Automatic compounding equipment for film circuit board

Abstract

The utility model discloses automatic compounding equipment for a thin film circuit board. Comprising a first circuit diaphragm feeding device, a second circuit diaphragm feeding device, an insulating diaphragm feeding device, a first circuit diaphragm punching device, a second circuit diaphragm punching device, a second circuit diaphragm punching device, a third circuit diaphragm punching device, a fourth circuit diaphragm punching device, a fifth circuit diaphragm punching device, a sixth circuit diaphragm punching device, a fifth circuit diaphragm punching device and a sixth circuit diaphragm punching device, the hot melting platform is used for realizing hot melting compounding of the first circuit diaphragm, the insulating diaphragm and the second circuit diaphragm; the diaphragm carrying device is used for placing the first circuit diaphragm, the insulating diaphragm and the second circuit diaphragm on the hot melting platform in sequence; according to the utility model, the diaphragms are accurately punched with positioning holes based on a pattern recognition method, and then are accurately compounded, so that the accurate alignment and positioning of each layer of diaphragm are realized, the alignment precision of contacts on the upper and lower layers of circuit diaphragms is better, and the yield is improved.

Description

Technical Field

[0001] This utility model relates to the technical field of thin-film circuit board production, and in particular to an automatic composite equipment for thin-film circuit boards. Background Technology

[0002] In the existing technology, each layer of film on the thin film circuit board is manufactured separately, and then the multiple layers of film are stacked by manual or robotic arms to form a sandwich structure consisting of a first circuit film, an insulating film, and a second circuit film. Then, the stacked films of the sandwich structure are thermally melted together. The switch contacts on the thin film circuit board are not easy to align during manufacturing, which often causes misalignment of the contacts on the upper and lower circuit films, affecting the yield rate. Moreover, the manual operation results in low production efficiency. Utility Model Content

[0003] To overcome the above deficiencies, this utility model provides an automatic thin-film circuit board lamination equipment. This automatic thin-film circuit board lamination equipment can automatically punch, stack, and thermally fuse the various layers of thin-film circuit boards, improving production efficiency and the alignment accuracy of contacts on the upper and lower circuit film layers, thus increasing the yield rate.

[0004] The technical solution adopted by this utility model to solve its technical problem is: an automatic thin-film circuit board lamination equipment, including an equipment frame, a first circuit film feeding device, a second circuit film feeding device, an insulating film feeding device, a first imaging device, a second imaging device, a third imaging device, a first circuit film punching device, a second circuit film punching device, an insulating film punching device, a hot-melt platform, a heating and fusion device, a film conveying mechanism, and a control system. The hot-melt platform is fixedly mounted on the equipment frame, and the hot-melt platform is provided with several positioning posts at intervals. The heating and fusion device can heat the hot-melt platform to heat and fuse the stacked films on the hot-melt platform into a single unit. The first circuit film punching device... The first, second, and third circuit diaphragm punching devices are spaced apart on one side of the hot-melt platform. Each of the first and second circuit diaphragm punching devices has a diaphragm positioning carrier for stopping and positioning the diaphragm to be punched. Each of the first, second, and third circuit diaphragm punching devices also has a punch for punching the positioned diaphragm and a punching drive device for driving the punch's lifting and lowering movement. Each of the first, second, and third circuit diaphragm punching devices also has a punching position adjustment device, which can adjust the position of the diaphragm positioning carrier or the punch in the horizontal direction. The first imaging device... The second and third imaging devices are respectively mounted on the first circuit film punching device, the first circuit film punching device, and the insulating film punching device, and respectively image the film located directly below them. The first, second, and third imaging devices all communicate with the control system to transmit their captured images. The control system can determine the position of the positioning points printed on the film based on the images captured by the first, second, and third imaging devices, and control the punching position adjustment device according to the position of the positioning points. The first circuit film feeding device, the second circuit film feeding device, and the insulating film feeding device are respectively located on the first circuit film punching device, the first circuit film... On one side of the sheet punching device and the insulating film punching device, the first circuit film feeding device, the second circuit film feeding device, and the insulating film feeding device are respectively able to transport the first circuit film, the second circuit film, and the insulating film to the film positioning carrier of the first circuit film punching device, the first circuit film punching device, and the insulating film punching device. The film conveying mechanism is used to convey the films in the first circuit film punching device, the second circuit film punching device, and the insulating film punching device to the hot melting platform. The control system controls the operation of the first circuit film feeding device, the second circuit film feeding device, the insulating film feeding device, the first circuit film punching device, the insulating film punching device, the film conveying mechanism, and the hot melting device.

