Heating element test board and heating element test system

Abstract

A heating element test board and a heating element test system are applied to the technical field of heating element test, and the heating element test board comprises a processor, a communication unit and a heating element test unit. The heating body test unit is used for being connected with a to-be-tested heating body and realizing a preset test function on the to-be-tested heating body; the communication unit is provided with a communication access end and a communication cascade end, and the communication access end is connected with the communication cascade end; the communication access end is used for being connected with a communication end of an upper computer or being connected with a communication end of a heating element test board of a previous cascade, and the communication cascade end is used for being connected with a communication end of a heating element test board of a next cascade; and the processor is respectively connected with the heating body testing unit and the communication unit. The plurality of heating element test boards can be cascaded based on the communication unit, and the plurality of cascaded heating element test boards can be connected and communicated with the upper computer, so that the test efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of heating element testing technology, specifically to a heating element test board and a heating element testing system. Background Technology

[0002] Heating elements can generate heat after being powered on, and can therefore be used to heat various products. However, heating elements need to undergo relevant tests before assembly, such as testing the initial resistance value of the heating element, as well as the resistance value of the heating element during and after the power-on test, to ensure that the resistance value meets the specified range, so as to ensure the consistency of heating elements used in production line assembly.

[0003] Current technical solutions typically rely on test boards to test heating elements. These test boards connect to a host computer, which then controls the testing process. However, the host computer can only connect to one test board at a time, and each test board can only test one heating element at a time. Therefore, the testing efficiency is low and only meets the required testing needs. A new technical solution is therefore needed. Utility Model Content

[0004] The main technical problem addressed in this application is the low testing efficiency of heating elements.

[0005] According to the first aspect, one embodiment provides a heating element test board, including a processor, a communication unit, and a heating element test unit;

[0006] The heating element testing unit is used to connect to the heating element to be tested and to perform preset testing functions on the heating element to be tested.

[0007] The communication unit has a communication access terminal and a communication cascade terminal, and the communication access terminal is connected to the communication cascade terminal; the communication access terminal is used to connect to the communication terminal of the host computer or to the communication terminal of the upper-level heating element test board, and the communication cascade terminal is used to connect to the communication terminal of the lower-level heating element test board.

[0008] The processor is connected to both the heating element testing unit and the communication unit.

[0009] In some embodiments, the communication unit includes a communication module and an address encoding module. The communication module has a communication access terminal and a communication cascading terminal. The address encoding module has multiple different configuration states, and the different configuration states are used to represent different communication addresses. The processor determines the current communication address based on the current configuration state of the address encoding module and controls the communication module to communicate with the host computer based on the current communication address.

[0010] In some embodiments, the address encoding module includes a DIP switch having multiple switching devices, each of which can be in an on or off state, and the configuration state of the DIP switch is a combination of the states of the multiple switching devices.

[0011] In some embodiments, the communication module includes an RS485 communication module, which has a communication access terminal for an RS485 communication bus and a communication cascade terminal for an RS485 communication bus.

[0012] In some embodiments, the heating element testing unit includes a driving module and a resistance detection module;

[0013] The driving module has a control terminal, an input terminal, and an output terminal. The control terminal of the driving module is connected to the processor, the input terminal is used to connect to the driving power supply, and the output terminal is connected to the heating element under test. The processor is used to output a heating control signal to the control terminal of the driving module to control the output terminal of the driving module to output a driving current to the heating element under test.

[0014] The resistance detection module has a control terminal, a first measurement terminal, and a second measurement terminal. The control terminal of the resistance detection module is connected to the processor, the first measurement terminal is connected to the heating element to be tested, and the second measurement terminal is grounded. The processor is used to output a resistance measurement control signal to the control terminal of the resistance detection module to control the first measurement terminal of the resistance detection module to detect the resistance of the heating element to be tested.

[0015] In some embodiments, the heating element to be tested includes an upper section and a lower section, and the driving module includes a first switching device and a second switching device;

[0016] The control terminals of the first and second switching devices are respectively connected to the processor, the input terminals of the first and second switching devices are respectively connected to the driving power supply, the output terminal of the first switching device is connected to the upper section, and the output terminal of the second switching device is connected to the lower section.

[0017] The processor is used to output a first heat control signal to the control terminal of the first switching device to control the first switching device to be turned on or off; the processor is used to output a second heat control signal to the control terminal of the second switching device to control the second switching device to be turned on or off.

[0018] In some embodiments, the resistance detection module includes a third switching device, a sampling resistor, and an analog-to-digital converter;

[0019] The first end of the sampling resistor is connected to the heating element to be tested, and the second end is grounded;

[0020] The input terminal of the analog-to-digital converter is connected to the first terminal of the sampling resistor, and the output terminal is connected to the processor.

