Dual-frequency microstrip antenna

Abstract

The utility model provides a dual-frequency microstrip antenna. The dual-frequency microstrip antenna comprises a dielectric substrate, a floor, a radiation patch assembly and a feed probe. The dielectric substrate and the floor are oppositely arranged at an interval, and the feed probe is connected with the dielectric substrate and the floor; the radiation patch assembly comprises a first radiation patch, a second radiation patch and a third radiation patch; the radiation patch assembly is electrically connected with the feed probe; the first radiation patch and the second radiation patch are arranged on the first surface, away from the floor, of the dielectric substrate, the third radiation patch is arranged on the second surface, facing the floor, of the dielectric substrate, a through hole is formed in the middle of the second radiation patch, the first radiation patch is arranged in the inner side area of the hole, and the first radiation patch and the second radiation patch are arranged at intervals. The first radiation patch is used for generating high frequency through resonance, the second radiation patch and the third radiation patch are electrically connected for generating low frequency through resonance, and the dual-frequency microstrip antenna can consider performance, cost, weight and size.

Description

TECHNICAL FIELD

[0001] The utility model relates to satellite navigation technical field, concretely relates to a kind of dual-frequency microstrip antenna. BACKGROUND

[0002] Current satellite navigation positioning equipment is increasingly widely applied in fields such as positioning, measurement, time service, high-precision agriculture and intelligent transportation. In order to obtain high-precision positioning requirements above decimeter, the antenna of the equipment generally needs to have dual-frequency characteristics at this time, so that L1, L5 of GPS or B1, B2 of Beidou and other carrier signals can be received simultaneously. By using the difference in the influence of ionospheric delay on dual-frequency carrier signals, the delay influence of the ionosphere on electromagnetic wave signals can be effectively eliminated.

[0003] Microstrip antennas have the characteristics of small size, light weight, low cost and low profile, and are widely used in scenarios that require low-profile antennas. However, microstrip antennas have the obvious disadvantages of low efficiency and narrow frequency band. To improve the antenna bandwidth, the thickness of the dielectric or low-dielectric-constant and low-loss dielectric materials need to be increased. On the other hand, to realize dual-frequency design, a double-layer antenna is generally required, and a single-layer antenna needs to be designed with a large size to meet the requirements. Therefore, it will lead to problems such as large antenna size, heavy weight, high cost, etc. Under the trend of increasingly fierce market competition, it is urgent to develop a dual-frequency antenna that can balance performance, cost, weight and size while ensuring high performance. SUMMARY

[0004] The technical problem solved by the utility model is to provide a dual-frequency antenna that can balance performance, cost, weight and size.

[0005] The scheme for achieving the technical purpose of the utility model is a dual-frequency microstrip antenna, which includes a dielectric substrate, a ground plate, a radiation patch assembly and a feed probe for electrically connecting a feed network.

[0006] The dielectric substrate is arranged opposite to and spaced apart from the ground plate, and the feed probe connects the dielectric substrate and the ground plate.

[0007] The radiation patch assembly includes a first radiation patch, a second radiation patch and a third radiation patch. At least one of the first radiation patch, the second radiation patch and the third radiation patch is electrically connected to the feed probe.

[0008] The first radiation patch and the second radiation patch are arranged on a first surface of the dielectric substrate away from the ground plate, and the third radiation patch is arranged on a second surface of the dielectric substrate facing the ground plate. The second radiation patch has a through opening in the middle. The first radiation patch is arranged in the inner region of the opening and is spaced apart from the second radiation patch. The first radiation patch is used for resonating to generate high frequency, and the second radiation patch and the third radiation patch are electrically connected to generate low frequency.

[0009] In an alternative embodiment, the projection of the second radiating patch and the projection of the third radiating patch at least partially overlap along the thickness direction of the dielectric substrate.

[0010] In an alternative embodiment, the dielectric substrate, the first radiating patch, the second radiating patch and the third radiating patch are concentrically arranged.

[0011] The third radiating patch is located in the area enclosed by the outer contour of the second radiating patch in the direction from the center to the outer periphery of the dielectric substrate.

