

[0004] To achieve the above object, the processor heat dissipation system proposed by the utility model includes:

[0005] A heat conduction plate, the bottom surface of the heat conduction plate is used for thermally conductive contact with the processor;

[0006] A first radiator, the first radiator includes a first heat conduction pipe and a plurality of first heat dissipation fins, the plurality of first heat dissipation fins are connected to the first heat conduction pipe, and the first heat conduction pipe is thermally conductive connected to the heat conduction plate;

[0007] A thermoelectric cooler, the thermoelectric cooler has a refrigerating surface and a heat dissipating surface arranged opposite to each other, and the refrigerating surface abuts against the top surface of the heat conduction plate;

[0008] A second radiator, the second radiator includes a second heat conduction pipe and a plurality of second heat dissipation fins, the plurality of second heat dissipation fins are connected to the second heat conduction pipe, and the second heat conduction pipe is thermally conductive abutted against the heat dissipating surface;

[0009] A cooling fan, the cooling fan is used to drive air flow to flow through the first heat dissipation fins and the second heat dissipation fins.

[0010] Optionally, a connection hole is formed on the side surface of the heat conduction plate, and the first heat conduction pipe is fixedly matched with the connection hole.

[0011] Optionally, the heat conduction plate includes a bottom plate and an upper cover, a part of the hole wall of the connection hole is arranged on the bottom plate, and the other part is arranged on the upper cover, and the bottom plate is connected to the upper cover to splice and form the connection hole.

[0012] Optionally, the first heat pipe includes a first installation section, a second installation section arranged side by side, and a connection section connecting the first installation section and the second installation section. The connection section is connected to the heat conduction plate. The first heat sink includes a plurality of first sheet bodies installed on the first installation section and a plurality of second sheet bodies installed on the second installation section. The cooling fan is located between the first sheet bodies and the second sheet bodies.

[0013] Optionally, the second heat sink is located on a side of the first sheet body away from the cooling fan.

[0014] Optionally, the first sheet body is located on the air outlet side of the cooling fan, and the second sheet body is located on the air inlet side of the cooling fan.

[0015] Optionally, the number of the second heat sinks is less than the number of the first sheet bodies, and the second heat sinks and some of the first sheet bodies are integrally formed.

[0016] Optionally, the length of the second heat sink is less than the length of the first sheet body, and / or the width of the second heat sink is greater than the width of the first sheet body.

[0017] Optionally, the processor cooling system further includes a heat dissipation plate. The heat dissipation plate abuts against the heat dissipation surface. The area of the heat dissipation plate is larger than the area of the heat dissipation surface. The second heat pipe abuts against a surface of the heat dissipation plate away from the heat dissipation surface.

[0018] Optionally, an installation groove is formed in a top surface of the heat conduction plate. The semiconductor refrigeration sheet is installed in the installation groove, and the heat dissipation surface protrudes from an opening of the installation groove.

[0019] In the technical solution of the processor cooling system of the present utility model, the heat conduction plate can conduct a large amount of heat on the processor quickly. The first radiator is in direct contact with the heat conduction plate, so that the heat of the heat conduction plate can be directly dissipated through the first heat sink. The cooling surface of the semiconductor refrigeration sheet can reduce the surface temperature of the heat conduction plate to improve the heat dissipation effect on the heat conduction plate together with the first radiator. The second radiator can dissipate heat from the heat dissipation surface of the semiconductor refrigeration sheet to ensure the continuous refrigeration effect of the cooling surface. The second heat sinks of the second radiator and the first heat sinks of the first radiator are cooled by the same cooling fan, which can improve the effective utilization rate of the cooling fan and make the overall structure of the processor cooling system simpler and more compact. Description of the Drawings

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0021] Figure 1 It is a schematic structural diagram of an embodiment of the processor heat dissipation system of the present invention;

[0022] Figure 2 It is a structural sectional view of an embodiment of the processor heat dissipation system of the present invention;

[0023] Figure 3 It is a structural sectional view of another embodiment of the processor heat dissipation system of the present invention;

[0024] Figure 4 It is a schematic structural diagram of an embodiment of the first sheet body and the second heat sink in the present invention.

