Bus capacitor, motor controller and vehicle

Abstract

The embodiment of the utility model provides a bus capacitor, a motor controller and a vehicle, and relates to the technical field of motor controllers. The bus capacitor comprises: a housing, wherein the housing is internally provided with an accommodating cavity; the capacitor body is arranged in the accommodating cavity; the liquid cooling heat dissipation piece is arranged on one side of the shell; and the conduction piece is arranged on the side, away from the shell, of the liquid cooling heat dissipation piece, and the conduction piece is used for installing a power device. According to the bus capacitor provided by the embodiment of the invention, the liquid cooling heat dissipation piece is independently arranged relative to the shell and does not occupy the internal space of the shell, so that the shell can accommodate the capacitor body with larger capacity.

Description

Technical Field

[0001] The present application relates to the technical field of motor controllers, and particularly to a bus capacitor, a motor controller, and a vehicle. Background Art

[0002] A bus capacitor is a capacitor used to store charge and smooth the power supply.

[0003] The related art provides a bus capacitor, including a housing and a capacitor disposed in the housing. A liquid cooling water channel is provided in the housing to dissipate heat from the capacitor in the housing.

[0004] However, the liquid cooling water channel is disposed in the housing, which will occupy the internal space of the housing. Summary of the Utility Model

[0005] The present application provides a bus capacitor, a motor controller, and a vehicle to solve the problem that the liquid cooling water channel disposed in the housing will occupy the internal space of the housing.

[0006] In a first aspect, an embodiment of the present application provides a bus capacitor, including:

[0007] A housing having an accommodation cavity therein;

[0008] A capacitor body disposed in the accommodation cavity;

[0009] A liquid cooling radiator disposed on one side of the housing;

[0010] A conducting member disposed on the side of the liquid cooling radiator away from the housing, and the conducting member is used to mount a power device.

[0011] In a possible implementation manner, the liquid cooling radiator has a liquid cooling cavity for accommodating a cooling medium, and the liquid cooling radiator has a liquid inlet and a liquid outlet communicating with the liquid cooling cavity. The liquid inlet is used for the cooling medium to enter the liquid cooling cavity, and the liquid outlet is used for the cooling medium to flow out of the liquid cooling cavity.

[0012] In a possible implementation manner, the liquid cooling radiator has a boss, and the boss is embedded in the accommodation cavity.

[0013] In a possible implementation manner, the bus capacitor further includes at least two first connecting members. The housing has at least two first connection holes, the liquid cooling radiator has at least two second connection holes, and the conducting member has at least two third connection holes. Each first connecting member correspondingly passes through each third connection hole, each second connection hole, and each first connection hole to connect the conducting member, the liquid cooling radiator, and the housing.

[0014] In a possible implementation manner, a plurality of heat dissipation teeth are provided on the surface of the conducting member close to the liquid cooling radiator.

[0015] In a possible implementation manner, the bus capacitor further includes a mounting member, which is arranged on a side of the housing facing away from the liquid-cooling radiator, and the mounting member is used to mount an inverter.

[0016] In a possible implementation manner, the mounting member has a plurality of heat dissipation air ducts.

[0017] In a possible implementation manner, the air inlet of the heat dissipation air duct is used to face the driving direction of the vehicle.

[0018] In a second aspect, an embodiment of the present application provides a motor controller, including a motor controller body and any bus capacitor provided in the first aspect connected to the motor controller body.

[0019] In a third aspect, an embodiment of the present application provides a vehicle, including a vehicle body and the motor controller provided in the second aspect arranged on the vehicle body.

