Radio frequency circuit and electronic equipment

Abstract

The utility model relates to a radio frequency circuit and electronic equipment. The radio frequency circuit comprises an independent networking transceiver, a first power amplification module and a first power supply module. The first power amplification module is connected with the independent networking transceiver and is configured to perform power amplification on a first radio frequency signal output by the independent networking transceiver; and the first power supply module is connected with the first power amplification module and is configured to supply power to at least two power amplifiers of the first power amplification module. According to the embodiment of the invention, the circuit integration level can be improved, and the radio frequency circuit cost is reduced.

Description

Technical Field

[0001] The present disclosure relates to the field of mobile consumer electronics, and in particular to a radio frequency circuit and electronic equipment. Background Art

[0002] With the development of technology, electronic devices have become increasingly widely used. Currently, the radio frequency circuits of electronic devices support the simultaneous transmission of radio frequency signals in multiple frequency bands. When operating RF signals in different frequency bands, such as fourth-generation (4G) and fifth-generation (5G) mobile communication technology signals, independent power supply networks are required. This poses the problem of circuit boards being incompatible with power supplies from different networks. Summary of the Invention

[0003] To overcome the problems existing in the related art, the present disclosure provides a radio frequency circuit and an electronic device, which can improve circuit integration and reduce the cost of the radio frequency circuit.

[0004] According to a first aspect of an embodiment of the present disclosure, there is provided a radio frequency circuit, comprising: a standalone networking transceiver, a first power amplifier module, and a first power supply module;

[0005] The first power amplification module is connected to the independent networking transceiver and is configured to power amplify the first radio frequency signal output by the independent networking transceiver;

[0006] The first power supply module is connected to the first power amplification module and is configured to supply power to at least two power amplifiers of the first power amplification module.

[0007] In some embodiments, the radio frequency circuit further includes a resistance module;

[0008] The first power supply module is connected to the at least two power amplifiers of the first power amplifier module respectively through the resistance module.

[0009] In some embodiments, the at least two power amplifiers of the first power amplification module include a first power amplifier and a second power amplifier;

[0010] The first power amplifier and the second power amplifier are both connected to the independent networking transceiver and the first power module, and are configured to power amplify the first radio frequency signals of different frequency bands;

[0011] The resistance module is connected to the first power supply module, the first power amplifier and the second power amplifier respectively.

[0012] In some embodiments, the resistance module includes:

[0013] a first resistance module, connected to a connection line between the first power module and the second power amplifier;

[0014] The second resistance module is connected to the first resistance module and the first power amplifier respectively.

[0015] In some embodiments, the first resistance module includes at least a zero-ohm resistor; and / or the second resistance module includes at least a zero-ohm resistor.

[0016] In some embodiments, the operating voltages of at least two power amplifiers of the first power amplification module are both within the power supply voltage range output by the first power supply module.

[0017] In some embodiments, the radio frequency circuit includes:

[0018] Non-standalone networking transceiver;

[0019] A second power amplification module, connected to the non-standalone networking transceiver, configured to power amplify the second radio frequency signal output by the non-standalone networking transceiver;

[0020] a second power supply module, both connected to the second power amplifier module and the first power supply module;

[0021] The second power supply module and the first power supply module are configured to respectively supply power to different power amplifiers of the second power amplifier module.

[0022] In some embodiments, the different power amplifiers of the second power amplification module include:

[0023] A third power amplifier and a fourth power amplifier are both connected to the non-standalone networking transceiver and the second power supply module, and are configured to respectively power amplify different second radio frequency signals of the first frequency band;

[0024] a fifth power amplifier, connected to the non-standalone networking transceiver and the first power module, and configured to power amplify the second radio frequency signal in the second frequency band;

[0025] The center frequency of the first frequency band is greater than the center frequency of the second frequency band.

[0026] In some embodiments, the first resistance module of the radio frequency circuit is connected to the connection line between the first power module and the fifth power amplifier.

[0027] According to a second aspect of an embodiment of the present disclosure, there is provided an electronic device, including:

[0028] Circuit boards and antenna radiators;

[0029] The radio frequency circuit as described in the first aspect above;

[0030] The radio frequency circuit is arranged on the circuit board and connected to the antenna radiator, and is configured to excite the antenna radiator to be in a working state.

