Current sampling device based on GMR sensor

Abstract

The utility model discloses a current sampling device based on GMR sensors. The current sampling device comprises an injection molding part, a U-phase silicon steel sheet shielding case, a V-phase silicon steel sheet shielding case, a W-phase silicon steel sheet shielding case, a U-phase copper bar, a V-phase copper bar, a W-phase copper bar, a U-phase GMR sensor, a V-phase GMR sensor, a W-phase GMR sensor and a PCB. The lower surface, the left side surface and the right side surface of the U / V / W phase copper bar are respectively kept at a distance of more than 1mm from the U / V / W phase silicon steel sheet shielding case, the upper surface of the U / V / W phase copper bar is respectively kept at a distance of less than 10mm from the lower surface of the U / V / W phase GMR sensor, the U / V / W phase GMR sensor is welded on the bottom layer of the PCB, the U / V / W phase GMR sensor is respectively positioned at the central position opposite to the U / V / W phase silicon steel sheet shielding case, and the U / V / W phase silicon steel sheet shielding case vertically penetrates through the PCB. The U / V / W-phase GMR sensors convert magnetic fields generated by U / V / W-phase copper bar currents into voltage signals respectively so as to achieve the purpose of current sampling, and the U / V / W-phase silicon steel sheet shielding cover has the effects of gathering magnetism and reducing crosstalk.

Description

Technical Field

[0001] The utility model relates to the technical field of automobile parts, in particular to a current sampling device based on a GMR sensor used in a motor controller of an electric vehicle. Background Art

[0002] The traditional current sampling structure based on Hall sensors is large in size, greatly affected by temperature, and has low accuracy, which is not conducive to achieving miniaturization and high power density of motor controllers.

[0003] GMR sensor, or giant magneto-resistance (GMR) sensor, is a sensor that integrates magnetic thin film, semiconductor integration and nanotechnology. It has the advantages of low power consumption, high reliability, small size and the ability to work in harsh environments. Summary of the Invention

[0004] In view of the above shortcomings in the prior art, the present invention provides a current sampling device based on a GMR sensor.

[0005] The technical solution adopted by the utility model is: a current sampling device based on a GMR sensor, comprising an injection molded part, a W-phase silicon steel sheet shielding cover, a W-phase copper busbar, a PCB board, a W-phase GMR sensor, a V-phase GMR sensor, a U-phase copper busbar, a U-phase silicon steel sheet shielding cover, a U-phase copper busbar and a V-phase silicon steel sheet shielding cover; the injection molded part is respectively integrally injection-molded with the U-phase silicon steel sheet shielding cover, the V-phase silicon steel sheet shielding cover and the W-phase silicon steel sheet shielding cover arranged side by side; the U-phase silicon steel sheet shielding cover, the V-phase silicon steel sheet shielding cover and the W-phase silicon steel sheet shielding cover are U-shaped with the opening upward, the U-phase copper busbar, the V-phase copper busbar and the W-phase copper busbar are respectively located in the U-phase silicon steel sheet shielding cover, the V-phase silicon steel sheet shielding cover and the W-phase silicon steel sheet shielding cover; the lower surface and left and right surfaces of the U-phase copper busbar, the V-phase copper busbar and the W-phase copper busbar are The two side surfaces maintain a distance of more than 1 mm from the U-phase silicon steel sheet shielding cover, the V-phase silicon steel sheet shielding cover, and the W-phase silicon steel sheet shielding cover respectively; the upper surfaces of the U-phase copper busbar, the V-phase copper busbar, and the W-phase copper busbar maintain a distance of less than 10 mm from the lower surfaces of the U-phase GMR sensor, the V-phase GMR sensor, and the W-phase GMR sensor respectively; the U-phase GMR sensor, the V-phase GMR sensor, and the W-phase GMR sensor are soldered to the bottom layer of the PCB board; the U-phase GMR sensor, the V-phase GMR sensor, and the W-phase GMR sensor are respectively located at the center position relative to the U-phase silicon steel sheet shielding cover, the V-phase silicon steel sheet shielding cover, and the W-phase silicon steel sheet shielding cover; the U-phase silicon steel sheet shielding cover, the V-phase silicon steel sheet shielding cover, and the W-phase silicon steel sheet shielding cover vertically pass through the PCB board to fix the PCB board on the injection molded part.