[0020] The bus capacitor, motor controller and vehicle provided by the embodiments of the present application. The bus capacitor is provided with a housing and a capacitor body, and the capacitor body is arranged in the accommodation cavity of the housing. The housing can accommodate and protect the capacitor body; by providing a liquid-cooling radiator, the liquid-cooling radiator is arranged on one side of the housing, and the liquid-cooling radiator can cool the capacitor body. Moreover, compared with the related art in which the liquid-cooling water channels are arranged inside the housing, the liquid-cooling radiator in the embodiment of the present application is independently arranged relative to the housing and does not occupy the internal space of the housing, so that the housing can accommodate a capacitor body with a larger capacity; by providing a conduction member, the conduction member is arranged on a side of the liquid-cooling radiator facing away from the housing, and the conduction member is used to mount a power device, so that the liquid-cooling radiator can dissipate heat from the power device through the conduction member. Thus, the liquid-cooling radiator can simultaneously dissipate heat from the capacitor body and the power device located on its opposite sides. Description of the Drawings

[0021] The drawings here are incorporated into the description and form a part of this description, showing embodiments consistent with the present application, and are used together with the description to explain the principles of the embodiments of the present application.

[0022] Figure 1 It is a schematic structural diagram of the bus capacitor provided by the embodiment of the present application;

[0023] Figure 2 It is Figure 1 a schematic structural diagram of the connection between the housing, the capacitor body and the mounting member in

[0024] Figure 3 It is Figure 1 a schematic structural diagram of the liquid-cooling radiator in

[0025] Figure 4 It is Figure 1Schematic structural diagram of the conductive member therein.

[0026] Explanation of the reference numerals in the drawings:

[0027] 100 - housing; 110 - accommodation cavity; 120 - second side plate; 130 - first connection hole;

[0028] 200 - capacitor body;

[0029] 300 - liquid cooling heat dissipation member; 310 - liquid cooling cavity; 320 - liquid inlet; 330 - liquid outlet; 340 - first bottom plate; 350 - first side plate; 360 - boss; 370 - step surface; 380 - second connection hole; 390 - fourth connection hole;

[0030] 400 - conductive member; 410 - third connection hole; 420 - fifth connection hole; 430 - heat dissipation teeth;

[0031] 500 - mounting member; 510 - heat dissipation air duct.

[0032] For the convenience of understanding the solution of the embodiments of the present application, the spline curves and arrows used for the reference numerals in the drawings are hereby explained: For the components indicated by the spline curves without arrows, they are solid components, that is, components with solid structures; for the components indicated by the spline curves with arrows, they are virtual components, that is, components without solid structures.

[0033] Through the above drawings, the clear embodiments of the present application have been shown, and there will be more detailed descriptions hereinafter. These drawings and text descriptions are not intended to limit the scope of the concept of the embodiments of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. Detailed implementation manners

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0035] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. In the description of the embodiments of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. (if any) is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of the present application. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising..." does not exclude the existence of additional identical elements in the process, method, article or device comprising such element. If there is no conflict, the embodiments of the present application and the various features in the embodiments may be combined with each other, and all are within the protection scope of the present application.

[0036] A bus capacitor is a capacitor designed specifically for DC circuits, used to store charge and smooth the DC power supply. Bus capacitors are usually composed of large-capacity electrolytic capacitors, with relatively high capacitance values and rated voltages. The bus capacitor is connected to the DC bus and can play the role of energy storage and filtering in the circuit.

[0037] The related art provides a bus capacitor, including a housing and a capacitor disposed inside the housing. A liquid cooling channel is provided inside the housing to dissipate heat from the capacitor inside the housing.

[0038] However, the liquid cooling channel is disposed inside the housing, which will occupy the internal space of the housing, resulting in a limited capacity of the capacitor that the housing can accommodate.

[0039] In view of the above technical problems, the embodiments of the present application provide a bus capacitor. Figure 1 It is a schematic structural diagram of the bus capacitor provided by the embodiments of the present application.

[0040] Specifically, please refer to Figure 1, the busbar capacitor includes: a housing 100 with a receiving cavity 110 therein; a capacitor body 200 disposed in the receiving cavity 110; a liquid cooling radiator 300 disposed on one side of the housing 100; and a conductive member 400 disposed on the side of the liquid cooling radiator 300 away from the housing 100, and the conductive member 400 is used for mounting a power device.