[0031] In some embodiments, the circuit board has a first welding area, a second welding area, and a third welding area;

[0032] The first welding area is used for welding the first power module of the radio frequency circuit in the case of independent networking; and for welding the second power module of the radio frequency circuit and the first power module in the case of non-independent networking;

[0033] The second welding area is used for welding the first power amplifier module of the radio frequency circuit in the case of the independent networking; and for welding the second power amplifier module of the radio frequency circuit in the case of the non-independent networking;

[0034] The third welding area is used for welding the first resistance module and the second resistance module of the radio frequency circuit in the case of the independent networking; and for welding the first resistance module in the case of the non-independent networking.

[0035] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0036] The first power supply module in the RF circuit of the disclosed embodiment can be connected to the first power amplifier module and supply power to at least two power amplifiers of the first power amplifier module. In other words, when SA is compatible, the first power supply module provided in the RF circuit of the disclosed embodiment can independently provide power, eliminating the need for two power supply modules. This can improve circuit integration and reduce RF circuit costs.

[0037] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0039] Figure 1 This is a schematic diagram of a radio frequency circuit structure in an independent network according to an exemplary embodiment. Figure 1 .

[0040] Figure 2 This is a schematic diagram of a radio frequency circuit structure in an independent network according to an exemplary embodiment. Figure 2 .

[0041] Figure 3 This is a schematic diagram of a radio frequency circuit structure in a non-standalone network according to an exemplary embodiment. Figure 1 .

[0042] Figure 4 This is a schematic diagram of a radio frequency circuit structure in a non-standalone network according to an exemplary embodiment. Figure 2 .

[0043] Figure 5 The figure is a schematic diagram of a power supply structure in a non-standalone network and a standalone network according to an exemplary embodiment.

[0044] Figure 6 The figure is a structural block diagram of an electronic device according to an exemplary embodiment. DETAILED DESCRIPTION

[0045] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0046] With the development of radio frequency communications, electronic devices can support 4G and 5G dual-connectivity technology (EUTRA NR Dual-Connectivity, ENDC), thereby achieving faster and more stable data transmission by connecting to 4G and 5G networks at the same time. However, since the time slots and power levels required by the 4G and 5G networks are different, for example, the 4G network power class (Power Class, PC) is PC3, and the scheduling is in subframes; the 5G network power class is PC2, and the scheduling is in time slots. In 5G, a wireless frame still contains 10 subframes, each subframe is still 1ms, and is fixed, so that more users can be managed. Therefore, two sets of power modules are required to supply the power amplifier corresponding to the 4G network and the power amplifier corresponding to the 5G network respectively. When compatible with independent networking, the power amplifier corresponding to ENDC cannot be independently separated, and there is still a problem of low circuit integration.

[0047] To address the above problems, an embodiment of the present disclosure proposes a radio frequency circuit that can use a first power supply module to power at least two power amplifiers when compatible with independent networking, that is, there is no need to use two sets of power supplies, which can improve circuit integration.

[0048] Figure 1 FIG. 1 is a schematic diagram showing a structure of a radio frequency circuit according to an exemplary embodiment. Figure 1 As shown, the radio frequency circuit includes: an independent networking transceiver 101, a first power amplifier module 102 and a first power supply module 103;

[0049] The first power amplification module 102 is connected to the independent networking transceiver 101 and configured to power amplify the first radio frequency signal output by the independent networking transceiver 101;

[0050] The first power supply module 103 is connected to the first power amplification module 102 and is configured to supply power to at least two power amplifiers of the first power amplification module 102 .

[0051] In the disclosed embodiments, the RF circuit typically cooperates with the antenna radiator to stimulate the antenna radiator to transmit and receive wireless signals. For example, the RF circuit can stimulate the antenna radiator to transmit and receive 5G wireless signals to enable voice communication using the 5G network.

[0052] The standalone access (SA) transceiver is used for signal transmission and reception in SA mode. In SA mode, the 5G wireless network and the core network communicate directly through the 5G base station, enabling independent operation of the 5G network.

[0053] The first power amplification module is configured to amplify the power of the first radio frequency signal output by the standalone networking transceiver. In other words, the first power amplification module is suitable for power amplification in a standalone networking environment.