[0025] Explanation of the reference numerals in the drawings:

[0026] Label Name Label Name Label Name 10 Processor 20 Heat conduction plate 30 First radiator 31 First heat conduction tube 32 First heat sink 40 Semiconductor refrigeration chip 50 Second radiator 51 Second heat conduction tube 52 Second heat sink 60 Cooling fan 21 Bottom plate 22 Upper cover 311 First installation section 312 Second installation section 313 Connection section 321 First sheet 322 Second sheet 70 Heat dissipation plate

[0027] The realization of the purpose, functional features and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the drawings. Detailed implementation manners

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0029] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If this specific posture changes, the directional indications will also change accordingly.

[0030] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present utility model, such descriptions of "first", "second", etc. are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and / or" appearing throughout the text is that it includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, or solution B, or a solution where both A and B are satisfied simultaneously. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0031] In modern computers, the Central Processing Unit (CPU) is a core component and undertakes a large number of data processing tasks. With the continuous improvement of processor performance, its power consumption and heat generation are also increasing significantly. Currently, CPU cooling technologies mainly include air cooling, liquid cooling, and phase change cooling, etc. Air cooling usually uses a radiator and a fan to dissipate heat, but as the CPU power density increases, the effect of air cooling is gradually limited. Related technologies use a thermoelectric cooler to cool the central processor, but the cooling effect of the thermoelectric cooler is limited, resulting in a poor cooling effect on the central processor.

[0032] The present utility model proposes a processor cooling system, aiming to solve the technical problem of how to improve the cooling effect of the processor cooling system.

[0033] In the embodiments of the present utility model, as Figures 1 to 3 shown, the processor cooling system includes: a heat conduction plate 20, the bottom surface of the heat conduction plate 20 is used for thermally conductive contact with the processor 10; a first radiator 30, the first radiator 30 includes a first heat conduction tube 31 and a plurality of first heat dissipation fins 32, the plurality of first heat dissipation fins 32 are connected to the first heat conduction tube 31, and the first heat conduction tube 31 is thermally conductively connected to the heat conduction plate 20; a thermoelectric cooler 40, the thermoelectric cooler 40 has a cooling surface and a heat dissipation surface arranged opposite to each other, and the cooling surface abuts against the top surface of the heat conduction plate; a second radiator 50, the second radiator 50 includes a second heat conduction tube 51 and a plurality of second heat dissipation fins 52, the plurality of second heat dissipation fins 52 are connected to the second heat conduction tube 51, and the second heat conduction tube 51 is thermally conductively abutted against the heat dissipation surface; a cooling fan 60, the cooling fan 60 is used to drive air flow to flow through the first heat dissipation fins 32 and the second heat dissipation fins 52.

[0034] In this embodiment, the processor 10 can be a central processing unit (CPU). The heat conduction plate 20 is a heat pipe, which can quickly conduct the heat generated by the processor 10 to the first radiator 30 and the semiconductor refrigeration sheet 40. The greater the heat dissipation speed of the heat conduction plate 20, the better the heat dissipation effect on the processor 10. A plurality of first heat dissipation fins 32 of the first radiator 30 are arranged at intervals along the length direction of the first heat conduction pipe 31. The first heat conduction pipe 31 can transfer the heat of the heat conduction plate 20 to the first heat dissipation fins 32, and then the first heat dissipation fins 32 dissipate heat to the air. The semiconductor refrigeration and heating sheet is also called a thermoelectric refrigeration sheet. Using the Peltier effect of semiconductor materials, when direct current passes through an electric couple formed by two different semiconductor materials connected in series, heat can be absorbed and released at both ends of the electric couple respectively, so as to achieve the purpose of refrigeration and heating. The refrigerating surface of the semiconductor refrigeration sheet 40 abuts against the heat conduction plate 20, and can directly cool and dissipate heat from the heat conduction plate 20. The heat generated by the heat dissipation surface of the semiconductor refrigeration sheet 40 is transferred to the second heat conduction pipe 51, and then transferred to the second heat dissipation fins 52 by the second heat conduction pipe 51, and finally dissipated to the air by the second heat dissipation fins 52. A plurality of second heat dissipation fins 52 of the second radiator 50 are arranged at intervals along the length direction of the second heat conduction pipe 51.