[0041] For the busbar capacitor provided by the embodiment of the present application, by providing the housing 100 and the capacitor body 200, with the capacitor body 200 disposed in the receiving cavity 110 of the housing 100, the housing 100 can accommodate the capacitor body 200, and moreover, the housing 100 can provide physical protection for the capacitor body 200 to prevent external physical impacts and environmental factors (such as moisture, dust, etc.) from affecting the capacitor body 200, thereby improving the service life of the capacitor body 200.

[0042] By providing the liquid cooling radiator 300 disposed on one side of the housing 100, the liquid cooling radiator 300 can cool the capacitor body 200, and moreover, compared with the related art where the liquid cooling water channels are disposed inside the housing 100, the liquid cooling radiator 300 in the embodiment of the present application is independently disposed relative to the housing 100 and does not occupy the internal space of the housing 100, enabling the housing 100 to accommodate a capacitor body 200 with a larger capacity.

[0043] By providing the conductive member 400 disposed on the side of the liquid cooling radiator 300 away from the housing 100, and the conductive member 400 being used for mounting a power device, the liquid cooling radiator 300 can dissipate heat from the power device through the conductive member 400. Thus, the liquid cooling radiator 300 can simultaneously dissipate heat from the capacitor body 200 and the power device located on its opposite sides.

[0044] It should be noted that the embodiments of the present application do not limit the specific structures of the housing 100, the liquid cooling radiator 300, and the conductive member 400, which can be adjusted according to specific requirements. Exemplarily, the housing 100, the liquid cooling radiator 300, and the conductive member 400 are all cylindrical, quadrilateral, or hexagonal, which results in a relatively large internal space for the housing 100, the liquid cooling radiator 300, and the conductive member 400.

[0045] The following describes the preferred technical solutions of the busbar capacitor according to the embodiments of the present application with reference to the accompanying drawings, where Figure 2 is a schematic structural diagram of the connection between the housing, the capacitor body, and the mounting member in the busbar capacitor, Figure 3 is a schematic structural diagram of the liquid cooling radiator in the busbar capacitor, Figure 4 is a schematic structural diagram of the conductive member in the busbar capacitor.

[0046] In a possible implementation manner, please refer to Figure 3The liquid-cooled heat sink 300 has a liquid cooling cavity 310 for accommodating a cooling medium. The liquid-cooled heat sink 300 has a liquid inlet 320 and a liquid outlet 330 connected to the liquid cooling cavity 310. The liquid inlet 320 is used for the cooling medium to enter the liquid cooling cavity 310, and the liquid outlet 330 is used for the cooling medium to flow out of the liquid cooling cavity 310.

[0047] In this embodiment, by providing a liquid inlet 320, a liquid cooling cavity 310 and a liquid outlet 330 that are interconnected, when the heat generated by the power device and the heat generated by the capacitor body 200 are conducted to the liquid cooling heat sink 300, the cooling medium that continuously flows into the liquid cooling cavity 310 can continuously obtain the heat generated by the power device and the heat generated by the capacitor body 200, and the cooling medium after obtaining the heat can be discharged through the liquid outlet 330, thereby achieving heat dissipation of the capacitor body 200 and the power device.

[0048] For some specific implementations, see Figure 3 The liquid-cooled heat sink 300 includes a first bottom plate 340 and a plurality of first side plates 350 connected end to end, the plurality of first side plates 350 are all arranged on the first bottom plate 340, the first bottom plate 340 and the first side plates 350 together form a liquid cooling chamber 310, the liquid inlet 320 can be arranged on at least one of the plurality of first side plates 350, and the liquid outlet 330 can also be arranged on one of the plurality of first side plates 350.

[0049] In this embodiment, if the liquid inlet 320 and the liquid outlet 330 are respectively arranged on the two first side plates 350, and the two first side plates 350 are arranged opposite to each other, the flow direction of the cooling medium can be followed, so that the fluidity of the cooling medium is better, thereby making the heat dissipation effect of the cooling medium better.