[0054] It should be noted that the first power amplification module may include at least two power amplifiers, and the at least two power amplifiers may be used to process power amplification of radio frequency signals in different frequency bands.

[0055] For example, the at least two power amplifiers of the first power amplifier module may include power amplifiers for processing the three frequency bands of the 5G network, namely, the N41 frequency band, the N79 frequency band, and the N78 frequency band. The N41 frequency band supports at least 2515MHz to 2675MHz; the N79 frequency band supports at least 4800MHz to 5000MHz; and the N41 frequency band supports at least 3400MHz to 3600MHz.

[0056] In the embodiment of the present disclosure, the first power supply module can be connected to at least two power amplifiers of the first power amplifier module through different connection modules, including but not limited to a resistance module or an inductance module.

[0057] In some embodiments, as Figure 1 As shown, the radio frequency circuit further includes a resistance module 104;

[0058] The first power supply module 103 is connected to at least two power amplifiers of the first power amplification module 102 respectively through the resistance module 104 .

[0059] That is, the embodiment of the present disclosure can realize the connection between the first power supply module and the at least two power amplifiers by providing a resistance module. For example, the resistance module is composed of at least a zero-ohm resistor, which is not limited in the embodiment of the present disclosure.

[0060] In the embodiment of the present disclosure, the first power supply module is used to supply power to at least two power amplifiers, so that the at least two power amplifiers can both transmit power at the power level of PC2.

[0061] Here, the power voltage output by the first power supply module can be boosted and then transmitted to the at least two power amplifiers of the first power amplification module, so that the at least two power amplifiers can both transmit at a power level of PC2. Of course, it is also possible to select a power amplifier within the power voltage range suitable for the output of the first power supply module, thereby achieving a power level of PC2 for the at least two power amplifiers by directly supplying power from the first power supply module without boosting.

[0062] It should be noted that the first power supply module can be connected to at least two power amplifiers of the first power amplification module, thereby enabling the first power supply module to supply power to the at least two power amplifiers. In other words, in the SA mode, the at least two power amplifiers of the first power amplification module can share the first power supply module to operate, thereby eliminating the need for a separate power supply on the basis of independent networking.

[0063] For example, in the related art, SA compatibility typically involves saving on conventional voltage power amplifiers. When a conventional voltage power amplifier operates in the 3.4V to 4.5V range and uses standalone networking mode, this conventional voltage power amplifier is no longer required. In other words, SA compatibility on a single circuit board doesn't address the need for two power modules for non-standalone networking; two power modules are still required to power different power amplifiers.

[0064] Based on this, embodiments of the present disclosure provide a radio frequency circuit in which a first power supply module is connected to a first power amplifier module and supplies power to at least two power amplifiers of the first power amplifier module. In other words, when SA is compatible, the first power supply module provided in the radio frequency circuit of the present disclosure embodiment can independently provide power, eliminating the need for two power supply modules. This improves circuit integration and reduces radio frequency circuit costs.

[0065] In some embodiments, as Figure 1 and Figure 2As shown, the at least two power amplifiers of the first power amplification module 102 include a first power amplifier 1021 and a second power amplifier 1022;

[0066] The first power amplifier 1021 and the second power amplifier 1022 are both connected to the independent networking transceiver 101 and the first power supply module 103, and are configured to power amplify the first radio frequency signals of different frequency bands;

[0067] The resistance module 104 is connected to the first power module 103 , the first power amplifier 1021 , and the second power amplifier 1022 , respectively.

[0068] In the disclosed embodiment, the first power amplifier and the second power amplifier can amplify first radio frequency signals in different frequency bands. That is, in the disclosed embodiment, in SA mode, the two power amplifiers can share a first power module. This means that the first power module enables the first power amplifier to transmit at a power level of PC2, and the second power amplifier to transmit at a power level of PC2.

[0069] For example, the first power amplifier can be used to power amplify the RF signal corresponding to the first sub-band in the 5G frequency band; the second power amplifier can be used to power amplify the RF signal corresponding to the second sub-band in the 5G frequency band; wherein the center frequency of the first sub-band is less than the center frequency of the second sub-band.

[0070] For another example, the first power amplifier can be used to power amplify RF signals in the 5G frequency band corresponding to sub6G. The second power amplifier can be used to power amplify RF signals in the 5G frequency band supported by PH5N; wherein PH5N supports 5G frequency bands and transmit / receive carrier aggregation (CA).