[0021] The control terminal of the third switching device is connected to the processor, the input terminal is connected to the heating element to be measured, and the output terminal is grounded; the processor is used to output the resistance measurement control signal to the control terminal of the third switching device to control the third switching device to be turned on or off.

[0022] In some embodiments, the heating element testing unit further includes a temperature sensing module connected to the processor; the temperature sensing module is used to detect the temperature of the heating element to be tested and output a corresponding temperature signal to the processor.

[0023] In some embodiments, the heating element test board further includes an alarm notification unit and / or a display unit; the alarm notification unit is connected to the processor to output alarm notification information; the display unit is connected to the processor to display visual information.

[0024] According to a second aspect, one embodiment provides a heating element testing system, comprising:

[0025] Multiple heating element test boards as described in the first aspect, wherein each heating element test board is cascaded with its respective communication unit;

[0026] The host computer's communication terminal is connected to the communication unit of the first-level heating element test board in the cascaded plurality of heating element test boards, so as to communicate with the communication unit of each heating element test board based on the communication unit of the first-level heating element test board.

[0027] According to the heating element test board and heating element test system of the above embodiments, since the communication access terminal of the communication unit is connected to the communication cascade terminal of the communication unit, when the communication access terminal of the communication unit is connected to the communication terminal of the host computer, the communication terminal of the next-level heating element test board can be connected to the communication terminal of the host computer through the communication cascade terminal of the communication unit. When the communication access terminal of the communication unit is connected to the communication terminal of the previous-level heating element test board, the communication access terminal of the communication unit can be connected to the communication terminal of the host computer through the communication terminal of the previous-level heating element test board, thereby enabling each cascaded heating element test board to connect and communicate with the host computer, thus improving testing efficiency. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of a heating element test plate according to one embodiment;

[0029] Figure 2This is a schematic diagram of the structure of a communication unit according to one embodiment;

[0030] Figure 3 This is a schematic diagram of the structure of a heating element testing unit according to one embodiment;

[0031] Figure 4 This is a schematic diagram of the structure of a driver module according to one embodiment;

[0032] Figure 5 This is a schematic diagram of the structure of a resistance detection module according to one embodiment;

[0033] Figure 6 This is a schematic diagram of the structure of a heating element testing system according to one embodiment. Detailed Implementation

[0034] The present application will now be described in further detail with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; the relevant operations can be fully understood based on the description in the specification and general technical knowledge in the art.

[0035] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0036] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0037] Some embodiments provide a heating element test board for performing relevant tests on a heating element under test to determine whether the heating element meets the usage requirements. Please refer to... Figure 1 The heating element test board includes a communication unit 10, a heating element test unit 20, and a processor 30, which will be described in detail below.

[0038] The communication unit 10 is used to communicate with a host computer. The communication unit 10 has a communication access terminal 14 and a communication cascading terminal 16, with the communication access terminal 14 and the communication cascading terminal 16 connected. Specifically, when the heating element test board is used to cascade with other heating element test boards, the communication access terminal 14 of the communication unit 10 is used to connect to the communication terminal of the preceding heating element test board. When the heating element test board is used to directly connect to the host computer, the communication access terminal 14 of the communication unit 10 is used to connect to the communication terminal of the host computer. When other heating element test boards need to be cascaded, the communication cascading terminal 16 of the communication unit 10 is used to connect to the communication terminal of the following heating element test board. In this embodiment, since the communication access terminal 14 of the communication unit 10 is connected to the communication cascade terminal 16 of the communication unit 10, when the communication access terminal 14 of the communication unit 10 is connected to the communication terminal of the host computer, the communication terminal of the next-level heating element test board can be connected to the communication terminal of the host computer through the communication cascade terminal 16 of the communication unit 10. When the communication access terminal 14 of the communication unit 10 is connected to the communication terminal of the previous-level heating element test board, the communication access terminal 14 of the communication unit 10 can be connected to the communication terminal of the host computer through the communication terminal of the previous-level heating element test board, thereby enabling each cascaded heating element test board to connect to and communicate with the host computer.

[0039] Please refer to Figure 2 In some embodiments, the communication unit 10 includes a communication module 12 and an address encoding module 18. The communication module 12 has a communication access terminal 14 and a communication cascading terminal 16. The address encoding module 18 has multiple different configuration states, each representing a different communication address. The processor 30 determines the current communication address based on the current configuration state of the address encoding module and controls the communication module 12 to communicate with the host computer based on the current communication address. When the heating element test board is cascaded with other heating element test boards, each heating element test board can communicate with the host computer based on a different communication address, allowing the host computer to control each cascaded heating element test board individually.