[0006] Furthermore, a partition is provided on the injection molded part, and the partition respectively separates the U-phase silicon steel sheet shielding cover, the V-phase silicon steel sheet shielding cover and the W-phase silicon steel sheet shielding cover.

[0007] The beneficial effects of the utility model are as follows: the utility model has the advantages of small size, little influence by temperature, high precision, etc., can realize the miniaturization of the motor controller, and improve the power density of the motor controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is an exploded view of the structure of the present utility model;

[0009] In the figure: 1-injection molded part, 2-W-phase silicon steel sheet shielding cover, 3-W-phase copper busbar, 4-PCB board, 5-W-phase GMR sensor, 6-V-phase GMR sensor, 7-U-phase GMR sensor, 8-V-phase copper busbar, 9-U-phase silicon steel sheet shielding cover, 10-U-phase copper busbar, 11-V-phase silicon steel sheet shielding cover, 12-partition. DETAILED DESCRIPTION

[0010] The present invention will be further described below with reference to the accompanying drawings.

[0011] like Figure 1 As shown, the utility model is a current sampling device based on a GMR sensor, including an injection molded part 1, a W-phase silicon steel sheet shielding cover 2, a W-phase copper busbar 3, a PCB board 4, a W-phase GMR sensor 5, a V-phase GMR sensor 6, a U-phase GMR sensor 7, a V-phase copper busbar 8, a U-phase silicon steel sheet shielding cover 9, a U-phase copper busbar 10 and a V-phase silicon steel sheet shielding cover 11.

[0012] The injection molded part 1 is integrally molded with the U-phase silicon steel sheet shield 9, V-phase silicon steel sheet shield 11, and W-phase silicon steel sheet shield 2, which are arranged side by side. A partition 12 is provided on the injection molded part 1 to separate the U-phase silicon steel sheet shield 9, V-phase silicon steel sheet shield 11, and W-phase silicon steel sheet shield 2. The U-phase silicon steel sheet shield 9, V-phase silicon steel sheet shield 11, and W-phase silicon steel sheet shield 2 are U-shaped with the opening upward. The U-phase copper busbar 10, V-phase copper busbar 8, and W-phase copper busbar 3 are respectively located within the U-phase silicon steel sheet shield 9, V-phase silicon steel sheet shield 11, and W-phase silicon steel sheet shield 2. The bottom surfaces and left and right side surfaces of the U-phase copper busbar 10, V-phase copper busbar 8, and W-phase copper busbar 3 are respectively maintained at a distance of more than 1 mm from the U-phase silicon steel sheet shield 9, V-phase silicon steel sheet shield 11, and W-phase silicon steel sheet shield 2.

[0013] The upper surfaces of the U-phase copper busbar 10, the V-phase copper busbar 8, and the W-phase copper busbar 3 are respectively kept within 10 mm from the lower surfaces of the U-phase GMR sensor 7, the V-phase GMR sensor 6, and the W-phase GMR sensor 5. The U-phase GMR sensor 7, the V-phase GMR sensor 6, and the W-phase GMR sensor 5 are soldered to the bottom layer of the PCB board 4. The U-phase GMR sensor 7, the V-phase GMR sensor 6, and the W-phase GMR sensor 5 are respectively located at the center relative to the U-phase silicon steel sheet shielding cover 9, the V-phase silicon steel sheet shielding cover 11, and the W-phase silicon steel sheet shielding cover 2. The U-phase silicon steel sheet shielding cover 9, the V-phase silicon steel sheet shielding cover 11, and the W-phase silicon steel sheet shielding cover 2 vertically pass through the PCB board 4, so that the PCB board 4 is fixed to the injection molded part 1.