[0012] In an alternative embodiment, the middle part of the third radiating patch has a through hole, and the projection of the first radiating patch on the dielectric substrate falls within the projection of the through hole of the third radiating patch on the dielectric substrate along the thickness direction of the dielectric substrate.

[0013] In an alternative embodiment, the first radiating patch comprises a connected base part and four extended blade parts, the four extended blade parts are uniformly arranged at the outer periphery of the base part, the end face of the extended blade part away from the base part is an arc surface, and the shape of the opening of the second radiating patch matches the outer contour shape of the first radiating patch.

[0014] The third radiating patch is a circular ring patch, and the hole wall projection of the through hole of the third radiating patch is between the arc surface of the extended blade part and the inner contour of the second radiating patch.

[0015] In an alternative embodiment, the feed probe is electrically connected to the second radiating patch and the ground plate, and the first radiating patch is coupled to the feed probe.

[0016] In an alternative embodiment, the number of feed probes is two, and the two feed probes are orthogonally distributed on the ground plate and close to the first radiating patch.

[0017] In an alternative embodiment, the dual-frequency microstrip antenna further comprises a plurality of parasitic patches and a plurality of first short-circuit probes, the plurality of parasitic patches are uniformly arranged on the dielectric substrate, and the parasitic patches are located at the outer periphery of the second radiating patch in the direction from the center to the outer periphery of the dielectric substrate.

[0018] The first short-circuit probe is electrically connected to the parasitic patch.

[0019] In an alternative embodiment, the dual-frequency microstrip antenna further comprises a second short-circuit probe, the second short-circuit probe is electrically connected to the first radiating patch.

[0020] In an alternative embodiment, the second radiating patch and the third radiating patch are electrically connected through a metalized via hole, and the metalized via hole penetrates the dielectric substrate.

[0021] According to the dual-band microstrip antenna of the above embodiment, on the one hand, there is an air medium of a certain height between the dielectric substrate and the ground plane. Compared with traditional microstrip antennas using ceramic dielectrics or high-frequency material dielectrics, the air medium solution has the advantages of lower cost and lighter weight. On the other hand, the first radiating patch and the second radiating patch are disposed on the first surface of the dielectric substrate, and the third radiating patch is disposed on the second surface of the dielectric substrate. The first radiating patch is used to generate high frequencies through resonance, and the second and third radiating patches are electrically connected to generate low frequencies through resonance. The third radiating patch is an extension of the second radiating patch on the second surface of the dielectric substrate, which can effectively improve the antenna gain and thus improve the antenna's ability to transmit and receive signals. At the same time, the third radiating patch is disposed on the side of the dielectric substrate closer to the ground plane, making full use of the space between the dielectric substrate and the ground plane, effectively balancing the size of the dual-band microstrip antenna while improving antenna performance.

[0022] In summary, the dual-frequency microstrip antenna provided by this utility model not only has the advantages of low profile of microstrip antennas, but also has the advantages of high gain, and can effectively balance cost, weight and size while improving performance. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a dual-frequency microstrip antenna provided for some embodiments of the present invention.

[0024] Figure 2 for Figure 1 An explosion diagram.

[0025] Figure 3 for Figure 2 Another perspective illustration.

[0026] Figure 4 for Figure 1 A schematic diagram of the assembly of the first, second, and third radiating patches on the dielectric substrate (the dielectric substrate has been omitted from the diagram).

[0027] Figure 5 for Figure 4 An explosion diagram.

[0028] Figure 6 for Figure 5 A top-down projection.

[0029] Reference numerals: 100 - dual-band microstrip antenna; 10 - dielectric substrate; 11 - first surface; 12 - second surface; 20 - ground plane; 30 - radiating patch assembly; 31 - first radiating patch; 311 - base portion; 312 - extended blade portion; 313 - arc surface; 32 - second radiating patch; 321 - aperture; 322 - low-frequency resonant stub; 33 - third radiating patch; 331 - through-hole; 40 - feed network; 50 - feed probe; 60 - metallized via; 70 - parasitic patch; 81 - first shorting probe; 82 - second shorting probe. DETAILED DESCRIPTION

[0030] The utility model will be further described in detail below through specific implementation mode combined with drawings. Similar elements in different implementation modes adopt relevant similar element marks. In the following implementation mode, many details are described in order to make the present application be better understood. However, the person skilled in the art can easily realize that part of the features can be omitted in different cases, or can be replaced by other elements, materials, methods. In some cases, some operations related to the present application are not shown or described in the specification, in order to avoid the core part of the present application being overwhelmed by too much description, and for the person skilled in the art, it is not necessary to describe these related operations in detail according to the description in the specification and the general technical knowledge in the art, and they can completely understand the related operations.