[0005] As a further improvement of this utility model, the diaphragm positioning carrier includes a fixed base, a diaphragm adsorption platform, a diaphragm edge pressing block, and a diaphragm edge pressing drive device. The punching position adjustment device includes a first sliding plate, a second sliding plate, a first horizontal drive device, a second horizontal drive device, and a rotary drive device. The first sliding plate is mounted on the fixed base and can slide linearly along the X direction. The second sliding plate is mounted on the first sliding plate and can slide linearly along the Y direction. The diaphragm adsorption platform is mounted on the second sliding plate and can rotate around a vertical axis. The diaphragm adsorption platform has a vacuum chamber inside, and the upper surface of the diaphragm adsorption platform has several air holes communicating with the vacuum chamber. The first horizontal drive device, the second horizontal drive device, and the rotary drive device drive the first sliding plate, the second sliding plate, and the diaphragm adsorption platform to move, respectively. The diaphragm edge pressing block is mounted on the periphery of the fixed base and can move up and down. When the diaphragm edge pressing block is pressed down, it can press the edge of the diaphragm located on the diaphragm adsorption platform. The diaphragm edge pressing drive device drives the diaphragm edge pressing block to move up and down. The control system controls the operation of the first horizontal drive device, the second horizontal drive device, the rotary drive device, and the diaphragm edge pressing drive device.

[0006] As a further improvement of this utility model, the first circuit diaphragm feeding device, the second circuit diaphragm feeding device, and the insulating diaphragm feeding device are all conveyor belts, and the conveying ends of the first circuit diaphragm feeding device, the second circuit diaphragm feeding device, and the insulating diaphragm feeding device are directly opposite the diaphragm adsorption platform of the first circuit diaphragm punching device, the first circuit diaphragm punching device, and the insulating diaphragm punching device.

[0007] As a further improvement of this utility model, a semi-enclosed membrane stop wall is formed around the membrane adsorption platform. The membrane stops that arrive at the membrane adsorption platform from the conveying ends of the first circuit membrane feeding device, the second circuit membrane feeding device and the insulating membrane feeding device are initially positioned on the surface of the membrane stop wall.

[0008] As a further improvement of this utility model, the membrane adsorption platform is also provided with a membrane sensing device. The membrane sensing device can sense the membrane located on the membrane adsorption platform. The membrane sensing device communicates with the control system to transmit information about the arrival of the membrane on the surface of the membrane adsorption platform.

[0009] As a further improvement of this utility model, the diaphragm transport mechanism includes a hinged manipulator, a manipulator forward and backward movement mechanism, and a manipulator left and right movement mechanism. The manipulator left and right movement mechanism is slidably mounted on the frame along the arrangement direction of the first circuit diaphragm punching device, the second circuit diaphragm punching device, and the insulating diaphragm punching device. The manipulator forward and backward movement mechanism is mounted on the left and right movement mechanism and can reciprocate between the first circuit diaphragm punching device, the second circuit diaphragm punching device, and the insulating diaphragm punching device and the hot-melting platform. The manipulator is mounted on the manipulator forward and backward movement mechanism, and the manipulator is provided with several suction cups, which can adsorb the diaphragm under negative pressure.

[0010] As a further improvement of this utility model, a diaphragm alignment camera is also provided. The robot arm with the diaphragm adsorbed by negative pressure first arrives directly above the diaphragm alignment camera and stays for a set time before transporting the diaphragm to the hot-melt platform. The diaphragm alignment camera can perform imaging detection on the holes of the diaphragm that arrive above it. The diaphragm alignment camera can transmit the image it captures to the control system. The control system controls the robot arm to adjust the position of the diaphragm on the hot-melt platform so that the holes on the diaphragm correspond to the positioning posts on the hot-melt platform.

[0011] As a further improvement of this utility model, the heating and fusion device is an ultrasonic heating device.

[0012] As a further improvement of this utility model, a pressure plate capable of lifting and lowering is also provided above the hot-melting platform. The pressure plate can press the stacked films on the hot-melting platform when it descends. A pressure plate driving device is also provided to drive the pressure plate to lift and lower.