[0050] It should be noted that this embodiment does not limit the number of liquid inlets 320 and liquid outlets 330, and can be adjusted according to specific needs. It is understandable that the more the number of liquid inlets 320 and liquid outlets 330, the more cooling medium can be introduced, so that the cooling medium can take away more heat, thereby improving the heat dissipation effect of the liquid-cooled heat sink 300.

[0051] For other specific implementations, see Figure 3 The liquid cooling heat sink 300 has a boss 360 , and the boss 360 is embedded in the accommodating cavity 110 .

[0052] In a specific implementation, the boss 360 can be provided on the first bottom plate 340 of the liquid cooling heat sink 300, and the boss 360 protrudes along the first bottom plate 340 toward the capacitor body 200. In this embodiment, by providing the boss 360, the boss 360 is closer to the capacitor body 200, and it is easier to obtain the heat of the capacitor body 200.

[0053] Further, please refer to Figure 2 and Figure 3 , a stepped surface 370 is formed between the boss 360 and the first bottom plate 340; the housing 100 includes a plurality of second side plates 120 connected end to end, and the plurality of second side plates 120 together enclose a receiving cavity 110. The stepped surface 370 matches the plurality of second side plates 120, and the housing 100 can limit the horizontal displacement of the liquid cooling radiator 300. Moreover, the boss 360 is embedded in the receiving cavity 110, and the boss 360 can serve as a cover of the housing 100 to make the receiving cavity 110 form a closed structure, so as to ensure that the capacitor body 200 is arranged in a closed space.

[0054] In some embodiments, please refer to Figures 1 to 3 , the bus capacitor further includes at least two first connectors (not shown). The housing 100 has at least two first connection holes 130, and the liquid cooling radiator 300 has at least two second connection holes 380. Each first connector correspondingly passes through each second connection hole 380 and each first connection hole 130 to connect the liquid cooling radiator 300 and the housing 100.

[0055] In a specific implementation, the first connection holes 130 are spaced apart and evenly distributed on the second side plates 120, and the second connection holes 380 are spaced apart and evenly distributed on the first side plates 350, so that the connection stability between the liquid cooling radiator 300 and the housing 100 is better.

[0056] It should be noted that the embodiments of the present application do not limit the specific types of the first connectors, the first connection holes 130 and the second connection holes 380, which can be adjusted according to specific requirements. Exemplarily, the first connectors are screws, rivets or bolt assemblies. Correspondingly, the first connection holes 130 and the second connection holes 380 are threaded holes or through holes.

[0057] Further, please refer to Figures 1 to 4 , the conducting member 400 has at least two third connection holes 410. Each first connector correspondingly passes through each third connection hole 410, each second connection hole 380 and each first connection hole 130 to connect the conducting member 400, the liquid cooling radiator 300 and the housing 100.

[0058] In a specific implementation, the third connection holes 410 are arranged along the circumferential direction of the conducting member 400 at square intervals and evenly on the conducting member 400, so that the connection stability between the conducting member 400, the liquid cooling radiator 300 and the housing 100 is better.

[0059] Still further, please refer to Figure 1 , Figure 3 and Figure 4The bus capacitor also includes at least two second connecting members (not shown), the liquid-cooled heat sink 300 has at least two fourth connecting holes 390, and the conductive member 400 has at least two fifth connecting holes 420. Each second connecting member passes through each fourth connecting hole 390 and each fourth connecting hole 390 to connect the conductive member 400 with the liquid-cooled heat sink 300.

[0060] In this embodiment, the fourth connection holes 390 are evenly and spaced apart on one of the first side plates 350 of the liquid-cooled heat sink 300 , which can further enhance the stability of the connection between the liquid-cooled heat sink 300 and the conductive element 400 .