[0031] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate way to form various embodiments. At the same time, the steps or actions in the method description can also be sequentially adjusted or adjusted in a manner that is obvious to the person skilled in the art. Therefore, the various sequences in the specification and drawings are only for the purpose of clearly describing a certain embodiment, and do not mean that the sequence is necessary, unless otherwise stated that a certain sequence must be followed.

[0032] The serial numbers of components in this paper, such as "first", "second", etc., are only used to distinguish the described objects, and have no sequence or technical meaning. Unless otherwise specified, the "connection" and "coupling" in the present application include direct and indirect connection (coupling).

[0033] To solve the above technical problems, the utility model embodiment provides a kind of dual-band microstrip antenna, please refer to Figures 1-6 Dual-band microstrip antenna 100 includes dielectric substrate 10, ground plane 20, radiating patch assembly 30 and feed probe 50 for electrically connecting feed network 40.

[0034] The medium substrate 10 is opposite and spaced apart from the ground plate 20, and the feed probe 50 connects the medium substrate 10 and the ground plate 20; the radiation patch assembly 30 comprises a first radiation patch 31, a second radiation patch 32 and a third radiation patch 33; at least one of the first radiation patch 31, the second radiation patch 32 and the third radiation patch 33 is electrically connected with the feed probe 50. The first radiation patch 31 and the second radiation patch 32 are arranged on the first surface 11 of the medium substrate 10 away from the ground plate 20, and the third radiation patch 33 is arranged on the second surface 12 of the medium substrate 10 facing the ground plate 20; the second radiation patch 32 has a through opening 321 in the middle, the first radiation patch 31 is arranged in the inner side area of the opening 321 and is spaced apart from the second radiation patch 32, the first radiation patch 31 is used for resonant generation of high frequency, and the second radiation patch 32 and the third radiation patch 33 are electrically connected for resonant generation of low frequency.

[0035] Please refer to Figures 1-3 The first surface 11 and the second surface 12 are two opposite surfaces in the thickness direction of the medium substrate 10.

[0036] The first radiation patch 31 is arranged in the opening 321 of the second radiation patch 32 and is spaced apart from the second radiation patch 32, so that the first radiation patch 31 is separated from the second radiation patch 32, and the distance therebetween is called a gap distance, which is determined by the coupling effect and generally has a value of 0.5mm-2mm.

[0037] The first radiation patch 31, the second radiation patch 32 and the third radiation patch 33 described above are metal thin layers with specific shapes made by a photoetching process and used for radiation, which are generally made of conductive materials such as gold or copper. For example, the first radiation patch 31, the second radiation patch 32 and the third radiation patch 33 can all be copper foils printed on the medium substrate 10.

[0038] According to the dual-frequency microstrip antenna 100 of the above embodiment, on the one hand, the medium substrate 10 and the ground plate 20 have a certain height of air medium, and compared with traditional ceramic medium, high-frequency material medium and other microstrip antennas, the air medium scheme has the advantages of lower cost and lower weight. The first radiation patch 31 and the second radiation patch 32 are arranged on the first surface 11 of the medium substrate 10, and the third radiation patch 33 is arranged on the second surface 12 of the medium substrate 10; the first radiation patch 31 is used for resonant generation of high frequency, and the second radiation patch 32 and the third radiation patch 33 are electrically connected for resonant generation of low frequency; high and low resonant frequencies are realized on the same medium substrate 10, which is convenient for individual tuning.