[0014] The U-phase GMR sensor 7, V-phase GMR sensor 6 and W-phase GMR sensor 5 in the present invention convert the magnetic field generated by the current of the U-phase copper busbar 10, V-phase copper busbar 8 and W-phase copper busbar 3 into a voltage signal to achieve the purpose of current sampling. The U-phase silicon steel sheet shielding cover 9, V-phase silicon steel sheet shielding cover 11 and W-phase silicon steel sheet shielding cover 2 play the role of magnetic field concentration and crosstalk reduction.

[0015] The utility model has the advantages of small size, little influence by temperature, high precision, etc., can realize the miniaturization of the motor controller and improve the power density of the motor controller.

Claims

1. A current sampling device based on a GMR sensor, comprising an injection molded part (1), a W-phase silicon steel sheet shielding cover (2), a W-phase copper busbar (3), a PCB board (4), a W-phase GMR sensor (5), a V-phase GMR sensor (6), a U-phase GMR sensor (7), a V-phase copper busbar (8), a U-phase silicon steel sheet shielding cover (9), a U-phase copper busbar (10), and a V-phase silicon steel sheet shielding cover (11); characterized in that: The injection molded part (1) is integrally injection molded with the U-phase silicon steel sheet shielding cover (9), the V-phase silicon steel sheet shielding cover (11) and the W-phase silicon steel sheet shielding cover (2) arranged side by side; the U-phase silicon steel sheet shielding cover (9), the V-phase silicon steel sheet shielding cover (11) and the W-phase silicon steel sheet shielding cover (2) are in a U-shape with the opening upward, and the U-phase copper busbar (10), the V-phase copper busbar (8) and the W-phase copper busbar (3) are respectively located in the U-phase silicon steel sheet shielding cover (9), the V-phase silicon steel sheet shielding cover (11) and the W-phase silicon steel sheet shielding cover (2); the lower surface and the left and right side surfaces of the U-phase copper busbar (10), the V-phase copper busbar (8) and the W-phase copper busbar (3) are respectively kept at a distance of more than 1 mm from the U-phase silicon steel sheet shielding cover (9), the V-phase silicon steel sheet shielding cover (11) and the W-phase silicon steel sheet shielding cover (2); the U-phase copper busbar (10), the V-phase copper busbar (8) and the W-phase copper busbar (3) are respectively kept at a distance of more than 1 mm from the U-phase silicon steel sheet shielding cover (9), the V-phase silicon steel sheet shielding cover (11) and the W-phase silicon steel sheet shielding cover (2); The upper surfaces of the row (8) and the W-phase copper row (3) are respectively kept at a distance of less than 10 mm from the lower surfaces of the U-phase GMR sensor (7), the V-phase GMR sensor (6) and the W-phase GMR sensor (5); the U-phase GMR sensor (7), the V-phase GMR sensor (6) and the W-phase GMR sensor (5) are welded to the bottom layer of the PCB board (4); the U-phase GMR sensor (7), the V-phase GMR sensor (6) and the W-phase GMR sensor (5) are respectively located at the center position relative to the U-phase silicon steel sheet shielding cover (9), the V-phase silicon steel sheet shielding cover (11) and the W-phase silicon steel sheet shielding cover (2); the U-phase silicon steel sheet shielding cover (9), the V-phase silicon steel sheet shielding cover (11) and the W-phase silicon steel sheet shielding cover (2) vertically pass through the PCB board (4), so that the PCB board (4) is fixed on the injection molded part (1).

2. The current sampling device based on a GMR sensor according to claim 1, characterized in that: A partition (12) is provided on the injection molded part (1), and the partition (12) respectively separates the U-phase silicon steel sheet shielding cover (9), the V-phase silicon steel sheet shielding cover (11), and the W-phase silicon steel sheet shielding cover (2).

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