[0061] It should be noted that the copper bar group of the capacitor body 200 needs to be led out from one of the second side plates 120 of the shell 100. The second side plate 120 is difficult to connect with the conductive part 400 and the liquid-cooled heat sink 300, so it is only necessary to connect the liquid-cooled heat sink 300 and the conductive part 400.

[0062] In other embodiments, see Figure 4 A plurality of heat dissipation teeth 430 are provided on a surface of the conductive element 400 close to the liquid cooling heat sink 300 .

[0063] In this embodiment, the conductive member 400 can be used as a cover for the liquid cooling cavity 310 of the liquid cooling heat sink 300, whereby the plurality of heat dissipation teeth 430 on the conductive member 400 can be located in the liquid cooling cavity 310, and the cooling medium in the liquid cooling cavity 310 can contact the plurality of heat dissipation teeth 430. In this case, the plurality of heat dissipation teeth 430 can increase the contact area between the conductive member 400 and the cooling medium in the liquid cooling cavity 310, and when the heat generated by the power device is transferred to the conductive member 400, the cooling medium can obtain more heat, thereby improving the heat dissipation efficiency of the power device.

[0064] It should be noted that the present embodiment does not limit the specific structure of the heat dissipation teeth 430, as long as the contact area between the conductive member 400 and the cooling medium can be increased. Exemplarily, the heat dissipation teeth 430 are conical, cylindrical or sawtooth-shaped.

[0065] In some other embodiments, see Figure 1 and Figure 2 The bus capacitor further includes a mounting member 500 , which is disposed on a side of the housing 100 away from the liquid cooling heat sink 300 , and is used to mount the inverter.

[0066] In this embodiment, the inverter is a power electronic device for converting direct current into alternating current. By arranging the mounting member 500 on the side of the housing 100 away from the liquid-cooled heat sink 300, the inverter can be stacked on the housing 100 in the vertical direction to improve the integration of the bus capacitor in the vertical direction.

[0067] It can be understood that the power device, the conduction member 400, the liquid-cooled radiator, the mounting member 500, and the inverter are all stacked on the housing 100 in the vertical direction, which can greatly improve the integration degree of the bus capacitor in the vertical direction.

[0068] In a specific implementation, the mounting member 500 is directly connected to a plurality of second side plates 120 of the housing 100. The mounting member 500 and the plurality of second side plates 120 together enclose a receiving cavity 110. The mounting member 500 can serve as a cover for the receiving cavity 110 so that the receiving cavity 110 forms a closed structure, ensuring that the capacitor body 200 is disposed in a closed space.

[0069] It should be noted that the present application does not limit the specific connection manner between the mounting member 500 and the housing 100, which can be adjusted according to specific requirements. Exemplarily, the mounting member 500 is welded, screwed, or riveted to the housing 100.

[0070] In some other embodiments (not illustrated in this embodiment), the mounting member 500 further includes a second bottom plate. The second bottom plate is connected to a plurality of second side plates 120 of the housing 100. The second bottom plate and the plurality of second side plates 120 together enclose the receiving cavity 110, and the mounting member 500 is connected to the second bottom plate. By providing the second bottom plate, the area of the second bottom plate is relatively large, which is convenient for connecting the mounting member 500.

[0071] Further, please refer to Figure 2 , the mounting member 500 is provided with a plurality of heat dissipation air ducts 510.

[0072] By providing the heat dissipation air ducts 510, when the heat generated by the capacitor body 200 is conducted to the heat dissipation air ducts 510, the air flows in the heat dissipation air ducts 510, and the heat generated by the capacitor body 200 can be taken away to achieve heat dissipation of the capacitor body 200.

[0073] In the embodiment of the present application, by providing the liquid-cooled heat dissipation member 300 and the mounting member 500 having the heat dissipation air ducts 510, the liquid-cooled heat dissipation member 300 and the mounting member 500 can simultaneously dissipate heat from both opposite sides of the capacitor body 200, and the heat dissipation efficiency is relatively high.