[0013] The beneficial technical effects of this utility model are as follows: By setting a first imaging device, a second imaging device, and a third imaging device on the first circuit diaphragm punching device, the second circuit diaphragm punching device, and the insulating diaphragm punching device, this utility model uses an image recognition method to correct the punching position of the first circuit diaphragm, the second circuit diaphragm, and the insulating diaphragm according to the position of the positioning points printed on the first circuit diaphragm, the second circuit diaphragm, and the insulating diaphragm, thereby achieving precise punching of the first circuit diaphragm, the second circuit diaphragm, and the insulating diaphragm. After precise punching, the diaphragms are stacked and positioned by the positioning columns on the hot-melt platform to ensure that the switch contacts on the first circuit diaphragm and the second circuit diaphragm are aligned with the position of the avoidance holes on the insulating diaphragm. This achieves accurate alignment and positioning of each layer of diaphragm, resulting in better alignment accuracy of the contacts on the upper and lower layers of circuit diaphragms and improving the yield rate. Attached Figure Description

[0014] Figure 1 A perspective view of the diaphragm feeding state of this utility model;

[0015] Figure 2This is a front cross-sectional view of the diaphragm in the feeding state of this utility model;

[0016] Figure 3 for Figure 2 Sectional view along line AA;

[0017] Figure 4 This is an exploded perspective view of the diaphragm positioning carrier and punching position adjustment device of this utility model.

[0018] Figure 5 This is a perspective view of the diaphragm stop wall of this utility model;

[0019] Figure 6 This is a three-dimensional view of the diaphragm transport mechanism and the heat fusion platform of this utility model. Detailed Implementation

[0020] Example: An automatic thin-film circuit board laminating equipment includes a machine frame 1, a first circuit film feeding device 2, a second circuit film feeding device 3, an insulating film feeding device 4, a first imaging device 5, a second imaging device 6, a third imaging device 7, a first circuit film punching device 8, a second circuit film punching device 9, an insulating film punching device 10, a hot-melt platform 11, a heating and fusion device, a film transport mechanism, and a control system 15. The hot-melt platform 11 is fixedly mounted on the machine frame 1, and the hot-melt platform 11 is spaced apart. The platform is equipped with several positioning posts 28. The heating and fusion device can heat the hot-melt platform so that the stacked films on the hot-melt platform 11 are thermally fused together. The first circuit film punching device 8, the second circuit film punching device 9, and the insulating film punching device 10 are spaced apart on one side of the hot-melt platform 11. The first circuit film punching device 8 and the insulating film punching device 10 are respectively equipped with film positioning carriers 16 that can stop and position the films to be punched. The first circuit film punching device 8... The second circuit diaphragm punching device 9 and the insulating diaphragm punching device 10 are also equipped with punches 17 for punching the positioned diaphragm and punching drive devices for driving the punches to move up and down. The first circuit diaphragm punching device 8, the first circuit diaphragm punching device 8 and the insulating diaphragm punching device 10 are also equipped with punching position adjustment devices. The punching position adjustment devices can adjust the position of the diaphragm positioning carrier 16 or the punch in the horizontal direction. The first imaging device 5, the second imaging device 6 and the third imaging device 7 are respectively installed on the first circuit diaphragm punching device 8, the first circuit diaphragm punching device 8 and the insulating diaphragm punching device 10 and respectively image the diaphragm located directly below them. The first imaging device 5, the second imaging device 6 and the third imaging device 7 communicate with the control system 15 to transmit the images they capture. The control system 15 can capture the position of the positioning point printed on the diaphragm according to the image captured by the first imaging device 5, the second imaging device 6 and the third imaging device 7. The control system 15 controls the punching position adjustment device to work according to the position of the positioning point.The first circuit diaphragm feeding device 2, the second circuit diaphragm feeding device 3, and the insulating diaphragm feeding device 4 are respectively located on one side of the first circuit diaphragm punching device 8, the first circuit diaphragm punching device 8, and the insulating diaphragm punching device 10. The first circuit diaphragm feeding device 2, the second circuit diaphragm feeding device 3, and the insulating diaphragm feeding device 4 can respectively transport the first circuit diaphragm, the second circuit diaphragm, and the insulating diaphragm to the diaphragm positioning carrier 16 of the first circuit diaphragm punching device 8, the first circuit diaphragm punching device 8, and the insulating diaphragm punching device 10. The diaphragm conveying mechanism is used to convey the diaphragms in the first circuit diaphragm punching device 8, the second circuit diaphragm punching device, and the insulating diaphragm punching device 10 to the heat fusion platform 11. The control system 15 controls the operation of the first circuit diaphragm feeding device 2, the second circuit diaphragm feeding device 3, the insulating diaphragm feeding device 4, the first circuit diaphragm punching device 8, the first circuit diaphragm punching device 8, the insulating diaphragm punching device 10, the diaphragm conveying mechanism, and the heat fusion device.