[0071] It can be understood that the embodiment of the present disclosure, by setting a resistance module connected to the first power supply module, the first power amplifier and the second power amplifier respectively, can achieve that the first power supply module can supply power to the first power amplifier and the second power amplifier through the resistance module, that is, the first power supply module can be shared in the scenario of two power amplifiers, and there is no need to set up two sets of power supply modules, which can improve circuit integration and reduce the cost of RF circuits.

[0072] In some embodiments, as Figure 1 and Figure 2 As shown, the resistance module 104 includes:

[0073] A first resistance module 1041 is connected to the connection line between the first power module 103 and the second power amplifier 1022;

[0074] The second resistance module 1042 is connected to the first resistance module 1041 and the first power amplifier 1021 respectively.

[0075] In the embodiment of the present disclosure, the first power supply module and the second power amplifier can be connected through the first resistor module, so that the first power supply module can supply power to the second power amplifier.

[0076] In some embodiments, the first resistor module includes at least a zero-ohm resistor.

[0077] It should be noted that the first resistance module may be composed of at least one zero-ohm resistor.

[0078] For example, the first resistance module includes two zero-ohm resistors, and the two zero-ohm resistors are connected in series on the connection line between the first power supply module and the second power amplifier.

[0079] In the disclosed embodiment, the second resistor module is connected to the first resistor module and the first power amplifier, respectively. The first resistor module is further connected to the first power module. Therefore, the disclosed embodiment, through the first resistor module and the second electronic module, enables the connection between the first power module and the second power amplifier, thereby enabling the first power module to supply power to the second power amplifier in addition to the first power amplifier.

[0080] In some embodiments, as Figure 2 As shown, the first resistance module 1041 includes at least a zero-ohm resistor; and / or the second resistance module 1042 includes at least a zero-ohm resistor.

[0081] It should be noted that both the first resistance module and the second resistance module can be composed of at least one zero-ohm resistor.

[0082] For example, the second resistance module includes a zero-ohm resistor, one end of the zero-ohm resistor is connected to the first resistance module, and the other end of the zero-ohm resistor is connected to the first power amplifier.

[0083] Here, when the first resistance module includes a plurality of zero-ohm resistors, the zero-ohm resistor included in the second resistance module may be connected to any one of the plurality of zero-ohm resistors included in the first resistance module.

[0084] It is understood that, in the disclosed embodiment, based on the provision of a first resistor module connected to the first power module and the second power amplifier, a second resistor module is provided to connect the first resistor module and the first power amplifier, thereby forming an independent power supply network consisting of the first power module, the second resistor module, the first power amplifier, the first resistor module, and the second power amplifier. In this independent power supply network, the first power module is simultaneously connected to the two power amplifiers, thereby enabling the first power module to supply power to both power amplifiers.

[0085] In some embodiments, as Figure 1 As shown, the operating voltages of at least two power amplifiers of the first power amplification module 102 are both within the power supply voltage range output by the first power supply module 103 .

[0086] In other words, the voltage output by the first power supply module can cause at least two power amplifiers of the first power amplifier module to transmit at a power level of PC2. This means that in the embodiment of the present disclosure, when the first power supply module drives the first power amplifier module to operate, conventional voltage boosting is not required. This means that, compared to the prior art, the embodiment of the present disclosure does not require a boost circuit, thereby simplifying the radio frequency circuit.

[0087] In some embodiments, as Figure 3 As shown, the radio frequency circuit includes:

[0088] Non-standalone networking transceiver 105;

[0089] A second power amplification module 106, connected to the non-standalone networking transceiver 105, configured to power amplify the second RF signal output by the non-standalone networking transceiver 105;

[0090] A second power supply module 107 and the first power supply module 103 are both connected to the second power amplification module 106;

[0091] The second power supply module 107 and the first power supply module 103 are configured to supply power to different power amplifiers of the second power amplification module 106 .

[0092] In the disclosed embodiment, the radio frequency circuit may also include a non-standalone access (NSA) transceiver for receiving and transmitting signals in NSA mode. In NSA mode, the 5G base station acts as an auxiliary connection point alongside the 4G base station, enabling electronic devices to connect to both 4G and 5G networks simultaneously.