[0040] In some embodiments, the address encoding module 18 includes a DIP switch with multiple switching devices. Each switching device can be in an on or off state, and the configuration state of the DIP switch is a combination of the states of the multiple switching devices. For example, the DIP switch has four switching devices, each of which can be in an on or off state based on user operation. Therefore, the user can configure the communication address based on the operation of each switching device in the DIP switch. For example, the on state of a switching device can represent address code "0", and the off state can represent address code "1". For example, when the configurations of the four switching devices are on, off, on, and off respectively, the current configuration state of the DIP switch can represent the communication address "0101".

[0041] In some embodiments, the communication module 12 includes an RS485 communication module. The RS485 communication module has a communication access terminal 14 and a communication cascade terminal 16 for the RS485 communication bus. The communication access terminal 14 is used for RS485 communication based on the RS485 communication bus. The communication cascade terminal 16 is connected to the communication access terminal 14 to extend the RS485 communication bus. For example, the communication access terminal 14 can be connected to the communication cascade terminal 16 of the previous stage heating element test board based on the RS485 communication bus, or to the RS485 communication terminal of the host computer. The communication cascade terminal 16 extends the RS485 communication bus and is then used to connect to the communication access terminal 14 of the next stage heating element test board, allowing multiple heating element test boards to be cascaded. Each cascaded heating element test board can then connect to the RS485 communication terminal of the host computer for communication.

[0042] The heating element test unit 20 is used to connect to the heating element under test and to implement preset test functions for testing the heating element under test.

[0043] Please refer to Figure 3 In this embodiment, the heating element testing unit 20 includes a driving module 22 and a resistance detection module 24. The driving module 22 outputs a driving current to the heating element under test, causing it to heat up. The resistance detection module 24 detects the resistance of the heating element based on voltage detection.

[0044] In some embodiments, the drive module 22 has a control terminal, an input terminal, and an output terminal. The control terminal of the drive module 22 is connected to the processor 30, the input terminal of the drive module 22 is connected to the drive power supply, and the output terminal of the drive module 22 is connected to the heat source under test. The processor 30 is used to output a heating control signal to the control terminal of the drive module 22 to control the output terminal of the drive module 22 to output a drive current to the heat source under test, so that the heat source under test heats up.

[0045] Please refer to Figure 4 In some embodiments, the heat source to be tested includes an upper section and a lower section, and the driving module 22 includes a first switching device Q4 and a second switching device Q3. The control terminals of the first switching device Q4 and the second switching device Q3 are respectively connected to the processor 30. The input terminals of the first switching device Q4 and the second switching device Q3 are respectively connected to a driving power supply, such as a 4.2V driving voltage. The output terminal of the first switching device Q4 is connected to the upper section, and the output terminal of the second switching device Q3 is connected to the lower section. The processor 30 outputs a first heat control signal (PWM_TOP) to the control terminal of the first switching device Q4 to control the first switching device Q4 to turn it on or off. The processor 30 also outputs a second heat control signal (PWM_BOT) to the control terminal of the second switching device Q3 to control the second switching device Q3 to turn it on or off. When the first switching device Q4 is turned on, it outputs a drive current to the upper section of the heating element; conversely, when it is turned off, it stops outputting the drive current. When the second switching device Q3 is turned on, it outputs a drive current to the lower section of the heating element; conversely, when it is turned off, it stops outputting the drive current. In some embodiments, when the heating element under test has only one section, such as only the upper or lower section, the driving module 22 may include either the first switching device Q4 or the second switching device Q3 to drive the heating element under test.

[0046] In some embodiments, the first switching device Q4 and the second switching device Q3 can be implemented based on P-type field-effect transistors (FETs). For example, the control terminal of the first switching device Q4 and the second switching device Q3 is the gate G, the input terminal is the source S, and the output terminal is the drain D. In some embodiments, the first switching device Q4 and the second switching device Q3 can be implemented based on N-type FETs, and their connection relationship can be adjusted adaptively, which will not be elaborated here. In some embodiments, the first switching device Q4 and the second switching device Q3 can also be implemented based on transistors.

[0047] In some embodiments, the resistance detection module 24 has a control terminal, a first measurement terminal, and a second measurement terminal. The control terminal of the resistance detection module 24 is connected to the processor 30, the first measurement terminal of the resistance detection module 24 is connected to the heating element under test, and the second measurement terminal of the resistance detection module 24 is grounded. The processor 30 is used to output a resistance measurement control signal to the control terminal of the resistance detection module 24 to control the first measurement terminal of the resistance detection module 24 to detect the resistance of the heating element under test.