[0021] Alignment marks are printed on the corners of the first circuit diaphragm, the second circuit diaphragm, and the insulating diaphragm. The insulating diaphragm has through holes corresponding to the contacts on the first and second circuit diaphragms. When the first circuit diaphragm, the second circuit diaphragm, and the insulating diaphragm are transported to the diaphragm positioning carrier 16 of the first circuit diaphragm punching device 8, the second circuit diaphragm punching device 9, and the insulating diaphragm punching device 10, the first imaging device 5, the second imaging device 6, and the third imaging device 7 respectively image the first circuit diaphragm, the second circuit diaphragm, and the insulating diaphragm. The image recognition method punches positioning holes on the first circuit diaphragm, the second circuit diaphragm, and the insulating diaphragm according to the alignment marks on the diaphragm. The diaphragm transport mechanism stacks the first circuit diaphragm, the insulating diaphragm, and the second circuit diaphragm sequentially on the heat fusion platform 11, and the heat fusion platform 11 is provided with positioning posts 28 for penetrating the positioning holes. The positioning posts 28 realize the precise positioning of the first circuit diaphragm, the insulating diaphragm, and the second circuit diaphragm. Finally, the first circuit diaphragm, the insulating diaphragm, and the second circuit diaphragm are sequentially composited into one piece by the heating fusion device.

[0022] The diaphragm positioning carrier 16 includes a fixed base 18, a diaphragm adsorption platform 19, a diaphragm edge pressing block, and a diaphragm edge pressing drive device. The punching position adjustment device includes a first sliding plate 20, a second sliding plate 21, a first horizontal drive device 22, a second horizontal drive device 23, and a rotary drive device 24. The first sliding plate 20 is linearly slidable along the X direction and mounted on the fixed base 18. The second sliding plate 21 is linearly slidable along the Y direction and mounted on the first sliding plate 20. The diaphragm adsorption platform 19 is rotatable around a vertical axis and mounted on the second sliding plate 21. The diaphragm adsorption platform 19 has a vacuum chamber. The upper surface of the attached platform 19 is provided with several air holes 25 that communicate with the vacuum chamber. The first horizontal drive device 22, the second horizontal drive device 23 and the rotary drive device 24 drive the first sliding plate 20, the second sliding plate 21 and the membrane adsorption platform 19 to move respectively. The membrane pressing block is installed on the periphery of the fixed base 18 and can move up and down. When the membrane pressing block is pressed down, it can press the edge of the membrane located on the membrane adsorption platform 19. The membrane pressing drive device drives the membrane pressing block to move up and down. The control system 15 controls the first horizontal drive device 22, the second horizontal drive device 23, the rotary drive device 24 and the membrane pressing drive device to work.

[0023] After the membrane is sent to the membrane adsorption platform 19, the membrane adsorption platform 19 adsorbs the membrane under negative pressure. Then, the control system 15 controls the first horizontal drive device 22, the second horizontal drive device 23 and the rotary drive device 24 to align the membrane with the punch according to the alignment marks on the membrane. Then, the membrane edge is pressed by the membrane pressing block to prevent the membrane from deforming during punching. After the membrane is positioned, the punch drive devices of the first circuit membrane punching device 8, the second circuit membrane punching device 9 and the insulating membrane punching device 10 are activated to accurately punch positioning holes on the membrane.

[0024] The first circuit diaphragm feeding device 2, the second circuit diaphragm feeding device 3, and the insulating diaphragm feeding device 4 are all conveyor belts. The conveying ends of the first circuit diaphragm feeding device 2, the second circuit diaphragm feeding device 3, and the insulating diaphragm feeding device 4 are directly opposite the diaphragm adsorption platform 19 of the first circuit diaphragm punching device 8, the first circuit diaphragm punching device 8, and the insulating diaphragm punching device 10. Automatic feeding avoids manual feeding and saves labor.

[0025] The membrane adsorption platform 19 is surrounded by a semi-enclosed membrane stop wall 26. The membranes that arrive at the membrane adsorption platform 19 from the conveying ends of the first circuit membrane feeding device 2, the second circuit membrane feeding device 3 and the insulating membrane feeding device 4 are initially positioned on the surface of the membrane stop wall 26.