[0093] The second power amplifier module may include a plurality of different power amplifiers for use in the NSA mode. The different power amplifiers for use in the NSA mode may be of two types, one for 4G networks and the other for 5G networks.

[0094] It is understandable that the second power module and the first power module are configured to respectively supply power to different power amplifiers of the second power amplifier module. In other words, by providing two power modules to provide power, communication in NSA mode can be achieved.

[0095] In some embodiments, as Figure 3 and Figure 4 As shown, the different power amplifiers of the second power amplification module 106 include:

[0096] A third power amplifier 1061 and a fourth power amplifier 1062 are both connected to the non-standalone networking transceiver 105 and the second power supply module 107, and are configured to respectively power-amplify different second radio frequency signals of the first frequency band;

[0097] a fifth power amplifier 1063 connected to the non-standalone networking transceiver 105 and the first power module 103, and configured to power amplify the second RF signal in the second frequency band;

[0098] The center frequency of the first frequency band is greater than the center frequency of the second frequency band.

[0099] In the embodiment of the present disclosure, Figure 4 As shown, there is no SMD second resistor module 1042 at the setting position of the second resistor module 1042 in the circuit board. Therefore, the first power module 103 and the second power module 107 are powered independently, and the networking between the first power module 103 and the second power module 107 is not connected through the second resistor module 1042.

[0100] It should be noted that the above-mentioned third power amplifier and the first power amplifier can be the same power amplifier, and can both be used to power amplify the radio frequency signal in the 5G frequency band corresponding to sub6G.

[0101] In the disclosed embodiment, the first frequency band may include a 5G frequency band. The third power amplifier and the fourth power amplifier may be used to power amplify different RF signals in the 5G frequency band. It should be noted that the third power amplifier may be used to power amplify RF signals corresponding to a first sub-band in the 5G frequency band; and the fourth power amplifier may be used to power amplify RF signals corresponding to a second sub-band in the 5G frequency band; wherein the center frequency of the first sub-band is less than the center frequency of the second sub-band.

[0102] For example, the first sub-frequency band may correspond to a low frequency band in the 5G frequency band, including at least: N1 or N28, etc., and the embodiments of the present disclosure are not limited to this.

[0103] The second sub-band may correspond to a mid-high frequency band in the 5G frequency band, including at least N38, N41, N77, or N78, etc., which is not limited in the present embodiment. Here, the second sub-band may be the 5G frequency band supported by PH5N-H.

[0104] Among them, N1 supports at least 1920MHz to 2170MHz; N28 supports at least 703MHz to 803MHz; N38 supports 2570MHz to 2620MHz.

[0105] In the embodiment of the present disclosure, the second frequency band may include a 4G frequency band. The fifth power amplifier may be used to power amplify radio frequency signals in the 4G frequency band. For example, the fifth power amplifier may be used to power amplify radio frequency signals in the 4G frequency band supported by the PH5N.

[0106] It should be noted that by using the second power module to power the third and fourth power amplifiers, the third and fourth power amplifiers can both transmit at a power level of PC2. By using the first power module to power the fifth power amplifier, the fifth power amplifier can both transmit at a power level of PC3.

[0107] In some embodiments, as Figure 4 As shown, the first resistance module 1041 of the radio frequency circuit is connected to the connection line between the first power module 103 and the fifth power amplifier 1063 .

[0108] That is to say, for both SA and NSA, the first resistance module can be used to implement the power supply connection of the first power module.

[0109] For example, the soldering area corresponding to the fifth power amplifier and the soldering area corresponding to the second power amplifier can both be the second soldering area of ​​the circuit board, and the soldering position corresponding to the first power module can be the first soldering area of ​​the circuit board. In this way, a third soldering area can be electrically connected between the first and second soldering areas, and the first resistor module can be soldered to this third soldering area.

[0110] In this way, the circuit board uses the first, second, and third soldering areas to perform SMD soldering of the first power module, first power amplifier, second power amplifier, second resistor module, and first resistor module in SA mode, and SMD soldering of the first and second power modules, fifth power amplifier, and first resistor module in NSA mode. This makes the circuit board compatible with both SA and NSA.