[0039] In another aspect, the third radiation patch 33 is an extension structure of the second radiation patch 32 on the second surface 12 of the dielectric substrate 10. Compared with the solution of directly expanding the area of the second radiation patch 32 on the first surface 11 to improve the gain and radiation performance, the present application divides the low-frequency radiation patch into the second radiation patch 32 and the third radiation patch 33, and oppositely arranges the second radiation patch 32 and the third radiation patch 33 on the first surface 11 and the second surface 12 of the dielectric substrate 10, fully utilizes the structure of the dielectric substrate 10 and the space between the dielectric substrate 10 and the ground plate 20, and effectively improves the gain of the antenna without expanding the size of the dielectric substrate 10, so as to improve the signal receiving and transmitting capability of the antenna, and further effectively control the size of the dual-frequency microstrip antenna 100.

[0040] In some embodiments, the microstrip antenna further comprises a feed network 40 component arranged on the side of the ground plate 20 away from the dielectric substrate 10, and the feed network 40 component is electrically connected with the feed probe 50, Figures 1-3 It is only a general schematic diagram, and the specific structural components of the feed network 40 component are not shown. The structure and components of the feed network 40 component can refer to the prior art, and the present embodiment will not be described here.

[0041] In some embodiments, as shown in Figures 1-6 , along the thickness direction of the dielectric substrate 10, the projection of the second radiation patch 32 at least partially overlaps with the projection of the third radiation patch 33, which can effectively increase the equivalent thickness of the low-frequency radiation patch, and further improve the antenna efficiency, and also enable the dual-frequency microstrip antenna 100 to withstand a larger power capacity compared with the existing antenna.

[0042] In some embodiments, as shown in Figures 1-3 , the second radiation patch 32 and the third radiation patch 33 are electrically connected through the metallized via 60 which penetrates the dielectric substrate 10. The forming technology of the metallized via 60 is relatively mature, and is beneficial to the overall consistency, and effectively ensures the stability of the electrical connection between the second radiation patch 32 and the third radiation patch 33.

[0043] In some embodiments, as shown in Figures 1-3 , the metallized via 60 simultaneously penetrates the second radiation patch 32, the dielectric substrate 10 and the third radiation patch 33, so as to further ensure the stability of the electrical connection between the second radiation patch 32 and the third radiation patch 33.

[0044] In some embodiments, as shown in Figures 1-6 , the dielectric substrate 10, the first radiation patch 31, the second radiation patch 32 and the third radiation patch 33 are concentrically arranged, so as to ensure the axial ratio performance.

[0045] In some embodiments, as shown in Figures 4-6In order to obtain better gain effect and reduce the influence of the third radiation patch 33 on the radiation performance of the first radiation patch 31 and the second radiation patch 32, the third radiation patch 33 is located in the area surrounded by the outer contour of the second radiation patch 32 from the center to the outer periphery of the dielectric substrate 10, in other words, the outer contour of the third radiation patch 33 does not exceed the outer contour of the second radiation patch 32, thereby effectively avoiding the negative influence of the third radiation patch 33 on the first radiation patch 31 and the second radiation patch 32, and facilitating the improvement of the overall performance of the dual-frequency microstrip antenna 100.

[0046] In some embodiments, the middle part of the third radiation patch 33 has a through hole 331, that is, the third radiation patch 33 is not a complete solid patch, and the overall performance of the dual-frequency microstrip antenna 100 can be adjusted by changing the size of the through hole 331. Meanwhile, the size of the through hole 331 and the size relationship and layout position relationship of the first radiation patch 31, the second radiation patch 32 and the third radiation patch 33 can be associated with the overall performance of the dual-frequency microstrip antenna 100, and can also be associated with the isolation between the feed probes 50. The skilled in the art can make adaptive adjustment according to the actual situation and needs, and the utility model is not limited in detail.

[0047] In some embodiments, please refer to Figures 4-6 The middle part of the third radiation patch 33 has a through hole 331, and along the thickness direction of the dielectric substrate 10, the projection of the first radiation patch 31 on the dielectric substrate 10 falls within the projection of the through hole 331 of the third radiation patch 33 on the dielectric substrate 10, which can effectively reduce the negative influence of the third radiation patch 33 on the first radiation patch 31, so that the high-frequency characteristics of the first radiation patch 31 meet the use requirements to achieve better effect.