[0035] The cooling fan 60 can drive the air flow to flow through the first heat dissipation fins 32 and the second heat dissipation fins 52, so as to take away the heat of the first heat dissipation fins 32 and the second heat dissipation fins 52 faster, thereby accelerating the heat dissipation efficiency of the first heat dissipation fins 32 and the second heat dissipation fins 52 and improving the heat dissipation effect on the heat conduction plate 20. That is to say, the heat conduction plate 20 can dissipate heat through the first radiator 30 and can also be cooled by the semiconductor refrigeration sheet 40. The heat dissipation surface of the semiconductor refrigeration sheet 40 can dissipate heat through the second radiator 50. The first radiator 30 and the second radiator 50 jointly improve the heat dissipation efficiency through the cooling fan 60. In this way, the heat dissipation effect on the heat conduction plate 20 can be improved, the effective utilization rate of the cooling fan 60 can be improved, and the overall structure of the processor heat dissipation system can be made more simple and compact.

[0036] Specifically, as Figure 3 shown, a connection hole is formed in the side surface of the heat conduction plate 20, and the first heat conduction pipe 31 is fixedly matched with the connection hole. The connection hole penetrates through the opposite side surfaces of the heat conduction plate 20. The first heat conduction pipe 31 is disposed in the connection hole, and the hole wall of the connection hole fits with the peripheral wall of the first heat conduction pipe 31. In this way, the contact area between the heat conduction plate 20 and the first heat conduction pipe 31 can be increased, thereby improving the heat conduction efficiency between the heat conduction plate 20 and the first heat conduction pipe 31 and improving the heat dissipation efficiency of the heat conduction plate 20.

[0037] In practical applications, as Figure 3As shown, the heat conducting plate 20 includes a bottom plate 21 and an upper cover 22. The wall portion of the connection hole is partially provided on the bottom plate 21 and the other part is provided on the upper cover 22. The bottom plate 21 is connected to the upper cover 22 to form the connection hole by splicing. When assembling the heat conducting plate 20 and the first heat pipe 31, the first heat pipe 31 can be first clamped between the bottom plate 21 and the upper cover 22. After ensuring that the peripheral wall of the first heat pipe 31 fits with the wall of the connection hole, the upper cover 22 and the bottom plate 21 are then connected and fixed.

[0038] The first heat sink 32 can be located on the air inlet side of the cooling fan 60 or on the air outlet side of the cooling fan 60.

[0039] Exemplarily, as Figure 2 As shown, the first heat pipe 31 includes a first installation section 311, a second installation section 312 arranged side by side, and a connection section 313 connecting the first installation section 311 and the second installation section 312. The connection section 313 is connected to the heat conducting plate 20. The first heat sink 32 includes a plurality of first sheet bodies 321 installed on the first installation section 311 and a plurality of second sheet bodies 322 installed on the second installation section 312. The cooling fan 60 is located between the first sheet bodies 321 and the second sheet bodies 322.

[0040] Combined with the above embodiment of the connection hole, the connection section 313 passes through the connection hole. The first installation section 311 and the second installation section 312 are respectively connected to both ends of the connection section 313, and the first installation section 311 and the second installation section 312 extend in the direction towards the top surface of the heat conducting plate 20. The plurality of first sheet bodies 321 are arranged at intervals along the length direction of the first installation section 311, and the plurality of second sheet bodies 322 are arranged at intervals along the length direction of the second installation section 312. The cooling fan 60 is located between the first sheet bodies 321 and the second sheet bodies 322, that is, above the heat conducting plate 20. In this way, the interval between the first sheet bodies 321 and the second sheet bodies 322 can be effectively utilized to install the cooling fan 60, so as to improve the space utilization rate, make the structure of the processor cooling system more compact, and reduce the occupied space. The air inlet side of the cooling fan 60 faces one of the first sheet bodies 321 and the second sheet bodies 322, and the air outlet side faces the other of the first sheet bodies 321 and the second sheet bodies 322. When the cooling fan 60 operates, it drives the air flow to flow from the air inlet side to the air outlet side. Therefore, there will be air flow on both the air inlet side and the air outlet side, so that both the first sheet bodies 321 and the second sheet bodies 322 can have their heat dissipation efficiency accelerated by the air flow. In this way, both the number of the first heat sinks 32 can be increased to improve the heat dissipation efficiency of the heat conducting plate 20, and the effective utilization rate of the cooling fan 60 can be improved, further improving the heat dissipation effect on the heat conducting plate 20.