[0074] It should be noted that the present embodiment does not limit the specific structure of the heat dissipation air ducts 510, as long as the capacitor body 200 can be air-cooled. Exemplarily, the heat dissipation air ducts 510 are in a straight line or a curve.

[0075] Furthermore, the air inlet of the heat dissipation air duct 510 is used to face the driving direction of the vehicle.

[0076] When the vehicle is running, relatively strong airflows will be generated. Orienting the air inlet of the heat dissipation air duct 510 towards the running direction of the vehicle can utilize these natural airflows to enhance the heat dissipation effect of the mounting member 500. The airflows enter the heat dissipation air duct 510 through the air inlet, which helps to carry away the heat on the mounting member 500 more quickly.

[0077] An embodiment of the present application further provides a motor controller, which includes a motor controller body and any one of the foregoing bus capacitors connected to the motor controller body.

[0078] Specifically, all the technical solutions of any one of the foregoing bus capacitors are adopted in the motor controller of this embodiment. Therefore, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated one by one here.

[0079] An embodiment of the present application further provides a vehicle, which includes a vehicle body and the foregoing motor controller disposed on the vehicle body.

[0080] Specifically, all the technical solutions of the foregoing motor controller are adopted in the vehicle of this embodiment. Therefore, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated one by one here.

[0081] It should be understood that the embodiments of the present application are not limited to the precise structures already described and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.

Claims

1. A busbar capacitor, characterized in that: include: A housing (100), wherein the housing (100) has a receiving cavity (110); A capacitor body (200), the capacitor body (200) being arranged in the accommodating cavity (110); A liquid-cooling heat sink (300), wherein the liquid-cooling heat sink (300) is arranged on one side of the housing (100); A conductive member (400) is arranged on a side of the liquid-cooled heat sink (300) that is away from the housing (100), and the conductive member (400) is used to install a power device.

2. The bus capacitor according to claim 1, characterized in that: The liquid-cooled heat sink (300) has a liquid cooling cavity (310) for accommodating a cooling medium, and the liquid-cooled heat sink (300) has a liquid inlet (320) and a liquid outlet (330) connected to the liquid cooling cavity (310), the liquid inlet (320) is used for allowing the cooling medium to enter the liquid cooling cavity (310), and the liquid outlet (330) is used for allowing the cooling medium to flow out of the liquid cooling cavity (310).

3. The bus capacitor according to claim 2, characterized in that: The liquid-cooling heat sink (300) has a boss (360), and the boss (360) is embedded in the accommodating cavity (110).

4. The bus capacitor according to claim 1, characterized in that: The invention also includes at least two first connecting members, the shell (100) has at least two first connecting holes (130), the liquid-cooled heat sink (300) has at least two second connecting holes (380), and the conductive member (400) has at least two third connecting holes (410), and each of the first connecting members passes through each of the third connecting holes (410), each of the second connecting holes (380) and each of the first connecting holes (130) to connect the conductive member (400), the liquid-cooled heat sink (300) and the shell (100).

5. The bus capacitor according to any one of claims 1 to 4, characterized in that: The conductive element (400) has a plurality of heat dissipation teeth (430) on one surface close to the liquid-cooled heat dissipation element (300).

6. The bus capacitor according to any one of claims 1 to 4, characterized in that: It also includes a mounting member (500), the mounting member (500) being arranged on a side of the housing (100) away from the liquid-cooled heat sink (300), and the mounting member (500) being used for mounting an inverter.

7. The bus capacitor according to claim 6, characterized in that: The mounting member (500) is provided with a plurality of heat dissipation ducts (510).

8. The bus capacitor according to claim 7, characterized in that: The air inlet of the heat dissipation air duct (510) is used to face the driving direction of the vehicle.

9. A motor controller, characterized in that: It comprises a motor controller body and a bus capacitor as described in any one of claims 1 to 8 connected to the motor controller body.

10. A vehicle, characterized in that: The vehicle comprises a vehicle body and the motor controller according to claim 9 arranged on the vehicle body.

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