[0048] However, it should be noted that it is not only this kind of implementation way that "the projection of the first radiation patch 31 on the dielectric substrate 10 falls within the projection of the through hole 331 of the third radiation patch 33 on the dielectric substrate 10". In some embodiments, the first radiation patch 31 and the third radiation patch 33 can also have part of the projection overlap, but in order to ensure the normal function and performance of the low frequency and the high frequency, the amount of projection overlap of the first radiation patch 31 and the third radiation patch 33 should be controlled within a small range, and the specific projection overlap value can be obtained by the skilled in the art according to the test experiment.

[0049] The shape of the first radiation patch 31 is not limited in detail, and the shape of the first radiation patch 31 is not limited to circular, square or other shape deformation.

[0050] For example, in some embodiments, the first radiation patch 31 can be generally cross-shaped, and the first radiation patch 31 includes a base portion 311 and four extended blade portions 312, which are evenly arranged at the outer periphery of the base portion 311. At least part of the hole wall of the through hole 331 of the third radiation patch 33 is projected between the end surface of the extended blade portion 312 away from the base portion 311 and the inner contour of the second radiation patch 32.

[0051] In some embodiments, the first radiation patch 31 can also be an arc cross polygon. For reference, see Figures 1-6 That is, it can be understood as a deformation of a cross shape. For reference, see Figures 4-6 The first radiation patch 31 includes a base portion 311 and four extended blade portions 312, which are evenly arranged at the outer periphery of the base portion 311. The end surface of the extended blade portion 312 away from the base portion 311 is an arc surface 313. The shape of the opening 321 of the second radiation patch 32 matches the outer contour shape of the first radiation patch 31. The third radiation patch 33 is a circular ring patch, and the hole wall of the through hole 331 of the third radiation patch 33 is projected between the arc surface 313 of the extended blade portion 312 and the inner contour of the second radiation patch 32. The hole wall of the through hole 331 of the third radiation patch 33 is the inner ring of the circular ring of the third radiation patch 33. In the case where the structures of the first radiation patch 31 and the second radiation patch 32 remain unchanged and the relative positions remain unchanged, the inner ring of the third radiation patch 33 is preferably projected between the gap spacing of the first radiation patch 31 and the second radiation patch 32 along the thickness direction of the dielectric substrate 10. This gap spacing is generally between 0.5 mm and 2 mm. In the case where the outer ring size of the third radiation patch 33 remains unchanged, the smaller the distance between the inner ring of the third radiation patch 33 and the geometric center of the dielectric substrate 10, the better the isolation between the feed probes 50.

[0052] In some embodiments, the four extended blade portions 312 can be orthogonally arranged at the outer periphery of the base portion 311. It should be noted that in some embodiments, when designing the structure of the first radiation patch 31, additional extension portions can be added on the basis of the cross, as long as the radiation patch meets the requirements and is centrally symmetric.

[0053] In some embodiments, for reference, see Figures 1-6 The outer periphery of the second radiation patch 32 also integrally forms a plurality of low-frequency tuning branches that protrude outward. The plurality of low-frequency tuning branches refers to three or more low-frequency tuning branches. The low-frequency tuning branches can more conveniently adjust the center frequency of low frequencies. The plurality of low-frequency tuning branches are evenly distributed to ensure the geometric symmetry of the second radiation patch 32 and to ensure the axial ratio performance.

[0054] In some embodiments, referring to Figures 1-3 The feeding probe 50 is electrically connected with the second radiation patch 32 and the ground plate 20, and the first radiation patch 31 is coupled with the feeding probe 50. The feeding probe 50 is in direct contact with the second radiation patch 32, which is a physical connection generally requiring welding, and the feeding probe 50 directly feeds the second radiation patch 32. The first radiation patch 31 is not in direct contact with the feeding probe 50 and is not electrically connected with the feeding probe 50, but generates energy through electromagnetic field coupling. The feeding probe 50 feeds the second radiation patch 32 through direct contact to generate a low-frequency operating frequency, which is generally 1164MHz-1300MHz in a navigation system. The feeding probe 50 is not in contact with the first radiation patch 31, but generates a high-frequency operating frequency through electromagnetic field coupling, which is generally 1559MHz-1612MHz in a navigation system. Through the coupling feeding scheme in the high-frequency band, the bandwidth of the antenna can be effectively improved.