[0026] The membrane adsorption platform 19 is also equipped with a membrane sensing device, which can sense the membrane located on the membrane adsorption platform 19. The membrane sensing device communicates with the control system 15 to transmit information about the arrival of the membrane on the surface of the membrane adsorption platform 19. The automatic sensing of membrane feeding through the membrane sensing device is beneficial for realizing intelligent control.

[0027] The diaphragm handling mechanism includes a hinged robotic arm 12, a robotic arm forward and backward movement mechanism 13, and a robotic arm left and right movement mechanism 14. The left and right movement mechanism of the robotic arm 12 is slidably mounted on the frame along the arrangement direction of the first circuit diaphragm punching device 8, the second circuit diaphragm punching device 9, and the insulating diaphragm punching device 10. The robotic arm forward and backward movement mechanism 13 is mounted on the left and right movement mechanism and can reciprocate between the first circuit diaphragm punching device 8, the second circuit diaphragm punching device 9, and the insulating diaphragm punching device 10 and the heat-melting platform 11. The robotic arm 12 is mounted on the robotic arm forward and backward movement mechanism 13. The robotic arm 12 is equipped with several suction cups, which can adsorb the diaphragm under negative pressure. By moving the robotic arm 12 forward, backward, left, and right, different diaphragms are handled and placed on the heat-melting platform 11 accordingly.

[0028] A diaphragm alignment camera 27 is also provided. A robotic arm 12, carrying a diaphragm under negative pressure, first arrives directly above the diaphragm alignment camera 27 and stays there for a set time before transporting the diaphragm to the hot-melt platform. The diaphragm alignment camera 27 can image and detect the holes on the diaphragm that have arrived above it. The diaphragm alignment camera 27 can transmit the captured images to the control system 15. The control system 15 controls the robotic arm 12 to adjust the position of the diaphragm on the hot-melt platform so that the holes on the diaphragm correspond to the positioning posts 28 on the hot-melt platform. When the robotic arm 12 transports the diaphragm, it images the diaphragm through the diaphragm alignment camera 27. Using an image recognition method, the robotic arm 12 adjusts the position of the diaphragm on the hot-melt platform 11 according to the positioning holes on the diaphragm, ensuring that the positioning holes on the diaphragm are aligned with the positioning posts 28 on the hot-melt platform 11.

[0029] The heating and fusion device is an ultrasonic heating device.

[0030] Above the hot-melting platform 11 is a pressure plate that can move up and down. When the pressure plate descends, it can press the stacked films on the hot-melting platform. There is also a pressure plate driving device that drives the pressure plate to move up and down to ensure that the hot-melting composite is firm and flat.

Claims

1. An automatic thin-film circuit board lamination device, characterized in that: The device rack (1), the first circuit film supply device (2), the second circuit film supply device (3), the insulating film supply device (4), the first imaging device (5), the second imaging device (6), the third imaging device (7), the first circuit film punching device (8), the second circuit film punching device (9), the insulating film punching device (10), the hot melting platform (11), the heating fusion device, the film carrying mechanism, and the control system (15) are fixedly arranged on the device rack, the hot melting platform is provided with a plurality of positioning columns (28) at intervals, the heating fusion device can heat the hot melting platform to make the laminated films on the hot melting platform hot melt and composite into one, the first circuit film punching device, the second circuit film punching device and the insulating film punching device are arranged at intervals on one side of the hot melting platform, the film positioning carrier (16) capable of stopping and positioning the film to be punched is arranged on the first circuit film punching device, the first circuit film punching device and the insulating film punching device, the punch (17) for punching the positioned film and the punching driving device for driving the punch to move up and down are further arranged on the first circuit film punching device, the second circuit film punching device and the insulating film punching device, the punching position adjusting device is further arranged on the first circuit film punching device, the second circuit film punching device and the insulating film punching device, the punching position adjusting device can adjust the position of the film positioning carrier or the punch in the horizontal direction, the first imaging device, the second imaging device and the third imaging device are respectively installed on the first circuit film punching device, the first circuit film punching device and the insulating film punching device and respectively image the films located directly below, the first imaging device, the second imaging device and the third imaging device all communicate with the control system to transmit the images shot by them, the control system can capture the position of the positioning point printed on the film according to the pictures shot by the first imaging device, the second imaging device and the third imaging device, and control the punching position adjusting device to work according to the position of the positioning point; the first circuit film supply device, the second circuit film supply device and the insulating film supply device are respectively arranged on the side of the first circuit film punching device, the first circuit film punching device and the insulating film punching device, the first circuit film supply device, the second circuit film supply device and the insulating film supply device can respectively deliver the first circuit film, the second circuit film and the insulating film to the film positioning carrier of the first circuit film punching device, the first circuit film punching device and the insulating film punching device, the film carrying mechanism is used for carrying the films in the first circuit film punching device, the second film punching device and the insulating film punching device to the hot melting platform, and the control system controls the first circuit film supply device, the second circuit film supply device, the insulating film supply device, the first circuit film punching device, the first circuit film punching device, the insulating film punching device, the film carrying mechanism and the heating fusion device to work.