[0041] Specifically, as Figure 2As shown, the second heat sink 52 is located on the side of the first sheet 321 away from the heat dissipation fan 60. The second heat sink 52 is also located in the flow direction of the airflow driven by the heat dissipation fan 60, so that the second heat sink 52 can also improve the heat dissipation efficiency by using the airflow driven by the heat dissipation fan 60. The second heat sink 52 can be located on the air inlet side of the heat dissipation fan 60, or on the air outlet side of the heat dissipation fan 60.

[0042] In practical applications, the first sheet 321 is located at the air outlet side of the heat dissipation fan 60, and the second sheet 322 is located at the air inlet side of the heat dissipation fan 60. In combination with the above embodiment, the second heat dissipation fin 52 is also located at the air outlet side of the heat dissipation fan 60. It can be understood that the airflow velocity of the heat dissipation fan 60 at the air outlet side is significantly greater than the airflow velocity at the air inlet side. Therefore, the second heat dissipation fin 52 is arranged at the air outlet side of the heat dissipation fan 60, so that the second heat dissipation fin 52 can use the airflow with a higher velocity to dissipate heat, ensuring that the airflow can still maintain a sufficient velocity to take away the heat on the second heat dissipation fin 52 after flowing through the first sheet 321, so as to improve the heat dissipation efficiency of the second heat dissipation fin 52.

[0043] For example, Figure 2 and Figure 4 As shown, the number of the second heat sink 52 is less than the number of the first sheet 321, and the second heat sink 52 is integrally formed with a part of the first sheet 321. The airflow of the heat dissipation fan 60 will be reduced by a certain flow rate after passing through the first sheet 321, and the heat dissipation capacity of the second heat sink 52 will be reduced accordingly. Therefore, setting the number of the second heat sink 52 to be less than the number of the first sheet 321 can make the number of the second heat sink 52 more match the heat dissipation capacity of the airflow after passing through the first sheet 321, thereby improving the effective heat dissipation rate of the second heat sink 52 and reasonably controlling the occupied space of the second heat sink 52.

[0044] The second heat sink 52 and the first sheet 321 can be integrally formed by a casting process or a die-casting process. The second heat sink 52 and the first sheet 321 are integrally formed, so that the overall structure of the first heat sink 30 and the second heat sink 50 can be simpler and more compact, and the processing method of the second heat sink 50 can be simplified. In addition, the second heat sink 52 and the first sheet 321 can also conduct heat to each other, so that when one of them does not dissipate heat in time, the heat dissipation efficiency can be improved through the other, thereby improving the overall heat dissipation efficiency of the first heat sink 30 and the second heat sink 50.

[0045] Specifically, Figure 4As shown, the length of the second heat sink 52 is less than that of the first sheet body 321. In this way, the whole second heat sink 52 can be located in the area where the air flow from the air outlet side of the cooling fan 60 is more concentrated, so as to improve the heat dissipation efficiency. And / or, the width of the second heat sink 52 is greater than that of the first sheet body 321. In this way, the heat dissipation capacity of the air flow after flowing through the first sheet body 321 can be fully utilized, the contact time between the air flow and the second heat sink 52 can be extended, and the heat dissipation effect on the second heat sink 52 can be further improved.