[0055] In some embodiments, referring to Figures 1-3 The number of the feeding probes 50 is two, and the two feeding probes 50 are distributed in an orthogonal state on the ground plate 20 and close to the first radiation patch 31, which is conducive to improving the overall performance of the entire dual-frequency microstrip antenna 100 and the isolation between the two feeding probes 50.

[0056] In some embodiments, referring to Figures 1-3 The dual-frequency microstrip antenna 100 further includes a plurality of parasitic patches 70 and a plurality of first short-circuit probes 81. The plurality of parasitic patches 70 are uniformly arranged on the dielectric substrate 10, and the parasitic patches 70 are located at the outer periphery of the second radiation patch 32 from the center of the dielectric substrate 10 to the outer periphery. The first short-circuit probe 81 connects the dielectric substrate 10 and the ground plate 20, and the first short-circuit probe 81 is electrically connected with the parasitic patch 70. The design of the parasitic patch 70 can reduce the size of the antenna, increase the electric field distribution in the horizontal direction to some extent, expand the antenna beam width, improve the receiving effect at low elevation angles, and reduce the backward radiation power to ensure the gain distribution of the antenna. In addition, the parasitic patch 70 and the first short-circuit probe 81 are arranged at the edge of the dielectric substrate 10, and the first short-circuit probe 81 can effectively change the edge electric field distribution to further reduce the size of the antenna and achieve the purpose of miniaturization.

[0057] In some embodiments, referring to Figures 1-3 The dual-frequency microstrip antenna 100 further includes a second short-circuit probe 82. The second short-circuit probe 82 connects the dielectric substrate 10 and the ground plate 20, and the second short-circuit probe 82 is electrically connected with the first radiation patch 31. The second short-circuit probe 82 plays a role in fixing the dielectric substrate 10 and lightning protection.

[0058] In some embodiments, referring to Figures 1-3The plurality of first short-circuit probes 81 are uniformly distributed outside the second short-circuit probe 82 in a center of the second short-circuit probe 82, so as to further optimize the edge electric field distribution of the dielectric substrate 10.

[0059] In some embodiments, the feeding probe 50 can be made of copper, stainless steel, or aluminum alloy, etc., and the first short-circuit probe 81 and the second short-circuit probe 82 can also be made of any one of copper, stainless steel, or aluminum alloy. The feeding probe 50, the first short-circuit probe 81, and the second short-circuit probe 82 can be made of the same material or different materials, which is not limited in the embodiments.

[0060] In summary, the dual-frequency microstrip antenna 100 provided by the utility model has at least the following effects:

[0061] The dielectric substrate 10 and the floor 20 have a certain height of air medium, and the air medium has the advantages of lower cost and lower weight compared with the traditional ceramic medium and high-frequency material medium of the microstrip antenna. The first radiation patch 31 and the second radiation patch 32 are arranged on the first surface 11 of the dielectric substrate 10, and the third radiation patch 33 is arranged on the second surface 12 of the dielectric substrate 10. The first radiation patch 31 is used for resonating to generate high frequency, and the second radiation patch 32 and the third radiation patch 33 are electrically connected to generate low frequency. The high and low resonant frequencies are realized on the same dielectric substrate 10, which is convenient for individual tuning.

[0062] The third radiation patch 33 is an extension structure of the second radiation patch 32 on the second surface 12 of the dielectric substrate 10. Compared with the scheme of directly expanding the area of the second radiation patch 32 on the first surface 11 to improve the gain and radiation performance, the low-frequency radiation patch is divided into the second radiation patch 32 and the third radiation patch 33 in the application, and the second radiation patch 32 and the third radiation patch 33 are arranged on the first surface 11 and the second surface 12 of the dielectric substrate 10, respectively. The structure of the dielectric substrate 10 is fully utilized, the gain of the antenna can be effectively improved without expanding the size of the dielectric substrate 10, the signal receiving and transmitting capability of the antenna is improved, and the size of the dual-frequency microstrip antenna 100 is effectively controlled. Moreover, along the thickness direction of the dielectric substrate 10, the projection of the second radiation patch 32 and the projection of the third radiation patch 33 at least partially overlap, which can increase the equivalent thickness of the low-frequency radiation patch, thereby improving the antenna efficiency, and the dual-frequency microstrip antenna 100 can also withstand greater power capacity.