[0111] The present disclosure further provides an electronic device, comprising:

[0112] Circuit boards and antenna radiators;

[0113] A radio frequency circuit as provided in one or more of the above embodiments;

[0114] The radio frequency circuit is arranged on the circuit board and connected to the antenna radiator, and is configured to stimulate the antenna radiator to be in a working state.

[0115] The printed circuit board (PCB) can be used to carry various electronic components in electronic devices and provide circuit connections.

[0116] It should be noted that the circuit board may include a rigid circuit board (Rigid PCB) or a flexible circuit board (Flexible PCB, FPC), and the embodiments of the present disclosure are not limited to this.

[0117] The above-mentioned antenna radiator may include a radiator formed by a conductive middle frame of an electronic device, a radiator formed by a PCB, or a radiator formed by laser direct irradiation technology, and the embodiments of the present disclosure are not limited to this.

[0118] It should be noted that the antenna radiator is in a working state, including the working state when the antenna radiator transmits signals outward, and also includes the state when the antenna radiator receives signals.

[0119] The electronic device of the disclosed embodiment includes the radio frequency circuit proposed in one or more of the aforementioned embodiments. The first power supply module in the radio frequency circuit is capable of connecting to at least two power amplifiers of the first power amplifier module, thereby enabling power supply to the at least two power amplifiers. In other words, when SA is compatible, the first power supply module provided in the radio frequency circuit of the disclosed embodiment can independently provide power, eliminating the need for two power supply modules. This can improve circuit integration and reduce radio frequency circuit costs.

[0120] In some embodiments, as Figure 1 、 Figure 3 and Figure 5 As shown, the circuit board has a first welding area A, a second welding area B and a third welding area C;

[0121] The first welding area A is used for welding the first power module 103 of the radio frequency circuit in the case of an independent network; and for welding the second power module 107 of the radio frequency circuit and the first power module 103 in the case of a non-independent network;

[0122] The second welding area B is used for welding the first power amplifier module 102 of the radio frequency circuit in the case of the independent networking; and for welding the second power amplifier module 106 of the radio frequency circuit in the case of the non-independent networking;

[0123] The third welding area C is used for welding the first resistance module 1041 and the second resistance module 1042 of the RF circuit in the case of the independent networking; and for welding the first resistance module 1041 in the case of the non-independent networking.

[0124] In the embodiment of the present disclosure, Figure 5 As shown, when the circuit board needs to be SA-compatible, the first power module 103 can be soldered to the first soldering area A; the first power amplifier 1021 and the second power amplifier 1022 of the first power amplification module 102 can be soldered to the second soldering area B; and the first resistor module 1041 and the second resistor module 1042 can be soldered to the third soldering area C. In this case, the first power module can supply power to the first power amplifier and the second power amplifier through the SA power supply line.

[0125] like Figure 4 and Figure 5 As shown, when the circuit board needs to be compatible with the NSA mode, the first power supply module 103 and the second power supply module 107 can be set to be soldered to the first welding area A; the third power amplifier 1061, the fourth power amplifier 1062 and the fifth power amplifier 1063 are all soldered to the second welding area B; the first resistor module 1041 is soldered to the third welding area C.

[0126] Here, when compatible with SA, the soldering position of the first power amplifier 1021 can be used to solder the third power amplifier 1061. When the first power amplifier 1021 and the third power amplifier 1061 are the same amplifier, the first power amplifier 1021 can be unchanged when compatible with NSA. In addition, when compatible with NSA, the soldering position of the second resistor module 1042 is vacant, and the first power module 103 and the second power module 107 are connected through the NSA power supply line (such as Figure 5 The thick solid line in the middle realizes the power supply of non-independent networking respectively.

[0127] It should be noted that, compared with NSA, the embodiment of the present disclosure does not require the setting of a second power supply module when being compatible with SA on the circuit board, and can also reduce the setting of a power amplifier such as a fourth power amplifier. Therefore, during production, for the second power supply module and an amplifier that do not need to be set up, there is no need to perform surface mounting technology (SMT) patching.

[0128] In the embodiment of the present disclosure, the second welding area has a first welding position, a second welding position and a third welding position; the third welding area has a fourth welding position and a fifth welding position;

[0129] a fourth welding position electrically connecting the first welding position, the second welding position, the fifth welding position, and the welding position where the second power module is set in the first welding area;

[0130] The fifth welding position is electrically connected to the third welding position and the welding position where the first power module is set in the first welding area.