[0048] Please refer to Figure 5In some embodiments, the resistance detection module 24 includes a third switching device Q5, a sampling resistor R23, and an analog-to-digital converter (not shown). The first terminal of the sampling resistor R23 is connected to the heat source under test, and the second terminal of the sampling resistor R23 is grounded. For example, the output terminal of the first switching device Q4 is connected to one end of the upper section (HEATER_TOP), the output terminal of the second switching device Q3 is connected to one end of the lower section (HEATER_BOT), and the sampling resistor R23 is connected in series with the other end (HEATER_COM) shared by the upper and lower sections. The input terminal of the analog-to-digital converter is connected to the first terminal of the sampling resistor R23, and the output terminal of the analog-to-digital converter is connected to the processor 30. The control terminal of the third switching device Q5 is connected to the processor 30, the input terminal of the third switching device Q5 is connected to the heat source under test, and the output terminal of the third switching device Q5 is grounded. The processor 30 outputs a resistance measurement control signal (OUT_OR_CHK) to the control terminal of the third switching device Q5 to control the third switching device Q5 to be turned on or off. When the third switching device Q5 is turned on, it short-circuits the sampling resistor R23, thereby stopping the resistance measurement. When the third switching device Q5 is turned off, the sampling resistor R23 is connected in series with the heating element and outputs the sampling voltage (ADC_OR) to the analog-to-digital converter.

[0049] In some embodiments, the third switching device Q5 can be implemented based on an N-type field-effect transistor (FET). For example, the control terminal of the third switching device Q5 is the gate (G), the input terminal is the drain (D), and the output terminal is the source (S). In some embodiments, the third switching device Q5 can be implemented based on a P-type FET, which will not be elaborated further here. In some embodiments, the first heating control signal and the second heating control signal can be PWM signals, and the resistance measurement control signal can be a high-level signal or a low-level signal. In some embodiments, the analog-to-digital converter can be a separate device or it can be built into the processor 30.

[0050] Please refer to Figure 3 In some embodiments, the heating element testing unit 20 further includes a temperature sensing module 26 connected to the processor 30. The temperature sensing module 26 can be implemented based on a temperature sensor. The temperature sensing module 26 is used to detect the temperature of the heating element under test and output the corresponding temperature signal to the processor 30. In some embodiments, the temperature sensing module 26 can directly output a digital temperature signal to the processor 30, or it can output an analog temperature signal, convert it into a digital temperature signal through an analog-to-digital converter, and then output it to the processor 30.

[0051] Please refer to Figure 1In some embodiments, the heating element test board further includes an alarm notification unit 40 and / or a display unit 50. The alarm notification unit 40 is connected to the processor 30 for outputting alarm notification information. The display unit 50 is connected to the processor 30 for displaying visual information. In some embodiments, the alarm notification unit 40 may include an LED light, for example, using the flashing of the LED light for notification; the alarm notification unit 40 may also include a buzzer, for example, using the sound emitted by a buzzer for notification. In some embodiments, the display unit 50 may be implemented based on an LCD screen or an LED screen, thereby displaying relevant information about the heating element, such as the measured resistance and temperature.

[0052] The processor 30 is connected to both the heating element test unit 20 and the communication unit 10 to control the heating element functional test unit to perform preset test functions and to communicate with the host computer via the communication unit 10. The processor 30 can be a CPU, FPGA, microcontroller, or other device with processing capabilities.

[0053] In the above embodiments, the heating element test board can be directly connected to the host computer via the communication unit 10, and can also be cascaded with other heating element test boards. Alternatively, it can be cascaded with other heating element test boards via the communication unit 10, allowing the other heating element test boards to connect to the host computer, and can also be used for cascading with other heating element test boards. This allows the host computer to connect to multiple heating element test boards at once after multiple heating element test boards are cascaded, enabling control of multiple heating element tests and thus improving testing efficiency.

[0054] The above is an explanation of a single heating element test board. Multiple heating element test boards and a host computer can also form a heating element test system. The following is a detailed explanation of the heating element test system.

[0055] Please refer to Figure 6 Some embodiments provide a heating element testing system, which includes multiple heating element testing boards and a host computer 60.

[0056] In some embodiments, multiple heating element test boards can be the heating element test boards described in the above embodiments, and the heating element test boards are cascaded with each other through their respective communication units 10.