[0063] The dual-frequency microstrip antenna 100 has the characteristics of compact structure, simple feeding, high gain, small antenna phase center elevation difference, low cost, easy processing, and easy realization of circular polarization, and meets the application requirements of high and low frequency signal receiving (or transmitting) of the four satellite navigation systems.

[0064] The utility model is described above with specific examples, which is only used for helping to understand the utility model and does not limit the utility model. For the skilled in the art to which the utility model belongs, according to the idea of the utility model, a number of simple deductions, deformations or substitutions can be made.

Claims

1. A dual frequency microstrip antenna, characterized by, Includes dielectric substrate, ground plane, radiating patch assembly, and feed probes for electrical connection of the feed network; Wherein: the dielectric substrate and the ground plane are positioned opposite to and spaced apart, and the feed probe is connected to the dielectric substrate and the ground plane; The radiating patch assembly includes a first radiating patch, a second radiating patch, and a third radiating patch; at least one of the first radiating patch, the second radiating patch, and the third radiating patch is electrically connected to the power supply probe. The first radiating patch and the second radiating patch are disposed on a first surface of the dielectric substrate facing away from the floor, and the third radiating patch is disposed on a second surface of the dielectric substrate facing the floor. The second radiating patch has a through hole in the middle, and the first radiating patch is disposed in the inner region of the hole and spaced apart from the second radiating patch. The first radiating patch is used to resonate and generate high frequency, and the second radiating patch and the third radiating patch are electrically connected to resonate and generate low frequency.

2. The dual-frequency microstrip antenna according to claim 1, wherein Along the thickness direction of the dielectric substrate, the projection of the second radiating patch at least partially overlaps with the projection of the third radiating patch.

3. The dual-frequency microstrip antenna according to claim 1, wherein The dielectric substrate, the first radiating patch, the second radiating patch, and the third radiating patch are arranged concentrically; From the center of the dielectric substrate to the outer periphery, the outer contour of the third radiating patch is located within the area enclosed by the outer contour of the second radiating patch.

4. The dual-frequency microstrip antenna according to claim 3, wherein The third radiating patch has a through hole in the middle, and along the thickness direction of the dielectric substrate, the projection of the first radiating patch on the dielectric substrate falls within the projection of the through hole of the third radiating patch on the dielectric substrate.

5. The dual-frequency microstrip antenna according to claim 4, wherein The first radiating patch includes a connected base portion and four extended blade portions. The four extended blade portions are evenly disposed on the outer periphery of the base portion. The end face of the extended blade portion away from the base portion is an arc surface. The shape of the opening of the second radiating patch matches the outer contour shape of the first radiating patch. The third radiating patch is an annular patch, and the projection of the hole wall of the third radiating patch is between the arc surface of the extended blade portion and the inner contour of the second radiating patch.

6. The dual-frequency microstrip antenna according to any one of claims 1-5, wherein, The power supply probe is electrically connected to the second radiating patch and the floor, and the first radiating patch is coupled to the power supply probe.

7. The dual-frequency microstrip antenna according to claim 6, wherein The number of the feeding probes is two, and the two feeding probes are orthogonally distributed on the floor and close to the first radiating patch.

8. The dual-frequency microstrip antenna according to any one of claims 1-5, wherein, The dual-frequency microstrip antenna further includes multiple parasitic patches and multiple first short-circuit probes. The multiple parasitic patches are uniformly disposed on the dielectric substrate, and from the center of the dielectric substrate to the outer periphery, the parasitic patches are located on the outer periphery of the second radiating patch. The first short-circuit probe connects the dielectric substrate and the ground plane, and the first short-circuit probe is electrically connected to the parasitic patch.

9. The dual-frequency microstrip antenna according to claim 8, wherein, The dual-frequency microstrip antenna further includes a second short-circuit probe, which is connected to the dielectric substrate and the ground plane, and is electrically connected to the first radiating patch.

10. The dual-frequency microstrip antenna according to any one of claims 1-5, wherein, The second radiating patch and the third radiating patch are electrically connected through metallized vias that penetrate the dielectric substrate.

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