[0046] Exemplarily, as Figure 2 and Figure 3 shown, the processor heat dissipation system further includes a heat dissipation plate 70. The heat dissipation plate 70 abuts against the heat dissipation surface. The area of the heat dissipation plate 70 is larger than that of the heat dissipation surface. The second heat conduction tube 51 abuts against one side of the heat dissipation plate 70 facing away from the heat dissipation surface. The heat dissipation plate 70 can conduct the heat of the heat dissipation surface to the second heat conduction tube 51. The heat dissipation plate 70 has a larger area for the second heat conduction tube 51 to abut against, so as to improve the heat conduction efficiency between the heat dissipation surface and the second heat conduction tube 51.

[0047] Specifically, an installation groove is formed in the top surface of the heat conduction plate 20. The semiconductor refrigeration chip 40 is installed in the installation groove. The heat dissipation surface protrudes from the notch of the installation groove. The installation groove can increase the installation area of the semiconductor refrigeration chip 40 on the heat conduction plate 20, so as to improve the installation stability of the semiconductor refrigeration chip 40 on the heat conduction plate 20.

[0048] The above are only optional embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made by using the content of the specification and drawings of the present invention under the inventive concept of the present invention, or any direct / indirect application in other related technical fields shall be included in the patent protection scope of the present invention.

Claims

1. A processor cooling system, characterized in that: include: A heat conductive plate, the bottom surface of which is used for thermally conductively contacting the processor; A first heat sink, the first heat sink comprising a first heat pipe and a plurality of first heat sinks, the plurality of first heat sinks are connected to the first heat pipe, and the first heat pipe is heat-conductively connected to the heat conductive plate; A semiconductor refrigeration sheet, wherein the semiconductor refrigeration sheet has a refrigeration surface and a heat dissipation surface disposed opposite to each other, and the refrigeration surface abuts against the top surface of the heat conducting plate; A second heat sink, the second heat sink comprising a second heat conducting pipe and a plurality of second heat dissipating fins, the plurality of second heat dissipating fins being connected to the second heat conducting pipe, and the second heat conducting pipe being in thermal contact with the heat dissipating surface; A heat dissipation fan is used to drive airflow to flow through the first heat dissipation fin and the second heat dissipation fin.

2. The processor cooling system according to claim 1, wherein: A connecting hole is provided on the side surface of the heat conducting plate, and the first heat conducting pipe is fixedly matched with the connecting hole.

3. The processor cooling system according to claim 2, wherein: The heat conducting plate comprises a bottom plate and an upper cover, a hole wall portion of the connection hole is arranged on the bottom plate, and another portion is arranged on the upper cover, and the bottom plate is connected to the upper cover to form the connection hole.

4. The processor cooling system according to claim 1, wherein: The first heat pipe includes a first mounting section and a second mounting section arranged side by side, and a connecting section connecting the first mounting section and the second mounting section, the connecting section is connected to the heat conductive plate, the first heat sink includes a plurality of first sheets mounted on the first mounting section, and a plurality of second sheets mounted on the second mounting section, and the heat dissipation fan is located between the first sheets and the second sheets.

5. The processor cooling system according to claim 4, wherein: The second heat sink is located at a side of the first sheet body away from the heat sink fan.

6. The processor cooling system according to claim 5, wherein: The first sheet is located at the air outlet side of the heat dissipation fan, and the second sheet is located at the air inlet side of the heat dissipation fan.

7. The processor cooling system according to claim 5, wherein: The number of the second heat sinks is less than the number of the first sheets, and the second heat sinks are integrally formed with a portion of the first sheets.

8. The processor cooling system according to claim 5, wherein: The length of the second heat sink is smaller than the length of the first sheet, and / or the width of the second heat sink is larger than the width of the first sheet.

9. The processor cooling system according to claim 1, wherein: The processor cooling system further includes a heat sink, which is in contact with the heat sink surface. The area of ​​the heat sink is larger than that of the heat sink surface. The second heat pipe is in contact with a side of the heat sink facing away from the heat sink surface.

10. The processor cooling system according to claim 1, wherein: The top surface of the heat conducting plate is provided with a mounting groove, the semiconductor cooling sheet is mounted in the mounting groove, and the heat dissipation surface protrudes from the notch of the mounting groove.

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