2. The thin film circuit board automatic compounding apparatus according to claim 1, characterized by: The film positioning carrier comprises a fixed base (18), a film suction platform (19), a film edge pressing block and a film edge pressing driving device, the punching position adjusting device comprises a first sliding plate (20), a second sliding plate (21), a first horizontal driving device (22), a second horizontal driving device (23) and a rotating driving device (24), the first sliding plate is linearly slidably mounted on the fixed base along the X direction, the second sliding plate is linearly slidably mounted on the first sliding plate along the Y direction, the film suction platform is rotatably mounted on the second sliding plate about a vertical rotating shaft, a vacuum cavity is arranged in the film suction platform, a plurality of air holes (25) in communication with the vacuum cavity are arranged on the upper surface of the film suction platform, the first horizontal driving device, the second horizontal driving device and the rotating driving device respectively drive the first sliding plate, the second sliding plate and the film suction platform to move, the film edge pressing block is linearly movably mounted on the periphery of the fixed base, the film edge pressing block can press the edge position of the film on the film suction platform when being pressed downward, the film edge pressing driving device drives the film edge pressing block to move up and down, and the control system controls the first horizontal driving device, the second horizontal driving device, the rotating driving device and the film edge pressing driving device to work.

3. The thin film circuit board automatic compounding apparatus according to claim 2, characterized by: The first circuit film supply device, the second circuit film supply device and the insulating film supply device are all conveying belts, and the conveying ends of the first circuit film supply device, the second circuit film supply device and the insulating film supply device are opposite to the film suction platforms of the first circuit film punching device, the first circuit film punching device and the insulating film punching device.

4. The thin film circuit board automatic compounding apparatus according to claim 2, characterized by: A semi-enclosing film stop wall (26) is formed on the periphery of the film suction platform, and the film on the film suction platform is preliminarily positioned on the surface of the film stop wall from the conveying ends of the first circuit film supply device, the second circuit film supply device and the insulating film supply device.

5. The thin film circuit board automatic compounding apparatus according to claim 3, characterized by: The film suction platform is further provided with a film sensing device, the film sensing device can sense the film on the film suction platform, and the film sensing device communicates with the control system to transmit the information of the film reaching the surface of the film suction platform.

6. The thin film circuit board automatic compounding apparatus according to claim 1, characterized by: The film carrying mechanism comprises a shaft-hinged manipulator (12), a manipulator forward and backward moving mechanism (13) and a manipulator left and right moving mechanism (14), the manipulator left and right moving mechanism is slidably mounted on the rack along the arrangement direction of the first circuit film punching device, the second circuit film punching device and the insulating film punching device, the manipulator forward and backward moving mechanism is reciprocally movably mounted on the left and right moving mechanism between the first circuit film punching device, the second circuit film punching device and the insulating film punching device and the hot melting platform, and the manipulator is mounted on the manipulator forward and backward moving mechanism, a plurality of suction cups are arranged on the manipulator, and the suction cups can negatively adsorb the film.

7. The thin film circuit board automatic compounding apparatus according to claim 6, characterized by: The film sheet aligning camera (27) is arranged above the film sheet aligning camera (27), and the film sheet is sucked by the negative pressure. The film sheet is transported to the hot melting platform after the manipulator stays for a set time. The film sheet aligning camera can image and detect the hole position of the film sheet above it. The film sheet aligning camera can transmit the image to the control system. The control system controls the manipulator to adjust the position of the film sheet on the hot melting platform so that the hole position of the film sheet corresponds to the positioning column on the hot melting platform.

8. The thin film circuit board automatic compounding apparatus according to claim 1, characterized by: The heating and melting device is an ultrasonic heating device.

9. The automatic film circuit board compounding device according to claim 1, characterized in that a pressing plate capable of lifting and moving is arranged above the hot melting platform, the pressing plate can press the stacked film sheets on the hot melting platform when it is lowered, and a pressing plate driving device is arranged to drive the lifting and moving of the pressing plate.

Images