[0131] When the circuit board is NSA-compatible, leave the fourth soldering position empty, solder the first resistor module to the fifth soldering position, solder the third power amplifier to the first soldering position, the fourth power amplifier to the second soldering position, and the fifth power amplifier to the third soldering position. This way, both the first and second power modules require power when NSA-compatible.

[0132] When the circuit board is compatible with SA, the second resistor module is soldered to the fourth soldering position, the first resistor module is soldered to the fifth soldering position, the first power amplifier is soldered to the first soldering position, and the second power amplifier is soldered to the third soldering position. In this way, the first power module can electrically connect the first power amplifier and the second power amplifier, and can independently provide power. Here, when the circuit board is compatible with SA, the second soldering position for soldering the fourth power amplifier and the soldering position for soldering the second power module are both vacant, and no SMT placement is required.

[0133] It is understood that the circuit board of the disclosed embodiment is compatible with both SA and NSA. When compatible with SA, a second resistor module is required in the third welding area to connect the first power module to the first power amplifier and the second power amplifier. Thus, when compatible with SA, the disclosed embodiment does not require a second power module, which improves circuit integration and reduces RF circuit costs.

[0134] Figure 6 6 is a block diagram of an electronic device according to an exemplary embodiment. For example, the electronic device 600 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0135] Reference Figure 6 , the electronic device 600 may include one or more of the following components: a processing component 602 , a memory 604 , a power component 606 , a multimedia component 608 , an audio component 610 , an input / output (I / O) interface 612 , a sensor component 614 , and a communication component 616 .

[0136] The processing component 602 generally controls the overall operation of the electronic device 600, such as operations associated with at least one of display, phone calls, data communications, camera operation, and recording operations. The processing component 602 may include one or more processors 620 to execute instructions to perform all or part of the steps of the above-described method. In addition, the processing component 602 may include one or more modules to facilitate interaction between the processing component 602 and other components. For example, the processing component 602 may include a multimedia module to facilitate interaction between the multimedia component 608 and the processing component 602.

[0137] The memory 604 is configured to store various types of data to support operations on the electronic device 600. Examples of such data include at least one of the following: instructions for any application or method operating on the electronic device 600, contact data, phone book data, messages, pictures, and videos. The memory 604 can be implemented by any type of volatile or non-volatile storage device, or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk, or optical disk.

[0138] The power supply component 606 provides power to various components of the electronic device 600. The power supply component 606 may include at least one of the following: a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the electronic device 600.

[0139] The multimedia component 608 includes a screen that provides an output interface between the electronic device 600 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, slides, and gestures on the touch panel. The touch sensor can not only sense the boundaries of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 608 includes a front camera and / or a rear camera. When the electronic device 600 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera can receive external multimedia data. Each front camera and rear camera can be a fixed optical lens system or have focal length and optical zoom capabilities.

[0140] The audio component 610 is configured to output and / or input audio signals. For example, the audio component 610 includes a microphone (MIC), which is configured to receive external audio signals when the electronic device 600 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in the memory 604 or transmitted via the communication component 616. In some embodiments, the audio component 610 also includes a speaker for outputting audio signals.

[0141] I / O interface 612 provides an interface between processing component 602 and peripheral interface modules, such as a keyboard, click wheel, and buttons. These buttons may include, but are not limited to, a home button, volume buttons, a start button, and a lock button.

[0142] The sensor assembly 614 includes one or more sensors for providing various aspects of the status assessment of the electronic device 600. For example, the sensor assembly 614 can detect the open / closed state of the electronic device 600, the relative positioning of components, such as the display and keypad of the electronic device 600. The sensor assembly 614 can also detect changes in the position of the electronic device 600 or a component thereof, the presence or absence of user contact with the electronic device 600, the orientation or acceleration / deceleration of the electronic device 600, and changes in the temperature of the electronic device 600. The sensor assembly 614 can include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 614 can also include an optical sensor, such as a complementary metal oxide semiconductor (CMOS) or charge coupled device (CCD) image sensor, for use in imaging applications. In some embodiments, the sensor assembly 614 can also include, but is not limited to, at least one of the following: an accelerometer, a gyroscope, a magnetic sensor, a pressure sensor, and a temperature sensor.