[0057] In some embodiments, the communication terminal of the host computer 60 is connected to the communication unit 10 of the first-level heating element test board in a cascaded plurality of heating element test boards, so that the communication unit 10 of the first-level heating element test board communicates with the communication unit 10 of each heating element test board respectively. This allows for the simultaneous connection of multiple heating element test boards for controlling the testing of multiple heating elements, improving testing efficiency. In some embodiments, the host computer 60 can be a control terminal, PC, or other terminal device.

[0058] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. A heating element test plate, characterized in that, Includes a processor, communication unit, and heat-generating element testing unit; The heating element testing unit is used to connect to the heating element to be tested and to perform preset testing functions on the heating element to be tested. The communication unit has a communication access terminal and a communication cascade terminal, and the communication access terminal is connected to the communication cascade terminal; the communication access terminal is used to connect to the communication terminal of the host computer or to the communication terminal of the upper-level heating element test board, and the communication cascade terminal is used to connect to the communication terminal of the lower-level heating element test board. The processor is connected to both the heating element testing unit and the communication unit.

2. The heating element test plate as described in claim 1, characterized in that, The communication unit includes a communication module and an address encoding module. The communication module has a communication access terminal and a communication cascading terminal. The address encoding module has multiple different configuration states, and different configuration states are used to represent different communication addresses. The processor determines the current communication address based on the current configuration state of the address encoding module and controls the communication module to communicate with the host computer based on the current communication address.

3. The heating element test plate as described in claim 2, characterized in that, The address encoding module includes a DIP switch, which has multiple switching devices. Each switching device can be in an open or closed state. The configuration state of the DIP switch is a combination of the states of the multiple switching devices.

4. The heating element test plate as described in claim 2, characterized in that, The communication module includes an RS485 communication module, which has a communication access terminal for an RS485 communication bus and a communication cascade terminal for an RS485 communication bus.

5. The heating element test plate as described in claim 1, characterized in that, The heating element testing unit includes a driving module and a resistance detection module; The driving module has a control terminal, an input terminal, and an output terminal. The control terminal of the driving module is connected to the processor, the input terminal is used to connect to the driving power supply, and the output terminal is connected to the heating element under test. The processor is used to output a heating control signal to the control terminal of the driving module to control the output terminal of the driving module to output a driving current to the heating element under test. The resistance detection module has a control terminal, a first measurement terminal, and a second measurement terminal. The control terminal of the resistance detection module is connected to the processor, the first measurement terminal is connected to the heating element to be tested, and the second measurement terminal is grounded. The processor is used to output a resistance measurement control signal to the control terminal of the resistance detection module to control the first measurement terminal of the resistance detection module to detect the resistance of the heating element to be tested.

6. The heating element test plate as described in claim 5, characterized in that, The heating element to be tested includes an upper section and a lower section, and the driving module includes a first switching device and a second switching device; The control terminals of the first and second switching devices are respectively connected to the processor, the input terminals of the first and second switching devices are respectively connected to the driving power supply, the output terminal of the first switching device is connected to the upper section, and the output terminal of the second switching device is connected to the lower section. The processor is used to output a first heat control signal to the control terminal of the first switching device to control the first switching device to be turned on or off; the processor is used to output a second heat control signal to the control terminal of the second switching device to control the second switching device to be turned on or off.

7. The heating element test plate as described in claim 5, characterized in that, The resistance detection module includes a third switching device, a sampling resistor, and an analog-to-digital converter; The first end of the sampling resistor is connected to the heating element to be tested, and the second end is grounded; The input terminal of the analog-to-digital converter is connected to the first terminal of the sampling resistor, and the output terminal is connected to the processor. The control terminal of the third switching device is connected to the processor, the input terminal is connected to the heating element to be measured, and the output terminal is grounded; the processor is used to output the resistance measurement control signal to the control terminal of the third switching device to control the third switching device to be turned on or off.

8. The heating element test plate as described in claim 5, characterized in that, The heating element testing unit also includes a temperature sensing module connected to the processor; the temperature sensing module is used to detect the temperature of the heating element to be tested and output the corresponding temperature signal to the processor.

9. The heating element test plate as described in claim 1, characterized in that, It also includes an alarm notification unit and / or a display unit; the alarm notification unit is connected to the processor to output alarm notification information; the display unit is connected to the processor to display visual information.

10. A heating element testing system, characterized in that, include: Multiple heating element test boards as described in any one of claims 1-9, wherein each heating element test board is cascaded with its respective communication unit; The host computer's communication terminal is connected to the communication unit of the first-level heating element test board in the cascaded plurality of heating element test boards, so as to communicate with the communication unit of each heating element test board based on the communication unit of the first-level heating element test board.

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