[0143] The communication component 616 is configured to facilitate communication between the electronic device 600 and other devices in a wired or wireless manner. The electronic device 600 can access a wireless network based on a communication standard, such as Wi-Fi, 4G, 5G, or a combination thereof. In an exemplary embodiment, the communication component 616 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 616 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0144] In an exemplary embodiment, the electronic device 600 may be implemented by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0145] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is further provided, such as a memory 604 including executable instructions or a computer program. The instructions or computer program can be executed by a processor 620 of the electronic device 600 to perform the above method. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a compact disc read-only memory (CD-ROM), a magnetic tape, a floppy disk, an optical data storage device, etc.

[0146] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the claims.

[0147] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A radio frequency circuit, characterized in that: include: An independent networking transceiver, a first power amplifier module and a first power supply module; The first power amplification module is connected to the independent networking transceiver and is configured to power amplify the first radio frequency signal output by the independent networking transceiver; The first power supply module is connected to the first power amplification module and is configured to supply power to at least two power amplifiers of the first power amplification module.

2. The radio frequency circuit according to claim 1, wherein: The radio frequency circuit further includes a resistance module; The first power supply module is connected to the at least two power amplifiers of the first power amplifier module respectively through the resistance module.

3. The radio frequency circuit according to claim 2, characterized in that: The at least two power amplifiers of the first power amplification module include a first power amplifier and a second power amplifier; The first power amplifier and the second power amplifier are both connected to the independent networking transceiver and the first power module, and are configured to power amplify the first radio frequency signals of different frequency bands; The resistance module is connected to the first power supply module, the first power amplifier and the second power amplifier respectively.

4. The radio frequency circuit according to claim 3, characterized in that: The resistance module includes: a first resistance module, connected to a connection line between the first power module and the second power amplifier; The second resistance module is connected to the first resistance module and the first power amplifier respectively.

5. The radio frequency circuit according to claim 4, characterized in that: The first resistance module includes at least a zero-ohm resistor; and / or the second resistance module includes at least a zero-ohm resistor.

6. The radio frequency circuit according to any one of claims 1 to 5, characterized in that: The operating voltages of at least two power amplifiers of the first power amplification module are both within the power supply voltage range output by the first power supply module.

7. The radio frequency circuit according to any one of claims 1 to 5, characterized in that: The radio frequency circuit includes: Non-standalone networking transceiver; A second power amplification module, connected to the non-standalone networking transceiver, configured to power amplify the second radio frequency signal output by the non-standalone networking transceiver; a second power supply module, both connected to the second power amplifier module and the first power supply module; The second power supply module and the first power supply module are configured to respectively supply power to different power amplifiers of the second power amplifier module.

8. The radio frequency circuit according to claim 7, characterized in that: The different power amplifiers of the second power amplification module include: A third power amplifier and a fourth power amplifier are both connected to the non-standalone networking transceiver and the second power supply module, and are configured to respectively power amplify different second radio frequency signals of the first frequency band; a fifth power amplifier, connected to the non-standalone networking transceiver and the first power module, and configured to power amplify the second radio frequency signal in the second frequency band; The center frequency of the first frequency band is greater than the center frequency of the second frequency band.

9. The radio frequency circuit according to claim 8, characterized in that: The first resistance module of the radio frequency circuit is connected to the connection line between the first power module and the fifth power amplifier.

10. An electronic device, characterized in that: include: Circuit boards and antenna radiators; The radio frequency circuit according to any one of claims 1 to 9; The radio frequency circuit is arranged on the circuit board and connected to the antenna radiator, and is configured to excite the antenna radiator to be in a working state.

11. The electronic device according to claim 10, characterized in that: The circuit board has a first welding area, a second welding area and a third welding area; The first welding area is used for welding the first power module of the radio frequency circuit in the case of independent networking; and for welding the second power module of the radio frequency circuit and the first power module in the case of non-independent networking; The second welding area is used for welding the first power amplifier module of the radio frequency circuit in the case of the independent networking; and for welding the second power amplifier module of the radio frequency circuit in the case of the non-independent networking; The third welding area is used for welding the first resistance module and the second resistance module of the radio frequency circuit in the case of the independent networking; and for welding the first resistance module in the case of the non-independent networking.

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